Device bonding apparatus using laser beam

Abstract

The present invention relates to an apparatus for bonding a device using a laser beam, and more particularly, to an apparatus for bonding a device on a tape using a laser beam. Disclosed is a device bonding apparatus (100) for bonding a plurality of devices (10) on a tape (20), comprising: one or more reciprocating parts (110) on which the tape (20) is placed and which are provided so as to be capable of reciprocating along a movement path (L) formed between a first region (A1) and a second region (A2) that are set in advance; a tape conveyance unit (120) that picks up the tape (20) and loads the tape (20) on the reciprocating unit (110) located in the first region (A1), or picks up the tape (20) placed on the reciprocating unit (110) located in the first region (A1) and loads the tape (20) to the outside; and a laser beam irradiation unit (130) that irradiates a laser beam (LB) on the upper surface of the tape (20) placed on the reciprocating unit (110) located in the second region (A2) in order to bond the plurality of devices (10) to the tape (20).

Description

Technical Field

[0001] The present invention relates to a device bonding apparatus using a laser beam, and more particularly, to a device bonding apparatus for bonding devices on a tape using a laser beam. Background Art

[0002] Generally, semiconductor chips are manufactured through the following processes: a manufacturing process of forming a circuit including electronic devices on a semiconductor substrate, an EDS process of inspecting the electrical characteristics of the semiconductor devices manufactured in the manufacturing process, and a packaging and assembly process of encapsulating the semiconductor devices that have completed the manufacturing process and the EDS inspection with epoxy resin and making them independent.

[0003] The packaging assembly process is to separate the substrate into flip chip units using sawing or laser cutting, then mount the cut flip chips on a substrate called a strip or boat for bonding, and then perform molding and cutting processes.

[0004] At this time, when bonding the flip chip to a substrate such as a tape, fast and accurate processing of the tape on which the flip chip is placed is very important for improving the productivity of the entire system.

[0005] Furthermore, in the case of flip chip bonding using a laser beam instead of a reflow method, layout design for handling the tape and the flow of the tape are very important factors in order to improve the productivity and accuracy of the system. Summary of the invention

[0006] Problem to be solved

[0007] An object of the present invention is to provide a device bonding apparatus using a laser beam in view of the above importance, which can load the tape, bond the devices, and unload the tape while linearly moving the tape for bonding the devices back and forth.

[0008] Means of solving the problem

[0009] The present invention is proposed to achieve the purpose as stated above, and discloses a device bonding apparatus 100 for bonding multiple devices 10 on a tape 20, comprising: one or more reciprocating sections 110, on which the tape 20 is placed, and which are configured to be able to move back and forth along a moving line L formed between a predetermined first area A1 and a second area A2; a tape conveying section 120, which picks up the tape 20 to load it on the reciprocating section 110 located in the first area A1, or picks up the tape 20 placed on the reciprocating section 110 located in the first area A1 to load it to the outside; and a laser beam irradiation section 130, which irradiates a laser beam LB on the tape 20 placed on the reciprocating section 110 located in the second area A2 in order to bond the multiple devices 10 to the tape 20.

[0010] The moving lines L are arranged in plurality and may be arranged in parallel with each other.

[0011] The reciprocating units 110 may be disposed corresponding to the plurality of moving routes L, respectively.

[0012] The first area A1 may correspond to an end area of ​​the moving line L.

[0013] The second area A2 may correspond to another end area of ​​the moving line L, and the other end area is on the opposite side of the one end area.

[0014] The tape conveying unit 120 may be provided to be movable along an arrangement direction of the plurality of movement lines L on an upper side of the first area A1.

[0015] The laser beam irradiation unit 130 may be provided to be movable along the arrangement direction of the plurality of movement lines L on the upper side of the second area A2.

[0016] On the moving line L, a temperature control area A3 may be set between the first area A1 and the second area A2 , and the temperature control area A3 is used to change the temperature of the strip 20 placed on the reciprocating portion 110 .

[0017] The reciprocating portion 110 may include temperature control portions 114 and 116 for controlling the temperature of the strip 20 placed thereon.

[0018] The second area A2 may be a bonding area where laser bonding is performed by the laser beam irradiation part 130 .

[0019] The temperature control parts 114 and 116 may maintain the temperature of the ribbon 20 placed on the reciprocating part 110 in the second area A2 at a preset process temperature.

[0020] Effects of the Invention

[0021] The device bonding apparatus of the present invention performs loading of the strip, bonding of the device and unloading of the strip while linearly moving the strip for bonding the device, thereby improving the productivity of bonding the device using a laser beam.

[0022] In addition, the device bonding apparatus of the present invention adopts a method of preheating the strip before bonding the device using a laser beam, and then cooling the strip after bonding the device using a laser beam. The steps of preheating, heating, and cooling are performed sequentially during the process. Therefore, it has the advantage of minimizing the thermal deformation of the strip in the bonded device.

[0023] In addition, the device bonding apparatus of the present invention is adapted to a bonding method using a laser beam instead of a reflow method, thereby having the advantages of minimizing the footprint of the entire equipment and maximizing the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 1 is a conceptual diagram showing a device bonding system including a device bonding apparatus according to an embodiment of the present invention.

[0025] Figure 2 It is shown Figure 1 Conceptual diagram of the device bonding apparatus.

[0026] Figure 3a to Figure 3b It is shown in Figure 1 A plan view and a side view of a process of bonding using a laser beam performed by a device bonding apparatus.

[0027] Figure 4 It is shown in Figure 3b A side view of the structure of a device bonded on a ribbon.

[0028] Figure 5 It is shown in Figure 2 A graph showing the temperature change of the ribbon over time in a device bonding apparatus.

[0029] Figures 6a to 7b It is shown Figure 2 A stereoscopic view, a side view, a plan view and an exploded stereoscopic view of a portion of the structure of a device bonding device. DETAILED DESCRIPTION

[0030] Hereinafter, the device bonding system of the present invention will be described below with reference to the accompanying drawings.

[0031] like Figure 1 As shown, the device bonding system of the present invention includes: a first conveying tool 60, which picks up a plurality of devices 10 loaded on a wafer ring 30 for conveying; a flipping section 40, which receives the device 10 from the first conveying tool 60 and flips the device 10 upside down; a second conveying tool 70, which picks up the device 10 flipped in the flipping section 40 and conveys it to a strip 20 on which a plurality of devices 10 are placed; a flux impregnation section 50, which is used to impregnate the bottom surface of the device 10 picked up by the second conveying tool 70 with flux; and a device bonding apparatus 100, which bonds the device 10 placed on the strip 20 to the strip 20 using a laser beam.

[0032] Here, the device 10 as a semiconductor device may adopt various structures; as an example, it may be a WL-CSP device that is packaged into an independent device through a sawing process after performing a packaging process from wafer level or a device that undergoes a Fan-out WLP process.

[0033] Bumps may be formed on the device 10 through a bump forming process to serve as connection terminals connected to the terminals on the strip 20 .

[0034] That is, the device 10 may be a flip chip on which bumps are formed and connected to the terminals of the tape 20 through the bumps.

[0035] Here, the tape strip 20 is used as a substrate for bonding (mounting) the device 10. In order to mount the device 10 using flux, various structures can be adopted as long as the structure can mount thin devices 10 such as lead frames, tape-shaped parts, etc.

[0036] The device bonding system performs a process of picking up the device 10 , a process of flipping, a process of dipping the solder flux, and a process of bonding the device 10 on the tape 20 on the wafer ring 30 .

[0037] The first transport tool 60 is a structure for picking up a plurality of devices 10 mounted on the wafer ring 30 and transporting them, and various structures may be adopted.

[0038] Here, the wafer ring 30 is a structure to which a wafer that has completed a sawing process is attached, and may adopt various structures, and may be a loading component for loading a plurality of devices 10 .

[0039] The wafer rings 30 may be sequentially loaded into the loading position by a separate wafer ring loading portion (not shown).

[0040] The first transport tool 60 may have a plurality of pick-up tools T for picking up a plurality of devices 10 .

[0041] The pick-up tool T may have a suction cup for vacuum adsorbing the upper surface of the device 10 for picking up.

[0042] The first transport tool 60 can use the plurality of pick-up tools T to pick up a plurality of devices 10 at one time or can pick up a plurality of devices 10 in sequence.

[0043] The turning unit 40 is a structure for receiving the device 10 from the first transport tool 60 and turning it upside down, and various structures may be adopted.

[0044] The first transport tool 60 can transport the picked-up devices 10 to be placed on the turning unit 40 .

[0045] The turning portion 40 may also have a plurality of device placement areas for receiving a plurality of devices 10 from the first conveying tool 60 at one time.

[0046] The turning unit 40 may rotate to turn upside down the plurality of devices 10 received from the first conveying tool 60 .

[0047] The turning portion 40 can turn the device 10 so that the bumps formed on the top face downward.

[0048] As a result, the bumps of device 10 may be disposed on the bottom surface of device 10 that is flipped over.

[0049] The second transport tool 70 may have a plurality of pick-up tools T to pick up a plurality of devices 10 .

[0050] In addition, the second transport tool 70 picks up the device 10 turned over by the turning unit 40 and transports it to the tape 20 on which a plurality of devices 10 are placed.

[0051] The structure of the second conveying tool 70 is the same as or similar to the structure of the first conveying tool 60 described above.

[0052] The flux impregnation part 50 is a structure for impregnating the bottom surface of the device 10 picked up by the second conveyance tool 70 with flux, and various structures may be adopted.

[0053] The flux impregnation part 50 may be disposed on a transport path of the second transport tool 70 between the tape 20 on which the devices 10 are placed and the flip part 40 , and may be loaded with flux to impregnate the bottom surface of the device 10 before the device 10 is placed on the tape 20 .

[0054] Here, the soldering flux impregnating the bottom surface of the device 10 is used as a substance for mounting the device 10, such as removing the oxide film, reducing the tension of the solder interface and preventing reoxidation before mounting the device 10. Various substances can be used according to the type of device 10 and the mounting method.

[0055] Here, since it takes a relatively longer time to dip the device 10 in the flux dipping section 50 compared to other structures, the device 10 is dipped in a state of being picked up by the second conveyance tool 70 .

[0056] The device 10 that has completed the impregnation may be placed on the tape 20 that has been loaded to the placement position by the second transport tool 70 .

[0057] The tape strip 20 on which the devices 10 are placed may be transferred to the device bonding apparatus 100 so that the devices 10 placed on the tape strip 20 may be bonded to the tape strip 20 using a laser beam.

[0058] The device bonding apparatus 100 is a device bonding apparatus 100 for bonding a plurality of devices 10 to a tape 20 , and may be a device bonding apparatus that uses a laser beam as a heating source for bonding.

[0059] As an example, the device bonding apparatus 100 may include: one or more reciprocating sections 110, which place the tape 20 and can move back and forth along a moving line L formed between a predetermined first area A1 and a second area A2; a tape conveying section 120, which picks up the tape 20 to load it on the reciprocating section 110 located in the first area A1, or picks up the tape 20 placed on the reciprocating section 110 located in the first area A1 and unloads it to the outside; and a laser beam irradiation section 130, which irradiates the laser beam LB on the tape 20 placed on the reciprocating section 110 located in the second area A2 in order to bond the multiple devices 10 to the tape 20.

[0060] The reciprocating portion 110 is a structure where the strip 20 is placed and can reciprocate along a movement path L formed between a first area A1 and a second area A2 that are predetermined in advance. Various structures may be adopted, and more than one reciprocating portion 110 may be configured.

[0061] A placement surface for placing the belt strip 20 may be arranged on the upper side of the reciprocating portion 110 .

[0062] The moving line L is a path for the reciprocating unit 110 to reciprocate, and may be formed linearly.

[0063] Guide lines may be provided along two side surfaces of the moving line L to guide the reciprocating movement of the reciprocating portion 110 .

[0064] A plurality of the moving lines L may be configured.

[0065] In addition, if Figure 1 As shown, the plurality of moving lines L may be arranged parallel to each other.

[0066] At this time, a plurality of the reciprocating units 110 may be configured, and each reciprocating unit 110 corresponds to the plurality of movement routes L in a 1:1 relationship.

[0067] The first area A1 and the second area A2 may be set on a moving line L, ie, a moving path of the reciprocating unit 110 .

[0068] At this time, the first area A1 may be defined as an area where the tape 20 to be subjected to the bonding process is loaded into the shuttle portion 110 and the tape 20 subjected to the bonding process is unloaded from the shuttle portion 110 .

[0069] The second area A2 is an area for performing a bonding process, where a laser beam is irradiated to the strip 20 placed on the round-trip portion 110 to bond the device 10 to the strip 20, and can be defined as a bonding area where laser bonding is performed by the laser beam irradiation unit 130 described later.

[0070] The first area A1 may correspond to one end of the moving line L.

[0071] At this time, the second area A2 may correspond to the other end area of ​​the moving line L, and the other end area is on the opposite side of the one end area.

[0072] That is, the second area A2 may be set at the other end area on the opposite side of the first area A1.

[0073] On the other hand, the reciprocating portion 110 may have temperature control portions 114 and 116 for controlling the temperature of the strip 20 placed thereon.

[0074] More specifically, the reciprocating portion 110 may have a vacuum adsorption plate 112 and temperature control portions 114 and 116. The vacuum adsorption plate 112 vacuum-adsorbs the strip 20 placed thereon for fixation. The temperature control portions 114 and 116 are combined with the lower side of the vacuum adsorption plate 112 to control the temperature of the strip 20 placed on the reciprocating portion 110.

[0075] The vacuum adsorption plate 112 is a vacuum suction cup that vacuum adsorbs and fixes the strip 20 placed thereon, and may adopt various structures.

[0076] The vacuum adsorption plate 112 may have vacuum ports V1 and V2 on the side thereof, so as to form a vacuum through a vacuum channel 112 a disposed inside the vacuum adsorption plate 112 .

[0077] The adsorption holes are arranged on the vacuum adsorption plate 112 and connected to the vacuum channel 112 a , and the strip 20 on the reciprocating portion 110 can be adsorbed and fixed through the adsorption holes.

[0078] The tape 20 can be stably held on the reciprocating portion 110 through the adsorption holes, and the process can be stably performed even if the reciprocating portion 110 moves.

[0079] In addition, one or more heating tubes 112 b may be disposed inside the vacuum adsorption plate 112 for heat transfer of the vacuum adsorption plate.

[0080] In addition, a plurality of position guide pins 112 c may be disposed on the vacuum adsorption plate 112 , and the position guide pins 112 c are coupled to the edge of the placement area to guide the position of the placed tape strip 20 .

[0081] The belt strip 20 is placed inside the guide pin 112c at the position, thereby allowing the belt strip 20 to be located in the correct position.

[0082] The temperature control parts 114 and 116 are structures combined with the lower side of the vacuum adsorption plate 112 to control the temperature of the strip 20 placed on the reciprocating part 110, and various structures can be adopted.

[0083] As an example, the temperature control parts 114 and 116 may include a temperature regulating plate 114 and a cooling fan 116 . The temperature regulating plate 114 is provided with one or more thermoelectric devices 118 . The cooling fan 116 is provided at the lower side of the temperature regulating plate 114 .

[0084] The thermoelectric device 118 (Peltier device) is a semiconductor device that absorbs and dissipates heat by the flow of electric current, and may have heat dissipation fins 114 b for dissipating heat on the lower side of the temperature adjustment plate 114 .

[0085] The thermoelectric device 118 may be configured in plurality, and may have a pair of terminals 118 a for current input / output.

[0086] In addition, a recessed portion 114 a may be formed on the upper surface of the temperature adjustment plate 114 for inserting and disposing the thermoelectric device 118 .

[0087] The temperature adjustment plate 114 may be bolted to the vacuum adsorption plate 112 .

[0088] In addition, a temperature sensor 114 c for measuring temperature may be inserted into the temperature adjustment plate 114 .

[0089] like Figure 6a to Figure 6b As shown, the temperature regulating plate 114 can be installed on the bottom plate 118 at the lower side in a state of being lifted upward by the support shaft 115 .

[0090] The cooling fan 116 may be installed in a space formed between the temperature adjustment plate 114 and the bottom plate 118 by the support shaft 115 .

[0091] The cooling fan 116 is also fixedly coupled to the bottom plate 118 and can be supported by the bottom plate 118 .

[0092] The tape conveying unit 120 is used as a transmission module to pick up the tape 20 to load it into the reciprocating unit 110 located in the first area A1, or to pick up the tape 20 placed in the reciprocating unit 110 located in the first area A1 to unload it to the outside, and various structures may be adopted.

[0093] At this time, the device bonding system may include a tape supply unit 140 and a tape discharge unit 150, wherein the tape supply unit 140 is used to supply the tape 20 to be bonded to the device bonding apparatus, and the tape discharge unit 150 is used to discharge the bonded tape 20 to the outside.

[0094] The tape conveying section 120 picks up the tape 20 to be bonded from the tape supply section 140 to place the tape 20 on the reciprocating section 110 located in the first area A1, and picks up the already bonded tape 20 placed on the reciprocating section 110 located in the first area A1 and places it on the tape discharge section 150.

[0095] In addition, more than one strip conveying unit 120 may be provided.

[0096] The tape conveying unit 120 may be provided to be movable along the arrangement direction of the plurality of moving lines L on the upper side of the first area A1.

[0097] The strip conveying unit 120 is disposed to be movable along the arrangement direction of the plurality of moving lines L on the upper side of the first area A1 , thereby being able to take into account all loading and unloading of the strips 20 of the plurality of moving lines L.

[0098] More specifically, the tape transport unit 120 may include: a tape pickup head 122 for picking up the tape 20; a pickup head guide 124 for guiding the linear movement of the tape pickup head 122; and a pickup head connecting unit 126 for combining the tape pickup head 122 with the pickup head guide 124.

[0099] Reference Figure 2 When the moving line L is parallel to the X-axis direction on the plane and multiple moving lines L are arranged in parallel along the Y-axis direction, the strip picking head 122 can perform linear reciprocating movement along the configuration direction of the moving line L, that is, the Y-axis direction.

[0100] If the tape 20 to be bonded is placed on the reciprocating portion 110 located in the first area A1 by the tape picking head 122, the reciprocating portion 110 absorbs and fixes the tape 20 placed thereon, and then moves along the corresponding moving line L to be located in the second area A2.

[0101] The second area A2 may be set as a bonding area where laser bonding is performed by a laser beam irradiation unit 130 described later.

[0102] The laser beam irradiation unit 130 irradiates the laser beam LB onto the tape 20 placed on the reciprocating portion 110 located in the second area A2 in order to bond the plurality of devices 10 to the tape 20 , and various structures may be adopted.

[0103] like Figures 3a to 4 As shown, the laser beam LB is an electromagnetic wave with a preset wavelength, and can be a laser beam that is irradiated vertically to the strip 20 by a homogenizer to uniformly distribute energy.

[0104] like Figure 4 As shown, if the laser beam LB is irradiated onto the device 10 placed on the strip 20, the energy of the laser beam LB is converted into vibration energy, and then the vibration energy becomes a heating source for bonding the bumps 12 of the device 10, and the bonding process can be performed.

[0105] The spot size, power and wavelength of the laser beam LB can be changed in various ways depending on the type of the device 10 to be bonded and the size of the ribbon 20 .

[0106] More than one laser beam irradiation unit 130 may be provided.

[0107] The laser beam irradiation unit 130 is provided to be movable along the arrangement direction of the plurality of movement lines L on the upper side of the second area A2.

[0108] The laser beam irradiation unit 130 is disposed to be movable along the arrangement direction of the plurality of moving lines L above the second area A2 , so that the laser bonding of the plurality of moving lines L can be taken into consideration.

[0109] More specifically, the laser beam irradiation unit 130 may include: a laser beam irradiation head 132 for irradiating the laser beam LB; a laser beam irradiation head guide 134 for guiding the linear movement of the laser beam irradiation head 132; and a laser beam irradiation head connection unit 136 for combining the laser beam irradiation head 132 with the laser beam irradiation head guide 134.

[0110] Reference Figure 2 When the moving line L is formed in a plane parallel to the X-axis direction and a plurality of the moving lines L are arranged in parallel along the Y-axis direction, the laser beam irradiation head 132 can perform linear reciprocating movement along the arrangement direction of the moving line L, i.e., the Y-axis direction.

[0111] If the bonding of the strip 20 placed on the reciprocating portion 110 located in the second area A2 is completed by the laser beam irradiation head 132, the reciprocating portion 110 will move back to the first area A1 along the corresponding moving line L in a state of adsorbing and fixing the strip 20 placed thereon, and then be located in the first area A1, and then be unloaded by the above-mentioned strip conveying portion 120, and can be discharged to the strip discharge portion 150.

[0112] On the other hand, a temperature control area A3 may be set between the first area A1 and the second area A2 on the moving line L to change the temperature of the strip 20 placed on the reciprocating portion 110 .

[0113] The temperature control area A3 may be set between the first area A1 and the second area A2 on the moving route L, and the temperature in the temperature control area A3 may be controlled by the temperature control parts 114 and 116 of the reciprocating part 110 .

[0114] Reference Figure 5 , illustrating the temperature changes of the respective areas A1, A2, and A3 caused by the temperature control units 114 and 116 of the reciprocating unit 110.

[0115] The reciprocating section 110 is located in the first area A1. During the period when the strip 20 to be bonded is loaded thereon and then moved to the second area A2 and passes through the temperature control area A3 (t1~t2, t12), the temperature control sections 114 and 116 can preheat the strip 20 placed on the reciprocating section 110 to a predetermined temperature (for example, to K3).

[0116] If the reciprocating portion 110 is located in the second area A2 after preheating during the time period of the third area A3, the temperature control portions 114 and 116 may maintain the temperature of the strip 20 placed on the reciprocating portion 110 in the second area A2 at a predetermined process temperature (for example, maintaining K3) for a predetermined time (t2~t3, t23).

[0117] After completing the laser bonding in the second area A2, the reciprocating portion 110 passes through the temperature control area A3 during the time period (t3~t4, t34) in order to move back to the first area A1. The temperature control portions 114 and 116 can cool the strip 20 placed on the reciprocating portion 110 to a predetermined temperature (for example, to K1).

[0118] That is, loading and unloading of the ribbon 20 in the first area A1 may be performed at a relatively low temperature, and laser bonding in the second area A2 may be performed at a relatively high temperature.

[0119] To this end, the temperature control parts 114 and 116 may control the temperature of the strip 20 to preheat the strip 20 when moving from the first area A1 to the second area A2, and conversely cool the strip 20 when moving from the second area A2 to the first area A1.

[0120] Accordingly, laser bonding is performed at an optimal process temperature, and loading and unloading of the ribbon 20 can be performed at a low temperature.

[0121] The above is only a part of the relevant description of the preferred embodiments that can be implemented by the present invention. Therefore, it is well known that the scope of the present invention is not limited to the above-mentioned embodiments for interpretation. The technical ideas of the present invention described above and its fundamental technical ideas are all included in the scope of the present invention.

Claims

1. A device bonding apparatus (100) for bonding a plurality of devices (10) on a strip (20), characterized in that: include: One or more reciprocating parts (110) are provided with a belt (20) and are arranged to be capable of reciprocating movement along a moving line (L) formed between a first area (A1) and a second area (A2) which are set in advance; A strip conveying section (120) picks up the strip (20) to load it to the reciprocating section (110) located in the first area (A1), or picks up the strip (20) placed in the reciprocating section (110) located in the first area (A1) to load it to the outside; The laser beam irradiation unit (130) irradiates a laser beam (LB) onto the tape (20) placed on the reciprocating portion (110) located in the second area (A2) in order to bond the plurality of devices (10) to the tape (20).

2. The device bonding apparatus (100) according to claim 1, characterized in that: Arrange a plurality of said moving lines (L) in parallel with each other; The reciprocating parts (110) are respectively arranged corresponding to the plurality of moving lines (L).

3. The device bonding apparatus (100) according to claim 2, characterized in that: The first area (A1) corresponds to an end area of ​​the moving line (L); The second area (A2) corresponds to the other end area of ​​the moving line (L), and the other end area is on the opposite side of the one end area.

4. The device bonding apparatus (100) according to claim 3, characterized in that: The strip conveying unit (120) is arranged to be movable on the upper side of the first area (A1) along the arrangement direction of the plurality of moving lines (L).

5. The device bonding apparatus (100) according to claim 3, characterized in that: The laser beam irradiation unit (130) is arranged to be movable along the arrangement direction of the plurality of movement lines (L) on the upper side of the second area (A2).

6. The device bonding apparatus (100) according to claim 3, characterized in that: On the moving line (L), a temperature control area (A3) is set between the first area (A1) and the second area (A2), and the temperature control area (A3) is used to change the temperature of the strip (20) placed on the reciprocating portion (110); The reciprocating portion (110) has a temperature control portion (114, 116) for controlling the temperature of the strip (20) placed thereon.

7. The device bonding apparatus (100) according to claim 6, characterized in that: The second area (A2) is a bonding area where laser bonding is performed by the laser beam irradiation unit (130); The temperature control section (114, 116) maintains the temperature of the strip (20) placed on the reciprocating section (110) in the second area (A2) at a preset process temperature.

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