Testing head structure and testing device with same

Abstract

The invention provides a testing head structure and a testing device with the same. The testing head structure comprises a connecting assembly which comprises a first connecting piece and a second connecting piece which are connected with each other; at least part of the abutting and pushing structure is used for being connected with the connecting assembly, the abutting and pushing end of the abutting and pushing structure is arranged opposite to the first connecting piece, and the abutting and pushing structure is movably arranged in the first direction so as to be close to or away from the first connecting piece and drive the first connecting piece to move; and the connecting assembly is movably arranged along a second direction relative to the pushing structure, so that the second connecting piece is close to or far away from the pushing structure, and the connecting assembly moves to a plugging position matched with the size of the to-be-tested port. Through the technical scheme provided by the invention, the technical problem that a test head structure in the prior art is inconvenient to plug and unplug quickly can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of testing devices, and in particular to a testing head structure and a testing device having the same. Background Art

[0002] At present, IO modules (input and output modules) are input and output modules in machine tool control systems. In modern industrial machine tools or automated production lines, IO modules are an important part of connecting control systems and peripherals. They realize information interaction and control functions between control systems and peripherals. IO modules are bridges between machine tool systems and peripherals. Most of the input and output terminals of IO modules use screw-type terminals, because such terminals are stable and reliable, have excellent electrical properties, and are easy to maintain.

[0003] However, when performing quality inspection and functional verification on IO modules, due to the large number of terminals, the test method of using wiring to lead out the terminal signals is inefficient. When screening and functional verification of IO modules, it is sometimes necessary to repeatedly rewire each IO module, but the wiring steps are relatively cumbersome, making it difficult to quickly plug and unplug all input and output terminals and lead out signals, affecting the efficiency of the test. Summary of the invention

[0004] The main purpose of the present invention is to provide a test head structure and a test device having the same, so as to solve the technical problem that the test head structure in the prior art is not convenient for rapid plugging and unplugging.

[0005] In order to achieve the above object, according to one aspect of the present invention, a test head structure is provided, comprising:

[0006] A connecting assembly, comprising a first connecting member and a second connecting member connected to each other;

[0007] A push structure, at least part of which is used to connect to a connecting component, a push end of the push structure is arranged opposite to a first connecting member, and the push structure is movably arranged along a first direction to approach or move away from the first connecting member and drive the first connecting member to move; the connecting component is movably arranged along a second direction relative to the push structure to make the second connecting member approach or move away from the push structure, so that the connecting component moves to a plug-in position that matches the size of the port to be tested.

[0008] Furthermore, the push-pushing structure includes:

[0009] A circuit board forms at least a part of the push structure.

[0010] Furthermore, the push structure further includes a buffer, which is arranged at one end of the circuit board close to the first connector; the buffer forms a push end of the push structure;

[0011] Wherein, the buffer member is a rubber member; and / or,

[0012] The buffer components are arranged protruding from both sides of the circuit board.

[0013] Furthermore, the test head structure also includes an elastic member;

[0014] Wherein, one end of the elastic member is connected to the circuit board, and the other end of the elastic member is connected to the second connecting member; and / or,

[0015] The elastic member is made of a conductive material; and / or,

[0016] The elastic member is a spring structure.

[0017] Further, there are at least two connecting components, one of the at least two connecting components is arranged opposite to and spaced from the other, and the push structure is located between one of the at least two connecting components and the other; or,

[0018] The test head structure also includes a fixed connection component, which is fixedly connected to the push structure. The connection component and the fixed connection component are arranged opposite to each other and at intervals, and the push structure is located between the connection component and the fixed connection component.

[0019] Furthermore, the connection component also includes:

[0020] A transition piece, one end of the transition piece is connected to the first connecting piece, and the other end of the transition piece is connected to the second connecting piece; an extending direction of the transition piece is arranged at a preset angle with a peripheral wall of the port to be tested, and the preset angle is greater than 0° and less than 90°;

[0021] The connection assembly has an initial position in which the transition piece is arranged relative to the periphery of the port to be tested.

[0022] According to another aspect of the present invention, a testing device is provided, comprising: the testing head structure provided above.

[0023] Furthermore, the test head structure includes a first test head and a second test head; the first test head is used to connect to the output end of the module to be tested, and the second test head is used to connect to the input end of the module to be tested; the test device also includes:

[0024] A control module, the control module is used to generate a test electrical signal and receive an electrical signal sent by the module to be tested, and compare the test electrical signal with the electrical signal sent by the module to be tested;

[0025] An input module is electrically connected to the control module; the input module is used to be electrically connected to the first test head to transmit to the control module an electrical signal sent by the test port of the test module received by the first test head;

[0026] The output module is electrically connected to the control module; the output module is used to be electrically connected to the second test head to transmit the electrical signal generated by the control module to the port to be tested.

[0027] Further, the input module includes a signal input circuit and an input wiring terminal connected to each other; the signal input circuit is electrically connected to the control module, and the input wiring terminal is used to connect to the first test head; the signal input circuit is used to perform voltage regulation on the current output by the input wiring terminal; and / or,

[0028] The output module includes an output drive circuit and an output wiring terminal connected to each other; the output drive circuit is electrically connected to the control module, and the output wiring terminal is used to connect to the second test head; the output drive circuit is used to regulate the voltage of the current output by the control module; and / or,

[0029] The testing device also includes a communication interface circuit, and the output module and the input module are both connected to the communication interface circuit. The communication interface circuit is used to send communication signals to the module to be tested and receive communication signals sent by the module to be tested.

[0030] Furthermore, the testing device further includes a control module; the testing device further includes:

[0031] an alarm module, electrically connected to the control module, the alarm module being used to emit an alarm sound; and / or,

[0032] The indicator light module is electrically connected to the control module, and is used to indicate the operating status and test results of the test device.

[0033] By applying the technical solution of the present invention, the test head structure can be quickly plugged in and out through the movement of the push structure, and the contact force between the first connector and the second connector and the port to be tested can be accurately controlled to ensure that during the test process, the connection component can quickly form a stable and tight electrical contact with the port to be tested, thereby improving the accuracy of signal transmission and the efficiency of the test process. The push structure drives the first connector to move in the first direction, and then indirectly drives the second connector to move. The second connector can also move in the direction close to or away from the push structure during the movement of the first connector, so that the second connector is adapted to the size of the port to be tested, and then it is easy to insert or pull out from the port to be tested. In addition, since the connection component can move in the second direction relative to the push structure, the test head can adapt to ports to be tested of different sizes without replacing the test head or making complex adjustments, which improves the flexibility and versatility of the test system and is suitable for testing a variety of IO modules. In addition, through the precise control of the push structure, damage to the port of the IO module or the test head itself due to excessive contact force or inaccurate positioning is avoided, the service life of the test head structure is extended, and the test cost is reduced. The movable design and automatic push function of the test head make it easy to integrate into the automated test system, realize fast and batch IO module testing, and is suitable for quality control and function verification on the production line. Therefore, the test head structure provided in this embodiment can solve the technical problem that the test head structure in the prior art is not convenient for fast plugging and unplugging. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0035] Figure 1 It shows a schematic structural diagram of a test head structure provided according to the first embodiment of the present invention;

[0036] Figure 2 It shows a schematic structural diagram of a test head structure in an initial position according to the first embodiment of the present invention;

[0037] Figure 3 It shows a schematic structural diagram of the test head structure provided in the first embodiment of the present invention when it is in the plugging position;

[0038] Figure 4 A schematic structural diagram of a testing device provided according to Embodiment 3 of the present invention is shown.

[0039] The above drawings include the following reference numerals:

[0040] 1. Port to be tested;

[0041] 2. Test device;

[0042] 3. Module to be tested;

[0043] 4. Test head structure; 41. First test head; 42. Second test head;

[0044] 10. Connect components;

[0045] 11. A first connecting member;

[0046] 12. A second connecting member;

[0047] 13. Transition piece;

[0048] 20. Pushing structure; 21. Circuit board; 22. Buffer;

[0049] 30. Elastic parts;

[0050] 100. Control module;

[0051] 200, signal input circuit;

[0052] 300, input cable terminal;

[0053] 400, output drive circuit;

[0054] 500, output wiring terminal;

[0055] 600, communication interface circuit;

[0056] 700, alarm module;

[0057] 800, indicator light module;

[0058] 900, communication port;

[0059] 1000, output terminal;

[0060] 1100, input end. DETAILED DESCRIPTION

[0061] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0062] like Figures 1 to 3As shown, a first embodiment of the present invention provides a test head structure 4, and the test head structure 4 includes a connecting component 10 and a push structure 20. The connecting component 10 includes a first connecting member 11 and a second connecting member 12 that are connected to each other. At least a portion of the push structure 20 is used to connect with the connecting component 10, and the push end of the push structure 20 is arranged opposite to the first connecting member 11, and the push structure 20 is movably arranged along a first direction to approach or move away from the first connecting member 11 and drive the first connecting member 11 to move; the connecting component 10 is movably arranged along a second direction relative to the push structure 20, so that the second connecting member 12 approaches or moves away from the push structure 20, so that the connecting component 10 moves to a plug-in position that matches the size of the port 1 to be tested.

[0063] By adopting the test head structure 4 provided in the first embodiment of the present invention, the test head structure 4 can be quickly plugged in and out through the movement of the push structure 20, and the contact force between the first connector 11 and the second connector 12 and the port 1 to be tested can be accurately controlled to ensure that during the test process, the connection component 10 can quickly form a stable and tight electrical contact with the port 1 to be tested, thereby improving the accuracy of signal transmission and the efficiency of the test process. The push structure 20 drives the first connector 11 to move in the first direction, and then indirectly drives the second connector 12 to move. The second connector 12 can also move in the direction close to or away from the push structure 20 during the movement of the first connector 11, so that the second connector 12 is adapted to the size of the port 1 to be tested, thereby facilitating the insertion or removal of the port 1 to be tested. In addition, since the connection component 10 can move in the second direction relative to the push structure 20, the test head can adapt to ports 1 to be tested of different sizes without replacing the test head or making complex adjustments, thereby improving the flexibility and versatility of the test system and being suitable for testing of various IO modules. In addition, through the precise control of the push structure 20, damage to the port of the IO module or the test head itself due to excessive contact force or inaccurate positioning is avoided, the service life of the test head structure 4 is extended, and the test cost is reduced. The movable design and automatic push function of the test head enable it to be easily integrated into the automated test system to achieve fast and batch IO module testing, which is suitable for quality control and functional verification on the production line. Therefore, the test head structure provided in this embodiment can solve the technical problem that the test head structure in the prior art is not convenient for rapid plugging and unplugging.

[0064] Specifically, during the insertion process of the test head structure 4, when the test head structure 4 is in an uninserted state, the first connector 11 and the second connector 12 remain stationary, a certain distance is maintained between the first connector 11 and the port 1 to be tested, a certain distance is maintained between the second connector 12 and the port 1 to be tested, and the push structure 20 is not in contact with the first connector 11. When the test head structure 4 begins to approach the port 1 to be tested, the push end of the push structure 20 is aligned with the first connector 11, ready to perform a push action. At this time, no electrical connection is established between the test head structure 4 and the port 1 to be tested. As the test head structure 4 is further advanced, the push structure 20 moves along the first direction, gradually approaches the first connector 11, and applies a push force to the first connector 11. Under the action of the push force, the first connector 11 begins to move toward the inner end wall of the port 1 to be tested. Then, the second connector 12 moves in a direction close to the push structure 20 until at least part of the second connector 12 enters the port 1 to be tested and contacts the inner peripheral wall of the port 1 to be tested. Finally, the first connector 11 forms a close contact with the inner end wall of the port to be tested 1. At this point, the test head structure 4 establishes a stable electrical connection with the port to be tested 1, and signal transmission and detection can be performed. During the removal of the test head structure 4, the push structure 20 moves away from the port to be tested 1 along the first direction. Since at least part of the push structure 20 is connected to the connection component 10, the connection component 10 is driven to move away from the port to be tested 1 along the first direction. Since the friction between the connection component 10 and the inner wall of the port to be tested 1 is small, it can be quickly removed from the port to be tested 1.

[0065] Specifically, “the plugging position adapted to the size of the port 1 to be tested” refers to a position where at least a portion of the connection assembly 10 contacts the inner wall of the port 1 to be tested.

[0066] Preferably, the "insertion position adapted to the size of the port to be tested 1" refers to the position where the first connector 11 contacts the inner end wall of the port to be tested 1 and the second connector 12 contacts the inner peripheral wall of the port to be tested 1. This can better ensure the stability of the connection.

[0067] Specifically, at least part of the push structure 20 is also used to electrically connect with the connection component 10. With such a structural setting, the push structure 20 can not only mechanically push the first connection member 11, but also form a connection with the connection component 10 in the circuit, ensuring that the test signal can be transmitted between the connection component 10 and the push structure 20, and then establish communication with the port 1 to be tested, thereby improving the integration of the test system and the efficiency of signal transmission.

[0068] Specifically, the connection component 10 is made of a conductive material. Specifically, the connection component 10 is a metal part. With such a structural setting, the use of the metal part can ensure that the connection component 10 has good conductivity, which is conducive to the efficient transmission of signals. At the same time, the high strength and wear resistance of the metal material also ensure the reliability and durability of the connection component 10, reducing the error caused by poor contact during testing.

[0069] Specifically, the push structure 20 is extended along the first direction. This design ensures that the push action can be accurately applied to the first connector 11, which is conducive to controlling the contact pressure between the push end of the push structure 20 and the first connector 11, ensuring a stable and reliable contact, and helping to improve the stability of signal transmission and the accuracy of testing.

[0070] Specifically, the first direction and the second direction are perpendicular to each other. This perpendicular motion design enables the connection assembly 10 and the push structure 20 to move independently in two directions, which not only ensures the adaptability of the test head structure 4 to the port 1 to be tested, but also makes the push and pull actions smoother and more controllable, thereby improving the flexibility and operation efficiency of the test head structure 4.

[0071] Specifically, the first connector 11 and the second connector 12 are arranged perpendicular to each other. With such a structural arrangement, the vertically arranged first connector 11 and the second connector 12 can ensure that when inserted into the port 1 to be tested, the two connectors respectively form stable and uniform contact with the inner end wall and the inner peripheral wall of the port, thereby avoiding poor contact caused by improper contact angles and enhancing the reliability of electrical connection.

[0072] Specifically, the port 1 to be tested is a square port.

[0073] Specifically, the push structure 20 includes a circuit board 21, and the circuit board 21 forms at least a part of the push structure 20. With such a structural setting, the circuit board 21, as a part of the push structure 20, not only provides a signal transmission path, but also can realize complex electronic control and signal processing functions, so that the function of the test head structure 4 is more comprehensive, and can adapt to different types of ports 1 to be tested, thereby enhancing the versatility and intelligence level of the test device 2.

[0074] Specifically, the circuit board 21 is a PCB (printed circuit board). The PCB has good circuit wiring performance, high stability and low cost in large-scale production, which can ensure the stability and accuracy of signal transmission during the test process. At the same time, the PCB is easy to maintain and replace, which reduces the maintenance cost during long-term use.

[0075] In the present embodiment, the push structure 20 further includes a buffer 22, and the buffer 22 is arranged at one end of the circuit board 21 close to the first connector 11; the buffer 22 forms the push end of the push structure 20. The buffer 22 is a rubber member. With such a structural arrangement, using rubber as the buffer 22 can effectively absorb and disperse the impact force during the push process, prevent the circuit board 21 and the first connector 11 from being damaged during rapid contact, protect the test head structure 4 and the port 1 to be tested, and extend the service life of the test head structure 4. The elastic properties of the rubber also ensure that the first connector 11 can form a good and stable contact when inserted into the port 1 to be tested, thereby improving the reliability of the electrical connection.

[0076] Specifically, the push structure 20 also includes a buffer 22, which is arranged at one end of the circuit board 21 close to the first connector 11; the buffer 22 forms the push end of the push structure 20. The buffer 22 is arranged to protrude from both sides of the circuit board 21. With such a structural setting, the protruding setting of the buffer 22 increases its contact area with the first connector 11, so that the pressure distribution is more uniform during the push process, avoiding the damage to the test head structure 4 caused by excessive local pressure. At the same time, this design can also better adapt to ports 1 to be tested of different sizes, enhancing the versatility of the test head structure 4.

[0077] Specifically, the buffer 22 is extended along the second direction. With such a structural arrangement, the extension of the buffer 22 along the second direction ensures that it can provide a continuous and correctly directional buffer force during the push process, which helps the first connector 11 to move smoothly to a position in contact with the inner end wall of the port to be tested 1, avoiding poor contact due to offset or tilt. This design also enables the buffer 22 to better adapt to the height of the port to be tested 1 (the height of the port to be tested 1 along the second direction), ensuring stable contact and signal transmission even when the port height changes slightly.

[0078] Specifically, the test head structure 4 also includes an elastic member 30. One end of the elastic member 30 is connected to the circuit board 21, and the other end of the elastic member 30 is connected to the second connector 12. Such a structural arrangement ensures that the second connector 12 can smoothly establish a stable electrical connection with the inner circumferential wall of the port 1 to be tested. The elastic member 30 plays a key supporting and buffering role during the insertion and removal of the test head. It enables the second connector 12 to stably contact in ports at different heights, and provides a restoring force when it is removed, thereby avoiding hard collisions of mechanical parts, protecting the circuit board 21 and the second connector 12, and extending the service life of the test head structure 4.

[0079] Specifically, during the insertion of the test head structure 4, the push structure 20 moves along the first direction, gradually approaches the first connector 11, and applies a push force to the first connector 11. Under the action of the push force, the first connector 11 begins to move toward the inner end wall of the port 1 to be tested. Then, the push structure 20 drives the second connector 12 to move along the first direction, and the second connector 12 moves in the direction close to the push structure 20 under the action of the elastic member 30, until at least part of the second connector 12 enters the port 1 to be tested and contacts the inner peripheral wall of the port 1 to be tested. During the removal of the test head structure 4, the push structure 20 moves away from the port 1 to be tested along the first direction, and the push structure 20 drives the elastic member 30 to move, and the elastic member 30 drives the second connector 12 to move. Since the friction between the connection assembly 10 and the inner wall of the port 1 to be tested is small, it can be quickly removed from the port 1 to be tested.

[0080] Specifically, the test head structure 4 also includes an elastic member 30. The elastic member 30 is made of a conductive material. With such a structural setting, the elastic member 30 is made of a conductive material, so that it not only has a mechanical elastic function, but also can serve as a path for signal transmission, reducing the wire connection inside the test head structure 4, simplifying the structure, reducing interference and attenuation during signal transmission, and improving the accuracy and stability of signal transmission. This integrated design is particularly important in scenarios that require high-frequency and fast testing, and helps to improve test efficiency.

[0081] Specifically, the elastic member 30 is a metal elastic member. In this way, the use of the metal elastic member combines the excellent electrical conductivity of metal and the mechanical properties of elastic materials, and can ensure that precise elastic force is provided to the second connector 12 during the insertion and removal process while achieving signal transmission, thereby ensuring contact reliability and continuity of signal transmission. The high durability and strength of the metal elastic member also further extend the service life of the test head and reduce maintenance requirements.

[0082] Specifically, the test head structure 4 further includes an elastic member 30. The elastic member 30 is a spring structure. The spring structure has good elasticity and restoring force, which can ensure that the second connecting member 12 can maintain stable contact with the inner peripheral wall of the port to be tested 1 in various heights of the port to be tested 1, and at the same time provide the ability to quickly return to the original position during the removal process, thereby avoiding potential damage to the test head structure 4 caused by residual stress. The design of the spring can also adapt to slight changes in the shape of the port, thereby improving the versatility and adaptability of the test fixture.

[0083] Specifically, the side of the connection component 10 close to the port 1 to be tested is a smooth surface. With such a structural setting, the design of the smooth surface reduces the friction between the connection component 10 and the port 1 to be tested, making the test head structure 4 smoother during insertion and removal, avoiding mechanical wear and operational difficulties caused by excessive friction resistance. In addition, the smooth surface also helps to improve the cleanliness of the test head structure 4, preventing dust and impurities from accumulating on the contact surface and affecting the quality of electrical contact, thereby ensuring the accuracy of the test signal and the reliability of the test results.

[0084] In this embodiment, there are at least two connection components 10, one of the at least two connection components 10 is arranged opposite to the other and spaced apart, and the push structure 20 is located between one of the at least two connection components 10 and the other. With such a structural arrangement, a stable test head structure 4 can be formed, so that when the push structure 20 pushes the connection component 10, the connection component 10 can be kept on both sides of the port 1 to be tested, thereby ensuring the verticality and accuracy of the test head structure 4 when it is inserted. The two relatively arranged connection components 10 form a positioning frame, which can better adapt to ports 1 to be tested of different sizes, improve the flexibility and adaptability of the test head structure 4, and at the same time reduce the deviation that may occur during insertion, thereby improving the accuracy and efficiency of the test.

[0085] Specifically, one and the other of at least two connection components 10 are arranged at intervals along the first direction. Such a structural arrangement ensures that even when facing ports 1 to be tested of different sizes, the connection component 10 can be accurately aligned with the port to be tested 1, reducing the time wasted due to position adjustment and improving the convenience and speed of the test. At the same time, this design can also ensure that during the insertion process, the connection components 10 will not interfere with each other, further improving the reliability of the test.

[0086] Specifically, the connection assembly 10 also includes a transition piece 13, one end of which is connected to the first connection piece 11, and the other end of the transition piece 13 is connected to the second connection piece 12; the extension direction of the transition piece 13 is set at a preset angle with the peripheral wall of the port to be tested 1, and the preset angle is greater than 0° and less than 90°. Among them, the connection assembly 10 has an initial position in which the transition piece 13 is set relative to the periphery of the port to be tested 1. The adoption of such a structural setting ensures a smooth transition between the first connection piece 11 and the second connection piece 12, so that when the test head structure 4 is inserted into the port to be tested 1, it can contact the port to be tested 1 at a preset angle, avoiding damage to the test head structure 4 that may be caused by hard contact. The selection of the preset angle enables the test head structure 4 to adapt to different types of ports to be tested 1, improving the versatility of the test fixture. At the same time, the design of the transition piece 13 also optimizes the internal signal transmission path, reduces the attenuation and interference of the signal during the transmission process, and improves the accuracy and efficiency of the test.

[0087] Specifically, when the test head structure 4 pushes the port to be tested 1, first, due to the contact between the transition piece 13 and the periphery of the port to be tested 1, the connection component 10 will be subjected to a pressure to shrink toward the PCB board, and at the same time, the pushing end of the pushing structure 20 will push the first connection piece 11 to move closer to the port to be tested 1, the elastic piece 30 will be compressed, and the second connection piece 12 will move closer to the PCB board. When the test head structure 4 is completely pushed into the port to be tested 1, the first connection piece 11 will contact the inner end wall of the port to be tested due to the pressure of the buffer piece 22, and the second connection piece 12 can also contact the inner circumferential wall of the port to be tested due to the elastic force of the elastic piece 30, and maintain a certain tension so that the test head structure 4 and the port to be tested are not easy to loosen and fall off. After the connection component 10 contacts the port to be tested 1, an electrical connection is established with the PCB board through the conductive elastic piece 30. Through this structure, the port to be tested 1 can be quickly electrically connected without twisting it up and down or fixing the wiring, thereby improving the test efficiency.

[0088] like Figure 2 As shown, when the connection assembly 10 is in the initial position, the transition piece 13 is arranged opposite to the periphery of the port 1 to be tested. Figure 2 The arrows in the figure indicate the moving directions of the first connecting member 11 and the transition member 13 respectively. Figure 3 As shown, when the connection assembly 10 is in the plugging position, the first connection member 11 contacts the inner end wall of the port 1 to be tested, and the second connection member 12 abuts against the inner peripheral wall of the port 1 to be tested under the elastic force of the elastic member 30 . Figure 3 The arrow in FIG. 1 indicates the direction of the elastic force of the elastic member 30 exerted on the second connecting member 12 .

[0089] In the second embodiment, the test head structure 4 also includes a fixed connection component, which is fixedly connected to the push structure 20. The connection component 10 and the fixed connection component are arranged opposite to each other and spaced apart, and the push structure 20 is located between the connection component 10 and the fixed connection component. With such a structural arrangement, the stability of the test head structure 4 is increased, and the movement of the first connection member 11 and the second connection member 12 can be controlled more accurately, thereby improving the contact quality with the port 1 to be tested and the reliability of signal transmission. At the same time, the relative spacing between the connection component 10 and the fixed connection component forms a stable clamping space that can adapt to ports 1 to be tested of a wider range of sizes, thereby improving the versatility and flexibility of the test head and helping to improve test efficiency.

[0090] Specifically, the connection component 10 and the fixed connection component are arranged at intervals along the first direction. With such a structural arrangement, the interval arrangement along the first direction ensures that the connection component 10 and the fixed connection component can provide sufficient support and positioning when inserted into the port to be tested 1, avoiding poor contact or signal transmission interruption caused by unstable position. This design also helps to simplify the insertion operation of the test head structure 4. Through precise positioning along the first direction, a stable connection with the port to be tested 1 can be quickly achieved, thereby improving the accuracy and speed of the test.

[0091] like Figure 4 As shown, the third embodiment of the present invention provides a testing device 2, and the testing device 2 includes the testing head structure 4 provided in the first or second embodiment.

[0092] By using the test device 2 provided in the third embodiment of the present invention, the test head structure 4 can be quickly plugged in and out through the movement of the push structure 20, and the contact force between the first connector 11 and the second connector 12 and the port 1 to be tested can be accurately controlled to ensure that during the test process, the connection component 10 can quickly form a stable and tight electrical contact with the port 1 to be tested, thereby improving the accuracy of signal transmission and the efficiency of the test process. The push structure 20 drives the first connector 11 to move along the first direction, and then indirectly drives the second connector 12 to move. The second connector 12 can also move in the direction close to or away from the push structure 20 during the movement of the first connector 11, so that the second connector 12 is adapted to the size of the port 1 to be tested, thereby facilitating the insertion or removal of the port 1 to be tested. In addition, since the connection component 10 can move along the second direction relative to the push structure 20, the test head can adapt to ports 1 to be tested of different sizes without replacing the test head or making complex adjustments, thereby improving the flexibility and versatility of the test system and being suitable for testing of various IO modules. In addition, through the precise control of the push structure 20, damage to the port of the IO module or the test head itself due to excessive contact force or inaccurate positioning is avoided, the service life of the test head structure 4 is extended, and the test cost is reduced. The movable design and automatic push function of the test head enable it to be easily integrated into the automated test system to achieve fast and batch IO module testing, which is suitable for quality control and functional verification on the production line. Therefore, the test device provided in this embodiment can solve the technical problem in the prior art that the test head structure is not convenient for rapid plugging and unplugging.

[0093] Specifically, there are multiple test head structures 4, and the multiple test head structures 4 are arranged at intervals. In this way, the test device 2 can test multiple ports 1 to be tested at the same time, greatly improving the test efficiency. The multiple test head structures 4 are spaced apart from each other, ensuring that each test head will not interfere with each other when inserted and removed, reducing mechanical errors during the test process, and improving the accuracy and repeatability of the test.

[0094] Specifically, the test head structure 4 includes a first test head 41 and a second test head 42; the first test head 41 is used to connect to the output end 1000 of the module to be tested 3, and the second test head 42 is used to connect to the input end 1100 of the module to be tested 3. The test device 2 also includes a control module 100, an input module and an output module. The control module 100 is used to generate a test electrical signal and receive an electrical signal emitted by the module to be tested 3, and compare the test electrical signal with the electrical signal emitted by the module to be tested 3. The input module is electrically connected to the control module 100; the input module is used to be electrically connected to the first test head 41 to transmit to the control module 100 the electrical signal emitted by the port 1 to be tested of the module to be tested 3 received by the first test head 41. The output module is electrically connected to the control module 100; the output module is used to be electrically connected to the second test head 42 to transmit the electrical signal generated by the control module 100 to the port 1 to be tested. With such a structural setting, the first test head 41 and the second test head 42 are used separately, so that the test device 2 can independently test the input and output functions of the module to be tested 3. By comparing the test electrical signal generated by the control module 100 with the electrical signal emitted by the module to be tested 3, the fault point of the module can be quickly and accurately identified, thereby improving the efficiency and accuracy of fault diagnosis. The design of the input module and the output module realizes the efficient transmission and processing of the test electrical signal, ensuring the integrity and stability of the signal. Such a setting can form a test circuit loop in the test device 2, thereby improving the test efficiency.

[0095] Specifically, the input module includes a signal input circuit 200 and an input wiring terminal 300 that are interconnected; the signal input circuit 200 is electrically connected to the control module 100, and the input wiring terminal 300 is used to connect to the first test head 41; the signal input circuit 200 is used to regulate the voltage of the current output by the input wiring terminal 300. With such a structural setting, the voltage regulation of the signal input circuit 200 ensures that the output signal of the module to be tested 3 can adapt to the input voltage requirement of the control module 100 when it is transmitted to the control module 100, avoiding signal distortion or equipment damage caused by voltage mismatch. At the same time, the design of the voltage regulation circuit can also effectively isolate noise and improve the purity of the signal, thereby improving the reliability of the test results.

[0096] Specifically, the output module includes an output drive circuit 400 and an output wiring terminal 500 that are interconnected; the output drive circuit 400 is electrically connected to the control module 100, and the output wiring terminal 500 is used to connect to the second test head 42; the output drive circuit 400 is used to regulate the voltage of the current output by the control module 100. With such a structural setting, the voltage regulation of the output drive circuit 400 ensures that the test electrical signal generated by the control module 100 can meet its input voltage requirements when it is transmitted to the module to be tested 3, avoiding signal transmission failure or equipment damage caused by voltage mismatch. This design can also provide sufficient driving capability to ensure that the signal can effectively activate the input terminal 1100 of the module, thereby improving the accuracy and efficiency of the test.

[0097] In the third embodiment, the test device 2 further includes a communication interface circuit 600, and both the output module and the input module are connected to the communication interface circuit 600, and the communication interface circuit 600 is used to send communication signals to the module to be tested 3 and receive communication signals sent by the module to be tested 3. With such a structural setting, the addition of the communication interface circuit 600 enables the test device 2 to perform two-way data communication with the module to be tested 3, so that its communication capability can be detected, achieving comprehensive test coverage, and improving the integrity and accuracy of fault diagnosis.

[0098] Specifically, the control module 100 is a microcontroller, which is mainly composed of an STM32F103VCT6 single-chip microcomputer and its peripheral circuits. The output drive circuit 400 is composed of a triode control circuit, which uses the 3.3V signal generated by the microcontroller to control the 24V signal switch and drive the relay or other types of switches on the IO module. The signal input circuit 200 is mainly composed of an optocoupler isolation circuit, which is used to isolate the 24V input signal through an optocoupler and output a 3.3V signal. The communication interface circuit 600 is mainly composed of various types of communication circuits, which mainly depends on the communication mode of the module, such as Ethercat, RS232, TTL level, etc.

[0099] Specifically, the test device 2 further includes an alarm module 700, which is electrically connected to the control module 100 and is used to emit an alarm. In this way, the use of the alarm module 700 provides an intuitive fault feedback to the operator. When a module abnormality is detected, the alarm can immediately remind the operator, so that the fault can be discovered and handled in time, avoiding further test delays due to neglect or misjudgment, and improving work efficiency.

[0100] Specifically, the alarm module 700 is a buzzer alarm circuit, which is used to sound an alarm when an abnormality occurs in the IO module test.

[0101] Specifically, the test device 2 further includes an indicator light module 800, which is electrically connected to the control module 100 and is used to indicate the operating status and test results of the test device 2. In this way, the setting of the indicator light module 800 provides a visual operating status and test result feedback, and the operator can quickly understand the working status and test results of the test device 2 by observing the changes in the indicator light, which simplifies the operation process, reduces the subjective judgment of the test results, and improves the objectivity and convenience of the test.

[0102] Specifically, the indicator light module 800 is an indicator light circuit, which indicates the operating status of the test device 2, the communication status between the test device 2 and the IO module, the test results, etc.

[0103] Specifically, after the test head structure 4 is connected to the port 1 to be tested of the IO module, the test of the IO module can be started. The test is mainly divided into three parts: communication, output and input of the IO module.

[0104] In the communication test, there are many communication modes for the IO module, such as serial communication (RS-232 / RS-485), USB, Ethernet, Modbus, CAN bus, Profibus bus, etc. In the communication test using Ethercat as the communication mode, when the communication interface circuit 600 of the test device 2 cannot establish communication with the communication port 900 of the IO module, it indicates that there is an abnormality in the communication module of the IO module, the test device 2 issues an alarm message, and the indicator circuit displays the abnormal communication state. When the IO module is directly electrically connected to the upper-level control device through a flat cable or other wires, the communication test only has the connection of electrical signals, and does not involve the conversion of communication protocols and data.

[0105] In the test of the module output signal, the test device 2 sends an output control signal to the IO module. After receiving the output control signal, the IO module will output a signal. The output signal is transmitted to the test head structure 4 through the output terminal 1000, and then connected to the input wiring terminal 300 of the test device 2 to perform a data return test. The data is first stepped down by the signal input circuit 200 to reduce the data output by the IO module to a 3.3V level that the chip (equivalent to the control module 100) can receive, and the data that does not meet the output level of the IO module is eliminated through the signal input circuit 200. The microcontroller of the test device 2 compares the test signal sent. If the comparison is incorrect, for example, there is a lack of IO module output signal or the level output does not reach the normal output level of the IO module, an alarm message is issued. If it passes, the IO module output test verification is qualified, and the indicator light indicates that the output test is qualified.

[0106] In the test of the module input signal, the test device 2 sends a control signal to the output drive circuit 400, and the output drive circuit 400 converts the 3.3V level of the microcontroller into the input level of the IO module. The input level is connected to the test head structure 4 through the output cable terminal 500 and the cable. The test head structure 4 is connected to the interface terminal of the input end 1100 of the IO module. The IO module input end 1100 terminal detects the change of the external level and connects to the test device 2 through the output end 1000. After the signal input circuit 200 of the test device 2 converts the level, the data is connected to the microcontroller for comparison. If the comparison is incorrect, an alarm message is issued and the indicator light indicates that the test fails. If it passes, the IO module input test verification is qualified and the indicator light indicates that the input test passes.

[0107] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects: by simulating the input and output signals through the connection with the test head structure, it is possible to quickly verify whether there are abnormalities in all input and output ports of the IO module, thereby improving the test efficiency. The design of the test head structure enables rapid plugging and unplugging of all input and output terminals and signal extraction, thereby improving the test efficiency.

[0108] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0109] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0110] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0111] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0112] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only to facilitate the distinction between corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0113] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A test head structure, characterized in that: include: A connecting assembly (10) comprising a first connecting member (11) and a second connecting member (12) connected to each other; A push structure (20), at least a portion of which is used to connect to the connecting component (10), the push end of the push structure (20) is arranged opposite to the first connecting member (11), the push structure (20) is movably arranged along a first direction to approach or move away from the first connecting member (11) and drive the first connecting member (11) to move; the connecting component (10) is movably arranged along a second direction relative to the push structure (20) to move the second connecting member (12) closer to or away from the push structure (20), so that the connecting component (10) moves to a plug-in position that matches the size of the port (1) to be tested.

2. The test head structure according to claim 1, characterized in that: The push-pushing structure (20) comprises: A circuit board (21), wherein the circuit board (21) forms at least a part of the thrust structure (20).

3. The test head structure according to claim 2, characterized in that: The push-pushing structure (20) further comprises a buffer component (22), wherein the buffer component (22) is arranged at one end of the circuit board (21) close to the first connecting component (11); the buffer component (22) forms the push-pushing end of the push-pushing structure (20); Wherein, the buffer member (22) is a rubber member; and / or, The buffer components (22) are arranged to protrude from both sides of the circuit board (21).

4. The test head structure according to claim 2, characterized in that: The test head structure also includes an elastic member (30); Wherein, one end of the elastic member (30) is connected to the circuit board (21), and the other end of the elastic member (30) is connected to the second connecting member (12); and / or, The elastic member (30) is made of a conductive material; and / or, The elastic member (30) is a spring structure.

5. The test head structure according to claim 1, characterized in that: There are at least two connecting assemblies (10), one of the at least two connecting assemblies (10) is arranged opposite to the other and spaced apart, and the push structure (20) is located between one of the at least two connecting assemblies (10) and the other; or, The test head structure further comprises a fixed connection component, wherein the fixed connection component is fixedly connected to the push structure (20), the connection component (10) and the fixed connection component are arranged opposite to each other and at a distance, and the push structure (20) is located between the connection component (10) and the fixed connection component.

6. The test head structure according to claim 1, characterized in that: The connection assembly (10) further comprises: a transition piece (13), one end of the transition piece (13) being connected to the first connecting piece (11), and the other end of the transition piece (13) being connected to the second connecting piece (12); an extending direction of the transition piece (13) being arranged at a preset angle with respect to a peripheral wall of the port to be tested (1), wherein the preset angle is greater than 0° and less than 90°; Wherein, the connection assembly (10) has an initial position in which the transition piece (13) is arranged relative to the periphery of the port to be tested (1).

7. A testing device, characterized in that: include: The test head structure according to any one of claims 1 to 6.

8. The testing device according to claim 7, characterized in that: The test head structure comprises a first test head (41) and a second test head (42); the first test head (41) is used to connect to an output end (1000) of a module to be tested, and the second test head (42) is used to connect to an input end (1100) of the module to be tested; the test device further comprises: A control module (100), the control module (100) being used to generate a test electrical signal and receive the electrical signal emitted by the module to be tested, and to compare the test electrical signal with the electrical signal emitted by the module to be tested; An input module electrically connected to the control module (100); the input module is used to electrically connect to the first test head (41) so as to transmit to the control module (100) an electrical signal received by the first test head (41) and sent by the test port (1) of the test module; An output module is electrically connected to the control module (100); the output module is used to electrically connect to the second test head (42) to transmit the electrical signal generated by the control module (100) to the port (1) to be tested.

9. The testing device according to claim 8, characterized in that: The input module comprises a signal input circuit (200) and an input wiring terminal (300) which are connected to each other; the signal input circuit (200) is electrically connected to the control module (100), and the input wiring terminal (300) is used to connect to the first test head (41); the signal input circuit (200) is used to perform voltage regulation processing on the current output by the input wiring terminal (300); and / or, The output module comprises an output drive circuit (400) and an output wiring terminal (500) which are connected to each other; the output drive circuit (400) is electrically connected to the control module (100), and the output wiring terminal (500) is used to connect to the second test head (42); the output drive circuit (400) is used to perform voltage regulation on the current output by the control module (100); and / or, The test device further comprises a communication interface circuit (600), the output module and the input module are both connected to the communication interface circuit (600), and the communication interface circuit (600) is used to send communication signals to the module to be tested and receive communication signals sent by the module to be tested.

10. The testing device according to claim 7, characterized in that: The testing device also includes a control module (100); The testing device also includes: an alarm module (700), electrically connected to the control module (100), the alarm module (700) being used to emit an alarm sound; and / or, An indicator light module (800) is electrically connected to the control module (100), and the indicator light module (800) is used to indicate the operating state and test results of the test device.

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