Design method of circuit board die punching explosion-proof hole

Abstract

The invention discloses a circuit board punching explosion-proof hole design method, which comprises the following steps of: designing explosion-proof holes according to the thickness of a circuit board, and adding the explosion-proof holes when the thickness of the circuit board is more than 1.6 mm and less than 2.0 mm and the distance between an inner groove edge or a forming edge and a nearest conductor is less than 1.3 mm; when the plate thickness is greater than 1.2 mm and less than or equal to 1.6 mm and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.0 mm, an explosion-proof hole is added; when the plate thickness is smaller than or equal to 1.2 mm and the distance between the inner groove edge or the forming edge and the nearest conductor is smaller than 0.8 mm, an explosion-proof hole is added; and forming a plurality of circular auxiliary holes in the explosion-proof hole, and punching to form the explosion-proof hole. According to the circuit board die punching explosion-proof hole design method provided by the invention, by optimizing the design and manufacturing process of the explosion-proof hole, the problem of cracking during die punching of the circuit board can be effectively solved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a method for designing a circuit board die-punching explosion-proof hole. Background Art

[0002] After the solder mask and text printing process, the entire PCB needs to be cut into pieces to obtain the size and shape of the circuit board required by the customer. In the PCB manufacturing process, the forming methods are mainly divided into two methods: CNC forming and die punching. Die punching cannot effectively reduce the force of the die punching during punching, which can easily cause board damage; and the waste material punched out of the die can easily damage the die, and the waste material is not easy to remove, the mold has a short service life, and the production efficiency is low when the machine is stopped to remove the waste material.

[0003] In view of this, it is necessary to provide a new process to solve the above technical problems. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for designing explosion-proof holes in circuit board die punching, which can effectively solve the problems of board damage and other problems that occur during circuit board die punching by optimizing the design and manufacturing process of the explosion-proof holes.

[0005] The technical solution of the present invention is as follows:

[0006] A method for designing a circuit board die-punched explosion-proof hole comprises the following steps:

[0007] Step S1, designing explosion-proof holes according to the thickness of the circuit board, wherein:

[0008] When 1.6mm<plate thickness<2.0mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.3mm, add explosion-proof holes;

[0009] When the plate thickness is 1.2mm<1.6mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.0mm, an explosion-proof hole should be added;

[0010] When the plate thickness is ≤1.2mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is <0.8mm, an explosion-proof hole should be added;

[0011] Step S2, punching out a plurality of circular auxiliary holes in the explosion-proof hole, and then performing die punching to punch out the explosion-proof hole.

[0012] Furthermore, when the explosion-proof hole is a long strip slot hole, the aperture of the auxiliary hole = slot width - 0.2 mm, and the distance between the hole wall of the auxiliary hole and the hole wall of the slot hole is 0.1-0.2 mm.

[0013] Furthermore, the auxiliary holes cover the slot holes, and the hole wall spacing of the auxiliary holes is 5-10 mil.

[0014] Furthermore, the diameter of the auxiliary hole is 1.5-1.6 mm.

[0015] Furthermore, when the explosion-proof hole is a circular slot, the auxiliary holes are distributed along the inner wall of the circular slot, and the distance between the hole wall of the auxiliary hole and the hole wall of the slot is 0.1-0.2mm, the distance between the hole walls of the auxiliary holes is 5-10mil, and the aperture of the auxiliary holes is 1.5-1.6mm.

[0016] Compared with the prior art, the circuit board die punching explosion-proof hole design method provided by the present invention has the following beneficial effects:

[0017] The method for designing explosion-proof holes for die punching of circuit boards provided by the present invention can effectively reduce the stress caused by the heavy pressure of die punching by optimizing the design and manufacturing process of the explosion-proof holes, thereby solving the problem of board damage caused by the stress problem; by designing the explosion-proof holes, waste materials after die punching are not easy to get stuck in the mold, and the waste materials can be easily removed, thereby increasing the service life of the mold; and there is no need to stop the machine to remove the waste materials, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of an implementation method of the explosion-proof hole in the circuit board die-punching explosion-proof hole design method of the present invention;

[0020] Figure 2 It is a schematic diagram of another implementation of the explosion-proof hole in the circuit board die-punching explosion-proof hole design method of the present invention. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific implementation modes of the present invention are further described below.

[0022] It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as there is no conflict between them.

[0023] A method for designing a circuit board die-punched explosion-proof hole comprises the following steps:

[0024] Step S1, designing explosion-proof holes according to the thickness of the circuit board, wherein:

[0025] When 1.6mm<plate thickness<2.0mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.3mm, add explosion-proof holes;

[0026] When the plate thickness is 1.2mm<1.6mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.0mm, an explosion-proof hole should be added;

[0027] When the plate thickness is ≤1.2mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is <0.8mm, an explosion-proof hole should be added;

[0028] The explosion-proof hole is located in the center of the die-punched slot and is designed according to the shape of the die-punched slot. When the die-punched slot is a long slot, the explosion-proof hole is designed to be strip-shaped, and when the die-punched slot is a circle, the explosion-proof hole is designed to be a circle. The diameter / slot width of the explosion-proof hole is ≥1.1445mm.

[0029] It should be noted that when the board thickness is ≥2.0mm, the circuit board adopts the gong plate process instead of the die punching process.

[0030] Step S2, punching out a plurality of circular auxiliary holes in the explosion-proof hole, and then performing die punching to punch out the explosion-proof hole.

[0031] like Figure 1 As shown, when the explosion-proof hole is a long strip slot, the diameter of the auxiliary hole = slot width - 0.2mm, the distance between the hole wall of the auxiliary hole and the hole wall of the slot is 0.1-0.2mm; the auxiliary holes cover the slot, and the distance between the hole walls of the auxiliary holes is 5-10mil. In this embodiment, the diameter of the auxiliary hole is 1.5-1.6mm, the distance between the hole wall of the auxiliary hole and the hole wall of the slot is 0.1mm, and the distance between the hole walls of the auxiliary holes is 0.15mm.

[0032] like Figure 2 As shown, when the explosion-proof hole is a circular slot, the auxiliary holes are distributed along the inner wall of the circular slot, and the distance between the hole wall of the auxiliary hole and the hole wall of the slot is 0.1-0.2mm, the distance between the hole walls of the auxiliary holes is 5-10mil, and the diameter of the auxiliary holes is 1.5-1.6mm. In this embodiment, the distance between the hole wall of the auxiliary hole and the hole wall of the slot is 0.1445mm, the distance between the hole walls of the auxiliary holes is 0.1471mm, and the diameter of the auxiliary holes is 1.55mm.

[0033] The method for designing explosion-proof holes for die punching of circuit boards provided by the present invention can effectively reduce the stress caused by the heavy pressure of die punching by optimizing the design and manufacturing process of the explosion-proof holes, thereby solving the problem of board damage caused by the stress problem; by designing the explosion-proof holes, waste materials after die punching are not easy to get stuck in the mold, and the waste materials can be easily removed, thereby increasing the service life of the mold.

[0034] The embodiments of the present invention are described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principles and spirit of the present invention are still within the protection scope of the present invention.

Claims

1. A method for designing a circuit board die-punched explosion-proof hole, characterized in that: The steps include: Step S1, designing explosion-proof holes according to the thickness of the circuit board, wherein: When 1.6mm<plate thickness<2.0mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.3mm, add explosion-proof holes; When the plate thickness is 1.2mm<1.6mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is less than 1.0mm, an explosion-proof hole should be added; When the plate thickness is ≤1.2mm, and the distance between the inner groove edge or the forming edge and the nearest conductor is <0.8mm, an explosion-proof hole should be added; Step S2, punching out a plurality of circular auxiliary holes in the explosion-proof hole, and then performing die punching to punch out the explosion-proof hole.

2. The method for designing a circuit board die-punched explosion-proof hole according to claim 1, characterized in that: When the explosion-proof hole is a long strip slot hole, the aperture of the auxiliary hole = slot width - 0.2 mm, and the distance between the hole wall of the auxiliary hole and the hole wall of the slot hole is 0.1-0.2 mm.

3. The method for designing a circuit board die-punched explosion-proof hole according to claim 2, characterized in that: The auxiliary holes fill the slots, and the hole wall spacing of the auxiliary holes is 5-10 mil.

4. The method for designing a circuit board die-punched explosion-proof hole according to claim 2, characterized in that: The diameter of the auxiliary hole is 1.5-1.6mm.

5. The method for designing a circuit board die-punched explosion-proof hole according to claim 1, characterized in that: When the explosion-proof hole is a circular slot, the auxiliary holes are distributed along the inner wall of the circular slot, and the distance between the hole wall of the auxiliary hole and the hole wall of the slot is 0.1-0.2mm, the distance between the hole walls of the auxiliary holes is 5-10mil, and the aperture of the auxiliary holes is 1.5-1.6mm.

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