Ceramic workpiece micropore machining method

Abstract

The invention relates to the technical field of ceramics, in particular to a ceramic workpiece micropore machining method which comprises the following steps: a machining preparation stage, positioning and marking, pretreatment, selection of a proper laser, fine machining and post-treatment. The method disclosed by the invention has the following three advantages: firstly, high-precision processing of the inner wall of the ceramic can be realized by adopting a laser cutting technology, and high-precision and small-size micro holes and air passages can be processed, so that the performance and the quality of ceramic products are improved; secondly, the machining speed of the laser cutting technology is high and is 1000% higher than that of CNC in the traditional process, the production efficiency of ceramic products is effectively improved, the labor cost is reduced, tools such as a cutter grinding head for machining micropores do not need to be used, and the machining cost is reduced; and thirdly, the processing method provided by the invention can be suitable for ceramic products with different materials, different sizes and different shapes, and has a wide application prospect.

Description

Technical Field

[0001] The invention relates to the technical field of ceramics, and in particular to a method for processing micro-holes in a ceramic workpiece. Background Art

[0002] Ceramics is a material with good performance in high temperature environment and is widely used in aerospace, chemical industry, energy and other fields. Ceramic materials have been widely used in modern industry, especially in high temperature environments, such as aerospace, chemical industry, energy and other fields. With the continuous development of science and technology, the performance and quality requirements of ceramic materials are getting higher and higher. In the production process of ceramic products, the role of micro-airways on the inner wall of ceramics is very important. It can affect the performance and quality of ceramic products by controlling the gas flow inside the ceramics. For example, in ceramic engines, micro-airways can affect combustion efficiency and power output, thereby improving the efficiency of the engine. Therefore, the processing of micro-airways on the inner wall of ceramics is one of the important links in the production of ceramic products, and the design and manufacture of micro-airways on the inner wall of ceramics has become one of the research hotspots.

[0003] The processing of micro air grooves is one of the key steps in the processing of micro air channels on the inner wall of ceramics. Its precision and efficiency directly affect the quality and performance of the entire ceramic product. At present, the research on the processing methods of micro air channels on the inner wall of ceramics has achieved certain results at home and abroad, but there are still many problems to be solved.

[0004] At present, there are mainly the following processing methods for micro airways on the inner wall of ceramics at home and abroad:

[0005] 1. Processing method based on chemical etching

[0006] Chemical etching is a common processing method that can remove a layer of material on the ceramic surface through chemical reaction. However, this method has low processing accuracy and cannot produce high-precision, small-sized micro airways.

[0007] 2. Processing method based on machining

[0008] Machining is a method of removing material using CNC plus electroplated grinding heads. This method has high machining accuracy and can produce high-precision, small-sized micro airways. However, this method has a slow machining speed and high cost. Summary of the invention

[0009] In order to overcome at least one of the following defects of the prior art method for processing micro air channels on the inner wall of ceramics: 1) low processing accuracy; 2) slow speed; 3) high cost, the present invention provides a method for processing micro holes in ceramic workpieces based on high-precision processing technology, which can process micro air channels on the inner wall of ceramics and can also meet the micro hole processing of ceramic workpieces. The method adopts laser cutting technology, and by controlling the accuracy and speed of the laser beam, it realizes precise processing of the inner wall of the ceramic, thereby obtaining micro air slots and micro holes of different shapes, sizes and quantities.

[0010] The purpose of the present invention is achieved by the following technical solution: a method for processing micro-holes in a ceramic workpiece, the method comprising the following steps:

[0011] Step 1: Processing preparation stage

[0012] Before you start, you need to prepare the ceramic sample workpiece to be processed and make sure its surface is clean and free of stains.

[0013] Step 2: Positioning and marking

[0014] Computer-aided design software is used to draw the shape and position of the required microholes, and then a laser system is used for precise marking.

[0015] The choice of the shape and position of the micropores depends on the specific application scenario and design purpose. The shape of the micropores may need to consider the adaptability to subsequent functions, such as whether it is conducive to fluid flow, whether it meets specific optical or mechanical performance requirements, etc. The choice of the micropore position may need to consider the stability of the overall structure, coordination with other components, and whether the best functional effect can be achieved.

[0016] After marking, micropores that match the designed shape will appear on the ceramic sample. These micropores have high precision and clarity, relatively neat edges, and a certain depth and surface features. The specific effects and characteristics will also vary depending on the laser parameters and the properties of the ceramic material.

[0017] Step 3: Preprocessing

[0018] Pre-treat the area of ​​the inner wall of the ceramic sample workpiece that is about to be irradiated to remove contaminants on the surface; proper pre-treatment of the area to be irradiated can improve processing efficiency and quality, including removing contaminants on the surface. After pre-treatment, the surface of the ceramic sample is cleaner and free of interference from contaminants, which is conducive to the smooth progress of subsequent processing and improves processing quality; changes in the surface properties of the ceramic sample can make the ceramic sample easier to process in subsequent processing, improve the bonding force with other materials, improve optical properties, etc.; at the same time, pre-treatment may also improve processing efficiency, because a clean surface and appropriate surface properties can reduce obstacles and problems in the processing process.

[0019] Step 4: Choose the right laser

[0020] According to the processing requirements, select the appropriate type of laser and adjust the power of the laser; the laser can be a ceramic laser. The power also needs to be adjusted appropriately. After repeated experiments, the inventor has found that the optimal laser power is 5W-10W. Too high power can easily lead to overburning, and too low power cannot meet the processing requirements.

[0021] Step 5: Fine processing

[0022] The pulse mode is used to reduce the heat affected zone, and the processing effect is constantly monitored and the parameters are finely adjusted during the process.

[0023] Step 6: Post-processing

[0024] After laser processing, the workpiece should be further cleaned to remove the residue and ensure the cleanliness of the workpiece surface. After laser processing, the workpiece should be further cleaned to remove the residue and check whether polishing or other subsequent processing is necessary.

[0025] Preferably, in step 1, the method for preparing the ceramic sample workpiece is as follows:

[0026] Step 1, ingredients: accurately weigh various raw materials according to the required chemical composition;

[0027] Step 2, mixing: mix the raw materials thoroughly and evenly;

[0028] Step 3, molding: dry pressing molding, grouting molding and other methods can be used, and the corresponding pressure, mold and other parameters can be set according to specific requirements;

[0029] Step 4, drying: Drying under appropriate temperature and humidity conditions to remove moisture;

[0030] Step 5, sintering: Sintering is carried out in a high-temperature furnace, and appropriate process parameters such as sintering temperature, heating rate, and holding time are set to obtain the required ceramic properties and structure.

[0031] The ceramic samples are advanced ceramic materials such as alumina, silicon nitride, and silicon carbide produced by our unit. Their specific raw materials, dosage, and related production parameters will not be repeated here.

[0032] Alumina ceramics have extremely high hardness HRA90-93, excellent electrical insulation (1x10^-14 to 1x10^15Ωcm), medium to ultra-high mechanical strength (360-600MPa), extremely high compressive strength (2250-2700MPa), low thermal conductivity (25-32W / mK), and a maximum operating temperature of 1400℃. Alumina (Al203) has high hardness, good wear resistance, corrosion resistance and high temperature resistance, so it is used in machinery, molds, textiles, stone palace features: oil, chemical industry, refractory materials and electronics and other industries. It is the most widely used and largest production and sales volume of wear-resistant and high-temperature resistant ceramic materials in oxide ceramics. The main alumina ceramic brands in Xiayang, Guangdong are: A-100, A-200, AZ-100.

[0033] Silicon carbide ceramics have an extremely low density (3.20g / cm 3 ), extremely high hardness (94HRA), high thermal conductivity (80W / mK), low linear expansion coefficient (4.5x10-6 / K, 400℃), maximum operating temperature 1500℃, and still maintains good corrosion resistance and wear resistance at high temperatures. Silicon carbide is one of the hardest materials in the fine ceramic family, with a hardness close to that of diamond. It is not only the lightest, but also has excellent thermal conductivity, high temperature chemical stability, low thermal expansion, and is extremely resistant to acids and alkalis. Therefore, silicon carbide is an excellent kiln furniture material, furnace material, and high temperature wear-resistant parts. Silicon carbide's excellent resistance to corrosion, wear and erosion is as excellent as its ability to withstand friction and wear.

[0034] Silicon nitride ceramics have extremely high hardness (92.5HRA), excellent fracture toughness (6-7.0MPam1 / 2), good bending strength (850MPa), and extremely low density (3.20g / cm 3 ), extremely low thermal expansion coefficient (3.2x10-6 / K), maximum operating temperature: 1400℃. Silicon nitride (S3N4) has an excellent combination of material properties. Low density, but extremely hard, and due to its special crystal structure, it has excellent thermal stability and high fracture toughness. It has become the best choice for use under extreme conditions. Therefore, silicon nitride ceramics are the only choice for high-speed and high-precision bearings, and are also important materials for high-temperature molding, high-speed tools, and high-temperature wear-resistant parts.

[0035] Preferably, the second step of positioning marking is specifically as follows: setting parameters according to the graphic data drawn by the CAD software; adjusting the laser power, focal length and other parameters to ensure accurate marking; starting the laser system, marking the ceramic sample according to the preset path and parameters, so that the ceramic sample presents micropores that match the designed shape. There are many manufacturers and product model information of laser systems, and different applications may choose different manufacturers and models, and the most common ones are Han's Laser.

[0036] Preferably, in step three, the pretreatment method is a low-power scanning method or a method of adding specific chemicals to change the surface properties.

[0037] Specifically, the low-power scanning method specifically refers to using a relatively low-power laser energy beam to slowly and carefully scan the surface of the area to be irradiated. Through the low-power energy beam scanning, the combination of the contaminant and the workpiece surface is weakened or destroyed, thereby achieving the purpose of separating and removing the contaminant from the workpiece surface.

[0038] Adding specific chemicals to change the surface properties of the workpiece specifically refers to selecting appropriate chemicals based on processing requirements and material properties and applying them to the surface. The purpose is to cause specific changes in the physical and chemical properties of the surface through the reaction or action of the chemicals with the workpiece surface, which is beneficial to increase the activity of the surface, improve the wettability of the surface, and enhance the compatibility of the surface with subsequent processing processes.

[0039] Specifically, the chemical agent can be hydrofluoric acid (concentration of about 5%-10%) for etching the ceramic surface to increase its roughness and activity; or nitric acid (concentration of about 10%-20%) is selected to treat the ceramic surface to improve its wettability. The reason for selecting these chemical agents is that they can react or act specifically with the surface of the workpiece, thereby changing the physical and chemical properties of the surface layer to achieve the purpose of increasing surface activity, improving wettability, and enhancing compatibility.

[0040] Preferably, in step 4, the laser power is 5-10W, and the laser is a Nd:YAG ceramic laser with a wavelength of 850nm-1064nm. The wavelength in the range of 850nm-1064nm can better interact with the processed material and improve processing efficiency and precision. A wavelength lower than 850nm may result in insufficient energy absorption and poor processing effect; a wavelength exceeding 1064nm may cause excessive energy concentration and cause unnecessary damage to the material. Compared with other lasers, the Nd:YAG ceramic laser has higher stability and reliability, can provide stable laser output, and ensure the consistency of processing quality. At the same time, its application in industrial processing is relatively mature and the technology is relatively complete.

[0041] Preferably, the step 5 of fine processing is specifically as follows: according to the material characteristics and processing accuracy requirements, the pulse frequency and pulse width parameters of the laser are set to minimize the heat affected zone while ensuring the processing quality. In actual operation, it is necessary to find the most suitable specific parameter combination through multiple tests and experience accumulation. In the process, the processing effects of surface quality and dimensional accuracy are closely observed, and the parameters are finely adjusted and optimized in time.

[0042] If the surface quality is not up to standard, three parameters need to be adjusted:

[0043] 1. Laser power: Too high power may cause excessive melting or evaporation of the material, increasing the surface roughness; too low power may lead to insufficient processing and affect the surface quality;

[0044] 2. Pulse width: A wider pulse width may cause more heat accumulation, resulting in worse surface roughness; a narrower pulse width can reduce the heat impact and make the surface smoother;

[0045] 3. Scanning speed: If the scanning speed is too fast, the material will not have enough time to fully react, which may cause an uneven surface; if the speed is too slow, it may generate too much heat.

[0046] If the dimensional accuracy is not high enough, four parameters need to be adjusted:

[0047] 1. Spot diameter: The smaller the spot diameter, the higher the processing accuracy;

[0048] 2. Positioning accuracy: The accuracy of the equipment's positioning system directly affects the accuracy of the processing position;

[0049] 3. Repeat positioning accuracy: The consistency of position during repeated processing has an important impact on accuracy;

[0050] 4. Pulse frequency: Appropriate pulse frequency helps to improve processing accuracy.

[0051] Preferably, in step five, the short pulse width is 1-3 μs, the high pulse frequency is 5-10 kHz, the scanning speed is 80-100 mm / s, and the focal length of the focusing lens is 40-60 mm. Preferably, the focal length of the focusing lens is 50 mm.

[0052] If the heat affected zone is large, possible defects include: material deformation, microstructure change, increased residual stress, etc., which will affect the performance and service life of the material. This solution can control the heat affected zone within a smaller range by setting parameters reasonably. The specific range will be affected by many factors, such as material properties, processing requirements, etc., but it can generally effectively reduce the heat affected zone and improve processing quality.

[0053] Preferably, the post-processing in step six is ​​to use appropriate tools or methods to clean the debris, particles and other substances generated by laser processing remaining on the surface of the workpiece.

[0054] Use appropriate tools or methods, such as using a multi-directional high-pressure air gun to continuously blow the product. First, the product can be cooled down. Second, the debris, particles and other substances remaining on the surface of the workpiece generated by the laser processing can be blown away without affecting the processing of subsequent products.

[0055] Preferably, after the post-processing in step six, step seven is also included, polishing or coating treatment, the polishing treatment is to polish the inner wall of the ceramic sample by mechanical polishing or chemical polishing to improve the surface finish of the workpiece; spray Teflon coating on the inner wall of the ceramic sample to improve the surface strength of the workpiece.

[0056] After post-processing, according to the roughness requirements of the workpiece surface: if a higher degree of smoothness is required, and the workpiece surface has obvious flaws, scratches, etc., polishing is required, and better workpiece surface flatness is required to meet specific functions.

[0057] There are many ways of polishing, the most common ones are mechanical polishing (using tools such as polishing wheels), chemical polishing, etc. The specific requirements depend on factors such as the material, shape, size of the workpiece and the polishing effect to be achieved. Mechanical polishing is generally chosen.

[0058] While ensuring that the workpiece size meets the requirements, coating strengthening treatment is performed on the workpiece surface, such as spraying Teflon coating, which is beneficial to improve the strength of the workpiece surface.

[0059] The present invention uses laser cutting technology to process micro air channels on the inner wall of ceramics. Specifically, a ceramic sample is first prepared and then processed using a laser cutting machine. During the processing, by adjusting and controlling the laser beam, micro air grooves of different shapes, sizes and numbers on the inner wall of the ceramic can be processed. At the same time, in order to verify the feasibility and superiority of this method, we also conducted a comparative experiment with the traditional processing method, and measured and analyzed the processing results.

[0060] Compared with traditional processing methods, the method of the present invention has the advantages of high processing precision, high speed, low cost, etc., can improve the performance and quality of ceramic products, and has broad application prospects.

[0061] The beneficial effects of the present invention are:

[0062] Compared with the traditional processing method, the method of the present invention has the following three advantages:

[0063] 1) High processing precision: The laser cutting technology of the present invention can realize high-precision processing of the inner wall of ceramics, and can process micro holes and airways with high precision (tolerance of ±0.03-0.05mm), small size (micro hole diameter φ0.25-0.5mm), and micro hole depth of 5-10mm, thereby improving the performance and quality of ceramic products;

[0064] 2) Fast speed and low cost: Laser cutting technology has a fast processing speed, which is 1000% faster than the traditional CNC process. It effectively improves the production efficiency of ceramic products and reduces labor costs. In addition, this application does not require the use of tools such as tool grinding heads for processing micro-holes, which is conducive to reducing processing costs.

[0065] 3) Wide application scope: The processing method proposed by the present invention can be applied to ceramic products of different materials, sizes and shapes, and has a wide range of application prospects.

[0066] Specifically, the materials of ceramic products include: alumina, silicon nitride, silicon carbide and other ceramic materials. Size range: from micro ceramic products of a few millimeters, such as micro ceramic breathable disks, to larger ceramic parts of tens of centimeters or even larger, such as large ceramic robotic arms. It is suitable for ceramic products of regular shapes, such as round, rectangular, square, etc.; it may also be suitable for ceramic products of irregular shapes, such as ceramic mechanical parts with special shapes. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Figure 1 Schematic diagram of the micropore structure of the alumina porous ceramic disk of Example 1 of the present invention.

[0068] Figure 2 This is a schematic diagram of the microporous structure of the alumina robotic arm of Example 2 of the present invention.

[0069] Figure 3 Schematic diagram of the micropore structure of the silicon carbide robotic arm of Example 3 of the present invention.

[0070] Figure 4 Schematic diagram of the microporous structure of the silicon carbide triangular bracket of Example 4 of the present invention.

[0071] Figure 5 Schematic diagram of the micro airway structure of the silicon carbide air flotation gauge of Example 5 of the present invention. DETAILED DESCRIPTION

[0072] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the examples, and the contents mentioned in the embodiments are not intended to limit the present invention. In the following examples, if there is no special description of the raw materials or processing techniques, it is indicated that the materials used are conventional commercially available raw materials or conventional processing techniques in the art.

[0073] Example 1

[0074] A method for processing micro-holes in a ceramic workpiece comprises the following steps:

[0075] Step 1: Processing preparation stage: Before starting, you need to prepare the ceramic sample workpiece (alumina porous ceramic disk) to be processed and ensure that its surface is clean and free of stains.

[0076] Step 2: Positioning and marking: Use computer-aided design software to draw the shape and position of the required micropores, and then use the laser system for precise marking. Specifically: set parameters according to the graphic data drawn by the CAD software; adjust the laser power 7W, focal length 50mm and other parameters to ensure accurate marking; start the laser system, and mark the ceramic sample according to the preset path and parameters, so that the ceramic sample will show micropores that match the designed shape.

[0077] Step 3, pretreatment: pretreat the area of ​​the ceramic sample workpiece to be irradiated to remove pollutants on the surface; the pretreatment method is to use a low-power scanning method or add specific chemicals to change the surface properties. The low-power scanning method specifically refers to using a relatively low-power laser energy beam to scan the surface of the area to be irradiated.

[0078] Step 4. Select a suitable laser: Select the appropriate type of laser according to the processing requirements and adjust the power of the laser; the laser power is 7W, and the laser is a Nd:YAG ceramic laser with a wavelength of 957nm.

[0079] Step 5: Fine processing: According to the material characteristics and processing accuracy requirements, the laser pulse frequency and pulse width parameters are set to minimize the heat affected zone. During the process, the surface quality and dimensional accuracy of the processing effect are closely observed, and the parameters are finely adjusted and optimized in time. Specifically, the short pulse width is 2μs, the high pulse frequency is 7kHz, the scanning speed is 90mm / s, and the focal length of the focusing lens is 50mm.

[0080] Specifically, in the step 1, the preparation method of the ceramic sample workpiece is as follows: Step 1, batching: accurately weigh various raw materials according to the required chemical composition; Step 2, mixing: fully and evenly mix the raw materials; Step 3, molding: dry pressing molding, grouting molding and other methods can be used, and the corresponding pressure, mold and other parameters are set according to specific requirements; Step 4, drying: drying under appropriate temperature and humidity conditions to remove moisture; Step 5, sintering: sintering in a high-temperature furnace, setting appropriate sintering temperature, heating rate, insulation time and other process parameters to obtain the required ceramic properties and structure.

[0081] like Figure 1 As shown, under this setting, the micro-hole processing of the alumina ceramic disk was successfully achieved. The diameter of the ceramic disk was D110mm, the micro-hole processing time was 90 minutes, the number of micro-holes on the ceramic disk was 97, the diameter of each micro-hole was about 250μm and the depth was about 100μm. The micro-holes of the alumina porous ceramic disk were free of cracks and the incisions were fine.

[0082] Example 2

[0083] The difference between this embodiment and embodiment 1 is that: in the actual operation, a Nd:YAG ceramic laser with a wavelength of 850nm was used to perform micro-hole processing on the ceramic workpiece of the alumina robotic arm. After repeated experiments, the optimal process conditions were obtained as follows: laser power 5W, short pulse width 3μs, high pulse frequency 10kHz, scanning speed 100mm / s, and focusing lens focal length 40mm.

[0084] like Figure 2 As shown, under this setting, the micro-hole processing of the crack-free alumina robot arm with a diameter of 2000μm and a depth of 3000μm was successfully achieved. The overall dimensions of the ceramic robot arm were 300mm*90mm*5mm, the processing time was 60 minutes, and the number of micro-holes on the alumina robot arm was 42 φ2000μm±0.03mm.

[0085] Example 3

[0086] The difference between this embodiment and embodiment 1 is that: in the actual operation, a Nd:YAG ceramic laser with a wavelength of 850nm was used to perform micro-hole processing on the ceramic workpiece of the silicon carbide robotic arm. After repeated experiments, the optimal process conditions were obtained as follows: laser power 8W, short pulse width 2μs, high pulse frequency 8kHz, scanning speed 100mm / s, and focusing lens focal length 50mm.

[0087] like Figure 3 As shown in the figure, under this setting, the micro-hole processing of the silicon carbide robot arm with a diameter of φ5mm and a depth of 5mm without cracks was successfully achieved. The size of the robot arm is 300mm*80mm*5, the required processing time is 15 minutes, and the number of micro-holes on the silicon carbide ceramic workpiece is 3.

[0088] Example 4

[0089] The difference between this embodiment and embodiment 1 is that: in the actual operation, a Nd:YAG ceramic laser with a wavelength of 1064nm was used to perform micro-hole processing on the ceramic workpiece of the silicon carbide tripod bracket. After repeated experiments, the optimal process conditions were obtained as follows: laser power 10W, short pulse width 1μs, high pulse frequency 5kHz, scanning speed 80mm / s, and focusing lens focal length 60mm.

[0090] like Figure 4 As shown in the figure, under this setting, the micro-hole machining of a crack-free silicon carbide triangular bracket with a diameter of 1000μm and a depth of 5mm was successfully achieved. The size of the silicon carbide triangular bracket is 135mm*135mm*10mm, and the required machining time is 45 minutes. The number of micro-holes on the ceramic workpiece is 21 Φ1.0mm.

[0091] Example 5

[0092] The difference between this embodiment and embodiment 1 is that: in the actual operation, a Nd:YAG ceramic laser with a wavelength of 850nm-1064nm was used to perform micro-airway processing on the ceramic workpiece of the silicon carbide air flotation gauge. After repeated experiments, the optimal process conditions were obtained as follows: laser power 5-10W, short pulse width 1-2μs, high pulse frequency 5-10kHz, scanning speed 80-100mm / s, and focusing lens focal length 50mm.

[0093] Under this setting, the micro airway processing of the crack-free silicon carbide air float gauge with a width of 0.25mm, a length of 6mm, and a depth of 0.1mm was successfully achieved. The size of the ceramic workpiece of the silicon carbide air float gauge is an outer diameter of D12.5mm, an inner diameter of D8mm, and a total length of 38mm. The required processing time is 30 minutes, and the number of micro airways on the ceramic workpiece is 4. At the same time, 4 φ0.3±0.025mm micro holes were achieved, such as Figure 5 shown.

[0094] Example 6

[0095] The difference between this embodiment and embodiments 1-5 is that it also includes step 6, post-processing: further cleaning the workpiece after laser fine processing to remove residues to ensure the cleanliness of the workpiece surface, specifically using appropriate tools or methods to clean the debris, particles and other substances generated by laser processing remaining on the workpiece surface. The rest of the content of this embodiment is the same as that of embodiments 1-5, and will not be repeated here.

[0096] Comparative Example 1

[0097] An example of traditional CNC technology: It takes 16 hours to process 97 equally distributed micro holes of φ0.25±0.03mm, and a diamond electroplating grinding head can only process 3 micro holes at most, and the electroplating layer will fall off. The tool must be replaced in time to continue processing. Otherwise, not only will the micro holes fail to meet the size requirements, but the tool may also burn, resulting in ceramic collapse and cracks. This greatly increases the processing cost and material cost, and the risk of scrap is extremely high.

[0098] Comparative Example 2

[0099] Fiber lasers are suitable for industrial metal cutting, such as metal sheet cutting. Fiber lasers can achieve high-precision and high-speed cutting. TRUMPF fiber lasers can be used to cut various metals ranging from thin plates to medium and thick plates, such as stainless steel and carbon steel. However, they cannot achieve the same effect as metal processing for ceramic processing. Micro-holes of φ0.3±0.03mm cannot be made, and they cannot meet the processing requirements of small-sized micro-holes.

[0100] By comparing the performance of the micro-holes / air channels of the ceramic workpieces prepared in Examples 1-5 and Comparative Examples 1-2, it can be seen that the present invention can meet the processing requirements of small-sized micro-holes / air channels (micro-hole diameter φ0.25-0.5mm) with high processing accuracy (tolerance is ±0.03-0.05mm). The micro-holes / air channels with a micro-hole depth of 5-10mm are beneficial to improving the performance and quality of ceramic products, and the processing speed is fast, which is 1000% higher than that of traditional CNC, and there is no tool wear, which is conducive to promotion and application.

[0101] The above specific embodiments are further explanations of the technical solutions and beneficial effects of the present invention, and are not limitations of the implementation methods. For those skilled in the art, any obvious replacements that do not depart from the concept of the present invention are within the protection scope of the present invention.

Claims

1. A method for processing micro-holes in a ceramic workpiece, characterized in that: The following steps are involved: Step 1: Processing preparation stage Before you start, you need to prepare the ceramic sample workpiece to be processed and make sure its surface is clean and free of stains; Step 2: Positioning and marking The shape and location of the required micro-holes are drawn using computer-aided design software, and then precisely marked using a laser system; Step 3: Preprocessing Pre-treat the area of ​​the ceramic sample workpiece that is about to be irradiated to remove contaminants on the surface; Step 4: Choose the right laser Select the appropriate type of laser according to processing requirements and adjust the laser power; Step 5: Fine processing Pulse mode is used to reduce the heat affected zone, and the processing effect is constantly monitored and the parameters are finely adjusted during the process; Step 6: Post-processing The workpiece that has completed laser fine processing will be further cleaned to remove residues and ensure the cleanliness of the workpiece surface.

2. A method for machining micro-holes in a ceramic workpiece according to claim 1, characterized in that: In the step 1, the method for preparing the ceramic sample workpiece is as follows: Step 1, ingredients: accurately weigh various raw materials according to the required chemical composition; Step 2, mixing: mix the raw materials thoroughly and evenly; Step 3, molding: dry pressing molding, grouting molding and other methods can be used, and the corresponding pressure, mold and other parameters can be set according to specific requirements; Step 4, drying: drying under appropriate temperature and humidity conditions to remove moisture; Step 5, sintering: sintering in a high-temperature furnace, setting appropriate sintering temperature, heating rate, holding time and other process parameters to obtain the required ceramic properties and structure.

3. A ceramic workpiece micro-hole processing method according to claim 1, characterized in that: The second step of positioning marking is specifically as follows: setting parameters according to the graphic data drawn by the CAD software; adjusting the laser power, focal length and other parameters to ensure accurate marking; starting the laser system, and marking the ceramic sample according to the preset path and parameters, so that micropores that match the designed shape appear on the ceramic sample.

4. A ceramic workpiece micro-hole machining method according to claim 1, characterized in that: In the step three, the pretreatment method is a low-power scanning method or a method of adding specific chemicals to change the surface properties.

5. A ceramic workpiece micro-hole machining method according to claim 4, characterized in that: The low-power scanning method specifically refers to using a relatively low-power laser energy beam to scan the surface of the area to be irradiated.

6. A ceramic workpiece micro-hole machining method according to claim 1, characterized in that: In the step 4, the laser power is 5-10W, and the laser is a Nd:YAG ceramic laser with a wavelength of 850nm-1064nm.

7. A ceramic workpiece micro-hole machining method according to claim 1, characterized in that: The step five of fine processing is specifically as follows: according to the material characteristics and processing accuracy requirements, the pulse frequency and pulse width parameters of the laser are set to minimize the heat affected zone, and the processing effects of surface quality and dimensional accuracy are closely observed during the process, and the parameters are finely adjusted and optimized in a timely manner.

8. A ceramic workpiece micro-hole machining method according to claim 7, characterized in that: In the step 5, the short pulse width is 1-3 μs, the high pulse frequency is 5-10 kHz, the scanning speed is 80-100 mm / s, and the focal length of the focusing lens is 40-60 mm.

9. A ceramic workpiece micro-hole machining method according to claim 1, characterized in that: The post-processing in step six is ​​specifically to use appropriate tools or methods to clean the debris, particles and other substances generated by laser processing remaining on the surface of the workpiece.

10. A ceramic workpiece micro-hole machining method according to claim 1, characterized in that: After the post-processing in step 6, step 7 is also included, which is polishing or coating treatment. The polishing treatment is to polish the inner wall of the ceramic sample by mechanical polishing or chemical polishing to improve the surface finish of the workpiece; spray Teflon coating on the ceramic sample to improve the surface strength of the workpiece.

Images