An implantable temperature measurement RFID electronic tag system and manufacturing method

Abstract

The present invention discloses an implantable temperature-measuring RFID electronic tag system and its manufacturing method. The system includes an electronic tag, which comprises a radio frequency chip, an antenna, a tag substrate, and a reflector. The antenna and reflector are located on the upper and lower surfaces of the tag substrate, respectively. The tag substrate is provided with a through hole, within which the radio frequency chip and antenna are located. The radio frequency chip and antenna are electrically connected to the antenna. The radio frequency chip detects temperature and embeds a prefabricated tag code. By embedding the electronic tag into a cable, the present invention can achieve accurate traceability and comprehensive management of the cable, and accurately measure the temperature within the cable.

Description

Technical Field

[0001] The present invention belongs to the technical field of implantable electronic tags, and in particular relates to an implantable temperature-measuring RFID electronic tag system and a manufacturing method thereof. Background Art

[0002] The development of a modern smart supply chain system has put forward new and higher requirements for the construction and application of material traceability and unified identity coding (physical "ID") for physical assets. Physical "ID" IoT tags are a key medium and information carrier for the ubiquitous interconnection of power grid materials, playing a vital role in the development of modern smart supply chains. In the future, the integration of blockchain technology can provide reliable guarantees for the transmission and interaction of data such as the physical "ID" of power materials, solving problems such as the secure storage and sharing of physical "ID" IoT tag data and cross-party trust, and laying the foundation for the future development of supply chain finance and other businesses.

[0003] At present, the physical "ID" is being used in the cable operation and maintenance management work in the form of a pilot construction in the form of bundling RFID electronic tags on the outside of the cable. For example, CN108197689A is a passive RFID cable temperature measurement tag, which uses an external reader device to identify the temperature data of the passive RFID cable temperature measurement tag. The passive RFID cable temperature measurement tag includes: a metal tie, an antenna and an FPC circuit board. The metal tie is installed on the cable to conduct the temperature of the cable. The antenna is located on the metal tie and is used to transmit radio frequency signals between the passive RFID cable temperature measurement tag and the external reader device, and is also used to conduct the temperature of the cable. The FPC circuit board is located above the antenna and includes a passive UFH temperature tag chip. The FPC circuit board couples the radio frequency signal transmitted by the antenna and conducts the temperature of the cable to enable the passive UFH temperature tag chip to detect the cable temperature. However, with the rapid advancement of urban construction, the distribution network cable supply chain management work has highlighted the following deficiencies in the actual construction process:

[0004] (1) On-site coding is expensive: On-site coding of RFID tags for distribution cables involves secondary coding and binding, which consumes a lot of manpower and material resources. In addition, with the continuous construction of power grid projects and the continuous entry of incremental assets into the network, asset coding and labeling work is difficult. At the same time, on-site coding of existing equipment cannot provide effective support for production supervision, logistics distribution, warehouse management and other businesses, resulting in the independent on-site coding of material identity codes.

[0005] (2) Difficulty in cable asset inventory: Due to the length management characteristics of cable materials, inventory, remaining material tracking, and material collection mainly rely on on-site manual reading of the remaining cable meter marks. This is greatly affected by factors such as weather conditions, personnel status, and cable sheath wear. The accuracy of the inventory cannot be guaranteed, and the inventory efficiency is low.

[0006] (3) Equipment collection is difficult to trace: After the cables are collected and shipped out of the warehouse, the actual amount and type of use by the construction unit cannot be effectively controlled. There are risks of theft such as passing inferior goods off as good ones and taking the long ones for the short ones. It is necessary to use technical means to transmit the original purchase and collection information to the construction site, supervision unit, and acceptance unit, and establish a "real-time, secure information channel" to fundamentally solve this problem.

[0007] (4) Difficulty in implementing incremental asset coding: Currently, RFID tags used in the cable field are mainly attached to the cable body. If incremental equipment is coded at the factory, there is a risk that the tags will fall off due to collisions during storage and transfer, and the straps / adhesive will fall off due to the external environment and time. This cannot effectively support the needs of unified equipment coding and full life cycle management.

[0008] (5) Lack of terminal material management: Power construction is affected by a variety of factors, and is prone to multiple material turnovers, scattered construction sites, and long project cycles. Construction units often store large quantities of construction materials at mobile or temporary material management points, and then allocate them to the construction site daily according to the progress of the project implementation. This leads to a lack of terminal material management, making it difficult to timely discover and locate the required cable equipment and its exact location, and is also more likely to cause problems such as material loss and theft.

[0009] (6) The temperature detection object is limited: Due to the setting method of the electronic tag, it can only detect the temperature of the outside / outer layer of the cable. In the actual cable temperature measurement link, it is often necessary to perform temperature detection on the conductor inside the cable. The existing RFID electronic tag can no longer meet the requirements.

[0010] Therefore, how to provide an implantable electronic tag for measuring the temperature inside a cable is an urgent problem to be solved in this field. Summary of the Invention

[0011] To address the shortcomings of the prior art, the present invention provides an implantable temperature-measuring RFID electronic tag system and its manufacturing method. By embedding the electronic tag into the cable, accurate cable traceability and comprehensive management can be achieved, as well as accurate temperature detection inside the cable.

[0012] In a first aspect, the present invention provides an implantable temperature measurement RFID electronic tag system, comprising: an electronic tag, the electronic tag comprising a radio frequency chip, an antenna, a tag substrate, and a reflective plate;

[0013] The antenna and reflector are respectively located on the upper and lower surfaces of the tag substrate. The tag substrate is provided with a through hole, in which a radio frequency chip and an antenna are arranged. The radio frequency chip is electrically connected to the antenna. The radio frequency chip detects temperature and has a prefabricated tag code embedded therein.

[0014] The production module is used to configure the coding information and issuance information of the radio frequency chip, wherein the coding information includes the label code, and the issuance information includes a unique identifier and a temperature test strategy for realizing internal temperature detection of the cable.

[0015] Furthermore, the antenna is formed by folding a plate to form a box-shaped structure with a hollow interior. The box-shaped structure includes an upper plate and a lower plate. A pad for fixing the radio frequency chip is provided inside the box-shaped structure.

[0016] Furthermore, the radio frequency chip is electrically connected to one side of the lower board through an impedance matching adjustment loop, and the other side of the lower board is connected to the upper board.

[0017] Furthermore, one end of the impedance matching adjustment loop connected to the radio frequency chip is provided with a feeding port that matches the antenna impedance.

[0018] Furthermore, the antenna includes a rectangular metal sheet, a ground plane, a short-circuit metal plate, a feed line and a dielectric substrate. The ground plane is fixed on one side of the dielectric substrate, and the rectangular metal sheet and the short-circuit metal plate are fixed on the other side. The feed line is connected to the short-circuit metal plate, and the two ends of the short-circuit metal plate are respectively connected to the rectangular metal sheet and the ground plane.

[0019] Furthermore, the RF chip includes a temperature sensor circuit for detecting temperature, the temperature sensor circuit includes an analog front-end circuit and an analog-to-digital converter circuit connected to the analog front-end circuit, the analog front-end circuit outputs voltage and voltage difference to the analog-to-digital converter circuit through two transistors with different bias currents, and the analog-to-digital converter circuit determines the detected temperature result based on the voltage and voltage difference.

[0020] Furthermore, the radio frequency chip is embedded with a prefabricated tag code, which contains the implantation information of the electronic tag and the production information of the cable. The implantation information includes serial information, and the production information includes manufacturer information, batch information and cable serial number information.

[0021] Label encoding, specifically expressed as:

[0022] TE=[(mi,bi,cr,si,cc)|mi∈M,bi∈B,cr∈CR,si∈S]

[0023]

[0024] Among them, TE is the label encoding dataset, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, d is the manufacturer information, D j(d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information.

[0025] Furthermore, the system also includes a production module electrically connected to the electronic tag, the production module is used to configure the coding information and issuance information of the radio frequency chip, the coding information includes the tag code, and the issuance information includes a unique identifier and a temperature test strategy for realizing internal temperature detection of the cable;

[0026] The production module is used to configure the encoding information and issuance information of the RF chip, including:

[0027] Generate a tag code based on the implantation information of the electronic tag and the production information of the cable, and write the tag code into the radio frequency chip;

[0028] Based on the cable parameters at the location where the electronic tag is implanted and the detected temperature parameters, combined with the ambient temperature parameters at the location where the cable is located, a temperature test strategy is given;

[0029] A unique identifier is generated based on the electronic tag parameters and the card reader parameters that match the electronic tag, and the unique identifier and the temperature test strategy are uploaded and stored.

[0030] Furthermore, the cable includes multiple cable conductors, an insulation layer, a metal shielding layer, a filling layer, an armor layer and an outer sheath from the inside out, and the electronic tag is implanted between the armor layer and the outer sheath;

[0031] Temperature test strategy, satisfying the following relationship:

[0032] θ c =θ0-2θ p +(W c +0.5W d )A1T1-3[W d +(1+λ1)W c ]A2T2+3[W d +(1+λ1+λ2)W c ](A3T3+A4T4)

[0033] Where θ c is the cable conductor temperature, θ0 is the ambient temperature where the cable is located, θ p is the temperature detected by the electronic tag, W c is the cable conductor loss, W d is the dielectric loss of the insulation layer, T1 is the thermal resistance of the insulation layer, T2 is the thermal resistance of the filling layer, T3 is the thermal resistance of the outer sheath, T4 is the thermal resistance of the surrounding medium, λ1 is the resistance loss factor of the metal shielding layer, λ2 is the resistance loss factor of the armor layer, and A1, A2, A3, and A4 are all correction coefficients.

[0034] Furthermore, the card reader parameters include the card reader power and frequency, and the electronic tag parameters include the data length and key type of the electronic tag.

[0035] Furthermore, the unique identifier is written into the radio frequency chip and uploaded for storage, including:

[0036] Verify the tag code of the electronic tag, and verify the electronic tag parameters and card reader parameters in the radio frequency chip based on the unique identifier;

[0037] The unique identifier after the tag code, electronic tag parameters and card reader parameters are verified is written into the radio frequency chip and uploaded for storage.

[0038] In a second aspect, the present invention further provides a method for manufacturing an implantable temperature-measuring RFID electronic tag, using the above-mentioned implantable temperature-measuring RFID electronic tag system, the manufacturing method includes:

[0039] Assembling a radio frequency chip, an antenna, a tag substrate and a reflective plate into an electronic tag;

[0040] Configure the encoding and issuance information of the RF chip.

[0041] The present invention provides an implantable temperature measurement RFID electronic tag system and a manufacturing method, which have at least the following beneficial effects:

[0042] (1) By embedding electronic tags into cables and configuring their distribution information, accurate cable traceability and comprehensive management can be achieved. Furthermore, by configuring temperature testing strategies, the internal temperature of the cable can be accurately detected, improving the application scenarios of electronic tags.

[0043] (2) By reading the cable electronic tags, the cable information can be obtained, and the identification code requirements of production and manufacturing units, material management units, on-site operation and maintenance personnel can be coordinated. In addition, the business pain points faced in cable material management, such as theft of goods, false reporting of usage, and inventory of remaining quantities, can be solved. This will greatly improve the accuracy of equipment supervision and contract performance tracking, and ensure the stable and orderly supply of power grid materials.

[0044] (3) By calculating and processing the easily detectable ambient temperature and cable armor layer temperature, the corresponding internal cable conductor temperature to be detected can be accurately obtained, ensuring the acquisition of cable conductor temperature in actual applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of an implantable temperature measurement RFID electronic tag system provided by the present invention;

[0046] Figure 2 Another structural diagram of an RFID electronic tag system provided by an embodiment of the present invention;

[0047] Figure 3 A schematic diagram of the structure of an electronic tag provided in one embodiment of the present invention;

[0048] Figure 4 A circuit diagram of a T-type matching network provided in one embodiment of the present invention;

[0049] Figure 5 A circuit diagram of an antenna provided in one embodiment of the present invention;

[0050] Figure 6 A circuit diagram of a temperature sensor circuit provided by an embodiment of the present invention;

[0051] Figure 7 A schematic structural diagram of a cable provided in one embodiment of the present invention;

[0052] Figure 8 This is a flow chart of a method for making an implantable temperature-measuring RFID electronic tag provided by the present invention.

[0053] Explanation of the reference numerals: 11- RF chip, 12- antenna, 121- rectangular metal sheet, 122- ground plane, 123- short-circuit metal plate, 124- dielectric substrate, 13- label substrate, 14- reflector, 21- cable conductor, 22- insulation layer, 23- metal shielding layer, 24- filling layer, 25- armor layer, 26- outer sheath. DETAILED DESCRIPTION

[0054] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0055] The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a," "an," "the," and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, and unless the context clearly indicates otherwise, "a plurality" generally includes at least two.

[0056] It should also be noted that the terms "include," "comprises," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a product or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such product or device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the product or device comprising the element.

[0057] like Figures 1 to 3 As shown, the present invention provides an implantable temperature measurement RFID electronic tag system, comprising: an electronic tag and a production module electrically connected to the electronic tag, the electronic tag comprising a radio frequency chip, an antenna, a tag substrate and a reflector;

[0058] The antenna and reflector are respectively located on the upper and lower surfaces of the tag substrate. The tag substrate is provided with a through hole, in which a radio frequency chip and an antenna are arranged. The radio frequency chip is electrically connected to the antenna. The radio frequency chip detects temperature and has a prefabricated tag code embedded therein.

[0059] The production module is used to configure the coding information and issuance information of the radio frequency chip, wherein the coding information includes the label code, and the issuance information includes a unique identifier and a temperature test strategy for realizing internal temperature detection of the cable.

[0060] In actual application scenarios, the antenna can be formed by folding the plate into a hollow box-shaped structure. The box-shaped structure includes an upper plate and a lower plate. A pad for fixing the RF chip is provided inside the box-shaped structure. The RF chip is electrically connected to one side of the lower plate through an impedance matching adjustment loop, and the other side of the lower plate is connected to the upper plate. The end of the impedance matching adjustment loop connected to the RF chip is provided with a feeding port that matches the antenna impedance. The pad is made of silicone with a thickness of 1mm. The impedance matching adjustment loop can be a T-type matching network, such as Figure 4 As shown, the T-type matching network connects two dipole antennas through a microstrip transmission line. The larger dipole antenna has a length of L and a radius of a; the other dipole has a length of L' (L'≠L) and a radius of a', (a'≠a); the two form an unbalanced parallel transmission line with a core diameter distance of s. Since the dipole length of the T-type matching network is relatively short, the size of 0.03λ~0.06λ is selected, and the impedance of the antenna is in complex form and is inductive. Since the impedance of the electronic tag antenna must be inductive impedance, the T-type matching network structure can be applied to the electronic tag antenna. By properly adjusting the parameters of the T-type matching network, the required impedance can be obtained, thereby obtaining the impedance bandwidth of the project. In addition, as Figure 5As shown, the antenna can also be a planar inverted-F antenna structure, formed by a microstrip antenna with one end short-circuited. Its structure includes a flat rectangular metal sheet, a large ground plane, a narrow short-circuit metal plate, a dielectric substrate, and a feeder (not shown). The ground plane is fixed to one side of the dielectric substrate, and the rectangular metal sheet and short-circuit metal plate are fixed to the other side. The feeder is connected to the short-circuit metal plate, and the ends of the short-circuit metal plate are connected to the rectangular metal sheet and the ground plane, respectively. Short-circuiting one end of the antenna significantly reduces its size. The ground plate in the antenna has a certain effect of isolating the antenna from the influence of the metal surface. When placed on the surface of the cable armor layer, the armor metal has little effect on the antenna matching and the band frame, thus providing metal resistance. When the electronic tag antenna is placed in free space (non-metallic surface), its half-power bandwidth is 15 MHz, the frequency band range is 910 MHz to 920 MHz, and the maximum read distance is 2.8 meters. When the tag is placed on the metal surface of the armor layer, the half-power bandwidth is 15 MHz, the frequency band range is 910 MHz to 925 MHz, and the maximum read distance is 3 meters. This shows that the tag's performance remains unchanged when placed on a metal surface. The antenna's built-in ground plane provides resistance to metal. Furthermore, when the tag is placed on a metal surface, the metal reflects electromagnetic waves, improving the tag's antenna's directivity and gain, further increasing the tag's recognition distance.

[0061] The electronic chip of this embodiment detects temperature through a temperature sensor circuit, specifically, Figure 6 As shown, the RF chip may include a temperature sensor circuit for detecting temperature, and the temperature sensor circuit includes an analog front-end circuit (such as Figure 6 A1 in the figure) and the analog-to-digital converter circuit connected to the analog front-end circuit (such as Figure 6 In A2), the analog front-end circuit outputs the voltage and voltage difference to the analog-to-digital converter circuit through two transistors with different bias currents. The analog-to-digital converter circuit determines the detected temperature result based on the voltage and voltage difference. In actual application scenarios, the difference ΔVBE voltage between the VBEs of the two transistors with different bias currents in the AFE circuit (analog front-end circuit) has a PTAT characteristic. By quantizing the value of ΔVBE, the current ambient temperature can be accurately obtained. When quantizing ΔVBE, a VREF that does not change with temperature is also required as a reference. Generally, a VREF reference voltage with a zero temperature coefficient can be obtained by adding a negative temperature coefficient VBE and αΔVBE. In this way, the ratio of VBE and VREF will contain temperature information. In order to fully utilize the full scale of the ADC circuit (analog-to-digital converter circuit), αΔVBE is used as the quantization object, which can fully utilize the ADC circuit. In the ADC circuit, it is necessary to determine the structure and end of the ADC. Specifically, the output of the ADC circuit can be set to:

[0062]

[0063]

[0064] Among them, the value of X changes nonlinearly with temperature. After algorithmic processing of the X value and selecting appropriate calibration parameters (α, A and B) in the algorithm, a high linearity can be achieved in the appropriate range to obtain the best temperature difference curve (linear curve), for example, α = 13, A ≈ 600, B ≈ 283.

[0065] For the ADC, SAR ADC and ΣΔ ADC are used for performance, power consumption, area, and accuracy considerations. Specifically, the SAR ADC is designed to be 5-bit, and the ΣΔ ADC is designed to be 8-bit. The ADC circuit also includes a CIC digital filter. Specifically, the most significant bits (MSBs) <4:0> in ADC_DATA<12:0> correspond to the decimal value of the SAR ADC, while the LSBs <8:0> are extracted by the decimation filter. The total result ADC_DATA<12:0> is obtained by the following method: X = n + 2μ, where X is the decimal value of ADC_DATA<12:0>, n is the decimal value obtained by the SAR ADC, and μ is the remainder after CIC decimation of the ΣΔ ADC (the lowest 8 digits are converted to decimal and then divided by the decimal number represented by 8'b11111111, where 0 < μ < 1). Temperature is then calculated using calibration parameters.

[0066] In order to achieve cross-disciplinary and cross-departmental cable information security traceability, this embodiment designs the label code of the radio frequency chip to better adapt it to the tracking and tracing management of the cable product throughout its entire life cycle. Specifically, the radio frequency chip is embedded with a prefabricated label code, which contains the implantation information of the electronic tag and the production information of the cable. The implantation information includes serial information, and the production information includes manufacturer information, batch information, and cable serial number information.

[0067] Label encoding can be expressed as:

[0068] TE=[(mi,bi,cr,si,cc)|mi∈M,bi∈B,cr∈CR,si∈S]

[0069]

[0070] Among them, TE is the label encoding dataset, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, d is the manufacturer information, D j(d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information. The check code is generated by processing the data codes other than the tag code itself, and the specific generation method can be parity check bit, cyclic redundancy check, hash function, error correction code, Base64 encoding, random number generation, etc. Since the ASCII code maps each character to a specific number, it is helpful for data storage and transmission. Therefore, when converting the manufacturer information into data code, the data structure can be simplified and the performance requirements of the radio frequency chip in the electronic tag can be reduced. In addition, since the ASCII code can be applied to different systems and has good compatibility, it ensures that the tag code of this embodiment can be applied to electronic tags with different parameter specifications.

[0071] In addition, in order to improve the functional characteristics of the label coding, the coding content of the label coding can also be expanded. For example, the label coding can also include the data coding of the cable type information, the data coding of the cable model information, the data coding of the cable voltage level information, etc. The specific expression is:

[0072] TE=[(mi,to,mo,vl,bi,cr,si,cc)|mi∈M,to∈T,mo∈O,vl∈V,bi∈B,cr∈CR,si∈S]

[0073]

[0074] Among them, TE is the data set of tag encoding, T is the data encoding subset of cable type information, O is the data encoding subset of cable model information, V is the data encoding subset of cable voltage level information, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, to is the data encoding of cable type information, mo is the data encoding of cable model information, vl is the data encoding of cable voltage level information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, and the sequence information is related to the setting interval of the electronic tag. For example, adjacent electronic tags are implanted in the cable at a predetermined distance, and the sequence information data encoding of adjacent electronic tags is a continuous number. d is the manufacturer information, and D j(d) is the ASCII code corresponding to the jth symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information. The data encoding of the cable type information, the cable model information, and the cable voltage level information can be encoded during production or warehousing, or can be calculated based on the specific information using other encoding methods. For example, the encoding can be implemented using ASCII encoding, Unicode encoding, Base64 encoding, URL encoding, etc.

[0075] The tag code of the electronic tag is configured on the RF chip by the production module, and when it is finally accessed by the reader / writer device, the tag code can be read and verified. In addition, in addition to configuring the tag code, this embodiment also requires configuring the temperature test strategy, etc. Specifically, the production module is used to configure the encoding information and issuance information of the RF chip, which may include:

[0076] Generate a tag code based on the implantation information of the electronic tag and the production information of the cable, and write the tag code into the radio frequency chip; the production information of the cable may also include cable type information, cable model information, and cable voltage level information;

[0077] Based on the cable parameters at the location where the electronic tag is implanted and the detected temperature parameters, combined with the ambient temperature parameters at the location where the cable is located, a temperature test strategy is given and the temperature test strategy is applied;

[0078] A unique identifier is generated based on the electronic tag parameters and the card reader parameters that match the electronic tag, and the unique identifier and temperature test strategy are uploaded and stored. The unique identifier and temperature test strategy can also be stored on the RF chip if the RF chip meets the storage requirements.

[0079] In determining the temperature test strategy, this embodiment mainly designs the corresponding method based on the overall structure of the cable, and ultimately achieves accurate calculation of the cable conductor temperature. Figure 7 As shown, the cable includes multiple cable conductors, insulation layers, metal shielding layers, filling layers, armor layers and outer sheaths from the inside to the outside. The electronic tag is implanted between the armor layer and the outer sheath. The cable conductors, insulation layers and metal shielding layers can be provided with a corresponding number of components according to different requirements. Preferably, three components are provided. Correspondingly, the temperature test strategy satisfies the following relationship:

[0080] θ c =θ0-2θ p +(W c +0.5W d )A1T1-3[W d +(1+λ1)W c ]A2T2+3[W d+(1+λ1+λ2)W c ](A3T3+A4T4)

[0081] Where θ c is the cable conductor temperature, θ0 is the ambient temperature where the cable is located, θ p is the temperature detected by the electronic tag, W c is the cable conductor loss, W d is the dielectric loss of the insulation layer, T1 is the thermal resistance of the insulation layer, T2 is the thermal resistance of the filling layer, T3 is the thermal resistance of the outer sheath, T4 is the thermal resistance of the surrounding medium, λ1 is the resistance loss factor of the metal shielding layer, λ2 is the resistance loss factor of the armor layer, A1, A2, A3, and A4 are all correction coefficients, which can be empirical values ​​or obtained through experiments. Specifically, the values ​​of A1, A2, A3, and A4 are in the range of [0.8, 1.2]. In addition, the cable in this embodiment may also include a conductor shielding layer disposed between the cable conductor and the insulation layer, and an inner sheath disposed between the filling layer and the armor layer.

[0082] The thermal resistance parameters in the temperature test strategy can be pre-calculated based on the test or simulation data, the size parameters and correlation coefficients of the cable conductor, insulation layer, metal shielding layer, armor layer, outer sheath, as well as the temperature description and correlation coefficient of the surrounding environment. Figure 2 In the structure shown, T1, T2, T3, and T4 are calculated as follows:

[0083] The thermal resistance of the insulation layer in the temperature test strategy satisfies the following relationship:

[0084]

[0085] Where, ρ T is the thermal resistance coefficient of the insulation layer, in K·m / W, t1 is the thickness of the insulation layer, in mm, D c is the cable conductor diameter, in mm. Specifically, the thermal resistance coefficient of the insulation layer is 3.5K·m / W, the thickness of the insulation layer is 6-7mm, preferably 6.4mm, and the cable conductor diameter is 22-22.5mm, preferably 22.2mm.

[0086] The thermal resistance of the filling layer satisfies the following relationship:

[0087]

[0088] Where ρ2 is the thermal resistance of the filler layer, expressed in K·m / W, specifically 5K·m / W. G is the geometric factor, which can be found by looking up the cable structure in a table.

[0089] The thermal resistance of the outer sheath satisfies the following relationship:

[0090]

[0091] Where t3 is the outer sheath thickness in mm, D a The outer diameter of the armor layer, in mm.

[0092] The thermal resistance of the ambient medium is selected according to the cable laying scenario. For example, if the cable is laid in the air, the thermal resistance of the ambient medium satisfies the following relationship:

[0093]

[0094] Where h is the heat dissipation coefficient, preferably h is 3.5, D e is the outer diameter of the cable; Δθ s It is the temperature rise of the cable surface above the ambient temperature.

[0095] For the loss parameters in the temperature test strategy, they can be pre-calculated based on the test or simulation data, the size parameters of the cable conductor and insulation layer, and the correlation coefficient. c 、W d The calculation of is as follows:

[0096] When calculating cable conductor loss, the conductor loss of a single cable satisfies the following relationship:

[0097] W c =I 2 R c

[0098] Among them, I is the current carrying capacity of the cable conductor, the unit is A, R c is the AC resistance of the cable conductor, in Ω.

[0099] The AC resistance per unit length of cable conductor (Ω / m) is:

[0100] R=R d (1+Y1+Y2)

[0101] R d =R0[1+α 20 (θ c -20)]

[0102]

[0103] Among them, R d is the DC resistance of the cable conductor per unit length, in Ω / m, Y1 is the skin effect factor, Y2 is the proximity effect factor, R0 is the DC resistance of the cable conductor per unit length at 20°C, in Ω / m, α 20 The resistance temperature coefficient of the cable conductor at 20°C, θ cThe cable conductor temperature is in °C. Its value depends on the type of insulation material used. The long-term temperature tolerance of cross-linked polyethylene is 90 °C. c is the diameter of the cable conductor in mm, f is the power frequency in Hz, s is the center-to-center distance between adjacent cable conductors in mm, k s 、k p is a constant, and k for copper conductor tightly compressed round stranded wire is s =1,k p =0.8.

[0104] When calculating the dielectric loss of the insulation layer, voltage is applied to the cable line to obtain the insulation loss in the insulation medium. Specifically, the insulation loss per unit length in each phase satisfies the following relationship:

[0105]

[0106] Where f1 is the line frequency in Hz; U0 is the rated voltage of the cable in V; tanδ is the dielectric loss factor; and c is the cable capacitance per unit length in F / m, satisfying the following relationship:

[0107]

[0108] Wherein, ε is the relative dielectric constant of the insulating material, ε0 is the absolute dielectric constant, preferably ε0 = 8.86 × 10 -12 F / m,D i D is the diameter of the insulation layer in mm. c is the conductor diameter in mm.

[0109] For the loss factor parameters in the temperature test strategy, they can be pre-calculated based on the test or simulation data, the size parameters and correlation coefficients of the cable conductor, metal shielding layer, and armor layer. λ1 and λ2 are calculated as follows:

[0110] Three-core cables are covered with a metal shielding layer over the insulation layer, which generates an induced voltage during alternating current operation. A portion of the magnetic flux generated by the conductor loop is linked to the metal shielding layer, generating an induced electromotive force in the metal shielding layer, causing eddy current losses. To prevent the induced electromotive force from endangering the safe operation of the cable, the metal shielding layer is often grounded, but this forms a current loop and generates circulating current losses. Therefore, the losses in the metal shielding layer mainly include circulating current loss and eddy current loss, which satisfy the following relationship:

[0111] λ1=λ1'+λ1”

[0112] Where λ1 is the ratio of the total loss of the metal shielding layer to the cable conductor loss, that is, the metal shielding layer resistance loss factor; λ'1 is the ratio of the metal shielding layer circulating current loss to the cable conductor loss; λ"1 is the ratio of the metal shielding layer eddy current loss to the conductor loss.

[0113] The center distance s between the two cable conductors is much larger than the diameter D of the cable metal shielding layer. s When the induced potential E in the metal shielding layer per unit length is s , satisfying the following relationship:

[0114]

[0115] The metal shielding layer is grounded at both ends. When the grounding resistance is very small, the current I s , satisfying the following relationship:

[0116]

[0117] R s is the resistance of the metal shielding layer per unit length of the cable in Ω / m; X is the reactance of the metal shielding layer per unit length of the cable in Ω / m; R is the AC resistance of the cable conductor per unit length (Ω / m).

[0118] For the cable metal shield loss per unit length W s , satisfying the following relationship:

[0119]

[0120] Then λ'1 satisfies the following relationship:

[0121]

[0122] When three single-core cable conductors are arranged in a triangle, the circulating current loss factor of the metal shielding layer satisfies the following relationship:

[0123]

[0124] Among them, R s is the metal shield resistance per unit length of the cable, in Ω / m; X is the metal shield reactance per unit length of the cable, in Ω / m; R is the AC resistance of the conductor, in Ω / m; s is the center axis spacing of the conductors of the cable, in mm; D s is the average diameter of the metal shielding layer, in mm; ρ s A is the resistivity of the material used for the metal shielding layer, in Ω·m; s is the cross-sectional area of ​​the metal shielding layer, in m 2 θ s It is the temperature of the metal shielding layer, which is generally equivalent to 70% to 80% of the conductor operating temperature.

[0125] For the case where a metal shielding layer is laid on the surface of each conductor insulation layer, λ'1 satisfies the following relationship:

[0126]

[0127] In this case, the eddy current loss of the metal shielding layer is negligible, that is, λ"1 is 0, that is, λ=λ'1 in this case. In the cable structure of this embodiment, a metal shielding layer is laid on the surface of each conductor insulation layer.

[0128] The loss factor λ2 of the armor layer is the sum of the hysteresis loss λ2 and the eddy current loss λ2 of the armor layer, satisfying the following relationship:

[0129] λ2=λ2'+λ2”

[0130]

[0131] Where s is the distance between the centers of adjacent cable conductors, in mm; δ is the equivalent thickness of the armor layer, in mm; D a is the average diameter of the armor layer, in mm; μ is the relative magnetic permeability of the armor layer, usually taken as 300.

[0132] After the temperature test strategy is given in this embodiment, the final result can be obtained by MATLAB calculation, and the final result can be obtained by Newton iteration method. c , T4, λ1, λ2 about θ c After the expression of the variable, the test environment temperature of 22℃ is set as the initial value, and the error range in the program is set to 10 -6 , and iterate continuously until the error range is met, which is the final result.

[0133] In this embodiment, when configuring and issuing information for the radio frequency chip through the production module, the unique identifier is written into the radio frequency chip and uploaded for storage, which may include:

[0134] Verify the tag code of the electronic tag, and verify the electronic tag parameters and card reader parameters in the radio frequency chip based on the unique identifier;

[0135] The unique identifier after the tag code, electronic tag parameters and card reader parameters are verified is written into the radio frequency chip and uploaded for storage.

[0136] The card reader parameters include the card reader power and frequency, and the electronic tag parameters include the data length and key type of the electronic tag.

[0137] This embodiment of the electronic tag uses ultra-high frequency RFID chip technology, which overcomes the efficiency limitations of traditional rectifier circuits and implements a highly efficient self-biased rectifier, enabling long-distance reading of the tag chip. High-reliability data read / write circuit technology is used to implement high-reliability memory, meeting the requirements for high-reliability operation of the tag chip at normal operating temperatures (<40°C).

[0138] This electronic tag enables coding and management throughout the manufacturing process of cable equipment, meeting performance requirements for metal resistance, high temperature resistance, and vandalism resistance. By coding cable equipment at fixed intervals before shipment, RFID IoT tags are applied. Based on a "self-coding and labeling of existing equipment + supplier-coding and labeling of incremental equipment," suppliers of incremental assets install the electronic tags, enabling efficient and rapid batch tag reading and writing. By associating physical "IDs" with sub-tags on equipment components, equipment management shifts from batch to individual management, and then to component-level traceability, enhancing lean and refined material management. By reading the electronic tags on cable reels, cable information such as manufacturer, model, length, equipment order, and serial number is captured. This coordinates the identification code needs of manufacturers, material management units, and on-site operations and maintenance personnel, addressing operational pain points in cable material management, such as product substitution, false usage reporting, and remaining inventory. This significantly improves the accuracy of equipment monitoring and contract tracking, ensuring a stable and orderly supply of power grid materials.

[0139] like Figure 8 As shown, the present invention also provides a method for manufacturing an implantable temperature measuring RFID electronic tag, using the above-mentioned implantable temperature measuring RFID electronic tag system, the manufacturing method includes:

[0140] Assembling a radio frequency chip, an antenna, a tag substrate and a reflective plate into an electronic tag;

[0141] Configure the encoding and issuance information of the RF chip.

[0142] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the invention. Thus, the present invention is intended to include such changes and modifications as fall within the scope of the claims and their equivalents.

Claims

1. An implantable temperature measurement RFID electronic tag system, characterized in that: include: Electronic tag, which includes a radio frequency chip, an antenna, a tag substrate and a reflector; The antenna and reflector are located on the upper and lower surfaces of the tag substrate, respectively. The tag substrate is provided with a through-hole, in which a radio frequency chip and antenna are placed. The radio frequency chip is electrically connected to the antenna. The radio frequency chip detects temperature and embeds a prefabricated tag code. The antenna is formed by folding a plate to form a hollow box-shaped structure. The box-shaped structure includes an upper plate and a lower plate. A pad is provided inside the box-shaped structure to fix the radio frequency chip. The radio frequency chip is electrically connected to one side of the lower plate through an impedance matching adjustment loop, and the other side of the lower plate is connected to the upper plate. The label code includes the implantation information of the electronic label and the production information of the cable. The implantation information includes sequence information. The production information includes manufacturer information, batch information and cable serial number information. The label code also includes the data encoding of the cable type information, the data encoding of the cable model information, and the data encoding of the cable voltage level information. The sequence information is related to the setting interval of the electronic label. Adjacent electronic labels are implanted in the cable at a predetermined distance. The sequence information data encoding of adjacent electronic labels is a continuous number. The system also includes a production module electrically connected to the electronic tag, the production module is used to configure the coding information and issuance information of the radio frequency chip, the coding information includes the tag code, and the issuance information includes a unique identifier and a temperature test strategy for realizing internal temperature detection of the cable; The production module is used to configure the encoding information and issuance information of the RF chip, including: Generate a tag code based on the implantation information of the electronic tag and the production information of the cable, and write the tag code into the radio frequency chip; Based on the cable parameters at the location where the electronic tag is implanted and the detected temperature parameters, combined with the ambient temperature parameters at the location where the cable is located, a temperature test strategy is given; Generate a unique identifier based on the electronic tag parameters and the card reader parameters that match the electronic tag, verify the tag code of the electronic tag, and verify the electronic tag parameters and card reader parameters in the radio frequency chip based on the unique identifier; The unique identifier after the tag code, electronic tag parameters and card reader parameters are verified is written into the RF chip and uploaded for storage. Among them, the card reader parameters include the card reader power and frequency, and the electronic tag parameters include the data length and key type of the electronic tag.

2. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The antenna includes a rectangular metal sheet, a ground plane, a short-circuit metal plate, a feed line and a dielectric substrate. The ground plane is fixed on one side of the dielectric substrate, and the rectangular metal sheet and the short-circuit metal plate are fixed on the other side. The feed line is connected to the short-circuit metal plate, and the two ends of the short-circuit metal plate are respectively connected to the rectangular metal sheet and the ground plane.

3. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The RF chip includes a temperature sensor circuit for detecting temperature. The temperature sensor circuit includes an analog front-end circuit and an analog-to-digital converter circuit connected to the analog front-end circuit. The analog front-end circuit outputs voltage and voltage difference to the analog-to-digital converter circuit through two transistors with different bias currents. The analog-to-digital converter circuit determines the detected temperature result based on the voltage and voltage difference.

4. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: Label encoding, specifically expressed as: ； Among them, TE is the label encoding dataset, T is the data encoding subset of cable type information, O is the data encoding subset of cable model information, V is the data encoding subset of cable voltage level information, M is the data encoding subset of manufacturer information, B is the data encoding subset of batch information, CR is the data encoding subset of cable serial number information, S is the data encoding subset of sequence information, cc is the check code, mi is the data encoding of manufacturer information, to is the data encoding of cable type information, mo is the data encoding of cable model information, vl is the data encoding of cable voltage level information, bi is the data encoding of batch information, cr is the data encoding of cable serial number information, si is the data encoding of sequence information, d is the manufacturer information, D j (d) is the ASCII code corresponding to the j-th symbol of the manufacturer information, and k is the number of symbols corresponding to the manufacturer information.

5. The implantable temperature measurement RFID electronic tag system according to claim 1, characterized in that: The cable consists of multiple cable conductors, insulation layers, metal shielding layers, filling layers, armor layers, and outer sheaths from the inside out. The electronic tag is embedded between the armor layer and the outer sheath. Temperature test strategy, satisfying the following relationship: ； Where θ c is the cable conductor temperature, θ0 is the ambient temperature where the cable is located, θ p is the temperature detected by the electronic tag, W c is the cable conductor loss, W d is the dielectric loss of the insulation layer, T1 is the thermal resistance of the insulation layer, T2 is the thermal resistance of the filling layer, T3 is the thermal resistance of the outer sheath, T4 is the thermal resistance of the surrounding medium, λ1 is the resistance loss factor of the metal shielding layer, λ2 is the resistance loss factor of the armor layer, and A1, A2, A3, and A4 are all correction coefficients.

6. A method for producing an implantable temperature measuring RFID electronic tag, characterized in that: The implantable temperature measurement RFID electronic tag system according to any one of claims 1 to 5 is used, and the manufacturing method includes: Assembling a radio frequency chip, an antenna, a tag substrate and a reflective plate into an electronic tag; Configure the encoding and issuance information of the RF chip.

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