Method for packaging metal tube with embedded PIN metal electrode
Through the metal tube packaging method with embedded PIN metal electrodes, combined with overall heating, laser welding and ultraviolet curing glue, the problems of high stress and short service life in metal connections are solved, and the connection strength and stability of the metal and glass interface are improved.
Patent Information
- Application Number
- CN202310728730.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-19
- Publication Date
- 2024-12-20
AI Technical Summary
In the existing metal connection technology, direct welding leads to problems of high stress and short service life, as well as insufficient stability of metal and glass interface connection.
The metal tube packaging method with embedded PIN metal electrodes is adopted, and the connection strength and stability of the metal and glass interface are enhanced by combining integral heating, laser welding and ultraviolet curing glue.
It effectively reduces stress, extends the service life of the workpiece, and improves the connection quality and stability of metal tubes and PIN metal electrodes.
Smart Images

Figure CN119159231A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a metal connection technology, in particular to a metal connection via a glass medium. Background Art
[0002] Existing metal connection technology usually works in a direct welding manner, that is, the heat generated during high-temperature heating is used to heat the metal so that the tightly fitting metals are connected together after melting and cooling. For example, the Chinese invention patent with the announcement number CN104185532A discloses a "method for connecting metal parts", which completes the connection of two low-melting-point metal surfaces by using a special melting inhibition composition. This welding method that directly heats the metal to increase the temperature has defects. Due to the large stress difference of some metals, when this type of metal is directly welded and connected, there are problems of high stress and short service life. During overall heating welding, greater requirements are placed on the size of the heating device. This part of the factor leads to an increase in the production cost of the workpiece. The metal also undergoes structural changes due to the temperature difference at different positions, which ultimately affects the quality of metal processing.
[0003] In addition, for the connection of metal and glass interfaces, the existing technologies can be divided into laser heating and integral heating. However, both technologies achieve the purpose of connection by heating and melting the glass material. For metal interfaces, grooves are generally etched or left untreated, and the stress that the workpiece can withstand is limited. Summary of the invention
[0004] In order to overcome the defects of the prior art such as large stress in metal interface connection leading to short service life of workpieces, and to increase the stability of glass-metal interface connection, the present invention provides a metal tube packaging method with embedded PIN metal electrodes, which uses a carbon dioxide laser as a welding device and low-refractive index glass as a connecting medium, and completes the processing and packaging of the metal workpiece through the combined effects of overall heating of the workpiece, laser welding and ultraviolet light curing adhesive.
[0005] The technical solution adopted by the present invention to solve the technical problem is: a metal tube packaging method with an embedded PIN metal electrode, comprising firstly completing the welding of the first layer of glass by heating the entire interface, then welding the glass material to the fixed interface by laser welding, and finally completing the final fixation by using ultraviolet light curing glue. The entire workpiece includes the innermost PIN metal electrode, the glass medium, and the outer metal tube.
[0006] In the above-mentioned metal tube packaging method with embedded PIN metal electrodes, the parts that need to be heated as a whole are the inner wall of the metal tube and the nano-glass particles. The nano-glass particles melt at high temperature and connect with the inner wall of the metal tube heated at high temperature to form a stable structure.
[0007] In the above-mentioned metal tube packaging method with embedded PIN metal electrode, the welding adopts a carbon dioxide laser and a quartz glass optical fiber, focusing the laser to the contact point between the optical fiber and the glass layer that has been connected on the metal tube, so that the optical fiber melts on the above-mentioned glass layer and connects, and the glass layer gradually becomes thicker until it is connected to the PIN metal electrode inside.
[0008] In the above-mentioned metal tube packaging method with embedded PIN metal electrodes, the welding material can be replaced with nano glass particles, so that the small particles melt at the interface and merge with the already connected glass layer until the glass layer and the inner PIN metal electrode are connected.
[0009] In the above-mentioned metal tube packaging method with embedded PIN metal electrodes, the metal tube is a hollow circular tube, and small metal protrusions can be made on the inner wall to increase the contact area of the metal-glass interface, thereby increasing the connection strength of the workpiece.
[0010] In the above-mentioned metal tube packaging method with embedded PIN metal electrode, the UV curing glue should be applied to each connection position to fill the gap, enhance the stability of the structure, and be cured by UV light.
[0011] In the above-mentioned metal tube packaging method with embedded PIN metal electrodes, the UV curing adhesive can be omitted on workpieces with restrictions on the materials used, so as to reduce the irritating gas generated by the curing adhesive or other substances that hinder production.
[0012] The beneficial effect of the present invention is that the present invention adopts the combined action of overall heating of the workpiece, laser welding and ultraviolet light curing adhesive to connect the metal interface, effectively eliminating the defects of high stress and short service life existing in the direct welding and other methods in the traditional metal connection method, and at the same time can ensure the strength and stability of the workpiece connection, so that the connection quality of the metal tube and the PIN metal electrode is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The present invention is further described below in conjunction with the accompanying drawings
[0014] Figure 1 Schematic diagram of the present invention
[0015] Figure 2 Schematic diagram after omitting the UV curing adhesive
[0016] In the figure, 1. PIN metal electrode, 2. Metal tube, 3. Protrusions on the metal tube wall, 4. Glass medium, 5. Optical fiber, 6. Laser machine focus point, 7. UV light curing glue DETAILED DESCRIPTION
[0017] [Example 1]
[0018] The metal tube package with embedded PIN metal electrode includes PIN metal electrode 1 and metal tube 2. The two metal workpieces are nested inside and outside, and glass medium 4 and UV curing glue 7 are filled in the middle. There are protrusions 3 on the side wall of metal tube 2 to increase the contact area and increase the connection strength with glass. Initially, only a thin layer of glass medium 4 is connected to the side wall of metal tube 2 at high temperature. The focus point 6 of the laser is controlled to always point to the contact position between optical fiber 5 and glass medium 4, so that optical fiber 5 melts on the original glass medium 4. Glass medium 4 is continuously thickened inward due to the addition of optical fiber until it contacts with PIN metal electrode 1 and is welded by carbon dioxide laser. UV curing glue 7 is applied to the contact position of metal tube 2, PIN metal electrode 1 and glass medium 4 to fill the gap caused by welding and increase the strength of the structure.
[0019] [Example 2]
[0020] The UV curing glue 7 can be omitted to reduce the influence of the glue on the process. The connection of the PIN metal electrode 1, the metal tube 2, and the glass medium 4 is completed by two steps of overall heating and laser welding. The laser welding point 6 moves with the movement of the optical fiber 5. If the optical fiber 5 is replaced with nano glass particles, the operation steps will not change.
Claims
1. A method for packaging a metal tube with an embedded PIN metal electrode, comprising connecting a PIN metal electrode (1) and a metal tube (2) using a glass medium (4), wherein the metal tube (2) has a protrusion (3), and wherein: The connection between the metal tube (2) and the glass medium (4) is initially completed by using an overall heating method, and then the quartz glass optical fiber (5) or nano glass particles are melted and connected to the glass medium (4) by using a carbon dioxide laser welding method until the glass medium (4) is thickened and connected to the PIN metal electrode (1), and ultraviolet curing glue (7) is applied to the connection gap for curing to enhance the strength of the connection.
2. The method for packaging a metal tube with an embedded PIN metal electrode according to claim 1, characterized in that: The glass medium (4) is made of quartz glass with a low refractive index, optical fibers (5) or nano glass particles are used as fillers, and the laser welding device is a carbon dioxide laser.
3. The method for packaging a metal tube with an embedded PIN metal electrode according to claim 1 or 2, characterized in that: The connection method used in the above method is divided into three steps, namely overall heating welding, laser welding and ultraviolet light curing.
4. The method for packaging a metal tube with an embedded PIN metal electrode according to claim 3, characterized in that: During overall heating and welding, focus on the connecting parts of the metal interface and the glass interface.
5. The method for packaging a metal tube with an embedded PIN metal electrode according to claim 3, characterized in that: The UV curing step can be omitted when there are requirements for the construction materials of the workpiece.
