Workpiece conveying device and workpiece inspection device

Abstract

Provided are a workpiece inspection device capable of avoiding an increase in size even when a large inspector is used, and a workpiece transport device capable of improving the degree of freedom in design and layout of the workpiece inspection device. A workpiece conveying device (10) is provided with: a feeding mechanism (15) for feeding a tray (26) on which a workpiece (30) before inspection is disposed; a first transfer unit (11) that transfers the conveyed tray (26) in a first direction (21) and causes the workpiece (30) to face the first inspection area (17a); a second transfer unit (12) that transfers the tray (26) in a second direction (22) orthogonal to the first direction (21) and causes the workpiece (30) to face a second inspection area (17b); a third transfer unit (13) that transfers the tray (26) on which the inspected workpiece (30) is disposed in a third direction (23) orthogonal to the second direction (22); and a transport-out mechanism (16) that transports out the tray (26).

Description

Technical Field

[0001] The present invention relates to an in-tray workpiece conveying device and a workpiece inspecting device for inspecting workpieces arranged on a pallet. Background Art

[0002] Inspection of chips cut from a semiconductor package or wafer is generally classified into the following two types. The first is an in-tray method in which inspection is performed with workpieces arranged on a tray on which the workpieces to be inspected are arranged (e.g., Patent Document 1). The second is a pick-and-place method in which workpieces are taken out of a tray, placed on an inspection table for inspection, and then put back on the tray after inspection (e.g., Patent Document 2).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-295814

[0006] Patent Document 2: Japanese Patent Application Publication No. 2003-114251 Summary of the invention

[0007] Problems to be solved by the invention

[0008] By the way, in the pick-and-place method, it is necessary to carry out / carry in the workpiece to be inspected from the pallet. Therefore, it takes a lot of time to carry out the replacement operation, which leads to a problem of reduced production. In contrast, the in-tray method can overcome the disadvantages of the pick-and-place method mentioned above.

[0009] The previously invented in-tray method scans the workpiece by hanging an inspector from an XY stage fixed to the ceiling. However, if the inspector is large and heavy, it is difficult to hang it from the ceiling.

[0010] Therefore, in the case of a large-scale / heavy inspector, it has been studied to place the inspector on an XY stage fixed from the ground. However, in this case, the XY stage is fixed to the ground on the side of the conveyor line of the pallet, and the inspector sweeping directly above the conveyor line is subjected to a large bending moment. To cope with such a bending moment, the support structure of the XY stage fixed to the ground needs to be made strong, and there is an issue that the large-scale workpiece inspection device cannot be avoided. If the workpiece inspection device is large-scale, the conveyor line needs to be designed to be longer accordingly.

[0011] In addition, the in-tray method sets a workpiece inspection area in the middle of the pallet conveying path. In the conventional workpiece conveying device, since the conveying path is linear, there is a problem of great restrictions on the design and layout of the workpiece conveying device.

[0012] The present invention has been made in consideration of such a situation, and an object of the present invention is to provide a workpiece inspection device that can avoid enlargement even when a large inspector is used, and a workpiece conveying device that improves the degree of freedom in design and layout of the workpiece inspection device.

[0013] Means used to solve problems

[0014] In the workpiece conveying device related to the present invention, it is provided with: a carrying-in mechanism for carrying in a pallet on which the workpiece before inspection is arranged; a first conveying unit for conveying the carried-in pallet in a first direction so that the workpiece faces a first inspection area; a second conveying unit for conveying the pallet in a second direction orthogonal to the first direction so that the workpiece faces a second inspection area; a third conveying unit for conveying the pallet on which the workpiece after inspection is arranged in a third direction orthogonal to the second direction; and a carrying-out mechanism for conveying the pallet out.

[0015] Effects of the Invention

[0016] According to the present invention, it is possible to provide a workpiece inspection device that can avoid enlargement even when a large-scale inspection device is used, and a workpiece conveying device that improves the degree of freedom in design and layout of the workpiece inspection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a YX plan view showing the workpiece conveying device according to the first embodiment of the present invention.

[0018] Figure 2 (A) is a YX plan view for explaining the operation of the workpiece conveying device according to the first embodiment. Figure 2 (B) is its Z-X front view. Figure 2 (C) is its Y-Z side view.

[0019] Figure 3 (A) is a YX plan view for explaining the operation of the workpiece conveying device according to the first embodiment. Figure 3 (B) is its Z-X front view. Figure 3 (C) is its Y-Z side view.

[0020] Figure 4 (A) is a YX plan view for explaining the operation of the workpiece conveying device according to the first embodiment. Figure 4 (B) is its Z-X front view. Figure 4 (C) is its Y-Z side view.

[0021] Figure 5 (A) is a YX plan view for explaining the operation of the workpiece conveying device according to the first embodiment. Figure 5(B) is its Z-X front view. Figure 5 (C) is its Y-Z side view.

[0022] Figure 6 (A) is a front view showing a state where the force applied to the bottom surface is released and the tray is separated from the inspection area. Figure 6 (B) is an enlarged view of the periphery of the positioning pin of the pallet.

[0023] Figure 7 (A) is a front view showing a state where a force is applied to the bottom surface of the tray so as to be positioned in the inspection area. Figure 7 (B) is an enlarged view of the periphery of the positioning pin of the pallet.

[0024] Figure 8 This is an XY bottom view of a frame defining the first inspection area and the second inspection area.

[0025] Fig. 9 It is a YX plan view showing a workpiece inspection device according to a second embodiment of the present invention.

[0026] Fig.10 It is a YZ side view which shows the workpiece inspection device according to the second embodiment of the present invention.

[0027] Fig.11 It is a YX plan view showing a workpiece conveying device according to a third embodiment of the present invention.

[0028] Fig.12 (A) is a top perspective view of a multilayer wiring substrate having bumps arranged on the upper surface used as a workpiece of the present embodiment, Fig.12 (B) is a side perspective view of an LSI package in which an LSI chip is mounted on a multilayer wiring substrate. DETAILED DESCRIPTION

[0029] (First embodiment)

[0030] Hereinafter, embodiments of the present invention will be described based on the drawings. Figure 11 is a top view of a workpiece conveying device 10A (10) according to a first embodiment of the present invention. The workpiece conveying device 10A includes: an infeed mechanism 15 for infeeding a pallet 26 on which workpieces 30 before inspection are arranged; a first transfer unit 11 for transferring the infeed pallet 26 in a first direction 21 and directing the pallet 26 on which workpieces 30 are arranged toward a first inspection area 17a; a second transfer unit 12 for transferring the pallet 26 in a second direction 22 orthogonal to the first direction 21 and directing the pallet 26 on which workpieces 30 are arranged toward a second inspection area 17b; a third transfer unit 13 for transferring the pallet 26 on which workpieces 30 after inspection are arranged in a third direction 23 orthogonal to the second direction 22; and an outfeed mechanism 16 for outfeeding the pallet 26.

[0031] Figure 2 (A)~ Figure 5 (A) is a YX plan view for explaining the operation of the workpiece conveying device 10A according to the first embodiment. Figure 2 (B)~ Figure 5 (B) is its Z-X front view. Figure 2 (C)~ Figure 5 (C) is its Y-Z side view.

[0032] The first transfer unit 11 and the third transfer unit 13 have a common structure, and include a conveyor 41 that transfers the tray 26 from one end to the other end, and a carriage 42 that moves the conveyor 41 in the direction of the first inspection area 17a or the second inspection area 17b. The first transfer unit 11 thus configured transfers the tray 26 on which the workpieces 30 before inspection are placed, which are carried in from the carrying mechanism 15, in the first direction 21, and directs the tray 26 on which the workpieces 30 are placed toward the first inspection area 17a. On the other hand, the third transfer unit 13 transfers the tray 26 on which the workpieces 30 after inspection are placed, which are separated from the second inspection area 17b, in the third direction 23 and carries it out.

[0033] The conveyor 41 is formed by arranging carriers made of belts, plastic chains, etc. in two rows. The pallet 26 on which the workpieces 30 are arranged two-dimensionally is supported at both ends by the conveyor 41 and moves.

[0034] The carrying-in mechanism 15 and the carrying-out mechanism 16 have a common structure. The carrying-in mechanism 15 carries the pallet 26 on which the workpieces 30 before inspection are arranged to one end of the first conveying unit 11. The carrying-out mechanism 16 receives the pallet 26 on which the workpieces 30 after inspection are arranged from the third conveying unit 13 and carries it out. In addition, a belt conveyor type is exemplified as the carrying-in mechanism 15 and the carrying-out mechanism 16, but it is not particularly limited and can also be carried out manually.

[0035] The second transfer unit 12 is as follows Figure 5As shown, it has: a first force-applying mechanism 31, which applies force to the bottom surface to move the tray 26 from the first transfer unit 11 to the first inspection area 17a; a moving mechanism 44, which carries the tray 26, from which the force is released, so that it moves from the first inspection area 17a to the second inspection area 17b; and a second force-applying mechanism 32, which applies force to the bottom surface to move the tray 26 from the moving mechanism 44 to the second inspection area 17b. Figure 2 (C)~ Figure 5 As shown in (C), the first urging mechanism 31 and the second urging mechanism 32 synchronize the timing of urging and releasing the corresponding tray 26 .

[0036] The second transfer unit 12 carries the tray 26 and transfers it from the first inspection area 17a to the second inspection area 17b in the second direction 22. In addition, the second transfer unit 12 returns the tray 26 from the second inspection area 17b to the direction opposite to the second direction 22 of the first inspection area 17a when it is empty. A frame 45 is provided on the upper side of the second transfer unit 12 to partition the first inspection area 17a and the second inspection area 17b.

[0037] Figure 6 (A) is a front view showing a state where the force applied to the bottom surface is released and the tray 26 is separated from the inspection area 17 . Figure 6 (B) is an enlarged view of the periphery of the positioning pin 43 of the tray 26. Figure 7 (A) is a front view showing a state where a force is applied to the bottom surface of the tray 26 and the tray 26 is positioned in the inspection area 17 . Figure 7 (B) is an enlarged view of the periphery of the positioning pin 43 of the tray 26.

[0038] The frame 45 is provided with a notch 49 for defining the height position of the tray 26 to be positioned in the first inspection area 17a or the second inspection area 17b. Furthermore, the frame 45 is provided with a plurality of pins 43 for positioning the tray 26.

[0039] Furthermore, the pin 43 comprises: a body portion 46, which is connected to the frame 45 and has a constant outer diameter, and has a side surface abutting against the periphery of the tray 26 to determine its planar position; and a tapered portion 47, which is formed by reducing the outer diameter from the body portion 46 toward the front end, and has a conical surface in sliding contact with the periphery of the tray 26 to guide it toward the inspection area 17.

[0040] Figure 8This is an XY bottom view of the frame 45 that specifies the inspection area 17 (the first inspection area 17a and the second inspection area 17b). In this way, the positioning pins 43 of the tray 26 are arranged so as to surround the outer periphery of the first inspection area 17a and the second inspection area 17b. In addition, the notches 49 that specify the height position of the tray 26 do not need to be evenly arranged on the outer periphery of the inspection area 17 (17a, 17b), and can also be arranged near the positioning pins 43 or integrated with the positioning pins 43.

[0041] Fig. 9 It is a YX plan view showing a workpiece inspection device 50 according to a second embodiment of the present invention. Fig.10 1 is a YZ side view thereof. Thus, the workpiece inspection device 50 comprises: a first inspector 51 for inspecting the workpiece 30 in the first inspection area 17a and a second inspector 52 for inspecting the workpiece 30 in the second inspection area 17b; a box 55 for accommodating the first inspector 51 and the second inspector 52 at the same arrangement interval as the first inspection area 17a and the second inspection area 17b; a table 56 for displacing the box 55 at the same interval as the arrangement interval of the workpiece 30 in the tray 26; and a support body 57 for supporting the table 56 and being fixed relative to the ground 58.

[0042] Furthermore, in the workpiece inspection device 50, the support 59 for fixing the support body 57 to the ground 58 is asymmetrically arranged on the first transfer unit 11 side and the third transfer unit 13 side by being arranged more on one side of the second transfer unit 12. In addition, the transfer direction of the second transfer unit 12 that reciprocates between the first inspection area 17a and the second inspection area 17b is a direction that is perpendicular to the first transfer unit 11 and the third transfer unit 13. As a result, the support body 57 and the table 56 can be miniaturized and the rigidity can be improved. As a result, it is helpful to prevent the width of the workpiece inspection device 50 that is opposite to the transfer direction (X direction) of the pallet 26 that is carried in / out from being enlarged.

[0043] Here, back Figure 2 to Figure 5 , the operation of the workpiece conveying device 10 and the workpiece inspection device 50 according to the embodiment will be described. Figure 2 As shown, in the first inspection area 17a and the second inspection area 17b, the first inspection device 51 and the second inspection device 52 ( Fig. 9 , Fig.10 ) is displaced at the same pitch as the arrangement interval of the workpiece 30 to inspect the workpiece 30. At this time, the second conveying unit 12 causes the force applying mechanisms 31 and 32 to rise, and applies force to the tray 26 to position it relative to the first inspection area 17a and the second inspection area 17b.

[0044] Then, the tray 26 on which the workpieces 30 before inspection are arranged is carried into one end of the first transfer unit 11 by the carrying mechanism 15. Then, the first transfer unit 11 transfers the tray 26 from one end to the other end by the conveyor 41. At the other end of the first transfer unit 11, the tray 26 is in a standby state until the inspection of the workpieces 30 arranged in the tray 26 in the inspection area 17 is completed.

[0045] Then, if Figure 3 As shown in the figure, when the inspection of the tray 26 in the inspection area 17 is completed (or before it is completed), the third transfer unit 13 is moved in the direction opposite to the third direction 23, so that the empty conveyor 41 is located below the second inspection area 17b. Then, the force applying mechanisms 31 and 32 are lowered to release the force, so that the tray 26 is separated from the inspection area 17 (17a, 17b). As a result, the tray 26 in the first inspection area 17a is placed on the moving mechanism 44, and the tray 26 in the second inspection area 17b is placed on the conveyor 41 of the third transfer unit 13.

[0046] Then, if Figure 4 As shown, the third transfer unit 13 is moved in the third direction 23 so as to be close to the carrying-out mechanism 16. At the same time, the moving mechanism 44 moves the pallet 26 carried thereon from directly below the first inspection area 17a toward the second direction 22 to directly below the second inspection area 17b. Furthermore, at the same time, the first transfer unit 11 is moved in the first direction 21 so that the conveyor 41 carrying the pallet 26 on which the workpiece 30 to be inspected is arranged is located below the first inspection area 17a. These three actions are performed simultaneously, from Figure 3 Instantly switch to Figure 4 status.

[0047] Then, if Figure 5 As shown, in the second conveying section 12, the force applying mechanisms 31 and 32 are raised to apply force to the tray 26 and position it relative to the first inspection area 17a and the second inspection area 17b. Figure 6 , Figure 7 ) to accurately and stably position the height and plane positions of the tray 26 relative to the first inspection area 17a and the second inspection area 17b, respectively.

[0048] Next, the first transfer unit 11 is moved in the direction opposite to the first direction 21, so that the empty conveyor 41 is brought close to the carrying mechanism 15. Furthermore, at the same time, in the second transfer unit 12, the moving mechanism 44 is moved from the second inspection area 17b to the second direction 22 (see FIG. Figure 4) and returns to the position of the first inspection area 17a. The third transfer unit 13 operates the conveyor 41 to transfer and transport the pallet 26 with the inspected workpiece 30 separated from the second inspection area 17b in the third direction 23. These three actions are performed simultaneously. Figure 5 Instantly switch to Figure 2 In this way, the Figure 2 to Figure 5 In the operation described above, the pallet 26 on which the workpieces 30 before inspection are placed is sequentially carried in, inspected, and carried out.

[0049] Fig.11 This is a YX plan view showing a workpiece conveying device 10B (10) according to a third embodiment of the present invention. The difference from the workpiece conveying device 10A according to the first embodiment is that the third direction 23 in which the third conveying unit 13 conveys the tray 26 is the opposite direction.

[0050] In this way, the workpiece conveying device 10 (10A, 10B) can diversify the conveying path of the tray 26 by making it curved or inverted. This can improve the degree of freedom in design and layout of the workpiece inspection device 50 compared to the case where the conveying path is a straight line.

[0051] Fig.12 (A) is a perspective view of a multilayer wiring board 38 having bumps 37 arranged on the upper surface thereof, which is used as the workpiece 30 of the present embodiment. Figure 5 (B) is a side perspective view of an LSI package in which an LSI chip 36 is mounted on the multilayer wiring substrate 38. In the LSI package, electrodes of the multilayer wiring substrate 38 and electrodes of the LSI chip 36 are electrically connected via bumps 37. Furthermore, the LSI package is encapsulated with resin for deterioration and heat countermeasures. Such a method of electrical connection using spherical bumps 37 is called flip chip mounting.

[0052] In order to make the electrodes of the multilayer wiring substrate 38 and the electrodes of the LSI chip 36 directly overlap each other, the flip chip mounting needs to align the height of the bump 37. This is because if there is a deviation in the height of the bump 37, a poor connection will occur. In addition, it is also required to detect the position of the bump, the diameter of the bump, the abnormal shape of other bumps, and foreign matter on the substrate. In addition, the workpiece 30 is exemplified as an LSI package in the embodiment, but it is not limited to this, and it is suitable as long as it can be placed on the tray 26.

[0053] In this case, the first inspection device 51 measures the relative height of the multilayer wiring board 38. The second inspection device 52 is a measuring / inspecting device that measures various sizes of the bumps 37 arranged on the upper surface of the multilayer wiring board 38 or detects foreign matter. Specifically, it is a surface shape measuring machine and an image measuring machine using light, or a measuring / inspecting machine having the functions of both and capable of measuring the convex and concave information of the surface.

[0054] In addition, generally, the dispersion of the top surface height of the multilayer wiring substrate 38 is much greater than the dispersion of the size of the bump 37. Therefore, the first inspector 51 is set to have a larger measuring range than the second inspector 52. Therefore, an adjustment mechanism (not shown) is provided to adjust the height direction of the frame 45 so that the second inspection area 17b does not deviate from the measuring range of the second inspector 52. In addition, the inspectors 51 and 52 are not particularly limited, and any type, whether contact or non-contact, can be appropriately adopted as long as they inspect the workpiece 30.

[0055] Description of symbols

[0056] 10 (10A, 10B) ... workpiece conveying device; 11 ... first conveying unit; 12 ... second conveying unit; 13 ... third conveying unit; 15 ... carrying-in mechanism; 16 ... carrying-out mechanism; 17 ... inspection area; 17a ... first inspection area; 17b ... second inspection area; 21 ... first direction; 22 ... second direction; 23 ... third direction; 26 ... tray; 30 ... workpiece; 31 ... first force applying mechanism; 32 ... second Force-applying mechanism; 36…LSI chip; 37…bump; 38…multilayer wiring board; 41…conveyor; 42…trolley; 43…positioning pin; 44…moving mechanism; 45…frame; 46…body; 47…cone; 49…notch; 50…workpiece inspection device; 51…first inspector; 52…second inspector; 55…housing; 56…table; 57…support; 58…ground; 59…pillar.

Claims

1. A workpiece conveying device, characterized in that: have: A transporting mechanism transports in a pallet with workpieces to be inspected; A first conveying unit conveys the transported pallet in a first direction so that the workpiece faces a first inspection area; A second conveying unit conveys the tray in a second direction orthogonal to the first direction so that the workpiece faces a second inspection area; a third conveying unit that conveys the pallet on which the inspected workpiece is disposed in a third direction that is orthogonal to the second direction; and The transporting mechanism transports the above pallet out.

2. The workpiece conveying device according to claim 1, characterized in that: At least one of the first transfer unit and the third transfer unit includes a conveyor that transfers the tray from one end to the other end, and a carriage that moves the conveyor toward the first inspection area or the second inspection area.

3. The workpiece conveying device according to claim 1 or 2, characterized in that: The second transfer unit includes: A first force applying mechanism applies force to the bottom surface to move the tray from the first transfer section to the first inspection area; a moving mechanism for placing the pallet after the force is released so as to move it from the first inspection area to the second inspection area; and The second force applying mechanism applies force to the bottom surface to move the tray from the moving mechanism to the second inspection area.

4. The workpiece conveying device according to claim 3, characterized in that: The first urging mechanism and the second urging mechanism synchronize their respective urging and releasing timings on the corresponding trays.

5. A workpiece inspection device, characterized in that: have: The workpiece conveying device according to claim 1 or 2; a first inspector for inspecting the workpiece in the first inspection area and a second inspector for inspecting the workpiece in the second inspection area; A box body that accommodates the first inspection device and the second inspection device at the same arrangement interval as the first inspection area and the second inspection area; a stage for displacing the box at the same interval as the arrangement interval of the workpieces of the pallet; and The support body supports the table and is fixed relative to the ground.

6. The workpiece inspection device according to claim 5, characterized in that: The support pillars for fixing the support body to the ground are provided in greater numbers on one side of the second transfer unit, and are thus asymmetrically provided on the first transfer unit side and the third transfer unit side.

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