Heat curing device, heat curing equipment and heat curing method

Abstract

The invention discloses a heating and curing device, heating and curing equipment and a heating and curing method, and relates to the technical field of heating and curing of liquid crystal panel photoresist, the heating and curing device comprises a heating bin, a heating device and a supporting assembly, a heating cavity is formed in the heating bin, and an opening communicated with the heating cavity is formed in the outer wall of the heating bin; the heating device is located in the heating cavity and comprises a vapor chamber assembly and a temperature control assembly, the vapor chamber assembly comprises a plurality of composite plates, the heating cavity comprises a plurality of heating spaces, each heating space is provided with at least one composite plate correspondingly arranged, and each composite plate is provided with at least one temperature control assembly correspondingly arranged. The temperature control assembly is used for adjusting the temperature of the corresponding composite plate according to the temperature of the heating space, so that the temperature of each heating space is within a preset temperature range; therefore, the volatilization speed of the photoresist in each area on the material basically tends to be consistent, the uniformity of the photoresist film is improved, and the brightness uniformity of the OLED display screen is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heating and curing photoresist for liquid crystal panels, and in particular to a heating and curing device, a heating and curing equipment and a heating and curing method. Background Art

[0002] The glue coating and developing equipment is the core equipment of the display panel TFT (Thin Film Transistor) process. In the display panel industry, the glue coating machine evenly coats the photoresist on the cleaned and dried glass substrate, and then the heating and cooling equipment removes about 80%-90% of the solvent in the photoresist, and solidifies it to form a photoresist film. The OLED (Organic Electroluminescence Display) display screen made by this traditional process is prone to uneven brightness in different areas. Summary of the invention

[0003] The main purpose of the present invention is to provide a heating and curing device, a heating and curing equipment and a heating and curing method, aiming to solve the problem of how to improve the uniformity of the brightness of an OLED display screen.

[0004] To achieve the above object, the heating and curing device proposed in the present invention comprises:

[0005] A heating chamber, wherein a heating chamber is formed in the heating chamber, and an outer wall of the heating chamber is provided with an opening communicating with the heating chamber;

[0006] A heating device, the heating device is located in the heating chamber, the heating device includes a soaking plate assembly and a temperature control assembly, the soaking plate assembly includes a plurality of composite plates, a plurality of the composite plates are spliced ​​to form a spliced ​​plate, the heating chamber includes a plurality of heating spaces, each of the heating spaces is provided with at least one composite plate, each of the composite plates is provided with at least one temperature control assembly, the temperature control assembly is used to adjust the temperature of the corresponding composite plate according to the temperature of the heating space, so that the temperature of each heating space is within a preset temperature range;

[0007] A support assembly, wherein the support assembly comprises a plurality of support members, and the plurality of support members are all arranged on the top of the splicing plate.

[0008] In one embodiment, the heating and curing device also includes an air outlet component, which includes a shell and a fan, an air duct is formed in the shell, the air outlet side of the fan is connected to the air duct, a plurality of air outlet holes are provided on the shell, each of the air outlet holes is connected to the air duct, the shell and the ventilation holes are respectively provided on two side walls of the heating chamber opposite to each other along the first direction, and the air outlet holes are arranged toward the heating chamber and are connected to the heating chamber.

[0009] In one embodiment, at least two buffer plates are sequentially arranged inside the shell along the flow direction of the airflow in the air duct, so that the buffer plates can buffer the airflow flowing in the air duct.

[0010] In one embodiment, each of the supporting members includes a base, a support rod and a ball bearing, the base is connected to the lifting frame, one end of the support rod is connected to the base, and the ball bearing is rotatably mounted on the other end of the support rod.

[0011] In one embodiment, the composite plate includes a polytetrafluoroethylene plate, an aluminum plate and a mica plate which are stacked in sequence, the polytetrafluoroethylene plate is arranged on top of the aluminum plate, and the temperature control component is connected to the mica plate.

[0012] In one embodiment, the temperature control component includes a heating element, a temperature sensor and a thermostat, the temperature sensor and the heating element are both communicatively connected to the thermostat, the heating element is connected to the composite plate, the temperature sensor can obtain temperature information of the heating space, the thermostat can control the power of the heating element according to the temperature information, and the heating element can adjust the temperature of the composite plate so that the temperature of each heating space is within a preset temperature range.

[0013] The present invention also proposes a heating and curing device, which includes a mounting frame and the above-mentioned heating and curing device. There are multiple heating and curing devices, and the multiple heating chambers are arranged on the mounting frame in sequence and spaced apart along the vertical direction.

[0014] The present invention also proposes a heating and curing method, which is applied to the above-mentioned heating and curing device, the heating and curing device also includes a lifting device and a manipulator, the lifting device is located in the heating bin, the lifting device includes a driving component, a lifting frame and a bearing member, the driving component and the lifting frame are located on the side of the composite plate away from the support member, the number of the bearing members is multiple, each of the bearing members is arranged on the side of the lifting frame facing the composite plate, the splicing plate is provided with through holes for the bearing members to pass through, the number of the through holes is consistent with the number of the bearing members and is arranged one by one, the driving component is connected to the lifting frame in a transmission manner, so that the driving component can drive each of the bearing members to rise and fall through the lifting frame; the heating and curing method comprises the following steps:

[0015] Control each temperature control component to maintain the temperature of each heating space within a preset temperature range;

[0016] Controlling the driving assembly to drive the bearing member to rise;

[0017] Controlling the manipulator to deliver the material into the heating chamber through the opening and place the material on the carrier;

[0018] Controlling the driving assembly to drive the bearing member to descend until the material contacts the supporting member;

[0019] Controlling the driving assembly to drive the bearing member to rise after a preset time has passed;

[0020] The robot is controlled to take the material out of the heating chamber.

[0021] In one embodiment, the temperature control component includes a heating element, a temperature sensor and a thermostat, the temperature sensor and the heating element are both in communication connection with the thermostat, the heating element is connected to the composite plate, the temperature sensor can obtain temperature information of the heating space, the thermostat can control the power of the heating element according to the temperature information, the heating element can adjust the temperature of the composite plate so that the temperature of each heating space is within a preset temperature range, and the step of controlling each temperature control component to maintain the temperature of each heating space within the preset temperature range includes:

[0022] Controlling each of the temperature sensors in real time to obtain temperature information of the corresponding heating space;

[0023] Controlling each of the thermostats in real time to adjust the power of the corresponding heating element according to the temperature information to maintain the temperature of each of the heating spaces within the preset temperature range;

[0024] And / or, the heating and curing device further comprises an air outlet component, the air outlet component comprises a shell and a fan, an air duct is formed in the shell, the air outlet side of the fan is communicated with the air duct, a plurality of air outlet holes arranged at intervals are provided on the shell, each of the air outlet holes is communicated with the air duct, the shell and the air outlet holes are respectively provided on two side walls of the heating chamber which are arranged opposite to each other along a first direction, the air outlet holes are arranged toward the heating chamber and are communicated with the heating chamber; after the step of controlling the driving component to drive the supporting member to descend until the material contacts the supporting member, before the step of controlling the driving component to drive the supporting member to rise after a preset time, the step comprises:

[0025] Controlling the fan to blow out airflow to take away the volatile solvent in the heating chamber;

[0026] And / or, the heating and curing device further comprises a gate assembly, the gate assembly is arranged in the heating chamber, the gate assembly is used to open or close the opening, after the step of controlling each temperature control assembly to maintain the temperature of each heating space within a preset temperature range, before the step of controlling the driving assembly to drive the bearing member to rise, the step comprises:

[0027] controlling the gate assembly to open the opening;

[0028] After the step of controlling the manipulator to deliver the material into the heating chamber through the opening and placing the material on the carrier, and before the step of controlling the driving assembly to drive the carrier to descend until the material contacts the support, the method includes:

[0029] controlling the gate assembly to close the opening;

[0030] After the step of controlling the driving assembly to drive the carrier to rise after a preset time, and before the step of controlling the manipulator to take the material out of the heating chamber, the step includes:

[0031] The gate assembly is controlled to open the opening.

[0032] The technical solution of the present invention adopts multiple temperature control components to independently adjust the temperature of the corresponding composite plates, so that the temperature of each heating space in the heating chamber can be maintained within a preset temperature range, thereby effectively improving the uniformity of temperature distribution in the heating chamber, making the volatilization speed of the photoresist in various areas on the material basically consistent, improving the uniformity of the photoresist film, and further improving the uniformity of the brightness of the OLED display. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0034] Figure 1 A schematic structural diagram of an embodiment of a heating and curing device provided by the present invention;

[0035] Figure 2 A structural schematic diagram of an embodiment of a spliced ​​board formed by splicing a plurality of composite boards provided by the present invention;

[0036] Figure 3 A schematic structural diagram of an embodiment of a heating and curing device provided by the present invention when a glass substrate is located in a heating chamber;

[0037] Figure 4 for Figure 3 Schematic diagram of the cross-section structure at AA;

[0038] Figure 5 It is a schematic diagram of the local enlarged structure of 4 at B;

[0039] Figure 6 A schematic structural diagram of an embodiment of the gas flow state in a heating chamber provided by the present invention;

[0040] Figure 7 A schematic structural diagram of an embodiment of a lifting device provided by the present invention;

[0041] Figure 8 A schematic structural diagram of an embodiment of a driving assembly provided by the present invention;

[0042] Fig. 9 A schematic structural diagram of an embodiment of a bearing member provided by the present invention;

[0043] Fig.10 A schematic cross-sectional view of an embodiment of a housing provided by the present invention;

[0044] Fig.11 A front view of an embodiment of a housing provided by the present invention;

[0045] Fig.12 A schematic structural diagram of an embodiment of a heating and curing device provided by the present invention;

[0046] Fig.13 A schematic diagram of a process flow of a first embodiment of a heating and curing method provided by the present invention;

[0047] Fig.14A schematic flow chart of a second embodiment of the heating and curing method provided by the present invention;

[0048] Fig.15 This is a schematic flow chart of the third embodiment of the heating and curing method provided by the present invention.

[0049] Description of Figure Numbers:

[0050] 100. Heating and curing device; 1. Heating chamber; 11. Heating chamber; 12. Opening; 13. Ventilation hole; 2. Heat diffusion plate assembly; 21. Composite plate; 211. Polytetrafluoroethylene plate; 212. Aluminum plate; 213. Mica plate; 3. Support assembly; 31. Support member; 4. Air outlet assembly; 41. Shell; 411. Air duct; 412. Air outlet hole; 413. Buffer plate; 42. Fan; 5. Lifting device; 51. Drive assembly; 511. Servo motor; 512. High-precision reducer; 513. Screw lift; 52. Lifting frame; 53. Bearing member; 531. Base; 532. Support rod; 533. Ball bearing; 6. Gate assembly;

[0051] 200. Heating and curing equipment; 201. Mounting frame;

[0052] 300. Glass substrate.

[0053] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0056] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0057] The glue coating and developing equipment is the core equipment of the display panel TFT (Thin Film Transistor) process. In the display panel industry, the glue coating machine evenly coats the photoresist on the cleaned and dried glass substrate, and then the heating and cooling equipment removes about 80%-90% of the solvent in the photoresist, and solidifies it to form a photoresist film. The OLED (Organic Electroluminescence Display) display screen made by this traditional process is prone to uneven brightness in different areas.

[0058] The inventors have found that the heating and curing process after coating is directly related to the uniformity of device film formation and is one of the key factors affecting the luminescence of the device. The existing heating and curing process has the following problems: the solvent of the photoresist located in the peripheral area of ​​the glass substrate evaporates faster, while the solvent of the photoresist located in the middle area of ​​the glass substrate evaporates slower, resulting in uneven thickness of the photoresist film after the heating and curing process, which in turn affects the uneven brightness (mura) of different areas when the OLED display screen is displayed.

[0059] In view of this, the present invention proposes a heating and curing device, a heating and curing equipment and a heating and curing method, aiming to solve the problem of how to improve the uniformity of the brightness of an OLED display screen.

[0060] See also Figures 1 to 4In one embodiment of the present invention, the heating and curing device 100 includes a heating chamber 1, a heating device and a support assembly 3. A heating chamber 11 is formed in the heating chamber 1, and an opening 12 communicating with the heating chamber 11 is provided on the outer wall of the heating chamber 1; the heating device is located in the heating chamber 11, and the heating device includes a heat spreader assembly 2 and a temperature control assembly. The heat spreader assembly 2 includes a plurality of composite plates 21, and the plurality of composite plates 21 are spliced ​​to form a spliced ​​plate. The heating chamber 11 includes a plurality of heating spaces, and each heating space has at least one corresponding composite plate 21, and each composite plate 21 has at least one corresponding temperature control assembly. The temperature control assembly is used to adjust the temperature of the corresponding composite plate 21 according to the temperature of the heating space, so that the temperature of each heating space is within a preset temperature range; the support assembly 3 includes a plurality of support members 31, and the number of the support members 31 is multiple, and the plurality of support members 31 are all arranged on the top of the spliced ​​plate.

[0061] The technical solution of the present invention uses multiple temperature control components to obtain the temperature information of the corresponding heating space, and then adjusts the temperature of the corresponding composite plate 21 according to the temperature information. Since each composite plate 21 has at least one temperature control component corresponding to it, the temperature of each composite plate 21 can be adjusted independently. The temperature of different heating spaces is adjusted by independently adjusting the temperature of the composite plate 21, so that the temperature of each heating space can be maintained within a preset temperature range, and then the material is placed in the heating chamber 11 for heating for a preset time. Since the temperature of each heating space can be maintained within a preset temperature range, the uniformity of the temperature distribution in the heating chamber 11 is effectively improved, so that the volatilization speed of the photoresist in each area of ​​the material is basically consistent, which effectively improves the uniformity of the photoresist film, and then improves the uniformity of the brightness of the OLED display. It should be noted that the preset temperature range is generally 99°C-101°C, and the preset time is generally 30s-45s. It should also be noted that the material can be a glass substrate 300 or a substrate of other materials.

[0062] See also Figure 4 , Figure 6 , Fig.10 and Fig.11In one embodiment, the heating and curing device 100 also includes an air outlet component 4, which includes a shell 41 and a fan 42. An air duct 411 is formed in the shell 41, and the air outlet side of the fan 42 is connected to the air duct 411. A plurality of air outlet holes 412 arranged at intervals are provided on the shell 41, and each air outlet hole 412 is connected to the air duct 411. The two side walls of the heating chamber 1 arranged opposite to each other along the first direction are respectively provided with the shell 41 and the ventilation holes 13, and the air outlet holes 412 are arranged toward the heating chamber 11 and are connected to the heating chamber 11. The airflow generated by the fan 42 will enter the air duct 411 and flow along the air duct 411. The air duct 411 guides the airflow. This part of the airflow will eventually leave the air duct 411 through the air outlet 412 and enter the heating chamber 11. After passing through the heating chamber 11, the airflow will leave the heating chamber 11 through the ventilation hole 13. In the process of the airflow entering the heating chamber 11 and leaving the heating chamber 11, the volatiles generated during the heating and curing process of the photoresist will be taken away from the heating chamber 11, thereby reducing the influence of the volatiles on the heating and curing process of the glass substrate 300. The airflow generated by 42 is blown toward the air outlet 412 through the air duct 411. The air duct 411 can guide and buffer the airflow, so that the wind blown out of the air outlet 412 is more uniform; and since there are multiple air outlets 412, multiple air outlets 412 are arranged toward the heating chamber 11, so that the wind blown out of the air outlet 412 is more uniform; multiple air outlets 412 are arranged in an array, thereby further improving the uniformity of the air outlet; thereby reducing the probability of a large difference in temperature distribution in the heating chamber 11 due to uneven air outlet. It should be noted that the fan 42 can be a blower 42 or a fan. It should also be noted that Fig.10 The arrow indicates the flow direction of the airflow in the air duct 411 .

[0063] According to one embodiment of the present invention, the height of the ventilation hole 13 and the air outlet hole 412 is higher than the height of the top of the support member 31; since volatiles will flow upward with the hot air flow, the height of the ventilation hole 13 and the air outlet hole 412 is set above the glass substrate 300, so that the volatiles can be better brought out of the heating chamber 11.

[0064] According to another embodiment of the present invention, the opening 12 is arranged on any side wall of the heating chamber 1 relatively arranged along the second direction, and the first direction is perpendicular to the second direction, that is, the extension direction of the opening 12 is perpendicular to the arrangement direction of the shell 41 and the ventilation hole 13.

[0065] According to another embodiment of the present invention, there are multiple ventilation holes 13, and the multiple ventilation holes 13 are arranged at intervals along the second direction, and the first direction and the second direction are perpendicular. The provision of multiple ventilation holes 13 facilitates the rapid discharge of volatile substances.

[0066] See also Figure 4In one embodiment, at least two buffer plates 413 are sequentially arranged inside the housing 41 along the flow direction of the airflow in the air duct 411, so that the buffer plates 413 can buffer the airflow flowing in the air duct 411. The airflow generated by the fan 42 is buffered by the buffer plates 413, which is conducive to improving the uniformity of the air output.

[0067] According to an embodiment of the present invention, the air duct 411 can be bent so that the air duct 411 can play a certain buffering role on the airflow, thereby helping to improve the uniformity of air output.

[0068] See also Figure 4 and Figure 7 In one embodiment, the heating and curing device 100 also includes a lifting device 5, which is located in the heating chamber 1. The lifting device 5 includes a driving component 51, a lifting frame 52 and a bearing member 53. The driving component 51 and the lifting frame 52 are located on the side of the composite board 21 away from the support member 31. There are multiple bearing members 53, and each bearing member 53 is arranged on the side of the lifting frame 52 facing the composite board 21. A through hole for the bearing member 53 to pass through is provided on the splicing plate. The number of the through holes is consistent with that of the bearing members 53 and they are arranged one by one. The driving component 51 is connected to the lifting frame 52 in a transmission manner so that the driving component 51 can drive each bearing member 53 to rise and fall through the lifting frame 52. Generally, the glass substrate 300 is grasped by a robot. When the temperature of each heating space in the heating chamber 11 is within a preset range, the driving component 51 drives the carrier 53 to rise through the lifting frame 52. The robot sends the glass substrate 300 into the heating chamber 11 from the opening 12. The glass substrate 300 is supported by the carrier 53. The driving component 51 drives the carrier 53 to descend through the lifting frame 52, so that the glass substrate 300 on the carrier 53 falls to contact with the support 31, and the glass substrate 300 is supported by the support 31. Since the support 31 is arranged on the top of the splicing plate, there is a gap between the glass substrate 300 on the support 31 and the splicing plate. When the time for heating and curing the glass substrate 300 reaches the preset time, the driving component 51 drives the carrier 53 to rise through the lifting frame 52, so that the carrier 53 lifts the glass substrate 300, so that the glass substrate 300 is separated from the support 31, and then the glass substrate 300 is taken out of the heating chamber 11 from the opening 12 by the robot. It should be noted that the driving component 51 may be a pneumatic cylinder or an electric cylinder.

[0069] According to one embodiment of the present invention, the driving component 51 includes a servo motor 511, a high-precision reducer 512 and a screw elevator 513. The output shaft of the servo motor 511 is connected to the reducer, the reducer is connected to the screw elevator 513, and the screw elevator 513 is connected to the lifting frame 52, so that the servo motor 511 can drive the lifting frame 52 to rise and fall through the high-precision reducer 512 and the screw elevator 513.

[0070] See also Figures 7 to 9 In one embodiment, each carrier 53 includes a base 531, a support rod 532 and a ball 533. The base 531 is connected to the lifting frame 52, one end of the support rod 532 is connected to the base 531, and the ball 533 is rotatably mounted on the other end of the support rod 532. The ball 533 is arranged to contact the glass substrate 300, thereby effectively reducing the probability of scratches caused by the contact between the glass substrate 300 and the carrier 53, and providing a certain guarantee for the yield rate of the glass substrate 300.

[0071] According to one embodiment of the present invention, the support member 31 may be a round bead, which can be rotatably installed on the spliced ​​plate, that is, the top surface of each composite plate 21 may be provided with a round bead, or the top surface of some composite plates 21 may be provided with a round bead, and there is no limitation here; by providing the round bead, the probability of scratches caused by contact between the glass substrate 300 and the support member 31 is reduced.

[0072] According to one embodiment of the present invention, the support member 31 can be a support column and a round bead, one end of the support column is connected to the spliced ​​plate, and the round bead is rotatably installed on the other end of the support column, that is, the top surface of each composite board 21 can be provided with a support member 31, or the top surface of some composite boards 21 can be provided with a support member 31, and there is no limitation here; by providing the round bead, the probability of scratches caused by contact between the glass substrate 300 and the support member 31 is reduced.

[0073] See also Figure 5 and Figure 6 In one embodiment, the composite plate 21 includes a polytetrafluoroethylene plate 211, an aluminum plate 212 and a mica plate 213 which are stacked in sequence, the polytetrafluoroethylene plate 211 is arranged on top of the aluminum plate 212, and the temperature control component is connected to the mica plate 213. Through this arrangement, the temperature of different heating spaces in the heating chamber 11 can be better adjusted independently.

[0074] In one embodiment, the temperature control component includes a heating element, a temperature sensor and a thermostat. The temperature sensor and the heating element are both connected to the thermostat for communication. The heating element is connected to the composite plate 21. The temperature sensor can obtain the temperature information of the heating space. The thermostat can control the power of the heating element according to the temperature information. The heating element can adjust the temperature of the composite plate 21 so that the temperature of each heating space is within a preset temperature range. The heating element is connected to the mica board 213. The temperature sensor obtains the temperature information of the corresponding heating space in real time. The thermostat can adjust the voltage of the heating element according to the temperature information, thereby changing the power of the heating element, thereby affecting the heat generated by the heating element, thereby changing the temperature of the corresponding heating space, so that the temperature of the heating space can be maintained within a preset temperature range. It should be noted that the heating element can be a thermocouple or a semiconductor heating element.

[0075] See also Figure 1 According to an embodiment of the present invention, the heating and curing device 100 further includes a gate assembly 6, which is disposed on the heating chamber 1. The gate assembly 6 is used to open or close the opening 12. The gate assembly 6 is disposed to open and close the opening 12, so that when the glass substrate 300 needs to be placed in the heating chamber 11 or taken out from the heating chamber 11 through the opening 12, the gate assembly 6 can be controlled to cancel the shielding of the opening 12, so that the robot can operate smoothly. When the glass substrate 300 needs to be heated and cured, the gate assembly 6 can be controlled to shield the opening 12, thereby reducing the influence of the external environment on the temperature of the heating chamber 11.

[0076] See also Fig.12 The present invention also proposes a heating and curing device 200, which includes a mounting frame 201 and the above-mentioned heating and curing device 100. The number of the heating and curing devices 100 is multiple, and multiple heating chambers 1 are arranged on the mounting frame 201 in sequence and at intervals along the vertical direction. Since the heating and curing device 200 adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one. By setting up multiple heating and curing devices 100, the heating and curing device 200 can heat and cure multiple glass substrates 300 at the same time, effectively improving the heating and curing efficiency of the glass substrates 300.

[0077] See also Fig.13 , Fig.13The present invention further provides a heating and curing method, which is applied to the above-mentioned heating and curing device, wherein the heating and curing device further comprises a lifting device and a manipulator, wherein the lifting device is located in the heating bin, wherein the lifting device comprises a driving assembly, a lifting frame and a bearing member, wherein the driving assembly and the lifting frame are located on a side of the composite plate away from the supporting member, wherein the number of the bearing members is multiple, and each of the bearing members is arranged on a side of the lifting frame facing the composite plate, wherein the splicing plate is provided with through holes for the bearing members to pass through, wherein the through holes are consistent with the number of the bearing members and are arranged one by one, and the driving assembly is connected to the lifting frame in a transmission manner so that the driving assembly can drive each of the bearing members to lift and lower through the lifting frame; the heating and curing method comprises the following steps:

[0078] S100, controlling each temperature control component to maintain the temperature of each heating space within a preset temperature range;

[0079] The temperature of each heating space is adjusted by each temperature control component so that the temperature of each heating space can be within a preset range, thereby reducing the temperature difference between different areas in the heating chamber, which is helpful for the subsequent heating and curing of the glass substrate and makes the evaporation rate of the solvent in each area of ​​the glass substrate basically consistent.

[0080] S200, controlling the driving assembly to drive the bearing member to rise;

[0081] The driving assembly is transmission-connected to the lifting frame, and the bearing member is arranged on the lifting frame, so the driving assembly can drive the bearing member to rise through the lifting frame, so as to provide reliable support for the glass substrate entering the heating chamber from the opening.

[0082] S300, controlling the robot to deliver the material into the heating chamber through the opening and placing the material on the carrier;

[0083] The robot delivers the glass substrate into the heating chamber through the opening, thus avoiding the phenomenon of workers being scalded when manually moving the glass substrate.

[0084] S400, controlling the driving assembly to drive the bearing member to descend until the material contacts the supporting member;

[0085] The control driving assembly drives the carrier to descend through the lifting frame, so that the glass substrate on the carrier can also fall together until the glass substrate contacts the support member, and the support member provides reliable support for the glass substrate. By setting the support member, a gap is created between the glass substrate and the splicing plate, and the two are in a spaced relationship, and the support member can also provide reliable support for the glass substrate.

[0086] S500, controlling the driving assembly to drive the bearing member to rise after a preset time has passed;

[0087] After the glass substrate has passed a preset time, which is generally 30s-45s, the control driving assembly drives the carrier to rise through the lifting frame, and the rising carrier first contacts the glass substrate, and then as the carrier rises, the glass substrate is separated from the support, and the carrier again provides reliable support for the glass substrate until the glass substrate is moved to a height position where it contacts the carrier when it begins to enter the heating chamber, so that it can be subsequently grasped by the robot.

[0088] S600, controlling the robot to take the material out of the heating chamber.

[0089] The glass substrate is taken out of the heating chamber by a robot, thereby avoiding the phenomenon of workers being scalded when manually moving the glass substrate.

[0090] The technical solution of the present invention adopts multiple temperature control components to obtain temperature information of corresponding heating spaces, and then adjusts the temperature of corresponding composite plates according to the temperature information. Since each composite plate has at least one temperature control component corresponding to it, the temperature of each composite plate can be independently adjusted. The temperature of different heating spaces can be adjusted by independently adjusting the temperature of the composite plates, so that the temperature of each heating space can be maintained within a preset temperature range. Then, the material is placed in the heating chamber and heated for a preset time. Since the temperature of each heating space can be maintained within the preset temperature range, the uniformity of the temperature distribution in the heating chamber is effectively improved, so that the volatilization speed of the photoresist in each area on the material is basically consistent, which effectively improves the uniformity of the photoresist film, and then improves the uniformity of the brightness of the OLED display.

[0091] See also Fig.14 , Fig.14 This is a flow chart of a second embodiment of the heating and curing method provided by the present invention. In one embodiment, the temperature control component includes a heating element, a temperature sensor and a thermostat. The temperature sensor and the heating element are both connected to the thermostat for communication. The heating element is connected to the composite plate. The temperature sensor can obtain the temperature information of the heating space. The thermostat can control the power of the heating element according to the temperature information. The heating element can adjust the temperature of the composite plate so that the temperature of each heating space is within a preset temperature range. The step of S100 includes:

[0092] S110, controlling each of the temperature sensors in real time to obtain temperature information of the corresponding heating space;

[0093] S120, controlling each of the thermostats in real time to adjust the power of the corresponding heating element according to the temperature information to maintain the temperature of each of the heating spaces within the preset temperature range;

[0094] The temperature sensor obtains the temperature information of the corresponding heating space in real time. The thermostat can adjust the voltage of the heating element according to the temperature information, thereby changing the power of the heating element, and then affecting the heat generated by the heating element, thereby changing the temperature of the corresponding heating space, so that the temperature of the heating space can be maintained within a preset temperature range.

[0095] See also Fig.15 , Fig.15 A schematic flow chart of a third embodiment of the heating and curing method provided by the present invention, in one embodiment, the heating and curing device further comprises an air outlet component, the air outlet component comprises a shell and a fan, an air duct is formed in the shell, the air outlet side of the fan is communicated with the air duct, a plurality of air outlet holes arranged at intervals are provided on the shell, each of the air outlet holes is communicated with the air duct, the shell and the vents are respectively provided on two side walls of the heating chamber arranged opposite to each other along a first direction, the air outlet holes are arranged toward the heating chamber and are communicated with the heating chamber; after step S400 and before step S500, the following are included:

[0096] S410, controlling the fan to blow out airflow to take away the volatile solvent in the heating chamber;

[0097] The airflow generated by the fan will enter the air duct and flow along the air duct. The air duct guides the airflow. This part of the airflow will eventually leave the air duct through the air outlet and enter the heating chamber, and then leave the heating chamber through the ventilation hole after passing through the heating chamber. In the process of the airflow entering the heating chamber and leaving the heating chamber, the volatiles generated during the heating and curing process of the photoresist will be taken away from the heating chamber, thereby reducing the influence of the volatiles on the heating and curing process of the glass substrate. Since the airflow generated by the fan is blown to the air outlet through the air duct, the air duct can guide and buffer the airflow, thereby making the wind blown out of the air outlet more uniform. And since there are multiple air outlets, the multiple air outlets are arranged toward the heating chamber, making the wind blown out of the air outlet more uniform. The multiple air outlets are arranged in an array, thereby further improving the uniformity of the air outlet.

[0098] In one embodiment, the heating and curing device further includes a gate assembly, which is disposed in the heating chamber and is used to open or close the opening. After step S100 and before step S200, the following steps are included:

[0099] S101, controlling the gate assembly to open the opening;

[0100] After step S300 and before step S400, the following steps are included:

[0101] S301, controlling the gate assembly to close the opening;

[0102] After step S500 and before step S600, the method includes:

[0103] S501, controlling the gate assembly to open the opening.

[0104] By setting a gate assembly to open and close the opening, when the glass substrate needs to be placed into the heating chamber or taken out from the heating chamber through the opening, the gate assembly can be controlled to cancel the obstruction of the opening so that the robot can operate smoothly; when the glass substrate needs to be heated and cured, the gate assembly can be controlled to cover the opening, thereby reducing the influence of the external environment on the temperature of the heating chamber.

[0105] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heating and curing device, characterized in that: include: A heating chamber, wherein a heating chamber is formed in the heating chamber, and an outer wall of the heating chamber is provided with an opening communicating with the heating chamber; A heating device, the heating device is located in the heating chamber, the heating device includes a soaking plate assembly and a temperature control assembly, the soaking plate assembly includes a plurality of composite plates, a plurality of the composite plates are spliced ​​to form a spliced ​​plate, the heating chamber includes a plurality of heating spaces, each of the heating spaces is provided with at least one composite plate, each of the composite plates is provided with at least one temperature control assembly, the temperature control assembly is used to adjust the temperature of the corresponding composite plate according to the temperature of the heating space, so that the temperature of each heating space is within a preset temperature range; A support assembly, wherein the support assembly comprises a plurality of support members, and the plurality of support members are all arranged on the top of the splicing plate.

2. The heating and curing device according to claim 1, characterized in that: The heating and curing device also includes an air outlet component, which includes a shell and a fan. An air duct is formed in the shell, and the air outlet side of the fan is connected to the air duct. A plurality of air outlet holes are arranged at intervals on the shell, and each of the air outlet holes is connected to the air duct. The shell and the ventilation holes are respectively provided on two side walls of the heating chamber that are arranged opposite to each other along a first direction, and the air outlet holes are arranged toward the heating chamber and are connected to the heating chamber.

3. The heating and curing device according to claim 2, characterized in that: At least two buffer plates are sequentially arranged inside the shell along the flow direction of the airflow in the air duct, so that the buffer plates can buffer the airflow flowing in the air duct.

4. The heating and curing device according to claim 1, characterized in that: The heating and curing device also includes a lifting device, which is located in the heating chamber. The lifting device includes a driving assembly, a lifting frame and a bearing member. The driving assembly and the lifting frame are located on a side of the composite plate away from the support member. There are multiple bearing members, each of which is arranged on a side of the lifting frame facing the composite plate. The splicing plate is provided with through holes for the bearing members to pass through. The through holes are consistent in number with the bearing members and are arranged one-to-one. The driving assembly is connected to the lifting frame in a transmission manner so that the driving assembly can drive each of the bearing members to rise and fall through the lifting frame.

5. The heating and curing device according to claim 4, characterized in that: Each of the bearing members comprises a base, a support rod and a ball bearing. The base is connected to the lifting frame, one end of the support rod is connected to the base, and the ball bearing is rotatably mounted on the other end of the support rod.

6. The heating and curing device according to any one of claims 1 to 5, characterized in that: The composite plate comprises a polytetrafluoroethylene plate, an aluminum plate and a mica plate which are stacked in sequence, the polytetrafluoroethylene plate is arranged on the top of the aluminum plate, and the temperature control component is connected to the mica plate.

7. The heating and curing device according to any one of claims 1 to 5, characterized in that: The temperature control component includes a heating element, a temperature sensor and a thermostat. The temperature sensor and the heating element are both communicatively connected to the thermostat. The heating element is connected to the composite plate. The temperature sensor can obtain temperature information of the heating space. The thermostat can control the power of the heating element according to the temperature information. The heating element can adjust the temperature of the composite plate so that the temperature of each heating space is within a preset temperature range.

8. A heating and curing device, characterized in that: The heating and curing equipment comprises a mounting frame and a heating and curing device as claimed in any one of claims 1 to 7, wherein the number of the heating and curing devices is plural, and the plural heating chambers are arranged on the mounting frame in sequence and spaced apart in the vertical direction.

9. A heating curing method, characterized in that: The heating and curing method is applied to the heating and curing device described in any one of claims 1 to 7, the heating and curing device also includes a lifting device and a manipulator, the lifting device is located in the heating chamber, the lifting device includes a driving component, a lifting frame and a bearing member, the driving component and the lifting frame are located on the side of the composite plate away from the support member, the number of the bearing members is multiple, each of the bearing members is arranged on the side of the lifting frame facing the composite plate, the splicing plate is provided with through holes for the bearing members to pass through, the through holes are consistent with the number of the bearing members and are arranged one by one, the driving component is connected to the lifting frame in a transmission manner, so that the driving component can drive each of the bearing members to rise and fall through the lifting frame; the heating and curing method includes the following steps: Control each temperature control component to maintain the temperature of each heating space within a preset temperature range; Controlling the driving assembly to drive the bearing member to rise; Controlling the manipulator to deliver the material into the heating chamber through the opening and place the material on the carrier; Controlling the driving assembly to drive the bearing member to descend until the material contacts the supporting member; Controlling the driving assembly to drive the bearing member to rise after a preset time has passed; The robot is controlled to take the material out of the heating chamber.

10. The heat curing method according to claim 9, characterized in that: The temperature control component includes a heating element, a temperature sensor and a thermostat, the temperature sensor and the heating element are both in communication connection with the thermostat, the heating element is connected to the composite plate, the temperature sensor can obtain temperature information of the heating space, the thermostat can control the power of the heating element according to the temperature information, the heating element can adjust the temperature of the composite plate so that the temperature of each heating space is within a preset temperature range, and the step of controlling each temperature control component to maintain the temperature of each heating space within the preset temperature range includes: Controlling each of the temperature sensors in real time to obtain temperature information of the corresponding heating space; Controlling each of the thermostats in real time to adjust the power of the corresponding heating element according to the temperature information to maintain the temperature of each of the heating spaces within the preset temperature range; And / or, the heating and curing device further comprises an air outlet component, the air outlet component comprises a shell and a fan, an air duct is formed in the shell, the air outlet side of the fan is communicated with the air duct, a plurality of air outlet holes arranged at intervals are provided on the shell, each of the air outlet holes is communicated with the air duct, the shell and the air outlet holes are respectively provided on two side walls of the heating chamber which are arranged opposite to each other along a first direction, the air outlet holes are arranged toward the heating chamber and are communicated with the heating chamber; after the step of controlling the driving component to drive the supporting member to descend until the material contacts the supporting member, before the step of controlling the driving component to drive the supporting member to rise after a preset time, the step comprises: Controlling the fan to blow out airflow to take away the volatile solvent in the heating chamber; And / or, the heating and curing device further comprises a gate assembly, the gate assembly is arranged in the heating chamber, the gate assembly is used to open or close the opening, after the step of controlling each temperature control assembly to maintain the temperature of each heating space within a preset temperature range, before the step of controlling the driving assembly to drive the bearing member to rise, the step comprises: controlling the gate assembly to open the opening; After the step of controlling the manipulator to deliver the material into the heating chamber through the opening and placing the material on the carrier, and before the step of controlling the driving assembly to drive the carrier to descend until the material contacts the support, the method includes: controlling the gate assembly to close the opening; After the step of controlling the driving assembly to drive the carrier to rise after a preset time, and before the step of controlling the manipulator to take the material out of the heating chamber, the step includes: The gate assembly is controlled to open the opening.

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