Method for testing environmental stress cracking resistance and related device

Abstract

The invention discloses an environmental stress cracking resistance test method and a related device, and relates to the technical field of test.A relational expression of 50% cracking time of a polyethylene material under a test condition B in the GB / T 1842-2008 standard and 50% cracking time of the polyethylene material under the test condition of a high-temperature bending test method is constructed; and after obtaining the time of cracking 50% of the same batch of polyethylene material samples by adopting the high-temperature bending test method, substituting the time of cracking 50% of the same batch of polyethylene material samples into the relational expression, thereby calculating the time of cracking 50% of the same batch of polyethylene material samples under the test condition B in the GB / T 1842-2008 standard. And the test period is shortened while the test cost is not increased.

Description

Technical Field

[0001] The present application relates to the field of testing technology, and in particular to an environmental stress cracking resistance testing method and related devices. Background Art

[0002] In a floating power station on the water surface, the buoy is a supporting structure that supports system components, cables, junction boxes and related equipment. Its material is blow molding grade high-density polyethylene, processed by a single-layer or multi-layer extrusion blow molding machine, and is an integrated molding structure. Environmental stress crack resistance (ESCR) is a key technical indicator of the buoy material, which affects the life cycle of the buoy.

[0003] At present, for the blow molding grade high-density polyethylene in the water surface photovoltaic industry, the environmental stress cracking resistance test is generally based on the standard ASTM D 1693 (GB / T 1842-2008) polyethylene environmental stress cracking test method. The polyethylene material is compression molded into test pieces of different thicknesses, and 10 samples are taken as a group. A notch is made in the middle of the sample, and the sample is bent and placed in an active medium to induce cracking. The time for the polyethylene material to crack 50% is tested. However, this environmental stress cracking resistance test method has a long test cycle, generally requiring up to 1,000 hours. Summary of the invention

[0004] In view of the above problems, the present application provides an environmental stress cracking resistance test method and related devices to achieve the purpose of shortening the test cycle without increasing the test cost. The specific scheme is as follows: The first aspect of the present application provides an environmental stress cracking resistance testing method, comprising: Obtaining the time for 50% cracking of polyethylene material samples of the same batch after performing an environmental stress cracking resistance test on at least one batch of polyethylene material samples using a high temperature bending test method, wherein the constant temperature bath temperature in the high temperature bending test method is greater than 50° C., and other test conditions in the high temperature bending test method except the constant temperature bath temperature comply with test condition B in GB / T 1842-2008 standard, and the constant temperature bath temperature in the test condition B is 50° C.; Substitute the 50% cracking time of the polyethylene material samples from the same batch into the pre-constructed expression for the relationship between the 50% cracking time of the polyethylene material under the test condition B and the 50% cracking time of the polyethylene material under the experimental conditions of the high temperature bending test method, and calculate the 50% cracking time of the polyethylene material samples from the same batch under the test condition B.

[0005] In a possible implementation, the environmental stress cracking resistance testing method further includes: The time F for the polyethylene material to crack 50% under the test condition B is 50(h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 (h2) The relational expression InP = InA - Kt, where P is F 50 (h2) and F 50 (h1) ratio, t is F 50 (h2), A is the material constant, K is the reaction rate constant, InP = InA-Kt follows the kinetic equation; The time F for different polyethylene material samples to crack 50% under the test condition B is obtained respectively. 50 (h1) and the time F for 50% cracking under the experimental conditions of the high temperature bending test method 50 (h2); According to the F of different polyethylene material samples 50 (h1) and F 50 (h2) Calculate InP; InP and F of different polyethylene material samples 50 (h2) Linear fitting is performed to obtain InP and F 50 (h2) linear relationship expression; Based on InP and F 50 (h2) The linear relationship expression determines the parameters A and K.

[0006] In a possible implementation, the time F for the polyethylene material to crack 50% under the test condition B is 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 The relational expression InP = InA - Kt of (h2) includes: The relationship expression P=Aexp(-Kt) between the environmental stress cracking resistance retention rate P and the aging time t is constructed. P=Aexp(-Kt) follows the kinetic equation. The environmental stress cracking resistance retention rate P is F 50 (h2) and F 50 (h1) ratio, aging time t is F 50 (h2); Taking the logarithm of the relational expression P=Aexp(-Kt), we obtain InP=InA-Kt.

[0007] In a possible implementation, if the polyethylene material sample is a high-density polyethylene material, the constant temperature bath temperature in the high-temperature bending test method is 60°C.

[0008] A second aspect of the present application provides an environmental stress cracking resistance testing device, comprising: A cracking data acquisition module, used to acquire the time when 50% of the polyethylene material samples in the same batch crack after performing an environmental stress cracking resistance test on at least one batch of polyethylene material samples using a high-temperature bending test method, wherein the constant temperature bath temperature in the high-temperature bending test method is greater than 50° C., and other test conditions in the high-temperature bending test method except the constant temperature bath temperature comply with test condition B in GB / T 1842-2008 standard, and the constant temperature bath temperature in the test condition B is 50° C.; The cracking time calculation module is used to substitute the time when the polyethylene material samples of the same batch crack 50% into the pre-constructed relationship expression between the time when the polyethylene material cracks 50% under the test condition B and the time when the polyethylene material cracks 50% under the experimental conditions of the high temperature bending test method, and calculate the time when the polyethylene material samples of the same batch cracks 50% under the test condition B.

[0009] In a possible implementation, the environmental stress cracking resistance testing device further includes: Expression building block for building the time F at which the polyethylene material will crack 50% under the test condition B 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 (h2) The relational expression InP = InA - Kt, where P is F 50 (h2) and F 50 (h1) ratio, t is F 50 (h2), A is the material constant, K is the reaction rate constant, InP = InA-Kt follows the kinetic equation; The data acquisition module is used to obtain the time F of 50% cracking of different polyethylene material samples under the test condition B. 50 (h1) and the time F for 50% cracking under the experimental conditions of the high temperature bending test method 50 (h2); Data processing module for the analysis of the F 50 (h1) and F 50 (h2) Calculate InP and compare InP and F of different polyethylene material samples. 50 (h2) Linear fitting is performed to obtain InP and F 50 (h2) linear relationship expression; Expression solving module, used to calculate the expression according to InP and F 50 (h2) The linear relationship expression determines the parameters A and K.

[0010] In a possible implementation, the relationship building module is specifically used to build a relationship expression P=Aexp(-Kt) between the environmental stress cracking resistance retention rate P and the aging time t. P=Aexp(-Kt) follows the kinetic equation. The environmental stress cracking resistance retention rate P is F 50 (h2) and F 50 (h1) ratio, aging time t is F 50 (h2); Taking the logarithm of the relational expression P=Aexp(-Kt), we obtain InP=InA-Kt.

[0011] A third aspect of the present application provides a computer program product, comprising computer-readable instructions. When the computer-readable instructions are executed on an electronic device, the electronic device implements the environmental stress cracking resistance testing method of the first aspect or any implementation of the first aspect.

[0012] A fourth aspect of the present application provides an electronic device, comprising at least one processor and a memory connected to the processor, wherein: The memory is used to store computer programs; The processor is used to execute the computer program so that the electronic device can implement the environmental stress cracking resistance testing method of the first aspect or any implementation of the first aspect.

[0013] A fifth aspect of the present application provides a computer storage medium, which carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can implement the environmental stress cracking resistance testing method of the above-mentioned first aspect or any implementation of the first aspect.

[0014] By means of the above technical solution, the present application provides a method and related device for testing environmental stress cracking resistance, by pre-constructing a relational expression between the time when polyethylene material cracks 50% under test condition B in the ‌GB / T 1842-2008 standard and the time when polyethylene material cracks 50% under the experimental conditions of the high temperature bending test method, and obtaining the time when the same batch of polyethylene material samples cracks 50% after the environmental stress cracking resistance test is performed on at least one batch of polyethylene material samples using the high temperature bending test method, and then substituting the time when the same batch of polyethylene material samples cracks 50% into the above relational expression, thereby calculating the time when the same batch of polyethylene material samples cracks 50% under test condition B in the ‌GB / T 1842-2008 standard. Since the other test conditions except the constant temperature bath temperature in the high temperature bending test method meet the test condition B in the ‌GB / T 1842-2008 standard, and the constant temperature bath temperature in the high temperature bending test method is greater than the constant temperature bath temperature of the test condition B, the test cycle is shortened without increasing the test cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0016] Figure 1 A system architecture diagram provided for an embodiment of the present application; Figure 2 A schematic diagram of a terminal structure provided in an embodiment of the present application; Figure 3 A schematic diagram of a server structure provided in an embodiment of the present application; Figure 4 Schematic diagram of environmental stress cracking resistance test provided for this application; Figure 5 Schematic diagram of test conditions for environmental stress cracking resistance test provided for this application; Figure 6 A schematic diagram of a process for testing environmental stress cracking resistance provided in an embodiment of the present application; Figure 7 A linear fitting schematic diagram provided in an embodiment of the present application; Figure 8 A schematic structural diagram of an environmental stress cracking resistance testing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] In the following description, in order to ensure the accuracy of the citation and the fluency of reading, the key technical terms, abbreviations or abbreviations involved in the text are summarized and explained as follows: The following describes the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation method section of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0018] The embodiments of the present application are described below in conjunction with the accompanying drawings. Those skilled in the art will appreciate that, with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0019] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and need not be used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is only to describe the distinction mode adopted by the objects of the same attributes when describing in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0020] The present application can be applied in the field of testing. Taking the environmental stress cracking resistance test of polyethylene materials as an example, multiple application scenarios of the products will be introduced below.

[0021] First, the application scenario of this application is introduced.

[0022] This application can be applied to, but is not limited to, applications with environmental stress cracking resistance test functions or cloud services provided by cloud-side servers, etc., which are introduced below: The application program with the environmental stress cracking resistance test function can be installed in a terminal, and the terminal can be a mobile phone, a tablet computer, a wearable device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc. The user runs the application program, and after obtaining the 50% cracking time of the same batch of polyethylene material samples using the high temperature bending test method, the application program substitutes the 50% cracking time of the same batch of polyethylene material samples into the relationship expression between the 50% cracking time of the polyethylene material under the test condition B in the GB / T 1842-2008 standard and the 50% cracking time of the polyethylene material under the experimental conditions of the high temperature bending test method, thereby calculating the 50% cracking time of the same batch of polyethylene material samples under the test condition B in the GB / T 1842-2008 standard.

[0023] The cloud-side server may be one or more servers. The cloud service provided by the cloud-side server is used to obtain the 50% cracking time of the same batch of polyethylene material samples using the high-temperature bending test method, and then substitute the 50% cracking time of the same batch of polyethylene material samples into the relationship expression between the 50% cracking time of the polyethylene material under test condition B in the GB / T 1842-2008 standard and the 50% cracking time of the polyethylene material under the experimental conditions of the high-temperature bending test method, thereby calculating the 50% cracking time of the same batch of polyethylene material samples under test condition B in the GB / T 1842-2008 standard.

[0024] See also Figure 1 , Figure 1 A schematic diagram of a system architecture is shown. The system may include a terminal 100 and a server 200. The server 200 may include one or more servers ( Figure 1 In the example, a server is included, and the server 200 can provide the method provided in the embodiment of the present application for one or more terminals.

[0025] Among them, an application can be installed on the terminal 100, and the above application can provide an interface. The terminal 100 can receive relevant parameters entered by the user on the interface, such as the time for 50% cracking of the same batch of polyethylene material samples using a high-temperature bending test method, and send the above parameters to the server 200. The server 200 can obtain processing results based on the received parameters and return the processing results to the terminal 100.

[0026] It should be understood that in some optional implementations, the terminal 100 can also complete the action of obtaining the processing result based on the received parameters by itself without the cooperation of the server, and the embodiments of the present application are not limited to this.

[0027] Next describe Figure 1 The product form of the mid-terminal 100; The terminal 100 in the embodiment of the present application can be a mobile phone, a tablet computer, a wearable device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc., and the embodiment of the present application does not impose any limitation on this.

[0028] Figure 2 An optional hardware structure diagram of the terminal 100 is shown.

[0029] refer to Figure 2As shown, the terminal 100 may include a radio frequency unit 110, a memory 120, an input unit 130, a display unit 140, a camera 150 (optional), an audio circuit 160 (optional), a speaker 161 (optional), a microphone 162 (optional), an earphone jack 163 (optional), a processor 170, an external interface 180, a power supply 190 and other components. Those skilled in the art will appreciate that Figure 2 These are merely examples of terminals or multi-function devices and do not constitute limitations on the terminals, and may include more or fewer components than shown in the figure, or a combination of certain components, or different components.

[0030] The input unit 130 can be used to receive input digital or character information, and generate key signal input related to the user settings and function control of the terminal 100. Specifically, the input unit 130 may include a touch screen 131 (optional) and / or other input devices 132. The touch screen 131 can collect the user's touch operations on or near it (such as the user's operation on or near the touch screen using any suitable object such as fingers, joints, stylus, etc.), and drive the corresponding connection device according to a pre-set program. The touch screen can detect the user's touch action on the touch screen, convert the touch action into a touch signal and send it to the processor 170, and can receive and execute the command sent by the processor 170; the touch signal at least includes the touch point coordinate information. The touch screen 131 can provide an input interface and an output interface between the terminal 100 and the user. In addition, the touch screen can be implemented using multiple types such as resistive, capacitive, infrared and surface acoustic wave. In addition to the touch screen 131, the input unit 130 can also include other input devices. Specifically, other input devices 132 may include, but are not limited to, one or more of a physical keyboard, function keys (such as a volume control key, a switch key, etc.), a trackball, a mouse, a joystick, and the like.

[0031] Among them, the input device 132 can receive input data and the like.

[0032] The display unit 140 can be used to display information input by the user or information provided to the user, various menus of the terminal 100, interactive interfaces, file display and / or playback of any multimedia file. In the embodiment of the present application, the display unit 140 can be used to display the relevant interface of the environmental stress cracking resistance test method, processing results, etc.

[0033] The memory 120 can be used to store instructions and data. The memory 120 can mainly include an instruction storage area and a data storage area. The data storage area can store various data, such as multimedia files, texts, etc.; the instruction storage area can store software units such as operating systems, applications, instructions required for at least one function, or their subsets and extensions. It can also include a non-volatile random access memory; provide the processor 170 with hardware, software and data resources including management of computing and processing equipment, and support control software and applications. It is also used for the storage of multimedia files, and the storage of running programs and applications.

[0034] The processor 170 is the control center of the terminal 100. It uses various interfaces and lines to connect various parts of the entire terminal 100. By running or executing instructions stored in the memory 120 and calling data stored in the memory 120, it executes various functions of the terminal 100 and processes data, thereby controlling the terminal device as a whole. Optionally, the processor 170 may include one or more processing units; preferably, the processor 170 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface and application program, and the modem processor mainly processes wireless communication. It is understandable that the above-mentioned modem processor may not be integrated into the processor 170. In some embodiments, the processor and the memory may be implemented on a single chip, and in some embodiments, they may also be implemented separately on separate chips. The processor 170 may also be used to generate corresponding operation control signals, send them to corresponding components of the computing and processing device, read and process data in the software, especially read and process data and programs in the memory 120, so that each functional module therein performs corresponding functions, thereby controlling the corresponding components to act according to the requirements of the instructions.

[0035] Among them, the memory 120 can be used to store software codes related to the environmental stress cracking resistance test method, the processor 170 can execute the steps of the environmental stress cracking resistance test method, and can also schedule other units (such as the above-mentioned input unit 130 and display unit 140) to achieve corresponding functions.

[0036] The radio frequency unit 110 (optional) can be used for receiving and sending information or receiving and sending signals during a call, for example, after receiving the downlink information of the base station, it is sent to the processor 170 for processing; in addition, the designed uplink data is sent to the base station. Generally, the RF circuit includes but is not limited to an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier (Low Noise Amplifier, LNA), a duplexer, etc. In addition, the radio frequency unit 110 can also communicate with network devices and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to Global System of Mobile communication (Global System of Mobile communication, GSM), General Packet Radio Service (General Packet Radio Service, GPRS), Code Division Multiple Access (Code Division Multiple Access, CDMA), Wideband Code Division Multiple Access (Wideband Code Division Multiple Access, WCDMA), Long Term Evolution (Long Term Evolution, LTE), email, Short Messaging Service (SMS), etc.

[0037] In this embodiment of the present application, the RF unit 110 can send data to the server 200 and receive processing results sent by the server 200.

[0038] It should be understood that the radio frequency unit 110 is optional and can be replaced by other communication interfaces, such as a network port.

[0039] The terminal 100 also includes a power supply 190 (such as a battery) for supplying power to various components. Preferably, the power supply can be logically connected to the processor 170 through a power management system, so that the power management system can manage functions such as charging, discharging, and power consumption.

[0040] The terminal 100 further includes an external interface 180 , which may be a standard Micro USB interface or a multi-pin connector, and may be used to connect the terminal 100 to communicate with other devices, or to connect a charger to charge the terminal 100 .

[0041] Although not shown, the terminal 100 may also include a flashlight, a wireless fidelity (WiFi) module, a Bluetooth module, sensors with different functions, etc., which are not described in detail here. Some or all of the methods described below may be applied in the following embodiments. Figure 2 In the terminal 100 shown.

[0042] Next describe Figure 1 The product form of the server 200; Figure 3 A structural diagram of a server 200 is provided, such as Figure 3 As shown, the server 200 includes a bus 201, a processor 202, a communication interface 203, and a memory 204. The processor 202, the memory 204, and the communication interface 203 communicate with each other via the bus 201.

[0043] The bus 201 may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 3 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0044] The processor 202 may be any one or more of a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor (MP), or a digital signal processor (DSP).

[0045] The memory 204 may include a volatile memory, such as a random access memory (RAM). The memory 204 may also include a non-volatile memory, such as a read-only memory (ROM), a flash memory, a hard disk drive (HDD), or a solid state drive (SSD).

[0046] The memory 204 may be used to store software codes related to the environmental stress cracking resistance test method, and the processor 202 may execute the steps of the environmental stress cracking resistance test method, and may also schedule other units to implement corresponding functions.

[0047] It should be understood that the above-mentioned terminal 100 and server 200 can be centralized or distributed devices, and the processors in the above-mentioned terminal 100 and server 200 (such as processor 170 and processor 202) can be hardware circuits (such as application specific integrated circuit (ASIC), field-programmable gate array (FPGA), general-purpose processor, digital signal processor (DSP), microprocessor or microcontroller, etc.), or a combination of these hardware circuits. For example, the processor can be a hardware system with an instruction execution function, such as a CPU, DSP, etc., or a hardware system without an instruction execution function, such as an ASIC, FPGA, etc., or a combination of the above-mentioned hardware systems without an instruction execution function and hardware systems with an instruction execution function.

[0048] Environmental stress crack resistance (ESCR) is a key technical indicator of floating materials, which affects the life cycle of floating bodies. At present, for the blow molding grade high-density polyethylene in the surface photovoltaic industry, the environmental stress crack resistance test standard is ASTM D 1693 (GB / T 1842-2008) polyethylene environmental stress crack resistance test method, also known as the bending test method. Figure 4 As shown, the polyethylene material is compression molded into test pieces of different thicknesses, and a group of 10 test pieces are taken, notches are made in the middle of the test pieces, and the test pieces are bent and placed in an active medium to induce cracking, and the time it takes for the polyethylene material to crack 50% is tested.

[0049] like Figure 5 As shown in the ASTM D 1693 (GB / T 1842-2008) standard for environmental stress cracking resistance test, there are three test conditions: A, B, and C. Because the surface photovoltaic industry standard requires that the material's environmental stress cracking resistance performance F 50 (The time for 50% of the samples in the same batch to crack)>1000h, the most stringent B test conditions are generally used for testing, with sample thickness of 1.84-1.97mm, notch depth of 0.30-0.40mm, constant temperature bath temperature of 50℃, and reagent concentration of 10%. Although this polyethylene material environmental stress cracking test method has low equipment cost, a large number of test samples, and simple operation, the test cycle is long, generally requiring 1000 hours.

[0050] In addition, the notch constant load tensile test (NCTL) and the full notch tensile creep test (FNCT) can also be used for the environmental stress cracking test of polyethylene materials. These two methods of environmental stress cracking test of polyethylene materials have fast test speed and high accuracy, but the instrument test sample stations of these two tests are few and the equipment investment is high, close to one million.

[0051] It can be seen that the existing testing methods for the environmental stress cracking resistance of polyethylene materials have some shortcomings.

[0052] In order to solve the above problems, the embodiment of the present application provides a method for testing environmental stress cracking resistance. The environmental stress cracking resistance test method of the embodiment of the present application is described in detail below in conjunction with the accompanying drawings.

[0053] Reference Figure 6 , Figure 6 A schematic diagram of a process for testing environmental stress cracking resistance provided in an embodiment of the present application is shown in FIG. Figure 6 As shown, an environmental stress cracking resistance test method provided in an embodiment of the present application may include steps 401 to 402, and these steps are described in detail below.

[0054] 401: Obtaining the time for 50% cracking of polyethylene material samples of the same batch after performing an environmental stress cracking resistance test on at least one batch of polyethylene material samples using a high temperature bending test method, wherein the constant temperature bath temperature in the high temperature bending test method is greater than 50°C, and other test conditions in the high temperature bending test method except the constant temperature bath temperature comply with test condition B in GB / T1842-2008 standard, and the constant temperature bath temperature of the test condition B is 50°C; The time when 50% of the polyethylene samples in the same batch cracked can be expressed as F 50 It indicates that the time when 50% of the polyethylene material samples of the same batch cracks can be input by the user, or obtained by parsing the data file imported by the user. The data file includes the time when 50% of the polyethylene material samples of the same batch cracks, and the format of the data file can be Excel.

[0055] The other test conditions in the high temperature bending test method except the constant temperature bath temperature conform to the test condition B in the GB / T 1842-2008 standard, that is, the sample thickness is 1.84-1.97 mm, the notch depth is 0.30-0.40 mm, and the reagent concentration is 10%.

[0056] Environmental stress cracking resistance characterizes the ability of material samples or parts that come into contact with various media to resist surface cracking. Polyethylene material samples will age faster and stress decay in high temperature environments, so the higher the constant temperature bath temperature, the faster the cracking rate. However, excessive temperature can also cause safety problems. Therefore, in this embodiment, the constant temperature bath temperature in the high temperature bending test method can be 60°C, 80°C, 90°C, etc. The constant temperature bath temperature in the high temperature bending test method is related to the type of polyethylene material. If the polyethylene material sample is a high-density polyethylene material, the constant temperature bath temperature in the high temperature bending test method is 60°C.

[0057] The same batch of polyethylene material samples corresponds to a high temperature bending test method sample cracking 50%, and the final result is the 50% cracking time under test condition B. If the user inputs the sample cracking 50% time of multiple batches of polyethylene material samples under the high temperature bending test method at the same time, the final result is the 50% cracking time of each batch of polyethylene material samples under test condition B.

[0058] 402: Substitute the 50% cracking time of the polyethylene material samples of the same batch into the pre-constructed relationship expression between the 50% cracking time of the polyethylene material under the test condition B and the 50% cracking time of the polyethylene material under the experimental condition of the high temperature bending test method, and calculate the 50% cracking time of the polyethylene material samples of the same batch under the test condition B.

[0059] Constructing a relationship expression between the time for the polyethylene material to crack 50% under the test condition B and the time for the polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method, a possible implementation includes the following steps: A1: The time F for the polyethylene material to crack 50% under the test condition B 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 The relational expression of (h2): InP = InA - Kt; Wherein, P is the environmental stress cracking resistance retention rate, specifically F 50 (h2) and F 50 (h1) ratio, t is F 50 (h2), the unit is h, A is the material constant, K is the reaction rate constant, A and t need to be calculated later.

[0060] The derivation process of InP=InA-Kt is as follows: f(P)=Aexp(-Kt) is the linearization equation of the kinetic curve, which is one of the equations for predicting the aging life of materials. f(P) is the ratio of the performance value F after aging at any time to the performance value F0 before aging, that is, the performance change rate, and t is the aging time. In this example, the time F when the polyethylene sample cracks 50% under the experimental conditions of the high temperature bending test method is 50 (h2) The time F for polyethylene material to crack 50% under test condition B 50 The ratio of (h1), that is, the attenuation of the environmental stress cracking resistance of the polyethylene material at different constant temperature bath temperatures is regarded as the performance change rate P, and the relationship between the environmental stress cracking resistance retention rate P and the aging time t can be constructed: P=Aexp(-Kt), obviously this relationship expression follows the kinetic equation.

[0061] Taking the logarithm of the relational expression P=Aexp(-Kt), we obtain InP=InA-Kt.

[0062] A2: Obtain the time F for different polyethylene material samples to crack 50% under the test condition B. 50 (h1) and the time F for 50% cracking under the experimental conditions of the high temperature bending test method 50 (h2); The cracking time data of different polyethylene material samples under the test condition B and the experimental conditions of the high temperature bending test method are shown in Table 1.

[0063] Table 1

[0064] Among them, F 10 Indicates the time of 10% cracking, F 20 Indicates the time of 20% cracking, F 30 Indicates the time of 30% cracking, F 40 Indicates the time of 40% cracking, F 50 Indicates the time of 50% cracking, F 60 Indicates cracking 60% of the time.

[0065] A3: According to the F of different polyethylene material samples 50 (h1) and F 50 (h2) Calculate InP; The InP and aging time t of different polyethylene material samples calculated based on the data in Table 1 are shown in Table 2.

[0066] Table 2

[0067] A4: InP and F of different polyethylene material samples 50 (h2) Linear fitting is performed to obtain InP and F 50 (h2) linear relationship expression; Let y=InP, a=InA, b=-K, t=x in the above InP=InA-Kt, we can get: y=a+bx.

[0068] The relationship between y and x is a straight line.

[0069] A5: According to InP and F 50 (h2) The linear relationship expression determines the parameters A and K.

[0070] For InP and F in Table 2 50 (h2) is linearly fitted to obtain Figure 7 The graph shown.

[0071] The fitting curve is y=0.0003x-0.6081, where R 2 =0.4262, the linear relationship is significant. Among them, a=-0.6081, b=0.0003.

[0072] Then, the relationship between the time when the polyethylene material cracks 50% under the test condition B and the time when the polyethylene material cracks 50% under the experimental conditions of the high temperature bending test method can be obtained: InP=-0.6081+0.0003t.

[0073] Substituting the time t when the polyethylene material samples of the same batch crack 50% into the above relationship expression, the time when the polyethylene material samples of the same batch crack 50% under the test condition B can be quickly calculated.

[0074] The following polyethylene 5331AB batches were actually tested for environmental stress cracking time F at 60°C (high temperature bending test method) 50 , the results are shown in Table 3.

[0075] Table 3

[0076] According to the above relationship expression InP=-0.6081+0.0003t, the environmental stress cracking time F of each grade under 50℃ can be calculated theoretically. 50 , the results are shown in Table 4.

[0077] Table 4

[0078] At the same time, the environmental stress cracking resistance of the above-mentioned polyethylene 5331AB materials was tested at 50°C (test condition B). The results are shown in Table 5.

[0079] Table 5

[0080] By comparing the theoretical values ​​with the actual test values, the values ​​are relatively close and have high credibility, which is suitable for rapid evaluation of the environmental stress resistance of floating materials.

[0081] A method for testing environmental stress cracking resistance provided by an embodiment of the present application is introduced above. A device for executing the above-mentioned method for testing environmental stress cracking resistance will be introduced below.

[0082] See also Figure 8 , Figure 8 This is a schematic diagram of the structure of an environmental stress cracking resistance test device provided in an embodiment of the present application. Figure 8 As shown, the environmental stress cracking resistance test device comprises: A cracking data acquisition module, used to acquire the time when 50% of the polyethylene material samples in the same batch crack after performing an environmental stress cracking resistance test on at least one batch of polyethylene material samples using a high-temperature bending test method, wherein the constant temperature bath temperature in the high-temperature bending test method is greater than 50° C., and other test conditions in the high-temperature bending test method except the constant temperature bath temperature comply with test condition B in GB / T 1842-2008 standard, and the constant temperature bath temperature in the test condition B is 50° C.; The cracking time calculation module is used to substitute the time when the polyethylene material samples of the same batch crack 50% into the pre-constructed relationship expression between the time when the polyethylene material cracks 50% under the test condition B and the time when the polyethylene material cracks 50% under the experimental conditions of the high temperature bending test method, and calculate the time when the polyethylene material samples of the same batch cracks 50% under the test condition B.

[0083] In a possible implementation, the environmental stress cracking resistance testing device further includes: Expression building block for building the time F at which the polyethylene material will crack 50% under the test condition B 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 (h2) The relational expression InP = InA - Kt, where P is F 50 (h2) and F 50 (h1) ratio, t is F 50 (h2), A is the material constant, K is the reaction rate constant, InP = InA-Kt follows the kinetic equation; The data acquisition module is used to obtain the time F of 50% cracking of different polyethylene material samples under the test condition B. 50 (h1) and the time F for 50% cracking under the experimental conditions of the high temperature bending test method 50 (h2); Data processing module for the analysis of the F 50 (h1) and F 50 (h2) Calculate InP and compare InP and F of different polyethylene material samples. 50 (h2) Linear fitting is performed to obtain InP and F 50 (h2) linear relationship expression; Expression solving module for InP and F 50 (h2) The linear relationship expression determines the parameters A and K.

[0084] In a possible implementation, the relationship building module is specifically used to build a relationship expression P=Aexp(-Kt) between the environmental stress cracking resistance retention rate P and the aging time t. P=Aexp(-Kt) follows the kinetic equation. The environmental stress cracking resistance retention rate P is F 50 (h2) and F 50 (h1) ratio, aging time t is F 50 (h2); Taking the logarithm of the relational expression P=Aexp(-Kt), we obtain InP=InA-Kt.

[0085] The environmental stress cracking resistance test device disclosed in the present embodiment constructs a relational expression between the time when polyethylene material cracks 50% under test condition B in the ‌GB / T1842-2008 standard and the time when polyethylene material cracks 50% under the experimental conditions of the high temperature bending test method, and obtains the time when the same batch of polyethylene material samples cracks 50% by the high temperature bending test method. Then, the time when the same batch of polyethylene material samples cracks 50% can be substituted into the above relational expression, thereby calculating the time when the same batch of polyethylene material samples cracks 50% under the test condition B in the ‌GB / T 1842-2008 standard. Since the other test conditions except the constant temperature bath temperature in the high temperature bending test method meet the test condition B in the ‌GB / T 1842-2008 standard, and the constant temperature bath temperature in the high temperature bending test method is greater than the constant temperature bath temperature of the test condition B, the test cycle is shortened without increasing the test cost.

[0086] An embodiment of the present application also provides a computer program product including computer-readable instructions. When the computer-readable instructions are executed on an electronic device, the electronic device implements any one of the environmental stress cracking resistance test methods provided in the embodiments of the present application.

[0087] A computer-readable storage medium is also provided in an embodiment of the present application. The storage medium carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can implement any environmental stress cracking resistance test method provided in the embodiment of the present application.

[0088] It should also be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the drawings of the device embodiments provided by the present application, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.

[0089] Through the description of the above implementation mode, the technicians in the field can clearly understand that the present application can be implemented by means of software plus necessary general hardware, and of course, it can also be implemented by special hardware including special integrated circuits, special CPUs, special memories, special components, etc. In general, all functions completed by computer programs can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be various, such as analog circuits, digital circuits or special circuits. However, for the present application, software program implementation is a better implementation mode in more cases. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a readable storage medium, such as a computer floppy disk, a U disk, a mobile hard disk, a ROM, a RAM, a disk or an optical disk, etc., including a number of instructions to enable a computer device (which can be a personal computer, a training device, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0090] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0091] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website site, a computer, a training device, or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, training device, or data center. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device, a data center, etc. that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)), etc.

Claims

1. A method for testing environmental stress cracking resistance, It is characterized in that include: Obtaining the time for 50% cracking of polyethylene material samples of the same batch after performing an environmental stress cracking resistance test on at least one batch of polyethylene material samples using a high temperature bending test method, wherein the constant temperature bath temperature in the high temperature bending test method is greater than 50° C., and other test conditions in the high temperature bending test method except the constant temperature bath temperature comply with test condition B in GB / T 1842-2008 standard, and the constant temperature bath temperature in the test condition B is 50° C.; Substitute the 50% cracking time of the polyethylene material samples from the same batch into the pre-constructed expression for the relationship between the 50% cracking time of the polyethylene material under the test condition B and the 50% cracking time of the polyethylene material under the experimental conditions of the high temperature bending test method, and calculate the 50% cracking time of the polyethylene material samples from the same batch under the test condition B.

2. The environmental stress cracking resistance test method according to claim 1, It is characterized in that The environmental stress cracking resistance test method also includes: The time F for the polyethylene material to crack 50% under the test condition B is 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 (h2) The relational expression InP = InA - Kt, where P is F 50 (h2) and F 50 (h1) ratio, t is F 50 (h2), A is the material constant, K is the reaction rate constant, InP = InA-Kt follows the kinetic equation; The time F for different polyethylene material samples to crack 50% under the test condition B is obtained respectively. 50 (h1) and the time F for 50% cracking under the experimental conditions of the high temperature bending test method 50 (h2); According to the F of different polyethylene material samples 50 (h1) and F 50 (h2) Calculate InP; InP and F of different polyethylene material samples 50 (h2) Linear fitting is performed to obtain InP and F 50 (h2) linear relationship expression; Based on InP and F 50 (h2) The linear relationship expression determines the parameters A and K.

3. The environmental stress cracking resistance test method according to claim 2, It is characterized in that The time F for the polyethylene material to crack 50% under the test condition B 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 The relational expression InP = InA - Kt of (h2) includes: The relationship expression P=Aexp(-Kt) between the environmental stress cracking resistance retention rate P and the aging time t is constructed. P=Aexp(-Kt) follows the kinetic equation. The environmental stress cracking resistance retention rate P is F 50 (h2) and F 50 (h1) ratio, aging time t is F 50 (h2); Taking the logarithm of the relational expression P=Aexp(-Kt), we obtain InP=InA-Kt.

4. The environmental stress cracking resistance test method according to claim 1, It is characterized in that If the polyethylene material sample is a high-density polyethylene material, the constant temperature bath temperature in the high-temperature bending test method is 60°C.

5. An environmental stress cracking resistance test device, It is characterized in that include: A cracking data acquisition module, used to acquire the time when 50% of the polyethylene material samples in the same batch crack after performing an environmental stress cracking resistance test on at least one batch of polyethylene material samples using a high-temperature bending test method, wherein the constant temperature bath temperature in the high-temperature bending test method is greater than 50° C., and other test conditions in the high-temperature bending test method except the constant temperature bath temperature comply with test condition B in the GB / T 1842-2008 standard, and the constant temperature bath temperature in the test condition B is 50° C.; The cracking time calculation module is used to substitute the time when the polyethylene material samples of the same batch crack 50% into the pre-constructed relationship expression between the time when the polyethylene material cracks 50% under the test condition B and the time when the polyethylene material cracks 50% under the experimental conditions of the high temperature bending test method, and calculate the time when the polyethylene material samples of the same batch cracks 50% under the test condition B.

6. The environmental stress cracking resistance testing device according to claim 5, It is characterized in that The environmental stress cracking resistance testing device also includes: Expression building block for building the time F at which the polyethylene material will crack 50% under the test condition B 50 (h1) The time F for polyethylene material to crack 50% under the experimental conditions of the high temperature bending test method 50 (h2) The relational expression InP = InA - Kt, where P is F 50 (h2) and F 50 (h1) ratio, t is F 50 (h2), A is the material constant, K is the reaction rate constant, InP = InA-Kt follows the kinetic equation; The data acquisition module is used to obtain the time F of 50% cracking of different polyethylene material samples under the test condition B. 50 (h1) and the time F for 50% cracking under the experimental conditions of the high temperature bending test method 50 (h2); Data processing module for the analysis of the F 50 (h1) and F 50 (h2) Calculate InP and compare InP and F of different polyethylene material samples. 50 (h2) Linear fitting is performed to obtain InP and F 50 (h2) linear relationship expression; Expression solving module, used to calculate the expression according to InP and F 50 (h2) The linear relationship expression determines the parameters A and K.

7. The environmental stress cracking resistance testing device according to claim 6, It is characterized in that The relationship building module is specifically used to build a relationship expression P=Aexp(-Kt) between the environmental stress cracking resistance retention rate P and the aging time t. P=Aexp(-Kt) follows the kinetic equation. The environmental stress cracking resistance retention rate P is F 50 (h2) and F 50 (h1) ratio, aging time t is F 50 (h2); Taking the logarithm of the relational expression P=Aexp(-Kt), we obtain InP=InA-Kt.

8. A computer program product, It is characterized in that The method comprises computer-readable instructions, and when the computer-readable instructions are executed on an electronic device, the electronic device implements the environmental stress cracking resistance testing method as claimed in any one of claims 1 to 4.

9. An electronic device, It is characterized in that The method comprises at least one processor and a memory connected to the processor, wherein: The memory is used to store computer programs; The processor is used to execute the computer program so that the electronic device can implement the environmental stress cracking resistance testing method according to any one of claims 1 to 4.

10. A computer storage medium, It is characterized in that The storage medium carries one or more computer programs, and when the one or more computer programs are executed by an electronic device, the electronic device can implement the environmental stress cracking resistance testing method as described in any one of claims 1 to 4.

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