Chip tray transferring device and chip testing method

Abstract

The invention provides a chip tray transferring device and a chip testing method, and relates to the technical field of chip testing, the chip tray transferring device comprises at least one transferring structure, the transferring structure comprises a feeding mechanism, a feeding conveying mechanism, a turnover mechanism, a discharging conveying mechanism and a discharging mechanism, one side of the feeding conveying mechanism is provided with a first empty tray storage mechanism, and the other side of the feeding conveying mechanism is provided with a second empty tray storage mechanism; a second empty tray storage mechanism is arranged on one side of the discharge conveying mechanism; the mechanical arm is arranged above the material transferring structure, the mechanical arm can grab and move the empty material disc in the first empty material disc storage mechanism and buckle the empty material disc on the material carrying material disc on the feeding conveying mechanism, and the mechanical arm can grab and move the empty material disc on the discharging conveying mechanism and place the empty material disc in the second empty material disc storage mechanism; the problems that in the prior art, the material transferring process of chips between a non-metal material disc and a metal material disc is manually completed, time and labor are consumed, and the material transferring effect is poor are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip testing, and more specifically, relates to a chip tray transfer device and a chip testing method. Background Art

[0002] The reflow soldering (LAT) test step is an essential and important part of the integrated circuit factory (Final Test, FT) test process. Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computers are soldered to the circuit board through this process. There is a heating circuit inside this equipment, which heats the air or nitrogen to a high enough temperature and blows it to the circuit board with the components attached, so that the solder on both sides of the components melts and then bonds with the motherboard.

[0003] Therefore, in order to simulate the integrated circuit chip soldering process environment and ensure that the product is not damaged in the current process environment, a process step of simulating reflow soldering is added during the FT test.

[0004] The reflow process requires that the product must be placed in a high temperature environment of about 300 degrees. However, in the actual production process, the carriers that carry the chips all use ESD trays, which have a maximum temperature resistance of no more than 125 degrees and cannot withstand a high temperature environment of 300 degrees. Usually, the testing factory will place the chip on a metal tray for the reflow test step. The process of transferring the chip between the non-metallic tray and the metal tray is done manually by the operator, which is not only labor-intensive and inefficient, but also has low chip material safety. For example, the operator may touch the chip, and the chip may fall during the transfer process. Summary of the invention

[0005] The purpose of the present invention is to provide a chip tray transfer device and a chip testing method to address the deficiencies in the prior art, so as to solve the problem that the chip transfer process between a non-metallic tray and a metal tray in the prior art is manually completed, which is time-consuming and labor-intensive, and the transfer effect is poor.

[0006] In order to achieve the above object, the present invention provides a chip tray transfer device for transferring chips between a non-metal tray and a metal tray, comprising:

[0007] At least one material transfer structure, the material transfer structure includes a loading mechanism, a loading conveying mechanism, a flipping mechanism, a discharging conveying mechanism and a discharging mechanism, the loading mechanism is used for loading non-metallic trays with materials or metal trays with materials, a first empty tray storage mechanism is provided on one side of the loading conveying mechanism, a second empty tray storage mechanism is provided on one side of the discharging conveying mechanism, one of the first empty tray storage mechanism and the second empty tray storage mechanism is used for storing empty metal trays, and the other is used for storing empty non-metal trays;

[0008] At least one robot is arranged above the material transfer structure, the robot can grab and move the empty trays in the first empty tray storage mechanism and buckle them on the material tray with material on the loading conveyor mechanism, and the robot can grab and move the empty trays on the discharging conveyor mechanism and place them in the second empty tray storage mechanism.

[0009] Optionally, two material transfer structures are provided, the two material transfer structures are arranged side by side, and are respectively used to transfer the chips on the non-metal material tray with material to the empty metal material tray and to transfer the chips on the metal material tray with material to the empty non-metal material tray.

[0010] Optionally, the feeding mechanism includes four first columns, which form a feeding space, and the feeding space can accommodate a plurality of stacked material trays. A accommodating space is provided below the feeding space, and the accommodating space can accommodate at least one of the material trays to pass vertically. A first outlet is provided on the side of the accommodating space close to the flipping mechanism, and the first outlet can accommodate at least one of the material trays to pass horizontally. A first lifting plate is liftably provided in the accommodating space, and retractable separation blocks are provided on both sides of the lower end of the feeding space, and the separation blocks are used to be inserted into the slots on the outer walls of the material trays.

[0011] Optionally, a fool-proofing protrusion protruding toward the loading space is provided on a side of one of the four first columns close to the loading space, and a magnetic sensor and a photoelectric sensor are provided below the loading space.

[0012] Optionally, the loading conveyor mechanism extends from the bottom of the loading mechanism toward the flipping mechanism, the conveyor mechanism includes a first conveyor belt, and is used to convey the material tray. A first liftable limit plate is provided on one side of the loading conveyor mechanism near the flipping mechanism. The first limit plate is used to prevent the material tray from being conveyed toward the flipping mechanism, and is used to limit the empty tray buckled on the material tray.

[0013] Optionally, the flipping mechanism includes a vertically arranged rotating disk, an end of the rotating disk close to the feeding conveying mechanism is provided with an open groove, the open groove can accommodate a material tray with a material tray fastened with an empty material tray, a movable clamping block is provided on one side of the open groove, the clamping block is used to clamp the material tray with a material tray fastened with an empty material tray in the open groove, the rotating disk is connected to a driving mechanism, and the driving mechanism is used to drive the rotating disk to rotate.

[0014] Optionally, the discharging mechanism includes four second columns, and the four second columns form a discharging space. The loading space can accommodate a plurality of stacked material trays, and a channel that can accommodate at least one of the material trays is formed between two of the second columns. A second lifting plate is liftably arranged below the discharging space, and support components are relatively arranged on both sides of the lower end of the discharging space. The support component includes a supporting ear and a supporting block, one end of the supporting block is rotatably connected to the upper end of the supporting ear, and the supporting block is a wedge-shaped structure. In a natural state, the supporting block and the supporting ear form an L-shape, and the upper surface of the support block is a supporting plane, and the lower surface is a guiding inclined surface.

[0015] Optionally, the discharging conveying mechanism extends from the bottom direction of the discharging mechanism towards the flipping mechanism, and the discharging conveying mechanism includes a second conveyor belt. A second liftable limiting plate is arranged near the discharging mechanism, and the second limiting plate is used to limit the material tray with material and the empty material tray buckled thereon.

[0016] Optionally, two manipulators are provided, namely the first manipulator and the second manipulator, the first manipulator and the second manipulator are respectively installed on both sides of the support frame through the first moving mechanism and the second moving mechanism, the first manipulator is an adsorption manipulator, and the second manipulator is a gripper manipulator, the first manipulator is used to grab and move the empty trays in the first empty tray storage mechanism, and buckle them on the material tray with materials on the loading conveyor mechanism, and the second manipulator is used to grab and move the empty trays on the discharging conveyor mechanism, and place them in the second empty tray storage mechanism.

[0017] The present invention also provides a chip testing method, using the above chip tray transfer device, comprising:

[0018] Place the non-metallic tray with material and the empty metal tray in the loading mechanism and the first empty tray storage mechanism respectively;

[0019] Loading a non-metallic material tray with material to a loading conveying mechanism through a loading mechanism, and conveying the non-metallic material tray with material to a first set position through the loading conveying mechanism;

[0020] Grab the empty metal tray in the first empty tray storage mechanism by using a robot, move it to a first set position and buckle it on the non-metal tray with material;

[0021] The non-metal material tray with material buckled with the empty metal material tray is conveyed to the turning mechanism through the feeding conveying mechanism, and turned 180° through the turning mechanism;

[0022] The metal tray with material and the empty non-metal tray formed after flipping are conveyed to the second set position by the discharging conveying mechanism;

[0023] Grab the empty non-metallic tray by a robot and move it to a second empty tray storage mechanism;

[0024] The metal tray with material is conveyed to the discharging mechanism through the discharging conveying mechanism;

[0025] Take out the metal tray with material in the discharging mechanism and perform a reflow test on the chips in it.

[0026] The present invention provides a chip tray transfer device and a chip testing method, and its beneficial effects are: the transfer structure of the chip tray transfer device has a loading mechanism, a loading conveyor mechanism, a flipping mechanism, a discharging conveyor mechanism and a discharging mechanism, and has a first empty tray storage mechanism and a second empty tray storage mechanism, the loading mechanism can load the tape tray, so that the tape tray can be conveyed by the loading conveyor mechanism, and when it is conveyed to the first set position, the empty tray in the first empty tray storage mechanism can be grasped and moved by a manipulator, and buckled onto the tape tray on the loading conveyor mechanism, so that the tape tray and the chip material carried therein are buckled by the empty tray, for example, when the chip on the tape non-metal tray is transferred to the metal tray, the metal tray is buckled on the tape non-metal tray, and under the conveying action of the loading conveyor mechanism, the tape non-metal tray buckled with the empty metal tray enters the flipping mechanism, and is flipped by the flipping mechanism. The transfer mechanism is flipped, so that the non-metallic tray with material originally at the bottom becomes an empty non-metallic tray, and the empty metal tray originally at the top becomes a metal tray with material, and then it is conveyed to the second set position through the conveyor mechanism of the discharge conveyor. At this time, the empty non-metallic tray on the discharge conveyor mechanism can be grabbed and moved by the robot arm, and placed in the second empty tray storage mechanism, and then the transferred metal tray with material is conveyed to the discharge mechanism through the conveyor mechanism of the discharge conveyor. In this way, the transfer of the chip from the non-metallic tray with material to the empty metal tray is completed. The chip tray transfer device makes the entire transfer process mechanized and highly automated, replaces the manual transfer of operators, reduces manpower consumption, improves work efficiency, and the operators do not touch the chip materials throughout the process. At the same time, mechanized operation overcomes human errors and can effectively improve the safety of the chip transfer process.

[0027] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, wherein like reference numerals generally represent like components throughout the exemplary embodiments of the present invention.

[0029] Figure 1 A schematic diagram of the overall three-dimensional structure of a chip tray transfer device according to an embodiment of the present invention is shown.

[0030] Figure 2 A schematic diagram of the front structure of a chip tray transfer device according to an embodiment of the present invention is shown.

[0031] Figure 3 A schematic side structural view of a chip tray transfer device according to an embodiment of the present invention is shown.

[0032] Figure 4 A schematic diagram of the top view of a chip tray transfer device according to an embodiment of the present invention is shown.

[0033] Figure 5 A schematic top view of the structure of a loading mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0034] Figure 6 A three-dimensional structural schematic diagram of a loading mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0035] Figure 7 A schematic structural diagram of a loading and conveying mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0036] Figure 8 A schematic structural diagram of a material discharging mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0037] Fig. 9 A schematic structural diagram of a material discharging mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0038] Fig.10 A structural schematic diagram from one perspective of a flipping mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0039] Fig.11 A schematic structural diagram from another perspective of a flipping mechanism of a chip tray transfer device according to an embodiment of the present invention is shown.

[0040] Fig.12A schematic structural diagram of a first manipulator of a chip tray transfer device according to an embodiment of the present invention is shown.

[0041] Fig.13 A schematic structural diagram of a second manipulator of a chip tray transfer device according to an embodiment of the present invention is shown.

[0042] Fig.14 A flow chart of a chip testing method according to an embodiment of the present invention is shown.

[0043] Description of reference numerals:

[0044] 1. Loading mechanism; 2. Loading conveying mechanism; 3. Turning mechanism; 4. Discharging conveying mechanism; 5. Discharging mechanism; 6. First empty tray storage mechanism; 7. Second empty tray storage mechanism; 8. Frame; 9. Support frame; 10. First column; 11. First lifting plate; 12. Separation block; 13. First cylinder; 14. Anti-fool bump; 15. Magnetic sensor; 16. Photoelectric sensor; 17. First conveyor belt; 18. First limit plate; 19. First driving wheel; 20. Third cylinder Cylinder; 21. rotating disk; 22. opening slot; 23. pressing block; 24. fourth cylinder; 25. second drive motor; 26. belt; 27. second column; 28. second lifting plate; 29. ​​supporting ear; 30. supporting block; 31. fifth cylinder; 32. second conveyor belt; 33. first manipulator; 34. second manipulator; 35. first moving mechanism; 36. second moving mechanism; 37. extension bracket; 38. control unit; 39. second limit plate; 40. sixth cylinder. DETAILED DESCRIPTION

[0045] The preferred embodiments of the present invention will be described in more detail below. Although the preferred embodiments of the present invention are described below, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0046] like Figures 1 to 4 As shown, the present invention provides a chip tray transfer device, which is used for transferring chips between a non-metal tray and a metal tray, comprising:

[0047] At least one material transfer structure, the material transfer structure includes a loading mechanism 1, a loading conveying mechanism 2, a turning mechanism 3, a discharging conveying mechanism 4 and a discharging mechanism 5, the loading mechanism 1 is used for loading non-metallic trays with materials or metal trays with materials, a first empty tray storage mechanism 6 is provided on one side of the loading conveying mechanism 2, a second empty tray storage mechanism 7 is provided on one side of the discharging conveying mechanism 4, one of the first empty tray storage mechanism 6 and the second empty tray storage mechanism 7 is used for storing empty metal trays, and the other is used for storing empty non-metal trays;

[0048] At least one robot is arranged above the material transfer structure. The robot can grab and move the empty trays in the first empty tray storage mechanism 6 and buckle them on the material tray with material on the loading conveyor mechanism 2. The robot can grab and move the empty trays on the discharging conveyor mechanism 4 and place them in the second empty tray storage mechanism 7.

[0049] Specifically, in order to solve the problem that the chip transfer process between the non-metallic material tray and the metal material tray in the prior art is completed manually, which is time-consuming and labor-intensive, and the transfer effect is not good; the transfer structure of the chip material tray transfer device provided by the present invention has a loading mechanism 1, a loading conveyor mechanism 2, a flipping mechanism 3, a discharging conveyor mechanism 4 and a discharging mechanism 5, and a first empty material tray storage mechanism 6 and a second empty material tray storage mechanism 7. The loading mechanism 1 can load the material tray with material, so that the material tray with material can be conveyed by the loading conveyor mechanism 2. When it is conveyed to the first set position, the empty material tray in the first empty material tray storage mechanism 6 can be grasped and moved by a manipulator, and buckled onto the material tray with material on the loading conveyor mechanism 2, so that the material tray with material and the chip material carried therein are buckled by the empty material tray. For example, when the chip on the non-metallic material tray with material is transferred to the metal material tray, the metal material tray is buckled on the non-metallic material tray with material. Under the conveying action of the loading conveyor mechanism 2, the empty metal material is buckled The non-metallic tray with material on the tray enters the flipping mechanism 3 and is flipped by the flipping mechanism 3, so that the non-metallic tray with material originally at the bottom becomes an empty non-metallic tray, and the empty metal tray originally at the top becomes a metal tray with material, and then is conveyed to the second set position through the conveyor mechanism 4. At this time, the empty non-metallic tray on the discharge conveyor mechanism 4 can be grabbed and moved by the manipulator, and placed in the second empty tray storage mechanism 7, and then conveyed by the discharge conveyor mechanism 4, the metal tray with material after transfer is conveyed to the discharge mechanism 5, so that the transfer of chips from the non-metallic tray with material to the empty metal tray is completed. The chip tray transfer device makes the entire transfer process mechanized and highly automated, replaces the manual transfer of operators, reduces manpower consumption, improves work efficiency, and the operators do not touch the chip materials throughout the process. At the same time, mechanized operation overcomes human errors and can effectively improve the safety of the chip transfer process.

[0050] In this embodiment, a frame 8 is also included, and the frame 8 is used to support the chip tray transfer device. The frame 8 includes supporting feet, a platform, and a support frame 9 arranged on the upper side of the middle of the platform.

[0051] Optionally, two material transfer structures are provided, the two material transfer structures are arranged side by side, and are respectively used to transfer the chips on the non-metal material tray with material to the empty metal material tray and to transfer the chips on the metal material tray with material to the empty non-metal material tray.

[0052] Specifically, considering that the chip on the non-metallic tray with material needs to be transferred to the empty metal tray before the reflow soldering test, and the chip on the metal tray with material needs to be transferred to the empty non-metallic tray after the test, two transfer structures are arranged side by side. The two transfer structures can work at the same time, respectively used to transfer the chip on the non-metallic tray with material to the empty metal tray and to transfer the chip on the metal tray with material to the empty non-metallic tray, working in two lines to improve work efficiency.

[0053] Optionally, the feeding mechanism 1 includes four first columns 10, which form a feeding space. The feeding space can accommodate multiple stacked material trays. A accommodating space is provided below the feeding space, which can accommodate at least one material tray to pass vertically. A first outlet is provided on the side of the accommodating space close to the flipping mechanism 3, which can accommodate at least one material tray to pass horizontally. A first lifting plate 11 is liftably provided in the accommodating space, and retractable separation blocks 12 are provided on both sides of the lower end of the feeding space. The separation blocks 12 are used to insert into the slots on the outer walls of the material trays.

[0054] Specifically, Figure 5 and Figure 6As shown, the four first columns 10 form a guide bracket for the material tray with material, and multiple material trays with material can be stacked in the loading space, so that multiple material trays with material can be stored in the loading space, so that there is no need to manually put in a material tray with material each time, thereby improving the continuity and efficiency of work; the material tray with material in the loading space can move downward, enter the accommodating space, and fall onto the loading conveyor mechanism 2, and the loading conveyor mechanism 2 is used for loading; at the same time, due to the arrangement of the first lifting plate 11 and the retractable separation card block 12, the loading mechanism 1 can realize single discharging. In the initial state, multiple stacked material trays with material are placed on the retractable The upper side of the separation card block 12 that comes out, when discharging, the first lifting plate 11 is first lifted, and the multiple material trays with materials are pushed upward. At this time, the separation card block 12 can be retracted, and then the first lifting plate 11 drives the multiple material trays with materials to descend, so that the grooves on the outer side walls of the adjacent material trays on the upper side of the lowest material tray are aligned with the separation card block 12, and then the separation card block 12 extends out and is inserted into the groove to fix the second material tray from the bottom and separate the lowest material tray with materials. As the first lifting plate 11 descends, the lowest material tray with materials descends to the loading conveyor mechanism 2 and is conveyed by the loading conveyor mechanism 2.

[0055] In this embodiment, the cross-sections of the four first columns 10 are all L-shaped, and guide grooves are provided on the inner sides thereof, which can cooperate with the four corners of the material tray and play a guiding role therefor.

[0056] In this embodiment, the first lifting plate 11 is connected to a first cylinder 13 and is driven to rise and fall by the first cylinder 13, and the separation block 12 is connected to a second cylinder and is driven to extend and retract by the second cylinder.

[0057] Optionally, a fool-proofing protrusion 14 protruding toward the loading space is provided on one side of one of the four first columns 10 close to the loading space, and a magnetic sensor 15 and a photoelectric sensor 16 are provided below the loading space.

[0058] Specifically, the shape of the anti-mistake protrusion 14 cooperates with the notch structure on one corner of the material tray with material, which can play an anti-mistake effect to avoid placing it in the wrong direction; the magnetic sensor 15 can detect whether the material tray with material placed in the loading space is a metal material tray or a non-metallic material tray with material, which can play an anti-mistake effect to avoid placing the wrong type of material tray; the photoelectric sensor 16 can detect whether there is a material tray with material in the loading space, and only when there is a material tray with material, the material transfer structure can operate.

[0059] In this embodiment, the non-metallic tray is an ESD tray, and the switch state of the magnetic sensor 15 is set to a normally closed input. When the magnetic sensor 15 detects that there is a tray, if the state of the magnetic sensor 15 is open, it proves that the tray is wrong.

[0060] Optionally, the loading conveyor mechanism 2 extends from the bottom direction of the loading mechanism 1 towards the flipping mechanism 3, and the conveying mechanism includes a first conveyor belt 17, and is used to convey the material tray. A liftable first limit plate 18 is provided on one side of the loading conveyor mechanism near the flipping mechanism 3. The first limit plate 18 is used to prevent the material tray from being conveyed towards the flipping mechanism 3, and is used to limit the empty tray buckled on the material tray.

[0061] Specifically, a part of the conveying mechanism is located below the loading mechanism 1, and the other part extends in the direction close to the flipping mechanism 3. The first limit plate 18 can be raised and lowered on the conveying path of the material tray with material. When the first limit plate 18 is extended, it can limit the material tray with material so that it stays in the first set position and waits for the empty material tray to be buckled. It can also provide a limit for the empty material tray when the robot buckles the empty material tray onto the material tray with material to ensure accurate buckling.

[0062] In this embodiment, if Figure 7 As shown, the loading conveying mechanism 2 also includes a first driving mechanism for driving the first conveyor belt 17 to operate, and the first driving mechanism includes a first driving wheel 19, a first driven wheel, and a first driving motor.

[0063] In this embodiment, the first limiting plate 18 is connected to the third cylinder 20 and is driven to rise and fall by the third cylinder 20 .

[0064] Optionally, the flipping mechanism 3 includes a vertically arranged rotating disk 21, and an opening groove 22 is provided at one end of the rotating disk 21 close to the loading and conveying mechanism 2, and the opening groove 22 can accommodate a material tray with a material tray with an empty material tray. A movable clamping block 23 is provided on one side of the opening groove 22, and the clamping block 23 is used to clamp the material tray with an empty material tray in the opening groove 22. The rotating disk 21 is connected to a driving mechanism, and the driving mechanism is used to drive the rotating disk 21 to rotate.

[0065] Specifically, Fig.10 and Fig.11 As shown, before material transfer, the open slot 22 on the rotating disk 21 faces the direction of the loading conveyor mechanism 2, and the loading conveyor mechanism 2 transfers the material tray with the empty material tray buckled to the open slot 22, and is pressed by the clamping block 23 to ensure its stability in the open slot 22. When transferring materials, the driving mechanism drives the rotating disk 21 to rotate, so that the material tray with the empty material tray buckled in the open slot 22 is flipped over until the chip transfer is completed.

[0066] In this embodiment, the rotating disks 21 are arranged in pairs, and a connecting block and a clamping block 23 are arranged between a pair of rotating disks 21. The clamping block 23 is connected to the fourth cylinder 24 and is driven to move by the fourth cylinder 24, thereby achieving the clamping of the material tray with the empty material tray.

[0067] In this embodiment, the driving mechanism includes a second driving motor 25, a belt 26 and a pulley.

[0068] Optionally, the discharging mechanism 5 includes four second columns 27, which form a discharging space. The loading space can accommodate multiple stacked material trays, and a channel that can accommodate at least one material tray is formed between two of the second columns 27. A second lifting plate 28 is liftably arranged below the discharging space, and support components are relatively arranged on both sides of the lower end of the discharging space. The support component includes a supporting ear 29 and a supporting block 30. One end of the supporting block 30 is rotatably connected to the upper end of the supporting ear 29. The supporting block 30 is a wedge-shaped structure. In the natural state, the supporting block 30 and the supporting ear 29 form an L-shape, and the upper surface of the supporting block 30 is a supporting plane, and the lower surface is a guiding inclined surface.

[0069] Specifically, Figure 8 and Fig. 9 As shown, the material tray with material transmitted by the discharge conveyor mechanism 4 can enter the bottom of the discharge space through the channel, and the material tray with material entering the discharge space is under the support block 30. Under the rising action of the second lifting plate 28, the material tray with material in the discharge space can be lifted up, and in the process of the material tray with material moving upward from the bottom of the support block 30, the inclined surface of the support block 30 can be pushed, so that the support block 30 rotates 90° until the material tray with material rises to a position exceeding the height of the support block 30. At this time, the support block 30 automatically returns to its natural state due to its own weight, and the support block 30 and the support ear 29 form an L-shaped state, and then the second lifting plate 28 is lowered into the well, which can drive the material tray with material to descend until the material tray with material falls on the upper side of the support plane of the support block 30 and is supported by the support block 30; for each material tray with material transmitted, the above-mentioned discharge process is repeated, so that multiple material trays with material can be stacked and stored in the discharge space, which is convenient for discharging multiple material trays with material at one time.

[0070] In this embodiment, the cross-sections of the two columns close to the flipping mechanism 3 among the four second columns 27 are rectangular, and a channel capable of accommodating the passage of the material tray is formed between the two. The cross-sections of the two columns away from the flipping mechanism 3 are L-shaped, and a limit for the material tray is formed between the two.

[0071] In this embodiment, the second lifting plate 28 is connected to a fifth cylinder 31 and is driven to rise and fall by the fifth cylinder 31 .

[0072] Optionally, the discharging conveying mechanism 4 extends from the bottom direction of the discharging mechanism 5 close to the flipping mechanism 3, and the discharging conveying mechanism 4 includes a second conveyor belt 32. The discharging conveying mechanism 4 is provided with a liftable second limiting plate 39 near the discharging mechanism 5, and the second limiting plate 39 is used to limit the material tray with material and the empty material tray buckled thereon.

[0073] Specifically, a portion of the second conveyor belt 32 of the discharging conveying mechanism 4 is located below the discharging mechanism 5, and the other portion extends in the direction close to the flipping mechanism 3. The specific structure of the discharging conveying mechanism 4 is similar to that of the loading conveying mechanism 2, and will not be repeated here; the second limiting plate 39 limits the material tray with the empty material tray after being flipped and transmitted by the second conveyor belt 32, so that it stays in the second set position. At this time, the manipulator can grab and move the empty material tray. The second limiting plate 39 can also serve as a limiting reference for the manipulator to take away the position of the empty material tray.

[0074] In this embodiment, the second limiting plate 39 is connected to the sixth cylinder 40 and is driven to rise and fall by the sixth cylinder 40 .

[0075] Optionally, two manipulators are provided, namely a first manipulator 33 and a second manipulator 34. The first manipulator 33 and the second manipulator 34 are respectively installed on both sides of the support frame 9 through a first moving mechanism 35 and a second moving mechanism 36. The first manipulator 33 is an adsorption manipulator, and the second manipulator 34 is a gripper manipulator. The first manipulator 33 is used to grab and move the empty trays in the first empty tray storage mechanism 6, and buckle it on the material tray with material on the loading conveyor mechanism 2. The second manipulator 34 is used to grab and move the empty trays on the discharging conveyor mechanism 4, and place them in the second empty tray storage mechanism 7.

[0076] Specifically, Fig.12 and Fig.13 As shown, the support frame 9 is a gate-shaped support, and a first moving mechanism 35 and a second moving mechanism 36 are arranged at its crossbeam. The first moving mechanism 35 and the second moving mechanism 36 can respectively drive the first manipulator 33 and the second manipulator 34 to move horizontally and vertically, thereby completing the first manipulator 33 and the second manipulator 34 to grasp and move the empty material tray.

[0077] In this embodiment, the first moving mechanism 35 includes a first transverse screw rod, a first transverse slider, a first vertical screw rod, a first vertical slider and a horizontal telescopic module, and the first manipulator 33 is installed on the horizontal telescopic module; the second moving mechanism 36 includes a second transverse screw rod, a second transverse slider, a second vertical screw rod, a second vertical slider, an extension bracket 37 and a first clamp and a second clamp movably arranged under the extension bracket 37.

[0078] In this embodiment, a control unit 38 is further included. The control unit 38 is electrically connected to the material transfer structure and the manipulator, and is used to control the operation of the chip tray material transfer device.

[0079] like Fig.14 As shown, the present invention also provides a chip testing method, using the above chip tray transfer device, comprising:

[0080] Place the non-metallic tray with material and the empty metal tray in the loading mechanism 1 and the first empty tray storage mechanism 6 respectively;

[0081] A non-metal material tray with material is loaded onto the loading conveying mechanism 2 through the loading mechanism 1, and the non-metal material tray with material is transferred to a first set position through the loading conveying mechanism 2;

[0082] Grab the empty metal tray in the first empty tray storage mechanism 6 by a robot, move it to a first set position and buckle it on the non-metal tray with material;

[0083] The non-metal material tray with the empty metal material tray is conveyed to the turning mechanism 3 by the feeding conveying mechanism 2, and turned 180° by the turning mechanism 3;

[0084] The metal tray with material and the empty non-metal tray formed after flipping are conveyed to the second set position by the discharge conveyor mechanism 4;

[0085] Grab the empty non-metallic tray by the robot and move it to the second empty tray storage mechanism 7;

[0086] The metal tray with material is conveyed to the discharging mechanism 5 through the discharging conveying mechanism 4;

[0087] The metal tray with material in the discharging mechanism 5 is taken out, and the chips therein are subjected to a reflow soldering test.

[0088] Specifically, the chip testing method enables the chip to be transferred between the non-metallic tray and the metal tray in a mechanized and highly automated manner during the reflow soldering test through the chip tray transfer device, replacing the manual transfer by operators, reducing manpower consumption, and improving work efficiency. The operators do not touch the chip materials throughout the process. At the same time, the mechanized operation overcomes human errors and can effectively improve the safety of the chip transfer process, thereby ensuring the safety and accuracy of the test.

[0089] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A chip tray transfer device, used for transferring chips between a non-metal tray and a metal tray, characterized in that: include: At least one material transfer structure, the material transfer structure includes a loading mechanism, a loading conveying mechanism, a flipping mechanism, a discharging conveying mechanism and a discharging mechanism, the loading mechanism is used for loading non-metallic trays with materials or metal trays with materials, a first empty tray storage mechanism is provided on one side of the loading conveying mechanism, a second empty tray storage mechanism is provided on one side of the discharging conveying mechanism, one of the first empty tray storage mechanism and the second empty tray storage mechanism is used for storing empty metal trays, and the other is used for storing empty non-metal trays; At least one robot is arranged above the material transfer structure, the robot can grab and move the empty trays in the first empty tray storage mechanism and buckle them on the material tray with material on the loading conveyor mechanism, and the robot can grab and move the empty trays on the discharging conveyor mechanism and place them in the second empty tray storage mechanism.

2. The chip tray transfer device according to claim 1, characterized in that: There are two material transfer structures, which are arranged side by side and are used to transfer chips on a non-metal material tray with material to an empty metal material tray and to transfer chips on a metal material tray with material to an empty non-metal material tray.

3. The chip tray transfer device according to claim 1, characterized in that: The feeding mechanism includes four first columns, which form a feeding space. The feeding space can accommodate a plurality of stacked material trays. A accommodating space is provided below the feeding space, which can accommodate at least one of the material trays to pass vertically. A first outlet is provided on the side of the accommodating space close to the flipping mechanism, which can accommodate at least one of the material trays to pass horizontally. A first lifting plate is liftably provided in the accommodating space, and retractable separation blocks are provided on both sides of the lower end of the feeding space, and the separation blocks are used to be inserted into the slots on the outer walls of the material trays.

4. The chip tray transfer device according to claim 3, characterized in that: A fool-proofing protrusion protruding toward the feeding space is arranged on a side of one of the four first columns close to the feeding space, and a magnetic sensor and a photoelectric sensor are arranged below the feeding space.

5. The chip tray transfer device according to claim 1, characterized in that: The loading conveyor mechanism extends from the bottom of the loading mechanism to the direction close to the flipping mechanism, and the conveyor mechanism includes a first conveyor belt, and is used to convey the material tray. A liftable first limit plate is provided on one side of the loading conveyor mechanism close to the flipping mechanism. The first limit plate is used to prevent the material tray from being conveyed in the direction close to the flipping mechanism, and is used to limit the empty material tray buckled on the material tray.

6. The chip tray transfer device according to claim 1, characterized in that: The flipping mechanism includes a vertically arranged rotating disk, an end of the rotating disk close to the feeding conveying mechanism is provided with an open groove, the open groove can accommodate a material tray with material buckled with an empty material tray, a side of the open groove is provided with a movable clamping block, the clamping block is used to clamp the material tray with material buckled with an empty material tray in the open groove, the rotating disk is connected to a driving mechanism, and the driving mechanism is used to drive the rotating disk to rotate.

7. The chip tray transfer device according to claim 1, characterized in that: The discharging mechanism includes four second columns, and the four second columns form a discharging space. The loading space can accommodate a plurality of stacked material trays, and a channel that can accommodate at least one of the material trays is formed between two of the second columns. A second lifting plate is liftably provided below the discharging space, and support components are relatively provided on both sides of the lower end of the discharging space. The support component includes a supporting ear and a supporting block, one end of the supporting block is rotatably connected to the upper end of the supporting ear, and the supporting block is a wedge-shaped structure. In a natural state, the supporting block and the supporting ear form an L-shape, and the upper surface of the support block is a supporting plane, and the lower surface is a guiding inclined surface.

8. The chip tray transfer device according to claim 1, characterized in that: The discharging conveying mechanism extends from the bottom direction of the discharging mechanism towards the flipping mechanism, and the discharging conveying mechanism includes a second conveyor belt. A second liftable limiting plate is arranged near the discharging mechanism, and the second limiting plate is used to limit the material tray with material and the empty material tray buckled thereon.

9. The chip tray transfer device according to claim 1, characterized in that: The robot is provided with two, namely the first robot and the second robot, the first robot and the second robot are respectively installed on both sides of the support frame through the first moving mechanism and the second moving mechanism, the first robot is an adsorption robot, and the second robot is a gripper robot, the first robot is used to grab and move the empty tray in the first empty tray storage mechanism, and buckle it on the material tray with material on the loading conveyor mechanism, and the second robot is used to grab and move the empty tray on the discharging conveyor mechanism, and place it in the second empty tray storage mechanism.

10. A chip testing method, using the chip tray transfer device according to any one of claims 1 to 9, characterized in that: include: Place the non-metallic tray with material and the empty metal tray in the loading mechanism and the first empty tray storage mechanism respectively; Loading a non-metallic material tray with material to a loading conveying mechanism through a loading mechanism, and conveying the non-metallic material tray with material to a first set position through the loading conveying mechanism; Grab the empty metal tray in the first empty tray storage mechanism by using a robot, move it to a first set position and buckle it on the non-metal tray with material; The non-metal material tray with material buckled with the empty metal material tray is conveyed to the turning mechanism through the feeding conveying mechanism, and turned 180° through the turning mechanism; The metal tray with material and the empty non-metal tray formed after flipping are conveyed to the second set position by the discharging conveying mechanism; Grab the empty non-metallic tray by a robot and move it to a second empty tray storage mechanism; The metal tray with material is conveyed to the discharging mechanism through the discharging conveying mechanism; Take out the metal tray with material in the discharging mechanism and perform a reflow test on the chips in it.

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