Solar cell and preparation method thereof

Abstract

The embodiment of the invention provides a solar cell and a preparation method, the solar cell comprises a first substrate, a first transparent conductive layer, a monomolecular layer, a light absorption layer, a passivation layer, an electron transport layer, a hole blocking layer and an electrode layer, the monomolecular layer is formed by depositing a target co-solution, the target co-solution comprises a self-assembly monomolecule and a co-solvent, and the light absorption layer is formed on the first substrate. The cosolvent is prepared from isopropyl alcohol and N, N-dimethyl formamide. By adopting the embodiment of the invention, the critical micelle concentration of the self-assembled single molecule in the solvent can be improved to be higher than the processing concentration, so that the critical micelle gel threshold of the self-assembled single molecule in the co-solution is improved, self-assembled single molecule gel is effectively avoided, NiOx does not need to be introduced, the stability of the solar cell is improved, and the service life of the solar cell is prolonged. And the power generation efficiency of the solar cell is improved.

Description

Technical Field

[0001] The present application belongs to the field of battery technology, and specifically relates to a solar cell and a preparation method thereof. Background Art

[0002] After self-assembly, the SAM self-assembled monomolecular material will expose the hydrophobic group, making it difficult to evenly apply the perovskite precursor ink. At present, the SAM material is mainly combined by introducing the inorganic hole transport material NiOx, and the SAM material is only used to further modify the defect state on the NiOx surface. However, the trivalent nickel cations in NiOx and the iodine ions in the perovskite component undergo redox reactions, and are easily affected by ultraviolet light in the sun to accelerate the reaction, seriously affecting the long-term stability and power generation efficiency of the device. In addition, SAM molecules tend to self-assemble to form micelle structures in commonly used alcohol processing solvents, with their head groups facing inward and anchoring groups facing outward. This aggregation structure introduces additional energy barriers during the growth of SAM molecules on metal oxide substrates, limiting the formation of dense and neatly arranged monolayers of SAM molecules on the substrate. Summary of the invention

[0003] The embodiments of the present application provide a solar cell and a preparation method, which can increase the critical micelle concentration of self-assembled single molecules in a solvent to above the processing concentration, thereby increasing the critical micelle gel threshold of the self-assembled single molecules in a co-solution and effectively avoiding the self-assembled single molecule gel.

[0004] In a first aspect, an embodiment of the present application provides a solar cell, the solar cell comprising:

[0005] a first substrate;

[0006] a first transparent conductive layer, wherein the first transparent conductive layer is disposed on an upper surface of the first substrate;

[0007] A monomolecular layer, wherein the monomolecular layer is disposed on the upper surface of the first transparent conductive layer; the monomolecular layer is formed by depositing a target co-solution, wherein the target co-solvent comprises a self-assembled monomolecule and a co-solvent, and wherein the co-solvent comprises isopropyl alcohol and N,N-dimethylformamide;

[0008] a light absorbing layer, wherein the light absorbing layer is disposed on an upper surface of the first transparent conductive layer;

[0009] A passivation layer, the passivation layer being disposed on an upper surface of the light absorbing layer;

[0010] An electron transport layer, wherein the electron transport layer is disposed on an upper surface of the passivation layer;

[0011] A hole blocking layer, the hole blocking layer being arranged on the upper surface of the electron transport layer;

[0012] An electrode layer is disposed on the upper surface of the hole blocking layer.

[0013] In a possible example, the solar cell further includes a packaging adhesive film, a second transparent conductive layer, a second substrate and butyl adhesive;

[0014] The packaging film is arranged on the upper surface of the electrode layer, the second transparent conductive layer is arranged on the upper surface of the packaging film, and the second substrate is arranged on the upper surface of the second transparent conductive layer;

[0015] The butyl rubber is used for sealing the solar cell.

[0016] In a possible example, a protrusion of a target shape is formed on the upper surface of the first substrate;

[0017] A protrusion of a target shape is formed on the lower surface of the second substrate.

[0018] In one possible example, the ratio of isopropyl alcohol to N,N-dimethylformamide ranges from 50:1 to 100:3.

[0019] In a possible example, the material of the first transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO;

[0020] The material of the second transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO;

[0021] The material of the self-assembled monomolecule includes at least one of the following: [2-(3,6-dimethoxy-9H-carbazole-9-yl)phenethyl]acetic acid, [2-(9H-carbazole-9-yl)phenethyl]acetic acid, [4-(9H-carbazole-9-yl)butyl]acetic acid, [4-(3,6-dimethyl-9H-carbazole-9-yl)butyl]acetic acid and [4-(7H-dibenzocarbazole-7-yl)butyl]acetic acid;

[0022] The material of the hole blocking layer is SnO2; the material of the passivation layer is PEAI;

[0023] The material of the electron transport layer includes at least one of the following: C60, PCBM and ICBA.

[0024] In a possible example, the thickness range of the first transparent conductive layer is 300nm-600nm, the thickness range of the light absorption layer is 1-5um, the thickness range of the electron transport layer is 5-20nm, the thickness range of the hole blocking layer is 5-50nm, and the thickness range of the second transparent conductive layer is 200nm-400nm.

[0025] In a second aspect, an embodiment of the present application provides a method for preparing a solar cell, comprising:

[0026] Plating a first transparent conductive layer on the upper surface of the first substrate;

[0027] Depositing a target co-solution on the upper surface of the first transparent conductive layer, heating the target co-solution to 80° C.-95° C. for 7 min-15 min to form a monolayer, wherein the target co-solvent comprises a co-solvent and a self-assembled monomolecule, and the co-solvent comprises isopropyl alcohol and N,N-dimethylformamide;

[0028] Coating a light absorbing layer on the upper surface of the monolayer and placing it at 90° C. to 120° C. for 15 min to 45 min;

[0029] A passivation layer is coated on the upper surface of the light absorbing layer and placed at 85° C.-110° C. for 15 min-30 min;

[0030] Plating an electron transport layer on the upper surface of the passivation layer by evaporation;

[0031] Plating a hole blocking layer on the upper surface of the electron transport layer by magnetron sputtering;

[0032] Plating an electrode layer on the upper surface of the hole blocking layer by magnetron sputtering;

[0033] Plating a second transparent conductive layer on the lower surface of the second substrate;

[0034] The first substrate and the second substrate are packaged.

[0035] In a possible example, after heating the target co-solution to 80° C.-95° C. for 7 min-15 min to form a monolayer, the method further includes:

[0036] The monolayer was washed with RO water to remove the free self-assembled monomolecules.

[0037] In a possible example, after the hole blocking layer is plated on the upper surface of the electron transport layer by magnetron sputtering, the method further includes:

[0038] A picosecond laser is used to scribe the first film layer currently on the first substrate, so as to divide the first film layer into a plurality of first battery regions.

[0039] In a possible example, after plating the electrode layer on the upper surface of the hole blocking layer by magnetron sputtering, the method further includes:

[0040] The second film layer currently on the first substrate is scribed using a picosecond laser to divide the second film layer into a plurality of second battery regions.

[0041] A third aspect of the present application provides an electronic device, comprising: a processor and a memory; and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the processor, and the programs include instructions for some or all of the steps described in the second aspect.

[0042] A fourth aspect of an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium is used to store a computer program, wherein the computer program enables a computer to execute instructions of some or all of the steps described in the second aspect of the embodiment of the present application.

[0043] A fifth aspect of the embodiments of the present application provides a computer program product, wherein the computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute some or all of the steps described in the second aspect of the embodiments of the present application. The computer program product may be a software installation package.

[0044] It can be seen that in the embodiments of the present application, the critical micelle concentration of the self-assembled single molecule in the solvent can be increased to above the processing concentration, thereby increasing the critical micelle gel threshold of the self-assembled single molecule in the co-solution, effectively avoiding the self-assembled single molecule gel, and there is no need to introduce NiOx, which is beneficial to improving the stability of the solar cell and the power generation efficiency of the solar cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 is a schematic structural diagram of a solar cell provided in an embodiment of the present application;

[0047] Figure 2 is a structural schematic diagram of a substrate provided in an embodiment of the present application;

[0048] Figure 3A is a schematic diagram of light transmission provided by an embodiment of the present application;

[0049] Figure 3Bis a schematic diagram of another light transmission provided in an embodiment of the present application;

[0050] Figure 4 It is a schematic diagram of a process for preparing a solar cell provided in an embodiment of the present application;

[0051] Figure 5A is a schematic diagram of a film layer provided in an embodiment of the present application;

[0052] Figure 5B is a schematic diagram of another film layer provided in an embodiment of the present application;

[0053] Figure 5C This is a schematic diagram of another film layer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0055] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0056] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0057] In the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B can represent the following three situations: A exists alone; A and B exist at the same time; B exists alone. Among them, A and B can be singular or plural.

[0058] In the embodiment of the present application, the symbol " / " can indicate that the objects associated with each other are in an "or" relationship. In addition, the symbol " / " can also indicate a division sign, that is, performing a division operation. For example, A / B can indicate A divided by B.

[0059] In the embodiments of the present application, "at least one item" or similar expressions refer to any combination of these items, including any combination of single items or plural items, and refer to one or more, and multiple refers to two or more. For example, at least one item of a, b, or c can represent the following seven situations: a, b, c, a and b, a and c, b and c, a, b, and c. Among them, each of a, b, and c can be an element or a set containing one or more elements.

[0060] In the embodiments of the present application, "equal to" can be used in conjunction with greater than, and is applicable to the technical solution adopted when greater than, and can also be used in conjunction with less than, and is applicable to the technical solution adopted when less than. When equal to is used in conjunction with greater than, it is not used in conjunction with less than; when equal to is used in conjunction with less than, it is not used in conjunction with greater than.

[0061] In order to better understand the solutions of the embodiments of the present application, the electronic devices, related concepts and backgrounds that may be involved in the embodiments of the present application are first introduced below.

[0062] The electronic device of the embodiment of the present application is a device with a wireless communication function, which can be called a terminal, a user equipment (UE), a mobile station (MS), a mobile terminal (MT), an access electronic device, a vehicle-mounted electronic device, an industrial control electronic device, a UE unit, a UE station, a mobile station, a remote station, a remote electronic device, a mobile device, a UE electronic device, a wireless communication device, a UE agent or a UE device, etc. The electronic device can be fixed or mobile. It should be noted that the electronic device can support at least one wireless communication technology, such as LTE, new radio (NR), wideband code division multiple access (WCDMA), etc. For example, the electronic device may be a mobile phone, a tablet computer, a desktop computer, a laptop computer, an all-in-one computer, a vehicle-mounted terminal, a virtual reality (VR) electronic device, an augmented reality (AR) electronic device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical surgery, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, a cellular phone, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), a handheld device with wireless communication function, a terminal device or other processing device connected to a wireless modem, a wearable device, an electronic device in a future mobile communication network, or an electronic device in a future evolving public land mobile network (PLMN), etc. The electronic device may also be a battery assembly preparation device.

[0063] See also Figure 1 , Figure 1 Schematic diagram of a solar cell structure provided by an embodiment of the present application. Figure 1As shown, the solar cell 1000 includes: a first substrate 10, a first transparent conductive layer 20, a monomolecular layer 30, a light absorption layer 40, a passivation layer 50, an electron transport layer 60, a hole blocking layer 70, an electrode layer 80, an encapsulation film 90, a second transparent conductive layer 100, a second substrate 110 and butyl rubber 120.

[0064] Among them, the first transparent conductive layer 20 is arranged on the upper surface of the first substrate 10, and the monomolecular layer 30 is arranged on the upper surface of the first transparent conductive layer 20; the monomolecular layer 30 is formed by depositing a target co-solution, the target co-solution includes a self-assembled monomolecule and a co-solvent, and the co-solvent includes isopropyl alcohol and N,N-dimethylformamide; the light absorption layer 40 is arranged on the upper surface of the first transparent conductive layer 20; the passivation layer 50 is arranged on the upper surface of the light absorption layer 40, the electron transport layer 60 is arranged on the upper surface of the passivation layer 50, the hole blocking layer 70 is arranged on the upper surface of the electron transport layer 60, and the electrode layer 80 is arranged on the upper surface of the hole blocking layer 70.

[0065] The materials of the first substrate 10 and the second substrate 110 can be glass, plastic, metal, etc., which are not limited here.

[0066] Among them, the packaging film 90 is arranged on the upper surface of the electrode layer, the second transparent conductive layer 100 is arranged on the upper surface of the packaging film, and the second substrate 110 is arranged on the upper surface of the second transparent conductive layer 100; the butyl rubber 120 is arranged on both sides of the solar cell 1000 to seal the solar cell 1000 and improve the water and oxygen barrier performance of the solar cell 1000.

[0067] Among them, the upper surface of the first substrate 10 forms a protrusion of the target shape; the lower surface of the second substrate 110 forms a protrusion of the target shape, and the protrusions are closely connected. The target shape can be a circle, an ellipse, a polygon, and other forms. This design method is used to increase the contact area between the substrate and the transparent conductive layer and improve the adhesion between the materials. The protrusions of the target shape are formed on the thick substrate through exposure, etching, and embossing processes. At the same time, a target-shaped protrusion is formed on the upper surface of the first substrate 10, which matches the material of the first transparent conductive layer and has a convergence effect on light, that is, the incident light will be converged after passing through the first substrate 10, which is beneficial to improving the irradiance of the incident light; a target-shaped protrusion is formed on the lower surface of the second substrate 110, which can reflect the light, so that the light to be emitted enters the light absorption layer 40 again after reflection to generate electricity, which is beneficial to improving the power generation and power generation efficiency of the solar cell; and a target-shaped protrusion is formed on the lower surface of the second substrate 110, so that the surface of the second transparent conductive layer 100 also forms a target-shaped protrusion, which can effectively increase the contact area between the encapsulation film 90 and the second transparent conductive layer 100, thereby improving the bonding effect and improving the stability of the solar cell.

[0068] See also Figure 2 , Figure 2 is a structural schematic diagram of a substrate provided in an embodiment of the present application, Figure 2 The first substrate and the circular protrusion on the first substrate are shown in FIG. The radius of the circular protrusion is r. Compared with the non-protrusion design of the substrate, the surface area of ​​the convex-concave structure (2πr 2 ) compared to the surface area of ​​non-convex and concave structures (πr 2 ) Increased surface area △S = πr 2 , the surface area is doubled, and when other conditions remain unchanged, the adhesion between the substrate and the transparent conductive layer will be doubled.

[0069] Among them, the first transparent conductive layer 20 and the second transparent conductive layer 100 are TCO film layers, that is, transparent conductive oxide coatings. The TCO film layers can receive electrons or holes transmitted in the battery, and use their conductivity to collect the current generated by the battery to improve the performance of the battery. At the same time, the TCO film layers also serve as supporting materials to provide necessary physical support for the multi-layer material structure of the battery.

[0070] The material of the first transparent conductive layer 20 includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO; the material of the second transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO.

[0071] The self-assembled single molecule includes a hydrophobic conjugated head group and a hydrophilic anchor group. The hydrophobic conjugated head group can be a carbazole group, and the hydrophilic anchor group can be a phosphate group or a carboxylic acid group. The co-solvent strategy in this scheme is to add N,N-dimethylformamide to the isopropanol solvent, N,N-dimethylformamide and isopropanol solvent as co-solvents, and the self-assembled single molecule as a solute, so that the critical micelle concentration of the self-assembled single molecule in the solvent can be increased to above the processing concentration, and the processing concentration is 0.1 mg / mL. -1 , and the critical micelle concentration increased to 0.15 to 0.5 mg / mL -1 , the micelles can be effectively decomposed due to the stronger solvent-solute interaction between N,N-dimethylformamide and carbazole groups.

[0072] Among them, by depositing the target co-solution on the upper surface of the first transparent conductive layer 20, heating the target co-solution to 80°C-95°C and continuing for 7min-15min, the solvent in the co-solution is slowly evaporated. During the evaporation process, the phosphate group of the self-assembled monomolecule can react with the carboxyl group in the first transparent conductive layer 20 to form a covalent bond, so that the self-assembled monomolecule can be anchored in the first transparent conductive layer 20 to form a monolayer. This anchoring effect not only ensures the uniform distribution of the self-assembled monomolecule on the substrate, but also improves the contact quality between it and the light absorption layer, thereby reducing the interface recombination rate and improving the overall efficiency of the device. During the evaporation process, the activity of the phosphate anchoring group and the carbazole group of the self-assembled monomolecule is enhanced. The phosphate anchoring group can independently select the reactivity with the metal oxide substrate, reducing the energy barrier for the growth of the self-assembled monomolecule on the substrate, thereby forming a densely arranged hole extraction layer on the substrate. The carbazole group has good electron donor properties and can effectively adjust the charge density around it, thereby enhancing the conductivity of the material. The carbazole group also has a high intramolecular rigidity, which helps to improve the stability of the self-assembled monolayer. The application of SAM as a hole extraction layer also significantly reduces the charge transfer loss, thereby increasing the short-circuit current density and open-circuit voltage in solar cells and achieving higher power generation efficiency.

[0073] Wherein, the material of the self-assembled monomolecule includes at least one of the following: [2-(3,6-dimethoxy-9H-carbazole-9-yl)phenylethyl]acetic acid, [2-(9H-carbazole-9-yl)phenylethyl]acetic acid, [4-(9H-carbazole-9-yl)butyl]acetic acid, [4-(3,6-dimethyl-9H-carbazole-9-yl)butyl]acetic acid and [4-(7H-dibenzocarbazole-7-yl)butyl]acetic acid;

[0074] Among them, different types of solar cells correspond to different light absorption layers 40. For example, if the solar cell is a perovskite cell, the light absorption layer 40 may be a perovskite layer. The light absorption layer is used to absorb sunlight and generate photons and holes.

[0075] The passivation layer 50 passivates the surface of the light absorbing layer 40 through a passivation material, which can effectively combine with the charged defects to compensate for the holes or uncoordinated free particles generated during the device preparation process. The passivation layer 50 material is PEAI, and can also be other materials used to passivate the surface of the light absorbing layer, which is not limited here.

[0076] The electron transport layer 60 is used to efficiently transmit the electrons generated by the light absorption layer 40 to the external circuit, and to block the holes from being transmitted to the cathode, thereby preventing the electrons and holes from being recombined during the transmission process, thereby improving the efficiency of the battery. The material of the electron transport layer 60 includes at least one of the following: C60, PCBM and ICBA.

[0077] The hole blocking layer 70 is used to block the transmission of photogenerated holes generated from the light absorbing layer 40 to the transparent conductive substrate, and reduce the recombination of electrons and holes during the transmission process. The material of the hole blocking layer can be SnO2.

[0078] Among them, the electrode layer 80 is used to collect the photogenerated electrons and holes generated by the light absorption layer and transmit them to the external circuit. The electrode layer 80 can be a transparent electrode, a metal electrode and a carbon electrode. The transparent electrode includes fluorine-doped tin oxide (FTO) and indium-doped tin oxide (ITO), and the metal electrode includes gold and silver.

[0079] The packaging film 90 may be a POE (polyolefin elastomer) film, and the packaging film 90 has a low water vapor permeability to prevent water vapor from invading the interior of the battery and affecting the battery performance.

[0080] Among them, the thickness range of the first transparent conductive layer is 300nm-600nm, the thickness range of the light absorption layer is 1-5um, the thickness range of the electron transport layer is 5-20nm, the thickness range of the hole blocking layer is 5-50nm, and the thickness range of the second transparent conductive layer is 200nm-400nm.

[0081] It can be seen that the solar cell 1000 can increase the critical micelle concentration of the self-assembled single molecule in the solvent to above the processing concentration, thereby increasing the critical micelle gel threshold of the self-assembled single molecule in the co-solution, effectively avoiding the self-assembled single molecule gel, and there is no need to introduce NiOx, which is beneficial to improving the stability of the solar cell and the power generation efficiency of the solar cell.

[0082] See also Figure 3A , Figure 3AThis is a schematic diagram of light transmission provided in an embodiment of the present application, where the refractive index of air n0=1, the refractive index of the substrate n1=1.52, the refractive index of the first transparent conductive layer 20 n2 is between 1.8 and 2.2, n2>n1>n0, and it is assumed that parallel natural light 1 is incident at an incident angle θ0. From the law of refraction, it can be seen that n0*sinθ3=sinθ1*n1, and θ1 is an external angle between the two interface normals and the optical path of the light propagating in the substrate. Therefore, θ1 must be greater than θ2. Because n2>n1, θ2>θ3, and therefore θ0>θ3, the light will converge after passing through the first substrate, and the irradiance of the light will increase after reaching the light absorption layer 40, so the power generation of the component will increase accordingly, and because of the convergence of light, the irradiance intensity of natural light at sunrise every day can reach the threshold of light absorption 3 by the light absorption layer 40 in advance, and the irradiance intensity of natural light at sunset every day can be reduced to the threshold of light absorption by the light absorption layer 40, thus increasing the power generation time and the power generation. 2 represents part of the light that is not absorbed by the light absorption layer 40, and this part of the light will pass through the light absorption layer 40 into the passivation layer 50, the electron transport layer 60, etc. of the device.

[0083] See also Figure 3B , Figure 3B This is a schematic diagram of another light transmission provided in an embodiment of the present application. After the natural light 1 passes through the light absorbing layer 40, due to the material absorption rate problem, the spectrum within the bandwidth range of the light absorbing layer 40 is not completely absorbed, so some light cannot be absorbed. It is assumed that after the natural light 1 passes through the light absorbing layer 40, the unabsorbed light 4 is incident on the interface between the second transparent conductive layer 100 and the second substrate 110 at an angle α1. The refractive index n3 of the second substrate 110 is 1.52, and the refractive index n4 of the second transparent conductive layer 100 is 1.8-2.2, n4>n3. When the angle α1 is less than the critical angle α between the second transparent conductive layer 100 and the second substrate 110, there are first reflected light 5 and refracted light 6. α2 is the refraction angle of the refracted light, and α3 is the reflection angle of the first reflected light 5 reflected back to the light absorption layer 40. The intensity of the first reflected light 5 increases with the increase of the outgoing light 4 until the incident angle α1 is greater than the critical angle α, and the light is completely reflected. The critical angle α=arcsin(n3 / n4), and the first reflected light 5 will enter the light absorption layer 40. When the unabsorbed light is incident at an incident angle α5 greater than the critical angle α, the light will be completely reflected back to the light absorption layer 40 at a reflection angle α4, and the reflected light is the second reflected light 7. At this time, the third reflected light 8 reflected back to the light absorption layer 40 will be reabsorbed by the light absorption layer 40, which can improve the power generation efficiency of the component and increase the amount of electricity generated per unit time.

[0084] See also Figure 4 , Figure 41 is a schematic flow chart of a method for preparing a solar cell provided in an embodiment of the present application, the method comprising:

[0085] Step S401, depositing a first transparent conductive layer on the upper surface of the first substrate;

[0086] Among them, before coating the first transparent conductive layer, a SiO2 film layer can be coated on the upper surface of the first substrate by PVD. The SiO2 film layer can combine with the surface SI=O unsaturated bond of the first substrate to form a covalent bond link, so that the bonding force between the first substrate and the SiO2 film layer is stronger. At the same time, the SiO2 film layer can also increase the roughness of the glass substrate and improve the adhesion of the subsequent first transparent conductive layer to the first substrate. The SiO2 film layer can also effectively prevent the metal cations in the first substrate from diffusing into the first transparent conductive layer, affecting the physical and optical properties of the first transparent conductive layer.

[0087] The temperature setting range for coating the first transparent conductive layer is 250° C. to 340° C., and the sheet resistance of the coated first transparent conductive layer is 6-14Ω.

[0088] Among them, after the first transparent conductive layer is plated, the first transparent conductive layer is scratched with a picosecond laser in the infrared band of 1064nm to form multiple conductive areas on the surface of the first substrate, and the insulation resistance between different conductive areas is greater than 40MΩ, ensuring that each battery area has good insulation in subsequent processes to prevent the occurrence of micro-shorts.

[0089] Step S402, depositing the target co-solution on the upper surface of the first transparent conductive layer, heating the target co-solution to 80°C-95°C and continuing for 7min-15min to form a monolayer, wherein the target co-solvent includes a co-solvent and a self-assembled monomolecule, and the co-solvent includes isopropyl alcohol and N,N-dimethylformamide.

[0090] Among them, the deposition methods include spin coating, slit coating, spraying, etc. The SAM molecules can be anchored on the free radicals of the molecules in the first transparent conductive layer through the acetate groups, and have a high water drop angle (the water drop angle is 87.2°), which ensures that the subsequently coated light absorption layer can be evenly and stably deposited on the monomolecular layer.

[0091] Step S403, coating a light absorbing layer on the upper surface of the monolayer, and placing the monolayer at 90° C.-120° C. for 15 min-45 min.

[0092] Among them, the coating method includes spin coating, slit coating, spraying and the like.

[0093] Step S404, coating a passivation layer on the upper surface of the light absorbing layer and placing it at 85° C.-110° C. for 15 min-30 min;

[0094] The coating method includes spin coating, slit coating, spraying, etc. The passivation layer can effectively fill the lattice gap of the light absorbing layer and improve the carrier mobility of the light absorbing layer.

[0095] Step S405 , depositing an electron transport layer on the upper surface of the passivation layer by evaporation.

[0096] The material energy level of the electron transport layer is between -3.5 and -6.5 eV, for example: C60, PCBM, ICBA.

[0097] Step S406 , forming a hole blocking layer on the upper surface of the electron transport layer by magnetron sputtering.

[0098] Step S407 , forming an electrode layer on the upper surface of the hole blocking layer by magnetron sputtering.

[0099] Step S408 , depositing a second transparent conductive layer on the lower surface of the second substrate.

[0100] Wherein, the sheet resistance of the second transparent conductive layer is 0.05-0.5Ω.

[0101] Step S409: packaging the first substrate and the second substrate.

[0102] In a possible example, after heating the target co-solution to 80° C.-95° C. for 7 min-15 min to form a monolayer, the method further includes: washing the monolayer with RO water to remove free self-assembled monomolecules.

[0103] In a possible example, after the hole blocking layer is plated on the upper surface of the electron transport layer by magnetron sputtering, the method further includes:

[0104] A picosecond laser is used to scribe the first film layer currently on the first substrate, so as to divide the first film layer into a plurality of first battery regions.

[0105] The first film layer includes a hole blocking layer, an electron transport layer, a passivation layer, a light absorption layer, a monomolecular layer and a first transparent conductive layer.

[0106] See also Figure 5A , Figure 5A This is a schematic diagram of a film layer provided in an embodiment of the present application. The first film layer includes a hole blocking layer, an electron transport layer, a passivation layer, a light absorption layer, a monomolecular layer and a first transparent conductive layer. The first film layer is divided into five first battery areas by engraving, and there is a gap between each first battery area.

[0107] In a possible example, after plating the electrode layer on the upper surface of the hole blocking layer by magnetron sputtering, the method further includes:

[0108] The second film layer currently on the first substrate is scribed using a picosecond laser to divide the second film layer into a plurality of second battery regions.

[0109] The second battery region is different from the first battery region, and the second battery region may include a partial region of the first battery region. The second film layer includes an electrode layer, a hole blocking layer, an electron transport layer, a passivation layer, a light absorption layer, a monomolecular layer and a first transparent conductive layer.

[0110] See also Figure 5B , Figure 5B is a schematic diagram of another film layer provided in an embodiment of the present application. After the hole blocking layer is plated, the gap between the first battery regions is filled with the material of the hole blocking layer. Figure 5C , Figure 5C This is a schematic diagram of another film layer provided in an embodiment of the present application. The second film layer includes an electrode layer, a hole blocking layer, an electron transport layer, a passivation layer, a light absorption layer, a monomolecular layer and a first transparent conductive layer. The second film layer is divided into four second battery areas by being scored, and there is also a gap between each second battery area.

[0111] In a possible example, a protrusion of a target shape is formed on the upper surface of the first substrate;

[0112] A protrusion of a target shape is formed on the lower surface of the second substrate.

[0113] In one possible example, the ratio of isopropyl alcohol to N,N-dimethylformamide ranges from 50:1 to 100:3.

[0114] In a possible example, the material of the first transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO;

[0115] The material of the second transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO;

[0116] The material of the self-assembled monomolecule includes at least one of the following: [2-(3,6-dimethoxy-9H-carbazole-9-yl)phenethyl]acetic acid, [2-(9H-carbazole-9-yl)phenethyl]acetic acid, [4-(9H-carbazole-9-yl)butyl]acetic acid, [4-(3,6-dimethyl-9H-carbazole-9-yl)butyl]acetic acid and [4-(7H-dibenzocarbazole-7-yl)butyl]acetic acid;

[0117] The material of the hole blocking layer is SnO2; the material of the passivation layer is PEAI;

[0118] The material of the electron transport layer includes at least one of the following: C60, PCBM and ICBA.

[0119] In a possible example, the thickness range of the first transparent conductive layer is 300nm-600nm, the thickness range of the light absorption layer is 1-5um, the thickness range of the electron transport layer is 5-20nm, the thickness range of the hole blocking layer is 5-50nm, and the thickness range of the second transparent conductive layer is 200nm-400nm.

[0120] It should be noted that all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional module and will not be repeated here.

[0121] The electronic device provided in this embodiment is used to execute the above-mentioned method for preparing a solar cell, and thus can achieve the same effect as the above-mentioned implementation method.

[0122] In the case of an integrated unit, the electronic device may include a processing module, a storage module and a communication module. The processing module may be used to control and manage the actions of the electronic device, for example, it may be used to support the electronic device to execute the steps performed by the above-mentioned functional unit. The storage module may be used to support the electronic device to execute stored program codes and data, etc. The communication module may be used to support the communication between the electronic device and other devices.

[0123] Among them, the processing module can be a processor or a controller. It can implement or execute various exemplary logic boxes, modules and circuits described in conjunction with the disclosure of this application. The processor can also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of digital signal processing (DSP) and a microprocessor, etc. The storage module can be a memory. The communication module can specifically be a device that interacts with other electronic devices, such as a radio frequency circuit, a Bluetooth chip, a Wi-Fi chip, etc.

[0124] An embodiment of the present application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, wherein the computer program enables a computer to execute part or all of the steps of any method recorded in the above method embodiments, and the above computer includes a terminal device.

[0125] The present application also provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute some or all of the steps of any method described in the method embodiment. The computer program product may be a software installation package, and the computer includes a control platform.

[0126] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0127] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0128] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the above-mentioned units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0129] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0130] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0131] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the above-mentioned methods of each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or CD-ROM and other media that can store program codes.

[0132] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable memory, which can include: a flash drive, a read-only memory, a random access memory, a magnetic disk or an optical disk, etc.

[0133] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A solar cell, characterized in that: The solar cell comprises: a first substrate; a first transparent conductive layer, wherein the first transparent conductive layer is disposed on an upper surface of the first substrate; A monomolecular layer, wherein the monomolecular layer is disposed on the upper surface of the first transparent conductive layer; the monomolecular layer is formed by depositing a target co-solution, wherein the target co-solvent comprises a self-assembled monomolecule and a co-solvent, and wherein the co-solvent comprises isopropyl alcohol and N,N-dimethylformamide; a light absorbing layer, wherein the light absorbing layer is disposed on an upper surface of the first transparent conductive layer; A passivation layer, the passivation layer being disposed on an upper surface of the light absorbing layer; An electron transport layer, wherein the electron transport layer is disposed on an upper surface of the passivation layer; A hole blocking layer, the hole blocking layer being arranged on the upper surface of the electron transport layer; An electrode layer is disposed on the upper surface of the hole blocking layer.

2. The solar cell according to claim 1, characterized in that The solar cell further comprises a packaging adhesive film, a second transparent conductive layer, a second substrate and butyl adhesive; The packaging film is arranged on the upper surface of the electrode layer, the second transparent conductive layer is arranged on the upper surface of the packaging film, and the second substrate is arranged on the upper surface of the second transparent conductive layer; The butyl rubber is used for sealing the solar cell.

3. The solar cell according to claim 2, characterized in that: A protrusion of a target shape is formed on the upper surface of the first substrate; A protrusion of a target shape is formed on the lower surface of the second substrate.

4. The solar cell according to claim 1, characterized in that The ratio of isopropanol to N,N-dimethylformamide ranges from 50:1 to 100:

3.

5. The solar cell according to any one of claims 1 to 3, characterized in that: The material of the first transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO; The material of the second transparent conductive layer includes at least one of the following: ITO, AZO, FTO, SnO2 and AZO; The material of the self-assembled monomolecule includes at least one of the following: [2-(3,6-dimethoxy-9H-carbazole-9-yl)phenethyl]acetic acid, [2-(9H-carbazole-9-yl)phenethyl]acetic acid, [4-(9H-carbazole-9-yl)butyl]acetic acid, [4-(3,6-dimethyl-9H-carbazole-9-yl)butyl]acetic acid and [4-(7H-dibenzocarbazole-7-yl)butyl]acetic acid; The material of the hole blocking layer is SnO2; the material of the passivation layer is PEAI; The material of the electron transport layer includes at least one of the following: C60, PCBM and ICBA.

6. The solar cell according to any one of claims 1 to 3, characterized in that: The thickness of the first transparent conductive layer is in the range of 300nm-600nm, the thickness of the light absorption layer is in the range of 1-5um, the thickness of the electron transport layer is in the range of 5-20nm, the thickness of the hole blocking layer is in the range of 5-50nm, and the thickness of the second transparent conductive layer is in the range of 200nm-400nm.

7. A method for preparing a solar cell, characterized in that: include: Plating a first transparent conductive layer on the upper surface of the first substrate; Depositing a target co-solution on the upper surface of the first transparent conductive layer, heating the target co-solution to 80° C.-95° C. for 7 min-15 min to form a monolayer, wherein the target co-solvent comprises a co-solvent and a self-assembled monomolecule, and the co-solvent comprises isopropyl alcohol and N,N-dimethylformamide; Coating a light absorbing layer on the upper surface of the monolayer and placing it at 90° C. to 120° C. for 15 min to 45 min; A passivation layer is coated on the upper surface of the light absorbing layer and placed at 85° C.-110° C. for 15 min-30 min; Plating an electron transport layer on the upper surface of the passivation layer by evaporation; Plating a hole blocking layer on the upper surface of the electron transport layer by magnetron sputtering; Plating an electrode layer on the upper surface of the hole blocking layer by magnetron sputtering; Plating a second transparent conductive layer on the lower surface of the second substrate; The first substrate and the second substrate are packaged.

8. The method according to claim 7, characterized in that After heating the target co-solution to 80° C.-95° C. for 7 min.-15 min. to form a monolayer, the method further comprises: The monolayer was washed with RO water to remove the free self-assembled monomolecules.

9. The method according to claim 7, characterized in that: After the hole blocking layer is plated on the upper surface of the electron transport layer by magnetron sputtering, the method further comprises: A picosecond laser is used to scribe the first film layer currently on the first substrate, so as to divide the first film layer into a plurality of first battery regions.

10. The method according to claim 7, characterized in that After plating the electrode layer on the upper surface of the hole blocking layer by magnetron sputtering, the method further comprises: The second film layer currently on the first substrate is scribed using a picosecond laser to divide the second film layer into a plurality of second battery regions.

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