Rapid gluing method and system for diode

Abstract

The invention discloses a rapid gluing method and system for a diode, and relates to the technical field of diodes, and the method comprises the steps: collecting the distribution, gluing position and gluing area of diodes in a device, and constructing a distribution diagram which comprises a position identifier and an area identifier; identifying the size of the gluing area according to the area identifier, and performing clustering according to the size of the area to obtain an area clustering distribution diagram; determining an overlapping area region, converting the overlapping area region into correlation degree, and generating a correlation coefficient; calculating the total proportion of the position identifiers in the distribution map to obtain an area clustering proportion value; an initial area is determined according to the ratio, path configuration is conducted, and a gluing control path is obtained; and determining glue control parameters according to the area clustering size of the gluing control path, establishing a mapping relation between the gluing control path and the glue control parameters, and generating a control instruction for gluing control. And therefore, the technical effects of simplifying the gluing plan and improving the gluing efficiency are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of diodes, and in particular to a method and system for quickly coating diodes with glue. Background Art

[0002] Diodes are common components in electronic devices, and the glue coating process is an important part of the diode production process. It can protect the diode from environmental factors and improve the stability and service life of the diode.

[0003] Traditional diode gluing methods usually include manual gluing and machine gluing. The manual gluing method is simple to operate, but the work efficiency is low, and the gluing quality is greatly affected by the skill level of the operator, and the gluing uniformity and consistency are difficult to ensure. Although the machine gluing method can improve work efficiency and reduce the impact of human factors, the existing machine gluing equipment and systems are complex and costly, and the gluing speed and efficiency need to be improved. There are technical problems such as complex gluing planning and low gluing efficiency. Summary of the invention

[0004] The present invention provides a fast glue coating method and system for diodes, so as to solve the technical problems of complex glue coating planning and low glue coating efficiency in the prior art, and achieve the technical effects of simplifying glue coating planning and improving glue coating efficiency.

[0005] In a first aspect, the present invention provides a method for rapid glue coating of a diode, wherein the method comprises: Collect the distribution of diodes, glue coating positions and glue coating areas in the device, and construct a distribution map, wherein the distribution map has position marks and area marks; Performing size identification based on the area identifiers in the distribution map, and clustering the areas according to their sizes to obtain an area cluster distribution map; Obtaining the overlapping area region of the area cluster distribution map, performing correlation conversion according to the overlapping area region, and generating a correlation coefficient; Calculating the total proportion according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value; According to the area cluster proportion value, an initial area is determined, the initial area is the area cluster distribution with the largest area cluster proportion value, the associated area cluster distribution map of the initial area and the corresponding association coefficient are extracted, and the path configuration is performed to obtain the glue coating control path; The glue control parameters, including glue discharge pressure, glue discharge amount, and glue discharge control path, are determined according to the area cluster size of the glue coating control path, a mapping relationship between the glue coating control path and the glue control parameters is established, and a control instruction is generated to perform glue coating control.

[0006] In this method, the distribution of diodes in the device, the glue coating position and the glue coating area are collected to construct a distribution map with position and area identification, realizing the visual integrated display of key information in the glue coating process. Size recognition is performed based on the area identification, and clustering is performed according to the area size to obtain the area cluster distribution map, extract the overlapping area area, generate the correlation coefficient, and obtain the category and correlation relationship between different glue coating areas.

[0007] In a second aspect, the present invention further provides a rapid glue coating system for diodes, wherein the system comprises: A distribution mapping module, which is used to collect the distribution of diodes, the glue coating position and the glue coating area in the device, and construct a distribution map, wherein the distribution map has a position mark and an area mark; An area clustering module, the area clustering module is used to identify the size based on the area identifier in the distribution map, and cluster the areas according to the area size to obtain an area cluster distribution map; An association analysis module, the association analysis module is used to obtain the overlapping area region of the area cluster distribution map, perform correlation conversion according to the overlapping area region, and generate a correlation coefficient; A proportion calculation module, the proportion calculation module is used to calculate the total proportion according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value; A path configuration module, wherein the path configuration module is used to determine an initial area according to the area cluster proportion value, wherein the initial area is an area cluster distribution with the largest area cluster proportion value, extract an associated area cluster distribution map of the initial area and its corresponding associated coefficient, perform path configuration, and obtain a glue coating control path; The glue coating control module is used to determine the glue control parameters according to the area clustering size of the glue coating control path, including glue discharge pressure, glue discharge amount, and glue discharge control path, establish a mapping relationship between the glue coating control path and the glue control parameters, and generate control instructions for glue coating control.

[0008] The present invention discloses a method and system for rapid gluing of diodes, comprising: collecting the position and gluing area of ​​the diode in the device, and constructing a distribution map to mark the position and area. Through the area mark in the distribution map, the size of the gluing area is identified and clustered to generate an area cluster distribution map. The overlapping area regions are determined and converted into correlation coefficients. The total proportion of the position marks in the area cluster distribution map is calculated to obtain the area cluster proportion value. The initial area is determined according to the proportion value, the associated distribution map and correlation coefficient of the initial area are extracted, the path is configured, and the gluing control path is obtained. The gluing control parameters are determined according to the area cluster size of the control path, a mapping relationship between the control path and the gluing control parameters is established, and a control instruction is generated. The method and system for rapid gluing of diodes disclosed by the present invention solve the technical problems of complex gluing planning and low gluing efficiency, and achieve the technical effect of simplifying gluing planning and improving gluing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic flow chart of a method for rapid glue coating of a diode according to the present invention; Figure 2 The figure is a schematic structural diagram of a rapid glue coating system for diodes according to the present invention.

[0010] Explanation of the accompanying reference numerals: distribution mapping module 11, area clustering module 12, association analysis module 13, proportion calculation module 14, path configuration module 15, glue coating control module 16. DETAILED DESCRIPTION

[0011] The technical solution provided in the embodiments of the present invention is to solve the technical problems of high latency, lack of real-time performance, incomplete monitoring, and insufficient predictability in the prior art. The overall idea adopted is as follows: First, the distribution of diodes in the device, the glue coating position and the glue coating area data are collected, and a distribution map is constructed to ensure that the distribution map contains position identifiers and area identifiers. Next, the size is identified based on the area identifier in the distribution map, and the area is clustered according to the area size to obtain an area cluster distribution map. Then, the overlapping area area of ​​the area cluster distribution map is determined, and the correlation is converted according to the overlapping area area to generate a correlation coefficient. Next, according to the number of distribution position identifiers of the area cluster distribution map, the total proportion is calculated to obtain the area cluster proportion value. According to the area cluster proportion value, the initial area is determined, that is, the area cluster distribution with the largest area cluster proportion value, and the associated area cluster distribution map of the initial area and its corresponding correlation coefficient are extracted to perform path configuration and obtain the glue coating control path. Finally, the glue control parameters are determined according to the area cluster size of the glue coating control path, including glue discharge pressure, glue discharge amount and glue discharge control path, and a mapping relationship between the glue coating control path and the glue control parameters is established to generate control instructions for glue coating control.

[0012] The above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods of the specification to better understand the above technical solution. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments of the present invention. It should be understood that the present invention is not limited to the example embodiments used only to explain the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings, rather than all of them.

[0013] Embodiment 1 Figure 1 The present invention is a schematic flow chart of a method for rapid glue coating of a diode, which includes: Collect the distribution of diodes, glue coating positions and glue coating areas in the device, and construct a distribution map, wherein the distribution map has position marks and area marks; Specifically, applying glue to a diode is a common protective measure used to protect the diode from environmental factors (such as moisture, dust, etc.), thereby extending the service life of the diode.

[0014] Optionally, a distribution map is used to show the location of the diodes and the location and area of ​​the glue coating. The distribution map is a two-dimensional or three-dimensional map, depending on the complexity of the device and the level of detail required. The distribution map contains the location and area identification of multiple diodes in the acquisition device, which facilitates the quick and accurate determination of the location of each diode and glue coating and the area of ​​glue coating.

[0015] In some embodiments, the distribution of diodes, the glue coating position and the glue coating area in the acquisition device are used to construct a distribution map, wherein the distribution map has position marks and area marks, including: Obtain the design drawing of the device, perform diode glue coating task decomposition, and determine the diode distribution; According to the structure and functional requirements of the diode, analyze the area of ​​the glue coating part and locate the glue coating position of the diode; According to the design drawing of the base, locate the glue coating position and glue coating area of ​​the base, and the glue coating position and glue coating area of ​​the base are the position and area in contact with the diode; Obtaining the glue coating position according to the glue coating position of the diode and the glue coating position of the base; The glue coating area of ​​the diode is constrained according to the glue coating area of ​​the base to obtain the glue coating area.

[0016] The design drawing of the device is one or a group of design files based on a computer-aided design program or other types of drawings.

[0017] Optionally, the diode gluing task is decomposed based on the design drawing of the device to determine the diode distribution, including parsing the design drawing based on the layer settings and legend annotations in the device design drawing, so as to extract multiple groups of diode pixels; then, based on the positions of the above-mentioned diode pixels, the diodes are located to determine the diode pixel coordinates; finally, the diode pixel coordinates are converted into device coordinates in the real coordinate system through stretching, rotation and affine transformation, so as to determine the diode distribution.

[0018] Optionally, the area of ​​the glue coating part is analyzed and the glue coating position of the diode is determined according to the structure and functional requirements of the diode. This includes consulting technical documents or communicating with engineers and designers to understand the structure and functional requirements of the diode, and then analyzing the area of ​​the glue coating part according to the structure and functional requirements of the diode, combined with the size of the diode and the thickness and coverage of the glue coating.

[0019] Exemplarily, the glue application positions of the diode include fixed pins and auxiliary pins, wherein the fixed pins are the main contact points for the diode to connect to other electronic components or circuit boards. Applying glue at this position can help fix the diode to prevent it from moving or falling off under vibration or impact. Gluing can also provide additional electrical insulation to prevent short circuits or current leakage. Auxiliary pins are additional contact points of the diode, usually used to provide additional stability or support while providing thermal conductivity.

[0020] Optionally, based on the design drawing of the base and the corresponding relationship between the base and the diode, the glue coating position and glue coating area of ​​the base are determined, wherein the glue coating position of the base is the position in contact with the diode. The glue coating area of ​​the base is the area in contact with the diode. The glue coating position and glue coating area of ​​the base are consistent with the position and area in contact with the diode.

[0021] Specifically, according to the glue coating position of the diode and the glue coating position of the base, the glue coating position information is merged to obtain a complete glue coating position. The glue coating area of ​​the diode is constrained according to the glue coating area of ​​the base, so as to ensure that the glue coating area is within the range of the base, and no glue overflow or leakage occurs, thereby determining the final glue coating area. Exemplarily, according to the glue coating area of ​​the base, a glue coating area constraint with the base boundary as the constraint boundary is established. Among them, the base boundary includes the outer boundary of the base and the inner boundary of the base (such as openings, slots, clearances, etc. on the base).

[0022] Through the above steps, it is ensured that the glue coating position and area of ​​the diode and the base can meet the design and functional requirements of the equipment.

[0023] Performing size identification based on the area identifiers in the distribution map, and clustering the areas according to their sizes to obtain an area cluster distribution map; In some embodiments, size recognition is performed based on the area identifiers in the distribution map, and area clustering is performed according to area sizes to obtain an area cluster distribution map, including: Set the limit spacing distance based on the size of the glue application equipment; Using the limited interval distance to traverse the distribution points in the distribution map to obtain the abnormal interval area, including: configuring identification features according to the limited interval distance, using the convolution kernel model to segment the distribution map according to a preset segmentation method, and using the identification features to traverse the segmentation area features; Clustering and screening are performed according to the abnormal interval regions, and area configuration is performed on the abnormal interval regions, and combined area marking is performed on the abnormal interval regions according to the configured areas; The combined area identifier is added to the area identifier to perform area clustering.

[0024] Specifically, in the actual distribution map, there may be some areas where the diodes are too densely distributed, resulting in the inability of the glue coating equipment to perform precise operations in this area. At this time, the areas with inconsistent glue coating widths or too dense diode distribution can be regarded as a whole, and the glue coating operation can be performed on this whole to ensure that the glue coating position and glue coating area in the area are covered.

[0025] Optionally, first, the limiting spacing distance is set based on the size of the glue coating device, wherein the size of the glue coating device refers to the diameter of the glue outlet, which determines the minimum glue discharge width of the glue coating device, thereby affecting the glue coating accuracy. The theoretical minimum allowable distance between the points in the distribution map can be determined by the size of the glue coating device.

[0026] Then, the distribution point intervals in the distribution map are traversed to determine the size relationship with the limit interval distance. If the distribution point interval is greater than or equal to the limit interval distance, it means that the distribution point interval of this group of intervals is smaller than the size of the glue coating equipment, and accurate operation cannot be performed. The corresponding setting is an abnormal interval area. Among them, the distribution points in the distribution map refer to multiple glue coating points, such as two pin points close to a diode.

[0027] Exemplarily, to obtain the abnormal spacing area, first, determine the features to be identified, including the position, size, shape, etc. of the diode, according to the size and capacity of the glue coating equipment being used (i.e., the spacing distance). Then, analyze the distribution map through a convolutional neural network. The convolutional neural network slides on the distribution map through the convolution kernel, and each slide covers a small area (i.e., the area determined by the preset segmentation method). Then, the covered area is analyzed to check whether each area contains a diode, whether the size and spacing of the diode meet expectations, etc., so as to determine the abnormal spacing area.

[0028] Optionally, the abnormal interval regions are combined with area identification according to the configured area, including treating the abnormal interval regions as a whole glue-coated grid and allocating new area identifications to the reconfigured regions.

[0029] Optionally, the new area identifier is added to the original area identifier, and then further area clustering is performed to ensure that the glue coating areas in the clustering results are adapted to the working performance of the target glue coating equipment and the actual requirements of the diode, thereby improving the glue coating quality.

[0030] In some implementations, configuring the area of ​​the abnormal interval region includes: Acquire the glue coating area of ​​the abnormal interval area, and when the glue coating areas of the abnormal interval areas are the same, configure the original area identifier, and set the combined glue coating trajectory, wherein the combined glue coating trajectory is a sequentially continuous trajectory; When the glue coating areas of the abnormal interval regions are different, the configuration is performed with the diode area mark located in the middle, and the combined glue coating trajectory is set as a trajectory that diffuses outward from the center.

[0031] Specifically, the area of ​​the abnormal interval area is configured, and the abnormal interval area includes multiple glue coating areas. When the multiple glue coating areas in the abnormal interval area are the same, an original area identifier is configured for these areas, and a sequentially continuous combined glue coating trajectory is set. In other words, when the multiple glue coating areas in the abnormal interval area are the same, the glue coating device will glue these areas in a fixed order (such as from left to right, from top to bottom). When the glue coating areas of the abnormal interval areas are different, the glue coating area of ​​the diode located in the middle is used as an identifier to configure the glue coating parameters, including configuring the glue coating trajectory width, and setting the combined glue coating trajectory as a trajectory that diffuses from the center to the outside, thereby ensuring uniform distribution of the glue.

[0032] Obtaining the overlapping area region of the area cluster distribution map, performing correlation conversion according to the overlapping area region, and generating a correlation coefficient; Optionally, multiple area clusters in the area cluster distribution diagram are internally connected to form multiple cluster area regions; then, multiple area clusters are traversed to perform random combinations in pairs to obtain multiple cluster groups; then, overlapping areas of cluster area regions corresponding to multiple cluster groups are identified and measured to obtain multiple overlapping area regions, and the size or proportion of the overlapping area regions reflects the degree of association between clusters; then, the correlation coefficient is calculated based on the size or proportion of the overlapping area. The correlation coefficient is used to guide subsequent gluing operations.

[0033] Exemplarily, the ratio of the overlapping area size to the total size of the cluster area of ​​the corresponding cluster group is calculated, and a correlation conversion is performed to obtain a correlation coefficient.

[0034] Calculating the total proportion according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value; In some embodiments, the total proportion is calculated according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value, including: According to the number of distribution position identifiers of the distribution map, the total number of standard identifiers is obtained; The number of marks and the number of abnormal interval areas are calculated for the area cluster distribution map, and the proportion of the marked marks is obtained by the ratio of the number of marks to the total number of standard marks; The area clustering ratio value is generated by taking the proportion of the labeled marks as the standard value and the number of abnormal interval areas as the adjustment amount.

[0035] Among them, the total number of standard logos refers to the total number of distribution location logos in the distribution map.

[0036] Optionally, the area cluster distribution map is traversed to count the number of distribution position identifiers and the number of abnormal interval areas within the cluster. In this statistical process, the abnormal interval area as a whole is regarded as a distribution position identifier.

[0037] Optionally, the area cluster ratio value includes a standard value and an adjustment amount, wherein the standard value, i.e., the marked identification ratio, is the first reference indicator, which is the first selection basis in the subsequent initial area determination; the adjustment amount, i.e., the number of abnormal interval areas, is the second reference indicator, which is the second selection basis in the subsequent initial area determination.

[0038] According to the area cluster proportion value, an initial area is determined, the initial area is the area cluster distribution with the largest area cluster proportion value, the associated area cluster distribution map of the initial area and the corresponding association coefficient are extracted, and the path configuration is performed to obtain the glue coating control path; Among them, the initial area is the starting point of the glue coating track.

[0039] Optionally, first, the standard value in the area cluster ratio, i.e., the mark mark ratio, is used as the first reference indicator, and the adjustment amount, i.e., the number of abnormal interval regions, is used as the second reference indicator to arrange multiple area cluster distributions in descending order, and then, the area cluster distribution at the top of the sequence is selected as the initial region. Among them, the initial region is the cluster with the largest area and contains the most diodes, so the glue is applied first.

[0040] The above method provides a data-based selection strategy for determining the initial area of ​​the gluing operation, which helps to improve the efficiency and quality of gluing.

[0041] In some embodiments, extracting the associated area cluster distribution map of the initial area and the corresponding associated coefficient, performing path configuration, and obtaining the gluing control path includes: According to the association coefficient, the path configuration is performed with the initial area as the starting point, and the cluster distribution of the association area with the highest association coefficient is set as the subsequent node; According to the location marker distribution of each area cluster distribution map, the optimal subspace is constructed with the shortest path as the target value; According to the node relationship of the path configuration, each optimization subspace is connected to construct a full path optimization model; The combined gluing trajectory is taken as a constraint condition and added into the full path optimization model for iterative optimization. When a preset number of iterations is reached or a path optimization target value is reached, the gluing control path is output through the full path optimization model.

[0042] Optionally, first, according to the correlation coefficient, the path is configured with the initial area as the starting point, and the associated area cluster distribution with the highest correlation coefficient is selected as the next node; then, according to the location identifier distribution of each area cluster distribution map, an optimal subspace is constructed, wherein the optimal subspace takes the shortest path as the target value.

[0043] Optionally, multiple associated area cluster distributions are traversed to determine multiple subsequent nodes in sequence; then, based on the determined multiple subsequent nodes, multiple optimization subspaces are obtained; then, according to the order relationship of multiple nodes in the path configuration, multiple optimization subspaces are correspondingly connected to construct a full path optimization model. In other words, the full path optimization model includes multiple serialized optimization subspaces.

[0044] Optionally, in the process of finding the optimal gluing path, it is necessary to consider the existing combined gluing trajectory. Therefore, the combined gluing trajectory is used as an additional constraint, and the starting point and the end point of the combined gluing trajectory are set as the waypoints. The initial full path optimization model ensures that the gluing equipment will pass through the starting point and the end point of the combined gluing trajectory.

[0045] Optionally, an optimal gluing path is found based on an iterative optimization algorithm, such as a genetic algorithm or a simulated annealing algorithm. When a preset number of iterations is reached or the total path length reaches a target value, the total path optimization model outputs the gluing control path as the optimal gluing path, and the gluing control path is obtained.

[0046] The glue control parameters, including glue discharge pressure, glue discharge amount, and glue discharge control path, are determined according to the area cluster size of the glue coating control path, a mapping relationship between the glue coating control path and the glue control parameters is established, and a control instruction is generated to perform glue coating control.

[0047] Optionally, areas of different sizes require different glue output pressures and glue output amounts. Therefore, based on the area clustering size of the glue coating control path and combined with the characteristic parameters of the target glue coating equipment, the glue control parameters are determined, where the glue control parameters include glue pressure, glue output amount, and glue output control path.

[0048] Optionally, based on the area cluster size of different segments in the glue coating control path and the correspondence between the area cluster size and the glue control parameters, the glue control parameters are mapped to the glue coating control path, thereby ensuring that different segments on the glue coating control path are configured with appropriate glue control parameters, which helps to improve the efficiency and quality of glue coating.

[0049] In some implementations, the rapid glue coating method for a diode of the present invention further includes: Obtain device monitoring information through transport monitoring equipment to determine the location of post-installed devices; Acquire the gluing progress based on the control instruction, and determine the instruction interval deviation according to the position of the post-device and the gluing progress, wherein the instruction interval deviation is the time difference between the post-device reaching the gluing control position and the completion of the current control instruction; Adaptive adjustment of the glue control parameters is performed according to the instruction interval deviation, including: temperature control, the size of the temperature control corresponds to the temperature loss value and the power, and when the power heating time is less than half of the instruction interval deviation, the heating is stopped; otherwise, the power is controlled by curve analysis according to the instruction interval deviation through the temperature control processing model.

[0050] Optionally, when processing multiple devices, there may be deviations in the transmission speed of the devices. It is necessary to determine the instruction interval deviation based on the position of the post-device and the glue coating process, and to perform adaptive adjustment of the glue control parameters according to the instruction interval deviation.

[0051] Exemplarily, first, the position information of the post-device is obtained. Then, the gluing process is obtained through control instructions, and the instruction interval deviation is determined according to the position of the post-device and the gluing process. Next, based on the instruction interval deviation, the glue control parameters, including temperature control, are adaptively adjusted. This is because temperature affects the viscosity, fluidity and curing speed of the glue, thereby affecting the gluing process. Specifically, if the heating time of the current power is less than half of the instruction interval deviation, the heating is stopped, thereby appropriately reducing the viscosity and fluidity of the glue and improving the gluing effect; otherwise, the heating power is adjusted through the temperature control processing model in combination with the instruction interval deviation, so as to improve the gluing efficiency and ensure the normal processing of the post-device while ensuring the quality of the gluing.

[0052] The temperature control processing model can be a mathematical model based on statistical analysis or an end-to-end processing model based on machine learning, and the temperature control processing model includes a mapping relationship between the instruction interval deviation and the heating power. Specifically, the temperature control processing model uses the instruction interval deviation as an input parameter and the heating power adjustment value as a response result, thereby realizing adaptive adjustment of the temperature in the glue control parameter.

[0053] The above-mentioned adaptive gluing control method helps to improve the efficiency and quality of gluing.

[0054] In summary, the rapid glue coating method for diodes provided by the present invention has the following technical effects: By collecting the distribution of diodes, glue coating positions and glue coating areas in the device, a distribution map is constructed, wherein the distribution map has position identifiers and area identifiers; based on the area identifiers in the distribution map, size identification is performed, and area clustering is performed according to the area size to obtain an area clustering distribution map; the overlapping area area of ​​the area clustering distribution map is obtained, and the correlation degree is converted according to the overlapping area area to generate a correlation coefficient; according to the number of distribution position identifiers of the area clustering distribution map, the total proportion is calculated to obtain the area clustering proportion value; according to the area clustering proportion value, the initial area is determined, and the initial area is the area clustering distribution with the largest area clustering proportion value, and the associated area clustering distribution map of the initial area and the corresponding correlation coefficient are extracted to perform path configuration to obtain the glue coating control path; according to the area clustering size of the glue coating control path, the glue control parameters are determined, including glue discharge pressure, glue discharge amount, and glue discharge control path, and a mapping relationship between the glue coating control path and the glue control parameters is established to generate control instructions for glue coating control. Thus, the technical effect of simplifying glue coating planning and improving glue coating efficiency is achieved.

[0055] Embodiment 2 Figure 2 Schematic diagram of the structure of a fast glue coating system for diodes of the present invention. Figure 1 The schematic flow chart of the rapid glue coating method for a diode of the present invention can be shown as follows: Figure 2 The structure shown is implemented.

[0056] Based on the same concept as the fast glue coating method for a diode in the above embodiment, the present invention also provides a fast glue coating system for a diode, including: The distribution mapping module 11 is used to collect the distribution of diodes, the glue coating position and the glue coating area in the device, and construct a distribution map, wherein the distribution map has a position mark and an area mark; An area clustering module 12 is used to identify the size based on the area identifier in the distribution map, and cluster the areas according to the area size to obtain an area cluster distribution map; The association analysis module 13 is used to obtain the overlapping area region of the area cluster distribution diagram, perform correlation conversion according to the overlapping area region, and generate a correlation coefficient; A proportion calculation module 14 is used to calculate the total proportion according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value; The path configuration module 15 is used to determine the initial area according to the area cluster proportion value, the initial area is the area cluster distribution with the largest area cluster proportion value, extract the associated area cluster distribution map of the initial area and the corresponding association coefficient, perform path configuration, and obtain the glue coating control path; The glue coating control module 16 is used to determine the glue control parameters according to the area cluster size of the glue coating control path, including glue discharge pressure, glue discharge amount, and glue discharge control path, establish a mapping relationship between the glue coating control path and the glue control parameters, and generate control instructions for glue coating control.

[0057] Among them, the distribution mapping module 11 includes: A task decomposition unit, used to obtain a design drawing of the device, perform diode glue coating task decomposition, and determine the diode distribution; The diode glue coating positioning unit is used to analyze the glue coating area according to the structure and functional requirements of the diode and locate the diode glue coating position; A base positioning unit, used to locate the gluing position and gluing area of ​​the base according to the design drawing of the base, wherein the gluing position and gluing area of ​​the base are the position and area in contact with the diode; A gluing position unit, used for obtaining the gluing position according to the gluing position of the diode and the gluing position of the base; The area constraint unit is used to constrain the glue coating area of ​​the diode according to the glue coating area of ​​the base to obtain the glue coating area.

[0058] Furthermore, the area clustering module 12 includes: A spacing distance limiting unit, used for setting a limited spacing distance based on the size of the glue coating device; An abnormality identification unit, used to traverse the distribution points in the distribution map by using the limited interval distance to obtain the abnormal interval area, including: configuring identification features according to the limited interval distance, segmenting the distribution map according to a preset segmentation method by using a convolution kernel model, and traversing the segmentation area features by using the identification features; A combining unit, used for performing clustering screening according to the abnormal interval areas, configuring the areas of the abnormal interval areas, and marking the combined areas of the abnormal interval areas according to the configured areas; The area clustering unit is used to add the combined area identifier to the area identifier for area clustering.

[0059] In some implementations, the combining unit in the area clustering module 12 includes: A sequential and continuous unit is used to obtain the glue coating area of ​​the abnormal interval area, and when the glue coating areas of the abnormal interval areas are the same, configure the original area identifier and set a combined glue coating trajectory, wherein the combined glue coating trajectory is a sequential and continuous trajectory; The central diffusion unit is used to configure the diode area mark located in the middle when the glue coating area of ​​the abnormal interval area is different, and set the combined glue coating track as a diffusion track from the center to the outside.

[0060] Furthermore, the ratio calculation module 14 includes: A total number obtaining unit, used for obtaining the total number of standard identifiers according to the number of distribution position identifiers of the distribution graph; A labeling mark proportion unit is used to calculate the number of marks and the number of abnormal interval areas in the area cluster distribution map, and obtain the labeling mark proportion by the ratio of the number of marks to the total number of standard marks; The area cluster proportion unit is used to use the proportion of the marked marks as a standard value and the number of abnormal interval areas as an adjustment amount to generate the area cluster proportion value.

[0061] Furthermore, the path configuration module 15 includes: A path configuration unit, configured to perform path configuration based on the association coefficient and taking the initial area as a starting point, and set the cluster distribution of the association area with the highest association coefficient as a subsequent node; An optimization subspace construction unit is used to construct an optimization subspace based on the position identifier distribution of each area cluster distribution map and with the shortest path as the target value; A spatial connection unit, used to connect the optimization subspaces according to the node relationship of the path configuration to construct a full path optimization model; The path optimization unit is used to take the combined gluing trajectory as a constraint condition and add it to the full path optimization model for iterative optimization. When a preset number of iterations is reached or the path optimization target value is reached, the gluing control path is output through the full path optimization model.

[0062] Furthermore, the system also includes a temperature control unit, which is used to: Obtain device monitoring information through transport monitoring equipment to determine the location of post-installed devices; Acquire the gluing progress based on the control instruction, and determine the instruction interval deviation according to the position of the post-device and the gluing progress, wherein the instruction interval deviation is the time difference between the post-device reaching the gluing control position and the completion of the current control instruction; Adaptive adjustment of the glue control parameters is performed according to the instruction interval deviation, including: temperature control, the size of the temperature control corresponds to the temperature loss value and the power, and when the power heating time is less than half of the instruction interval deviation, the heating is stopped; otherwise, the power is controlled by curve analysis according to the instruction interval deviation through the temperature control processing model.

[0063] It should be understood that the embodiments mentioned in this specification focus on their differences from other embodiments. The specific embodiments in the aforementioned embodiment 1 are also applicable to the rapid glue coating system for diodes described in embodiment 2. For the sake of brevity of the specification, they will not be further elaborated here.

[0064] It should be understood that the embodiments disclosed in the present invention and the above description can enable those skilled in the art to use the present invention to implement the present invention. At the same time, the present invention is not limited to the above-mentioned embodiments. It should be understood that those skilled in the art can still modify the technical solutions recorded in the above-mentioned embodiments, or replace some of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention.

Claims

1. A method for rapid glue coating of a diode, characterized in that: The method comprises: Collect the distribution of diodes, glue coating positions and glue coating areas in the device, and construct a distribution map, wherein the distribution map has position marks and area marks; Performing size identification based on the area identifiers in the distribution map, and clustering the areas according to their sizes to obtain an area cluster distribution map; Obtaining the overlapping area region of the area cluster distribution map, performing correlation conversion according to the overlapping area region, and generating a correlation coefficient; Calculating the total proportion according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value; According to the area cluster proportion value, an initial area is determined, the initial area is the area cluster distribution with the largest area cluster proportion value, the associated area cluster distribution map of the initial area and the corresponding association coefficient are extracted, and the path configuration is performed to obtain the glue coating control path; The glue control parameters, including glue discharge pressure, glue discharge amount, and glue discharge control path, are determined according to the area cluster size of the glue coating control path, a mapping relationship between the glue coating control path and the glue control parameters is established, and a control instruction is generated to perform glue coating control.

2. The method according to claim 1, characterized in that The distribution of diodes, the glue coating position and the glue coating area in the collecting device are constructed to construct a distribution map, wherein the distribution map has a position mark and an area mark, including: Obtain the design drawing of the device, perform diode glue coating task decomposition, and determine the diode distribution; According to the structure and functional requirements of the diode, analyze the area of ​​the glue coating part and locate the glue coating position of the diode; According to the design drawing of the base, locate the glue coating position and glue coating area of ​​the base, and the glue coating position and glue coating area of ​​the base are the position and area in contact with the diode; Obtaining the glue coating position according to the glue coating position of the diode and the glue coating position of the base; The glue coating area of ​​the diode is constrained according to the glue coating area of ​​the base to obtain the glue coating area.

3. The method according to claim 1, characterized in that The size is identified based on the area identifier in the distribution map, and the area is clustered according to the area size to obtain an area cluster distribution map, including: Set the limit spacing distance based on the size of the glue application equipment; Using the limited interval distance to traverse the distribution points in the distribution map to obtain the abnormal interval area, including: configuring identification features according to the limited interval distance, using the convolution kernel model to segment the distribution map according to a preset segmentation method, and using the identification features to traverse the segmentation area features; Clustering and screening are performed according to the abnormal interval regions, and area configuration is performed on the abnormal interval regions, and combined area marking is performed on the abnormal interval regions according to the configured areas; The combined area identifier is added to the area identifier to perform area clustering.

4. The method according to claim 3, characterized in that The configuring the area of ​​the abnormal interval region includes: Acquire the glue coating area of ​​the abnormal interval area, and when the glue coating areas of the abnormal interval areas are the same, configure the original area identifier, and set the combined glue coating trajectory, wherein the combined glue coating trajectory is a sequentially continuous trajectory; When the glue coating areas of the abnormal interval regions are different, the configuration is performed with the diode area mark located in the middle, and the combined glue coating trajectory is set as a trajectory that diffuses outward from the center.

5. The method according to claim 4, characterized in that According to the number of distribution position identifiers of the area cluster distribution map, the total proportion is calculated to obtain the area cluster proportion value, including: According to the number of distribution position identifiers of the distribution map, the total number of standard identifiers is obtained; The number of marks and the number of abnormal interval areas are calculated for the area cluster distribution map, and the proportion of the marked marks is obtained by the ratio of the number of marks to the total number of standard marks; The area clustering ratio value is generated by taking the proportion of the labeled marks as the standard value and the number of abnormal interval areas as the adjustment amount.

6. The method according to claim 4, characterized in that Extracting the associated area cluster distribution map of the initial area and the corresponding associated coefficient, performing path configuration, and obtaining a gluing control path, including: According to the association coefficient, the path configuration is performed with the initial area as the starting point, and the cluster distribution of the association area with the highest association coefficient is set as the subsequent node; According to the location marker distribution of each area cluster distribution map, the optimal subspace is constructed with the shortest path as the target value; According to the node relationship of the path configuration, each optimization subspace is connected to construct a full path optimization model; The combined gluing trajectory is taken as a constraint condition and added into the full path optimization model for iterative optimization. When a preset number of iterations is reached or a path optimization target value is reached, the gluing control path is output through the full path optimization model.

7. The method according to claim 1, characterized in that The method further comprises: Obtain device monitoring information through transport monitoring equipment to determine the location of post-installed devices; Acquire the gluing progress based on the control instruction, and determine the instruction interval deviation according to the position of the post-device and the gluing progress, wherein the instruction interval deviation is the time difference between the post-device reaching the gluing control position and the completion of the current control instruction; Adaptive adjustment of the glue control parameters is performed according to the instruction interval deviation, including: temperature control, the size of the temperature control corresponds to the temperature loss value and the power, and when the power heating time is less than half of the instruction interval deviation, the heating is stopped; otherwise, the power is controlled by curve analysis according to the instruction interval deviation through the temperature control processing model.

8. A fast glue coating system for diodes, characterized in that: The system is used to implement the method according to any one of claims 1 to 7, and the system comprises: A distribution mapping module, which is used to collect the distribution of diodes, the glue coating position and the glue coating area in the device, and construct a distribution map, wherein the distribution map has a position mark and an area mark; An area clustering module, the area clustering module is used to identify the size based on the area identifier in the distribution map, and cluster the areas according to the area size to obtain an area cluster distribution map; An association analysis module, the association analysis module is used to obtain the overlapping area region of the area cluster distribution map, perform correlation conversion according to the overlapping area region, and generate a correlation coefficient; A proportion calculation module, the proportion calculation module is used to calculate the total proportion according to the number of distribution position identifiers of the area cluster distribution map to obtain the area cluster proportion value; A path configuration module, wherein the path configuration module is used to determine an initial area according to the area cluster proportion value, wherein the initial area is an area cluster distribution with the largest area cluster proportion value, extract an associated area cluster distribution map of the initial area and its corresponding associated coefficient, perform path configuration, and obtain a glue coating control path; The glue coating control module is used to determine the glue control parameters according to the area clustering size of the glue coating control path, including glue discharge pressure, glue discharge amount, and glue discharge control path, establish a mapping relationship between the glue coating control path and the glue control parameters, and generate control instructions for glue coating control.

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