Camera module, preparation method thereof, and electronic device

Abstract

The present application relates to an imaging module, a preparation method thereof, and an electronic device, which can effectively reduce the module shoulder height and meet the miniaturization requirements of the imaging module. The imaging module includes: a first circuit board; an image sensor chip electrically connected to the first circuit board; a base including a first portion located on the back surface of the first circuit board to support the first circuit board and a second portion at least partially located outside the periphery of the first portion and protruding upward from the first portion; a movable portion mounted on the second portion; and a lens assembly disposed on the movable portion to be movably constrained in the light sensing path of the image sensor chip.

Description

Technical Field

[0001] The present invention relates to the field of imaging technologies, and particularly to an imaging module, a preparation method thereof, and an electronic device. Background Art

[0002] With the progress and development of technology, electronic devices with imaging functions are increasingly developing towards high performance and thinness. As one of the core components of electronic products, the imaging module inevitably needs to make adaptive adjustments in terms of performance and size; that is to say, in the process of this round of technological innovation, each component in the imaging module needs to make corresponding changes in terms of performance and size.

[0003] As an indispensable component of a high-pixel imaging module, the motor is used to drive the lens to move in multiple directions during the operation of the imaging module to achieve the optical autofocus function (hereinafter referred to as the AF function; English: AutoFocus; Chinese: automatic focus) and the optical image stabilization function (hereinafter referred to as the OIS function; English: Optical Image Stabilization; Chinese: optical image stabilization) during the shooting process.

[0004] However, existing imaging modules are usually assembled by relatively independent motors and photosensitive components. That is, in existing imaging modules, the motor base is usually fixedly installed on the color filter bracket of the photosensitive component, and the color filter bracket is usually installed above the circuit board of the photosensitive component, resulting in a relatively large shoulder height of the imaging module and making it difficult to meet the miniaturization requirements of the imaging module. Summary of the Invention

[0005] An advantage of the present application is to provide an imaging module, a preparation method thereof, and an electronic device, which can effectively reduce the shoulder height of the module and meet the miniaturization requirements of the imaging module.

[0006] To achieve at least one of the above advantages or other advantages and purposes of the present invention, the present invention provides an imaging module, including:

[0007] A first circuit board;

[0008] A photosensitive chip, electrically connected to the first circuit board;

[0009] A base, including a first part located on the back of the first circuit board to support the first circuit board and a second part at least partially located outside the first part and protruding upward from the first part;

[0010] A movable part, installed on the second part; and

[0011] A lens assembly, disposed on the movable part to be movably constrained in the light sensing path of the photosensitive chip.

[0012] With such a setting, the base of the present application can not only support and reinforce the first circuit board through the first part, making it difficult for the first circuit board to be bent, so that the electrical connection between the photosensitive chip and the first circuit board is not likely to fail, which helps to improve the reliability of the camera module; but also can serve as the installation base for the movable part of the motor through the second part, making the integration of components in the camera module higher, without separately processing and then assembling the installation base of the first circuit board and the installation base of the movable part, so as to reduce the assembly process. More importantly, the installation base of the motor in the present application is at least partially lower than the first circuit board, and a sinking design is carried out compared with the installation base of the motor in the prior art, thereby effectively reducing the module shoulder height to meet the miniaturization requirements of the camera module.

[0013] According to an embodiment of the present application, the camera module further includes a first coil and a magnetic member relatively located above the first coil; the second part includes a first mounting portion, the first coil is disposed on the first mounting portion and electrically connected to the first circuit board, and the magnetic member is disposed on the movable part.

[0014] With such a setting, the base of the present application can serve as the support carrier for the first coil, so as to generate a stable Lorentz force with the magnetic member when the first coil is energized, for driving the movable part to drive the lens assembly to move relative to the photosensitive chip to achieve the required anti-shake function.

[0015] According to an embodiment of the present application, the second part includes a first mounting portion; the camera module further includes a second circuit board mounted on the first mounting portion, wherein the second circuit board is located between the movable part and the first circuit board in the optical axis direction, and the second circuit board is provided with a second through hole corresponding to the photosensitive chip; wherein the second circuit board is electrically connected to the first circuit board, and the first coil is mounted on the second circuit board.

[0016] With such a setting, the present application can achieve the electrical connection between the first coil and the first circuit board through the second circuit board, ensuring more convenient processing and assembly.

[0017] According to an embodiment of the present application, the base has a receiving space and a notch communicating with the receiving space, and the notch is located on the first side of the base; wherein a connector is provided at a portion of the first circuit board that passes out of the receiving space from the notch, and the first mounting portion avoids the first side of the base.

[0018] With such an arrangement, on the one hand, the connector of the first circuit board in the present application is arranged outside the accommodating space, facilitating the electrical connection between the connector and an external power supply structure, and thus facilitating the power supply to the camera module. On the other hand, the first mounting portion of the present application can avoid the side where the connector is located, enabling the reasonable arrangement of the first mounting portion and the notch on the circumferential side of the base, making the structure of the camera module more compact and conducive to the miniaturization of the camera module.

[0019] According to an embodiment of the present application, the first mounting portion includes at least two first sub-portions arranged at intervals in the circumferential direction; the second circuit board includes at least two side portions, and at least one of the side portions is connected to the corresponding first sub-portion on the corresponding side and is provided with the first coil.

[0020] With such an arrangement, the first mounting portion of the present application can support the side portion of the second circuit board through the first sub-portion, making it difficult for the side portion to warp, deform or bend, and ensuring that the electrical connection between the first coil and the second circuit board is not easily invalidated.

[0021] According to an embodiment of the present application, the second circuit board further includes a connecting portion located within the accommodating space, the connecting portion connecting the bottoms of two adjacent side portions and being located below the movable part.

[0022] With such an arrangement, the connecting portion of the present application is within the accommodating space and below the movable part, enabling the connecting portion to be designed as a limiting structure that allows the movable part and / or the lens assembly to move downward, and also reserving the space between two adjacent side portions and the outer space thereof in the inner and outer directions, facilitating the spatial arrangement of other components of the camera module and contributing to reducing the lateral size of the camera module. In addition, by connecting the connecting portion to the bottoms of two adjacent side portions, more space can be reserved above the connecting portion to design the stroke of the movable part in the optical axis direction, contributing to reducing the module shoulder height.

[0023] According to an embodiment of the present application, the second part further includes at least three second mounting portions arranged at intervals in the circumferential direction, and the camera module further includes a suspension assembly disposed between the movable part and the second mounting portions. A notch is formed between a pair of adjacent second mounting portions, and the first sub-portion is provided between other adjacent second mounting portions.

[0024] With such an arrangement, the present application is provided with the first sub - part between adjacent second mounting parts for supporting the suspension assembly. This not only spaces the support points of the suspension assembly in the second part and the mounting positions of the first coil in the second part circumferentially, but also makes the support points of the suspension assembly in the second part and the mounting positions of the first coil in the second part more dispersed circumferentially, ensuring that the driving force for driving the movable part and the suspension force applied to the movable part are more balanced, which helps to reduce assembly tilt.

[0025] According to an embodiment of the present application, the first mounting part and the second mounting part are joined, and the second mounting part is located outside the joining part of the second circuit board.

[0026] With such an arrangement, the present application designs the second mounting part to be located outside the joining part, which can reasonably arrange the joining part and the second mounting part in the inner - outer direction, facilitating the reduction of the lateral size of the camera module.

[0027] According to an embodiment of the present application, one side part of the second circuit board is located at the notch and is provided with pins, and the pins are electrically connected to the first circuit board; the first part includes a main body part that jointly defines the accommodation space with the second part and an extension part that extends from the main body part to the outside of the notch.

[0028] With such an arrangement, the present application can not only shorten the circuit design path by providing pins electrically connected to the first circuit board on the side part located at the notch, but also better support the electrical connection part between the second circuit board and the first circuit board by providing the extension part located outside the notch on the first part, ensuring that the first circuit board is not easily bent or broken and guaranteeing that the electrical connection between the pins of the second circuit board and the first circuit board is not easily invalidated.

[0029] According to an embodiment of the present application, the base further includes a first conductive member embedded in the first mounting part and electrically connected to the first circuit board; wherein the first coil is installed in the first mounting part, and the first coil is electrically connected to the first conductive member.

[0030] With such an arrangement, the camera module of the present application can omit the second circuit board and directly electrically conduct the first coil and the first circuit board through the first conductive member embedded in the first mounting part, thereby saving the space occupied by the second circuit board and further reducing the size of the camera module.

[0031] According to an embodiment of the present application, the second part includes a second mounting part higher than the first mounting part; wherein the camera module further includes a suspension assembly disposed between the movable part and the second mounting part.

[0032] With such a setting, through the design of the height position relationship between the second mounting portion and the first mounting portion, the present application can reasonably design the height difference between the second mounting portion and the first mounting portion, reserve sufficient accommodation space for the magnetic member while avoiding an overly large size of the camera module.

[0033] According to an embodiment of the present application, the second mounting portion includes a second sub-portion, the movable part includes an anti-shake bracket that is constrained to the second portion in a manner that can move in a direction perpendicular to the optical axis, and the lens assembly is constrained to the anti-shake bracket; the suspension assembly includes balls constrained between the anti-shake bracket and the second sub-portion.

[0034] According to an embodiment of the present application, there are multiple second sub-portions, which are circumferentially spaced apart; each of the second sub-portions is provided with a first strip-shaped groove, and the multiple first strip-shaped grooves are rotationally symmetrically distributed with respect to the optical axis of the lens assembly; the anti-shake bracket is provided with a plurality of second strip-shaped grooves that correspond one-to-one to the first strip-shaped grooves and have mutually perpendicular extending directions, and each second strip-shaped groove and the corresponding first strip-shaped groove together form a ball cavity for accommodating the balls.

[0035] With such a setting, the balls of the present application can support the anti-shake bracket while allowing the anti-shake bracket to move in a direction perpendicular to the optical axis, so as to achieve the required anti-shake function.

[0036] According to an embodiment of the present application, the second mounting portion further includes a third sub-portion, at least a part of the third sub-portion is located at the corner of the second portion, the suspension assembly includes a first elastic sheet, and the first elastic sheet includes a first section whose two ends are constrained between the anti-shake bracket and the third sub-portion.

[0037] With such a setting, the present application provides damping and elastic force during reset for the movement of the anti-shake bracket through the first elastic sheet, enabling the anti-shake movement and reset of the anti-shake bracket to be more stable; at the same time, the size design of the first elastic sheet between the anti-shake bracket and the third sub-portion affects the anti-shake stroke. Since the length at the diagonal is greater, the present application disposes at least a part of the third sub-portion at the corner of the second portion, so that the camera module has sufficient space to arrange the part of the first elastic sheet between the anti-shake bracket and the third sub-portion, that is, it can allow more space to be reserved for designing the anti-shake stroke, which is beneficial to the miniaturization of the camera module.

[0038] According to an embodiment of the present application, the movable part further includes a focusing bracket that is constrained to the anti-shake bracket in a manner that can move along the optical axis direction, and the lens assembly is constrained to the focusing bracket; the first elastic piece further includes a second section whose two ends are constrained between the focusing bracket and the anti-shake bracket; the magnetic member is disposed on the anti-shake bracket, and the imaging module further includes a second coil disposed on the focusing bracket and opposite to the magnetic member; the base further includes a second conductive member embedded in the third sub-part and electrically connected to the first circuit board, and the first elastic piece is made of metal and electrically conducts the second conductive member and the second coil.

[0039] With such a setting, in the present application, the first elastic piece is used to provide damping and elastic force during reset for the movement of the focusing bracket, and through the design of embedding the second conductive member into the third sub-part, the focusing bracket is electrically connected to the first circuit board through the first elastic piece and the second conductive member, which can supply power to the electromagnetic driving mechanism of the focusing bracket and simplify the motor circuit design; at the same time, in the present application, the design of sharing the magnetic member by the first coil and the second coil can simplify the design of the motor driving mechanism and contribute to the miniaturization of the imaging module.

[0040] According to an embodiment of the present application, the second mounting portion includes a second sub-part and a third sub-part protruding upward from the second sub-part, and the suspension assembly includes a first suspension member and a second suspension member. The first suspension member is disposed between the second sub-part and the lower part of the movable part, and the second suspension member is disposed between the third sub-part and the upper part of the movable part.

[0041] With such a setting, the suspension assembly of the present application can respectively constrain from the upper and lower parts of the movable part, making the force on the movable part more balanced, so as to more stably suspend the movable part, and it is not easy for the movable part to be assembled obliquely.

[0042] According to an embodiment of the present application, the base is a molded body formed on the first circuit board.

[0043] According to an embodiment of the present application, the first part is provided with a receiving hole, and the first circuit board is provided with a first through hole corresponding to the photosensitive chip; the photosensitive chip is located in the receiving hole and is flip-chip mounted on the first circuit board.

[0044] With such a setting, by mounting the photosensitive chip on the back of the first circuit board in the present application, the back focal distance of the imaging module overlaps with a part of the base, thereby being able to reduce the module shoulder height.

[0045] According to an embodiment of the present application, the imaging module further includes a filter element, and the filter element is mounted on the front surface of the first circuit board to cover the first through hole.

[0046] With such a setting, in the present application, the filter element is directly mounted on the front surface of the first circuit board, so as to eliminate the filter holder, which is beneficial to further reduce the module shoulder height.

[0047] According to an embodiment of the present application, the imaging module further includes a lens barrel constrained to the movable part, and the lens assembly is mounted inside the lens barrel; the filter element is rectangular, and at least a part of the long side of the filter element is located inside the lens barrel; wherein an electronic component mounting area is provided on the front surface of the first circuit board, and the electronic component mounting area is located between the long side of the filter element and the inner edge of the lens barrel.

[0048] With such a setting, in the present application, by locating at least a part of the long side of the filter element inside the lens barrel, the size of the filter element can be reduced, making the filter element not easily cracked. In addition, the electronic component mounting area is provided on the front surface of the first circuit board, which can reduce the magnetic interference with the photosensitive chip; the electronic component mounting area is located between the long side of the filter element and the inner edge of the lens barrel, which can rationally utilize the space between the long side of the filter element and the inner edge of the lens barrel to arrange electronic components, thereby allowing the distance between the short side of the filter element and the corresponding side of the imaging module to be shortened, contributing to reducing the width of the imaging module.

[0049] On the other hand, the present application further provides an electronic device, including:

[0050] A device body; and

[0051] The imaging module as described in any one of the above, and the imaging module is assembled to the device body.

[0052] On the other hand, the present application further provides a method for manufacturing an imaging module, including the steps of:

[0053] Placing a second conductive member in the cavity of a first injection mold to injection mold a third sub - part embedded with the second conductive member;

[0054] Placing the first circuit board and a plurality of third sub - parts in the cavity of a second injection mold to injection mold the part of the second part excluding the third sub - part and the first part to form a base, wherein the first part is located on the back surface of the first circuit board to support the first circuit board and includes a main body part and an extension part, and the second part protrudes upward from the first part and is located outside the main body part;

[0055] Flip - mounting the photosensitive chip on the first circuit board; and

[0056] Mounting the movable part with the lens assembly on the second part of the base to obtain the imaging module.

[0057] With such a setting, the base of the present application is formed by double injection molding, which can allow for a sufficient height difference between the third sub - part and the part of the base other than the third sub - part. This is because when the height difference between the third sub - part and the part of the base other than the third sub - part is large, it is easy to have poor molding during injection molding when using the method of one - time injection molding to form the base. Description of the Drawings

[0058] Figure 1 Schematic perspective view of an imaging module according to an embodiment of the present application;

[0059] Figure 2 Exploded schematic view of the imaging module shown in the above - mentioned embodiment of the present application;

[0060] Figure 3 Schematic cross - sectional view of the imaging module shown in the above - mentioned embodiment of the present application;

[0061] Figure 4 An example of the imaging module shown in the above - mentioned embodiment of the present application with the housing removed;

[0062] Figure 5 Schematic cross - sectional view of the imaging module shown in the above - mentioned example of the present application;

[0063] Figure 6 Schematic structural view of the photosensitive component in the imaging module shown in the above - mentioned example of the present application;

[0064] Figure 7 A modified example of the imaging module shown in the above - mentioned embodiment of the present application;

[0065] Figure 8 Schematic flow chart of a method for manufacturing an imaging module according to an embodiment of the present application.

[0066] Main reference numerals and symbols description:

[0067] 1. Camera module; 11. First circuit board; 1101. First through hole; 1102. Electronic component installation area; 111. Rigid board part; 112. Flexible board part; 113. Connector; 12. Photosensitive chip; 121. Photosensitive area; 122. Non - photosensitive area; 13. Base; 13a. First side; 130. Molding body; 1301. Accommodation space; 1302. Notch; 131. First part; 1310. Accommodation hole; 1311. Main body part; 1312. Extension part; 132. Second part; 1321. First installation part; 13210. First sub - part; 1322. Second installation part; 13220. First strip - shaped groove; 13221. Second sub - part; 13222. Third sub - part; 133. First conductive part; 134. Second conductive part; 14. Movable part; 141. Focusing bracket; 142. Anti - shake bracket; 1420. Second strip - shaped groove; 15. Optical lens; 151. Lens assembly; 152. Lens barrel; 16. Suspension assembly; 161. First elastic piece; 1611. First section; 1612. Second section; 162. Ball; 163. Second elastic piece; 17. Electromagnetic drive mechanism; 171. First coil; 172. Magnetic part; 173. Second coil; 18. Second circuit board; 180. Second through hole; 181. Side part; 1811. Horizontal area; 1812. First vertical area; 1813. Second vertical area; 1814. Pin; 182. Connection part; 19. Reinforcement plate; 20. Filter element; 21. Housing.

[0068] The above description of the main component symbols further elaborates on the present invention in conjunction with the accompanying drawings and specific embodiments. Specific embodiments

[0069] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0070] It should be noted that when a component is referred to as being "installed on" another component, it can be directly on the other component or there can also be an intermediate component. When a component is considered to be "arranged on" another component, it can be directly arranged on the other component or there may be an intermediate component at the same time. When a component is considered to be "fixed to" another component, it can be directly fixed to the other component or there may be an intermediate component at the same time.

[0071] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0072] Considering that in the existing camera module, the motor base is fixed to the color filter holder of the photosensitive component, resulting in a still relatively large shoulder height of the camera module, which is difficult to meet the miniaturization requirements of the camera module. Therefore, the present application proposes a camera module, a preparation method thereof, and an electronic device, which can effectively reduce the module shoulder height so as to meet the miniaturization requirements of the camera module.

[0073] Specifically, referring to the Figures 1 to 3 As shown, an embodiment of the present application provides an electronic device, which may include a device body and a camera module 1 assembled to the device body to collect image information for the device body through the camera module 1. It can be understood that the electronic device mentioned in the present application may be implemented as, but not limited to, a smart phone, a smart watch, a tablet, or a notebook, etc.

[0074] More specifically, as Figures 1 to 7 shown, the camera module 1 may include a first circuit board 11, a photosensitive chip 12, a base 13, a movable part 14, and an optical lens 15. The photosensitive chip 12 is electrically connected to the first circuit board 11. The base 13 includes a first part 131 located on the back of the first circuit board 11 to support the first circuit board 11 and a second part 132 at least partially located on the periphery of the first part 131 and protruding upward from the first part 131. The movable part 14 is mounted on the second part 132, and the optical lens 15 is disposed on the movable part 14 to be movably constrained in the light-sensitive path of the photosensitive chip 12, ensuring that external light first passes through the optical lens 15 and then is received by the photosensitive chip 12 for imaging.

[0075] It should be noted that the base 13 mentioned in this application can not only support and reinforce the first circuit board 11 through the first part 131, making the first circuit board 11 not easily bent, so that the electrical connection between the photosensitive chip 12 and the first circuit board 11 is not easily invalidated, which helps to improve the reliability of the camera module 1; but also can act as the mounting base for the movable part 14 of the motor through the second part 132, making the integration of the components in the camera module 1 higher, without separately processing and then assembling the mounting base of the first circuit board 11 and the mounting base of the movable part 14 together, so as to reduce the assembly process. More importantly, the second part 132 serving as the motor mounting base in this application is at least partially lower than the first circuit board 11, and a sunken design is carried out compared with the motor mounting base in the prior art, so as to effectively reduce the shoulder height of the module to meet the miniaturization requirements of the camera module 1.

[0076] In addition, as Figure 2 shown, the base 13 mentioned in this application may have a receiving space 1301 and a notch 1302 communicating with the receiving space 1301, and the notch 1302 is located on the first side 13a of the base 13. A connector 113 is provided at a portion of the first circuit board 11 that passes out of the receiving space 1301 through the notch 1302.

[0077] In an example of this application, as Figure 2 shown, the first part 131 may include a main body portion 1311 and an extension portion 1312. The main body portion 1311 and the second part 132 together form the receiving space 1301 and the notch 1302, wherein the notch 1302 communicates with the receiving space 1301 and is located on the first side 13a of the base 13. The extension portion 1312 is located outside the receiving space 1301 and corresponds to the first side 13a of the base 13. Correspondingly, the first circuit board 11 may include a rigid board portion 111, a flexible board portion 112, and a connector 113. The rigid board portion 111 extends out of the receiving space 1301 from the notch 1302; the flexible board portion 112 is connected to a side of the rigid board portion 111 that extends out of the receiving space 1301, and the connector 113 is provided on the flexible board portion 112 for electrical connection with an external power supply structure. In particular, the back surface of the rigid board portion 111 is mounted on the first part 131, so that the first part 131 supports and reinforces the rigid board portion 111, ensuring that the rigid board portion 111 is not easily bent, so that the electrical connection between the photosensitive chip 12 and the rigid board portion 111 is not easily invalidated, and the reliability of the camera module is improved.

[0078] In an example of this application, as Figure 2 and Figure 3As shown, the main body portion 1311 of the first part 131 may be provided with the accommodation hole 1310, and the rigid board portion 111 of the first circuit board 11 is provided with a first through hole 1101 corresponding to the photosensitive chip 12; the photosensitive chip 12 is located within the accommodation hole 1310 and is flip-chip mounted on the first circuit board 11. The photosensitive chip 12 has a photosensitive area 121 corresponding to the first through hole 1101 and a non-photosensitive area 122 located around the photosensitive area 121, and the non-photosensitive area 122 of the photosensitive chip 12 is fixedly connected to the first circuit board 11. It can be understood that "the first through hole 1101 corresponds to the photosensitive chip 12" means that the light emitted from the optical lens 15 can irradiate the photosensitive area 121 of the photosensitive chip 12 through the first through hole 1101. In other words, by accommodating the photosensitive chip 12 within the accommodation hole 1310 and flip-chip mounting it on the first circuit board 11, the imaging module 1 of the present application can overlap the space of the first part 131 and the space of the photosensitive chip 12 in the optical axis direction, so that the back focal distance of the imaging module 1 partially overlaps with the base 13, thereby reducing the module shoulder height.

[0079] It should be noted that in other embodiments of the present application, the photosensitive chip may be mounted on the front surface of the first circuit board or within the accommodation hole of the first circuit board. The electrical connection method between the photosensitive chip and the first circuit board may also be wire bonding.

[0080] In addition, as Figure 3 shown, the imaging module 1 may further include an electromagnetic driving mechanism 17 for driving the movable part 14 to drive the optical lens 15 to move relative to the photosensitive chip 12 to achieve the focusing and / or anti-shake function of the imaging module 1.

[0081] Exemplarily, as Figure 3 shown, the electromagnetic driving mechanism 17 of the imaging module 1 may include a first coil 171 and a magnetic member 172 located above the first coil 171; the first coil 171 is disposed on the second part 132 and is electrically connected to the first circuit board 11, and the magnetic member 172 is disposed on the movable part 14. In this way, the base 13 of the present application can serve as a support carrier for the first coil 171 to generate a stable Lorentz force with the magnetic member 172 when the first coil 171 is energized, so as to drive the movable part 14 to drive the optical lens 15 to move relative to the photosensitive chip 12 to achieve the required anti-shake function.

[0082] Optionally, as Figure 3 and Figure 5As shown, the movable part 14 includes an anti-shake bracket 142. The anti-shake bracket 142 is constrained to the second part 132 in a manner that it can move in a direction perpendicular to the optical axis. The optical lens 15 is constrained to the anti-shake bracket 142. At this time, the magnetic member 172 is disposed on the anti-shake bracket 142 and arranged corresponding to the first coil 171, so as to generate a Lorentz force with the magnetic member 172 when the first coil 171 is energized, driving the anti-shake bracket 142 to drive the optical lens 15 to move in a direction perpendicular to the optical axis, thereby realizing the anti-shake function of the imaging module 1. It can be understood that in other examples of the present application, the installation positions of the first coil 171 and the magnetic member 172 can be interchanged, and the required anti-shake function can still be realized, which will not be elaborated in the present application; in addition, the optical axis mentioned in the present application refers to the optical axis of the optical lens 15.

[0083] Optionally, as Figure 3 and Figure 4 shown, the movable part 14 further includes a focusing bracket 141. The focusing bracket 141 is constrained to the anti-shake bracket 142 in a manner that it can move along the optical axis. The optical lens 15 is mounted on the focusing bracket 141. At this time, the electromagnetic driving mechanism 17 may further include a second coil 173 disposed on the focusing bracket 141 and opposite to the magnetic member 172. The second coil 173 is electrically connected to the first circuit board 11, so as to generate a Lorentz force with the magnetic member 172 when the second coil 173 is energized, driving the focusing bracket 141 to drive the optical lens 15 to move along the optical axis, thereby realizing the focusing function of the imaging module 1.

[0084] It should be noted that in the above examples of the present application, as Figure 3 shown, the first coil 171 and the second coil 173 can share the same magnetic member 172. It can not only generate a Lorentz force with the magnetic member 172 after the first coil 171 is energized, for driving the anti-shake bracket 142 to drive the optical lens 15 to move in a direction perpendicular to the optical axis to realize optical anti-shake, but also generate a Lorentz force with the magnetic member 172 after the second coil 173 is energized, for driving the focusing bracket 141 to drive the optical lens 15 to move in the reverse direction of the optical axis to realize autofocus. It can be understood that in other examples of the present application, the movable part 14 may not include the focusing bracket 141, but realizes the required focusing function by moving the photosensitive chip 12, and the autofocus driving mechanism of the photosensitive chip 12 refers to the prior art; in addition, the installation positions of the second coil 173 and the magnetic member 172 mentioned in the present application can also be interchanged, which will not be elaborated in the present application.

[0085] According to the above embodiments of the present application, as Figures 2 to 6As shown, the second part 132 may include a first mounting portion 1321; the camera module 1 further includes a second circuit board 18 mounted on the first mounting portion 1321. The second circuit board 18 is located between the movable part 14 and the first circuit board 11 in the optical axis direction, and the second circuit board 18 is provided with a second through hole 180 corresponding to the photosensitive chip 12. The second circuit board 18 is electrically connected to the first circuit board 11, and the first coil 171 is mounted on the second circuit board 18. In this way, the camera module 1 of the present application can achieve the electrical connection between the first coil 171 and the first circuit board 11 through the second circuit board 18, ensuring more convenient processing and assembly. It can be understood that the "second through hole 180 corresponding to the photosensitive chip 12" mentioned in the present application means that the second through hole 180 allows the light emitted from the optical lens 15 to irradiate the photosensitive area 121 of the photosensitive chip 12 through the second through hole 180; the positional relationship between the optical lens 15 and the second through hole 180 is not limited, and the optical lens 15 may be located above the second circuit board 18, or the optical lens 15 may pass through the second through hole 180.

[0086] Optionally, as Figure 2 and Figure 6 shown, the first mounting portion 1321 avoids the first side 13a of the base 13. In this way, the first mounting portion 1321 can avoid the side where the connector 113 is located, and can reasonably arrange the first mounting portion 1321 and the notch 1302 on the circumferential side of the base 13, making the structure of the camera module 1 more compact and facilitating the miniaturization of the camera module 1.

[0087] It should be noted that the first mounting portion 1321 includes at least two first sub-portions 13210 arranged at intervals in the circumferential direction; the second circuit board 18 includes at least two side portions 181, and at least one of the side portions 181 is connected to the first sub-portion 13210 on the corresponding side and is provided with the first coil 171. For example, as Figure 2 and Figure 3 shown, the first mounting portion 1321 may include three first sub-portions 13210 arranged at intervals in the circumferential direction; the second circuit board 18 may include four side portions 181, and each side portion 181 may be provided with the first coil 171, and three of the side portions 181 are connected to the first sub-portion 13210 on the corresponding side. In this way, the first mounting portion 1321 of the present application can support the side portion 181 of the second circuit board 18 through the first sub-portion 13210, so that the side portion 181 is not easily warped, deformed or bent, ensuring that the electrical connection between the first coil 171 and the second circuit board 18 is not easily invalidated.

[0088] Optionally, as Figure 6As shown, the second circuit board 18 further includes an engaging portion 182 located within the accommodating space 1301. The engaging portion 182 connects the bottoms of two adjacent side portions 181 and is located below the movable portion 14. In this way, the engaging portion 182 of the present application is within the accommodating space 1301 and below the movable portion 14, enabling the engaging portion 182 to accommodate a limiting structure designed to allow the movable portion 14 and / or the optical lens 15 to move downward. It can also reserve the space between two adjacent side portions 181 and the space outside thereof in the inner and outer directions, facilitating the spatial arrangement of other components of the imaging module 1 and helping to reduce the lateral size of the imaging module 1. In addition, by connecting the engaging portion 182 to the bottoms of two adjacent side portions 181 in the present application, more space can be reserved above the engaging portion 182 to design the travel of the movable portion 14 in the optical axis direction, which helps to reduce the module shoulder height.

[0089] Exemplarily, as Figure 6 shown, the second circuit board 18 has four side portions 181. The two ends of the engaging portion 182 are respectively fixedly connected to two adjacent side portions 181 to jointly define the second through hole 180 located around the optical lens 15, such that while the second circuit board 18 limits the movement of the movable portion 14 in the optical axis direction, the optical lens 15 can be as close as possible to the photosensitive chip 12 to reduce the overall height of the module.

[0090] Optionally, as Figure 6 shown, each side portion 181 may have a lateral region 1811 fixedly connected to the upper surface of the first sub-portion 13210 and a first longitudinal region 1812 extending downward from the inner edge of the lateral region 1811. The engaging portion 182 extends inward from the lower edge of the first longitudinal region 1812; the first coil 171 is correspondingly mounted on the lateral region 1811 of the side portion 181.

[0091] Optionally, as Figure 3 and Figure 6 shown, one side portion 181 of the second circuit board 18 is located at the notch 1302 and is provided with a pin 1814, and the pin 1814 is electrically connected to the first circuit board 11. In other words, the side portion 181 of the second circuit board 18 corresponding to the notch 1302 may have a second longitudinal region 1813 extending downward from the outer edge of the lateral region 1811 and the pin 1814 provided in the second longitudinal region 1813 to electrically connect the second circuit board 18 to the first circuit board 11 through the pin 1814.

[0092] According to the above embodiments of the present application, as Figure 2 , Figure 5 and Figure 6As shown, the second part 132 further includes at least three second mounting portions 1322 arranged at circumferential intervals. The camera module 1 further includes a suspension assembly 16 disposed between the movable part 14 and the second mounting portions 1322. A notch 1302 is formed between a pair of adjacent second mounting portions 1322, and a first sub-portion 13210 is provided between other adjacent second mounting portions 1322. In this way, in the present application, the first sub-portion 13210 is provided between adjacent second mounting portions 1322 to support the suspension assembly 16, not only making the support points of the suspension assembly 16 on the second part 132 and the mounting positions of the first coil 171 on the second part 132 circumferentially spaced, but also making the support points of the suspension assembly 16 on the second part 132 and the mounting positions of the first coil 171 on the second part 132 more dispersed circumferentially, ensuring that the driving force for driving the movable part 14 and the suspension force applied to the movable part 14 are more balanced, which helps to reduce assembly tilt.

[0093] Optionally, as Figure 2 and Figure 6 shown, the first mounting portion 1321 and the second mounting portion 1322 are joined, and the second mounting portion 1322 is located outside the joining portion 182 of the second circuit board 18. In this way, in the present application, the second mounting portion 1322 is designed to be located outside the joining portion 182, which can reasonably arrange the joining portion 182 and the second mounting portion 1322 in the inner and outer directions, facilitating the reduction of the lateral size of the camera module 1.

[0094] Optionally, as Figure 2 and Figure 3 shown, the first mounting portion 1321 is lower than the second mounting portion 1322, and the suspension assembly 16 is connected between the movable part 14 and the second mounting portion 1322. In this way, through the design of the height position relationship between the second mounting portion 1322 and the first mounting portion 1321 in the present application, a reasonable design of the height difference between the second mounting portion 1322 and the first mounting portion 1321 can be allowed, and while reserving sufficient accommodation space 1301 for the magnetic member 172, the size of the camera module 1 can be prevented from being too large.

[0095] It should be noted that, as Figure 2 、 Figure 5 and Figure 6As shown, the second mounting portion 1322 may include a second sub-portion 13221 and a third sub-portion 13222 protruding upward from the second sub-portion 13221; correspondingly, the suspension assembly 16 may include a first suspension member and a second suspension member. The first suspension member is disposed between the second sub-portion 13221 and the lower portion of the movable part 14, and the second suspension member is disposed between the third sub-portion 13222 and the upper portion of the movable part 14. In this way, the suspension assembly 16 of the present application can respectively constrain the movable part 14 from the upper and lower portions, so as to more stably suspend the movable part 14. It can be understood that the first suspension member mentioned in the present application can be, but is not limited to, implemented as a ball 162; the second suspension member mentioned in the present application can be, but is not limited to, implemented as a first elastic piece 161; of course, in other examples of the present application, the suspension assembly 16 can also be implemented as a guide post or a wire, etc., as long as the required suspension effect can be achieved, and the present application will not elaborate on this.

[0096] Exemplarily, as Figure 5 shown, the second mounting portion 1322 includes a second sub-portion 13221. The movable part 14 includes an anti-shake bracket 142 that is constrained to the second portion 132 in a manner that can move in a direction perpendicular to the optical axis. The optical lens 15 is constrained to the anti-shake bracket 142; the suspension assembly 16 includes a ball 162 that is constrained between the anti-shake bracket 142 and the second sub-portion 13221.

[0097] Optionally, as Figure 2 、 Figure 5 and Figure 6 shown, the second mounting portion 1322 includes a plurality of second sub-portions 13221 that are circumferentially spaced apart; each second sub-portion 13221 is provided with a first strip-shaped groove 13220, and the plurality of first strip-shaped grooves 13220 are rotationally symmetrically distributed with respect to the optical axis of the optical lens 15; the anti-shake bracket 142 is provided with a plurality of second strip-shaped grooves 1420 that correspond to the first strip-shaped grooves 13220 one by one and have mutually perpendicular extending directions. Each second strip-shaped groove 1420 and the corresponding first strip-shaped groove 13220 jointly form a ball cavity for accommodating the ball 162. In this way, the ball 162 of the present application can support the anti-shake bracket 142 while allowing the anti-shake bracket 142 to move in a direction perpendicular to the optical axis, so as to achieve the required anti-shake function.

[0098] Optionally, as Figure 2 、 Figure 4 、and Figure 5As shown, the second mounting portion 1322 further includes a plurality of third sub-portions 13222; at least a part of the third sub-portion 13222 is located at the corner of the second portion 132. The suspension assembly 16 includes a first elastic piece 161, and the first elastic piece 161 includes a first section 1611 whose two ends are constrained between the anti-shake bracket 142 and the third sub-portion 13222. In this way, in the present application, the first elastic piece 161 provides damping and elastic force during reset for the movement of the anti-shake bracket 142, enabling the anti-shake movement and reset of the anti-shake bracket 142 to be more stable; at the same time, the dimensional design of the first elastic piece 161 between the anti-shake bracket 142 and the third sub-portion 13222 affects the anti-shake stroke. Since the length of the diagonal is greater, at least a part of the third sub-portion 13222 is arranged at the corner of the second portion 132 in the present application, so that there is enough space in the camera module 1 to arrange the part of the first elastic piece 161 between the anti-shake bracket 142 and the third sub-portion 13222, that is, more space can be reserved for designing the anti-shake stroke, which is beneficial to the miniaturization of the camera module 1.

[0099] Optionally, as Figure 3 and Figure 4 shown, the movable part 14 further includes a focusing bracket 141 that is constrained to the anti-shake bracket 142 in a manner that can move along the optical axis direction, and the optical lens 15 is constrained to the focusing bracket 141; the first elastic piece 161 further includes a second section 1612 whose two ends are constrained between the focusing bracket 141 and the anti-shake bracket 142; the magnetic member 172 is arranged on the anti-shake bracket 142, and the camera module 1 further includes a second coil 173 that is arranged on the focusing bracket 141 and is opposite to the magnetic member 172; the base 13 further includes a second conductive member 134 that is embedded in the third sub-portion 13222 and is electrically connected to the first circuit board 11. The first elastic piece 161 is made of metal and electrically conducts the second conductive member 134 and the second coil 173. In this way, in the present application, the first elastic piece 161 provides damping and elastic force during reset for the movement of the focusing bracket 141, and through the design of embedding the second conductive member 134 into the third sub-portion 13222, the focusing bracket 141 is electrically connected to the first circuit board 11 through the first elastic piece 161 and the second conductive member 134, enabling power supply to the electromagnetic drive mechanism of the focusing bracket 141 and simplifying the motor circuit design; at the same time, in the present application, through the design of sharing the magnetic member 172 by the first coil 171 and the second coil 173, the design of the motor drive mechanism can be simplified, which is helpful for the miniaturization of the camera module 1.

[0100] It should be noted that, as Figure 4 and Figure 5As shown, both ends of the first elastic piece 161 are fixedly connected to the upper part of the third sub - part 13222 and the upper part of the focusing bracket 141 respectively, so as to be implemented as an upper elastic piece that restricts from the upper part of the movable part 14. At the same time, as Figure 4 shown, the middle part of the first elastic piece 161 is fixedly connected to the upper part of the anti - shake bracket 142, so as to restrict the anti - shake bracket 142 from the upper and lower sides of the movable part 14 respectively through the first elastic piece 161 and the ball 162.

[0101] In addition, as Figure 5 shown, the suspension assembly 16 of the present application may further include a second elastic piece 163. Both ends of the second elastic piece 163 are fixedly connected to the lower part of the focusing bracket 141 and the lower part of the anti - shake bracket 142 respectively, so as to restrict the focusing bracket 141 from the upper and lower sides of the movable part 14 respectively through the first elastic piece 161 and the second elastic piece 163.

[0102] It is worth mentioning that in a deformation example of the present application, as Figure 7 shown, the camera module 1 may not include the second circuit board 18 either; at this time, the base 13 further includes a first conductive member 133 embedded in the first mounting portion 1321 and electrically connected to the first circuit board 11; wherein the first coil 171 is installed in the first mounting portion 1321, and the first coil 171 is electrically connected to the first conductive member 133. In this way, the camera module 1 of the present application directly electrically connects the first coil 171 and the first circuit board 11 through the first conductive member 133 embedded in the first mounting portion 1321, without the need to additionally provide a second circuit board 18, so as to save the space occupied by the second circuit board 18 and further reduce the size of the camera module 1.

[0103] According to the above - mentioned embodiments of the present application, as Figure 2 、 Figure 3 and Figure 6 shown, the camera module 1 further includes a filter element 20, and the filter element 20 is installed on the front surface of the first circuit board 11 to cover the first through - hole 1101. In this way, the camera module 1 of the present application directly installs the filter element 20 on the front surface of the first circuit board 11, so as to save the color filter holder, which is beneficial to further reducing the module shoulder height. It can be understood that the filter element 20 mentioned in the present application can be mounted on the front surface of the first circuit board 11.

[0104] Optionally, as Figures 1 to 7 shown, the camera module 1 further includes a reinforcing plate 19, wherein the reinforcing plate 19 is mounted on the first part 131 to seal the accommodation hole 1310, which can prevent the back surface of the photosensitive chip 12 from being exposed, so as to protect the photosensitive chip 12 and reduce the external impact on the photosensitive chip 12.

[0105] Alternatively, if Figure 3 As shown, there is a gap between the upper surface of the reinforcing plate 19 and the back surface of the photosensitive chip 12, ensuring that when the camera module 1 is impacted on its back, the reinforcing plate 19 will not contact the photosensitive chip 12, thereby preventing the impact on the reinforcing plate 19 from being transmitted to the photosensitive chip 12.

[0106] It is worth noting that a buffer glue can be filled between the reinforcing plate 19 and the photosensitive chip 12, so that the buffer glue can absorb the impact on the back of the photosensitive chip 12, protect the photosensitive chip 12, and make it not easily damaged. It can be understood that the present application can make the photosensitive component of the camera module 1 both thin and light and the photosensitive chip 12 not easily damaged by reasonably designing the distance between the reinforcing plate 19 and the photosensitive chip 12.

[0107] In addition, glue can be filled between the peripheral side wall of the photosensitive chip 12 and the first part 131. The glue can be glue with a large elastic modulus, such as DA glue, which can reinforce the connection between the photosensitive chip 12, the first part 131 and the reinforcing plate 19 to improve the reliability of the connection; or, the glue can also be glue with a small elastic modulus, such as buffer glue, which can convert mechanical energy into thermal energy, thereby eliminating the impact effect and achieving stress buffering for the photosensitive chip 12.

[0108] Alternatively, if Figures 1 to 3 As shown, the camera module 1 further includes a housing 21, and the housing 21 is covered on the second portion 132 to cover the movable portion 14. It can be understood that the housing 21 can be implemented as a metal housing to play the role of a magnetic yoke.

[0109] Alternatively, if Figure 3 and Figure 4 As shown, the optical lens 15 in the camera module 1 may include a lens assembly 151 and a lens barrel 152 constrained by the movable part 14, and the lens assembly 151 is installed in the lens barrel 152. Specifically, the lens barrel 152 may be installed on the focus bracket 141 to achieve the installation of the optical lens 15 on the focus bracket 141; a lens mounting hole is provided inside the lens barrel 152, and the lens assembly 151 is installed in the lens mounting hole.

[0110] More specifically, if Figure 3As shown, the filter element 20 can be rectangular, and at least a part of the long side of the filter element 20 is located within the lens barrel 152; an electronic component mounting area 1102 is provided on the front surface of the first circuit board 11, and the electronic component mounting area 1102 is located between the long side of the filter element 20 and the inner edge of the lens barrel 152. In this way, in the present application, by locating at least a part of the long side of the filter element 20 within the lens barrel 152, the size of the filter element 20 can be reduced, making the filter element 20 not easily cracked. In addition, the electronic component mounting area 1102 is provided on the front surface of the first circuit board 11, which can reduce the magnetic interference with the photosensitive chip 12; the electronic component mounting area 1102 is located between the long side of the filter element 20 and the inner edge of the lens barrel 152, which can rationally utilize the space between the long side of the filter element 20 and the inner edge of the lens barrel 152 to arrange electronic components, thereby allowing the distance between the short side of the filter element 20 and the corresponding side of the imaging module 1 to be shortened, contributing to reducing the width of the imaging module 1.

[0111] It can be understood that in other examples of the present application, the optical lens 15 may also only include the lens assembly 151, and a lens mounting hole is provided inside the focusing bracket 141, and the lens assembly 151 is directly mounted in the lens mounting hole of the focusing bracket 141. The present application will not elaborate on this.

[0112] It is worth mentioning that according to the above embodiments of the present application, as Figure 2 and Figure 5 shown, the base 13 can be but is not limited to being implemented as a molded body 130 formed on the first circuit board 11, which can be prepared by a single injection molding process or a secondary injection molding process.

[0113] Specifically, according to another aspect of the present application, as Figure 8 shown, an embodiment of the present application further provides a method for manufacturing an imaging module, which may include the steps of:

[0114] S100: Place a second conductive member in the cavity of the first injection mold to injection mold a third sub - part embedded with the second conductive member;

[0115] S200: Place the first circuit board and a plurality of third sub - parts in the cavity of the second injection mold to injection mold the part of the second part except the third sub - part and the first part to form a base, where the first part is located on the back surface of the first circuit board to support the first circuit board and includes a main body part and an extension part, and the second part protrudes upward from the first part and is located outside the main body part;

[0116] S300: Flip - chip the photosensitive chip onto the first circuit board; and

[0117] S400: Mount the movable part with the lens assembly on the second part of the base to obtain the camera module.

[0118] It should be noted that if the base 13 is prepared by a one - shot injection molding process, due to the large height difference between different parts of the base 13, it is easy to have problems with poor molding during injection molding. Therefore, the preparation method of this application preferably uses a two - shot injection molding process to mold the base 13, which can allow a sufficient height difference between the third sub - part 13222 and the part of the base 13 other than the third sub - part 13222, that is: first, injection - mold the third sub - part 13222 with a larger height by the first injection molding, and then injection - mold the other parts of the base 13 on the first circuit board 11 and the third sub - part 13222 by the second injection molding to ensure excellent molding of the base 13.

[0119] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0120] The above embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention.

Claims

1. Camera module, characterized in that, Comprising: A first circuit board; A photosensitive chip, electrically connected to the first circuit board; A base, including a first portion located on the back of the first circuit board to support the first circuit board and a second portion at least partially located outside the periphery of the first portion and protruding upward from the first portion; the second portion is at least partially lower than the first circuit board; A movable part, mounted on the second portion; And A lens assembly, disposed on the movable part to be movably constrained in the photosensitive path of the photosensitive chip.

2. The imaging module according to claim 1, wherein, The imaging module further includes a first coil and a magnetic member relatively located above the first coil; the second portion includes a first mounting portion, the first coil is disposed on the first mounting portion and electrically connected to the first circuit board, and the magnetic member is disposed on the movable part.

3. The camera module according to claim 2, wherein The imaging module further includes a second circuit board mounted on the first mounting portion, wherein the second circuit board is located between the movable part and the first circuit board in the optical axis direction, and the second circuit board is provided with a second through hole corresponding to the photosensitive chip; wherein the second circuit board is electrically connected to the first circuit board, and the first coil is mounted on the second circuit board.

4. The camera module according to claim 3, wherein The base has a receiving space and a notch communicating with the receiving space, and the notch is located on the first side of the base; wherein a connector is provided at a portion of the first circuit board that passes out of the receiving space from the notch, and the first mounting portion avoids the first side of the base.

5. The imaging module according to claim 4, wherein The first mounting portion includes at least two first sub-portions arranged at intervals in the circumferential direction; the second circuit board includes at least two side portions, wherein at least one of the side portions is connected to the corresponding first sub-portion on the corresponding side and is provided with the first coil.

6. The camera module according to claim 5, wherein, The second circuit board further includes a connecting portion located within the receiving space, the connecting portion connecting the bottoms of two adjacent side portions and located below the movable part.

7. The camera module according to claim 6, wherein The second portion further includes at least three second mounting portions arranged at intervals in the circumferential direction, and the imaging module further includes a suspension assembly disposed between the movable part and the second mounting portions, wherein a gap is formed between a pair of adjacent second mounting portions, and the first sub-portions are provided between other adjacent second mounting portions.

8. The camera module according to claim 7, wherein, The first mounting portion and the second mounting portion are connected, and the second mounting portion is located outside the connecting portion of the second circuit board.

9. The camera module according to claim 5, wherein One side portion of the second circuit board is located at the notch and is provided with pins, and the pins are electrically connected to the first circuit board; the first portion includes a main body portion that jointly defines the receiving space with the second portion and an extension portion extending from the main body portion to the outside of the notch.

10. The imaging module according to claim 2, wherein, The base further includes a first conductive member embedded in the first mounting portion and electrically connected to the first circuit board; wherein the first coil is mounted on the first mounting portion, and the first coil is electrically connected to the first conductive member.

11. The imaging module according to claim 2, wherein The second portion includes a second mounting portion higher than the first mounting portion; wherein the imaging module further includes a suspension assembly disposed between the movable part and the second mounting portion.

12. The camera module according to claim 11, wherein, The second mounting portion includes a second sub-portion. The movable part includes an anti-shake bracket that is constrained to the second portion so as to be movable in a direction perpendicular to the optical axis, and the lens assembly is constrained to the anti-shake bracket; the suspension assembly includes balls constrained between the anti-shake bracket and the second sub-portion.

13. The camera module according to claim 12, wherein There are a plurality of the second sub-portions, which are circumferentially spaced apart; each of the second sub-portions is provided with a first strip-shaped groove, and the plurality of first strip-shaped grooves are rotationally symmetrically distributed with respect to the optical axis of the lens assembly; the anti-shake bracket is provided with a plurality of second strip-shaped grooves corresponding to the first strip-shaped grooves one by one and having mutually perpendicular extending directions, and each second strip-shaped groove and the corresponding first strip-shaped groove together form a ball cavity for accommodating the balls.

14. The imaging module according to claim 12, wherein, The second mounting portion further includes a third sub-portion, at least a part of the third sub-portion is located at a corner of the second portion, the suspension assembly includes a first elastic piece, and the first elastic piece includes a first section whose two ends are constrained between the anti-shake bracket and the third sub-portion.

15. The camera module according to claim 14, wherein, The movable part further includes a focusing bracket that is constrained to the anti-shake bracket so as to be movable in the optical axis direction, and the lens assembly is constrained to the focusing bracket; the first elastic piece further includes a second section whose two ends are constrained between the focusing bracket and the anti-shake bracket; the magnetic member is disposed on the anti-shake bracket, and the imaging module further includes a second coil disposed on the focusing bracket and opposite to the magnetic member; the base further includes a second conductive member embedded in the third sub-portion and electrically connected to the first circuit board, and the first elastic piece is made of a metal member and electrically conducts the second conductive member and the second coil.

16. The imaging module according to claim 11, wherein The second mounting portion includes a second sub-portion and a third sub-portion protruding upward from the second sub-portion. The suspension assembly includes a first suspension member and a second suspension member. The first suspension member is disposed between the second sub-portion and the lower part of the movable part, and the second suspension member is disposed between the third sub-portion and the upper part of the movable part.

17. The camera module according to any one of claims 1 to 16, characterized in that, The base is a molded body formed on the first circuit board.

18. The camera module according to any one of claims 1 to 16, characterized in that, The first portion is provided with a receiving hole, and the first circuit board is provided with a first through hole corresponding to the photosensitive chip; the photosensitive chip is located in the receiving hole and is flip-chip mounted on the first circuit board.

19. The camera module according to claim 18, wherein The imaging module further includes a filter element, and the filter element is mounted on the front surface of the first circuit board to cover the first through hole.

20. The imaging module according to claim 19, wherein The imaging module further includes a lens barrel constrained to the movable part, and the lens assembly is mounted inside the lens barrel; the filter element is rectangular, and at least a part of the long side of the filter element is located inside the lens barrel; an electronic component mounting area is provided on the front surface of the first circuit board, and the electronic component mounting area is located between the long side of the filter element and the inner edge of the lens barrel.

21. An electronic device, characterized in that, Comprising: The device body; and The imaging module according to any one of claims 1 to 20, and the imaging module is assembled to the device body.

22. A method for preparing a camera module, characterized in that, Including steps: Placing a second conductive member in the cavity of the first injection mold to injection mold a third sub-portion embedded with the second conductive member; Place the first circuit board and a plurality of third sub-parts in the cavity of the second injection mold to injection mold the part of the second part excluding the third sub-parts and the first part to form a base, wherein the first part is located on the back surface of the first circuit board to support the first circuit board and includes a main body part and an extension part, and the second part protrudes upward from the first part and is located around the main body part; at least part of the second part is lower than the first circuit board; Flip-chip the photosensitive chip onto the first circuit board; And Mount the movable part with the lens assembly on the second part of the base to obtain the camera module.

Images