Process for bonding and gluing between micro-thruster array charging chamber and ignition chip layer

Abstract

The invention relates to a process for bonding and gluing between a micro-thruster array charging chamber and an ignition chip layer. Comprising the following steps: preparing an epoxy resin powder chamber, an ignition chip, a gluing positioning mold, an ignition chip positioning mold and a mask; placing an epoxy resin powder chamber in a gluing positioning mold, and covering the epoxy resin powder chamber with a mask; the bottom of the gluing positioning mold is placed on a vacuum adsorption platform; dispersing and dispensing bonding glue on the mask, blade-coating the bonding glue, sucking the bonding glue into the window under the action of a vacuum pump, and separating the epoxy resin powder chamber distributed with the bonding glue from the mold; and the vacuum pump is closed, the mask is uncovered, the ignition chip is covered with the ignition chip positioning mold, the ignition chip is positioned, and the ignition chip provided with the positioning mold is covered with the powder chamber. The mask is used for controlling the gluing area and the gluing amount, and the mold is used for controlling the relative distribution positions of the powder chamber and the chip ignition bridge.

Description

Technical Field

[0001] The invention belongs to the field of micro-thrusters, and in particular relates to a process for bonding and gluing between charge chambers of a micro-thruster array and ignition chips. Background Art

[0002] For the traditional micro-thruster array processing technology, for example, the distance between the ignition bridges of densely distributed ignition chips is small. It is often impossible to control the distribution and amount of bonding glue, which causes the bonding glue to cover the ignition bridge in the subsequent process, resulting in ignition failure. In addition, in order to circumvent the problems caused by the dense distribution of ignition bridges, some processes choose to distribute the ignition bridges at a large distance, which will sacrifice the number of combustion chambers in the micro-thruster array. These problems are caused by the inability to effectively control the distribution of glue, the inability to effectively control the amount of glue, and the inability to effectively control the relative position of the chamber and the chip. Summary of the invention

[0003] The purpose of the present invention is to provide a process for bonding and gluing between a micro-thruster array charge chamber and an ignition chip layer.

[0004] The technical solution to achieve the purpose of the present invention is: a process for bonding and gluing between the charge chamber of a micro-thruster array and the ignition chip layer, comprising the following steps:

[0005] Step (1): preparing an epoxy resin chamber and an ignition chip: wherein overflow grooves connected in a vertical and horizontal manner are provided on both surfaces of the epoxy resin chamber, and the overflow grooves are formed in a "mouth" shape at the periphery of each perforation;

[0006] Step (2): preparing a glue coating positioning mold and an ignition chip positioning mold: the glue coating positioning mold is used to position the epoxy resin chamber, and the ignition chip positioning mold is used to position the ignition chip and the epoxy resin chamber;

[0007] Step (3): preparing a steel sheet mask: the openings on the steel sheet mask are matched with the holes on the epoxy resin chamber;

[0008] Step (4): placing the epoxy resin chamber in the glue coating positioning mold, and covering the epoxy resin chamber with a steel sheet mask; placing the bottom of the glue coating positioning mold on a vacuum adsorption platform, and adsorbing the mask on the epoxy resin chamber under the action of the vacuum adsorption platform;

[0009] Step (5): applying the bonding glue on the mask in a dispersed manner and scraping the bonding glue, the bonding glue is sucked into the window under the action of a vacuum pump, and the epoxy resin chamber with the bonding glue is separated from the mold;

[0010] Step (6): turn off the vacuum pump, remove the mask, cover the ignition chip with the ignition chip positioning mold, the ignition chip is positioned, and cover the chamber obtained in step (5) on the ignition chip equipped with the positioning mold to achieve bonding between the chamber and the ignition chip layer.

[0011] Furthermore, the depth of the overflow groove in step (1) is 0.1-0.15 mm.

[0012] Furthermore, the glue coating and positioning mold in step (2) is a rectangular metal block with a square cross section and three layers of inlaid transparent windows;

[0013] The first layer of transparent windows has the smallest area and penetrates the glue coating positioning mold. Its area is smaller than the area of ​​the surface of the epoxy resin chamber to be coated with glue. The first layer of transparent windows is used to connect the vacuum pump; the second layer is the epoxy resin chamber inlay groove, which has a larger area than the first layer of transparent windows. Its length and width are 0.15-0.25mm larger than the length and width of the epoxy resin chamber, and its thickness is equal to the thickness of the epoxy resin chamber; the third layer is the mask inlay groove, which has a length and width that are 0.05-0.15mm larger than the length and width of the mask, and its thickness is equal to the thickness of the mask.

[0014] Furthermore, the ignition chip positioning mold in step (2) is a rectangular metal block with a square cross section and two layers of inlaid transparent windows;

[0015] The first layer is the epoxy resin chamber inlaid window, which has the smallest area and penetrates the ignition chip positioning mold. The length and width are 0.15-0.25mm larger than the epoxy resin chamber. The second layer is the ignition chip inlaid groove, which is larger than the ignition chip and has a length and width of 0.15-0.25mm larger than the ignition chip.

[0016] Furthermore, the thickness of the mask in step (3) is 0.1±0.05 mm.

[0017] Furthermore, the position of the epoxy resin chamber perforation in the steel sheet mask in step (3) is a perforated steel sheet area larger than the cross-sectional area of ​​the perforation, and a large rectangular window area shorter than the diameter of the perforation is opened at the position corresponding to each overflow groove on the periphery of the mask perforated steel sheet area, an inclined small rectangular window area is set between the two orthogonal large rectangular window areas, and a square window is opened at the position corresponding to the midpoint of the adjacent perforation.

[0018] Furthermore, the method for preparing the steel sheet mask in step (3) is laser engraving or corrosion engraving.

[0019] Compared with the prior art, the present invention has the following significant advantages:

[0020] 1. The present invention can effectively control the glue coating position on the medicine chamber wall, that is, it can effectively ensure that there is bonding glue in the appropriate area on the medicine chamber, and can also ensure that there is no bonding glue in the hole chamber part of the medicine chamber.

[0021] 2. The present invention can effectively control the amount of glue coating, which can ensure sufficient amount of medicine to ensure that the medicine chamber and the chip are firmly bonded, there are no gaps between the medicine holes, and no cross-fire occurs, and it can also prevent excessive medicine from covering the ignition bridge in the ignition area.

[0022] 3. The present invention can effectively control the relative position of the chip and the ignition chip, and the hole chamber of the chamber and the ignition bridge are aligned one by one. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the positioning mold, mask and chamber used in the present invention; wherein (a) is the glue coating positioning mold, (b) is the ignition chip positioning mold, (c) is the steel sheet mask, and (d) is the epoxy resin chamber.

[0024] Figure 2 Schematic diagram of the product obtained by the process of the present invention; wherein (a) is Example 1, (b) is Example 2, and (3) is Example 3. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0026] A process for bonding and coating between the charge chamber and the ignition chip layer of a micro-thruster array uses two molds and a mask to accurately and cost-effectively achieve bonding and scraping alignment between the charge chamber and the ignition layer. It can reliably achieve uniform coating, no residue in the hole chamber, no colloid coverage in the ignition bridge area, and fine alignment.

[0027] The device adopted in the process of the invention comprises an epoxy resin chamber, a stainless steel mask, a glue coating positioning mold and an ignition chip positioning mold.

[0028] The epoxy resin chamber structure is a cubic structure with a certain thickness and a series of perforations. The distribution of the perforations is designed according to the distribution of the ignition bridge on the ignition chip, such as Figure 2 (a)(b)(c) As shown. Each perforation on the upper and lower surfaces of the epoxy resin chamber is wrapped by a "mouth"-shaped groove with a certain depth, and all grooves have the same cross-linking, such as Figure 1 (d) is shown. The groove is called "overflow groove". The "mouth" frame structure composed of the overflow groove wraps each hole chamber. The depth of the overflow groove is between 0.1-0.15mm. The function of the overflow groove is to accommodate excess bonding glue to prevent excessive bonding glue from covering the ignition bridge.

[0029] The mask structure is a stainless steel sheet with a thickness of only 0.1mm. It is designed according to the epoxy resin structure and has a window area and a stainless steel covering area. The window area is distributed around the perforation and on the "mouth" overflow groove, such as Figure 1(c) shows the stainless steel cover area covering all the perforations and having an area larger than the perforations. Its function is to scrape the bonding adhesive on a specific area of ​​the epoxy resin chamber wall.

[0030] The glue coating positioning mold structure is a metal rectangular body with a window, such as Figure 1 (a) is shown. It has three layers of inlaid transparent windows. The first layer is a transparent window. It has the smallest area and penetrates the entire glue coating positioning mold. Its surface is smaller than the epoxy resin chamber. Its function is to connect the vacuum pump and facilitate the removal of the epoxy resin chamber. The second layer is an epoxy resin inlay groove. Its area is larger than the first layer of transparent windows. Its size is compared with the epoxy resin chamber. Its length and width are 0.2mm larger than the epoxy resin chamber. Its height is consistent with the height of the epoxy resin chamber. Its function is to inlay the epoxy resin chamber. The third layer is a mask inlay groove. Its size is compared with the stainless steel mask. Its length and width are 0.1mm larger than the stainless steel mask. Its height is consistent with the stainless steel mask. Its function is to inlay and position the stainless steel mask. The glue coating positioning mold can fix the chamber. The mask area is larger than the chamber area. The mask area is in the same plane as the medicine after placement. The mask area can fix the mask. This design makes the relative position of the chamber and the mask fixed and in close contact.

[0031] The ignition chip positioning mold structure is a metal rectangular body with a window, such as Figure 1 (b) As shown. There are two layers of inlaid transparent windows. The first layer is the chamber placement transparent window. It has the smallest area and penetrates the entire ignition chip positioning mold. Compared with the epoxy resin chamber, the length and width are 0.2mm larger than the epoxy resin chamber, and the function is to inlay the epoxy resin chamber. The second layer is the ignition chip inlay groove. Compared with the ignition chip, the length and width are 0.2mm larger than the ignition chip, and the function is to inlay the ignition chip.

[0032] Place the bottom of the glue-coated positioning mold on the vacuum adsorption platform, the mold is tightly adsorbed on the vacuum adsorption platform, the mask is tightly adsorbed on the epoxy resin chamber, and 0.5 ml of bonding glue is evenly dispersed and applied on the mask. Use a dust-free cotton swab to evenly scrape the bonding glue. Since there is no adhesive contact between the mask and the chamber, there is a gap, and the bonding glue is sucked into the window by the vacuum pump.

[0033] The openings of the mask are aligned with the chamber wall, and the metal areas of the mask are aligned with the chamber holes and the areas that do not require glue coating.

[0034] The second layer ignition chip inlay groove of the ignition chip positioning mold can fix the silicon-based chip ignition layer, and the ignition bridge area of ​​the chip is exposed. Since the size of the window area for placing the first layer of the mold's chamber is designed to accommodate the chamber, this design fixes the relative position of the ignition chip and the chamber.

[0035] The relative position of the ignition chip and the chamber is fixed, so the distribution of the chamber holes and the ignition bridge are aligned.

[0036] The steps of glue coating are as follows: 1. Clean the epoxy resin chamber thoroughly with clean water, soak it in anhydrous ethanol solvent for ultrasonic vibration for 20 minutes, and then place it in a 100°C oven for 30 minutes. 2. Place the epoxy resin chamber in the glue coating positioning mold (glue coating positioning mold), and cover the glue coating mask in the mask area of ​​the glue coating positioning mold. At this time, the mask steel sheet partially covers the hollow hole in the chamber, and the chamber wall is exposed in the window of the mask. 3. Place the bottom of the glue coating positioning mold on the vacuum adsorption platform, the mold is tightly adsorbed on the vacuum adsorption platform, and the mask is tightly adsorbed on the epoxy resin chamber. There is a weak airflow that can pass through the gap between the mask and the chamber, but the adsorption strength of the mask is not significantly affected. 4. Evenly spread 0.5ml of bonding glue on the mask, and use a dust-free cotton swab to evenly scrape the bonding glue. Due to the tiny gap between the mask and the chamber, the bonding glue is sucked into the window by the vacuum pump. 5. Turn off the vacuum pump and use tweezers to remove the mask. The bonding glue that can be seen is distributed on the surface of the chamber according to the shape of the window, but has not entered the chamber hole. 6. Cover the ignition chip positioning mold (ignition chip positioning mold) on the ignition layer chip. The chip is positioned, the large window is opened to expose the ignition part, and the chamber with the distributed bonding glue is gently covered on the chip.

[0037] The glue positioning mold fixes the relative position of the chamber and the mask, the mask fixes the glue position on the chamber, and the ignition chip positioning mold fixes the relative position of the chamber and the ignition chip.

[0038] Example 1

[0039] (1) Prepare a 3mm high chamber

[0040] According to the present invention, the height of the chamber is 2 mm, and the holes are distributed in 8×8. The fixed height of the chamber of the glue coating positioning mold is 2 mm, and the mask height is 0.1 mm.

[0041] (2) Bonding glue

[0042] The glue coating positioning mold fixes an 8×8, 2mm high chamber, and the mask covers the chamber to expose the glue coating area; (2) Use a vacuum pump to evenly coat the glue, and the bonding glue adheres to the exposed area. Use tweezers to remove the mask. The bonding glue can be seen distributed on the chamber surface according to the shape of the window, but has not entered the chamber hole. Take out the chamber; (3) Cover the ignition chip positioning mold on the ignition layer chip, and the chip is positioned; (4) Place the chamber in the window area of ​​the ignition chip positioning mold, and the chamber opening corresponds one by one to the chip ignition bridge; (5) Take out the chip and chamber.

[0043] Example 2

[0044] (1) Prepare a 3mm high chamber

[0045] According to the present invention, the chamber is processed with a height of 3 mm and a distribution of 8×8 holes. The fixed height of the chamber of the glue coating positioning mold is modified to 3 mm according to the change of the chamber height, and the mask height is 0.1 mm.

[0046] (2) Bonding glue

[0047] The glue coating positioning mold fixes an 8×8, 3mm high chamber, and the mask covers the chamber to expose the glue coating area; (2) Use a vacuum pump to evenly coat the glue, and the bonding glue adheres to the exposed area. Use tweezers to remove the mask. The bonding glue can be seen distributed on the chamber surface according to the shape of the window, but has not entered the chamber hole. Take out the chamber; (3) Cover the ignition chip positioning mold on the ignition layer chip, and the chip is positioned; (4) Place the chamber in the window area of ​​the ignition chip positioning mold, and the chamber opening corresponds one by one to the chip ignition bridge; (5) Take out the chip and chamber.

[0048] Example 3

[0049] (1) Prepare a 4mm high chamber

[0050] According to the present invention, the chamber is processed with a height of 4 mm and a 2×2 distribution of the holes. The fixed height of the chamber of the glue coating positioning mold is modified to 4 mm according to the change of the chamber height, and the mask height is 0.1 mm.

[0051] (2) Bonding glue

[0052] The glue coating positioning mold fixes a 2×2, 4mm high chamber, and the mask covers the chamber to expose the glue coating area; (2) Use a vacuum pump to evenly coat the glue, and the bonding glue adheres to the exposed area. Use tweezers to remove the mask. The bonding glue can be seen distributed on the chamber surface according to the shape of the window, but has not entered the chamber hole. Take out the chamber; (3) Cover the ignition chip positioning mold on the ignition layer chip, and the chip is positioned; (4) Place the chamber in the window area of ​​the ignition chip positioning mold, and the chamber opening corresponds to the chip ignition bridge one by one; (5) Take out the chip and chamber.

Claims

1. A process for bonding and gluing between a micro-thruster array charge chamber and an ignition chip layer, characterized in that: The steps include: Step (1): preparing an epoxy resin chamber and an ignition chip: wherein overflow grooves which are connected in a vertical and horizontal manner are provided on both surfaces of the epoxy resin chamber, and the overflow grooves are formed in a "mouth" shape at the periphery of each perforation; Step (2): preparing a glue coating positioning mold and an ignition chip positioning mold: the glue coating positioning mold is used to position the epoxy resin chamber, and the ignition chip positioning mold is used to position the ignition chip and the epoxy resin chamber; Step (3): preparing a steel sheet mask: the openings on the steel sheet mask are matched with the holes on the epoxy resin chamber; Step (4): placing the epoxy resin chamber in the glue coating positioning mold, and covering the epoxy resin chamber with a steel sheet mask; placing the bottom of the glue coating positioning mold on a vacuum adsorption platform, and adsorbing the mask on the epoxy resin chamber under the action of the vacuum adsorption platform; Step (5): applying the bonding glue on the mask in a dispersed manner and scraping the bonding glue, the bonding glue is sucked into the window under the action of a vacuum pump, and the epoxy resin chamber with the bonding glue is separated from the mold; Step (6): turn off the vacuum pump, remove the mask, cover the ignition chip with the ignition chip positioning mold, the ignition chip is positioned, and cover the chamber obtained in step (5) on the ignition chip equipped with the positioning mold to achieve bonding between the chamber and the ignition chip layer.

2. The process according to claim 1, characterized in that The depth of the overflow groove in step (1) is 0.1-0.15 mm.

3. The process according to claim 2, characterized in that The glue coating positioning mold in step (2) is a rectangular metal block with a square cross section and three layers of inlaid transparent windows; The first layer of transparent windows has the smallest area and penetrates the glue coating positioning mold. Its area is smaller than the area of ​​the surface of the epoxy resin chamber to be coated with glue. The first layer of transparent windows is used to connect the vacuum pump; the second layer is the epoxy resin chamber inlay groove, which has a larger area than the first layer of transparent windows. Its length and width are 0.15-0.25mm larger than the length and width of the epoxy resin chamber, and its thickness is equal to the thickness of the epoxy resin chamber; the third layer is the mask inlay groove, which has a length and width that are 0.05-0.15mm larger than the length and width of the mask, and its thickness is equal to the thickness of the mask.

4. The process according to claim 3, characterized in that The ignition chip positioning mold in step (2) is a rectangular metal block with two layers of inlaid transparent windows and a square cross-section; The first layer is the epoxy resin chamber inlaid window, which has the smallest area and penetrates the ignition chip positioning mold. The length and width are 0.15-0.25mm larger than the epoxy resin chamber. The second layer is the ignition chip inlaid groove, which is larger than the ignition chip and has a length and width of 0.15-0.25mm larger than the ignition chip.

5. The process according to claim 4, characterized in that The thickness of the mask in step (3) is 0.1±0.05 mm.

6. The process according to claim 5, characterized in that The position of the epoxy resin chamber perforation in the steel sheet mask in step (3) is a perforated steel sheet area larger than the cross-sectional area of ​​the perforation, and a large rectangular window area shorter than the diameter of the perforation is opened at the position corresponding to each overflow groove on the periphery of the mask perforated steel sheet area. An inclined small rectangular window area is set between the two orthogonal large rectangular window areas, and a square window is opened at the position corresponding to the midpoint of the adjacent perforation.

7. The process according to claim 1, characterized in that The method for preparing the steel sheet mask in step (3) is laser engraving or corrosion engraving.

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