Electronic equipment

Abstract

The invention discloses electronic equipment which comprises a rotating shaft, a first machine body and a second machine body, the first machine body comprises a first circuit board; a gap is formed between the first circuit board and the rotating shaft; the connecting line is arranged between the first circuit board and the rotating shaft and at least partially extends along the axial direction of the rotating shaft. Therefore, the connecting line can be wired out of the board instead of being wired on the first circuit board, so that the layout area occupation of the first circuit board can be reduced, and the first circuit board has more layout area for arranging other functional devices; in addition, the signal interference of the first circuit board on the connecting line can be avoided, and the signal quality is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to an electronic device. Background Art

[0002] Electronic devices are usually equipped with connecting wires, which are used to connect various electronic components in the electronic devices. For example, the connecting wires can realize signal transmission between two electronic components.

[0003] The connecting wires are usually routed on the circuit boards of electronic devices. However, this routing method not only occupies the layout area of ​​the circuit board, making it impossible to set other functional devices on the circuit board, but also causes the circuit board to interfere with the connecting wires, affecting the signal quality. Summary of the invention

[0004] The present application provides an electronic device to solve the problem that the existing wiring method not only occupies the layout area of ​​the circuit board but also affects the signal quality.

[0005] The present application provides an electronic device, comprising: a rotating shaft, and a first body and a second body respectively arranged on both sides of the rotating shaft; the first body comprises: a first circuit board, with a gap between the first circuit board and the rotating shaft; and a connecting line, which is arranged between the first circuit board and the rotating shaft and extends at least partially along the axial direction of the rotating shaft. In this way, the connecting line can be routed outside the board instead of on the first circuit board. This routing method does not occupy the layout area of ​​the first circuit board, so that the first circuit board has more layout area for arranging other functional devices; in addition, it can also reduce the signal interference of the first circuit board on the connecting line, thereby ensuring the signal quality.

[0006] In some embodiments of the present application, the first body further includes: a bracket, disposed between the first circuit board and the rotating shaft; the bracket includes a wire groove, the wiring direction of the wire groove is parallel to the rotating shaft, and the wire groove is used for routing the connecting wire. In this way, the wiring path of the connecting wire can be better constrained to avoid bending or deviation.

[0007] In some embodiments of the present application, the bracket includes a main bracket, a side plate and a support plate, the main bracket is adjacent to the rotating shaft, the side plate is adjacent to the first circuit board, and there is a gap between the main bracket and the side plate; the main bracket is connected to the side plate through the support plate to form a wire groove. In this way, a wire groove with one side open can be formed to facilitate the laying of the connecting wire.

[0008] In some embodiments of the present application, the bracket further includes: a baffle; the baffle is located at the outlet end of the wire trough and is connected to the support plate, and the baffle is perpendicular to the routing direction; the baffle is used to limit the position of the connecting wire. In this way, the baffle can be used to prevent the connecting wire from being routed outside the area where the bracket is located, and can also change the routing direction of the connecting wire.

[0009] In some embodiments of the present application, there is a first distance L1 between the baffle and the side plate, so that an outlet is formed between the baffle and the side plate, and the outlet faces the first circuit board. In this way, the connecting wire can change direction at the outlet and continue to run toward the first circuit board.

[0010] In some embodiments of the present application, the bracket further includes: a guide plate; the guide plate is located at the connection between the support plate and the baffle plate, and forms a slope facing the side plate; the guide plate is used to guide the connecting line. In this way, the guide plate can be used not only to support the connecting line, but also to guide the connecting line.

[0011] In some embodiments of the present application, the main bracket includes a first side wall facing the side panel, the first side wall includes at least one first wire clamp portion arranged at intervals, and the first wire clamp portion protrudes toward the side panel; the side panel includes a second side wall facing the first side wall, the second side wall includes at least one second wire clamp portion arranged at intervals, and the second wire clamp portion protrudes toward the first side wall; the first wire clamp portion and the second wire clamp portion are used to fix the connecting wire. In this way, the connecting wire can be fixed by each first wire clamp portion and each second wire clamp portion to prevent the connecting wire from falling out of the wire groove, thereby preventing the connecting wire from interfering with other devices in the first fuselage.

[0012] In some embodiments of the present application, the main bracket includes a first chamfer, which is located at an edge of the first side wall away from the support plate; the side plate includes a second chamfer, which is located at an edge of the second side wall away from the support plate. In this way, it is easy to lay the connecting wires and prevent the bracket from scratching the connecting wires.

[0013] In some embodiments of the present application, it also includes: a flexible circuit board; the first body also includes: a middle frame, the area of ​​the middle frame adjacent to the hinge includes a through hole, the first circuit board is arranged in the middle frame and adjacent to the through hole; the first end of the flexible circuit board is connected to the first circuit board, and the second end of the flexible circuit board passes through the through hole to be connected to the second body; the bracket is arranged in the through hole and connected to the middle frame, and the bracket is used to seal the through hole.

[0014] In some embodiments of the present application, the middle frame includes a first portion located on a side of the through hole away from the rotation axis and a second portion located on a side of the through hole close to the rotation axis; the first portion includes a first side surface facing the through hole, and the second portion includes a second side surface facing the through hole; a sealing portion is provided on the first side surface, and the sealing portion extends from the first side surface to the second side surface; there is a gap between the sealing portion and the second side surface, which is used to form a first channel for the flexible circuit board to pass through; the second end of the flexible circuit board extends along the sealing portion and passes through the first channel to the second body. In this way, the flexible circuit board can be easily passed through the middle frame to be connected between the first body and the second body.

[0015] In some embodiments of the present application, the sealing part is attached to the flexible circuit board through an adhesive layer, so that the flexible circuit board and the sealing part can be fixed, and the flexible circuit board can also play the role of sealing the through hole.

[0016] In some embodiments of the present application, the bracket includes a first contact surface facing the sealing portion, a second contact surface facing the second side surface, and a third contact surface located at both ends of the first contact surface along the routing direction; the middle frame includes two third side surfaces along the routing direction for connecting the first side surface and the second side surface; the first contact surface abuts against the area of ​​the flexible circuit board used for bonding with the sealing portion, the second contact surface abuts against the second side surface, and the third contact surface abuts against the third side surface to seal the through hole. In this way, each contact surface of the bracket can abut against the corresponding side surface of the middle frame to improve the sealing effect of the through hole.

[0017] In some embodiments of the present application, the bracket includes a receiving opening, which is continuously formed on the first contact surface, the second contact surface, and the third contact surface; the receiving opening is filled with sealing ribs, which are respectively abutted against the flexible circuit board and the second side surface and the third side surface of the middle frame to seal the through hole. In this way, the sealing ribs are used to achieve the abutment between the bracket and the middle frame, which can further improve the sealing effect.

[0018] In some embodiments of the present application, the bracket includes a first fixing portion and a second fixing portion; the first fixing portion and the second fixing portion are located at both ends of the bracket along the routing direction; the first fixing portion and the second fixing portion are used to connect with the middle frame. In this way, the bracket can be stably fixed to the middle frame to ensure the effect of sealing the through hole of the bracket.

[0019] In some embodiments of the present application, the second circuit board and the radio frequency chip module are also included; the radio frequency chip module is arranged on the first circuit board and connected to the first circuit board; the second circuit board is arranged on the side of the first circuit board away from the radio frequency chip module along the axial direction of the rotating shaft. In this way, it is convenient to lay a connecting line between the second circuit board and the first circuit board to realize signal transmission between the second circuit board and the radio frequency chip module.

[0020] In some embodiments of the present application, the connecting wire is a radio frequency connecting wire; one end of the radio frequency connecting wire is connected to the second circuit board, and the other end of the radio frequency connecting wire passes through the wire slot and extends to the first area of ​​the first circuit board to connect to the first circuit board; wherein the first area refers to the area of ​​the first circuit board adjacent to the radio frequency chip module. In this way, the connecting wire connected to the second circuit board can receive the signal and transmit it to the first circuit board, thereby facilitating signal transmission.

[0021] In some embodiments of the present application, the connecting wire is a radio frequency connecting wire; one end of the radio frequency connecting wire is connected to the second area of ​​the first circuit board, and the other end of the radio frequency connecting wire passes through the wire slot and is connected to the first area of ​​the first circuit board; wherein the first area refers to the area of ​​the first circuit board adjacent to the radio frequency chip module, and the second area refers to the area of ​​the first circuit board away from the radio frequency chip module. In this way, different connecting wires can be used to realize the transmission of different signals.

[0022] In some embodiments of the present application, the side panel includes an opening; the opening is connected to the wire slot, and the opening faces the second area of ​​the first circuit board; the other end of the RF connection line passes through the opening and the wire slot and is connected to the first area of ​​the first circuit board. In this way, signal transmission within the board can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 is a schematic diagram of the structure of the radio frequency connecting line provided in an embodiment of the present application;

[0025] Figure 2A It is a schematic diagram of the internal structure of an electronic device;

[0026] Figure 2B yes Figure 2A A partial schematic diagram of the middle A area;

[0027] Figure 3 is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application;

[0028] Figure 4 It is a first internal structure schematic diagram of the electronic device 100 provided in an embodiment of the present application;

[0029] Figure 5 is a second internal structure schematic diagram of the electronic device 100 provided in an embodiment of the present application;

[0030] Figure 6 is a first structural schematic diagram of the first fuselage 110 provided in an embodiment of the present application;

[0031] Figure 7 yes Figure 6 Schematic diagram of the structure of the middle B area;

[0032] Figure 8 is a first structural schematic diagram of the bracket 204 provided in an embodiment of the present application;

[0033] Fig. 9is a second structural schematic diagram of the bracket 204 provided in the embodiment of the present application;

[0034] Fig.10 yes Figure 8 Partial view of the middle DD section;

[0035] Fig.11 yes Fig. 9 Schematic diagram of the structure of the middle E area;

[0036] Fig.12 is a side view of the bracket 204 provided in the embodiment of the present application;

[0037] Fig.13A It is a partial schematic diagram of the middle frame 201 provided in an embodiment of the present application;

[0038] Fig. 13B yes Figure 7 The first partial schematic diagram of the CC section;

[0039] Fig.14 It is a schematic diagram of the assembly structure of the bracket 204 and the radio frequency connecting line 205 provided in the embodiment of the present application;

[0040] Fig.15 is a second structural schematic diagram of the first fuselage 110 provided in an embodiment of the present application;

[0041] Fig.16 is a third structural schematic diagram of the bracket 204 provided in the embodiment of the present application;

[0042] Fig.17 is a fourth structural schematic diagram of the bracket 204 provided in the embodiment of the present application;

[0043] Fig.18 is a fifth structural schematic diagram of the bracket 204 provided in the embodiment of the present application;

[0044] Fig.19 yes Figure 7 The second partial schematic diagram of the CC section;

[0045] Fig. 20 is a schematic diagram of the structure of the sealing rib 20481 provided in an embodiment of the present application;

[0046] Fig.21 It is a schematic diagram of the assembly structure of the bracket 204 and the sealing rib 20481 provided in the embodiment of the present application. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described clearly below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making creative work all belong to the protection scope of the present application.

[0048] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0049] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] The professional terms mentioned in the embodiments of the present application are explained below to facilitate understanding by those skilled in the art.

[0051] RF cable (hereinafter referred to as cable) is a common signal line in electronic devices. Cable may include an inner conductor and an outer conductor wrapped around the inner conductor. The inner conductor and the outer conductor are coaxial, and the inner conductor and the outer conductor form a current loop for signal transmission. There is an insulating medium between the inner conductor and the outer conductor. The insulating medium is used to ensure that the distance between the inner conductor and the outer conductor is consistent to avoid reducing the transmission signal power and thus avoid reducing the signal strength. The outer conductor is wrapped with an insulating layer, which acts as an insulator to shield electromagnetic interference. Cables are often used for long-distance radio frequency, communication and other signal transmission.

[0052] Figure 1 It is a structural schematic diagram of the radio frequency connecting line provided in an embodiment of the present application.

[0053] like Figure 1 As shown, the cable line 40 may include a line body 41 and cable heads 42 located at both ends of the line body 41. The cable heads 42 are used to be buckled on the circuit board so as to transmit the signal to the radio frequency processor near the circuit board.

[0054] The cable 40 is used to connect the radio frequency circuit and the antenna in the electronic device, so that the electronic device can perform radio frequency communication through the connected radio frequency circuit and the antenna. The radio frequency circuit can be located on the main circuit board of the electronic device, and the antenna can be located on the middle frame of the electronic device.

[0055] Figure 2A It is a schematic diagram of the internal structure of an electronic device. Figure 2B yes Figure 2A A partial schematic diagram of area A in the middle.

[0056] like Figure 2A and Figure 2B As shown, the electronic device includes a middle frame 10, on which a main circuit board 20 and a sub-circuit board 50 are arranged, wherein the main circuit board 20 is located in the upper half of the middle frame 10, and the sub-circuit board 50 is located in the lower half of the middle frame 10. The main circuit board 20 is responsible for most system function operations and whole machine control in the electronic device; the sub-circuit board 50 is responsible for charging, headphone audio signal transmission, signal connection processing, communication processing, and sound conversion processing.

[0057] The RF processor 30 is disposed in the area of ​​the main circuit board 20 adjacent to the top of the middle frame 10, and the RF processor 30 is connected to the main circuit board 20. The cable 40 is connected between the main circuit board 20 and the auxiliary circuit board 50, and the auxiliary circuit board 50 transmits the collected signal to the main circuit board 20 through the cable 40, and then the main circuit board 20 transmits the signal to the RF processor 30, and the RF processor 30 processes the signal.

[0058] The middle frame portion 10 may include an antenna (not shown in the figure); the main circuit board 20 may include a radio frequency circuit and a connection socket connected to the radio frequency circuit; the auxiliary circuit board 50 may include a connection socket connected to the antenna and corresponding one to one.

[0059] The RF circuit may include one or more devices of a power amplifier, a filter, a linear amplifier, and a switch, and the RF circuit may also be coupled to the RF processor 30. The RF processor 30 is used to generate a transmission signal, and the RF circuit transmits the transmission signal to the antenna via the cable 40, and the antenna transmits the generated wireless signal. The antenna may also receive a RF signal, and the antenna transmits the received RF signal to the RF circuit via the cable 40, and transmits the received RF signal to the RF processor 30 via the RF circuit.

[0060] When using the cable 40 for signal transmission, the cable 40 can connect the RF circuit and the antenna through the connection sockets on the main circuit board 20 and the auxiliary circuit board 50. Exemplarily, one cable head 42 of the cable 40 is buckled on the main circuit board 20 and coupled with the connection socket corresponding to the RF circuit, and the other cable head 42 is buckled on the auxiliary circuit board 50 and coupled with the connection socket corresponding to the antenna. In this way, the cable 40 can realize signal transmission between different circuit boards, so that when the electronic device is performing RF communication, the RF circuit can send RF signals to the antenna through the cable 40, and the antenna can receive and send RF signals, thereby realizing RF communication of the electronic device.

[0061] Taking a mobile phone as an example of an electronic device, the middle frame 10 is a relatively large structural component that carries all components such as circuit boards and batteries. Due to its structural integrity and relatively large size, it is convenient to lay the routing path of the cable 40. Therefore, a groove 11 can be opened on the middle frame 10, and the cable 40 is routed in the groove 11 until it reaches the circuit board (main circuit board 20 and auxiliary circuit board 50) and is connected to the circuit board. Routing refers to laying the cable 40.

[0062] When using the cable 40 to transmit the signal to the RF processor 30 disposed on the main circuit board 20, from the perspective of reducing signal insertion loss, the cable head 42 is buckled as much as possible at a position of the main circuit board 20 that is relatively close to the corresponding RF processor 30. Based on the commonly used routing method, the cable 40 is routed in the groove 11 of the middle frame 10, and when it encounters the main circuit board 20 at the T1 position, it turns to the left and routes along the edge of the main circuit board 20. The T1 position is the end of the main circuit board 20 away from the RF chip 30, so the cable 40 needs to be routed along the edge of the main circuit board 20 to the T2 position and then turn to route upward, so that the cable head 42 can be buckled at the position of the main circuit board 20 near the RF processor 30. In this way, the distance between the cable 40 from the routing position to the main circuit board 20 to the routing position to the RF processor 30 is relatively far, and a longer distance line needs to be laid.

[0063] However, the cable is routed on the main circuit board 20 of the electronic device, so that other functional devices cannot be soldered on the main circuit board 20, resulting in a waste of circuit board layout area. In addition, in order to prevent other devices in the electronic device from damaging the cable 40, it is necessary to solder hardware on the main circuit board 20 to restrict the routing path of the cable 40 from bending or deflecting, which not only makes the manufacturing more complicated and increases the cost, but also further wastes the layout area of ​​the circuit board.

[0064] In addition, due to the structural characteristics of the cable 40, the signal running in the conductor has the characteristic of dissipating energy outward due to electromagnetic radiation, which causes a difference between the signal input to the cable 40 and the signal output from the cable 40, that is, the signal is damaged. The outermost layer of the cable 40 is an insulating layer, which can usually ensure that the signal will not be scattered. However, if the cable 40 is routed on the main circuit board 20, the insulating layer cannot be made into a good electromagnetic shield. Then, at the same routing distance, routing on the main circuit board 20 will produce more spillage, resulting in signal damage. It can be seen that the cable 40 is laid out on the main circuit board 20 for a longer distance, and the main circuit board 20 will cause electromagnetic interference to the cable 40, causing the transmission signal of the cable 40 to be damaged.

[0065] In order to increase the layout area of ​​the circuit board, reduce costs, and avoid signal damage, the embodiment of the present application provides an electronic device 100, which lays routing paths on other structural parts to reduce the routing distance of the RF connection line on the circuit board.

[0066] The electronic device described in the embodiments of the present application includes but is not limited to a mobile phone, a folding screen mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant or a wearable device, etc. The following description is made by taking the electronic device as a folding screen mobile phone.

[0067] To facilitate understanding of the electronic device 100 provided in the embodiment of the present application, the structure thereof is described in detail below with reference to the accompanying drawings.

[0068] Figure 3 It is a schematic diagram of the structure of the electronic device 100 provided in an embodiment of the present application.

[0069] like Figure 3 As shown, in some embodiments, the electronic device 100 may include a first body 110, a second body 120, a hinge 130, a screen 140, a first rear shell and a second rear shell (not shown in the figure). The first body 110 and the second body 120 are arranged on both sides of the axis direction of the hinge 130; the screen 140 covers the first body 110, the second body 120 and the hinge 130, and is connected to the first body 110 and the second body 120 respectively; the first rear shell is connected to the side of the first body 110 away from the screen 140, and the second rear shell is connected to the side of the second body 120 away from the screen 140.

[0070] The first body 110 and the second body 120 are respectively rotatably connected to the shaft 130, so that the angle between the first body 110 and the second body 120 decreases until the electronic device 100 is in a folded state, or the angle between the first body 110 and the second body 120 increases until the electronic device 100 is in an unfolded state.

[0071] The screen 140 may be a bendable flexible screen. Figure 3 The state shown is a schematic diagram of the electronic device 100 in an unfolded state. At this time, the first body 110 and the second body 120 are distributed in parallel on both sides of the hinge 130, flattening the flexible screen.

[0072] Depending on the rotation direction of the first body 110 and the second body 120, the flexible screen may be hidden inside the body when the electronic device 100 is in the folded state, or it may be wrapped around the outside of the body. Among them, when the first body 110 and the second body 120 are folded toward the front of the flexible screen, the flexible screen is hidden inside the body when the electronic device 100 is in the folded state, and this electronic device can be called an inner folding screen electronic device, such as an inner folding screen mobile phone; when the first body 110 and the second body 120 are folded toward the back of the flexible screen, the flexible screen is wrapped around the outside of the body when the electronic device 100 is in the folded state, and this electronic device 100 can be called an outer folding screen electronic device, such as an outer folding screen mobile phone.

[0073] To facilitate description of the internal structure layout of the electronic device 100, the body (first body 110 and second body 120) of the electronic device 100 is defined to include a first surface 100a and a second surface 100b. The first surface 100a is the surface of the body facing the rear shell of the body; the second surface 100b is the surface of the body facing the screen 140. In other words, the first surface 100a and the second surface 100b are opposite surfaces.

[0074] Figure 4 This is a first internal structure diagram of the electronic device 100 provided in an embodiment of the present application.

[0075] Figure 5 This is a second internal structure diagram of the electronic device 100 provided in an embodiment of the present application.

[0076] in, Figure 4 The state shown is a schematic diagram of the structure of the first surface 100a of the electronic device 100. Figure 5 The state shown is a schematic structural diagram of the second surface 100 b of the electronic device 100 .

[0077] like Figure 4 and Figure 5 As shown, in some embodiments, when the electronic device 100 is a foldable screen mobile phone, a flexible printed circuit (FPC) 150 connected to the main circuit board is usually arranged between the first body 110 and the second body 120. The flexible printed circuit 150 has excellent characteristics such as light weight, thin thickness, and free bending and folding.

[0078] The flexible circuit board 150 spans the hinge 130 along the first direction and is connected between the first body 110 and the second body 120. The flexible circuit board 150 may include a first end 151 and a second end 152 opposite to each other, wherein the first end 151 is connected to the first body 110 at the first surface 100a of the electronic device 100, and the second end 152 first penetrates from the first surface 100a into the second surface 100b, then penetrates from the second surface 100b to the first surface 100a, and finally connects to the second body 120 at the first surface 100a. The first direction is perpendicular to the axial direction of the hinge 130.

[0079] The main circuit board of the electronic device 100 can be arranged in the first body 110 or in the second body 120. The routing path of the RF connection line is determined according to the layout position of the main circuit board. Exemplarily, when the main circuit board is arranged in the first body 110, the routing path of the RF connection line is also laid in the first body 110.

[0080] Figure 6 This is a first structural schematic diagram of the first fuselage 110 provided in an embodiment of the present application.

[0081] in, Figure 6 The state shown is a schematic structural diagram of the first surface 100 a of the first body 110 .

[0082] Combination Figure 4 and Figure 6 As shown, in some embodiments, the first body 110 includes a first circuit board 202 and a connection line 205. There is a gap between the first circuit board 202 and the shaft 130. The connection line 205 is disposed between the first circuit board 202 and the shaft 130, and at least partially extends along the axial direction of the shaft 130.

[0083] The first circuit board 202 may be the main circuit board of the electronic device 100. The connecting line 205 may be a radio frequency connecting line or other connecting lines configured in the electronic device for signal transmission. The following description takes the connecting line 205 as an example of a radio frequency connecting line 205. The radio frequency connecting line 205 is used to realize signal transmission between the circuit boards in the electronic device 100, wherein the signal may include a radio frequency signal and / or a communication signal. The structural characteristics of the radio frequency connecting line 205 may refer to Figure 1 The structural characteristics of the cable 40 are not described in detail here.

[0084] In this way, the electronic device 100 provided in the embodiment of the present application provides a routing method, so that the connecting line 205 can be routed outside the board instead of being routed on the first circuit board 202. This routing method does not occupy the layout area of ​​the first circuit board 202, so that the first circuit board 202 has more layout area for arranging other functional components; it can also reduce the number of hardware components arranged on the first circuit board 202 to reduce costs. In addition, it can also reduce the signal interference of the first circuit board 202 on the connecting line 205, ensuring signal quality.

[0085] In some embodiments, see again Figure 4 and Figure 6 In the embodiment of the present application, the RF connecting line 205 is laid on the side of the first body 110 close to the rotating shaft 130, but not on the side away from the rotating shaft 130. This is because the side of the first body 110 away from the rotating shaft 130 is the button side. In this way, the first body 110 includes a side button position, and a groove has been opened on the first body 110 corresponding to the side button position to accommodate the side button and related electronic components, and there is a backing adhesive between the first body 110 and the battery cover for sealing, so that the first body 110 on the button side is already the narrowest sealed position. If the RF connecting line 205 is routed at this position, a corresponding wire groove needs to be added to the first body 110, and the vertical wall of the first body 110 needs to continue to expand to the right, and the right side is the battery compartment 207. If it expands to the right, the battery needs to be narrowed as a whole, which is not conducive to the laying of the battery. Therefore, in the embodiment of the present application, the RF connection line 205 is laid on a side of the first body 110 close to the rotation shaft 130 , which will not affect other components in the electronic device 100 .

[0086] Figure 7 yes Figure 6 Schematic diagram of the structure of area B in the middle.

[0087] Combination Figure 4 and Figure 7 As shown, in some embodiments, the first body 110 may further include a radio frequency chip module 203 and a bracket 204 .

[0088] The RF chip module 203 is disposed on the first circuit board 202 and is electrically connected to the first circuit board 202. Based on the layout characteristics of each device in the electronic device 100, the RF chip module 203 can be disposed in an area of ​​the first circuit board 202 near the top of the first body 110.

[0089] The RF chip module 203 is used to receive the signal transmitted by the RF connecting line 205 through the first circuit board 202 and process the signal; the RF chip module 203 is also used to generate a signal and transmit the signal to the antenna through the RF connecting line 205 so as to be emitted by the antenna.

[0090] The bracket 204 is disposed between the first circuit board 202 and the rotating shaft 130. The bracket 204 is used to guide the routing path of the radio frequency connecting line 205. Exemplarily, the bracket 204 can be made of stainless steel, plastic, aluminum alloy or other materials.

[0091] Figure 8 This is a first structural schematic diagram of the bracket 204 provided in the embodiment of the present application.

[0092] Fig. 9 This is a second structural schematic diagram of the bracket 204 provided in the embodiment of the present application.

[0093] in, Fig. 9 The structure shown is Figure 8 Schematic diagram of another perspective of the structure shown.

[0094] Combination Figure 4 , Figure 7 , Figure 8 and Fig. 9 As shown, in some embodiments, the bracket 204 includes a wire groove 2041 , the wiring direction D0 of the wire groove 2041 is parallel to the rotating shaft 130 , and the wire groove 2041 is used for routing the RF connecting line 205 .

[0095] The wire groove 2041 can pass through both ends of the bracket 204 in the length direction, and the routing direction D0 of the wire groove 2041 is the length direction of the bracket 204, so that the entrance 204a of the wire groove 2041 along the routing direction D0 can be located at one end of the length direction of the bracket 204, and the exit 204b along the routing direction D0 can be located at the other end of the length direction of the bracket 204. In this way, routing in the length direction of the bracket 204 can increase the routing distance, thereby better laying the RF connection line 205 and reducing the routing of the RF connection line 205 on other devices.

[0096] In some embodiments, the wire groove 2041 can be formed by being recessed to a first depth along the surface of the bracket 204 toward the inside of the bracket 204. In this way, the wire groove 2041 can be a groove with one end open to facilitate wiring.

[0097] In some embodiments, the wire groove 2041 can be formed at the center of the length direction of the bracket 204, and the bracket 204 is a hollow structure. In this way, the bracket 204 can wrap the RF connection line 205, and can stably fix the RF connection line 205 to prevent the RF connection line 205 from falling out of the wire groove 2041.

[0098] The RF connection line 205 is routed in the wire groove 2041 . To constrain the position of the RF connection line 205 and prevent the routing path of the RF connection line 205 from bending or deflecting, the depth of the wire groove 2041 is greater than or equal to the diameter of the RF connection line 205 .

[0099] One end of the RF connection line 205 is used to receive signals, and the other end passes through the wire slot 2041 and extends to the first area 2021 of the first circuit board 202. The first area 2021 includes a connection seat (not shown in the figure), and the other end of the RF connection line 205 is buckled on the connection seat to connect with the first circuit board 202; wherein the first area 2021 refers to the area of ​​the first circuit board 202 adjacent to the RF chip module 203.

[0100] The outlet 204b of the wire groove 2041 along the routing direction D0 is adjacent to the RF chip module 203, and the RF connecting line 205 passes through the outlet 204b of the wire groove 2041 and meets the first circuit board 202. In this way, the position where the RF connecting line 205 meets the first circuit board 202 is adjacent to the RF chip module 203, so the direction of the RF connecting line 205 can be changed to route to the first circuit board 202, and further extend to the area adjacent to the RF chip module 203. The first circuit board 202 may include a RF circuit, so the RF connecting line 205 can be connected to the RF chip module 203 through the RF circuit of the first circuit board 202 to transmit the signal into the RF chip module 203. In this way, the RF connecting line 205 can be routed outside the board to a position that is almost closest to the RF chip module 203. After that, it enters the area of ​​the first circuit board 202 close to the RF chip module 203, that is, the routing is in the upper area of ​​the first circuit board 202, to ensure that the routing occupies the minimum layout area of ​​the first circuit board 202.

[0101] The electronic device 100 provided in the embodiment of the present application uses a bracket 204 to lay the RF connection line 205, and the RF connection line 205 is routed in the wire groove 2041 on the bracket 204, which can better constrain the routing path of the RF connection line 205 to avoid bending or offset. In this way, the RF connection line 205 can be routed outside the board to the position that is almost closest to the RF chip module 203. After that, it enters the area of ​​the first circuit board 202 close to the RF chip module 203, which can reduce the routing distance of the RF connection line 205 on the first circuit board 202, and ensure that the layout area occupied by the routing of the first circuit board 202 is minimized. In addition, the RF connection line 205 can be connected to the area adjacent to the RF chip module 203, which can not only reduce the electromagnetic interference of the first circuit board 202 to the RF connection line 205 and avoid signal damage, but also reduce the layout area occupied by the first circuit board 202, so that the first circuit board 202 has more layout area for laying out other functional devices. At the same time, the RF connecting line 205 can be fixed by the bracket 204 to reduce the number of hardware arranged on the first circuit board 202, which can not only further reduce the layout area occupied by the first circuit board 202, but also reduce the cost.

[0102] Fig.10 yes Figure 8Partial view of the DD section.

[0103] in, Fig.10 Only the structures of the main bracket 2042, the side plate 2043 and the support plate 2044 included in the bracket 204 are shown, and other structures of the bracket 204 are not shown.

[0104] Combination Figure 7 , Figure 8 and Fig.10 As shown, in some embodiments, the bracket 204 may include a main bracket 2042, a side plate 2043 and a support plate 2044. The main bracket 2042 is adjacent to the shaft 130, the side plate 2043 is adjacent to the first circuit board 202, and there is a gap between the main bracket 2042 and the side plate 2043; the main bracket 2042 is connected to the side plate 2043 through the support plate 2044 to form a wire groove 2041.

[0105] In this way, a wire groove 2041 with an opening on one side can be formed, and the radio frequency connecting wire 205 can be laid in the wire groove 2041 from the opening, which facilitates the laying of the radio frequency connecting wire 205 .

[0106] In some embodiments, the bracket 204 may further include a first fixing portion 20491 and a second fixing portion 20492. The first fixing portion 20491 and the second fixing portion 20492 are located at two ends of the bracket 204 along the routing direction D0, and the first fixing portion 20491 and the second fixing portion 20492 may be located on the same side of the routing direction.

[0107] Exemplarily, the first fixing portion 20491 may be connected to a region of the side plate 2043 corresponding to an entrance of the wire trough 2041 , and the second fixing portion 20492 may be connected to a region of the support plate 2044 corresponding to an exit of the wire trough 2041 .

[0108] The first fixing portion 20491 and the second fixing portion 20492 are used to connect with the first body 110. Exemplarily, the first fixing portion 20491 and the second fixing portion 20492 may both adopt a ring structure.

[0109] Fig.11 yes Fig. 9 Schematic diagram of the structure of area E in the middle.

[0110] Fig.12 It is a side view of the bracket 204 provided in the embodiment of the present application.

[0111] like Fig.11 and Fig.12 As shown, in some embodiments, the bracket 204 may further include: a baffle 2045 , and the baffle 2045 is used to limit the position of the RF connection line 205 .

[0112] The baffle 2045 is located at one end of the length direction of the bracket 204 and at the exit 204b of the wire slot 2041. The baffle 2045 can be located at the connection between the second fixing portion 20492 and the support plate 2044, and the baffle 2045 is connected to the support plate 2044, and the baffle 2045 is perpendicular to the length direction of the bracket 204. In this way, the baffle 2045 can be used to prevent the RF connection line 205 from being routed outside the area where the bracket 204 is located, for example, to prevent the RF connection line 205 from being routed to the second fixing portion 20492. By limiting the routing position of the RF connection line 205 by using the baffle 2045, it is possible to avoid the RF connection line 205 from interfering with other devices in the first fuselage 110.

[0113] In some embodiments, the length of the side panel 2043 along the routing direction D0 is smaller than the length of the main support 2042 along the routing direction, so that there is a first distance L1 between the baffle 2045 and the side panel 2043, so that an outlet 204b is formed between the baffle 2045 and the side panel 2043, and the outlet 204b faces the first circuit board 202 and is adjacent to the RF chip module 203.

[0114] In this way, the baffle 2045 can be used to change the routing direction D0 of the RF connecting line 205 routed to the exit 204b position, so that the RF connecting line 205 can change direction at the exit position and continue to route toward the first circuit board 202, so that when the RF connecting line 205 transmits signals between the RF chip module 203, it can have the shortest routing distance on the first circuit board 202.

[0115] In some embodiments, the support 204 may further include a guide plate 2046 . The guide plate 2046 is located at the connection between the support plate 2044 and the baffle plate 2045 , and forms a slope facing the side plate 2043 .

[0116] The guide plate 2046 is used to increase the strength of the bracket 204. In this way, the guide plate 2046 can not only support the RF connection line 205, but also guide the RF connection line 205. In this way, the guide plate 2046 is used to assist the baffle 2045 to change the routing direction D0 of the RF connection line 205, so that the RF connection line 205 is routed in the direction of the first circuit board 202.

[0117] Combine again Fig.10 and Fig.11 In some embodiments, the main bracket 2042 may include a first side wall 20421 facing the side plate 2043 , the first side wall 20421 includes at least one first wire clamp portion 20422 arranged at intervals, and the first wire clamp portion 20422 protrudes toward the side plate 2043 .

[0118] The side plate 2043 may include a second side wall 20431 facing the first side wall 20421 , and the second side wall 20431 includes at least one second wire clamp portion 20432 arranged at intervals, and the second wire clamp portion 20432 protrudes toward the first side wall 20421 .

[0119] The number of the first wire clamp parts 20422 can be the same as or different from the number of the second wire clamp parts 20432. The first wire clamp parts 20422 and the second wire clamp parts 20432 can be staggered or arranged one by one. The first wire clamp parts 20422 and the second wire clamp parts 20432 protrude toward each other in the wire groove 2041 respectively. When the RF connection line 205 is routed in the wire groove 2041, the RF connection line 205 can be fixed by using the first wire clamp parts 20422 and the second wire clamp parts 20432, which can prevent the RF connection line 205 from slipping out of the wire groove 2041 and prevent the routing path of the RF connection line 205 from bending or deflecting. The position of the RF connection line 205 is constrained by the first wire clamp parts 20422 and the second wire clamp parts 20432, thereby preventing the RF connection line 205 from interfering with other devices in the first fuselage 110.

[0120] In some embodiments, the main support 2042 may include a first chamfer 20423 located at an edge of the first side wall 20421 away from the support plate 2044. The side plate 2043 includes a second chamfer 20433 located at an edge of the second side wall 20431 away from the support plate 2044.

[0121] The first chamfer 20423 and the second chamfer 20433 are located at the opening of the wire groove 2041 . Thus, when laying the RF connecting wire 205 in the wire groove 2041 , the first chamfer 20423 and the second chamfer 20433 can facilitate the laying of the RF connecting wire 205 and prevent the bracket 204 from scratching the RF connecting wire 205 .

[0122] See again Figure 6 and Figure 7 In some embodiments, the first body 110 may further include a middle frame 201. The middle frame 201 is a structural component used to carry other devices in the electronic device 100, and antennas (not shown in the figure) are arranged in different areas of the middle frame 201.

[0123] Fig.13A It is a partial schematic diagram of the middle frame 201 provided in an embodiment of the present application.

[0124] Fig. 13B yes Figure 7 First partial schematic diagram of the CC section.

[0125] in, Fig. 13BOnly the structure of the middle frame 201 including the through hole 2011 is shown, and the rest of the structure is not shown.

[0126] Combination Figure 4 , Figure 7 , Fig.13A and Fig. 13B As shown, in some embodiments, the area of ​​the middle frame 201 adjacent to the rotation axis 130 includes a through hole 2011 , and the through hole 2011 is connected to the first surface 100 a and the second surface 100 b .

[0127] Similarly, the second body 120 includes a second middle frame (not shown in the figure), and the area of ​​the second middle frame adjacent to the hinge 130 includes a second through hole (not shown in the figure), the second through hole is connected between the first surface 100a and the second surface 100b, and the second through hole can be symmetrical with the through hole 2011 relative to the hinge 130. In this way, the through hole 2011 and the second through hole can be used for the flexible circuit board 150 to pass through, so as to achieve the connection between the flexible circuit board 150 and the first body 110 and the second body 120 respectively.

[0128] The first circuit board 202 is arranged on the first surface 100a of the middle frame 201, and is located in the upper half of the middle frame 201, and is adjacent to the through hole 2011. The first circuit board 202 is located on the side of the through hole 2011 away from the rotating shaft 130. The through hole 2011 is opened near the first circuit board 202, so that the flexible circuit board 150 can pass through the through hole 2011 to connect with the first circuit board 202. In this way, the first circuit board 202 is connected to the first end 151 of the flexible circuit board 150, and the second end 152 of the flexible circuit board 150 passes through the through hole 2011 to enter the second surface 100b, and then penetrates into the first surface 100a through the second through hole to connect with the second fuselage 120.

[0129] Based on the layout characteristics of each device in the electronic device 100 , the RF chip module 203 can be arranged in an area of ​​the first circuit board 202 close to the top of the middle frame 201 , so that the RF chip module 203 can be close to the through hole 2011 .

[0130] When the electronic device 100 changes to the folded state, for an inner folding screen mobile phone, the hinge 130 will be exposed to the outside world. The flexible circuit board 150 is arranged across the hinge 130, and the existence of the through hole 2011 in the middle frame 201 for the flexible circuit board 150 to pass through will cause external dust or liquid to enter the body, for example, into the circuit board area, and the dust or liquid will damage the circuit board and other components.

[0131] To this end, in some embodiments, the bracket 204 is disposed in the through hole 2011 and connected to the middle frame 201, and the bracket 204 is used to seal the through hole 2011. In this way, the wire groove 2041 can be formed by being recessed into the bracket 204 by a first depth along the surface of the bracket 204 away from the through hole 2011.

[0132] The electronic device provided in the embodiment of the present application uses the bracket 204 to seal the through hole 2011, which can prevent external dust or liquid from entering the body.

[0133] In some embodiments, when connecting the bracket 204 to the middle frame 201, screws can be used to fix the first fixing portion 20491 and the second fixing portion 20492 of the bracket 204 to the middle frame 201 at the edge of the through hole 2011, respectively, to achieve fixation of the bracket 204 to the first body 110 and ensure that the bracket 204 seals the through hole 2011.

[0134] The electronic device 100 provided in the embodiment of the present application is applied in the folding screen mobile phone scenario, the first body 110 and the second body 120 are respectively arranged on both sides of the rotating shaft 130, the middle frame 201 of the first body 110 includes a through hole 2011, and the through hole 2011 is adjacent to the rotating shaft 130; the first circuit board 202 is located on the side of the through hole 2011 away from the rotating shaft 130, and the radio frequency chip module 203 is arranged on the first circuit board 202; the first end 151 of the flexible circuit board 150 is connected to the first circuit board 202, and the second end 152 extends through the through hole 2011 to the second body 120 and is connected to the second body 120. The bracket 204 is arranged in the through hole 2011 to seal the through hole 2011, so that the bracket 204 is adjacent to the first circuit board 202. Then, when laying the RF connection line 205, the RF connection line 205 is routed in the wire groove 2041 on the bracket 204, that is, routed outside the board to the position almost closest to the RF chip module 203. After that, the RF connection line 205 is routed in the area of ​​the first circuit board 202 close to the RF chip module 203, which can reduce the routing distance of the RF connection line 205 on the first circuit board 202 and ensure that the layout area occupied by the routing line is minimized on the first circuit board 202. In addition, the RF connection line 205 can be connected to the area adjacent to the RF chip module 203, which can not only reduce the electromagnetic interference of the first circuit board 202 to the RF connection line 205 and avoid signal damage, but also reduce the layout area occupied by the first circuit board 202, so that the first circuit board 202 has more layout area for arranging other functional devices. At the same time, the RF connection line 205 can be fixed by the bracket 204 to reduce the number of hardware arranged on the first circuit board 202, which can not only further reduce the layout area occupied by the first circuit board 202, but also reduce costs.

[0135] See again Figure 4 , Figure 6, Figure 7 and Figure 8 In some embodiments, the first body 110 may further include: a second circuit board 206 and a battery compartment 207, both of which are arranged on the first surface 100a of the middle frame 201. The second circuit board 206 may be a secondary circuit board of the electronic device 100, and is used to connect to the antenna on the middle frame 201 to collect signals. The battery compartment 207 is used to install batteries.

[0136] The second circuit board 206 is arranged on a side of the first circuit board 202 away from the RF chip module 203 along the axial direction of the rotating shaft 130, and the second circuit board 206 and the first circuit board 202 are respectively arranged on both sides of the battery compartment 207 along the axial direction of the rotating shaft 130. The battery compartment 207 is located between the first circuit board 202 and the second circuit board 206, so that both the first circuit board 202 and the second circuit board 206 can be connected to the battery in the battery compartment 207. Exemplarily, the first circuit board 202 is located in the upper area of ​​the middle frame 201, the battery compartment 207 is located in the middle area of ​​the middle frame 201, and the second circuit board 206 is located in the lower area of ​​the middle frame 201.

[0137] The second circuit board 206 includes a connection socket, which can be connected to the antenna set in the area of ​​the middle frame 201 corresponding to the second circuit board 206. One end of the RF connection line 205 for receiving signals is buckled on the connection socket of the second circuit board 206 to achieve the connection between the RF connection line 205 and the second circuit board 206. In this way, one end of the RF connection line 205 for receiving signals is connected to the second circuit board 206 to receive the signal collected by the antenna; the other end of the RF connection line 205 passes through the wire groove 2041 and is connected to the first area 2021 of the first circuit board 202 to transmit the signal to the RF chip module 203 connected to the first area 2021.

[0138] In some embodiments, the RF connection line 205 may include multiple lines to transmit different signals. Exemplarily, the RF connection line 205 may include a first RF connection line 2051 and a second RF connection line 2052, wherein the first RF connection line 2051 is used to transmit one of the RF signal and the communication signal, and the second RF connection line 2052 is used to transmit the other of the RF signal and the communication signal.

[0139] When the electronic device 100 adopts a signal transmission method in which the bottom collects signals and the upper part processes signals, one end of the first RF connection line 2051 and the second RF connection line 2052 for receiving signals are both connected to the second circuit board 206 .

[0140] Since there is a certain distance between the second circuit board 206 and the bracket 204, in order to facilitate wiring, the second circuit board 206 is combined again. Figure 6 and Figure 7, a second wire groove 201a can be opened in the area of ​​the middle frame 201 adjacent to the second circuit board 206, and the second wire groove 201a is connected to the wire groove 2041. Then, the other ends of the first RF connection line 2051 and the second RF connection line 2052 first pass through the second wire groove 201a, then enter the wire groove 2041, and finally route to the first circuit board 202 and connect to the first area 2021.

[0141] In the electronic device 100 provided in the embodiment of the present application, the other end of the RF connection line 205 (the first RF connection line 2051 and the second RF connection line 2052) can be routed directly from the second wire groove 201a on the middle frame 201 to the wire groove 2041 on the bracket 204, and when extending from the wire groove 2041 to the first circuit board 202, it only needs to turn in one direction to extend to the first area 2021 of the first circuit board 202 and connect to the RF chip module 203. Figure 2B In the existing routing method shown, the cable 40 is routed from the groove 11 of the middle frame 10, and needs to first turn in one direction (T1 position) to route to the main circuit board 20, and then turn in another direction (T2 position) on the main circuit board 20, and then extend to the area of ​​the RF processor 30. It can be seen that the existing routing method requires the cable 40 to turn in two directions before it can transmit signals with the RF processor 30, while in the embodiment of the present application, the RF connection line 205 only needs to turn in one direction to transmit signals with the RF chip module 203. The RF connection line 205 turns less once, which can reduce stress and improve the performance of the RF connection line 205. In addition, most of the routing distances of the first RF connection line 2051 and the second RF connection line 2052 are routed outside the board, which can reduce the routing distances of the first RF connection line 2051 and the second RF connection line 2052 on each circuit board, and avoid occupying too much layout space of each circuit board.

[0142] Fig.14 It is a schematic diagram of the assembly structure of the bracket 204 and the radio frequency connecting line 205 provided in the embodiment of the present application.

[0143] like Fig.14 As shown, in some embodiments, when the electronic device 100 uses two RF connection lines 205 to achieve signal transmission, a first RF connection line 2051 and a second RF connection line 2052 are laid in the wire groove 2041 of the bracket 204. The first RF connection line 2051 and the second RF connection line 2052 can be laid in the wire groove 2041 in a stacked form. Exemplarily, the first RF connection line 2051 is located at the bottom of the wire groove 2041, and the second RF connection line 2052 is located above the first RF connection line 2051. The depth of the wire groove 2041 is greater than or equal to the total height of the first RF connection line 2051 and the second RF connection line 2052.

[0144] When the wiring reaches the baffle 2045, the baffle 2045 can be used to change the wiring direction of the second RF connection line 2052, and the guide plate 2046 can be used to change the wiring direction of the first RF connection line 2051. At the same time, the baffle 2045 and the guide plate 2046 can prevent the first RF connection line 2051 and the second RF connection line 2052 from being routed outside the area where the bracket 204 is located, so that the first RF connection line 2051 and the second RF connection line 2052 can be routed according to the designed routing path.

[0145] Fig.15 This is a second structural schematic diagram of the first body 110 provided in an embodiment of the present application.

[0146] like Fig.15 As shown, in some embodiments, an antenna may also be provided in the area of ​​the middle frame 201 corresponding to the first circuit board 202, so that the first circuit board 202 can collect signals and transmit them to the RF chip module 203 connected to the first circuit board 202 through the RF connection line 205, so as to realize intra-board signal transmission. In this way, one end of the RF connection line 205 is connected to the second area 2022 of the first circuit board 202, and the other end of the RF connection line 205 passes through the wire slot 2041 and is connected to the first area 2021 of the first circuit board 202.

[0147] When transmitting signals within the board, the first circuit board 202 includes a second area 2022, and the second area 2022 includes a connection seat, which can be connected to an antenna arranged in an area of ​​the middle frame 201 corresponding to the first circuit board 202. The second area 2022 refers to an area of ​​the first circuit board 202 away from the RF chip module 203.

[0148] Thus, the first circuit board 202 includes two connection sockets. Exemplarily, one end of the second RF connection line 2052 for receiving signals is buckled in the connection socket in the second area 2022 to be connected to the first circuit board 202 in the second area 2022; the other end of the second RF connection line 2052 passes through the wire slot 2041 and is buckled in the connection socket in the first area 2021 to be connected to the first circuit board 202 in the first area 2021.

[0149] One end of the first RF connecting line 2051 for receiving signals is buckled in the connecting socket of the second circuit board 206 to be connected to the second circuit board 206; the other end passes through the second wire groove 201a and the wire groove 2041 in sequence and is buckled in the connecting socket of the first area 2021 to be connected to the first circuit board 202 in the first area 2021.

[0150] It should be noted that in the embodiment of the present application, one of the two RF connecting lines can be used for intra-board signal transmission, and the other can be used for bottom acquisition signal and upper processing signal transmission; both can also be used for intra-board signal transmission; both can also be used for bottom acquisition signal and upper processing signal transmission, which is not limited here.

[0151] Fig.16 This is a third structural schematic diagram of the bracket 204 provided in the embodiment of the present application.

[0152] Fig.17 This is the fourth structural schematic diagram of the bracket 204 provided in the embodiment of the present application.

[0153] Fig.18 This is the fifth structural schematic diagram of the bracket 204 provided in the embodiment of the present application.

[0154] Combination Fig.15 , Fig.16 , Fig.17 and Fig.18 As shown, in some embodiments, the side plate 2043 of the bracket 204 includes an opening 20434. The opening 20434 is connected to the wire slot 2041, and the opening 20434 faces the second area 2022 of the first circuit board 202. In this way, the wire slot 2041 includes two entrances (204a and 204c), the entrance 204c facing the second area 2022 is used for routing the second RF connection line 2052, and the entrance 204a facing the second circuit board 206 is used for routing the first RF connection line 2051.

[0155] One end of the second RF connection line 2052 is connected to the second area 2022 of the first circuit board 202, and is used to receive the signal collected by the corresponding antenna of the second area 2022; the other end of the second RF connection line 2052 is routed from the entrance 204c through the opening 20434 to the wire slot 2041, and is routed to the first circuit board 202 in the wire slot 2041, and is connected to the first circuit board 202 in the first area 2021 to realize intra-board signal transmission. In this way, the connection between the second RF connection line 2052 and the RF chip module 203 can be realized, and the second RF connection line 2052 transmits the signal to the RF chip module 203 for processing. The routing path of the first RF connection line 2051 refers to the contents described in the aforementioned embodiment, and is not repeated here.

[0156] See again Fig. 13BIn some embodiments, when the bracket 204 is used to seal the through hole 2011, the middle frame 201 may include a first portion 2012 located at a side of the through hole 2011 away from the rotation axis 130 and a second portion 2013 located at a side of the through hole 2011 close to the rotation axis 130. The first portion 2012 includes a first side surface 2014 facing the through hole 2011, and the second portion 2013 includes a second side surface 2015 facing the through hole 2011. The first side surface 2014 and the second side surface 2015 are both perpendicular to the first surface 100a, the first side surface 2014 and the second side surface 2015 face each other, and there is a height difference between the first side surface 2014 and the second side surface 2015.

[0157] The first side surface 2014 is provided with a sealing portion 2016, and the sealing portion 2016 extends along the first side surface 2014 to the second side surface 2015. The bracket 204 is embedded in the through hole 2011 from the first surface 100a of the middle frame 201. To facilitate the sealing effect between the bracket 204 and the middle frame 201, the sealing portion 2016 can be located on a side of the first side surface 2014 adjacent to the second surface 100b.

[0158] There is a gap L2 between the sealing portion 2016 and the second side surface 2015 to form a first channel for the flexible circuit board 150 to pass through.

[0159] Fig.19 yes Figure 7 Second partial schematic diagram of the CC section.

[0160] like Fig.19 As shown, in some embodiments, the first end 151 of the flexible circuit board 150 is connected to the first circuit board 202 , and the second end 152 of the flexible circuit board 150 extends along the sealing portion 2016 and passes through the first channel to the second body 120 .

[0161] The sealing part 2016 is attached to the flexible circuit board 150 through the adhesive layer 2017. The adhesive layer 2017 is used to fix the flexible circuit board 150 and the sealing part 2016, so that the flexible circuit board 150 can also play the role of sealing the through hole 2011.

[0162] Combination Figure 8 , Fig.12 , Fig. 13B and Fig.19 As shown, in some embodiments, the bracket 204 may include a first contact surface 20471 facing the sealing portion 2016, a second contact surface 20472 facing the second side surface 2015, and a third contact surface 20473 located at both ends of the first contact surface 20471 along the routing direction D0.

[0163] Exemplarily, the first contact surface 20471 can be formed by the surfaces of the main bracket 2042 and the support plate 2044 facing the sealing portion 2016; the second contact surface 20472 can be formed by the surface of the main bracket 2042 away from the through hole 2011 along the routing direction D0 perpendicular to the routing direction D0; the third contact surface 20473 can be formed by the two end surfaces of the main bracket 2042 along the routing direction D0.

[0164] The first contact surface 20471 may be perpendicular to the third contact surface 20473, the first contact surface 20471 may be perpendicular to the second contact surface 20472, the second contact surface 20472 may be perpendicular to the third contact surface 20473, and the two third contact surfaces 20473 are parallel. The first contact surface 20471, the second contact surface 20472 and the two third contact surfaces 20473 in the bracket 204 are used to cooperate with the middle frame 201 to seal the through hole 2011.

[0165] Correspondingly, the middle frame 201 may include two third side surfaces 2018 (combined with the first side surface 2014 and the second side surface 2015) along the routing direction D0. Fig.13A ). The first third side surface 2018 is used to connect one end of the first side surface 2014 and one end of the second side surface 2015, and the second third side surface 2018 is used to connect the other end of the first side surface 2014 and the other end of the second side surface 2015. The first third side surface 2018 is opposite to the second third side surface 2018. In this way, the four side surfaces are connected in sequence to form a through hole 2011.

[0166] The first contact surface 20471 abuts against the area of ​​the flexible circuit board 150 for bonding with the sealing portion 2016 , the second contact surface 20472 abuts against the second side surface 2015 , and the two third contact surfaces 20473 abut against the two third side surfaces 2018 in a one-to-one correspondence to seal the through hole 2011 .

[0167] In some embodiments, to improve the sealing effect, the bracket 204 may include a receiving opening 2048, and the receiving opening 2048 is continuously formed on the first contact surface 20471, the second contact surface 20472 and the third contact surface 20473, so that the receiving opening 2048 can be an annular structure.

[0168] Fig. 20 It is a schematic diagram of the structure of the sealing rib 20481 provided in an embodiment of the present application.

[0169] like Fig. 20 As shown, in some embodiments, the receiving opening 2048 is filled with a sealing rib 20481. The sealing rib 20481 may be an annular structure, and the sealing rib 20481 may be made of a material having elasticity and deformability, such as rubber.

[0170] Fig.21 It is a schematic diagram of the assembly structure of the bracket 204 and the sealing rib 20481 provided in the embodiment of the present application.

[0171] Combination Fig.19 and Fig.21 As shown, in some embodiments, the sealing rib 20481 is embedded in the receiving opening 2048. Since the sealing rib 20481 has a deformable characteristic, the sealing rib 20481 can be deformed according to the structure of the receiving opening 2048 to be closely combined with the receiving opening 2048 to ensure a sealing effect.

[0172] The sealing rib 20481 protrudes from the corresponding contact surface relative to the receiving opening 2048, see Fig.19 The dotted line portion at the middle sealing rib 20481. In this way, when the bracket 204 is installed in the through hole 2011, the sealing rib 20481 abuts against the flexible circuit board 150, and by utilizing the elasticity of the sealing rib 20481, the sealing rib 20481 is flattened by the flexible circuit board 150 and the sealing portion 2016, and generates elastic deformation to apply pressure to the flexible circuit board 150; similarly, the sealing rib 20481 abuts against the second side surface 2015 and the third side surface 2018 of the middle frame 201, and the sealing rib 20481 is flattened by the various side surfaces of the middle frame 201, and generates elastic deformation to apply pressure to the second side surface 2015 and the third side surface 2018, so as to improve the sealing effect of the through hole 2011.

[0173] The electronic device 100 provided in the embodiment of the present application can use the bracket 204 to not only seal the through hole 2011 for the flexible circuit board 150 to pass through, but also provide routing for the radio frequency connection line 205. No specific device for routing the radio frequency connection line 205 is required in the electronic device 100, and the multi-functions are integrated in one device, which can reduce the internal space occupied by the electronic device 100.

[0174] In some embodiments, the number of RF connection lines 205 may be multiple, for example, three, four, etc. When the lines are routed in the wire slot 2041, the depth of the wire slot 2041 is greater than or equal to the total height of the stack of the RF connection lines 205, so as to constrain the position of the RF connection lines 205 and prevent the routing path of the RF connection lines 205 from being bent or offset.

[0175] In some embodiments, the RF connection line 205 may also be laid in an area of ​​the middle frame 201 where no buttons are set. For example, if both the main and auxiliary circuit boards are set in the second body 120, since the middle frame of the second body 120 does not need to be provided with buttons, a wire groove may be opened on the middle frame of the second body 120 for routing the RF connection line 205.

[0176] It should be noted that those skilled in the art will readily come up with other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope of the present application is indicated by the following claims.

[0177] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: include: A rotating shaft (130); A first body (110) and a second body (120) are arranged on both sides of the rotating shaft (130); The first body (110) comprises: A first circuit board (202), wherein a gap is provided between the first circuit board (202) and the rotating shaft (130); as well as, The connecting line (205) is arranged between the first circuit board (202) and the rotating shaft (130), and at least partially extends along the axial direction of the rotating shaft (130).

2. The electronic device according to claim 1, characterized in that: The first body (110) further includes: A bracket (204) is arranged between the first circuit board (202) and the rotating shaft (130); The bracket (204) comprises a wire groove (2041), the wiring direction of the wire groove (2041) is parallel to the rotating shaft (130), and the wire groove (2041) is used for routing the connecting wire (205).

3. The electronic device according to claim 2, characterized in that: The bracket (204) comprises a main bracket (2042), a side plate (2043) and a support plate (2044), the main bracket (2042) is adjacent to the rotating shaft (130), the side plate (2043) is adjacent to the first circuit board (202), and there is a gap between the main bracket (2042) and the side plate (2043); The main bracket (2042) is connected to the side plate (2043) via the support plate (2044) to form the wire trough (2041).

4. The electronic device according to claim 3, characterized in that: The support (204) further includes: a baffle (2045); The baffle (2045) is located at the outlet end of the wire trough (2041) and is connected to the support plate (2044), and the baffle (2045) is perpendicular to the routing direction; The baffle (2045) is used to limit the position of the connecting line (205).

5. The electronic device according to claim 4, characterized in that: There is a first distance L1 between the baffle plate (2045) and the side plate (2043), so that an outlet is formed between the baffle plate (2045) and the side plate (2043), and the outlet faces the first circuit board (202).

6. The electronic device according to claim 5, characterized in that: The support (204) further includes: a guide plate (2046); The guide plate (2046) is located at the connection between the support plate (2044) and the baffle plate (2045), and forms a slope facing the side plate (2043); The guide plate (2046) is used to guide the connecting line (205).

7. The electronic device according to claim 3, characterized in that: The main bracket (2042) comprises a first side wall (20421) facing the side plate (2043), the first side wall (20421) comprises at least one first wire clamp portion (20422) arranged at intervals, and the first wire clamp portion (20422) protrudes in the direction of the side plate (2043); The side plate (2043) comprises a second side wall (20431) facing the first side wall (20421), the second side wall (20431) comprises at least one second wire clamp portion (20432) arranged at intervals, and the second wire clamp portion (20432) protrudes in the direction of the first side wall (20421); The first wire clamp portion (20422) and the second wire clamp portion (20432) are used to fix the connecting wire (205).

8. The electronic device according to claim 7, characterized in that: The main support (2042) comprises a first chamfer (20423), wherein the first chamfer (20423) is located at an edge of the first side wall (20421) away from the support plate (2044); The side plate (2043) includes a second chamfer (20433), and the second chamfer (20433) is located at an edge of the second side wall (20431) away from the support plate (2044).

9. The electronic device according to claim 2, characterized in that: Also includes: A flexible circuit board (150); The first body (110) further comprises: a middle frame (201), a region of the middle frame (201) adjacent to the rotating shaft (130) comprising a through hole (2011), and the first circuit board (202) is arranged on the middle frame (201) and adjacent to the through hole (2011); The first end (151) of the flexible circuit board (150) is connected to the first circuit board (202), and the second end (152) of the flexible circuit board (150) passes through the through hole (2011) to be connected to the second body (120); The bracket (204) is arranged in the through hole (2011) and connected to the middle frame (201), and the bracket (204) is used to seal the through hole (2011).

10. The electronic device according to claim 9, characterized in that: The middle frame (201) comprises a first portion (2012) located on a side of the through hole (2011) away from the rotating shaft (130) and a second portion (2013) located on a side of the through hole (2011) adjacent to the rotating shaft (130); the first portion (2012) comprises a first side surface (2014) facing the through hole (2011), and the second portion (2013) comprises a second side surface (2015) facing the through hole (2011); The first side surface (2014) is provided with a sealing portion (2016), and the sealing portion (2016) extends along the first side surface (2014) toward the second side surface (2015); There is a gap between the sealing portion (2016) and the second side surface (2015), which is used to form a first channel for the flexible circuit board (150) to pass through; The second end (152) of the flexible circuit board (150) extends along the sealing portion (2016) and passes through the first channel to the second body (120).

11. The electronic device according to claim 10, characterized in that: The sealing portion (2016) is bonded to the flexible circuit board (150) via an adhesive layer (2017).

12. The electronic device according to claim 11, characterized in that: The bracket (204) comprises a first contact surface (20471) facing the sealing portion (2016), a second contact surface (20472) facing the second side surface (2015), and third contact surfaces (20473) located at both ends of the first contact surface (20471) along the routing direction; The middle frame (201) comprises two third side surfaces (2018) along the routing direction and used to connect the first side surface (2014) and the second side surface (2015); The first contact surface (20471) abuts against the area of ​​the flexible circuit board (150) for bonding with the sealing portion (2016), the second contact surface (20472) abuts against the second side surface (2015), and the third contact surface (20473) abuts against the third side surface (2018) to seal the through hole (2011).

13. The electronic device according to claim 12, characterized in that: The bracket (204) comprises a receiving opening (2048), wherein the receiving opening (2048) is continuously formed on the first contact surface (20471), the second contact surface (20472), and the third contact surface (20473); A sealing rib (20481) is filled in the accommodating opening (2048), and the sealing rib (20481) respectively abuts against the flexible circuit board (150), and the second side surface (2015) and the third side surface (2018) of the middle frame (201) to seal the through hole (2011).

14. The electronic device according to claim 9, characterized in that: The bracket (204) comprises a first fixing portion (20491) and a second fixing portion (20492); The first fixing portion (20491) and the second fixing portion (20492) are located at two ends of the bracket (204) along the routing direction; The first fixing portion (20491) and the second fixing portion (20492) are used to connect to the middle frame (201).

15. The electronic device according to claim 3, characterized in that: The first body (110) further includes: a second circuit board (206) and a radio frequency chip module (203); The radio frequency chip module (203) is arranged on the first circuit board (202) and connected to the first circuit board (202); The second circuit board (206) is arranged on a side of the first circuit board (202) away from the radio frequency chip module (203) along the axial direction of the rotating shaft (130).

16. The electronic device according to claim 15, characterized in that: The connecting line (205) is a radio frequency connecting line; One end of the radio frequency connection line is connected to the second circuit board (206), and the other end of the radio frequency connection line passes through the wire slot (2041) and extends to the first area (2021) of the first circuit board (202) to be connected to the first circuit board (202); The first area (2021) refers to an area of ​​the first circuit board (202) adjacent to the radio frequency chip module (203).

17. The electronic device according to claim 15, characterized in that: The connecting line (205) is a radio frequency connecting line; One end of the radio frequency connection line is connected to the second area (2022) of the first circuit board (202), and the other end of the radio frequency connection line passes through the wire slot (2041) and is connected to the first area (2021) of the first circuit board (202); The first area (2021) refers to an area of ​​the first circuit board (202) adjacent to the radio frequency chip module (203), and the second area (2022) refers to an area of ​​the first circuit board (202) away from the radio frequency chip module (203).

18. The electronic device according to claim 17, characterized in that: The side plate (2043) includes an opening (20434); The opening (20434) is in communication with the wire slot (2041), and the opening (20434) faces the second area (2022) of the first circuit board (202); The other end of the radio frequency connection line passes through the opening (20434) and the wire slot (2041) and is connected to the first area (2021) of the first circuit board (202).

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