Method for manufacturing dimming device

Abstract

The invention provides a method for manufacturing a dimming device, which is not easy to generate damage such as cracks when cutting a mother substrate. A method for manufacturing a dimming device includes: a mother substrate holding step of holding one or two mother substrates on a holding device; a cutting step of cutting the mother substrate to cut the dimming panel; a lamination step of laminating one or two other mother substrates on the cut mother substrate; a panel unit manufacturing step for manufacturing a panel unit by repeating the cutting step and the laminating step; and a conductive member forming step of forming a conductive member on a side portion of the panel unit.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a dimming device. Background Art

[0002] The dimming device includes a panel unit formed by stacking a plurality of dimming panels (for example, refer to Patent Document 1). The dimming panel includes, for example, a first substrate and a second substrate, and a liquid crystal layer sealed between the substrates. The panel unit is manufactured, for example, by cutting four mother substrates at a time using a cutting device such as a cutter while four mother substrates are stacked.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-333567 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The mother substrate formed by stacking multiple pieces becomes one and becomes more rigid. When the stacked mother substrate is cut, the cut mother substrate will be subjected to the external force generated by the cutting and try to deform, but the multiple mother substrates formed as one are difficult to deform, so cracks and other damages caused by the cutting may occur in the mother substrate.

[0008] The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a method for manufacturing a dimming device that is less likely to be damaged by cracks or the like when a mother substrate is cut.

[0009] Solutions for solving technical problems

[0010] In a manufacturing method of a dimming device involved in one embodiment of the present disclosure, the dimming device includes a panel unit and a conductive component, the panel unit is stacked with at least four dimming panels in a first direction, the dimming panel has a first substrate and a second substrate overlapping with the first substrate in the first direction, the conductive component is arranged at an end of the panel unit in a second direction intersecting the first direction and extending in the first direction, the manufacturing method of the dimming device includes: a mother substrate holding step, holding a mother substrate connected to a plurality of the dimming panels on a holding device; a cutting step, after the mother substrate holding step, cutting the mother substrate and cutting out the dimming panel; a stacking step, after the cutting step, stacking other mother substrates different from the mother substrate relative to the cut mother substrate in the first direction; a panel unit manufacturing step, after the stacking step, repeatedly performing the cutting step and the stacking step to manufacture the panel unit; and a conductive component forming step, after the panel unit manufacturing step, forming the conductive component at the end of the panel unit in the second direction, the mother substrate and the other mother substrates are each one piece, or the mother substrate and the other mother substrates are respectively two stacked pieces. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a perspective view schematically showing the dimming device according to the first embodiment.

[0012] Figure 2 yes Figure 1 Cross-sectional view along line II-II.

[0013] Figure 3 yes Figure 2 The diagram shows a top view of the first substrate in the first and second dimming panels from the upper side.

[0014] Figure 4 yes Figure 2 The diagram shows a top view of the second substrate in the first and second dimming panels from the upper side.

[0015] Figure 5 yes Figure 2 The shown diagram is a top view of the first substrate in the third and fourth dimming panels from the top.

[0016] Figure 6 yes Figure 2 The top view of the second substrate in the third and fourth dimming panels from the top is shown.

[0017] Figure 7 It is a top view of the mother substrate.

[0018] Figure 8 It is a schematic diagram of a positioning device for positioning a mother substrate.

[0019] Fig. 9 It is a side view schematically showing a first cutting step in the manufacturing process of the dimming device.

[0020] Fig.10 yes Fig. 9 Top view of the .

[0021] Fig.11 It is a side view schematically showing a lamination process of a second mother substrate in the manufacturing process of the dimming device.

[0022] Fig.12 It is a side view schematically showing the second cutting step in the manufacturing process of the dimming device.

[0023] Fig.13 This is a side view schematically showing a state after all cutting steps in the manufacturing process of the dimming device are completed.

[0024] Fig.14 It is a perspective view schematically showing the dimming device according to the first embodiment.

[0025] Fig.15 It is a side view schematically showing a holding device according to a first modified example.

[0026] Fig.16 It is a side view schematically showing a holding device according to a second modified example.

[0027] Fig.17 It is a side view schematically showing a holding device according to a third modified example.

[0028] Fig.18 It is a side view schematically showing a first cutting step in the manufacturing process of the dimming device according to the second embodiment.

[0029] Fig.19 It is a side view schematically showing a second cutting step in the manufacturing process of the dimming device according to the second embodiment.

[0030] Description of Reference Numerals

[0031] 1, 1A, 1B, 1C, 1D: dimming panel; 2: first substrate; 3: second substrate; 4: liquid crystal layer; 100: dimming device; 110: panel unit; 120, 120A, 120B, 120C: mother substrate; 125: cutting line; 130: dividing sheet; 400: flexible printed substrate (wiring for external connection); 500: conductive component; 610: light-transmitting adhesive; 620: reversible adhesive; 700: cutting device; 710, 710A, 710B, 710C: holding device; 715: cutting machine. DETAILED DESCRIPTION

[0032] The method (implementation method) for implementing the present disclosure is described in detail with reference to the accompanying drawings. The present disclosure is not limited to the contents described in the following implementation methods. In addition, the constituent elements described below include elements that can be easily thought of by a person skilled in the art and substantially the same elements. Furthermore, the constituent elements described below can be appropriately combined.

[0033] In addition, the disclosure is only an example, and appropriate changes to the main purpose of the disclosure that can be easily thought of by a person skilled in the art are of course included in the scope of the present disclosure. In addition, in order to make the description clearer, the drawings sometimes schematically indicate the width, thickness, shape, etc. of each part compared with the actual method, but it is only an example and does not limit the interpretation of the present disclosure. In addition, in this specification and each figure, the same figure mark is sometimes used for the same elements as those described previously with respect to the figures that have appeared, and the detailed description is appropriately omitted. In addition, in the XYZ coordinates shown in the figure, the X direction is the front-to-back direction, and the X1 side is opposite to the X2 side. The X1 side is also called the front side, and the X2 side is also called the rear side. The Y direction is the left-right direction, and the Y1 side is opposite to the Y2 side. The Y1 side is also called the left side, and the Y2 side is also called the right side. The Z direction is the up-down direction (stacking direction). The Z1 side is opposite to the Z2 side. The Z1 side is also called the upper side, and the Z2 side is also called the lower side.

[0034] [First embodiment]

[0035] Figure 1 It is a perspective view schematically showing the dimming device according to the first embodiment. Figure 2 yes Figure 1 Cross-sectional view along line II-II.

[0036] like Figure 1 and Figure 2 As shown, the dimming device 100 of the first embodiment includes a panel unit 110, a conductive member 500, and a flexible printed circuit (FPC: FLEXIBLE PRINTED CIRCUITS) 400 as an example of external connection wiring. The external connection wiring is not limited to the flexible printed circuit 400, and may be a conductive wire.

[0037] like Figure 2 As shown, in this embodiment, the panel unit 110 is formed by stacking a plurality of (four in this embodiment) dimming panels 1 in the Z direction (first direction). The number of stacked dimming panels 1 can be, for example, four or more. The dimming panel 1 is a square in this embodiment, but the present invention is not limited thereto, and also includes polygons such as octagonal shapes.

[0038] Specifically, if Figure 2As shown, four dimming panels 1 are stacked in order from the upper side, dimming panels 1A, 1B, 1C, and 1D. Each dimming panel 1 includes a first substrate 2 arranged on the lower side, a second substrate 3 arranged on the upper side, a seal 600 provided between the first substrate 2 and the second substrate 3, a liquid crystal layer 4 filled inside the seal 600, and a terminal 200. In addition, the inside of the seal 600 is an effective area. In addition, when viewed from the Z direction, the first substrate 2 and the second substrate 3 have the same size. Moreover, for example, an external connection wiring (flexible printed substrate 400) is electrically connected to the terminal 200 of the first substrate 2 in the dimming panel 1D located at the lowermost side.

[0039] In addition, if Figure 1 As shown, the conductive member 500 extends along the Z direction (vertical direction) on the side of the panel unit 110. The conductive member 500 is formed by applying a paste containing a conductive material such as silver (Ag) or carbon (C) to the side of the panel unit 110 and curing it.

[0040] Next, wirings and terminals of the first substrate 2 and the second substrate 3 constituting the panel unit 110 will be described in detail. Figure 3 yes Figure 2 The diagram shows a top view of the first substrate in the first and second dimming panels from the upper side. Figure 4 yes Figure 2 The diagram shows a top view of the second substrate in the first and second dimming panels from the upper side. Figure 5 yes Figure 2 The shown diagram is a top view of the first substrate in the third and fourth dimming panels from the top. Figure 6 yes Figure 2 The top view of the second substrate in the third and fourth dimming panels from the top is shown.

[0041] As mentioned above Figure 2 As shown, the four dimming panels 1 are stacked in order from the top, namely, a dimming panel 1A, a dimming panel 1B, a dimming panel 1C and a dimming panel 1D.

[0042] like Figure 3 As shown, the first substrate 2 of the dimming panel 1A and the dimming panel 1B includes first terminals 210 , 220 , 230 , 240 and a liquid crystal driving electrode 250 . Figure 2 The terminal 200 shown includes first terminals 210, 220, 230, and 240. In addition, the first substrate 2 is square in a plan view and has a first side 21, a second side 22, a third side 23, and a fourth side 24. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0043] The first terminal 210 has straight portions 213 and 215. The straight portions 213 and 215 are wide strips. The straight portion 213 extends from the end 211 to the end 212. The straight portion 213 extends along the first side 21. The straight portion 215 extends from the end 212 to the end 214. The end 214 is connected to the wiring 251. A liquid crystal drive electrode 250 is provided in the center of the first substrate 2, and the wiring 251 is electrically connected to the liquid crystal drive electrode 250. The wiring 251 extends in the Y direction. A plurality of liquid crystal drive electrodes 250 are provided and extend in the X direction respectively.

[0044] The first terminal 220 has straight portions 223 and 225. The straight portions 223 and 225 are wide strips. The straight portion 223 extends from the end 221 to the end 222. The straight portion 223 extends along the second side 22. The straight portion 225 extends from the end 222 to the end 224. The end 224 is connected to the wiring 252. The wiring 252 is connected to the liquid crystal drive electrode 250. The wiring 252 extends in the Y direction.

[0045] The first terminal 230 has a straight portion 233 . The straight portion 233 is a wide strip-shaped body. The straight portion 233 extends from the end 231 to the end 232 . The straight portion 233 extends along the third side 23 .

[0046] The first terminal 240 has a straight portion 243 . The straight portion 243 is a wide strip-shaped body. The straight portion 243 extends from the end 241 to the end 242 . The straight portion 243 extends along the fourth side 24 .

[0047] like Figure 4 As shown, the second substrate 3 of the dimming panel 1A and the dimming panel 1B includes second terminals 310, 320, 330, 340 and a liquid crystal driving electrode 350. In addition, the second substrate 3 is a square in a plan view, and has a first side 31, a second side 32, a third side 33 and a fourth side 34. The first side 31 is located on the X1 side. The second side 32 is located on the X2 side. The third side 33 is located on the Y1 side. The fourth side 34 is located on the Y2 side.

[0048] The second terminal 310 has a straight portion 313 . The straight portion 313 is a wide strip-shaped body. The straight portion 313 extends from the end 311 to the end 312 . The straight portion 313 extends along the first side 31 .

[0049] The second terminal 320 has a straight portion 323 . The straight portion 323 is a wide strip-shaped body. The straight portion 323 extends from the end 321 to the end 322 . The straight portion 323 extends along the second side 32 .

[0050] The second terminal 330 has straight portions 333 and 335. The straight portions 333 and 335 are wide strips. The straight portion 333 extends from the end 331 to the end 332. The straight portion 333 extends along the third side 33. The straight portion 335 extends from the end 332 to the end 334. The end 334 is connected to the wiring 351. A liquid crystal drive electrode 350 is provided in the center of the second substrate 3, and the wiring 351 is electrically connected to the liquid crystal drive electrode 350. The wiring 351 extends in the X direction. A plurality of liquid crystal drive electrodes 350 are provided and extend in the Y direction respectively.

[0051] The second terminal 340 has straight portions 343 and 345. The straight portions 343 and 345 are wide strips. The straight portion 343 extends from the end 341 to the end 342. The straight portion 343 extends along the fourth side 34. The straight portion 345 extends from the end 342 to the end 344. The end 344 is connected to the wiring 352. The wiring 352 is electrically connected to the liquid crystal drive electrode 350. The wiring 352 extends in the X direction.

[0052] also, Figure 5 as well as Figure 6 The dimming panels 1C and 1D shown are obtained by rotating the dimming panels 1A and 1B 90 degrees in a clockwise direction (right-hand direction) when viewed from above. Therefore, the positions of the wiring, terminals and electrodes of the first substrate 2 and the second substrate 3 included in the dimming panels 1C and 1D are also obtained by rotating the wiring, terminals and electrodes of the first substrate 2 and the second substrate 3 included in the dimming panels 1A and 1B 90 degrees in a clockwise direction (right-hand direction). In addition, the dimming panels 1A and 1B are, for example, dimming panels for p-wave polarization, and the dimming panels 1C and 1D are, for example, dimming panels for s-wave polarization. In this way, by driving the dimming panel for p-wave polarization and the dimming panel for s-wave polarization respectively, the diffusion degree of light in two directions can be controlled.

[0053] Next, the manufacturing of the dimming device 100 will be described. Figure 7 It is a top view of the mother substrate. Figure 8 It is a schematic diagram of a positioning device for positioning a mother substrate. Fig. 9 It is a side view schematically showing a first cutting step in the manufacturing process of the dimming device. Fig.10 yes Fig. 9 Top view of the . Fig.11 It is a side view schematically showing a lamination process of a second mother substrate in the manufacturing process of the dimming device. Fig.12 It is a side view schematically showing the second cutting step in the manufacturing process of the dimming device. Fig.13 This is a side view schematically showing a state after all cutting steps in the manufacturing process of the dimming device are completed. Fig.14 It is a perspective view schematically showing the dimming device according to the first embodiment.

[0054] First, the mother substrate 120 is described. Figure 7 As shown, the mother substrate 120 has a rectangular shape when viewed from above. Specifically, the mother substrate 120 has a first side 121, a second side 122, a third side 123, and a fourth side 124. The mother substrate 120 of this embodiment has three dimming panels 1 connected in the left-right direction. That is, Figure 7 In the embodiment, a first substrate 2 and a second substrate 3 are stacked in a direction perpendicular to the paper surface, and a seal 600 and a liquid crystal layer 4 are provided between the first substrate 2 and the second substrate 3. Figure 7 The mother substrate 120 is cut along the cutting line 125 to form three dimming panels 1. The cutting line 125 is substantially parallel to the third side 123 and the fourth side 124.

[0055] Next, the positioning device 720 of the mother substrate 120 is described. Figure 8 As shown in the top view of , the positioning device 720 for positioning the mother substrate 120 includes positioning components 721, 722, 723, 724, force components 725, 726, and fixing components 727, 728. The positioning components abut against each side of the mother substrate 120. The positioning component 721 abuts against the third side 123. The positioning component 722 abuts against the first side 121. The positioning component 723 abuts against the second side 122. The positioning component 724 abuts against the fourth side 124. The fixing component 727 is configured to be separated from the second side 122 in a direction perpendicular to the second side 122. The fixing component 727 and the positioning component 723 are connected via the force component 725. The force component 725 extends substantially parallel to the third side 123 and the fourth side 124. The fixing component 728 is configured to be separated from the fourth side 124 in a direction perpendicular to the fourth side 124. The fixing member 728 and the positioning member 724 are connected via the biasing member 726. The biasing member 726 extends substantially parallel to the first side 121 and the second side 122.

[0056] Next, the holding device 710 for the mother substrate 120 will be described. Fig. 9 It is a side view schematically showing a first cutting step in the manufacturing process of the dimming device. Fig.10 yes Fig. 9 Top view of the .

[0057] like Fig. 9 As shown, the holding device 710 includes a mounting plate 711 and a support portion 712. Fig. 9 and Fig.10As shown, the carrier plate 711 is a flat plate that is rectangular when viewed from above. A through hole 713 is provided in the central portion of the carrier plate 711. The support portion 712 has a cylindrical shape in which the through hole 713 is provided. The through hole 713 of the support portion 712 is connected to the through hole 713 of the carrier plate 711. The holding device 710 has a vacuum adsorption function. That is, the support portion 712 is connected to a suction machine not shown in the figure, and air 714 is sucked from the through hole 713 of the support portion 712 to the suction machine. Thus, the mother substrate 120 can be held on the carrier plate 711 by vacuum adsorption.

[0058] Next, the cutting device 700 for the mother substrate 120 will be described. The cutting device 700 of this embodiment is, for example, Fig. 9 and Fig.10 The cutter 715 shown in the figure. However, in the present invention, in addition to the cutter 715, cutting using a laser, cutting using a wire saw, cutting using a water jet, etc. can also be applied.

[0059] Next, a method for manufacturing the dimming device 100 will be described. Fig.11 It is a side view schematically showing a lamination process of a second mother substrate in the manufacturing process of the dimming device. Fig.12 It is a side view schematically showing the second cutting step in the manufacturing process of the dimming device. Fig.13 This is a side view schematically showing a state after all cutting steps in the manufacturing process of the dimming device are completed. Fig.14 1 is a perspective view schematically showing the dimming device of the first embodiment. The manufacturing method of this embodiment is characterized in that the mother substrate is cut piece by piece. The following is a detailed description.

[0060] (Mother substrate holding process)

[0061] In the mother substrate holding process, Fig. 9 and Fig.10 As shown, a mother substrate 120 is placed and held on three holding devices 710. The mother substrate 120 connects three dimming panels 1 in the left-right direction. In other words, when the mother substrate 120 is cut using the cutting line 125, three dimming panels 1 are produced. One holding device 710 is provided for each dimming panel 1. As described above, a mother substrate 120 is held on three mounting plates 711 by vacuum adsorption.

[0062] In addition, Figures 9 to 13 In the process, the positioning device 720 (refer to Figure 8 ) is used to position the mother substrate, but the positioning device 720 is omitted from the figure. That is, in all the steps until the panel unit 110 is manufactured, the mother substrate is positioned by the positioning device 720.

[0063] (Cutting process)

[0064] The cutting process is performed after the mother substrate holding process. Fig. 9 as well as Fig.10 As shown, one mother substrate 120 is cut to produce three dimming panels 1. In the cutting process, the mother substrate 120 is also positioned by the positioning device 720.

[0065] As described above, the cutting device 700 is, for example, a cutter 715. Specifically, the cutter 715 is used to cut at the cutting line 125 to cut out three split pieces 130, namely, split pieces 131, 132, and 133 (see Fig.11 ). The partition sheets 131 , 132 , and 133 are respectively equivalent to one dimming panel 1 .

[0066] (Lamination process)

[0067] The lamination process is performed after the cutting process. Fig.11 As shown, a mother substrate 120A different from the mother substrate 120 is stacked on three split pieces 130. Specifically, a light-transmitting adhesive 610 is applied on the split pieces 131, 132, and 133, and the mother substrate 120A is placed on the light-transmitting adhesive 610, and the light-transmitting adhesive 610 is cured. In the stacking process, the mother substrate 120A is also positioned by the positioning device 720.

[0068] (Cutting process)

[0069] In the cutting process, Fig.12 As shown, the mother substrate 120A including the light-transmitting adhesive 610 is cut to obtain three split pieces 130, namely, split pieces 131A, 132A, and 133A. That is, the mother substrate 120A and the light-transmitting adhesive 610 are cut to obtain three split pieces 130, namely, split pieces 131A, 132A, and 133A. Each of the split pieces 131A, 132A, and 133A is equivalent to one dimming panel 1.

[0070] (Panel unit manufacturing process)

[0071] In the panel unit manufacturing process, the cutting process and the laminating process are repeated to manufacture the panel unit 110. Fig.13 The mother substrate is stacked on the three split pieces 130 shown, namely the split pieces 131A, 132A, and 133A, and then cut, and then another mother substrate is stacked and cut. Here, the third and fourth mother substrates from the bottom are rotated 90 degrees in the clockwise direction (right-hand direction) relative to the first and second mother substrates from the bottom when viewed from above.

[0072] Thus, the split sheet 131A is stacked on the split sheet 131, the split sheet 131B is stacked on the split sheet 131A, and the split sheet 131C is stacked on the split sheet 131B. Each of the split sheets 131, 131A, 131B, and 131C corresponds to one dimming panel 1. Therefore, one panel unit 110 is manufactured by the split sheets 131, 131A, 131B, and 131C.

[0073] Similarly, the split sheet 132A is stacked on the split sheet 132, the split sheet 132B is stacked on the split sheet 132A, and the split sheet 132C is stacked on the split sheet 132B. One panel unit 110 is manufactured by these split sheets 132, 132A, 132B, and 132C.

[0074] Furthermore, the split sheet 133A is stacked on the split sheet 133, the split sheet 133B is stacked on the split sheet 133A, and the split sheet 133C is stacked on the split sheet 133B. One panel unit 110 is manufactured by using these split sheets 133, 133A, 133B, and 133C. In this way, in this embodiment, the cutting process and the stacking process are repeated to manufacture three panel units 110.

[0075] (Conductive member forming process)

[0076] The conductive component forming process is performed after the panel unit manufacturing process. Fig.14 As shown in FIG. 1 , in the conductive component forming process, a conductive component 500 is formed on the side of the panel unit 110. Fig.14 In the figure, it is shown that Fig.13 The panel unit 110 is made of the leftmost split pieces 131, 131A, 131B and 131C in FIG. The conductive component 500 is arranged at the center of each side when the panel unit 110 is viewed from above. Specifically, for example, a paste containing a conductive material such as silver (Ag) or carbon (C) is applied to the side of the panel unit 110 and cured, thereby forming the conductive component 500.

[0077] Finally, the flexible printed circuit board 400 is connected to the terminal 200 (see Figure 2 ) are electrically connected. Thus, the dimming device 100 is completed.

[0078] As described above, the manufacturing method of the dimming device 100 of the first embodiment includes: a mother substrate holding step, in which a mother substrate 120 is held in a holding device 710; a cutting step, in which a mother substrate 120 is cut to cut out a dimming panel 1; a stacking step, in which a mother substrate 120A is stacked on a mother substrate 120 after being cut; a panel unit manufacturing step, in which the panel unit manufacturing step is repeated to manufacture the panel unit 110 by repeatedly performing the cutting step and the stacking step; and a conductive component forming step, in which a conductive component 500 is formed on the side of the panel unit 110. In this way, in the present embodiment, the mother substrate 120 and the other mother substrate 120A are each one piece, and in the cutting step, the mother substrate 120 and the other mother substrate 120A are cut one piece at a time.

[0079] As described above, conventionally, panel unit 110 is manufactured by cutting four stacked mother substrates. However, the four stacked mother substrates are difficult to deform due to their high rigidity, and may be damaged by cracks or the like due to cutting.

[0080] In contrast, in the present embodiment, the mother substrate 120 and the other mother substrates 120A are cut one by one. Therefore, the mother substrate 120 and the other mother substrates 120A are easily deformed during cutting, and are less likely to be damaged by cracks or the like.

[0081] In addition, according to the first embodiment, in the mother substrate holding step, the mother substrate 120 is held on the holding device 710 by vacuum adsorption. Therefore, if the air 714 is sucked, the mother substrate 120 can be held on the holding device 710, and if the suction of the air 714 is stopped, the mother substrate 120 can be removed from the holding device 710. In this way, the mother substrate 120 can be easily attached and detached by vacuum adsorption.

[0082] One holding device 710 is provided for each dimming panel 1 obtained by cutting the mother substrate 120. When the mother substrate 120 is cut, foreign matter such as fragments during cutting falls from the cut portion. Therefore, by arranging one holding device 710 corresponding to one dimming panel 1 obtained by cutting the mother substrate 120, the foreign matter is difficult to adhere to the holding device 710.

[0083] [First Modification]

[0084] Next, a holding device according to a first modified example will be described. Fig.15 1 is a side view schematically showing a holding device according to a first modification. In the first embodiment, a holding device 710 having a vacuum suction function is used, but in the first modification, a detachable reversible adhesive 620 is used.

[0085] like Fig.15 As shown, the holding device 710A of the first variant includes a holding component 713A and a reversible adhesive 620. The reversible adhesive 620 is an adhesive that can be repeatedly disassembled. Three holding components 713A are provided. The holding component 713A includes a carrier plate 711A and a support portion 712A. The carrier plate 711A is a flat plate that is, for example, rectangular in a plan view. The support portion 712A extends downward from the lower surface of the carrier plate 711A. The reversible adhesive 620 is provided on the carrier plate 711A. The reversible adhesive 620 joins and holds the mother substrate 120 to the carrier plate 711A.

[0086] As described above, according to the first modification, in the mother substrate holding step, the mother substrate 120 is held in the holding device 710A via the detachable reversible adhesive 620. Thus, the mother substrate 120 is held in the holding device 710A with a larger area, so that the mother substrate 120 can be held more stably. In addition, since the reversible adhesive 620 is detachable, it can be easily removed after the manufacturing is completed.

[0087] [Second Modification]

[0088] Next, a holding device according to a second modified example will be described. Fig.16 2 is a side view schematically showing a holding device according to a second modification. In the second modification, a large plate-shaped mounting plate 711B has a vacuum adsorption function.

[0089] like Fig.16 As shown, the holding device 710B of the second variant example includes a carrier plate 711B. The carrier plate 711B is a large plate-like component. The carrier plate 711B is, for example, rectangular in a plan view. A plurality of through holes 713B are provided on the carrier plate 711B. The carrier plate 711B is connected to a suction machine not shown in the figure, and the suction machine is used to suck air 714 from the through holes 713B of the carrier plate 711B. Thus, the mother substrate 120 can be held on the carrier plate 711B by vacuum adsorption.

[0090] As described above, according to the second modification, the holding device 710B includes the placement plate 711B and one holding device 710B is provided for each mother substrate 120. Therefore, the mother substrate 120 can be held with a larger area, so the mother substrate 120 can be held more stably.

[0091] [Third Modification]

[0092] Next, a holding device according to a third modified example will be described. Fig.172 is a side view schematically showing a holding device according to a third modification. In the third modification, a reversible adhesive 620 is provided on a large plate-shaped mounting plate 711C.

[0093] like Fig.17 As shown, the holding device 710C of the third variant example includes a carrier plate 711C and a reversible adhesive 620. The carrier plate 711C is a large flat plate-shaped member. There is no through hole on the carrier plate 711C like the carrier plate 711B. The reversible adhesive 620 is provided on the carrier plate 711C. The reversible adhesive 620 joins and holds the mother substrate 120 to the carrier plate 711C.

[0094] As described above, according to the third modification, one holding device 710C is provided for one mother substrate 120. The mother substrate 120 is held by the holding device 710C via the detachable reversible adhesive 620. Therefore, the mother substrate 120 can be held over a larger area, so the mother substrate 120 can be held more stably.

[0095] [Second Embodiment]

[0096] Next, a method for manufacturing the dimming device 100 according to the second embodiment will be described. Fig.18 It is a side view schematically showing a first cutting step in the manufacturing process of the dimming device according to the second embodiment. Fig.19 This is a side view schematically showing the second cutting process in the manufacturing process of the dimming device of the second embodiment. In the first embodiment, the mother substrate is cut one by one, but the manufacturing method of the second embodiment is characterized in that the mother substrate is cut two by two. The following is mainly explained with the differences from the first embodiment.

[0097] (Mother substrate holding process)

[0098] In the mother substrate holding process, Fig.18 As shown, two mother substrates 120 and 120A are placed and held on three holding devices 710. The mother substrate 120 and the mother substrate 120A are previously bonded via a light-transmitting adhesive 610. In the second embodiment, the positioning device 720 is also omitted from the illustration.

[0099] (Cutting process)

[0100] In the cutting process, Fig.18 As shown in FIG. 1 , the two mother substrates 120 and 120A are cut to form the dimming panel 1. Fig.18 As shown, by cutting out the mother substrate 120 using a cutting machine 715, divided pieces 131, 131A, divided pieces 132, 132A, and divided pieces 133, 133A are obtained.

[0101] (Lamination process)

[0102] In the lamination process, Fig.19 As shown, the other mother substrates 120B and 120C are stacked on the three divided pieces 131A, 132A, and 133A. The mother substrate 120B and the mother substrate 120C are previously bonded via a light-transmitting adhesive 610. Specifically, the light-transmitting adhesive 610 is applied on the divided pieces 131A, 132A, and 133A, and the mother substrates 120B and 120C are placed on the light-transmitting adhesive 610, and the light-transmitting adhesive 610 is cured. In the stacking process, the mother substrates 120B and 120C are also positioned by the positioning device 720.

[0103] (Cutting process and panel unit production process)

[0104] In the cutting process, Fig.19 As shown in FIG. 1 , the mother substrates 120B and 120C are cut into separate pieces. Thus, the panel unit 110 is manufactured.

[0105] As described above, according to the second embodiment, the mother substrate 120, 120A and the other mother substrates 120B and 120C are each two pieces, and in the cutting step, the mother substrate 120, 120A and the other mother substrates 120B and 120C are cut into two pieces.

[0106] Thus, even when the mother substrate is cut into two pieces, the mother substrate 120, 120A and the other mother substrates 120B, 120C are easily deformed when cut, and are less likely to suffer from cracks or other damage caused by the cutting. In addition, since two mother substrates are cut each time, the number of cutting operations is half compared to the first embodiment.

Claims

1. A method for manufacturing a dimming device, the dimming device comprising a panel unit and a conductive component, the panel unit having at least four dimming panels stacked in a first direction, the dimming panel having a first substrate and a second substrate overlapping the first substrate in the first direction, the conductive component being disposed at an end of the panel unit in a second direction intersecting the first direction and extending in the first direction, Manufacturing method of dimming device include: A mother substrate holding step, holding the mother substrates connected to the plurality of dimming panels on a holding device; A cutting step, after the mother substrate holding step, cutting the mother substrate to cut out the dimming panel; a laminating step of laminating another mother substrate different from the mother substrate in the first direction with respect to the cut mother substrate after the cutting step; a panel unit manufacturing step of manufacturing the panel unit by repeating the cutting step and the stacking step after the stacking step; and a conductive component forming step, after the panel unit manufacturing step, forming the conductive component at the end portion of the panel unit in the second direction, The mother substrate and the other mother substrate are each one piece, or the mother substrate and the other mother substrate are each two stacked pieces.

2. The method for manufacturing a dimming device according to claim 1, in, The mother substrate and the other mother substrates are each one piece, In the cutting step, the mother substrate and the other mother substrates are cut one by one.

3. The method for manufacturing a dimming device according to claim 1, in, The mother substrate and the other mother substrates are two stacked sheets respectively. In the cutting step, the mother substrate and the other mother substrates are cut two by two.

4. The method for manufacturing a dimming device according to any one of claims 1 to 3, in, In the mother substrate holding step, the mother substrate is held on the holding device by vacuum adsorption.

5. The method for manufacturing a dimming device according to any one of claims 1 to 3, in, In the mother substrate holding step, the mother substrate is held by the holding device via a detachable adhesive.

6. The method for manufacturing a dimming device according to any one of claims 1 to 3, in, One holding device is provided for each dimming panel obtained by cutting the mother substrate.

7. The method for manufacturing a dimming device according to any one of claims 1 to 3, in, A holding device is provided for the mother substrate.

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