Method for processing a buried copper wiring board and buried copper wiring board

Abstract

The application relates to a processing method of a buried copper circuit board and the buried copper circuit board. The processing method of the buried copper circuit board comprises the following steps: preparing an integrated circuit board with an inner buried copper block and a welding column; drilling a through hole on the integrated circuit board, so that the through hole penetrates the copper block and the welding column is removed; and filling copper material in the through hole, so that the copper material connects all the circuit layers of the integrated circuit board with the copper block. The processing method of the buried copper circuit board can bury the copper block in the integrated circuit board for heat dissipation through the welding column, remove the welding column through drilling of the through hole, fill the through hole with the copper material, and conduct the copper block with all the circuit layers of the integrated circuit board, so that the contact area of the heat dissipation copper block and the high current density area of the buried copper circuit board can be effectively increased, the heat dissipation exchange efficiency of the buried copper circuit board is improved, the heat dissipation performance is improved, the processing efficiency and the processing precision are improved, quality problems caused by the welding column are avoided, and product reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit boards, in particular to a processing method of a copper-embedded circuit board and the copper-embedded circuit board. BACKGROUND

[0002] With the continuous progress of science and technology, electronic devices are becoming more and more powerful, and the requirement for heat dissipation performance is also getting higher and higher. Therefore, various heat dissipation circuit boards have become an indispensable part of modern electronic devices.

[0003] In the related art, copper particles are embedded in the interior of a printed circuit board (PCB) for heat dissipation. However, the contact area between the copper particles and the high current density area in the circuit board is small, which limits the heat exchange efficiency, causes insufficient heat transfer, weakens the heat dissipation efficiency, and affects the heat dissipation performance of the heat dissipation circuit board. SUMMARY

[0004] Therefore, it is necessary to provide a processing method of a copper-embedded circuit board and the copper-embedded circuit board to solve the problem that the contact area between the copper particles and the high current density area in the circuit board is small and affects the heat dissipation performance.

[0005] In a first aspect, a processing method of a copper-embedded circuit board is provided, comprising:

[0006] preparing a whole circuit board with an embedded copper block and a soldering column;

[0007] drilling a through hole on the whole circuit board, so that the through hole penetrates the copper block and removes the soldering column;

[0008] filling copper material in the through hole, so that the copper material connects all circuit layers of the whole circuit board to the copper block.

[0009] In some embodiments, the hole diameter of the through hole is 4-6 mil larger than the outer diameter of the soldering column.

[0010] In some embodiments, the through hole includes one of a circular hole, an elliptical hole, and a polygonal hole.

[0011] In some embodiments, the filling of the copper material in the through hole includes:

[0012] copper plating and board electro-processing are performed on the whole circuit board, and a plating-resistant layer is made;

[0013] hole-filling electroplating is performed to fill the through hole with copper material.

[0014] In some embodiments, the preparation of the whole circuit board with the embedded copper block and the soldering column includes:

[0015] fixing the copper block to the substrate through the soldering column to obtain a heat dissipation core board;

[0016] The heat dissipation core plate is fixedly connected with the at least one circuit core plate to obtain the integrated circuit board with the embedded copper block and the welding column.

[0017] In some embodiments, at least one side of the circuit core plate is provided with the circuit layer; the circuit core plate comprises a copper-clad plate, and the circuit layer is a copper layer with a circuit pattern formed thereon.

[0018] In some embodiments, the heat dissipation core plate comprises a plurality of copper blocks; and the end faces of the plurality of copper blocks are flush along the axial direction of the through hole.

[0019] In some embodiments, the thickness of the copper block ranges from 300 microns to 800 microns.

[0020] In some embodiments, the shape of the copper block comprises one of a square shape, a cylindrical shape, a polygonal prism shape and a circuit shape.

[0021] In the second aspect, a copper-embedded circuit board is provided, which is prepared by the processing method of the copper-embedded circuit board according to any one of the first aspect.

[0022] The processing method of the copper-embedded circuit board and the copper-embedded circuit board can effectively increase the contact area between the heat dissipation copper block and the high current density area of the copper-embedded circuit board, improve the heat dissipation exchange efficiency of the copper-embedded circuit board, improve the heat dissipation performance, and improve the processing efficiency and processing precision, while avoiding quality problems caused by the welding column, improving product reliability, and solving the problems of easy explosion of the circuit board and poor heat dissipation exchange efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The figure is a flowchart of the processing method of the copper-embedded circuit board according to some embodiments of the present application.

[0024] Figure 2 The figure is a structural diagram of the integrated circuit board according to some embodiments of the present application.

[0025] Figure 3 The figure is a diagram of drilling a through hole in the integrated circuit board according to some embodiments of the present application.

[0026] Figure 4 The figure is a structural diagram of the copper-embedded circuit board according to some embodiments of the present application.

[0027] Figure 5 The figure is a structural diagram of the heat dissipation core plate according to some embodiments of the present application.

[0028] REFERENCE NUMERALS:

[0029] 100, buried copper circuit board; 10, whole circuit board; 1, heat dissipation core board; 11, base plate; 12, copper foil; 2, copper block; 3, welding column; 4, circuit core board; 101, through hole; 20, copper material. DETAILED DESCRIPTION

[0030] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described and should not be limited to these specific embodiments. It is to be understood that other embodiments can be utilized and structural or logical changes can be made without departing from the scope of the present application.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be understood as a limitation of the present application.

[0032] In addition, the terms "first", "second" are only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0033] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless specifically stated and limited otherwise, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "over", "above" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. The first feature "under", "below" and "underneath" the second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0035] It should be noted that an element referred to as being "fixed" or "disposed" on another element can be directly on the other element or can exist with a mediating element. An element is considered to be "connected" to another element, which can be directly connected to the other element or can exist with a mediating element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and are not intended to be the only implementation.

[0036] Referring to Figure 1 , Figure 1 A flowchart of a processing method of a buried copper circuit board in some embodiments of the present application is shown. The processing method of the buried copper circuit board provided in the embodiments of the present application includes the following steps:

[0037] Step S100, preparing an overall circuit board with an inner buried copper block and a soldering column;

[0038] Step S200, drilling a through hole on the overall circuit board, so that the through hole penetrates the copper block and removes the soldering column;

[0039] Step S300, filling copper material in the through hole, so that the copper material connects all the circuit layers of the overall circuit board to the copper block.

[0040] In combination with Figure 2 shown, Figure 2 A structural schematic diagram of an overall circuit board 10 in some embodiments of the present application is shown. Embedding at least one copper block 2 inside the overall circuit board 10 can greatly improve the heat dissipation performance of the overall circuit board 10. For example, the number of copper blocks 2 can be 1, 2, 3, 5 or more. Each copper block 2 is embedded into the inside of the overall circuit board 10 through at least one soldering column 3 for heat dissipation, and the processing efficiency and processing precision are higher. Wherein, along the thickness direction of the overall circuit board 10, the projection of the soldering column 3 is located within the projection range of the copper block 2. The soldering column 3 can be a soldering copper column.

[0041] In combination with Figure 3 shown, Figure 3A schematic diagram of drilling a through hole 101 in the overall circuit board 10 in some embodiments of the present application is shown; a drill is used to drill through the solder column 3 and the copper block 2, so that the through hole 101 penetrates through the opposite two sides of the overall circuit board 10 and penetrates through the copper block 2 while removing the solder column 3; wherein the inner diameter of the through hole 101 is greater than the diameter of the solder column 3 and less than the length and width dimensions of the copper block 2; the length and width dimensions of the copper block 2 refer to the dimensions of the copper block 2 in the axial direction perpendicular to the through hole 101. For example, the drill can include a laser drilling device, which uses laser to burn through the overall circuit board 10. By removing the solder column 3 while retaining the copper block 2, quality problems caused by the presence of the solder column 3 can be avoided, such as poor bonding and easy board explosion, while improving heat dissipation performance and product reliability.

[0042] In combination Figure 4 as shown, Figure 4 A schematic diagram of the structure of the copper-embedded circuit board 100 in some embodiments of the present application is shown; after drilling a through hole 101 in the overall circuit board 10, copper material 20 is used to fill the through hole 101, so that the copper material 20 forms a copper column with the same shape as the through hole 101; since the through hole 101 penetrates through each circuit layer of the overall circuit board 10 and the copper block 2, the copper material 20 filled in the through hole 101 can connect all circuit layers of the overall circuit board 10 with the copper block 2. In this way, the contact area between the heat dissipation copper block 2 and the high current density area of the copper-embedded circuit board 100 can be effectively increased, the heat dissipation exchange efficiency of the copper-embedded circuit board 100 can be improved, heat transfer is sufficient, heat dissipation efficiency is improved, and the heat dissipation performance of the copper-embedded circuit board 100 is improved.

[0043] The processing method of the copper-embedded circuit board 100 of the embodiments of the present application embeds the copper block 2 into the inside of the overall circuit board 10 for heat dissipation through the solder column 3, and then removes the solder column 3 by drilling a through hole 101 and fills the through hole 101 with copper material 20 to connect the copper block 2 with each circuit layer of the overall circuit board 10, which can effectively increase the contact area between the heat dissipation copper block 2 and the high current density area of the copper-embedded circuit board 100, improve the heat dissipation exchange efficiency of the copper-embedded circuit board 100, improve the heat dissipation performance, and also facilitate improving the processing efficiency and processing precision, while avoiding quality problems caused by the presence of the solder column 3, improving product reliability, and solving the problems of poor bonding and easy board explosion and poor heat dissipation exchange efficiency.

[0044] In some embodiments, the hole diameter of the through hole 101 is 4 to 6 mils larger than the outer diameter of the solder column 3.

[0045] 1 mil is about 0.0254 mm, 4 mils is about 0.1016 mm, and 6 mils is about 0.1524 mm. By setting the hole diameter of the through hole 101 to be at least 4 mils larger than the diameter of the solder post 3, i.e., about 0.1 mm, it is ensured that the solder post 3 can be removed by drilling the through hole 101, the machining precision requirement is reduced, and the machining efficiency is improved.

[0046] In some embodiments, the through hole 101 comprises one of a round hole, an oval hole, and a polygonal hole.

[0047] For example, the polygonal hole can be a triangular hole, a square hole, a pentagonal hole, a hexagonal hole, etc. The through hole 101 can be set to different cross-sectional shapes according to actual needs, and the machining is convenient and flexible, meeting actual needs.

[0048] In some embodiments, the through hole 101 is filled with copper material 20, specifically comprising the following steps:

[0049] Step S301, copper plating and panel surface electroplating treatment are performed on the overall circuit board 10, and a plating resist layer is made.

[0050] Step S302, hole filling electroplating is performed to fill the through hole 101 with copper material 20.

[0051] The overall circuit board 10 is subjected to copper plating and panel surface electroplating treatment, i.e., a copper layer between the conductive pattern circuit layer and the pattern circuit layer is deposited in the through hole 101 of the overall circuit board 10 by chemical copper plating, including two or more adjacent pattern circuit layers, so that the through hole 101 becomes a conductive hole; and the overall circuit board 10 is subjected to copper electroplating by full panel electroplating to thicken the copper layer on the panel surface and in the through hole 101 of the overall circuit board 10.

[0052] The plating resist layer is made, i.e., the plating resist layer is made on the panel surface of the overall circuit board 10 to avoid further increasing the thickness of the copper layer on the panel surface of the overall circuit board 10 in the subsequent hole filling electroplating process.

[0053] The hole filling electroplating fills the through hole 101 with copper material 20, i.e., the through hole 101 is filled with copper material 20 by hole filling electroplating copper, and the copper material 20 filling the through hole 101 forms a copper post, which electrically connects the copper block 2 and all the circuit layers of the overall circuit board 10.

[0054] In some embodiments, after the hole filling electroplating fills the through hole 101, a conventional post-process can also be included; for example, the conventional post-process includes: outer layer dry film; circuit electroplating and outer layer etching; outer layer circuit inspection; solder resist ink; surface treatment; plate ringing; electrical testing; and final inspection.

[0055] In some embodiments, the overall circuit board 10 with the embedded copper block 2 and the solder post 3 is prepared, specifically comprising the following steps:

[0056] Step S101, fixing the copper block 2 to the substrate 11 through the welding column 3 to obtain the heat dissipation core plate 1;

[0057] Step S102, fixing the heat dissipation core plate 1 and the at least one circuit core plate 4 through pressing to obtain the overall circuit board 10 with the embedded copper block 2 and the welding column 3.

[0058] In combination Figure 5 As shown, Figure 5 The structure of the heat dissipation core plate 1 in some embodiments of the present application is shown. The substrate 11 can be a plate made of adhesive insulating material, such as a prepreg, etc. The processing flow of fixing the copper block 2 to the substrate 11 through the welding column 3 can include: fixing and connecting at least one welding column 3 on the copper block 2; embedding the welding column 3 into the substrate 11, and fixing and connecting the copper block 2 to the substrate 11 at a set position through the welding column 3, which can be a position aligned with the circuit layer on the adjacent circuit core plate 4, so as to obtain the heat dissipation core plate 1 with the fixed copper block 2. The heat dissipation core plate 1 can further include a copper foil 12 arranged on the surface of the substrate 11 away from the copper block 2, and the welding column 3 is connected to the copper foil 12 through the substrate 11, which is conducive to improving the bonding force of the copper block 2, the substrate 11 and the copper foil 12 and improving the heat transfer efficiency, and further improving the heat dissipation performance. The resin flowability of the prepreg or high-thermal-conductivity insulating material can be used under the action of a certain temperature and pressure, and the copper block 2, the substrate 11 and the copper foil 12 are bonded together when the temperature reaches a certain degree, further improving the bonding force of the copper block 2, the substrate 11 and the copper foil 12. By fixing the copper block 2 to the substrate 11 through the welding column 3, the position of the copper block 2 can be fixed, and the relative position of the copper block 2 and the circuit layer on the circuit core plate 4 aligned with the copper block 2 is also fixed, which is conducive to improving the heat transfer efficiency of the copper block 2, improving the heat dissipation performance, and improving the processing efficiency and processing precision.

[0059] The circuit core plate 4 can be a semi-finished circuit board with pre-printed circuit, i.e. the circuit core plate 4 has a circuit layer. The processing flow of fixing the heat dissipation core plate 1 and the at least one circuit core plate 4 through pressing can include: arranging the heat dissipation core plate 1 with the fixed copper block 2 and the at least one circuit core plate 4 according to the stacking structure of the embedded copper circuit board 100, and then using the resin flowability of the prepreg or high-thermal-conductivity insulating material under the action of a certain temperature and pressure, and bonding the heat dissipation core plate 1 and the at least one circuit core plate 4 when the temperature reaches a certain degree, so as to obtain the overall circuit board 10. Since the prepreg or other insulating resin material has adhesive properties and can melt and flow under high temperature and pressure, the small gaps between the circuit core plate 4, the heat dissipation core plate 1 and the copper block 2 can be gradually filled during the pressing process, and the embedded copper block 2 can be bonded with the heat dissipation core plate 1 and the at least one circuit core plate 4 after solidification.

[0060] In some embodiments, the number of the circuit core boards 4 can be at least two, and the heat dissipation core board 1 fixedly combined with the copper block 2 is pressed between the at least two circuit core boards 4, that is, the heat dissipation core board 1 fixedly combined with the copper block 2 is sandwiched between the at least two circuit core boards 4; for example, 2 to 30 layers of the circuit core boards 4 are stacked, and the circuits of the circuit core boards 4 in different layers are electrically connected to each other to perform a specific function; that is, the overall circuit board 10 can be a multi-layer circuit board, and the number of layers is 2 to 30. In this way, the overall circuit board 10 has high assembly density, small volume and light weight, is beneficial to the miniaturization of electronic equipment, and is simple to install and has high reliability.

[0061] In some embodiments, the circuit core board 4 can be at least one of an FR-4 circuit board, a Teflon circuit board, a CAM-3 circuit board, a hydrocarbon resin circuit board, a BT resin circuit board and a polyimide circuit board. The FR-4 is a code of a flame-resistant material grade, which means that the resin material must be able to extinguish itself after burning. The FR-4 grade material used in the circuit board can be a composite material made of Tera-Function epoxy resin, filler and glass fiber. Teflon refers to polytetrafluoroethylene. The hydrocarbon resin refers to a polyolefin homopolymer or copolymer, including but not limited to butadiene styrene copolymer, butadiene homopolymer, styrene homopolymer, styrene / divinyl benzene copolymer, styrene-butadiene-divinyl benzene copolymer, etc. The BT resin refers to a bismaleimide triazine resin, which is resistant to chemical corrosion, has good insulation and heat resistance.

[0062] In some embodiments, before the heat dissipation core board 1 and the at least one circuit core board 4 are pressed in a stack structure, a conventional pre-process of processing the circuit core board 4 can be further included; for example, the conventional pre-process includes cutting, circuit layer pattern transfer, circuit layer etching, circuit layer circuit inspection and brown oxidation.

[0063] In some embodiments, at least one side of the circuit core board 4 is provided with a circuit layer; the circuit core board 4 includes a copper-clad plate, and the circuit layer is a copper layer with a circuit pattern.

[0064] The circuit core board 4 can be a single-sided circuit pattern or a double-sided circuit pattern, which is not limited herein. The circuit core board 4 can be a copper-clad plate after an etching process, and the copper layer of the copper-clad plate forms a circuit pattern to form a circuit layer.

[0065] In some embodiments, the heat dissipation core board 1 includes a plurality of copper blocks 2; the end faces of the plurality of copper blocks 2 are flush along the axial direction of the through hole 101.

[0066] The plurality of copper blocks 2 are combined and fixed on the heat dissipation core plate 1, which is conducive to improving the heat dissipation performance; and the plurality of copper blocks 2 are located in the same plane. In this way, the thickness difference between the plurality of copper blocks 2 is reduced, the flatness problem of the copper-embedded circuit board 100 caused by the thickness difference is avoided, the flatness of the surface of the copper-embedded circuit board 100 is improved, and the overall thickness of the copper-embedded circuit board 100 is reduced.

[0067] In some embodiments, the thickness of the copper block 2 ranges from 300 microns to 800 microns.

[0068] The thickness of the copper block 2 refers to the size in the axial direction of the through hole 101. The thickness of the copper block 2 is greater than or equal to 300 microns and less than or equal to 800 microns, that is, the thickness of the copper block 2 is greater than or equal to 80Z and less than or equal to 220Z. In this way, the heat dissipation performance of the copper-embedded circuit board 100 is improved.

[0069] In some embodiments, the length or width of the copper block 2 is 10.2 millimeters or 12.2 millimeters.

[0070] The length of the copper block 2 refers to the size perpendicular to the axial direction of the through hole 101, and the width of the copper block 2 refers to the size perpendicular to the length direction of the copper block 2 and perpendicular to the axial direction of the through hole 101. The length of the copper block 2 can be 10.2 millimeters or 12.2 millimeters, or the width of the copper block 2 can be 10.2 millimeters or 12.2 millimeters, which is not limited herein. In this way, the copper block 2 has a larger heat dissipation area, which is conducive to improving the heat dissipation performance of the copper-embedded circuit board 100.

[0071] In some embodiments, the shape of the copper block 2 includes one of a square, a cylindrical shape, a polygonal prism shape, and a circuit shape.

[0072] For example, the polygonal prism can be a triangular prism, a quadrangular prism, a pentagonal prism, a hexagonal prism, an octagonal prism, etc. The shape of the copper block 2 can be a circuit shape, which means that the shape of the copper block 2 is consistent with the circuit shape of the circuit core plate 4 adjacent to the heat dissipation core plate 1, that is, the width and length of the copper block 2 are the same as the width and length of the part of the circuit of the circuit core plate 4 aligned therewith. In some embodiments, the copper block 2 is etched according to the required shape, such as the current direction (i.e., the circuit shape); and the pattern shape formed by the plurality of copper blocks 2 on the heat dissipation core plate 1 is the same as the shape of the circuit pattern of the circuit core plate 4 adjacent to the heat dissipation core plate 1. The copper block 2 can be set to different shapes according to actual needs, which is convenient and flexible to process, and is conducive to improving the heat transfer efficiency of the copper block 2, improving the heat dissipation effect, and meeting the actual needs.

[0073] Referring to Figure 4 The copper-embedded circuit board 100 provided by the embodiments of the present application is prepared by the processing method of the copper-embedded circuit board 100 in any of the above embodiments.

[0074] The buried copper circuit board 100 of the embodiment of the present application has the same beneficial effects as the processing method of the buried copper circuit board 100 of the above-mentioned embodiment, and will not be described here again.

[0075] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above-mentioned embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as the scope of the present disclosure.

[0076] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A method of processing a buried-copper wiring board, characterized by, The application relates to a buried copper circuit board and a processing method thereof. At least one welding column is fixedly connected on a copper block, so that the welding column is embedded in a substrate, and the copper block is fixedly connected to a set position on the substrate through the welding column, so that a heat dissipation core plate is obtained; the set position is a position aligned with a circuit layer on an adjacent circuit core plate, and a projection of the welding column is located in a projection range of the copper block; the heat dissipation core plate is fixedly connected with at least one circuit core plate, so that an overall circuit board with an embedded copper block and a welding column is obtained; A through hole is drilled on the overall circuit board, so that the through hole penetrates the copper block and removes the welding column, wherein an inner diameter of the through hole is greater than a diameter of the welding column and smaller than length and width dimensions of the copper block; Copper material is filled in the through hole, so that all circuit layers of the overall circuit board are connected with the copper block through the copper material.

2. The method of processing a buried-copper wiring board according to claim 1, wherein, The hole diameter of the through hole is greater than the outer diameter of the welding column by 4-6 mils.

3. The method of processing a buried-copper wiring board according to claim 1, wherein The through hole comprises one of a round hole, an oval hole and a polygonal hole.

4. The method of processing a buried-copper wiring board according to claim 1, wherein The copper material filled in the through hole comprises: The overall circuit board is subjected to copper plating and plate electroprocessing, and a plating-resisting layer is formed; The through hole is filled with copper material through hole-filling electroplating.

5. The method of processing a buried-copper wiring board according to claim 1, wherein At least one side of the circuit core plate is provided with the circuit layer; the circuit core plate comprises a copper-clad plate, and the circuit layer is a copper layer with a circuit pattern.

6. The method of processing a buried-copper wiring board according to claim 1, wherein The heat dissipation core plate comprises a plurality of copper blocks; along an axial direction of the through hole, end faces of the plurality of copper blocks are flush.

7. The method of processing a buried-copper wiring board according to claim 1, wherein The thickness of the copper block ranges from 300 to 800 microns.

8. The method of processing a buried-copper wiring board according to any one of claims 1 to 4, wherein The shape of the copper block comprises one of a square, a cylindrical shape and a multi-prism shape.

9. A buried-copper wiring board, characterized by, The buried copper circuit board is prepared by the processing method of the buried copper circuit board according to any one of claims 1-8.

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