Sealing gasket production equipment and method for semiconductor equipment

Abstract

The invention discloses sealing gasket production equipment and method for semiconductor equipment, and relates to the technical field of sealing gasket production, the sealing gasket production equipment comprises a bottom plate, the upper surface of one end of the bottom plate is fixedly connected with a first fixing column, the top end of the first fixing column is fixedly connected with a hydraulic cylinder, and the upper surface of the bottom plate is fixedly connected with a first collecting box; the side, close to the first collecting box, of the upper surface of the bottom plate is fixedly connected with a second fixing column, and the other side, close to the first collecting box, of the upper surface of the bottom plate is fixedly connected with a second collecting box. According to the sealing gasket production equipment and method for the semiconductor equipment, current is generated in the heating column and the heating ring by generating a variable magnetic field, the inner ring of the sealing gasket is uniformly heated and melted through the heating column and the heating ring, the notch of the inner ring is in a molten state, the temperature is reduced, the surface of the inner ring of the sealing gasket is smooth, and the sealing gasket is prevented from being damaged. The effect of improving the corrosion resistance of the sealing gasket is achieved, and in the same way, the outer ring of the sealing gasket has the same effect.

Description

Technical Field

[0001] The present invention relates to the technical field of sealing gasket production, and in particular to a sealing gasket production device and method for semiconductor equipment. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc.

[0003] Etching equipment is used to etch the surface of the wafer to form the required circuit lines and holes. Etching equipment usually adopts technologies such as reactive ion etching or plasma etching to achieve high-precision and high-efficiency etching operations. Semiconductor etching equipment uses sealing gaskets. The sealing gaskets used in general semiconductor equipment are produced by injection molding. The edges of the products will have brushing or burrs, making the gaskets susceptible to corrosion by chemical solutions during use, causing pollution inside the semiconductor production equipment, reducing the qualified rate of semiconductors, and failing to meet actual needs. Summary of the invention

[0004] The present invention discloses a sealing gasket production device and method for semiconductor equipment, aiming to solve the technical problem that sealing gaskets for general semiconductor equipment are produced by injection molding, wire drawing or burrs will be generated on the edges of the products, making the gaskets easily corroded by chemical solutions during use, causing pollution inside the semiconductor production equipment, and reducing the qualified rate of semiconductors.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A sealing gasket production device and method for semiconductor equipment, comprising a base plate, a first fixing column fixedly connected to the upper surface of one end of the base plate, a hydraulic cylinder fixedly connected to the top of the first fixing column, a first collecting box fixedly connected to the upper surface of the base plate, a second fixing column fixedly connected to the side of the upper surface of the base plate close to the first collecting box, a second collecting box fixedly connected to the other side of the upper surface of the base plate close to the first collecting box, a third fixing column fixedly connected to the upper surface of the other end of the base plate, a second slide rail fixedly connected to the top of the third fixing column, a third slide plate slidably connected in the second slide rail, a sliding frame fixedly connected to the top of the third slide plate, a third slide rail fixedly connected to the upper surface of the sliding frame, a second slide rail slidably connected in the third slide rail;

[0007] A stamping mechanism is installed on the top of the second fixing column, and the stamping mechanism is used to stamp the sealing gasket;

[0008] A linkage mechanism is installed on the upper surface of the bottom plate, and the linkage mechanism is used to realize mechanism linkage;

[0009] A pressure-bearing mechanism is installed on the sliding frame, and the pressure-bearing mechanism is used in conjunction with the punching mechanism.

[0010] In a preferred embodiment, the stamping mechanism comprises a first slide rail fixedly connected to the top of the second fixed column, a first slide plate is slidably connected inside the first slide rail, a stamping cylinder is fixedly connected to the top of the first slide plate, a buffer rod is slidably connected inside the stamping cylinder, and a stamping spring is sleeved on one end of the buffer rod;

[0011] The buffer rod is provided with a stamping airtight mechanism, which is used to absorb the waste material after stamping;

[0012] A shearing mechanism is installed at one end of the punching cylinder, and the shearing mechanism is used to shear the sealing gasket.

[0013] The stamping airtight mechanism includes a bellows sleeved on one end of a buffer rod, an adsorption channel is arranged inside the buffer rod, an adsorption groove is arranged at one end of the adsorption channel, the shearing mechanism includes a first shearing knife arranged on the edge of one end of the stamping cylinder, a plurality of gap grooves are arranged on the surface of one end of the stamping cylinder, and a second shearing knife is arranged on the edge of one end of the stamping cylinder close to the buffer rod.

[0014] Furthermore, the function of the gap groove is to form a gap between the sealing gasket and the punching cylinder to prevent the sealing gasket from being adsorbed on the punching cylinder.

[0015] In a preferred embodiment, the linkage mechanism includes two connecting blocks fixedly connected to the upper surface of the base plate, one side of the connecting block is rotatably connected to the first rotating plate and the second rotating plate respectively, one side of the first rotating plate is rotatably connected to the linkage plate, one side of the second rotating plate is rotatably connected to the connecting plate, the upper surface of the base plate is fixedly connected to the mounting plate, one side of the mounting plate is rotatably connected to the auxiliary plate, one end of the first rotating plate is slidably connected to the second slide groove, one end of the second rotating plate is slidably connected to the first slide groove, and the bottom end of the first slide groove is fixedly connected to the upper surface of the sliding frame.

[0016] In a preferred embodiment, the pressure-bearing mechanism includes two fixed seats fixedly connected to the upper surface of the sliding frame, one side of the fixed seat is fixedly connected to a fixed cylinder, one side of the sliding frame is fixedly connected to a fixed shaft, one end of the fixed shaft is sleeved with a pressure-bearing spring, one end of the fixed shaft is slidably connected to the sliding cylinder, one end of the sliding cylinder is rotatably connected to the rotating cylinder, the top of the sliding cylinder is fixedly connected to a motor, one end of the motor output shaft is fixedly connected to a driving gear, one end of the rotating cylinder is fixedly connected to a driven gear, an upper auxiliary groove and a lower auxiliary groove are respectively provided on the outer wall and the inner wall of one end of the rotating cylinder, an upper mounting groove is provided on the inner wall of one end of the fixed cylinder, and a lower mounting groove is provided on the outer wall of one end of the fixed shaft;

[0017] A pressure-bearing airtight mechanism is installed inside the sliding cylinder, and the pressure-bearing airtight mechanism is used to absorb the sealing gasket;

[0018] An inner ring processing mechanism is installed inside the fixed shaft, and the inner ring processing mechanism is used to process the inner ring of the sealing gasket;

[0019] An outer ring processing mechanism is installed inside the fixing cylinder, and the outer ring processing mechanism is used for sealing the outer ring of the gasket.

[0020] In a preferred embodiment, the pressure-bearing airtight mechanism includes a plurality of fixed adsorption tubes arranged inside the sliding cylinder, one end of the fixed adsorption tube is sleeved with a connecting tube, the other end of the fixed adsorption tube is provided with a ventilation groove, and a rotating adsorption tube is arranged inside the rotating cylinder, one end of the rotating adsorption tube is provided with a connecting groove.

[0021] In a preferred embodiment, the inner ring processing mechanism includes a mounting rod inserted into the interior of a fixed shaft, one end of the mounting rod is fixedly connected to the first electromagnetic coil, a heating column is inserted into the interior of the connecting plate at one end close to the first electromagnetic coil, a plurality of first heat conducting plates are fixedly connected to the outer surface of the heating column, one side of the first heat conducting plate is respectively rotatably connected to the first inner heating plate and the second inner heating plate, one side of the first inner heating plate is provided with an inner spring sheet, the outer ring processing mechanism includes a plurality of fixed rods inserted into the outer wall of the fixed cylinder, one end of the fixed rod is fixedly connected to the second electromagnetic coil, a heating ring is fixedly connected to the outer wall of the fixed cylinder, a plurality of second heat conducting plates are fixedly connected to the inner wall of the heating ring, one side of the second heat conducting plate is respectively rotatably connected to the first outer heating plate and the second outer heating plate, and one side of the first outer heating plate is rotatably connected to the outer spring sheet.

[0022] A method for using a sealing gasket production device for semiconductor equipment, characterized in that it comprises the following steps:

[0023] S1. Preparation stage: The connecting pipe and the bellows are connected to the air pump respectively, and the blank of the sealing gasket is attached to one end of the rotating adsorption tube on the rotating cylinder. The sealing gasket is adsorbed by the air pump to push the punching cylinder to slide to the left. One end of the buffer rod contacts the sealing gasket first, and the output shaft of the hydraulic cylinder continues to move, pushing the first rotating plate to rotate to one side. Through the linkage action of the linkage plate, the auxiliary plate and the connecting plate, the second rotating plate rotates in the opposite direction, so that the sliding frame is close to the second slide groove.

[0024] S2, shearing stage: the first shearing knife and the second shearing knife on the punching cylinder shear off the inner circle and the outer circle of the sealing gasket, leaving only the annular part of the sealing gasket, so as to make the edge of the sealing gasket neat, so that one end of the punching cylinder and one end of the rotating cylinder squeeze the sealing gasket into the fixed cylinder, and the rotating cylinder and the sliding cylinder slide on the fixed shaft to compress the pressure spring so that the edge of the sealing gasket is located between the upper mounting groove and the lower mounting groove.

[0025] S3, processing stage: the edge of the sealing gasket is located between the upper mounting groove and the lower mounting groove, the first inner heating plate and the second inner heating plate are against the inner ring edge of the sealing gasket, the first electromagnetic coil and the second electromagnetic coil are started to generate a changing magnetic field, so that current is generated inside the heating column and the heating ring, the temperature of the heating column and the heating ring is increased, and the sealing gasket is rotated. The heating column and the heating ring heat and melt the inner ring of the sealing gasket evenly, and the inner ring is cut into a molten state to reduce the temperature. The inner ring surface of the sealing gasket is smooth, which increases the corrosion resistance of the sealing gasket. Similarly, the outer ring of the sealing gasket has the same effect.

[0026] S4, collection stage: the output shaft of the hydraulic cylinder moves back, the punching cylinder is separated from the rotating cylinder, the outer ring part of the waste falls into the first collection box, the sealing gasket is adsorbed on the rotating cylinder, and the inner circular waste is adsorbed on the buffer rod. The circular waste is dropped into the first collection box through the air pump, and the sealing gasket on the rotating cylinder falls into the second collection box, thereby achieving the effect of classifying and collecting the sealing gasket and waste.

[0027] As can be seen from the above, the sealing gasket production equipment and method for semiconductor equipment provided by the present invention have the following technical effects.

[0028] First: by generating a changing magnetic field, due to Lenz's law, an electric current is generated inside the heating column and the heating ring, the temperature of the heating column and the heating ring increases, and the sealing gasket rotates. Since the heating column transfers the temperature to the first heat conduction plate, the heating column and the heating ring heat and melt the inner ring of the sealing gasket evenly, and the inner ring is cut into a molten state, which reduces the temperature and makes the inner ring surface of the sealing gasket smooth, thereby increasing the corrosion resistance of the sealing gasket. Similarly, the outer ring of the sealing gasket produces the same effect.

[0029] Second: by making one end of the punching cylinder and one end of the rotating cylinder squeeze the sealing gasket and push it into the fixed cylinder, the edge of the sealing gasket is located between the upper mounting groove and the lower mounting groove, and the pressure spring pushes the rotating cylinder into the fixed cylinder, so that the rotating cylinder and the punching cylinder complete the clamping of the sealing gasket, the buffer rod and the fixed shaft complete the clamping of the internal circular waste, and the fixed cylinder has the effect of separating the external circular waste.

[0030] Third: connect with the air pump through the connecting pipe and the bellows respectively, start the hydraulic cylinder, the output shaft of the hydraulic cylinder extends to one end, pushes the punching cylinder to slide to the left, and one end of the buffer rod contacts the sealing gasket first, so that the first shearing knife and the second shearing knife on the punching cylinder cut off the inner circle and the outer circle of the sealing gasket, leaving only the circular ring part of the sealing gasket, so as to make the edge of the sealing gasket neat.

[0031] Fourthly: by designing a connecting groove, the air pump fixes the adsorption tube, the rotating adsorption tube, the ventilation groove and the connecting groove, the sealing gasket is always adsorbed. When the rotating cylinder and the sliding cylinder rotate relative to each other, due to the action of the connecting groove, the ventilation groove and the rotating adsorption tube are always connected, so that the negative pressure inside the rotating adsorption tube always exists, which plays the role of always adsorbing the sealing gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a front view structural schematic diagram of a sealing gasket production device for semiconductor equipment proposed by the present invention.

[0033] Figure 2 The present invention is a schematic cross-sectional structural diagram of a sealing gasket production device for semiconductor equipment.

[0034] Figure 3 This is a schematic diagram of the structure of a stamping cylinder of a sealing gasket production device for semiconductor equipment proposed by the present invention.

[0035] Figure 4 This is a schematic diagram of the buffer rod structure of a sealing gasket production device for semiconductor equipment proposed by the present invention.

[0036] Figure 5 The present invention is a schematic diagram of a fixed axis structure of a sealing gasket production device for semiconductor equipment.

[0037] Figure 6 This is a schematic structural diagram of a first inner heating plate of a sealing gasket production device for semiconductor equipment proposed by the present invention.

[0038] Figure 7 This is a schematic diagram of the structure of a fixing cylinder of a sealing gasket production device for semiconductor equipment proposed by the present invention.

[0039] Figure 8This is a schematic diagram of the connecting groove structure of a sealing gasket production device for semiconductor equipment proposed by the present invention.

[0040] In the figure: 1, bottom plate; 2, first collecting box; 3, first rotating plate; 4, second rotating plate; 5, linkage plate; 6, auxiliary plate; 7, connecting plate; 8, sliding frame; 9, fixed seat; 10, first slide groove; 11, punching cylinder; 12, second slide groove; 13, hydraulic cylinder; 14, first slide plate; 15, fixed cylinder; 16, rotating cylinder; 17, fixed shaft; 18, sliding cylinder; 19, pressure spring; 20, second slide plate; 21, third slide plate; 22, punching spring; 23, buffer rod; 24, adsorption channel; 25, bellows; 26, adsorption groove; 27, gap groove; 28, first shearing knife; 29. Connecting pipe; 30. Fixed adsorption pipe; 31. Motor; 32. Driving gear; 33. Rotating adsorption pipe; 34. Upper mounting groove; 35. Upper auxiliary groove; 36. Lower auxiliary groove; 37. Lower mounting groove; 38. Driven gear; 39. First electromagnetic coil; 40. Heating column; 41. First heat conduction plate; 42. First inner heating plate; 43. Inner spring piece; 44. Second inner heating plate; 45. Fixed rod; 46. Second electromagnetic coil; 47. Heating ring; 48. Second heat conduction plate; 49. First outer heating plate; 50. Outer spring piece; 51. Second outer heating plate; 52. Ventilation groove; 53. Connecting groove. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0042] The present invention discloses a sealing gasket production device and method for semiconductor equipment, which are mainly used in the production of sealing gaskets for general semiconductor equipment using an injection molding method. Wiredrawing or burrs may occur on the edges of the products, making the gaskets susceptible to corrosion by chemical solutions during use, causing pollution inside the semiconductor production equipment and reducing the qualified rate of semiconductors.

[0043] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4, a sealing gasket production device and method for semiconductor equipment, comprising a bottom plate 1, a first fixing column is fixedly connected to the upper surface of one end of the bottom plate 1, a hydraulic cylinder 13 is fixedly connected to the top of the first fixing column, a first collecting box 2 is fixedly connected to the upper surface of the bottom plate 1, a second fixing column is fixedly connected to the side of the upper surface of the bottom plate 1 close to the first collecting box 2, a second collecting box is fixedly connected to the other side of the upper surface of the bottom plate 1 close to the first collecting box 2, a third fixing column is fixedly connected to the upper surface of the other end of the bottom plate 1, a second slide rail is fixedly connected to the top of the third fixing column, a third slide plate 21 is slidably connected in the second slide rail, a sliding frame 8 is fixedly connected to the top of the third slide plate 21, a third slide rail is fixedly connected to the upper surface of the sliding frame 8, and a second slide plate 20 is slidably connected in the third slide rail;

[0044] A stamping mechanism is installed on the top of the second fixed column, and the stamping mechanism is used to stamp the sealing gasket;

[0045] A linkage mechanism is installed on the upper surface of the bottom plate 1, and the linkage mechanism is used to realize the linkage of the mechanisms;

[0046] A pressure-bearing mechanism is installed on the sliding frame 8, and the pressure-bearing mechanism is used in conjunction with the punching mechanism.

[0047] In this embodiment, the outer circular waste falls into the first collecting box 2, and the inner circular waste is adsorbed on the buffer rod 23. The air pump is used to make the circular waste fall into the first collecting box 2, and the sealing gasket falls into the second collecting box, thereby achieving the effect of classifying and collecting the sealing gasket and waste.

[0048] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 In a preferred embodiment, the stamping mechanism includes a first slide rail fixedly connected to the top of the second fixed column, a first slide plate 14 is slidably connected inside the first slide rail, a stamping cylinder 11 is fixedly connected to the top of the first slide plate 14, a buffer rod 23 is slidably connected inside the stamping cylinder 11, and a stamping spring 22 is sleeved on one end of the buffer rod 23;

[0049] The buffer rod 23 is provided with a stamping airtight mechanism, which is used to absorb the waste material after stamping;

[0050] A shearing mechanism is installed at one end of the punching cylinder 11, and the shearing mechanism is used to shear the sealing gasket. The punching airtight mechanism includes a bellows 25 which is sleeved on one end of the buffer rod 23. The buffer rod 23 is provided with an adsorption channel 24 inside, and one end of the adsorption channel 24 is provided with an adsorption groove 26. The shearing mechanism includes a first shearing knife 28 arranged on the edge of one end of the punching cylinder 11, and a plurality of gap grooves 27 are arranged on the surface of one end of the punching cylinder 11. A second shearing knife is arranged on the edge of one end of the punching cylinder 11 near the buffer rod 23.

[0051] In this embodiment, the connecting pipe 29 and the bellows 25 are respectively connected to the air pump, and the hydraulic cylinder 13 is started. The output shaft of the hydraulic cylinder 13 extends to one end, pushing the punching cylinder 11 to slide to the left. One end of the buffer rod 23 first contacts the sealing gasket, so that the first shearing knife 28 and the second shearing knife on the punching cylinder 11 cut off the inner circle and the outer circle of the sealing gasket, leaving only the circular ring part of the sealing gasket, thereby making the edge of the sealing gasket neat.

[0052] Furthermore, the function of the gap groove 27 is to form a gap between the sealing gasket and the punching cylinder 11 to prevent the sealing gasket from being adsorbed on the punching cylinder 11 .

[0053] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 In a preferred embodiment, the linkage mechanism includes two connecting blocks fixedly connected to the upper surface of the base plate 1, one side of the connecting block is rotatably connected to the first rotating plate 3 and the second rotating plate 4, one side of the first rotating plate 3 is rotatably connected to the linkage plate 5, one side of the second rotating plate 4 is rotatably connected to the connecting plate 7, the upper surface of the base plate 1 is fixedly connected to a mounting plate, one side of the mounting plate is rotatably connected to an auxiliary plate 6, one end of the first rotating plate 3 is slidably connected to the second slide groove 12, one end of the second rotating plate 4 is slidably connected to the first slide groove 10, and the bottom end of the first slide groove 10 is fixedly connected to the upper surface of the sliding frame 8.

[0054] In this embodiment, the output shaft of the hydraulic cylinder 13 continues to move, pushing the first rotating plate 3 to rotate to one side. Through the linkage action of the linkage plate 5, the auxiliary plate 6 and the connecting plate 7, the second rotating plate 4 rotates in the opposite direction, so that the sliding frame 8 approaches the second slide groove 12, until one end of the fixed shaft 17 squeezes the buffer rod 23 into the interior of the stamping cylinder 11 to compress the stamping spring 22, thereby increasing the pressure of the shear sealing gasket.

[0055] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5In a preferred embodiment, the pressure-bearing mechanism includes two fixed seats 9 fixedly connected to the upper surface of the sliding frame 8, one side of the fixed seat 9 is fixedly connected to a fixed cylinder 15, one side of the sliding frame 8 is fixedly connected to a fixed shaft 17, one end of the fixed shaft 17 is sleeved with a pressure-bearing spring 19, one end of the fixed shaft 17 is slidably connected to a sliding cylinder 18, one end of the sliding cylinder 18 is rotatably connected to a rotating cylinder 16, a motor 31 is fixedly connected to the top of the sliding cylinder 18, one end of the output shaft of the motor 31 is fixedly connected to a driving gear 32, one end of the rotating cylinder 16 is fixedly connected to a driven gear 38, an upper auxiliary groove 35 and a lower auxiliary groove 36 are respectively provided on the outer wall and inner wall of one end of the rotating cylinder 16, an upper mounting groove 34 is provided on the inner wall of one end of the fixed cylinder 15, and a lower mounting groove 37 is provided on the outer wall of one end of the fixed shaft 17;

[0056] A pressure-bearing airtight mechanism is installed inside the sliding cylinder 18, and the pressure-bearing airtight mechanism is used to absorb the sealing gasket;

[0057] An inner ring processing mechanism is installed inside the fixed shaft 17, and the inner ring processing mechanism is used to process the inner ring of the sealing gasket;

[0058] An outer ring processing mechanism is installed inside the fixing cylinder 15, and the outer ring processing mechanism is used for sealing the outer ring of the gasket.

[0059] In this embodiment, the blank of the sealing gasket is attached to one end of the rotating adsorption tube 33 on the rotating cylinder 16, and the sealing gasket is adsorbed by the air pump. The output shaft of the hydraulic cylinder 13 continues to move, so that one end of the punching cylinder 11 and one end of the rotating cylinder 16 squeeze the sealing gasket and push it into the fixed cylinder 15. The rotating cylinder 16 and the sliding cylinder 18 slide on the fixed shaft 17, compressing the pressure spring 19, so that the edge of the sealing gasket is located between the upper mounting groove 34 and the lower mounting groove 37. The pressure spring 19 pushes the rotating cylinder 16 out of the fixed cylinder 15, and the output shaft of the hydraulic cylinder 13 moves back, and the punching cylinder 11 is separated from the rotating cylinder 16, so that the rotating cylinder 16 and the punching cylinder 11 complete the clamping of the sealing gasket, the buffer rod 23 and the fixed shaft 17 complete the clamping of the internal circular waste, and the fixed cylinder 15 has the effect of separating the external circular waste.

[0060] Reference Figure 1 , Figure 2 , Figure 5 and Figure 8 In a preferred embodiment, the pressure-bearing airtight mechanism includes a plurality of fixed adsorption tubes 30 arranged inside the sliding cylinder 18, one end of the fixed adsorption tube 30 is sleeved with a connecting tube 29, and the other end of the fixed adsorption tube 30 is provided with a ventilation groove 52, and a rotating adsorption tube 33 is arranged inside the rotating cylinder 16, and one end of the rotating adsorption tube 33 is provided with a connecting groove 53.

[0061] In this embodiment, the air pump fixes the adsorption tube 30, the rotating adsorption tube 33, the ventilation groove 52 and the connecting groove 53, so that the sealing gasket is always adsorbed. When the rotating cylinder 16 and the sliding cylinder 18 rotate relative to each other, due to the action of the connecting groove 53, the ventilation groove 52 and the rotating adsorption tube 33 are always connected, so that the negative pressure inside the rotating adsorption tube 33 always exists, thereby playing the role of always adsorbing the sealing gasket.

[0062] Reference Figure 1 , Figure 2 , Figure 6 and Figure 7 In a preferred embodiment, the inner ring processing mechanism includes a mounting rod inserted into the interior of the fixed shaft 17, one end of the mounting rod is fixedly connected to the first electromagnetic coil 39, a heating column 40 is inserted into the end of the connecting plate 7 close to the first electromagnetic coil 39, and a plurality of first heat conducting plates 41 are fixedly connected to the outer surface of the heating column 40, one side of the first heat conducting plate 41 is respectively rotatably connected to the first inner heating plate 42 and the second inner heating plate 44, and one side of the first inner heating plate 42 is provided with an inner spring piece 43, and the outer ring processing mechanism includes a plurality of fixed rods 45 inserted into the outer wall of the fixed cylinder 15, one end of the fixed rod 45 is fixedly connected to the second electromagnetic coil 46, a heating ring 47 is fixedly connected to the outer wall of the fixed cylinder 15, and a plurality of second heat conducting plates 48 are fixedly connected to the inner wall of the heating ring 47, one side of the second heat conducting plate 48 is respectively rotatably connected to the first outer heating plate 49 and the second outer heating plate 51, and one side of the first outer heating plate 49 is rotatably connected to the outer spring piece 50.

[0063] In this embodiment, the first electromagnetic coil 39 and the second electromagnetic coil 46 are started to generate a changing magnetic field. Due to Lenz's law, current is generated inside the heating column 40 and the heating ring 47, so that the temperature of the heating column 40 and the heating ring 47 increases. Similarly, the first outer heating plate 49 and the second outer heating plate 51 are the same. The motor 31 is started to drive the driving gear 32 and the driven gear 38 to rotate, thereby driving the rotating cylinder 16 to rotate, so that the sealing gasket rotates. Since the heating column 40 transfers the temperature to the first heat conducting plate 41, and then to the first inner heating plate 42 and the second inner heating plate 44 through the first heat conducting plate 41, the heating column 40 and the heating ring 47 heat and melt the inner ring of the sealing gasket evenly, and the inner ring cut is in a molten state. The first electromagnetic coil 39 and the second electromagnetic coil 46 are closed to reduce the temperature. The inner ring surface of the sealing gasket is smooth, which increases the corrosion resistance of the sealing gasket. Similarly, the outer ring of the sealing gasket produces the same effect.

[0064] Furthermore, due to the elastic force of the inner spring piece 43 and the outer spring piece 50, the angle between the first inner heating plate 42 and the second inner heating plate 44 tends to decrease. Due to the extrusion of the inner wall of the rotating cylinder 16, the first inner heating plate 42 and the second inner heating plate 44 cannot rotate until the edge of the sealing gasket is located between the upper mounting groove 34 and the lower mounting groove 37. The upper mounting groove 34 and the lower mounting groove 37 reduce the angle between the first inner heating plate 42 and the second inner heating plate 44. Similarly, the first outer heating plate 49 and the second outer heating plate 51 are also the same. The edge of the sealing gasket is located between the upper mounting groove 34 and the lower mounting groove 37. The first inner heating plate 42 and the second inner heating plate 44 resist the inner ring edge of the sealing gasket, so that the output shaft of the hydraulic cylinder 13 moves back, so that the angle between the first inner heating plate 42 and the second inner heating plate 44 increases again and returns to its original position, so that the inner spring piece 43 is in an elastic state, which plays a role in limiting the position of the sealing gasket.

[0065] Working principle: When in use, the connecting pipe 29 and the bellows 25 are connected to the air pump respectively, and the embryo of the sealing gasket is attached to one end of the rotating adsorption tube 33 on the rotating cylinder 16. The sealing gasket is adsorbed by the air pump, and the hydraulic cylinder 13 is started. The output shaft of the hydraulic cylinder 13 extends out to one end, pushing the stamping cylinder 11 to slide to the left. One end of the buffer rod 23 contacts the sealing gasket first, and the output shaft of the hydraulic cylinder 13 continues to move, pushing the first rotating plate 3 to rotate to one side. Through the linkage action of the linkage plate 5, the auxiliary plate 6 and the connecting plate 7, the second rotating plate 4 rotates in the opposite direction, so that the sliding frame 8 approaches the second slide groove 12, until one end of the fixed shaft 17 squeezes the buffer rod 23 into the inside of the stamping cylinder 11 to compress the stamping spring 22, so that the first rotating plate 3 on the stamping cylinder 11 is pressed. A shearing knife 28 and a second shearing knife shear off the inner circle and the outer circle of the sealing gasket, leaving only the annular part of the sealing gasket, so as to make the edge of the sealing gasket neat. The function of the gap groove 27 is to form a gap between the sealing gasket and the punching cylinder 11 to prevent the sealing gasket from being adsorbed on the punching cylinder 11. The output shaft of the hydraulic cylinder 13 continues to move, so that one end of the punching cylinder 11 and one end of the rotating cylinder 16 squeeze the sealing gasket and push it into the fixed cylinder 15. The rotating cylinder 16 and the sliding cylinder 18 slide on the fixed shaft 17, compressing the pressure spring 19, so that the edge of the sealing gasket is located between the upper mounting groove 34 and the lower mounting groove 37. Due to the elastic force of the inner spring sheet 43 and the outer spring sheet 50, the angle between the first inner heating plate 42 and the second inner heating plate 44 is reduced. The first inner heating plate 42 and the second inner heating plate 44 cannot rotate due to the squeezing of the inner wall of the rotating cylinder 16 until the edge of the sealing gasket is located between the upper mounting groove 34 and the lower mounting groove 37. The upper mounting groove 34 and the lower mounting groove 37 reduce the angle between the first inner heating plate 42 and the second inner heating plate 44. Similarly, the first outer heating plate 49 and the second outer heating plate 51 are the same. The edge of the sealing gasket is located between the upper mounting groove 34 and the lower mounting groove 37. The first inner heating plate 42 and the second inner heating plate 44 are against the inner circle edge of the sealing gasket, and the first electromagnetic coil 39 and the second electromagnetic coil 46 are started to generate a changing magnetic field. Due to Lenz's law, current is generated inside the heating column 40 and the heating ring 47, so that the temperature of the heating column 40 and the heating ring 47 increases. The temperature rises, and the first outer heating plate 49 and the second outer heating plate 51 are the same. The motor 31 is started to drive the driving gear 32 and the driven gear 38 to rotate, thereby driving the rotating cylinder 16 to rotate, so that the sealing gasket rotates. Since the heating column 40 transfers the temperature to the first heat conducting plate 41, and transmits it to the first inner heating plate 42 and the second inner heating plate 44 through the first heat conducting plate 41, the heating column 40 and the heating ring 47 heat and melt the inner ring of the sealing gasket evenly, and the inner ring cut is in a molten state. The first electromagnetic coil 39 and the second electromagnetic coil 46 are closed to reduce the temperature. The inner ring surface of the sealing gasket is smooth, which increases the corrosion resistance of the sealing gasket. Similarly, the outer ring of the sealing gasket produces the same effect, so that the output shaft of the hydraulic cylinder 13 moves back.The angles of the first inner heating plate 42 and the second inner heating plate 44 are enlarged and restored to their original positions, so that the inner spring sheet 43 is in an elastic state, and the pressure-bearing spring 19 pushes the rotating cylinder 16 out of the fixed cylinder 15. The air pump fixes the adsorption tube 30, the rotating adsorption tube 33, the ventilation groove 52 and the connecting groove 53, so that the sealing gasket is always adsorbed. When the rotating cylinder 16 and the sliding cylinder 18 rotate relative to each other, due to the action of the connecting groove 53, the ventilation groove 52 and the rotating adsorption tube 33 are always connected, so that the negative pressure inside the rotating adsorption tube 33 always exists, which plays a role in always adsorbing the sealing gasket. The output shaft of the hydraulic cylinder 13 moves back, the punching cylinder 11 is separated from the rotating cylinder 16, and the external annular part of the waste falls into the first collecting box 2. The sealing gasket is adsorbed on the rotating cylinder 16, and the internal circular waste is adsorbed on the buffer rod 23. The circular waste is made to fall into the first collecting box 2 by the air pump, and the sealing gasket on the rotating cylinder 16 falls into the second collecting box, which plays an effect of classifying and collecting the sealing gasket and waste. ,

[0066] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A sealing gasket production device for semiconductor equipment, comprising a base plate (1), characterized in that: The upper surface of one end of the base plate (1) is fixedly connected with a first fixing column, the top of the first fixing column is fixedly connected with a hydraulic cylinder (13), the upper surface of the base plate (1) is fixedly connected with a first collecting box (2), the upper surface of the base plate (1) is fixedly connected with a second fixing column on one side close to the first collecting box (2), the upper surface of the base plate (1) is fixedly connected with a second collecting box on the other side close to the first collecting box (2), the upper surface of the other end of the base plate (1) is fixedly connected with a third fixing column, the top of the third fixing column is fixedly connected with a second slide rail, the second slide rail is slidably connected with a third slide plate (21), the top of the third slide plate (21) is fixedly connected with a sliding frame (8), the upper surface of the sliding frame (8) is fixedly connected with the third slide rail, and the interior of the third slide rail is slidably connected with a second slide plate (20); A stamping mechanism is installed on the top of the second fixing column, and the stamping mechanism is used to stamp the sealing gasket; A linkage mechanism is installed on the upper surface of the base plate (1), and the linkage mechanism is used to realize mechanism linkage; A pressure-bearing mechanism is installed on the sliding frame (8), and the pressure-bearing mechanism is used in conjunction with the punching mechanism.

2. The sealing gasket production equipment for semiconductor equipment according to claim 1, characterized in that: The punching mechanism comprises a first slide rail fixedly connected to the top of the second fixed column, a first slide plate (14) is slidably connected inside the first slide rail, a punching cylinder (11) is fixedly connected to the top of the first slide plate (14), a buffer rod (23) is slidably connected inside the punching cylinder (11), and a punching spring (22) is sleeved on one end of the buffer rod (23); The buffer rod (23) is provided with a stamping airtight mechanism, and the stamping airtight mechanism is used for absorbing the waste material after stamping; A shearing mechanism is installed at one end of the punching cylinder (11), and the shearing mechanism is used to shear the sealing gasket.

3. The sealing gasket production equipment for semiconductor equipment according to claim 2, characterized in that: The stamping airtight mechanism comprises a bellows (25) sleeved on one end of a buffer rod (23); an adsorption channel (24) is provided inside the buffer rod (23); and an adsorption groove (26) is provided at one end of the adsorption channel (24).

4. The sealing gasket production equipment for semiconductor equipment according to claim 3, characterized in that: The shearing mechanism comprises a first shearing knife (28) arranged on the edge of one end of the punching cylinder (11), a plurality of gap grooves (27) are arranged on the surface of one end of the punching cylinder (11), and a second shearing knife is arranged on the edge of one end of the punching cylinder (11) close to the buffer rod (23).

5. The sealing gasket production equipment for semiconductor equipment according to claim 4, characterized in that: The linkage mechanism comprises two connecting blocks fixedly connected to the upper surface of the base plate (1), one side of the connecting block is rotatably connected to the first rotating plate (3) and the second rotating plate (4), one side of the first rotating plate (3) is rotatably connected to the linkage plate (5), one side of the second rotating plate (4) is rotatably connected to the connecting plate (7), the upper surface of the base plate (1) is fixedly connected to a mounting plate, one side of the mounting plate is rotatably connected to an auxiliary plate (6), one end of the first rotating plate (3) is slidably connected to the second slide groove (12), one end of the second rotating plate (4) is slidably connected to the first slide groove (10), and the bottom end of the first slide groove (10) is fixedly connected to the upper surface of the sliding frame (8).

6. The sealing gasket production equipment for semiconductor equipment according to claim 5, characterized in that: The pressure-bearing mechanism comprises two fixed seats (9) fixedly connected to the upper surface of the sliding frame (8), one side of the fixed seat (9) is fixedly connected to a fixed cylinder (15), one side of the sliding frame (8) is fixedly connected to a fixed shaft (17), one end of the fixed shaft (17) is sleeved with a pressure-bearing spring (19), one end of the fixed shaft (17) is slidably connected to a sliding cylinder (18), one end of the sliding cylinder (18) is rotatably connected to a rotating cylinder (16), and the sliding cylinder (18) A motor (31) is fixedly connected to the top of the rotating cylinder (16), one end of the output shaft of the motor (31) is fixedly connected to a driving gear (32), one end of the rotating cylinder (16) is fixedly connected to a driven gear (38), an upper auxiliary groove (35) and a lower auxiliary groove (36) are respectively provided on the outer wall and the inner wall of one end of the rotating cylinder (16), an upper mounting groove (34) is provided on the inner wall of one end of the fixed cylinder (15), and a lower mounting groove (37) is provided on the outer wall of one end of the fixed shaft (17); A pressure-bearing airtight mechanism is installed inside the sliding cylinder (18), and the pressure-bearing airtight mechanism is used to absorb the sealing gasket; An inner ring processing mechanism is installed inside the fixed shaft (17), and the inner ring processing mechanism is used to process the inner ring of the sealing gasket; An outer ring processing mechanism is installed inside the fixed cylinder (15), and the outer ring processing mechanism is used for sealing the outer ring of the gasket.

7. The sealing gasket production equipment for semiconductor equipment according to claim 6, characterized in that: The pressure-bearing airtight mechanism comprises a plurality of fixed adsorption tubes (30) arranged inside the sliding cylinder (18), one end of the fixed adsorption tube (30) is sleeved with a connecting tube (29), the other end of the fixed adsorption tube (30) is provided with a ventilation groove (52), and a rotating adsorption tube (33) is arranged inside the rotating cylinder (16), and one end of the rotating adsorption tube (33) is provided with a connecting groove (53).

8. The sealing gasket production equipment for semiconductor equipment according to claim 7, characterized in that: The inner ring processing mechanism includes a mounting rod inserted inside a fixed shaft (17), one end of the mounting rod is fixedly connected to a first electromagnetic coil (39), a heating column (40) is inserted into one end of the connecting plate (7) near the first electromagnetic coil (39), and a plurality of first heat conducting plates (41) are fixedly connected to the outer surface of the heating column (40), one side of the first heat conducting plate (41) is rotatably connected to a first inner heating plate (42) and a second inner heating plate (44), and one side of the first inner heating plate (42) is provided with an inner spring sheet (43).

9. The sealing gasket production equipment for semiconductor equipment according to claim 8, characterized in that: The outer ring processing mechanism comprises a plurality of fixed rods (45) inserted into the outer wall of the fixed cylinder (15), one end of the fixed rod (45) is fixedly connected to a second electromagnetic coil (46), the outer wall of the fixed cylinder (15) is fixedly connected to a heating ring (47), the inner wall of the heating ring (47) is fixedly connected to a plurality of second heat conducting plates (48), one side of the second heat conducting plate (48) is rotatably connected to a first external heating plate (49) and a second external heating plate (51), and one side of the first external heating plate (49) is rotatably connected to an external spring sheet (50).

10. The method for using a sealing gasket production device for semiconductor equipment according to claim 9, characterized in that: The following steps are involved: S1, preparation stage: the connecting pipe (29) and the bellows (25) are respectively connected to the air pump, the embryo of the sealing gasket is attached to one end of the rotating adsorption tube (33) on the rotating cylinder (16), the sealing gasket is adsorbed by the air pump, and the punching cylinder (11) is pushed to slide to the left, one end of the buffer rod (23) first contacts the sealing gasket, and the output shaft of the hydraulic cylinder (13) continues to move, pushing the first rotating plate (3) to rotate to one side, and through the linkage action of the linkage plate (5), the auxiliary plate (6) and the connecting plate (7), the second rotating plate (4) is rotated in the opposite direction, so that the sliding frame (8) is close to the second slide groove (12). S2, shearing stage: the first shearing knife (28) and the second shearing knife on the punching cylinder (11) shear off the inner circle and the outer circle of the sealing gasket, leaving only the annular portion of the sealing gasket, so as to make the edge of the sealing gasket neat, so that one end of the punching cylinder (11) and one end of the rotating cylinder (16) squeeze the sealing gasket and push it into the fixed cylinder (15), and the rotating cylinder (16) and the sliding cylinder (18) slide on the fixed shaft (17) to compress the pressure spring (19), so that the edge of the sealing gasket is located between the upper mounting groove (34) and the lower mounting groove (37). S3, processing stage: the edge of the sealing gasket is located between the upper mounting groove (34) and the lower mounting groove (37), the first inner heating plate (42) and the second inner heating plate (44) are pressed against the inner ring edge of the sealing gasket, the first electromagnetic coil (39) and the second electromagnetic coil (46) are started, and a changing magnetic field is generated, so that an electric current is generated inside the heating column (40) and the heating ring (47), so that the temperature of the heating column (40) and the heating ring (47) increases, and the sealing gasket rotates. The heating column (40) and the heating ring (47) heat and melt the inner ring of the sealing gasket evenly, and the inner ring cut is in a molten state, so that the temperature is reduced, and the inner ring surface of the sealing gasket is smooth, which increases the corrosion resistance of the sealing gasket. Similarly, the outer ring of the sealing gasket produces the same effect. S4, collection stage: the output shaft of the hydraulic cylinder (13) moves back, the punching cylinder (11) is separated from the rotating cylinder (16), the outer annular waste material falls into the first collection box (2), the sealing gasket is adsorbed on the rotating cylinder (16), the inner circular waste material is adsorbed on the buffer rod (23), and the circular waste material is dropped into the first collection box (2) by the air pump, and the sealing gasket on the rotating cylinder (16) is dropped into the second collection box, thereby achieving the effect of classifying and collecting the sealing gasket and waste material.

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