Magnetic sensor device

Abstract

The invention provides a magnetic sensor device which can properly fix a sensor substrate on a support substrate and has stable output characteristics. A magnetic sensor device (1) is provided with a support substrate (2) and a sensor substrate (10) fixed to the support substrate (2). The sensor substrate (10) has a first surface (10B) facing the support substrate (2) and a second surface (10A) on which a functional film (20) including a plurality of magnetic detection elements (E) is provided, the second surface (10A) being located on the opposite side from the first surface (10B), a hole (11) is formed in the first surface (10B), and the contour (O11) of the hole (11) includes at least one corner (C1, C2, C3...). At least one corner (C1, C2, C3...) includes a first corner (C1) that overlaps at least one of the plurality of magnetic detection elements (E) in a plan view as viewed in a normal direction (Z) from the second surface (10A) toward the first surface (10B), and the radius of curvature of the first corner (C1) is formed to be 5 [mu] m or more.

Description

Technical Field

[0001] The present disclosure relates to magnetic sensor devices. Background Art

[0002] A magnetic sensor device having a sensor chip having a magnetic detection element disposed on a sensor substrate bonded to a support substrate by an adhesive. For example, Patent Document 1 discloses the following magnetic sensor device: a first chip and a second chip including a magnetic sensor for generating a detection signal, and a support body including an application-specific integrated circuit (ASIC) for processing the detection signal are prepared respectively, and the first chip and the second chip are bonded to the support body by an adhesive.

[0003] In such a magnetic sensor device, it is preferable to apply the adhesive so that it is slightly exposed from the bonding surface of the sensor substrate. If the amount of adhesive applied is insufficient, peeling may easily occur starting from the part where the adhesive is not applied, and the bonding strength may be reduced. If the amount of adhesive applied is excessive, the adhesive exposed from the sensor substrate adheres to the electrodes on the surface of the ASIC, etc., and the connection reliability may be reduced.

[0004] If a bottom hole or a through hole is formed on the bonding surface of the sensor substrate, the amount of adhesive exposed from the sensor chip is not likely to change due to surface tension even if the coating amount changes slightly. Since the adhesive layer becomes thicker, the bonding strength is also improved. Patent document 2 discloses a semiconductor device, which is not a magnetic sensor device, but a semiconductor element is mounted on a support body via an adhesive layer, wherein a recess is formed on the back side of the semiconductor element facing the support substrate.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2023-10557

[0008] Patent Document 2: Japanese Patent Application Publication No. 2010-205893 Summary of the invention

[0009] Problems to be solved by the invention

[0010] However, the magnetic sensor device is different from the semiconductor device described in Patent Document 2, and has a magnetic detection element made of a magnetic material. When an external force is applied to the magnetic material, the response to the magnetic field will change due to the inverse magnetostrictive effect. In particular, the tunnel magnetoresistance effect element has excellent output characteristics with a large MR ratio, but on the other hand, the output characteristics are easily changed by external forces. In addition, when a bottom hole or a through hole is formed on the sensor substrate, the thickness of the sensor substrate changes locally, so the thermal deformation of the sensor substrate when it expands or contracts due to temperature changes becomes uneven, which may act on the magnetic detection element. Thermal stress.

[0011] The present disclosure has been developed in view of such circumstances, and an object of the present disclosure is to provide a magnetic sensor device that can appropriately fix a sensor substrate to a support substrate and has stable output characteristics.

[0012] Technical solutions to solve problems

[0013] One embodiment of the present disclosure provides a magnetic sensor device, which includes a support substrate and a sensor substrate fixed to the support substrate. The sensor substrate has a first surface facing the support substrate and a second surface located on the side opposite to the first surface, that is, the second surface is provided with a functional film including a plurality of magnetic detection elements, a hole portion is formed on the first surface, the contour of the hole portion includes at least one corner, the at least one corner includes a first corner overlapping with at least one of the plurality of magnetic detection elements when viewed from above along a normal direction from the second surface toward the first surface, and the curvature radius of the first corner is formed to be 5 μm or more.

[0014] According to this method, a hole portion is formed on the sensor substrate, so that even if the amount of adhesive applied changes, the amount of adhesive exposed from the lower surface of the sensor substrate is not easy to change compared to a case where no hole portion is formed. The adhesive layer becomes thicker and the bonding strength is also improved. Therefore, the sensor substrate can be properly bonded to the supporting substrate. The hole portion can be a bottomed hole recessed from the first surface toward the second surface, or a through hole that passes from the first surface to the second surface. When viewed from above, if the radius of curvature of the corner of the contour of the hole portion is small, it is easy to be affected by thermal stress at a position overlapping with the corner. According to this method, the magnetic detection element can be arranged in a manner overlapping with the first corner having a radius of curvature of 5μm or more. Compared with the case where all corners of the hole portion must be avoided, there are fewer restrictions on the arrangement of the magnetic detection elements, and the degree of freedom in design is excellent. The position overlapping with a corner having a curvature radius of 5 μm or more is slightly more susceptible to thermal stress than the position not overlapping with the corner. However, compared with the position overlapping with a corner having a curvature radius of less than 5 μm, the influence of thermal stress is sufficiently small. Therefore, a magnetic sensor device with stable output characteristics can be provided.

[0015] In the above aspect, the sensor substrate may be fixed to the support substrate using an adhesive, and the hole may be filled with the adhesive.

[0016] According to this aspect, the sensor substrate can be appropriately fixed to the support substrate using the adhesive.

[0017] In the above aspect, at least one corner may be a plurality of corners, and the outline may be a polygon in which all of the plurality of corners have an R angle with a curvature radius of 5 μm or more.

[0018] According to this aspect, no matter which corner the magnetic detection element is arranged at, the influence of thermal stress is small, so there is no need to pay attention to the corner where the magnetic detection element cannot be arranged. The degree of freedom in design is excellent.

[0019] In the above method, it is also possible that, when viewed from above, the plurality of magnetic detection elements include at least one first magnetic detection element configured to overlap with the contour, and a plurality of second magnetic detection elements configured not to overlap with the contour, a portion of the plurality of second magnetic detection elements is configured on the inner side of the contour when viewed from above, and the remaining portion of the plurality of second magnetic detection elements is configured on the outer side of the contour when viewed from above. In the above method, it is also possible that the plurality of magnetic detection elements further include at least one second magnetic detection element configured not to overlap with the contour when viewed from above, and all of the at least one second magnetic detection element is configured on the inner side of the contour when viewed from above. All of the at least one second magnetic detection element may also be configured on the outer side of the contour when viewed from above.

[0020] According to these methods, the first magnetic detection element overlapping with the contour and the second magnetic detection element not overlapping with the contour can be mixed, the second magnetic detection element can be arranged across the inside and outside of the contour, the second magnetic detection element can be arranged only on the inside of the contour, and the second magnetic detection element can be arranged only on the outside of the contour. There are few restrictions on the arrangement of the magnetic detection elements, and the degree of freedom of design is excellent.

[0021] In the above aspect, the hole portion may be a bottomed hole recessed from the first surface toward the second surface, and a depth of the bottomed hole in the normal direction may be less than or equal to half of the thickness of the sensor substrate.

[0022] The deeper the hole portion, the greater the difference in plate thickness between the hole portion and the portion outside the hole portion, and the more susceptible the magnetic detection element is to thermal stress when the sensor substrate expands or contracts due to temperature changes. According to this embodiment, the difference between the hole portion and the portion outside the hole portion is less than half of the plate thickness, and thus, a magnetic sensor device can be provided in which the influence of thermal stress is not too large and the output characteristics are stable.

[0023] In the above aspect, a wiring layer may be further provided in a layer farther from the support substrate than the functional film in the normal direction, and each of the plurality of magnetic detection elements may be arranged inside an outline of the wiring layer in a plan view.

[0024] When the magnetic detection element is arranged inside the outline of the wiring layer, the magnetic detection element is less susceptible to thermal stress than when there is no wiring layer.

[0025] In the above aspect, the hole may have an inner surface inclined with respect to a normal direction, and each of the plurality of magnetic detection elements may be arranged so as not to overlap with the inner surface in a plan view.

[0026] The position overlapping the inclined inner surface is easily affected by thermal stress. According to this aspect, each of the plurality of magnetic detection elements does not overlap the inclined inner surface, so it is possible to provide a magnetic sensor device that is less susceptible to thermal stress and has stable output characteristics.

[0027] In the above-described method, the angle sensor may include a magnetic sensor device, the magnetic compass may include a magnetic sensor device, the current sensor may include a magnetic sensor device, or the autofocus mechanism and / or optical shake correction mechanism of the camera module may include a magnetic sensor device.

[0028] According to these aspects, the magnetic sensor device can be used for various purposes.

[0029] Effects of the Invention

[0030] According to the present disclosure, it is possible to provide a magnetic sensor device in which a sensor substrate can be appropriately fixed to a support substrate and output characteristics are stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a perspective view showing a magnetic sensor device according to one embodiment.

[0032] Figure 2 It is schematically indicated Figure 1 A cross-sectional view of an example of the internal structure of the magnetic sensor device shown.

[0033] Figure 3 Yes Description Figure 1 A perspective view of the manufacturing process of the magnetic sensor device shown.

[0034] Figure 4 This is a diagram showing an example of a magnetic sensor device configured as an angle sensor.

[0035] Figure 5 This is a plan view showing an example of a magnetic sensor device configured as a magnetic compass.

[0036] Figure 6 FIG. 1 is a diagram showing an example of a magnetic sensor device used as a part of a current sensor.

[0037] Figure 7 Yes means Figure 6 The circuit structure of the current sensor is shown in the figure.

[0038] Figure 8 This is a perspective view showing an example of a magnetic sensor device used as a part of an autofocus mechanism and an optical shake correction mechanism of a camera module.

[0039] Fig. 9 Yes means Figure 8 A cross-sectional view of the internal structure of a camera module is shown.

[0040] Fig. 10A This is a plan view of a simulated model in which a quadrilateral hole is formed, viewed from the normal direction.

[0041] Fig. 10B This is a top view of a simulated model in which a quadrilateral hole with rounded corners is formed, viewed from the normal direction.

[0042] Fig. 10C This is a plan view of a simulated model in which a circular hole is formed, viewed from the normal direction.

[0043] Fig. 10D This is a plan view of a simulated model further including a wiring layer as viewed from the normal direction.

[0044] Fig. 10E This is a top view of a simulated model having an inclined inner surface as viewed from the normal direction.

[0045] Fig.11 This is a cross-sectional view of the simulated model observed along the XY plane that is orthogonal to the normal direction.

[0046] Fig.12 and Fig.13 It means in Fig. 10A and Fig.11 Plot of the simulated angular error for each position shown.

[0047] Fig.14 It means in Fig. 10A , Fig. 10B and Fig. 10C Plot of the simulated angular error for each position shown.

[0048] Fig.15 It means in Fig. 10A , Fig. 10B and Fig. 10C Simulation of each position shown Fig. 10D Graph of the angle error of the model with wiring layers shown.

[0049] Fig.16 It means in Fig. 10E Plot of the simulated angular error for each position shown.

[0050] Figure 17 to Figure 19 These are plan views showing first to third examples in which the magnetic detection element is arranged so as to overlap with the first corner having a curvature radius of 5 μm or more.

[0051] Fig. 20 It is a plan view showing a fourth example in which the magnetic detection element is arranged inside the outline of the wiring layer.

[0052] Fig.21 It is a cross-sectional view showing a fifth example in which the magnetic detection element is arranged so as not to overlap with the inclined inner surface. DETAILED DESCRIPTION

[0053] The preferred embodiments are described with reference to the accompanying drawings. In the drawings, components with the same reference numerals have the same or similar structures. One of the characteristics of the magnetic sensor device 1 of one embodiment of the present disclosure is that a hole 11 is formed on the sensor substrate 10. Figures 17 to 20 As shown, when viewed from above along the normal direction Z, although at least one magnetic detection element E is configured to overlap with the corner C1 of the contour O11 of the hole 11, the curvature radius of the corner C1 overlapping with the magnetic detection element E is greater than 5 μm. The contour O11 of the hole 11 may also be a polygon such as a quadrilateral including a plurality of corners C1, C2, C3…. The corners C1, C2, C3…, for example, may also be referred to as vertices C1, C2, C3… where the curvature takes a maximum value. The contour O11 of the hole 11 may be an ellipse having a pair of vertices C1 and C2, or may be a combination of the vertex C1 and a curve such as a teardrop shape. For example, in an arc of a circle with a constant curvature sandwiched between two straight lines such as an R angle, the corners C1, C2, C3… may also be the midpoints of the arc (refer to Fig. 10B ).

[0054] The magnetic sensor device 1 of the position embodiment of the present disclosure comprises a supporting substrate 2 and a sensor substrate 10 fixed to the supporting substrate 2 by an adhesive AD, the sensor substrate 3 having a first surface 10B facing the supporting substrate 2 and a second surface 10A located on the side opposite to the first surface 10B, that is, the second surface 10A provided with a functional film 20 including a plurality of magnetic detection elements E, the adhesive AD is filled into a hole portion 11 which is a bottomed hole recessed from the first surface 10B toward the second surface 10A or formed as a through hole penetrating from the first surface 10B to the second surface 10A, the contour O11 of the hole portion 11 includes at least one vertex C1, C2, C3, ... having a maximum curvature, and when viewed from above along the normal direction Z from the second surface 10A toward the first surface 10B, at least one vertex C1, C2, C3, ... includes a first vertex C1 overlapping with at least one of the plurality of magnetic detection elements E, and the curvature radius of the first vertex C1 is formed to be 5 μm or more. Hereinafter, with reference to Figure 1 to Figure 21Each structure is described in detail.

[0055] Figure 1 1 is a perspective view showing a magnetic sensor device 1 according to an embodiment. In the example shown in the figure, the magnetic sensor device 1 includes a support substrate 2, a sensor chip 3, a wiring layer 4, a sealing resin 5, an electrode 6, etc. One magnetic sensor device 1 may include a plurality of sensor chips 3.

[0056] like Figure 1 As shown in FIG. 1 , the support substrate 2 is formed in a flat plate shape having an upper surface 2A and a lower surface 2B on the opposite side of the upper surface 2A. In the following description, the thickness direction of the support substrate 2 is referred to as a normal direction Z or an up-down direction Z, the direction from the lower surface 2B toward the upper surface 2A is referred to as an upper direction, and the direction from the upper surface 2A toward the lower surface 2B is referred to as a lower direction. The upper surface 2A extends parallel to the XY plane orthogonal to the normal direction Z.

[0057] Figure 2 It is schematically indicated Figure 1 1 is a cross-sectional view of an example of the internal structure of the magnetic sensor device 1 shown in FIG. In the example shown in the figure, the support substrate 2 is an ASIC (Application Specific Integrated Circuit), and the electrode 2E electrically connected to the wiring layer 4 is provided on the upper surface 2A. The support substrate 2 is not limited to an ASIC, and may also be a silicon substrate or a sapphire substrate. It may also be a relay substrate (interposer) on which only wiring without an integrated circuit is formed on these substrates.

[0058] The sensor chip 3 is fixed to the upper surface 2A of the support substrate 2 by using an adhesive AD. Figure 2 As shown, the sensor chip 3 includes a sensor substrate 10, at least one magnetic detection element array 30 for generating a detection signal, and a functional film 20 surrounding the magnetic detection element array 30. The functional film 20 may be an inorganic film with silicon dioxide (SiO2) as a main component, or a laminated film of an inorganic film with silicon dioxide as a main component and an inorganic film with aluminum oxide (Al2O3) as a main component.

[0059] The sensor substrate 10 is, for example, a silicon substrate, and is disposed between the upper surface 2A of the support substrate 2 and the functional film 20. The sensor substrate 10 has a first surface (lower surface) 10B facing the support substrate 2, and a second surface (upper surface) 10A on the side opposite to the first surface 10B. A functional film 20 including a magnetic detection element array 30 is provided on the second surface 10A. A hole portion 11 capable of being filled with an adhesive AD is formed on the first surface 10B of the sensor substrate 10. The hole portion 11 may be a bottomed hole recessed from the first surface 10B of the sensor substrate 10 toward the second surface 10A, or may be a through hole penetrating from the first surface 10B to the second surface 10A.

[0060] Each magnetic detection element array 30 is composed of a plurality of magnetic detection elements E ( Fig.17 An example of the magnetic detection element E is a TMR (tunnel magnetoresistance effect) element. The magnetic detection element E is not limited to a TMR element, and may be a GMR (giant magnetoresistance effect) element, an AMR (anisotropic magnetoresistance effect) element, a Hall element, or other types of magnetic detection elements. Compared with other types of MR elements, the TMR element has a small bonding area, which can miniaturize the sensor chip 3, and a large MR ratio, which can increase the output of the sensor chip 3. Therefore, it is particularly suitable for the magnetic detection element E.

[0061] The magnetic detection element array 30 is arranged on the upper surface 2A side of the support substrate 2 and is formed on the first layer L1 on the upper surface 2A side of the support substrate 2. The wiring layer 4 is arranged on the upper surface 2A side of the support substrate 2 and is formed on a second layer L2 different from the first layer L1. The second layer L2 is located farther from the support substrate 2 than the first layer L1.

[0062] The wiring layer 4 extends parallel to the upper surface 2A of the support substrate 2 and electrically connects the electrode 2E of the support substrate 2 and the electrode 3E provided on the upper surface 3A of the sensor chip 3 via a plurality of via holes 40 extending in the normal direction Z. The wiring layer 4 is arranged to partially overlap the sensor substrate 10 in the normal direction Z.

[0063] The sealing resin 5 is disposed on the upper surface 2A side of the support substrate 2, and covers the sensor chip 3 and the wiring layer 4. The sealing resin 5 is formed by a plurality of resin layers 51, 52, 53 ( Figure 3The wiring layer 4 is, for example, copper plating provided on the upper surface of the resin layers 51 and 52. The electrode 6 is, for example, a solder ball or a copper column, electrically connected to the wiring layer 4, and exposed from the sealing resin 5.

[0064] Figure 3 Yes Description Figure 1 The manufacturing process of the magnetic sensor device 1 is shown in FIG. Figure 3 As shown in (A), using adhesive AD ( Figure 2 The sensor chip 3 is fixed on the upper surface 2A of the support substrate 2 (as shown in FIG. 1 ). At this time, when the amount of adhesive AD applied is insufficient, peeling is likely to occur starting from the portion where the adhesive is not applied, and when the amount of adhesive AD applied is excessive, the adhesive exposed from the sensor chip 3 adheres to the electrode 2E on the upper surface 2A of the support substrate 2. Therefore, it is preferable to apply the adhesive AD in a manner that it is slightly exposed from the lower surface of the sensor chip 3.

[0065] like Figure 3 As shown in FIG. 1B , a resin layer (first resin layer) 51 is formed to cover the sensor chip 3 and the upper surface 2A of the support substrate 2, and a via hole 40 ( Figure 2 As shown in FIG. Figure 3 As shown in (C), a seed layer is formed by sputtering or the like, and via holes 40 and first wiring layer 41 are formed by plating. Figure 3 The process shown in (C) can be either a subtractive process or an additive process.

[0066] like Figure 3 As shown in (D), a resin layer (second resin layer) 52 is formed to cover the via hole 40, the first wiring layer 41, and the resin layer 51, and a through hole 40P for the via hole 40 is opened. Figure 3 As shown in (E), by Figure 3 (C) The via hole 40 and the second wiring layer 42 are formed by the same process. Figure 3 As shown in (F), a resin layer (third resin layer) 53 is formed to cover the via hole 40, the second wiring layer 42, and the resin layer 52, and a through hole 6P for the electrode 6 is opened. Figure 3 As shown in (G), solder or the like is filled into the through hole 6P to form the electrode 6. Figure 3 By electrically connecting the prepared support substrate 2 and the sensor chip 3 in the order shown in (A) to (G), it is possible to obtain Figure 1 The magnetic sensor device 1 is shown.

[0067] Figure 41 is a diagram showing an example of a magnetic sensor device 1 configured as an angle sensor that generates a detection value corresponding to the angle of a detection object. In the example shown in the figure, the magnetic sensor device 1 is configured as an angle sensor that detects the angle of a magnet 300 that can rotate about the central axis O of a cylinder as a rotation axis. In the example shown in the figure, the X direction, the Y direction, and the Z direction are orthogonal to each other, and the central axis O is parallel to the Z direction.

[0068] The magnetic sensor device 1 detects a first component of the magnetic field generated by the magnet 300, that is, a magnetic field component MF applied to the magnetic sensor device 1, in a direction parallel to the X direction, and generates a first detection signal indicating the intensity of the first component, and detects a second component of the magnetic field generated by the magnet 300 in a direction parallel to the Y direction, and generates a second detection signal indicating the intensity of the second component. The processor (not shown) calculates the angle θ formed by the magnetic field generated by the magnet 300 and the reference direction DR by calculating the arc tangent of the ratio of the first detection signal to the second detection signal.

[0069] Figure 5 FIG. 1 is a diagram showing an example of a magnetic sensor device 1 configured as a magnetic compass for generating a detection value corresponding to an angle of the earth's magnetism. Figure 5 As shown, the magnetic sensor device 1 includes three sensor chips 3 (first to third sensor chips 3X, 3Y, and 3Z), and the first to third sensor chips 3X, 3Y, and 3Z are configured to detect components of the external magnetic field in three directions orthogonal to each other.

[0070] Figure 6 1 is a diagram showing an example of a magnetic sensor device 1 used as a part of a current sensor 400 for generating a detection value corresponding to a current value of a detection object. In the example shown in the figure, the current sensor 400 is configured to detect the value of the current Itg flowing through the bus 410. A magnetic field MF is generated around the bus 410 by the current Itg. The current sensor 400 is arranged at a position where the magnetic field MF is applied and near the bus 410.

[0071] Figure 7 Yes means Figure 6 FIG. 4 is a diagram showing a circuit structure of a current sensor 400 shown in FIG. 4 . In the example shown in the figure, the current sensor 400 is configured as a magnetic balance current sensor. The current sensor 400 includes a coil 420 in addition to the magnetic sensor device 1. The coil 420 is used to generate a second magnetic field MF2 that cancels out the first magnetic field MF1 of the magnetic field MF. The magnetic sensor device 1 detects a residual magnetic field between the first magnetic field MF1 and the second magnetic field MF2, and generates a magnetic field detection value S corresponding to the strength of the magnetic field.

[0072] The current sensor 400 also includes a feedback circuit 430, a current detector 440, and the like. The feedback circuit 430 flows a feedback current for generating a second magnetic field MF2 to the coil 420 based on the magnetic field detection value S. The current detector 440 detects the value of the feedback current flowing through the coil 420. The current detector 440 is, for example, a resistor inserted into the current path of the feedback current. In this case, the potential difference between the two ends of the resistor is equivalent to the detection value of the feedback current. The detection value of the feedback current is in a proportional relationship with the value of the current Itg of the bus 410, and therefore, the value of the current Itg can be detected based on the detection value of the feedback current.

[0073] The magnetic sensor device 1 disclosed in the present invention can be used as a magnetic compass mounted on electronic equipment such as information equipment to detect geomagnetism, can also be used as a part of the autofocus mechanism and optical shake correction mechanism of a camera module, can also be used as an angle sensor for detecting the angle formed by the magnetic field generated by a magnet and a reference direction, and can also be used as a part of a current sensor for detecting the value of the current flowing through a busbar.

[0074] Figure 8 1 is a perspective view showing an example of the magnetic sensor device 1 used as a part of the autofocus mechanism and the optical shake correction mechanism of the camera module 200 . Fig. 9 Yes means Figure 8 2 is a cross-sectional view of the internal structure of the camera module 200. The autofocus mechanism and the optical shake correction mechanism of the camera module 200 include a drive device 230 for moving the lens 220, and the drive device 230 is controlled based on the position information of the lens 220 detected by the plurality of magnetic sensor devices 1.

[0075] When describing in detail, the autofocus mechanism detects the state of focusing on the subject using an image sensor or an autofocus sensor, and moves the lens in the Z direction relative to the image sensor. The optical shake correction mechanism detects shake using a gyro sensor, and moves the lens in the U direction and / or V direction relative to the image sensor.

[0076] Figure 8 The camera module 200 shown includes an image sensor 210 such as a CMOS, a lens 220 aligned with the image sensor 210, a first holding component 241 movable in the U direction and the V direction relative to the image sensor 210, a second holding component 242 movable in the Z direction relative to the first holding component 241, a plurality of elastically deformable wires 244 supporting the first holding component 241 and the second holding component 242, a driving device 230 for moving the first holding component 241 and the second holding component 242, a frame 250 for housing these, and the like.

[0077] The autofocus mechanism and optical shake correction mechanism of the camera module 200 include a drive device 230 and a plurality of magnetic sensor devices 1, a processor for controlling the drive device 230, an autofocus sensor for detecting a state where a subject is in focus, a gyro sensor for detecting shake, etc. The processor, autofocus sensor, gyro sensor, etc., which are not shown, are arranged outside the housing.

[0078] The lens 220 is fixed inside the second holding member 242 formed in a cylindrical shape. The second holding member 242 is accommodated in the first holding member 241 formed in a box shape together with the lens 220. At least one second magnet 243 is fixed to the second holding member 242 so that at least one magnetic sensor device 1 detects the position information of the second holding member 242.

[0079] The driving device 230 includes a plurality of first coils 231, a plurality of second coils 232, a plurality of first magnets 233, etc. The plurality of first coils 231 are fixed to the frame 250. The plurality of second coils 232 are fixed to the second holding member 242. The plurality of first magnets 233 are fixed to the first holding member 241. Each of the plurality of first coils 231 is opposite to the corresponding first magnet 233. Each of the plurality of second coils 232 is opposite to the corresponding first magnet 233.

[0080] In the case of the autofocus mechanism, when a current flows to any second coil 232 according to an instruction from the processor, the second holding member 242 fixed to the second coil 232 moves in the Z direction due to the interaction between the magnetic field generated by the first magnet 233 and the magnetic field generated by the second coil 232. At least one magnetic sensor device 1 generates a detection signal based on a synthetic magnetic field synthesized by the magnetic field generated by at least one second magnet 243 fixed to the second holding member 242 and the magnetic field generated by the first magnet 233 fixed to the first holding member 241, and sends it to the processor. The processor detects the position information of the lens 220 in the Z direction based on the detection signal, and controls the drive device 230 so that the subject is focused.

[0081] In the case of the optical shake correction mechanism, when a current flows to any first coil 231 according to an instruction from the processor, the first holding member 241 fixed to the first magnet 233 moves in the U direction and / or the V direction due to the interaction between the magnetic field generated by the first magnet 233 and the magnetic field generated by the first coil 231. Each of the plurality of magnetic sensor devices 1 generates a detection signal based on the position of the corresponding first magnet 233 and sends it to the processor. The processor detects the position information of the lens 220 in the U direction and the V direction based on the detection signal, and controls the drive device 230 in a manner to correct the shake.

[0082] Next, refer to Figure 10A to Figure 21 The magnetic sensor device 1 of the present disclosure will be described in detail. Fig. 10A It is a plan view of a simulated model in which a hole 11 having a quadrilateral outline O11 is formed on the first surface 10B of the sensor substrate 10 as viewed from the normal direction Z, and shows positions P and Q drawn on the upper surface 3A of the sensor chip 3 .

[0083] like Fig. 10A As shown, the position directly above the corner C1 of the hole 11 of 280 μm square in the X-axis direction and the Y-axis direction is set to P=0, and the position is moved every 10 μm in the X-axis direction and the Y-axis direction, and is depicted as P=1, 2, 3, ... 14. For example, P=14 is a position 140 μm away from P=0 in the X-axis direction and the Y-axis direction. Similarly, the position directly above the corner C1 is set to Q=0, and the position is moved every 10 μm in the X-axis direction, and is depicted as Q=1, 2, 3, ... 14.

[0084] Fig. 10B This is a top view of a simulated model of a hole 11 having a quadrilateral with an R angle formed on the first surface 10B of the sensor substrate 10 as viewed from the normal direction Z, and shows a position P drawn on the upper surface 3A of the sensor chip 3. Fig. 10B As shown, the position directly above the corner C1 of the hole 11 which is 340 μm square in the X-axis direction and the Y-axis direction with an R angle of 200 μm in diameter is set to P=0, and it is moved every 10 μm in the X-axis direction and the Y-axis direction, and depicted as P=1, 2, 3, ... 14.

[0085] Fig. 10C This is a top view of a simulated model in which a circular hole 11 is formed on the first surface 10B of the sensor substrate 10 as viewed from the normal direction Z, and shows a position P drawn on the upper surface 3A of the sensor chip 3. Fig. 10C As shown, the position directly above the contour O11 of the circular hole 11 with a diameter of 400 is set as P=0, and P=1, 2, 3, ... 14 are plotted in increments of 10 μm in the X-axis direction and the Y-axis direction.

[0086] Fig. 10D is observed from the normal direction Z Fig. 10A The model shown also includes a top view of a simulated model of a wiring layer 4 having a size of 100 μm square in the X-axis direction and the Y-axis direction. The wiring layer 4 is arranged at a position where its center is P=0. Fig.15 In the simulation results, Fig. 10D same, Fig. 10B and Fig. 10CThe model shown also includes a wiring layer 4 arranged so as to be 100 μm square in the X-axis direction and the Y-axis direction with the position of P=0 being the center.

[0087] Fig. 10E 1 is a top view of a simulated model having an inner surface 11C inclined relative to the normal direction Z as viewed from the normal direction Z, and shows a position P drawn on the upper surface 3A of the sensor chip 3. Fig. 10E As shown in the figure, the simulation model is a hole 11 with a size of 400 μm square in the X-axis direction and the Y-axis direction, which will be described later. Fig.11 The deepest center depth D shown is 15 μm, and there is no bottom surface 10D. Instead, the inner surface 11C is formed into an inclined surface or a step shape. In this simulation model, a corner C1 of the hole 11 is added. Fig. 10D The wiring layer 4 shown is plotted as P=1, 2, 3, ... 14 at intervals of 10 μm in the X-axis direction and the Y-axis direction, with the position directly below the center of the wiring layer 4 being defined as P=0.

[0088] Fig.11 It is a cross-sectional view of the simulated model observed along the XY plane orthogonal to the normal direction Z. In addition, the contour O11 of the hole portion 11 is the contour of the bottom surface 11D of the hole portion 11, and is defined by the boundary between the bottom surface 11D and the inner surface 11C. The boundary between the bottom surface 11D and the inner surface 11C may also have an R angle. In this case, if the bottom surface 11D is flat and the depth D from the first surface 10B to the bottom surface 11D is approximately constant, the position where the depth D begins to gradually decrease is the boundary between the bottom surface 11D and the inner surface 11C.

[0089] Described later Figure 12 to Figure 16 In the simulation results, the thickness T of the sensor substrate 10 from the first surface 10B to the second surface 10A is 15 μm, and the thickness of the functional film 20 is also 15 μm. Fig.15 In the simulation results of , the distance from upper surface 3A of sensor chip 3 to the lower surface of wiring layer 4 is 5 μm.

[0090] Fig.12 Yes means Fig. 10A The position P shown is Fig.11 The diagram of the simulated angular error at each depth D is shown, with the horizontal axis being Fig. 10A The position P shown in the figure changes to 15 patterns ranging from 0 to 14. Fig.11 The depth D from the first surface 10B of the sensor substrate 10 to the bottom surface 11D of the hole 11 is changed to four patterns of 0 μm, 5 μm, 7.5 μm, and 15 μm. The simulation results of the angular error when a predetermined stress value is applied to the magnetic sensor device 1 are plotted on the vertical axis.

[0091] When the depth D is less than 15 μm, the hole 11 is formed as a bottomed hole that is recessed from the first surface 10B toward the second surface 10A of the sensor substrate 10. When the depth D is 15 μm, the hole 11 is formed as a through hole that passes from the first surface to the second surface. Even if the hole 11 is a through hole, the magnetic detection element E is fixed by the functional film 20 that surrounds the magnetic detection element E.

[0092] like Fig.12 As shown, in the model where the corner C1 does not have an R angle, in the simulation results, the closer to P = 0, the larger the angle error. When the magnetic detection element E is located directly above the corner C1, it is easily affected by the thermal stress from the sensor substrate 10. When the corner C1 does not have an R angle, it is preferred that each of the magnetic detection elements E is spaced apart from the corners C1 to C4 by more than 10 μm in the in-plane direction orthogonal to the normal direction Z. In addition, the deeper the depth D of the hole 11, the larger the angle error. The depth D of the hole 11 is preferably less than half of the thickness T = 30 μm of the sensor substrate 10.

[0093] Fig.13 Yes means Fig. 10A The position Q shown in Fig.11 The diagram of the simulated angular error at each depth D is shown, with the horizontal axis being Fig. 10A The position Q shown changes to 14 patterns from 1 to 14, making Fig.11 The depth D of the hole 11 is changed into four patterns of 0 μm, 5 μm, 7.5 μm, and 15 μm, and the simulation results of the angle error when a predetermined stress value is applied to the magnetic sensor device 1 are plotted on the vertical axis.

[0094] like Fig.13 As shown, in the model without R angle in corner C1, the closer to Q = 0 (with Fig.12 The larger the angle error is, the closer the angle C1 is to the corner C1, the larger the angle error is. When the magnetic detection element E is located directly above the corner C1, it is easily affected by the thermal stress from the sensor substrate 10. When the corner C1 does not have an R angle, both P separated from the contour O11 of the hole 11 and Q moving on the contour O11 of the hole 11 have the same tendency that the closer to the corner C1, the larger the angle error is.

[0095] Fig.14 This means that the depth D of the hole 11 is fixed at 15 μm and Fig. 10A , Fig. 10B and Fig. 10C The illustrated position P is changed into 15 patterns of 0 to 14 and the angle error of the simulation is obtained when a predetermined stress value is applied to the magnetic sensor device 1 .

[0096] like Fig.14As shown in FIG. 1 , the angle error increases in the order of the model in which the contour O11 of the hole 11 is a quadrilateral with an R angle, the model in which the contour O11 is a circular model, and the model in which the contour O11 is a quadrilateral with an R angle. In any model, the angle error tends to increase as the model approaches P=0, but in the model in which the contour O11 of the hole 11 is a quadrilateral with an R angle, the angle error is less than 1 / 7 compared with the model in which the contour O11 is a quadrilateral without an R angle even just above the corner C1.

[0097] Fig.15 The depth D of the hole 11 is fixed at 15 μm and the Fig. 10D The wiring layer 4 shown in FIG. Fig. 10A , Fig. 10B and Fig. 10C The illustrated position P is changed into 15 patterns of 0 to 14 and the angle error of the simulation is obtained when a predetermined stress value is applied to the magnetic sensor device 1 .

[0098] When with Fig.14 and Fig.15 When comparing the simulation results, the model with the wiring layer 4 tends to have a smaller angular error than the model without the wiring layer 4 at positions P=0 to 3 inside the outline O4 of the wiring layer 4, when the outline O11 of the hole 11 is a quadrilateral, a quadrilateral with R, or a circle. That is, it can be expected that the sensor substrate 10 is less likely to be affected by thermal stress. However, in the quadrilateral model, the angular error of the model with the wiring layer 4 is larger than that of the model without the wiring layer 4 at positions P=4 to 6 near the outline O4 of the wiring layer 4.

[0099] Fig.16 Indicates Fig. 10E The angular error of the simulation when P changes to 15 patterns ranging from 0 to 14 and a predetermined stress value is applied to the magnetic sensor device 1 is shown. Fig.15 and Fig.16 Comparing the simulation results, the angular error of the model in which the inner surface 11C is inclined relative to the normal direction Z and the model in which the inner surface 11C is formed in a stepped shape are larger than that of the model in which the inner surface 11C is not inclined. In other words, the sensor substrate 10 tends to be easily affected by thermal stress.

[0100] Reference Figures 17 to 21 The preferred examples of the present disclosure are described. Fig.12 and Fig.13 As described above, the magnetic detection element E is easily affected by the thermal stress from the sensor substrate 10 just above the corner without the R angle, so the angle error becomes large. Figures 17 to 20 1 to 4 are top views showing the first to fourth examples of making the corners overlapping with the magnetic detection element E have R. Fig.14As described above, when an R angle is provided, the angle error can be reduced even directly above the corner.

[0101] Figures 17 to 20 In the first to fourth examples shown, the outline O11 is a quadrilateral and includes a first corner overlapping at least one of the plurality of magnetic detection elements E in a plan view. The first corner has a curvature radius of 5 μm or more. Fig.17 In the first example shown, the corners C2 and C3 are provided with an R angle having a radius of 5 μm or more. The corners C2 and C3 are examples of first corners.

[0102] The position overlapping with the corners C2 and C3 having a curvature radius of 5 μm or more is slightly more susceptible to thermal stress than the position not overlapping with any of the corners C1 to C4, but the influence of thermal stress is sufficiently small compared to the position overlapping with the corners C1 and C4 having a curvature radius of less than 5 μm. According to the first example, a magnetic sensor device 1 having a stable output characteristic can be provided. In addition, according to the first example, the magnetic detection element E can be arranged in a manner overlapping with the corners C2 and C3 having a curvature radius of 5 μm or more, so that compared with the case where the corners C1 to C4 of all the hole portions 11 must be avoided, there are fewer restrictions on the arrangement of the magnetic detection element E, and the degree of freedom of design is excellent.

[0103] In the first example, the plurality of magnetic detection elements E include at least one first magnetic detection element E1 configured to overlap with the outline O11 in a plan view, and a plurality of second magnetic detection elements E2 configured not to overlap with the outline O11. In a plan view, a portion of the plurality of second magnetic detection elements E2 is configured inside the outline O11, and in a plan view, the remaining portion of the plurality of second magnetic detection elements E2 is configured outside the outline O11. In other words, in Fig.17 In the first example shown, the magnetic detection element E is arranged so as to straddle the inside and outside of the outline O11.

[0104] exist Fig.18 and Fig.19 In the second and third examples shown, all of the plurality of corners C1 to C4 have an R angle with a curvature radius of 5 μm or more. Fig.18 In the second example shown, the entire second magnetic detection element E2 is arranged inside the outline O11 in a plan view. Fig.19 In the third example shown, the entire second magnetic detection element E2 is arranged outside the contour O11 when viewed from above. According to the second and third examples, since all of the plurality of corners C1 to C4 have an R angle with a curvature radius of 5 μm or more, even if the magnetic detection element E is arranged at any of the corners C to C4, the influence of thermal stress is small. A magnetic sensor device 1 with stable output characteristics can be provided. The magnetic detection element E can be arranged in a manner overlapping the corners C1 to C4, so there are fewer restrictions on the arrangement of the magnetic detection element E than in the case where the corners C1 to C4 must be avoided.

[0105] like Fig.19 In the third example shown, the hole 11 may be arranged across a plurality of bridge circuits. Figures 17 to 20 In the example shown, the magnetic sensor device 1 includes first to fourth magnetic detection element arrays 31, 32, 33, and 34, and two parallel circuits form a first bridge circuit. Fig.19 In the third example shown, the magnetic sensor device 1 further includes fifth to eighth magnetic detection element arrays 35 , 36 , 37 , and 38 , and a second bridge circuit is formed by two parallel circuits.

[0106] The first magnetic detection element array 31 and the second magnetic detection element array 32 are connected in series with the output port A interposed therebetween so as to constitute a parallel circuit of the first bridge circuit, and the third magnetic detection element array 33 and the fourth magnetic detection element array 34 are connected in series with the output port B interposed therebetween so as to constitute another parallel circuit of the first bridge circuit. Similarly, the fifth magnetic detection element array 35 and the sixth magnetic detection element array 36 are connected in series with the output port A interposed therebetween so as to constitute a parallel circuit of the second bridge circuit, and the seventh magnetic detection element array 37 and the eighth magnetic detection element array 38 are connected in series with the output port B interposed therebetween so as to constitute another parallel circuit of the second bridge circuit. The output ports A and B are connected to a galvanometer or the like.

[0107] Fig. 20 The magnetic detection element E is arranged inside the outline O4 of the wiring layer 4. Fig.17 The first example shown is a top view of the fourth example in which the wiring layer 4 is added. In the fourth example, as in the first example, the corners C2 and C3 are provided with an R angle with a radius of 5 μm or more. Corners C2 and C3 are an example of a first corner. According to the fourth example of the present disclosure, the magnetic detection element E can be arranged in a manner overlapping with the corners C2 and C3 with a curvature radius of 5 μm or more, and thus a magnetic sensor device 1 with stable output characteristics can be provided. Compared with the case where the corners C1 to C4 of all the hole portions 11 must be avoided, there are fewer restrictions on the arrangement of the magnetic detection elements E, and the degree of freedom in design is excellent. As shown in FIG. Fig.15 As described above, when the wiring layer 4 is added, the angle error becomes smaller inside the outline O4 of the wiring layer 4. In the fourth example, the influence of thermal stress can be expected to be smaller than that in the first example.

[0108] Fig.21 2 is a cross-sectional view showing a fifth example in which the magnetic detection element is configured so as not to overlap with the inclined inner surface. Fig.16As described above, in the case of having the inner surface 11C inclined with respect to the normal direction Z, the position overlapping with the inner surface 11C in a plan view tends to be easily affected by the thermal stress from the sensor substrate 10. In the ninth example, since each of the plurality of magnetic detection elements E does not overlap with the inclined inner surface 11C, the magnetic detection elements E are not easily affected by the thermal stress from the sensor substrate 10.

[0109] According to the magnetic sensor device 1 of the present disclosure constructed as above, a hole portion 11 is formed on the sensor substrate 10. Therefore, compared with a case where the hole portion 11 is not formed, even if the amount of adhesive AD applied changes, the amount of adhesive AD exposed from the first surface 10B of the sensor substrate 10 is not easily changed. The adhesive layer becomes thicker and the bonding strength is also improved. Therefore, the sensor substrate 10 can be bonded and properly fixed on the supporting substrate 2. When viewed from above, when the radius of curvature of the corner of the contour O11 of the hole portion 11 is small, it is easy to be affected by thermal stress at the position overlapping with the corner. As a result, the magnetic detection element E is configured in a manner that overlaps only the first corner (for example, corners C2, C3) with a curvature radius of 5μm or more, and is therefore not easily affected by thermal stress. A magnetic sensor device 1 that can provide a magnetic detection element array 30 with stable output characteristics.

[0110] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The various elements and their configurations, materials, conditions, shapes, and sizes of the embodiments are not necessarily limited to the examples and may be appropriately changed. In addition, the structures shown in different embodiments may be partially replaced or combined with each other.

[0111] Description of Reference Numerals

[0112] 1…magnetic sensor device, 2…support substrate, 2A…upper surface, 2B…lower surface, 2E…electrode, 3…sensor chip, 3A…upper surface, 3E…electrode, 3X…first sensor chip, 3Y…second sensor chip, 3Z…third sensor chip, 4…wiring layer, 5…sealing resin, 6…electrode, 6P…through hole, 10…sensor substrate, 10A…second surface (upper surface), 10B…first surface (lower surface), 11…hole portion (bottomed hole or through hole), 11 C…Inner surface (inner wall surface) of the hole, 11D…Bottom surface of the hole, 20…Functional film, 30…Magnetic detection element array, 31 to 38…First to eighth magnetic detection element arrays, 40…Via hole, 40P…Through hole, 41…First wiring layer, 42…Second wiring layer, 51 to 53…Resin layer, 200…Camera module, 210…Image sensor, 220…Lens, 230…Drive device, 231…First coil, 232…Second coil, 233…First magnet, 2 41…first holding member, 242…second holding member, 243…second magnet, 244…wire, 250…frame, 300…magnet, 400…current sensor, 410…busbar, 420…coil, 430…feedback circuit, 440…current detector, A…output port, AD…adhesive, B…output port, C1, C2, C3, C4…corner, D…depth of hole, DR…reference direction, E…magnetic detection element, E1…first magnetic detection element, E2… Second magnetic detection element, Itg…current, L1…first layer, L2…second layer, MF…magnetic field, MF1…first magnetic field, MF2…second magnetic field, O…center axis, O4…profile of wiring layer, O11…profile of hole, P, Q…position, S…magnetic field detection value, T…board thickness of sensor substrate, U, V…direction of shaking, W…wiring, X…left-right direction (an example of the direction within the plane), Y…front-back direction (another example of the direction within the plane), Z…normal direction, θ…angle.

Claims

1. A magnetic sensor device comprising: support base plate; a sensor substrate fixed to the support substrate, The sensor substrate has a first surface facing the support substrate and a second surface located on the opposite side to the first surface, the second surface being provided with a functional film including a plurality of magnetic detection elements. A hole is formed on the first surface, The profile of the hole portion includes at least one corner, The at least one corner includes a first corner overlapping at least one of the plurality of magnetic detection elements in a plan view along a normal direction from the second surface toward the first surface, and the first corner has a curvature radius of 5 μm or more.

2. The magnetic sensor device according to claim 1, in, The sensor substrate is fixed to the support substrate using an adhesive. The hole is filled with the adhesive.

3. The magnetic sensor device according to claim 1, in, The at least one corner is a plurality of corners, The contour is a polygon in which all of the plurality of corners have an R angle with a curvature radius of 5 μm or more.

4. The magnetic sensor device according to claim 1, in, The plurality of magnetic detection elements include at least one first magnetic detection element arranged to overlap with the outline in the plan view, and a plurality of second magnetic detection elements arranged not to overlap with the outline, In the plan view, a portion of the plurality of second magnetic detection elements is arranged inside the outline, and in the plan view, the remaining portion of the plurality of second magnetic detection elements is arranged outside the outline.

5. The magnetic sensor device according to claim 1, in, The plurality of magnetic detection elements include at least one first magnetic detection element configured to overlap with the outline in the plan view, and at least one second magnetic detection element configured not to overlap with the outline, In the plan view, the at least one second magnetic detection element is entirely arranged inside the outline.

6. The magnetic sensor device according to claim 1, in, The plurality of magnetic detection elements include at least one first magnetic detection element configured to overlap with the outline in the plan view, and at least one second magnetic detection element configured not to overlap with the outline, In the plan view, the at least one second magnetic detection element is entirely arranged outside the outline.

7. The magnetic sensor device according to claim 1, in, The hole portion is a bottomed hole that is recessed from the first surface toward the second surface. The depth of the bottomed hole in the normal direction is less than or equal to half of the thickness of the sensor substrate.

8. The magnetic sensor device according to claim 1, in, further comprising a wiring layer provided at a layer farther from the support substrate than the functional film in the normal direction, Each of the plurality of magnetic detection elements is arranged inside an outline of the wiring layer in the plan view.

9. The magnetic sensor device according to claim 1, in, The hole portion has an inner surface inclined relative to the normal direction, Each of the plurality of magnetic detection elements is arranged so as not to overlap with the inner surface in the plan view. 10 . An angle sensor comprising the magnetic sensor device according to claim 1 . 11 . A magnetic compass comprising the magnetic sensor device according to claim 1 . 12 . A current sensor comprising the magnetic sensor device according to claim 1 . 13 . A camera module comprising an autofocus mechanism and / or an optical shake correction mechanism including the magnetic sensor device according to claim 1 .

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