Constant-temperature measurement and control device and method for optical module

Abstract

The invention relates to the field of optical modules in optical communication, in particular to a constant-temperature measurement and control device and method for an optical module, and the device comprises a body unit, the body unit comprises a bracket, the top of the bracket is fixedly provided with a PCB through a screw, the top of the PCB is provided with a cooling fin, and the top of the cooling fin is connected with a measurement and control unit; the measurement and control unit comprises a heat insulation plate and a heat conduction plate, the heat insulation plate is fixedly connected with the cooling fins through screws, the heat conduction plate penetrates into the heat insulation plate through the screws to be fixed to the cooling fins, and an adjusting rod is locked on the PCB through threads. A sensor and a guide sleeve are inserted into the cooling fins, the heat insulation plate and the heat conduction plate. According to the invention, heat dissipation is carried out on the measured and controlled product through the heat dissipation unit, the temperature of the measured and controlled product is detected through the sensor, and temperature compensation can be carried out on the measured and controlled product in time through the semiconductor cooler, so that heat dissipation and temperature compensation can be carried out on the measured and controlled product while temperature detection is carried out on the measured and controlled product; therefore, the service life of the optical module is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules in optical communications, and in particular to a constant temperature measurement and control device and method for an optical module. Background Art

[0002] An optical module is composed of optoelectronic devices, functional circuits and optical interfaces. Optoelectronic devices include two parts: transmitting and receiving. Simply put, the function of an optical module is to convert electrical signals into optical signals at the transmitting end, and then convert the optical signals into electrical signals at the receiving end after being transmitted through optical fibers.

[0003] In the field of optical communications, optical modules are one of the most important products in optical / electrical information conversion processing. With the rise of digital economy, data centers, artificial intelligence and other industries, the transmission rate requirements for optical modules are getting higher and higher. The higher the optical power, the more heat it generates. In order to extend the service life of the optical module, its temperature needs to be measured and controlled.

[0004] However, most of the existing optical modules have uneven heat dissipation, and the temperature of the optical modules is rarely detected, resulting in a shortened service life of many optical modules. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a constant temperature measurement and control device and method for an optical module.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A constant temperature measurement and control device and method for an optical module, comprising a main body unit, wherein the main body unit comprises a bracket, a PCB board is fixed to the top of the bracket by screws, a heat sink is installed on the top of the PCB board, and the top of the heat sink is connected to the measurement and control unit;

[0008] The measurement and control unit includes a heat insulation plate and a heat conduction plate, the heat insulation plate is fixedly connected to the heat sink by screws, the heat conduction plate is fixed to the heat sink by screws inserted into the heat insulation plate, and an adjustment rod is locked on the PCB board by threads;

[0009] The heat sink, heat insulation plate and heat conducting plate are provided with sensors and guide sleeves. The heat conducting plate is provided with a groove in which a semiconductor refrigerator is installed. The upper and lower surfaces of the semiconductor refrigerator are respectively attached to the lower surface of the heat conducting plate and the upper surface of the PCB board.

[0010] In addition, the preferred structure is that a small compression spring is inserted into the adjusting rod, and the two ends of the small compression spring are respectively fitted with the bottom end of the sensor and the step of the adjusting rod, and the two end surfaces of the guide sleeve are respectively close to the bottom surface of the heat conducting plate and the upper surface of the PCB board.

[0011] In addition, a preferred structure is that the small shaft of the sensor passes through the hole of the heat conducting plate, the upper end surface of the large shaft of the sensor fits with the lower end surface of the heat conducting plate, and the threaded pair of the adjusting rod can adjust the tightness of the small compression spring.

[0012] In addition, a preferred structure is that a guide plate is fixedly connected to one side of the top of the heat sink by screws, a lock buckle is provided on one side of the heat sink, a hole is opened on the lock buckle, a rotating pin is passed through the hole on the lock buckle, and the rotating pin is fixedly connected to the heat sink.

[0013] In addition, a preferred structure is that a tension spring screw is fixedly installed on one side of the heat sink by means of screws, a tension spring is fixedly connected between the tension spring screw and the lock buckle, and the lock buckle can rotate around the rotating pin.

[0014] In addition, a preferred structure is that heat dissipation units are connected to both sides of the top of the PCB board, the heat dissipation unit includes a wind hood, the wind hood is fixedly connected to the PCB board by screws, a hinge is fixedly connected to the wind hood by screws, one end of the hinge is connected to a heat dissipation base, one side of the heat dissipation base is fixedly connected to a handle by screws, and a heat dissipation component is fixedly installed on the bottom of the heat dissipation base by a guide rod, and one side of the wind hood is fixedly connected to a fan by screws.

[0015] In addition, a preferred structure is that the top of the heat dissipation assembly is a fixed base, a guide rod is installed with a compression spring at the bottom of the fixed base, and a small heat sink is connected to the bottom of the fixed base, a waist-shaped hole is opened between the small heat sink and the side of the fixed base, and a connecting pin is inserted into the waist-shaped hole, and the connecting pin can move up and down in the waist-shaped hole under the action of the compression spring.

[0016] In addition, a preferred structure is that one end of the heat conducting plate is fixedly connected to a transfer PCB board by screws, a connector A is provided at the top of one side of the transfer PCB board, and a connector B is provided at the top of the other side of the transfer PCB board.

[0017] In addition, a preferred structure is that the product to be measured and controlled is fixedly mounted on the top of the measurement and control unit, and the top of the product to be measured and controlled is attached to a small heat sink.

[0018] The beneficial effects of the present invention are as follows: the heat is dissipated for the measured and controlled product through the heat dissipation unit, and the temperature of the measured and controlled product is detected through the sensor, and the temperature of the measured product can be compensated in time through the semiconductor cooler, so that the measured product can be dissipated and temperature compensated while the temperature of the measured and controlled product is detected, thereby increasing the service life of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a general assembly diagram of a constant temperature measurement and control device and method for an optical module proposed by the present invention;

[0020] Figure 2 An axonometric diagram of a main body unit proposed by the present invention;

[0021] Figure 3 An axonometric diagram of a heat dissipation unit proposed by the present invention;

[0022] Figure 4 An axonometric diagram of a heat dissipation assembly proposed by the present invention;

[0023] Figure 5 An axonometric diagram of a fan proposed by the present invention;

[0024] Figure 6 An axonometric diagram of a measurement and control unit proposed by the present invention;

[0025] Figure 7 This is an axonometric view of the reverse side of the measurement and control unit proposed by the present invention.

[0026] In the figure: 1 main unit, 101 bracket, 102 PCB board, 103 heat sink, 104 transmission pin, 105 tension spring, 106 tension spring screw, 107 lock, 108 guide plate, 2 heat dissipation unit, 201 wind cover, 202 hinge, 203 heat dissipation base, 204 handle, 205 heat dissipation component, 2051 fixed base, 2052 guide rod, 2053 compression spring, 2054 small heat sink, 2055 connecting pin, 206 fan, 3 measurement and control unit, 301 heat insulation board, 302 heat conduction board, 303 connector A, 304 adapter PCB board, 305 connector B, 306 guide sleeve, 307 adjustment rod, 308 sensor, 309 semiconductor refrigerator, 4 measured and controlled products. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] Reference Figure 1-7 A constant temperature measurement and control device and method for an optical module, comprising a main body unit 1, the main body unit 1 comprising a bracket 101, a PCB board 102 is fixed to the top of the bracket 101 by screws, a heat sink 103 is installed on the top of the PCB board 102, and a measurement and control unit 3 is connected to the top of the heat sink 103;

[0029] The measurement and control unit 3 includes a heat insulation plate 301 and a heat conducting plate 302. The heat insulation plate 301 is fixedly connected to the heat sink 103 by screws. The heat conducting plate 302 is fixed to the heat sink 103 by screws inserted into the heat insulation plate 301. An adjusting rod 307 is screwed on the PCB board 102.

[0030] A sensor 308 and a guide sleeve 306 are inserted into the heat sink 103, the heat insulation plate 301, and the heat conducting plate 302. A groove is opened on the heat conducting plate 302, and a semiconductor cooler 309 is installed in the groove. The upper and lower surfaces of the semiconductor cooler 309 are respectively attached to the lower surface of the heat conducting plate 302 and the upper surface of the PCB board 102.

[0031] Among them, a small compression spring is inserted into the adjustment rod 307, and the two ends of the small compression spring are respectively in contact with the bottom end of the sensor 308 and the step of the adjustment rod 307, and the two end surfaces of the guide sleeve 306 are respectively close to the bottom surface of the heat conducting plate 302 and the upper surface of the PCB board 102.

[0032] At the same time, the small shaft of the sensor 308 passes through the hole of the heat conducting plate 302, the upper end surface of the large shaft of the sensor 308 fits with the lower end surface of the heat conducting plate 302, and the threaded pair of the adjusting rod 307 can adjust the tightness of the small compression spring.

[0033] At the same time, a guide plate 108 is fixedly connected to one side of the top of the heat sink 103 by screws, and a lock buckle 107 is provided on one side of the heat sink 103. A hole is opened on the lock buckle 107, and a rotating pin 104 is passed through the hole on the lock buckle 107. The rotating pin 104 is fixedly connected to the heat sink 103, and the lock buckle 107 can be used for fixing.

[0034] In addition, a tension spring screw 106 is fixedly installed on one side of the heat sink 103 by means of screws, a tension spring 105 is fixedly connected between the tension spring screw 106 and the lock buckle 107 , and the lock buckle 107 can rotate around the rotating pin 104 .

[0035] In addition, heat dissipation units 2 are connected to both sides of the top of the PCB board 102, and the heat dissipation unit 2 includes a hood 201, which is fixedly connected to the PCB board 102 by screws, and a hinge 202 is fixedly connected to the hood 201 by screws, one end of the hinge 202 is connected to a heat dissipation base 203, one side of the heat dissipation base 203 is fixedly connected to a handle 204 by screws, and a heat dissipation component 205 is fixedly installed on the bottom of the heat dissipation base 203 through a guide rod 2052, and a fan 206 is fixedly connected to one side of the hood 201 by screws, and the fan 206 is conducive to discharging heat from the heat dissipation unit 3.

[0036] Moreover, the top of the heat dissipation component 205 is a fixed base 2051, and the guide rod 2052 is equipped with a compression spring 2053 at the bottom of the fixed base 2051, and the bottom of the fixed base 2051 is connected to a small heat sink 2054, and the small heat sink 2054 and the side of the fixed base 2051 are provided with a waist-shaped hole, and a connecting pin 2055 is inserted into the waist-shaped hole, and the connecting pin 2055 can move up and down in the waist-shaped hole under the action of the compression spring 2053, and the small heat sink 2054 can dissipate heat for the measured and controlled product 4.

[0037] In addition, one end of the heat conducting plate 302 is fixedly connected to the adapter PCB board 304 by screws, a connector A303 is arranged at the top of one side of the adapter PCB board 304, and a connector B304 is arranged at the top of the other side of the adapter PCB board 304.

[0038] At the same time, the measured and controlled product 4 is fixedly installed on the top of the measurement and control unit 3, and the top of the measured and controlled product 4 is attached to the small heat sink 2054.

[0039] In this embodiment, the entire device is first powered on, and then the handle 204 in the heat dissipation unit 2 is manually grasped to rotate the heat dissipation component 205 to a certain angle through the hinge 202. Then, the product 4 to be measured and controlled is manually grasped and inserted into the connector A303 in the measurement and control unit 3 along the guide plate 108. At this time, the top of the sensor 308 in the measurement and control unit 3 and the measured and controlled area of ​​the bottom edge of the measured and controlled product 4 are tightly fitted under the action of the small compression spring in the guide sleeve 306.

[0040] At this time, by manually holding the handle 204 in the heat dissipation unit 2, and then using the handle 204 to press down the heat dissipation component 205, under the action of the compression spring 2053 in the heat dissipation unit 2, the small heat sink 2054 is tightly fitted to the upper surface of the measured and controlled product 4.

[0041] At this time, manually turn the lock 107 in the main unit 1 to lock the heat dissipation base 203 and the measured and controlled product 4. At this time, start the fan 206 to complete the heat dissipation of the measured and controlled product 4. At the same time, the sensor 308 can measure the temperature of the measured and controlled product 4. When there is an error between the temperature measured by the sensor 308 and the set value, the semiconductor cooler 309 in the measurement and control unit 3 starts working to complete the temperature compensation of the measured product 4, so that the temperature measurement and control of the entire measured product 4 is completed.

[0042] In the present invention, the heat dissipation of the measured and controlled product 4 is performed by the heat dissipation unit 3, and the temperature of the measured and controlled product 4 is detected by the sensor 308, and the temperature of the measured product 4 can be compensated in time by the semiconductor cooler 309, so that the measured product 4 can be dissipated and temperature compensated while the temperature of the measured and controlled product 4 is detected, thereby improving the service life of the optical module.

[0043] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A constant temperature measurement and control device and method for an optical module, comprising a main unit (1), characterized in that: The main body unit (1) comprises a bracket (101), a PCB board (102) is fixed to the top of the bracket (101) by screws, a heat sink (103) is installed on the top of the PCB board (102), and a measurement and control unit (3) is connected to the top of the heat sink (103); The measurement and control unit (3) comprises a heat insulation plate (301) and a heat conducting plate (302); the heat insulation plate (301) is fixedly connected to the heat sink (103) by means of screws; the heat conducting plate (302) is fixed to the heat sink (103) by means of screws inserted into the heat insulation plate (301); and an adjustment rod (307) is screw-locked on the PCB board (102); The heat sink (103), the heat insulation plate (301), and the heat conducting plate (302) are provided with a sensor (308) and a guide sleeve (306); the heat conducting plate (302) is provided with a groove, a semiconductor cooler (309) is installed in the groove, and the upper and lower surfaces of the semiconductor cooler (309) are respectively attached to the lower surface of the heat conducting plate (302) and the upper surface of the PCB board (102).

2. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: A small compression spring is inserted into the adjusting rod (307), and the two ends of the small compression spring are respectively in contact with the bottom end of the sensor (308) and the step of the adjusting rod (307), and the two end surfaces of the guide sleeve (306) are respectively in contact with the bottom surface of the heat conducting plate (302) and the upper surface of the PCB board (102).

3. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: The small shaft of the sensor (308) passes through the hole of the heat conducting plate (302), the upper end surface of the large shaft of the sensor (308) fits with the lower end surface of the heat conducting plate (302), and the threaded pair of the adjusting rod (307) can adjust the tightness of the small compression spring.

4. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: A guide plate (108) is fixedly connected to one side of the top of the heat sink (103) by means of screws, a lock buckle (107) is provided on one side of the heat sink (103), a hole is provided on the lock buckle (107), a rotating pin (104) is passed through the hole on the lock buckle (107), and the rotating pin (104) is fixedly connected to the heat sink (103).

5. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: A tension spring screw (106) is fixedly mounted on one side of the heat sink (103) by means of screws, a tension spring (105) is fixedly connected between the tension spring screw (106) and the lock buckle (107), and the lock buckle (107) can rotate around the rotating pin (104).

6. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: The top two sides of the PCB board (102) are connected to a heat dissipation unit (2), the heat dissipation unit (2) comprising a fan (201), the fan (201) being fixedly connected to the PCB board (102) by means of screws, a hinge (202) being fixedly connected to the fan (201) by means of screws, one end of the hinge (202) being connected to a heat dissipation base (203), one side of the heat dissipation base (203) being fixedly connected to a handle (204) by means of screws, a heat dissipation assembly (205) being fixedly mounted on the bottom of the heat dissipation base (203) by means of a guide rod (2052), and one side of the fan (201) being fixedly connected to a fan (206) by means of screws.

7. The constant temperature measurement and control device and method of an optical module according to claim 6, characterized in that: The top of the heat dissipation component (205) is a fixed base (2051), a guide rod (2052) is installed with a compression spring (2053) at the bottom of the fixed base (2051), and a small heat sink (2054) is connected to the bottom of the fixed base (2051), and waist-shaped holes are opened on the sides of the small heat sink (2054) and the fixed base (2051), and a connecting pin (2055) is inserted into the waist-shaped hole, and the connecting pin (2055) can move up and down in the waist-shaped hole under the action of the compression spring (2053).

8. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: One end of the heat conducting plate (302) is fixedly connected to a transfer PCB board (304) by means of screws, a connector A (303) is arranged at the top end of one side of the transfer PCB board (304), and a connector B (304) is arranged at the top end of the other side of the transfer PCB board (304).

9. The constant temperature measurement and control device and method of an optical module according to claim 1, characterized in that: The top of the measurement and control unit (3) is fixedly mounted with a product to be measured and controlled (4), and the top of the product to be measured and controlled (4) is attached to a small heat sink (2054).

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