Bidirectional optical sensor package and method of forming same

Abstract

The present application discloses an optical sensor package comprising: a base substrate having a window; a first optical sensor mounted on a front surface of the base substrate, a light receiving surface of the first optical sensor facing and aligned with the window; a first light-transmissive sealing molded part covering the light receiving surface of the first optical sensor, the first light-transmissive sealing molded part being filled in the window; a first sealant layer formed on the front surface of the base substrate and sealing the first optical sensor, the first sealant layer including an interlayer connector; an interposer mounted on the first encapsulant layer and electrically coupled to the base substrate via an interlayer connection of the first encapsulant layer; a second optical sensor mounted on a front surface of the interposer, a light receiving surface of the second optical sensor facing away from the interposer; a second light-transmissive sealing mold covering a light-receiving surface of the second optical sensor; and a second encapsulant layer formed on the front surface of the interposer to encapsulate the second optical sensor.

Description

Technical Field

[0001] The present application relates generally to semiconductor technology, and more particularly to a bidirectional optical sensor package and a method for forming a bidirectional optical sensor package. Background Art

[0002] Recently, sensor development is accelerating due to the expansion of the automotive and wearable device markets. It is expected that more optical sensors can be integrated into a single package, making the sensor package more compact overall.

[0003] Therefore, there is a need for further improvements in optical sensor packaging. Summary of the invention

[0004] An object of the present application is to provide a bidirectional optical sensor package with a compact structure.

[0005] According to one aspect of the present application, an optical sensor package is disclosed. The optical sensor package includes: a base substrate having a window passing therethrough; a first optical sensor mounted on the front surface of the base substrate, wherein the light receiving surface of the first optical sensor faces the window of the base substrate and is aligned with the window of the base substrate; a first light-transmitting sealing molding covering the light receiving surface of the first optical sensor, wherein the first light-transmitting sealing molding is filled in the window of the base substrate; a first sealant layer formed on the front surface of the base substrate and sealing the first optical sensor, wherein the first sealant layer includes an interlayer connector passing therethrough; an interposer mounted on the first sealant layer and electrically coupled to the base substrate via the interlayer connector of the first sealant layer; a second optical sensor mounted on the front surface of the interposer, wherein the light receiving surface of the second optical sensor faces away from the interposer; a second light-transmitting sealing molding covering the light receiving surface of the second optical sensor; and a second sealant layer formed on the front surface of the interposer to seal the second optical sensor.

[0006] According to another embodiment of the present application, a method for forming an optical sensor package is disclosed. The method includes: providing a base substrate; forming a window through the base substrate; providing a first optical sensor having a light receiving surface covered by a first light-transmitting sealing molding and a second optical sensor having a light receiving surface covered by a second light-transmitting sealing molding; mounting the first optical sensor on the front surface of the base substrate, wherein the first light-transmitting sealing molding is filled in the window of the base substrate; forming an interlayer connector on the front surface of the base substrate; forming a first sealant layer on the front surface of the base substrate to seal the first optical sensor and the interlayer connector, wherein the interlayer connector passes through the first sealant layer; mounting an interlayer on the interlayer connector to electrically couple the interlayer with the base substrate; mounting the second optical sensor on the front surface of the interlayer, wherein the light receiving surface of the second optical sensor and the second light-transmitting sealing molding are facing away from the interlayer; and forming a second sealant layer on the front surface of the interlayer to seal the second optical sensor.

[0007] According to another embodiment of the present application, a method for forming an optical sensor package is disclosed. The method includes: providing a base substrate; forming a window through the base substrate; providing a first optical sensor having a light receiving surface covered by a first light-transmitting sealing mold and a second optical sensor having a light receiving surface covered by a second light-transmitting sealing mold; mounting the first optical sensor on the front surface of the base substrate, wherein the first light-transmitting sealing mold is filled in the window of the base substrate; forming an interlayer connector on the front surface of the base substrate; forming a first sealant layer on the front surface of the base substrate to seal the first optical sensor and the interlayer connector, wherein the interlayer connector passes through the first sealant layer; providing an interposer, mounting the second optical sensor on the front surface of the interposer, wherein the light receiving surface of the second optical sensor and the second light-transmitting sealing mold face away from the interposer; forming a second sealant layer on the front surface of the interposer to seal the second optical sensor; and attaching the interposer to the first sealant layer to electrically couple the interposer with the base substrate via the interlayer connector.

[0008] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory and do not limit the present invention. In addition, the accompanying drawings, which are incorporated in this specification and constitute a part of this specification, illustrate embodiments of the present invention and together with the description, are used to explain the principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings referred to herein form part of the specification. The features shown in the drawings only illustrate some embodiments of the present application, rather than all embodiments of the present application, unless the specific implementation method clearly indicates otherwise, and the reader of this specification should not make an inference to the contrary.

[0010] Figure 1A bidirectional optical sensor package according to an embodiment of the present application is shown.

[0011] Figures 2A to 2D A method for forming an optical sensor assembly according to an embodiment of the present application is shown.

[0012] Figures 3A to 3G A method for forming an optical sensor package according to an embodiment of the present application is shown.

[0013] FIG. 4A to FIG. 4B A method for forming an optical sensor package according to an embodiment of the present application is shown.

[0014] FIG. 5A to FIG. 5F A method for forming an optical sensor package according to an embodiment of the present application is shown.

[0015] The same reference numbers will be used throughout the drawings to refer to the same or like parts. DETAILED DESCRIPTION

[0016] The following detailed description of exemplary embodiments of the present application refers to the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which the present application can be practiced. The detailed description including the drawings describes these embodiments in sufficient detail to enable a person skilled in the art to practice the present application. A person skilled in the art may further utilize other embodiments of the present application and make logical, mechanical and other changes without departing from the spirit or scope of the present application. Therefore, the reader of the following detailed description should not interpret this specification in a limiting sense, and only the appended claims define the scope of the embodiments of the present application.

[0017] In this application, unless otherwise expressly stated, the use of the singular includes the plural. In this application, unless otherwise stated, the use of "or" means "and / or". In addition, the use of the term "comprising" is not limiting. In addition, unless otherwise specifically stated, terms such as "element" or "component" cover both elements and components that contain one unit and elements and components that contain more than one unit. The section headings used herein are for organizational purposes only and should not be construed as limiting the desired subject matter in any way.

[0018] As used herein, for ease of description, spatially relative terms such as "under," "below," "above," "above," "up," "upper," "lower," "left," "right," "vertical," "horizontal," "side," etc. may be used herein to describe the relationship of one element or feature to another element (or elements) or feature (or features), as illustrated in the drawings. In addition to the orientation depicted in the figures, spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may also be interpreted accordingly. It should be understood that when an element is referred to as being "connected to" or "coupled to" another element, the element may be directly connected or coupled to the other element, or there may be intermediate elements.

[0019] Figure 1 A bidirectional optical sensor package 100 according to an embodiment of the present application is shown. The optical sensor package 100 includes two optical sensors facing away from each other to receive light from the front and back sides of the package 100.

[0020] like Figure 1 As shown in , the optical sensor package 100 includes a base substrate 102, which can provide support and connection for electronic components mounted thereon. For example, the base substrate 102 can include a printed circuit board (PCB), a carrier substrate, a semiconductor substrate with electrical interconnects, or a ceramic substrate. In some other examples, the base substrate 102 can include a laminated interposer, a strip interposer, a lead frame, or other suitable substrate. In some embodiments, the base substrate 102 can include a plurality of interconnect structures that can provide connections for electronic components mounted on the base substrate 102. The interconnect structures can include one or more of Cu, Al, Sn, Ni, Au, Ag, or any other suitable conductive material. In some examples, the interconnect structures can include redistribution structures. The redistribution structures can include one or more dielectric layers and one or more conductive layers between and through the dielectric layers. The conductive layers can define pads, traces, and plugs, and electrical signals or voltages can be distributed horizontally and vertically across the redistribution structures via the pads, traces, and plugs.

[0021] The base substrate 102 has a front surface and a rear surface opposite the front surface. A window 104 is formed in the base substrate 102 and passes through the base substrate 102 between the front surface and the rear surface of the base substrate. In some embodiments, conductive patterns such as contact pads and / or solder bumps may be formed on the rear surface of the base substrate 102 to allow the optical sensor package 100 to be connected to an external electronic device or system such as a printed circuit board.

[0022] The first optical sensor component is mounted on the front surface of the base substrate 102. Specifically, the first optical sensor component may include a first optical sensor 106 such as an image sensor die or an infrared sensor die, which has a light receiving surface for receiving light emitted from a space where the optical sensor package 100 is positioned. Alternatively, the first optical sensor 106 may also incorporate one or more additional functions (e.g., an image processing function) therein to improve the integration of the optical sensor package 100. Figure 1 As shown, the light receiving surface of the first optical sensor 106 faces toward the window 104 of the base substrate 102 and is aligned with the window of the base substrate, so that the first optical sensor can receive light emitted from the back side of the optical sensor package 100 through the window 104. The first optical sensor component also includes a light-transmitting sealing molding 108, which covers the light-receiving surface of the first optical sensor 106 but allows light to pass through the first light-transmitting sealing molding 108. The first light-transmitting sealing molding 108 is filled in the window 104. In this way, the overall height of the optical sensor package 100 can be reduced because there is some overlap in height between the base substrate 102 and the first optical sensor component. In some embodiments, the front surface of the first light-transmitting sealing molding 108 can be substantially flush with the back surface of the base substrate 102 to form a flat plane at the back surface. The first light-transmitting sealing molding 108 can be made of a light-transmitting material (such as glass, silicone, resin or other suitable materials or combinations thereof), and can be formed using a molding process (such as injection molding or compression molding). In some embodiments, an optical filter layer 110 may be formed between the first optical sensor 106 and the first light-transmissive sealing molding 108 for filtering light.

[0023] In addition to its light receiving surface, the first optical sensor 106 also has a set of conductive patterns 112, such as contact pads. The conductive patterns 112 can be electrically coupled to the base substrate 102 via a set of solder bumps 114 between the first optical sensor 106 and the base substrate 102. The solder bumps 114 can be, for example, stub bumps, which can be pre-formed on the front surface of the first optical sensor 106 before being mounted on the base substrate 102. The set of conductive patterns 112 and solder bumps 114 can be evenly distributed around the light receiving surface and the periphery of the first optical sensor 106, so that the first optical sensor 106 can be firmly bonded to the base substrate 102. In some embodiments, the first optical sensor assembly can be independently formed as one piece before being mounted on the base substrate 102. An exemplary process for forming the first optical sensor assembly and other similar optical sensor assemblies will be described in detail below.

[0024] In some embodiments, at least one electronic component, such as one or more passive devices 116 (e.g., capacitors or resistors) and one or more semiconductor dies 118, may be attached to the front surface of the base substrate 102. These electronic components may be electrically coupled to the first optical sensor 106 via the base substrate 102 to provide more functionality for the optical sensor package 100. For example, the semiconductor die 118 may include an application specific integrated circuit (ASIC) that may provide additional signal or data processing capabilities, or may include a memory that may store images captured by the first optical sensor 106 or store other data generated by the circuit in the optical sensor package 100.

[0025] A first sealant layer 120 is formed on the front surface of the base substrate 102, which can seal the first optical sensor 106, and optionally, at least one electronic component is mounted on the front surface of the base substrate 102. In some embodiments, the first sealant layer 120 may be made of a polymer composite material, such as an epoxy resin with or without fillers, an epoxy acrylate with or without fillers, or a polymer with or without appropriate fillers, but the scope of the present application is not limited thereto. In addition, interlayer connectors 122 such as metal pillars may be formed on the base substrate 102. The interlayer connectors 122 may pass through the first sealant layer 120 and thus provide interlayer connection capabilities. The interlayer connectors 122 may be electrically connected to certain conductive patterns on the front surface of the base substrate 102. The number of interlayer connectors 122 may depend on the need for signal transmission in the optical sensor package 100.

[0026] Interposer 124 is mounted on first encapsulant layer 120 and electrically coupled to base substrate 102 via interlayer connectors 122. Similar to base substrate 102, interposer 102 may include a plurality of interconnect structures that may provide connectivity therethrough and, optionally, may be used to mount electronic components on interposer 124. The interconnect structures may include one or more of Cu, Al, Sn, Ni, Au, Ag, or any other suitable conductive material. In some examples, the interconnect structures may include one or more conductive layers between and through interposers 124. The conductive layers may define pads, traces, and plugs through which electrical signals or voltages may be distributed horizontally and vertically across the interconnect structures and through interposer 124.

[0027] The second optical sensor assembly is mounted on the front surface of the interposer 124. In some embodiments, the second optical sensor assembly can be the same as the first optical sensor assembly, while in some other embodiments, the second optical sensor assembly can be different from the first optical sensor assembly. For example, the second optical sensor assembly can have a larger size because there is more space for mounting the second optical sensor assembly. Figure 1, the second optical sensor component has a similar structure to the first optical sensor component, for example, they can be pre-formed using the same process or even in the same batch. Specifically, the second optical sensor component can have a second optical sensor 126, wherein the light receiving surface of the second optical sensor faces away from the interposer 124. The second optical sensor 126 can receive light emitted from the front side of the optical sensor package 100. In this way, the first optical sensor 106 and the second optical sensor 126 can implement bidirectional light detection relative to the optical sensor package 100. The second optical sensor component also includes a second light-transmitting sealing molding 128, which covers the light-receiving surface of the second optical sensor 126 but allows light to pass through. The second light-transmitting sealing molding 128 can be made of a light-transmitting material such as glass, silicone, resin or other suitable materials or combinations thereof, and can be formed using a molding process such as injection molding or compression molding. In some embodiments, an optical filter layer 130 can be formed between the second optical sensor 126 and the second light-transmitting sealing molding 128 for filtering light. In addition to its light receiving surface, the second optical sensor 126 also has a set of conductive patterns 132 , such as contact pads on its front surface. The conductive patterns 132 may be electrically coupled to the interposer 124 via a set of bonding wires 134 .

[0028] In addition, a second sealant layer 134 is formed on the front surface of the interposer 124, which may seal the second optical sensor 126 and the second light-transmitting sealing mold 128. However, the front surface of the second light-transmitting sealing mold 128 may be exposed from the second sealant layer 134 to prevent the second sealant layer 134 from blocking light transmission. The second sealant layer 134 may be formed of a material that is the same as or different from that of the first sealant layer 120. In some embodiments, the second sealant layer 134 may be formed together with the first sealant layer 120, while in some other embodiments, the first sealant layer 120 and the second sealant layer 134 may be formed separately.

[0029] Figures 2A to 2D A method for forming an optical sensor assembly according to an embodiment of the present application is shown. For example, the method can be used to form Figure 1 The first optical sensor component and / or the second optical sensor component of the optical sensor package 100 shown in FIG.

[0030] like Figure 2A As shown in FIG. 1 , an optical sensor 210 is provided. It is understandable that the optical sensor 210 may not be a single sensor chip that has been separated from a sensor wafer. In fact, the optical sensor 210 may be an unseparated optical sensor in a sensor wafer, and other identical or similar optical sensors may also exist in the sensor wafer. Although Figure 2AAlthough not shown in the figure, some conductive patterns (not shown) may be formed on the front surface of the optical sensor 210 to provide electrical connection between the optical sensor 210 and other electronic components.

[0031] The patterned photoresist layer 214 may be formed on the optical sensor 210, or in particular, on the front surface of the optical sensor 210. The patterned photoresist layer 214 at least partially covers the conductive pattern of the sensor 210, but exposes the light receiving surface or area of ​​the optical sensor 210. Specifically, a photoresist layer completely covering the front surface of the optical sensor 210 may be formed on the front surface of the optical sensor 210 using, for example, printing, spin coating, or spray coating. Subsequently, the photoresist layer may be formed into certain patterns using, for example, a photolithography process.

[0032] Then, if Figure 2B , an optical filter layer 211 and a light-transmitting sealant layer 212 are formed on the optical sensor 210. Specifically, the optical filter layer 211 is formed on top of the front surface of the optical sensor 210. The optical filter layer 211 covers and directly contacts the light receiving surface and the patterned photoresist layer of the optical sensor 210. Preferably, the optical filter layer 211 completely covers the exposed portion of the light receiving surface and the patterned photoresist layer. Subsequently, the light-transmitting sealant layer 212 is formed on top of the optical filter layer 211. Preferably, the light-transmitting sealant layer 212 may completely cover the entire optical filter layer 211.

[0033] See further Figure 2C , a portion of the light-transmitting sealant layer 212 and a portion of the optical filter layer 211 are removed so as to expose the patterned photoresist layer 214. In some embodiments, the removal may take the form of a half-cutting process performed using a saw or a laser cutting tool. The location where the half-cutting process is performed is selected so that after the half-cutting process, the patterned photoresist layer 214 is at least partially exposed. The depth of the half-cutting process may be equal to or greater than the total thickness of the light-transmitting sealant layer 212 and the optical filter layer 211, but less than the total thickness of the light-transmitting sealant layer 212, the optical filter layer 211, and the patterned photoresist layer 214. In some embodiments, in the case where the depth of the half-cutting process is less than the total thickness of the light-transmitting sealant layer 212, the optical filter layer 211, and the patterned photoresist layer 214, some of the patterned photoresist layer 214 may remain on the optical sensor 210. In other words, the patterned photoresist layer 214 may not be completely removed so that the retained photoresist layer 214 may protect the conductive pattern thereunder from being damaged during the half-cutting process. The remaining patterned photoresist layer 214 may be removed later by a photoresist stripping process such as organic stripping, inorganic stripping or dry stripping. Figure 2DAs shown in . Therefore, the optical sensor assembly 215 is formed. After the half-cutting process, the optical filter layer 211 and the light-transmitting sealant layer 212 may be patterned into the optical filter 211 and the light-transmitting sealing molding 212, respectively.

[0034] It will be appreciated that if the optical sensor is manufactured on the same wafer together with other similar sensors, a separation process may be performed to separate the optical sensors from each other, which will not be described in detail herein.

[0035] Various processes can be used to manufacture Figure 1 The optical sensor package 100 shown in FIG. 1 is shown in FIG. 1 . Some exemplary processes are described below, which may be used in Figures 2A to 2D After the steps for forming the optical sensor shown in .

[0036] Figures 3A to 3G A method for forming an optical sensor package according to an embodiment of the present application is shown.

[0037] like Figure 3A As shown in FIG. 3 , a base substrate 302 is provided. The base substrate 302 may be mounted on a carrier 301, such as a carrier tape or a carrier platform that provides support for the base substrate 302 during subsequent steps. It is understood that the base substrate 302 may be a substrate strip or plate having a plurality of unit portions, such as Figure 3A , which can be separated into separate units or parts when the packaging process is complete or substantially complete. A window 304 can be formed through the base substrate 302 using an etching process such as laser ablation. The shape of the window 304 can vary depending on the optical sensor component to be assembled in the window 304. In some embodiments, the window 304 can have a circular shape, a rectangular shape, or a square shape.

[0038] Then, if Figure 3B , various electronic components such as one or more passive devices 316 and one or more semiconductor dies 318 may be mounted on the front surface of the base substrate 302, and these electronic components may form a sensor module or system together with the optical sensor to be mounted on the base substrate 302 later. In addition, some other components that may facilitate the installation of the optical sensor assembly of the optical sensor package may be mounted on the front surface of the base substrate 302. Specifically, a group of solder bumps 314 such as short column bumps may be formed around the window 304. These solder bumps 314 may be formed on some conductive patterns on the front surface of the base substrate 302. Interlayer connectors 322 such as metal pillars may also be formed on the front surface of the base substrate 302. The interlayer connectors 322 may have a height greater than that of the electronic components on the base substrate 302.

[0039] like Figure 3C, the first optical sensor assembly may be mounted on the front surface of the base substrate 302. The first optical sensor assembly includes a first optical sensor 306 having a light receiving surface, a first light-transmitting sealing mold 308, and optionally an optical filter layer 310 between the first optical sensor 306 and the first light-transmitting sealing mold 308. The first light-transmitting sealing mold 308 and the optical filter layer 310 cover the light-receiving surface of the first optical sensor 306. When the optical sensor assembly is mounted on the base substrate 302, the light-receiving surface may face downward and be aligned with the window of the base substrate 302. In addition, the conductive pattern 312 (such as the contact pad on the front surface of the first optical sensor 306) may be aligned with the solder bump 314 so that the first optical sensor assembly may be firmly attached to the base substrate 302 (for example, after a reflow process). In some embodiments, an adhesive material, a sealing material, or other suitable filler material may be filled in the gap between the window and the first light-transmitting sealing mold 308 to form a tight seal therebetween.

[0040] Then, if Figure 3D As shown in FIG. 1 , the interposer 324 is mounted above the base substrate 302 and supported by the interlayer connectors 322. The interposer 324 can thus be electrically coupled to the base substrate 302 via the interlayer connectors 322. Figure 3E , the first sealant layer 320 may be formed on the front surface of the base substrate 302 to seal the first optical sensor 306 and other elements on the base substrate 302. The sealing material of the first sealant layer 320 may well occupy the space between the base substrate 302 and the interposer 324. In some embodiments, the sealing material of the first sealant layer 320 may fill the gap between the window of the base substrate 302 and the first light-transmitting sealing molding 308 to form a tight seal therebetween. Because of the presence of the carrier 301, the sealing material does not flow onto the rear surface of the base substrate 302. In some embodiments, the first sealant layer 302 may be formed using a molding process such as injection molding or compression molding.

[0041] Then, if Figure 3F, the second optical sensor assembly is mounted on the front surface of the interposer 324. The second optical sensor assembly includes a second optical sensor 326 having a light receiving surface facing away from the interposer 324, a second light-transmitting sealing mold 328, and an optical filter layer 330 optionally located between the second optical sensor 326 and the second light-transmitting sealing mold 328. The second light-transmitting sealing mold 328 and the optical filter layer 330 cover the light receiving surface of the second optical sensor 326. In some embodiments, the second optical sensor assembly may be attached to the front surface of the interposer 324 via an adhesive material. In addition, the second optical sensor 326 may have a set of conductive patterns 332 surrounding its light receiving surface, and the conductive patterns may be electrically coupled to the interposer 332 via corresponding bonding wires 334.

[0042] Finally, if Figure 3G As shown in FIG. 3 , a second sealant layer 336 may be formed on the front surface of the interposer 324 to seal the second optical sensor assembly. It is understood that the front surface of the second light-transmitting sealing molding 328 may be exposed from the second sealant layer 336, so that light may pass through the second light-transmitting sealing molding 328 to the light receiving surface of the second optical sensor 326. An optical sensor package may then be formed. As mentioned above, a separation process may be used to separate the package strips into individual packages, which may be further removed from the carrier.

[0043] FIG. 4A to FIG. 4B A method for forming an optical sensor package according to another embodiment of the present application is shown. Figure 3E to Figure 3G The sealing steps of forming two sealant layers are shown in Figure 4A and 4B The embodiment shown in uses a single sealing step.

[0044] like Figure 4A As shown in FIG. 4 , various elements including two optical sensor components are mounted on a base substrate 402 and an interposer 424 , respectively, and the base substrate 402 and the interposer 424 are mechanically and electrically coupled to each other via an interlayer connector 422 therebetween.

[0045] After this, a sealant molding process may be performed, such as Figure 4B The first sealant layer 420 may be formed between the base substrate 402 and the interposer 424, and seal the interlayer connector 422 and other electronic components on the base substrate 402. In addition, the second sealant layer 436 may be formed on the interposer 424 to seal the second optical sensor assembly but expose the front surface of the second light-transmitting sealing molding 428 of the second optical sensor assembly. The second sealant layer 436 may well protect the second optical sensor 426 of the second optical sensor assembly. Figures 3A to 3GCompared with the two-step sealing process shown in , the benefit of the single-step sealing process is that the thermal stress between the different sealant layers can be reduced.

[0046] FIG. 5A to FIG. 5F A method for forming an optical sensor package according to another embodiment of the present application is shown. Figures 3A to 3G and Figure 4A and Figure 4B In the method shown in FIG. 1 , two layers of electronic components are mounted on a base substrate and an interposer, respectively, and then FIG. 5A to FIG. 5F The embodiments shown are assembled together.

[0047] like Figure 5A As shown in , the base substrate 502 may be attached to the first carrier 501. Subsequently, the first optical sensor assembly may be mounted on the base substrate 502, and various other elements including interlayer connectors 522 such as metal pillars are also mounted on the base substrate 502. Then, a first sealant layer 520 may be formed on the front surface of the base substrate 502, which may cover and seal all elements on the base substrate 502. The first sealant layer 520 may have a height greater than the interlayer connector 522. Subsequently, as shown in FIG. Figure 5B As shown in FIG. 5 , a grinding process may be performed on the first sealant layer 520 to remove an excess portion of the first sealant layer 520 . Thus, a top surface of the interlayer connector 522 may be exposed from the first sealant layer 520 .

[0048] like Figure 5C As shown in FIG. 1 , as a separate one-step process, a second optical sensor assembly having a second optical sensor 526, a second light-transmissive sealing molding 528, and an optional optical filter layer can be mounted on the interposer 524 via, for example, an adhesive material. The second optical sensor 526 can have a conductive pattern 532 on its front surface, which can be electrically coupled to the interposer 524 via a set of bonding wires 534. Subsequently, as shown in FIG. Figure 5D As shown in FIG. 5 , a second sealant layer 536 may be formed on the interposer 524 to seal the second optical sensor assembly but expose the front surface of the second light-transmitting sealing molding 528. The second sealant layer 536 may be attached to a second carrier 541 such as a carrier tape, wherein the rear surface of the interposer 524 is away from the second carrier 541, such as Figure 5E As shown in .

[0049] Finally, if Fig. 5F As shown in Figure 5A and FIG. 5B to FIG. 5DThe two parts of the optical sensor package formed separately by the steps shown in the figure can be attached to each other using some adhesive material. Specifically, after the attachment process, the interlayer connector 522 can be electrically coupled to the interposer 524, so that the interposer 524 and the second optical sensor component mounted thereon can be electrically coupled to the base substrate 502 and the element mounted thereon via the interlayer connector 522. In some embodiments, an anisotropic conductive film can be used to attach the two parts of the optical sensor package because it can be conductive only in the vertical direction at the location of the interlayer connector 522 and may not be conductive in the horizontal direction. As mentioned above, a separation process can be formed to separate the package strips of the plurality of optical sensor packages into separate packages. The first carrier 501 and the second carrier 541 can then be removed from the optical sensor package.

[0050] It is understood that the two parts of the optical sensor package can be combined with each other in other ways. For example, a clamp, a vacuum chuck or other suitable tool can be used instead of the second carrier 541 to move the interposer 524 and the second optical sensor assembly mounted thereon to the base substrate 502, and stack the interposer, the second optical sensor assembly and the base substrate on the first sealant layer 520. Alternatively, the two parts of the optical sensor package can be removed from the first carrier and the second carrier respectively, and then the two parts of the optical sensor package can be moved together using any other suitable tool or device.

[0051] It can be seen that the optical sensor package according to the embodiment of the present application is compact in structure and can avoid some components required for conventional optical sensor packages, such as a cover or a cap. In addition, the double-layer structure of the optical sensor package allows detection of light emitted from both sides of the package, that is, bidirectional optical detection can be implemented.

[0052] Although the optical sensor package of the present application is described in conjunction with the corresponding drawings, it will be understood by those skilled in the art that modifications and adaptations may be made to the semiconductor package without departing from the scope of the present invention.

[0053] The discussion herein includes a number of illustrative drawings showing an optical sensor package and a method for forming an optical sensor package. For clarity of illustration, such drawings do not show all aspects of each example semiconductor package. Any of the example optical sensor packages provided herein may share any or all characteristics with any or all other optical sensor packages provided herein.

[0054] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be appreciated that various modifications and variations may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the appended claims. In addition, other embodiments will be apparent to those skilled in the art by consideration of the specification and practice of one or more embodiments of the invention disclosed herein. Therefore, it is intended that the present application and the examples herein be considered merely exemplary, with the true scope and spirit of the invention being indicated by the list of the appended exemplary claims.

Claims

1. An optical sensor package, characterized in that: The optical sensor package comprises: a base substrate having a window therethrough; a first optical sensor mounted on the front surface of the base substrate, wherein a light receiving surface of the first optical sensor faces toward and is aligned with the window of the base substrate; a first light-transmitting sealing molding covering the light-receiving surface of the first optical sensor, wherein the first light-transmitting sealing molding fills the window in the base substrate; a first sealant layer formed on the front surface of the base substrate and sealing the first optical sensor, wherein the first sealant layer includes an interlayer connector therethrough; an interposer mounted on the first sealant layer and electrically coupled to the base substrate via the interlayer connector of the first sealant layer; a second optical sensor mounted on the front surface of the interposer, wherein a light receiving surface of the second optical sensor faces away from the interposer; a second light-transmitting sealing molding covering the light receiving surface of the second optical sensor; and A second sealant layer is formed on the front surface of the interposer to seal the second optical sensor.

2. The optical sensor package according to claim 1, characterized in that: Further including: At least one electronic component is mounted on the front surface of the base substrate, wherein the at least one electronic component is electrically coupled to the first optical sensor and the second optical sensor.

3. The optical sensor package according to claim 1, wherein the first optical sensor includes a group of conductive patterns other than its light receiving surface, and the group of conductive patterns is electrically coupled to the base substrate via a group of solder bumps between the first optical sensor and the base substrate.

4. The optical sensor package according to claim 1, characterized in that: The first light-transmitting sealing molding has a front surface substantially flush with a rear surface of the base substrate.

5. The optical sensor package according to claim 1, characterized in that: The interlayer connector includes a metal column.

6. The optical sensor package according to claim 1, characterized in that: The second optical sensor includes a set of conductive patterns except for a light receiving surface thereof, and the set of conductive patterns is electrically coupled to the interposer via a set of bonding wires.

7. A method for forming an optical sensor package, characterized in that: The method comprises: providing a base substrate; forming a window through the base substrate; providing a first optical sensor having a light receiving surface covered by a first light-transmitting sealing molding and a second optical sensor having a light receiving surface covered by a second light-transmitting sealing molding; mounting the first optical sensor on the front surface of the base substrate, wherein the first light-transmitting sealing molding fills the window of the base substrate; forming an interlayer connector on the front surface of the base substrate; forming a first sealant layer on the front surface of the base substrate to seal the first optical sensor and the interlayer connector, wherein the interlayer connector passes through the first sealant layer; mounting an interposer on the interlayer connector to electrically couple the interposer to the base substrate; mounting the second optical sensor on the front surface of the interposer, wherein the light receiving surface of the second optical sensor and the second light-transmitting sealing molding face away from the interposer; and A second sealant layer is formed on the front surface of the interposer to seal the second optical sensor.

8. The method according to claim 7, characterized in that Forming a window through the base substrate includes: attaching the rear surface of the base substrate to a carrier; and The base substrate is etched to form the window.

9. The method according to claim 7, characterized in that: Before forming the first sealant layer on the front surface of the base substrate, the method further includes: At least one electronic component is mounted on the front surface of the base substrate, wherein the at least one electronic component is electrically coupled to the first optical sensor and the second optical sensor.

10. The method according to claim 7, characterized in that The first optical sensor includes a set of conductive patterns except for a light receiving surface thereof, and the set of conductive patterns is electrically coupled to the base substrate via a set of solder bumps between the first optical sensor and the base substrate.

11. The method according to claim 7, characterized in that The first light-transmitting sealing molding has a front surface substantially flush with the rear surface of the base substrate.

12. The method according to claim 7, characterized in that The interlayer connector includes a metal column.

13. The method according to claim 7, characterized in that The second optical sensor includes a set of conductive patterns other than a light receiving surface thereof, and the method further includes: A set of bonding wires is formed on the front surface of the interposer to electrically couple the set of conductive patterns of the second optical sensor to the interposer.

14. The method according to claim 7, characterized in that The formation of the first sealant layer and the second sealant layer is performed in a single sealing process.

15. A method for forming an optical sensor package, characterized in that: include: providing a base substrate; forming a window through the base substrate; providing a first optical sensor having a light receiving surface covered by a first light-transmitting sealing molding and a second optical sensor having a light receiving surface covered by a second light-transmitting sealing molding; mounting the first optical sensor on the front surface of the base substrate, wherein the first light-transmitting sealing molding fills the window of the base substrate; forming an interlayer connector on the front surface of the base substrate; forming a first sealant layer on the front surface of the base substrate to seal the first optical sensor and the interlayer connector, wherein the interlayer connector passes through the first sealant layer; Provide an intermediary layer; mounting the second optical sensor on the front surface of the interposer, wherein the light receiving surface of the second optical sensor and the second light-transmissive sealing molding face away from the interposer; forming a second sealant layer on the front surface of the interposer to seal the second optical sensor; as well as The interposer is attached to the first encapsulant layer to electrically couple the interposer with the base substrate via the interlayer connector.

16. The method according to claim 15, characterized in that Forming the window through the base substrate includes: attaching the rear surface of the base substrate to a carrier; and The base substrate is etched to form the window.

17. The method according to claim 15, characterized in that The first optical sensor includes a set of conductive patterns except for a light receiving surface thereof, and the set of conductive patterns is electrically coupled to the base substrate via a set of solder bumps between the first optical sensor and the base substrate.

18. The method according to claim 15, characterized in that The first light-transmitting sealing molding has a front surface substantially flush with the rear surface of the base substrate.

19. The method according to claim 15, characterized in that The second optical sensor includes a set of conductive patterns other than a light receiving surface thereof, and the method further includes: A set of bonding wires is formed on the front surface of the interposer to electrically couple the set of conductive patterns of the second optical sensor to the interposer.

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