Wiring board, package for mounting electronic component using wiring board, and electronic module

Abstract

The wiring substrate has a first insulating layer, a second insulating layer, a conductor layer, a first ground conductor, and a second ground conductor. The conductor layer has a pair of first signal lines and a pair of second signal lines extending in a first direction, the second ground conductor has a pair of first openings and a pair of second openings, and the second insulating layer has a pair of first through conductors, a pair of second through conductors, and a central through conductor. The pair of first through conductors is located in the pair of first openings and connected to the pair of first signal lines, and the pair of second through conductors is located in the pair of second openings and connected to the pair of second signal lines. The central through conductor is located between the pair of first openings and the pair of second openings, is connected to the first ground conductor and the second ground conductor, and is a ground through conductor close to the first through conductor and the second through conductor in a second direction intersecting the first direction.

Description

Technical Field

[0001] The present disclosure relates to a wiring board, an electronic component mounting package using the wiring board, and an electronic module. Background Art

[0002] In recent years, electronic modules used in wireless communication devices and optical communication devices have been required to transmit high-frequency signals in order to transmit high-speed and large-volume information. Therefore, wiring substrates for transmitting signals are required to transmit high-frequency signals with low loss.

[0003] In addition, as wireless communication devices and optical communication devices are miniaturized, wiring boards used therein, and electronic component mounting packages and electronic modules using the wiring boards are also required to be miniaturized.

[0004] As described in Patent Document 1, there is known a circuit board having grounding through holes arranged around a central conductor. The central conductor has a through hole at the center and is connected to a strip line. The grounding through hole has a through hole at the center. (For example, refer to FIG. 10A of Patent Document 1, etc.).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: WO2004 / 107830 Summary of the invention

[0008] In one embodiment of the present disclosure, (1) a wiring substrate has a first insulating layer, a second insulating layer, a conductor layer, a first grounding conductor, and a second grounding conductor. The first insulating layer has a first upper surface and a first side surface connected to the first upper surface. The second insulating layer is located on the first insulating layer and has a second upper surface, a second lower surface on the opposite side of the second upper surface, and a second side surface connecting the second upper surface and the second lower surface. The conductor layer is located on the first upper surface and has a pair of first signal lines and a pair of second signal lines that transmit differential signals and extend in a first direction, respectively. The first grounding conductor is located on the first upper surface and is located between the pair of first signal lines and the pair of second signal lines at a distance from the pair of first signal lines and the pair of second signal lines. The second grounding conductor is located on the second upper surface and has a pair of first openings and a pair of second openings arranged side by side with the pair of first openings. The pair of second signal lines are arranged side by side with the pair of first signal lines. In addition, the second insulating layer has a pair of first through conductors, a pair of second through conductors, and one or more central through conductors that pass through from the second upper surface to the second lower surface, respectively. The pair of first through conductors are located in the pair of first openings and are electrically connected to the pair of first signal lines, and the pair of second through conductors are located in the pair of second openings and are electrically connected to the pair of second signal lines. The central through conductor is located between the pair of first openings and the pair of second openings and is electrically connected to the first ground conductor and the second ground conductor, and the central through conductor is a grounding through conductor close to the first through conductor in a second direction intersecting the first direction, and is a grounding through conductor close to the second through conductor in the second direction intersecting the first direction.

[0009] (2) The wiring substrate of (1) above further includes a third insulating layer located on the second upper surface. The third insulating layer includes a third through conductor and a fourth through conductor. The third through conductor and the fourth through conductor respectively penetrate the third insulating layer and are electrically connected to the second grounding conductor. The third through conductor is located between a pair of first openings, and the fourth through conductor is located between a pair of second openings. Furthermore, in the second direction, the third through conductor is a grounding through conductor that is close to the pair of first through conductors, and the fourth through conductor is a grounding through conductor that is close to the pair of second through conductors, respectively.

[0010] (3) In the wiring substrate of (1) or (2) above, the pair of first openings and the pair of second openings are circular in a plan view.

[0011] (4) In the wiring substrate of (2) or (3) above, the third through conductor, the fourth through conductor, and the central through conductor are arranged side by side on a straight line in the second direction.

[0012] (5) In the wiring substrates of (2) to (4) above, the pair of first through conductors, the pair of second through conductors, the third through conductor, the fourth through conductor, and the central through conductor are arranged side by side on a straight line in the second direction.

[0013] (6) In the wiring substrates of (2) to (5) above, when the distance between the third through conductor and the central through conductor along the second direction is set to L3 and the distance between the fourth through conductor and the central through conductor along the second direction is set to L4, L3=L4 is satisfied.

[0014] (7) In the wiring substrate of (1) to (6) above, the second ground conductor has a pair of third openings located at positions overlapping the pair of first signal lines and a pair of fourth openings located at positions overlapping the pair of second signal lines in a plan view.

[0015] (8) In the wiring substrate of (7) above, in the second direction, when the size of a pair of first openings is set to OL1, the size of a pair of second openings is set to OL2, the size of a pair of third openings is set to OL3, and the size of a pair of fourth openings is set to OL4, OL1≥OL3 and OL2≥OL4 are satisfied.

[0016] (9) In the wiring substrates of (1) to (8) above, the first insulating layer has a protrusion that extends outward from the second side surface of the second insulating layer along the first direction when viewed from above, and includes a first side surface. The protrusion has a first surface extending from the second side surface of the second insulating layer in the first direction in the first upper surface of the first insulating layer, and a first opening and a second opening that are open on the first surface. A pair of first signal lines and a pair of second signal lines are arranged to extend on the first surface of the protrusion. The first opening is located between the pair of first signal lines. The second opening is located between the pair of second signal lines.

[0017] (10) In the wiring substrate of (9) above, when viewed from above, the pair of first signal lines respectively include a first connection portion and a first line portion extending inwardly from the first connection portion along the first direction. The pair of second signal lines respectively include a second connection portion and a second line portion extending inwardly from the second connection portion along the first direction. The first opening portion is located between the pair of first line portions. The second opening portion is located between the pair of second line portions. In the second direction, the size of the first line portion is shorter than the size of the first connection portion, and the size of the second line portion is shorter than the size of the second connection portion.

[0018] (11) In the wiring substrate of (9) or (10) above, the protrusion has a first central cutout portion cut from the first surface to the first side surface. The first central cutout portion has a first inner wall surface connected to the first surface and the first side surface. When viewed from the side in the first direction, the first central cutout portion is located at a position overlapping with the central through conductor. The first ground conductor is arranged so as to extend from the first surface to the first inner wall surface.

[0019] (12) In the wiring substrate of (1) to (11) above, the second insulating layer has a second central cutout portion cut from the second upper surface to the second side surface. The second central cutout portion has a second inner wall surface connected to the second upper surface and the second side surface. When viewed from the side in the first direction, the second central cutout portion is located at a position overlapping with the central through conductor. The second ground conductor is arranged so as to extend from the second upper surface to the second inner wall surface.

[0020] (13) In the wiring substrate of (2) to (12) above, the wiring substrate further has a third grounding conductor. The third insulating layer may also have a third upper surface, a third side surface, a third lower surface, an inner side surface and an inner cutout portion. The third lower surface is located on the opposite side to the third upper surface. The third side surface connects the third upper surface and the third lower surface and is located on the same plane as the second side surface. The inner side surface connects the third upper surface and the third lower surface and includes a fourth side surface on the opposite side to the third side surface. In addition, the inner side surface includes a lateral side surface along the first direction and a corner portion located between the lateral side surface and the fourth side surface. The corner portion is in an arc shape when viewed from above. The inner cutout portion is cut from the third upper surface to the fourth side surface. The inner cutout portion has a third inner wall surface continuous with the corner portion and the fourth side surface. The third grounding conductor is located on the third upper surface and is configured to extend from the third upper surface to the third inner wall surface.

[0021] (14) An electronic component mounting package according to one embodiment of the present disclosure comprises the wiring substrate of (1) to (13), a substrate and a frame. The frame is bonded to the upper surface of the substrate, and the wiring substrate is fixed to the frame. Alternatively, the wiring substrate may be bonded to the upper surface of the substrate.

[0022] (15) An electronic module according to one embodiment of the present disclosure comprises the electronic component mounting package of (14) above, an electronic component, and a cover. The electronic component is located on the upper surface of the substrate and is electrically connected to the wiring substrate of the electronic component mounting package. The cover is located on the frame and is located at a position covering the interior of the electronic component mounting package. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a perspective view of a wiring board, an electronic component mounting package, and an electronic module according to an embodiment of the present disclosure.

[0024] Figure 2From another perspective Figure 1 An enlarged view of the main part A is shown.

[0025] Figure 3 Yes Figure 2 The main part A shown is a perspective view taken along line X1-X1.

[0026] Figure 4 yes Figure 3 A top view of the main part A is shown.

[0027] Figure 5 yes Figure 4 An enlarged view of the main part B is shown.

[0028] Figure 6 yes Figure 3 A top perspective view of the main part A is shown.

[0029] Figure 7 yes Figure 6 The Y1-Y1 cross-sectional view of the main part A is shown.

[0030] Figure 8 It is a plan view of a wiring board, an electronic component mounting package, and an electronic module according to an embodiment of the present disclosure.

[0031] Fig. 9 yes Figure 8 An enlarged view of the main portion C is shown. DETAILED DESCRIPTION

[0032] <Structure of Wiring Board>

[0033] Hereinafter, several exemplary embodiments of the present disclosure are described with reference to the accompanying drawings. It should be noted that, in the wiring substrate, any direction can be set as the upper direction or the lower direction, but for convenience, an orthogonal coordinate system xyz is defined, and the positive side of the z direction is set as the upper direction. In the following, the first direction refers to, for example, the x direction mentioned in the accompanying drawings. The second direction intersecting the first direction refers to, for example, the y direction mentioned in the accompanying drawings. In addition, in the present disclosure, the top view is a concept that includes plane perspective.

[0034] Reference Figures 1 to 9 The wiring substrate 101 involved in the embodiment of the present disclosure is described. The wiring substrate 101 has at least a first insulating layer 1, a second insulating layer 2, a conductor layer S, a first grounding conductor layer G1, and a second grounding conductor G2. In addition, the wiring substrate 101 may also have a third insulating layer 3. In addition, for example, a wire, a flexible substrate (FPC: Flexible Printed Circuits, flexible printed circuits), a lead terminal, etc. can be connected to the wiring substrate 101. In addition, Figure 2 Observed from the positive direction of the z-axis Figure 1 The illustrated diagram is an enlarged view of a main portion A of a wiring substrate 101 , an electronic component mounting package 100 , and an electronic module 10 .

[0035] like Figure 7 As shown, the first insulating layer 1 has a first upper surface 1a and a first side surface 1b connected to the first upper surface 1a. As the material of the first insulating layer 1, for example, a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, or a dielectric material such as a glass ceramic material can be used.

[0036] Alternatively, the first insulating layer 1 may be a structure in which a plurality of insulating layers are stacked. The first insulating layer 1 is, for example, U-shaped in a plan view, with a size of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.5 mm to 10 mm.

[0037] like Figure 7 As shown, the second insulating layer 2 is located on the first insulating layer 1, and has a second upper surface 2a, a second lower surface 2c on the opposite side of the second upper surface 2a, and a second side surface 2b connecting the second upper surface 2a and the second lower surface 2c. The second lower surface 2c can be defined as a surface opposite to the first upper surface 1a. The material of the second insulating layer 2 can be the same as that of the first insulating layer 1, or different. For example, the same material as the first insulating layer 1 described above can be used. The second insulating layer 2 can also be a structure in which a plurality of insulating layers are stacked. The second insulating layer 2 is, for example, U-shaped when viewed from above, with a size of 4mm×4mm to 50mm×50mm and a thickness of 0.5mm to 10mm.

[0038] like Figures 2 to 7 As shown, the conductor layer S is located on the first upper surface 1a, and has a pair of first signal lines S1 and a pair of second signal lines S2 that transmit differential signals respectively and extend in a first direction (in one embodiment, in the x direction). As the material of the conductor layer S (a pair of first signal lines S1, a pair of second signal lines S2), for example, metal materials such as gold, silver, copper, nickel, tungsten, molybdenum and manganese can be cited. In addition, the conductor layer S can be formed by sintering a metal paste on the first upper surface 1a, or by using a thin film forming technique such as a vapor deposition method or a sputtering method. An insulating film such as a ceramic (such as an alumina coating) or a resin can also be located on a portion of the conductor layer S. The insulating film can be set on each signal line (a pair of first signal lines S1 and a pair of second signal lines S2) by screen printing. In addition, the insulating film can be located only on a portion of each signal line. According to such a structure, the possibility of a short circuit due to a short circuit of each signal line can be reduced.

[0039] The pair of second signal lines S2 is arranged side by side with the pair of first signal lines S1. A metal plating layer such as a nickel plating layer or a gold plating layer may be formed on the surface of the pair of first signal lines S1 and the pair of second signal lines S2. The pair of first signal lines S1 and the pair of second signal lines S2 have a width of 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm, for example.

[0040] The thickness of a pair of first signal lines S1 and a pair of second signal lines S2 is, for example, 0.01 to 0.1 mm. In addition, the width, length, and thickness of the pair of first signal lines S1 and the pair of second signal lines S2 mentioned here can be set to the dimension in the y direction, the dimension in the x direction, and the dimension in the z direction of the pair of first signal lines S1 and the pair of second signal lines S2, respectively. The width / length / thickness of the first ground conductor G1 and the second ground conductor G2 described later can also be defined in the same way. In addition, the width / length / thickness of each signal line constituting the pair of first signal lines S1 can be the same as or different from the width / length / thickness of the pair of first signal lines S1.

[0041] like Figure 2 to Figure 7 As shown, the first grounding conductor G1 is located on the first upper surface 1a. Furthermore, in an embodiment in which the first grounding conductor G1 is located between a pair of first signal lines S1 and a pair of second signal lines S2 and is spaced apart from each other, the first grounding conductor G1 may also be configured to extend in the first direction (x direction). The material of the first grounding conductor G1 may be the same as or different from the material of the conductor layer S, and for example, the same material as the material of the conductor layer S may be cited. In addition, the first grounding conductor G1 may also be formed by the same method as the conductor layer S described above. The first grounding conductor G1 may have a width of, for example, 0.05 mm to 2 mm and a length of, for example, 1.5 mm to 25 mm. The thickness of the first grounding conductor G1 may be, for example, 0.01 mm to 0.1 mm.

[0042] The first ground conductor G1 is located between a pair of first signal lines S1 and a pair of second signal lines S2, thereby strengthening the ground potential and enhancing the electrolytic coupling. Therefore, the conductor layer S can reduce the possibility of crosstalk and resonance caused by the electric field distribution being wider than the expected range when transmitting high-frequency signals.

[0043] The second grounding conductor G2 is located on the second upper surface 2a. Furthermore, the second grounding conductor G2 has a pair of first openings O1 (first opening O1a, first opening O1b) and a pair of second openings O2 (second opening O2a, second opening O2b) arranged side by side with the pair of first openings O1. The pair of first openings O1 and the pair of second openings O2 are areas where the second grounding conductor G2 is not formed when viewed from above. In one embodiment, the first grounding conductor G1 may also be arranged to extend in the first direction (x direction). The material of the second grounding conductor G2 may be the same as or different from the material of the conductor layer S, and for example, the same material as the material of the above-mentioned conductor layer S may be cited. In addition, the second grounding conductor G2 may also be formed by the same method as the above-mentioned conductor layer S. The thickness of the second grounding conductor G2 is, for example, 0.01 mm to 0.1 mm.

[0044] like Figure 4 and Figure 6 As shown, the pair of first openings O1 and the pair of second openings O2 may also be circular in a plan view. The circular shape mentioned here is not limited to a perfect circle, but may also be an ellipse or a circle with a part missing. Figure 4 and Figure 6 As shown, the pair of first openings O1 and the pair of second openings O2 may also be circles with a portion missing in the portion adjacent to the central through conductor 2G1 described later. More specifically, in a plan view, the portion along the central through conductor 2G1 in the first opening O1a and the second opening O2a is shaped along the outer circumference of the central through conductor 2G1. Thus, the second ground conductor G2 can be located between the central through conductor 2G1 and the first opening O1a and the second opening O2a, thereby strengthening the ground potential.

[0045] In the case where the second insulating layer 2 is a structure in which a plurality of insulating layers are stacked, the wiring substrate 101 may have a plurality of second grounding conductors G2, and the second grounding conductors G2 may be respectively located between the insulating layers constituting the second insulating layer 2. In this case, all the second grounding conductors G2 do not need to have the same shape when viewed from above. For example, in the second grounding conductor G2 located between the insulating layers constituting the second insulating layer 2, each of the pair of first openings O1 may be combined into one opening when viewed from above, and each of the pair of second openings O2 may be combined into one opening when viewed from above.

[0046] like Figure 3 , Figure 4 , Figure 6 , Figure 7As shown, the second insulating layer 2 has a pair of first through conductors 2S1, a pair of second through conductors 2S2, and one or more central through conductors 2G1. The first through conductor 2S1, the second through conductor 2S2, and the central through conductor 2G1 penetrate from the second upper surface 2a to the second lower surface 2c, respectively. The pair of first through conductors 2S1 can be formed by filling a metal paste containing a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese in a through hole provided in the second insulating layer 2. In addition, the pair of second through conductors 2S2 and the central through conductor 2G1 can also be formed by the same method as the pair of first through conductors 2S1.

[0047] The pair of first through conductors 2S1, the pair of second through conductors 2S2, and the central through conductor 2G1 may be via holes filled with metal paste, or may be through holes coated with metal paste on the inner wall surface of the through hole. In one embodiment, the pair of first through conductors 2S1, the pair of second through conductors 2S2, and the central through conductor 2G1 are via holes formed by the above method. In this case, compared with the case where the pair of first through conductors 2S1, the pair of second through conductors 2S2, and the central through conductor 2G1 are through holes, the possibility of a decrease in the strength of the wiring substrate 101 when the wiring substrate 101 is miniaturized can be reduced. That is, when miniaturizing the wiring substrate 101, a pair of first through conductors 2S1, a pair of second through conductors 2S2, and a central through conductor 2G1 are respectively arranged close to each other, but because the pair of first through conductors 2S1, a pair of second through conductors 2S2, and a central through conductor 2G1 are vias in which metal paste is filled, the possibility of reduction in the strength of the wiring substrate 101 can be reduced compared to the case of through holes.

[0048] like Figure 4 and Figure 6 As shown, a pair of first through conductors 2S1 are located in a pair of first openings O1 and are electrically connected to a pair of first signal lines S1. A pair of second through conductors 2S2 are located in a pair of second openings O2 and are electrically connected to a pair of second signal lines. When viewed from above, each of the pair of first through conductors 2S1 (first through conductor 2S1a and first through conductor 2S1b) is located inside each of the pair of first openings O1 (first opening O1a, first opening O1b), and each of the pair of second through conductors 2S2 (second through conductor 2S2a and second through conductor 2S2b) is located inside each of the pair of second openings O2 (second opening O2a, second opening O2b). By means of the above-mentioned structure, a pseudo-coaxial structure can be formed, and a signal can be transmitted in the direction in which the first insulating layer 1 and the second insulating layer 2 are stacked (in one embodiment, in the z direction), and the possibility of a large loss of the transmitted signal can be reduced.

[0049] In one embodiment, more specifically, in a plan view, the first through conductor 2S1a is located at the center of the first opening O1a, and the first through conductor 2S1b is located at the center of the first opening O1b. In addition, in a plan view, the second through conductor 2S2a is located at the center of the second opening O2a, and the second through conductor 2S2b is located at the center of the second opening O2b. With such a structure, a pair of first through conductors 2S1 and a pair of second through conductors 2S2 form a differential pseudo-coaxial structure that transmits differential signals respectively. With such a structure, currents with opposite phases flow through the first through conductor 2S1a and the first through conductor 2S1b, so that external noise is canceled, thereby reducing the influence of EMI noise and enabling smoother transmission of high-frequency signals. In the second through conductor 2S2a and the second through conductor 2S2b, high-frequency signals can also be transmitted more smoothly. The pair of first through conductors 2S1 may be electrically connected to the pair of first signal lines S1, and the pair of first through conductors 2S1 does not necessarily need to be directly connected to the pair of first signal lines S1.

[0050] In one embodiment, the wiring substrate 101 may include a first interlayer signal conductor S3 and a second interlayer signal conductor S4. Figure 6 , the first interlayer signal conductor S3 and the second interlayer signal conductor S4 described later are indicated by dotted lines. A pair of first through conductors 2S1 are connected to a pair of first signal lines S1 via the first interlayer signal conductor S3. A pair of second through conductors 2S2 are connected to a pair of second signal lines S2 via the second interlayer signal conductor S4. In addition, the material of the first interlayer signal conductor S3 and the second interlayer signal conductor S4 may be the same as or different from the material of the conductor layer S, and for example, the same material as the material of the conductor layer S may be cited. In addition, the first interlayer signal conductor S3 and the second interlayer signal conductor S4 may also be formed by the same method as the conductor layer S described above. The first interlayer signal conductor S3 and the second interlayer signal conductor S4 may have a width of, for example, 0.05 mm to 2 mm and a length of, for example, 1.5 mm to 25 mm. The thickness of the first interlayer signal conductor S3 and the second interlayer signal conductor S4 may be, for example, 0.01 mm to 0.1 mm.

[0051] like Figure 3 to Figure 6 As shown, the central through conductor 2G1 is located between a pair of first openings O1 and a pair of second openings O2. The central through conductor 2G1 is electrically connected to the first ground conductor G1 and the second ground conductor G2. In addition, in a second direction (y direction in one embodiment) intersecting the first direction, the central through conductor 2G1 is a grounding through conductor close to the first through conductor 2S1a, and is a grounding through conductor close to the second through conductor 2S2a.

[0052] The wiring substrate 101 can reduce the possibility of crosstalk by the above-described structure, and can also reduce the size of the wiring substrate 101.

[0053] In one embodiment, when the distance between the central through conductor 2G1 and the adjacent first through conductor 2S1 is L1 and the distance between the central through conductor 2G1 and the adjacent second through conductor 2S2 is L2, L1=L2 is satisfied. With such a structure, good high frequency transmission can be maintained and the wiring substrate 101 can be miniaturized.

[0054] Among them, Figure 4 As shown, in one embodiment, the central through conductor 2G1 may be one. According to such a structure, the generation of crosstalk can be reduced, and the miniaturization of the wiring substrate 101 can be further achieved. In addition, the central through conductor 2G1 may be plural, and the number of the central through conductors 2G1 may be appropriately adjusted according to the frequency of the transmitted signal. That is, for example, two central through conductors 2G1 arranged along the first direction may also be located between a pair of first openings O1 and a pair of second openings O2.

[0055] like Figure 2 and Figure 7 As shown, the wiring substrate 101 may also have a third insulating layer 3 located on the second upper surface 2a. The third insulating layer 3 has a third through conductor 3G3 and a fourth through conductor 3G4. The third through conductor 3G3 and the fourth through conductor 3G4 respectively penetrate the third insulating layer 3 and are electrically connected to the second grounding conductor G2. The material of the third insulating layer 3 may be the same as that of the first insulating layer 1, or may be different. For example, the same material as the first insulating layer 1 described above can be used. The third insulating layer 3 may also be a structure in which a plurality of insulating layers are stacked. The third insulating layer 3 is, for example, U-shaped when viewed from above, with a size of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.5 mm to 10 mm.

[0056] In addition, the wiring substrate 101 may also include a third ground conductor G3 located on the third insulating layer 3. The third ground conductor G3 is formed of the same material and the same method as the material of the conductor layer S. Figure 7 As shown, when the third insulating layer 3 is a structure in which a plurality of insulating layers are stacked, the third ground conductor G3 may be located between the insulating layers constituting the third insulating layer 3. In this case, the third ground conductor G3 may be electrically connected to the third through conductor 3G3 and the fourth through conductor 3G4.

[0057] like Figure 4As shown, the third through conductor 3G3 is located between a pair of first openings O1, and the fourth through conductor 3G4 is located between a pair of second openings O2. In addition, in the second direction (y direction), the third through conductor 3G3 is a grounding through conductor close to the pair of first through conductors 2S1, and the fourth through conductor 3G4 is a grounding through conductor close to the pair of second through conductors 2S2. More specifically, in the second direction (y direction), the distance from the third through conductor 3G3 to the first through conductor 2S1a is the same as the distance from the third through conductor 3G3 to the first through conductor 2S1b. The third through conductor 3G3 and the fourth through conductor 3G4 can be formed by filling a metal paste including a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese into the through hole provided in the third insulating layer 3.

[0058] In one embodiment, the third through conductor 3G3 may also be located between the first opening O1a and the first opening O1b at intervals. In addition, the fourth through conductor 3G4 may also be located between the second opening O2a and the second opening O2b at intervals. The second grounding conductor G2 is located between the third through conductor 3G3 and the pair of first openings O1 and between the fourth through conductor 3G4 and the pair of second openings O2. As described above, in the case where the wiring substrate 101 has the third grounding conductor G3 and the third grounding conductor G3 is electrically connected to the third through conductor 3G3 and the fourth through conductor 3G4, by electrically connecting a plurality of layers of grounding conductors (in one embodiment, the second grounding conductor G2 and the third grounding conductor G3) via the third through conductor 3G3 and the fourth through conductor 3G4, the grounding potential can be strengthened.

[0059] The third through conductor 3G3, the fourth through conductor 3G4 and the central through conductor 2G1 can also be arranged side by side on a straight line in the second direction (in one embodiment, the y direction). As a result, the ground potential can be strengthened while the pair of first openings O1 are arranged at the shortest distance, and the ground potential can be strengthened while the pair of second openings O2 are arranged at the shortest distance. In addition, the ground potential can be strengthened while the pair of first openings O1 and the pair of second openings O2 are arranged at the shortest distance. Therefore, miniaturization can be achieved while strengthening the ground potential of the wiring substrate 101.

[0060] Alternatively, the pair of first through conductors 2S1, the pair of second through conductors 2S2, the third through conductor 3G3, the fourth through conductor 3G4, and the central through conductor 2G1 may be arranged side by side in a straight line in the second direction. Thus, the ground potential of the wiring substrate 101 can be enhanced while achieving miniaturization through the same effects as above.

[0061] like Figure 4As shown, when viewed from above, when the distance between the third through conductor 3G3 and the central through conductor 2G1 along the second direction is set to L3, and the distance between the fourth through conductor 3G4 and the central through conductor 2G1 along the second direction is set to L4, L3 = L4. In this case, since the impedance of the first signal line S1 and the second signal line S2 can be easily adjusted, the high-frequency characteristics of the wiring substrate 101 can be improved.

[0062] like Figure 4 As shown, in a plan view, the second ground conductor G2 may also have a pair of third openings O3 located at a position overlapping with the pair of first signal lines S1 and a pair of fourth openings O4 located at a position overlapping with the pair of second signal lines S2. With such a structure, the possibility of a decrease in the value of impedance can be reduced in the pair of first signal lines S1 and the pair of second signal lines S2 that transmit differential signals respectively, and the impedance can be adjusted to a desired value. Such a wiring substrate 101 has excellent transmission characteristics of high-frequency signals.

[0063] The following description will be made by taking the pair of third openings O3 as an example, but the pair of fourth openings O4 may have the same structure as the pair of third openings O3 or may be different.

[0064] The pair of third openings O3 may be located at a position overlapping at least a portion of the pair of first signal lines S1 when viewed from above, and the pair of third openings O3 do not need to be located at a position overlapping the entire pair of first signal lines S1. The pair of third openings O3 may be substantially rectangular when viewed from above, or may be circular including an elliptical shape. The substantially rectangular shape may also include a shape in which a portion of the rectangular shape is along the outer shape of the via connected to the second ground conductor G2 when viewed from above.

[0065] When the wiring substrate 101 has the first interlayer signal conductor S3 and the second interlayer signal conductor S4, the pair of third openings O3 may be located at a position overlapping the first interlayer signal conductor S3, and the pair of fourth openings O4 may be located at a position overlapping the second interlayer signal conductor S4 in a plan view. In one embodiment, the pair of third openings O3 may be located at a position overlapping the pair of first signal lines S1 and the first interlayer signal conductor S3, and the pair of fourth openings O4 may be located at a position overlapping the pair of second signal lines S2 and the second interlayer signal conductor S4.

[0066] More specifically, in one embodiment, in the second direction, one first signal line S1 and one first interlayer signal conductor S3 may be located in one third opening O3 closer to another third opening O3 than the midpoint of the third opening O3. In this case, the coupling degree of differential signals can be improved.

[0067] like Figure 4 As shown, in the second direction (y direction), when the size of the pair of first openings O1 is set to OL1, the size of the pair of second openings O2 is set to OL2, the size of the pair of third openings O3 is set to OL3, and the size of the pair of fourth openings O4 is set to OL4, OL1≥OL3 and OL2≥OL4 may be satisfied. By making the size OL3 of the pair of third openings O3 too large, the area of ​​the second ground conductor G2 located on the second upper surface 2a is reduced, thereby reducing the weakening of the ground potential. That is, by setting the size OL3 of the pair of third openings O3 to a size smaller than the size OL1 of the pair of first openings O1, the ground potential can be prevented from becoming unstable. In addition, by also setting the size OL4 of the pair of fourth openings O4 to a size smaller than the size OL2 of the pair of second openings O2, the ground potential can be prevented from becoming unstable in the same way as in the above case.

[0068] like Figure 2 to Figure 7 As shown, the first insulating layer 1 may also have a protrusion 11. The protrusion 11 is a portion of the first insulating layer 1 that extends outward from the second side surface 2b of the second insulating layer 2 along the first direction (x direction) (in one embodiment, the negative direction of the x-axis) and includes the first side surface 1b when viewed from above. In addition, the protrusion 11 has a first surface 11a extending from the second side surface 2b of the second insulating layer 2 to the first direction in the first upper surface 1a of the first insulating layer 1 when viewed from above, and a first opening 11O1 and a second opening 11O2 opened on the first surface 11a. A pair of first signal lines S1 and a pair of second signal lines S2 are arranged to extend on the first surface 11a of the protrusion 11. The first opening 11O1 is located between the pair of first signal lines S1, and the second opening 11O2 is located between the pair of second signal lines S2. With such a structure, the dielectric constant of the first insulating layer 1 between the pair of first signal lines S1 and the pair of second signal lines S2 can be reduced, and the reduction in impedance can be reduced in the pair of first signal lines S1 and the pair of second signal lines S2. Therefore, by using the wiring substrate 101, it is possible to provide an electronic component mounting package 100 and an electronic module 10 that can reduce the loss in the transmission of high-frequency signals.

[0069] In one embodiment, the first opening 11O1 and the second opening 11O2 may be concave portions located in the protrusion 11, or may be substantially elliptical in plan view. With such a shape, compared with the case where the first opening 11O1 and the second opening 11O2 are rectangular, stress generated at the corners can be reduced, thereby reducing the possibility of damage to the wiring substrate 101.

[0070] In addition, the first opening 11O1 and the second opening 11O2 may be elliptical, square, or rectangular with rounded corners when viewed from above. In addition, the first opening 11O1 and the second opening 11O2 may reach the first side surface 1b. In other words, the first opening 11O1 and the second opening 11O2 may be in a shape that is cut from the first surface 11a to the first side surface 1b. In addition, the first opening 11O1 and the second opening 11O2 may extend to a position that overlaps with the second side surface 2b when viewed from above.

[0071] In addition, in one embodiment, if Figure 4 As shown, the first opening 11O1 and the second opening 11O2 may be located at left-right symmetrical positions across the first ground conductor G1 and may have the same shape. With such a structure, the first opening 11O1 and the second opening 11O2 can be formed by punching into the same shape, so that the wiring substrate 101 can be easily manufactured. In addition, the impedance of the signal transmitted by the pair of first signal lines S1 and the pair of second signal lines S2 can be easily adjusted to be consistent.

[0072] In addition, the shape, position, and size of the first opening 1101 and the second opening 1102 are not limited to the above. That is, the sizes of the first opening 1101 and the second opening 1102 may be different, and the first opening 1101 and the second opening 1102 may be appropriately arranged at a position where impedance reduction is required.

[0073] And, if Figure 5 As shown, when viewed from above, a pair of first signal lines S1 respectively have a first connection portion S12 and a first line portion S11 extending inwardly from the first connection portion S12 along the first direction. Furthermore, a pair of second signal lines S2 respectively have a second connection portion S22 and a second line portion S21 extending inwardly (in the positive direction of the x-axis) from the second connection portion S22 along the first direction (x-direction). In this case, the first opening portion 11O1 is located between the pair of first line portions S11, and the second opening portion 11O2 is located between the pair of second line portions S21. In the second direction (y-direction), the size WS11 of the first line portion S11 is shorter than the size WS12 of the first connection portion S12, and the size WS21 of the second line portion S21 is shorter than the size WS22 of the second connection portion S22. That is, WS11 <WS12,WS21<WS22。

[0074] By means of the above-mentioned structure, it is possible to ensure an area for connecting a wire, a lead terminal, and a flexible substrate at each connection portion (the first connection portion S12, the second connection portion S22) of each signal line, so that the wire, etc. can be easily connected to each connection portion. In addition, when each connection portion (the first connection portion S12, the second connection portion S22) is connected to a lead terminal, since the connection is made via a conductive bonding material (for example, solder, silver solder, etc.), the bonding material can easily form a solder fillet from each connection portion to the lead terminal, thereby improving the bonding strength between the lead terminal and the wiring substrate 101.

[0075] In one embodiment, the pair of second signal lines S2 (second line portion S21, second connection portion S22) has the same shape and size as the pair of first signal lines S1 (first line portion S11, first connection portion S12). Figure 5 , description of a pair of second signal lines S2 (second line portion S21, second connection portion S22), a size WS21 of the second line portion S21, and a size WS22 of the second connection portion S22 is omitted.

[0076] like Figure 2 to Figure 4 As shown, the protrusion 11 may also have a first central cutout portion 11K cut from the first surface 11a to the first side surface 1b. The first central cutout portion 11K has a first inner wall surface 11K1 connected to the first surface 11a and the first side surface 1b. When viewed from the side in the first direction (x direction), the first central cutout portion 11K is located at a position overlapping with the central through conductor 2G1. In addition, the first ground conductor G1 may also be configured to extend from the first surface 1a to the first inner wall surface 11K1. With such a structure, the ground potential can be strengthened and the possibility of signal loss transmitted in each signal line can be reduced.

[0077] like Figure 2 to Figure 4 As shown, the second insulating layer 2 may also have a second central cutout portion 2K cut from the second upper surface 2a to the second side surface 2b. In this case, the second central cutout portion 2K has a second inner wall surface 2K1 connected to the second upper surface 2a and the second side surface 2b. When viewed from the side in the first direction (x direction), the second central cutout portion 2K is located at a position overlapping with the central through conductor 2G1. In addition, the second grounding conductor G2 may also be configured to extend from the second upper surface 2a to the second inner wall surface 2K1. With such a structure, the grounding potential can be strengthened and the possibility of signal loss transmitted in each signal line can be reduced.

[0078] The first ground conductor G1 located on the first inner wall surface 11K1 may be formed as a so-called castellation structure formed by coating on the first inner wall surface 11K1, or may be formed as a so-called divided via shape filled with metal paste in the first central cutout portion 11K. In addition, the second ground conductor G2 located on the second inner wall surface 2K1 may also have the same structure as the first ground conductor G1.

[0079] In addition, if Figure 4 As shown, in one embodiment, when viewed from above, the first central cutout 11K, the second central cutout 2K, and the central through conductor 2G1 are located on any same straight line. According to such a structure, it is easy to make the grounding state of a pair of first signal lines S1 and a pair of second signal lines S2 the same, so that impedance adjustment can be easily performed.

[0080] When the wiring substrate 101 further includes a third ground conductor G3, as shown in FIG. Figure 7 to Figure 9 As shown, the third insulating layer 3 may also have a third upper surface 3a, a third side surface 3b, a third lower surface 3c, an inner side surface 3d and an inner cutout portion 3K1. The third lower surface 3c is located on the opposite side of the third upper surface 3a. The third side surface 3b connects the third upper surface 3a and the third lower surface 3c, and is located on the same plane as the second side surface 2b. The inner side surface 3d connects the third upper surface 3a and the third lower surface 3c, and includes a fourth side surface 3d1 on the opposite side of the third side surface 3b. In addition, the inner side surface 3d includes a lateral side surface 3d2 along the first direction and a corner portion 3d3 located between the lateral side surface 3d2 and the fourth side surface 3d1. As shown Fig. 9 As shown, the corner 3d3 is in an arc shape when viewed from above. The inner cutout portion 3K1 may be cut from the third upper surface 3a to the fourth side surface 3d1. The inner cutout portion 3K1 has a third inner wall surface 3K11 that is continuous with the corner 3d3 and the fourth side surface 3d1. The third ground conductor G3 may be located on the third upper surface 3a and extended from the third upper surface 3a to the third inner wall surface 3K11. With such a structure, it is possible to reduce the pressure generated at the corner 3d3 of the third insulating layer 3 when the wiring substrate 101 is miniaturized, and to strengthen the ground potential. More specifically, when the imaginary circle along the corner 3d3 is set as the imaginary circle C1, and the center line passing through the center point of the imaginary circle C1 and extending in the first direction (x direction) is set as the center line C2, when viewed from above, at least a portion of the third inner wall surface 3K11 close to the lateral side surface 3d2 is consistent with the center line C2.

[0081] In addition, the inner cutout portion 3K1 may be further cut from the fourth side surface 3d1 to the third lower surface 3c. In this case, when the third insulating layer 3 is a structure in which a plurality of insulating layers are stacked, the inner cutout portion 3K1 can be formed by performing the same punching process on each insulating layer, thereby making it easy to manufacture the wiring substrate 101.

[0082] The third ground conductor G3 on the third inner wall surface 3K11 may be formed as a so-called castellated structure by coating metal paste on the third inner wall surface 3K11, or may be formed as a divided via shape filled with metal paste in the third cutout portion 3K1.

[0083] <Method for Manufacturing Wiring Board>

[0084] Here, a method for manufacturing the wiring substrate 101 according to the embodiment of the present disclosure will be described. It should be noted that the present disclosure is not limited to the following embodiment, and for example, the wiring substrate 101 may be manufactured using a 3D printer.

[0085] (1) First, a plurality of green sheets are formed. Specifically, for example, an organic binder, a plasticizer, a solvent, etc. are added to and mixed with ceramic powders such as boron nitride, aluminum nitride, silicon nitride, silicon carbide, or beryllium oxide to obtain a mixture, and the mixture is formed into layers to produce a plurality of green sheets. Next, the plurality of green sheets are processed using a mold or the like, and a plurality of green sheets formed into the outer shapes of the first insulating layer 1 and the second insulating layer 2 when viewed from above are prepared. In addition, through holes having the outer shapes of the central through conductor 2G1, a pair of first through conductors 2S1, and a pair of second through conductors 2S2 are provided in the second insulating layer 2 using a mold or a laser or the like. In addition, in the case of forming a wiring substrate 101 having a third insulating layer 3, a green sheet formed into the outer shape of the third insulating layer 3 is also prepared. Furthermore, when the first insulating layer has the first opening 11O1 and the second opening 11O2 , the first opening 11O1 and the second opening 11O2 are provided in the green sheet to be the first insulating layer 1 using a mold or a laser.

[0086] (2) Prepare a high melting point metal powder such as tungsten or molybdenum, and add and mix an organic binder, a plasticizer or a solvent to the powder to prepare a metal paste. Next, the metal paste is printed in a predetermined pattern on a plurality of green sheets formed into the outer shapes of the first insulating layer 1, the second insulating layer 2, and the third insulating layer 3, to form a conductor layer S, a first grounding conductor G1, and a second grounding conductor G2. In addition, in order to improve the bonding strength with each insulating layer, the metal paste may also contain glass or ceramics.

[0087] (3) The through-holes formed in the second insulating layer 2 in the above step (1) are filled with metal paste to form the central through-conductor 2G1 , the pair of first through-conductors 2S1 , and the pair of second through-conductors 2S2 .

[0088] (4) A plurality of green sheets are stacked in such a manner that the outer edges of the green sheets formed into the outer shapes of the first insulating layer 1 and the second insulating layer 2 are aligned, thereby forming a green sheet stack. Alternatively, after the green sheet stack is formed, a metal paste may be printed into a predetermined pattern, and then the conductor layer S, the first ground conductor G1, the second ground conductor G2, and other wirings may be formed.

[0089] (5) The green sheet stack is fired to sinter the plurality of green sheets, thereby obtaining wiring board 101.

[0090] <Structure of electronic component mounting package>

[0091] like Figure 1 As shown, in one embodiment, electronic component mounting package 100 includes wiring substrate 101, substrate 102, and frame 103. Frame 103 is bonded to the upper surface of substrate 102, and wiring substrate 101 is fixed to frame 103. Alternatively, wiring substrate 101 may be bonded to the upper surface of substrate 102.

[0092] The substrate 102 has an upper surface. The substrate 102 is, for example, a quadrilateral in a plan view, with a size of 10 mm×10 mm to 50 mm×50 mm and a thickness of 0.5 mm to 20 mm. As the material of the substrate 102, for example, metal materials such as copper, iron, tungsten, molybdenum, nickel or cobalt, or alloys containing these metal materials can be cited. In this case, the substrate 102 can also be a metal plate or a laminated body in which a plurality of metal plates are stacked. In addition, when the material of the substrate 102 is the above-mentioned metal material, in order to reduce oxidative corrosion, a plating layer of nickel or gold or the like can be formed on the surface of the substrate 102 by electroplating or electroless plating. In addition, the material of the substrate 102 is an insulating material, for example, it can be a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body or a glass ceramic.

[0093] The frame 103 is located on the upper surface of the substrate 102 to protect the electronic components 104 located inside when viewed from above. In other words, when viewed from above, the frame 103 is located at a position surrounding the electronic components 104. Figure 1As shown, in one embodiment, the frame 103 is not located on one side of the outer edge of the upper surface of the substrate 102. That is, the outer edge of the upper surface of the substrate 102 is surrounded by the frame 103 and the wiring substrate 101. In other words, the electronic component 104 is surrounded by the frame 103 and the wiring substrate 101. In this way, the frame 103 does not have to surround the entire outer edge of the upper surface of the substrate 102. In addition, in one embodiment, the frame 103 is arranged along the outer edge of the upper surface of the substrate 102, but the frame 103 may also be located at a position closer to the inner side than the outer edge of the upper surface of the substrate 102.

[0094] The material of the frame 103 can be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel or cobalt, or an alloy containing these metal materials. In addition, the material of the frame 103 can be an insulating material, for example, a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body or a glass ceramic.

[0095] The frame body 103 can be bonded to the substrate 102 by solder or the like. It should be noted that the material of the solder is, for example, silver, copper, gold, aluminum or magnesium, and may contain additives such as nickel, cadmium or phosphorus.

[0096] <Structure of electronic module>

[0097] like Figure 1 As shown, the electronic module 10 includes an electronic component mounting package 100, an electronic component 104, and a cover 106. The electronic module 10 may also include a sealing ring 105.

[0098] The electronic component 104 may be a component that processes signals, such as converting an optical signal into an electric signal or converting an electric signal into an optical signal. The electronic component 104 is located on the upper surface of the substrate 102 and is accommodated in the electronic component mounting package 100 .

[0099] Examples of the electronic component 104 include optical semiconductor elements such as semiconductor lasers (LD) and photodiodes (PD), semiconductor integrated circuit elements, and sensor elements such as optical sensors. The electronic component 104 can be formed of a semiconductor material such as gallium arsenide or gallium nitride.

[0100] The cover 106 is located on the frame 103 in a manner that covers the interior of the package 100 for mounting electronic components, and protects the electronic components 104 together with the frame 103. The cover 106 is, for example, a quadrilateral shape when viewed from above, with a size of 10 mm×10 mm to 50 mm×50 mm, and a thickness of 0.5 mm to 2 mm. As the material of the cover 106, for example, metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum or tungsten, or alloys combining multiple types of these metal materials, etc. can be cited. By subjecting such a blank of a metal material to a metal processing method such as a rolling method or a punching method, a metal component constituting the cover 106 can be manufactured.

[0101] The sealing ring 105 has the function of bonding the cover 106 to the frame 103. The sealing ring 105 is located on the frame 103 and surrounds the electronic component 104 in a plan view. As the material of the sealing ring 105, for example, metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum or tungsten, or alloys combining a plurality of these metal materials, etc. can be cited. In addition, when the sealing ring 105 is not provided on the frame 103, the cover 106 can also be bonded by bonding materials such as solder, brazing material, glass or resin adhesive materials.

[0102] In addition, various combinations of characteristic parts in one embodiment are not limited to the examples of the above-mentioned embodiment. In addition, each embodiment can also be combined with each other.

[0103] Industrial Applicability

[0104] The present disclosure can be utilized as a wiring board, an electronic component mounting package using the wiring board, and an electronic module.

[0105] Description of reference numerals:

[0106] 1 First insulation layer

[0107] 1a First upper surface

[0108] 1b First side

[0109] 11. Protrusion

[0110] 11a Page 1

[0111] 11O1 First opening

[0112] 11O2 Second opening

[0113] 11K First central cutout

[0114] 11K1 First inner wall

[0115] 2 Second insulation layer

[0116] 2a Second upper surface

[0117] 2b Second side

[0118] 2c Second lower surface

[0119] 2S1a~b A pair of first through conductors

[0120] 2S2a~b A pair of second through conductors

[0121] 2G1 Central through conductor

[0122] 2K Second central cutout

[0123] 2K1 Second inner wall

[0124] 3 Third insulation layer

[0125] 3a Third upper surface

[0126] 3b Third side

[0127] 3c Third lower surface

[0128] 3d inner side

[0129] 3d1 Fourth side

[0130] 3d2 Horizontal side

[0131] 3d3 Corner

[0132] 3K1 Medial incision

[0133] 3K11 Third inner wall

[0134] 3G3 Third through conductor

[0135] 3G4 Fourth through conductor

[0136] C1 Imaginary circle

[0137] C2 Centerline

[0138] S Conductor layer

[0139] S1 A pair of first signal lines

[0140] S11 First Line Department

[0141] S12 First connection

[0142] WS11 Width of the first line section

[0143] WS12 Width of the first connection

[0144] S2 A pair of second signal lines

[0145] S21 Second Line Department

[0146] S22 Second connection

[0147] WS21 Width of the second line section

[0148] WS22 Width of the second connection

[0149] S3 First layer signal conductor

[0150] S4 Second layer signal conductor

[0151] G1 First grounding conductor

[0152] G2 Second grounding conductor

[0153] O1a~b ​​A pair of first openings

[0154] O2a~b A pair of second openings

[0155] O3 A pair of third openings

[0156] O4 A pair of fourth openings

[0157] G3 Third grounding conductor

[0158] L1 Distance between the central through conductor and the first through conductor adjacent to it

[0159] L2 Distance between the central through conductor and the adjacent second through conductor

[0160] L3 Distance between the central through conductor and the third through conductor

[0161] L4 Distance between the central through conductor and the fourth through conductor

[0162] OL1 Dimensions of the first opening

[0163] OL2 Second opening dimensions

[0164] OL3 Dimensions of the third opening

[0165] OL4 Size of the fourth opening

[0166] 10 Electronic modules

[0167] 100 Package for mounting electronic components

[0168] 101 Wiring substrate

[0169] 102 substrate

[0170] 103 Frame

[0171] 104 Electronic components

[0172] 105 Sealing ring

[0173] 106 Cover

Claims

1. A wiring substrate, wherein: have: A first insulating layer having a first upper surface and a first side surface connected to the first upper surface; A second insulating layer, located on the first insulating layer, having a second upper surface, a second lower surface opposite to the second upper surface, and a second side surface connecting the second upper surface and the second lower surface; A conductor layer, located on the first upper surface, having a pair of first signal lines and a pair of second signal lines that transmit differential signals respectively and extend in a first direction; a first ground conductor, located on the first upper surface and spaced apart from the pair of first signal lines and the pair of second signal lines and located between the pair of first signal lines and the pair of second signal lines; as well as a second grounding conductor, located on the second upper surface, having a pair of first openings and a pair of second openings arranged side by side with the pair of first openings; The pair of second signal lines are arranged in parallel with the pair of first signal lines, The second insulating layer has a pair of first through conductors, a pair of second through conductors, and one or more central through conductors, each of which penetrates from the second upper surface to the second lower surface. The pair of first through conductors are located in the pair of first openings and are electrically connected to the pair of first signal lines. The pair of second through conductors are located in the pair of second openings and are electrically connected to the pair of second signal lines. The central through-conductor is located between the pair of first openings and the pair of second openings, and is electrically connected to the first grounding conductor and the second grounding conductor, and the central through-conductor is a grounding through-conductor close to the first through-conductor in a second direction intersecting the first direction, and is a grounding through-conductor close to the second through-conductor in the second direction intersecting the first direction.

2. The wiring substrate according to claim 1, wherein: The wiring substrate has a third insulating layer located on the second upper surface, The third insulating layer has a third through conductor and a fourth through conductor that respectively penetrate the third insulating layer and are electrically connected to the second ground conductor. The third through conductor is located between the pair of first openings, The fourth through conductor is located between the pair of second openings, In the second direction, The third through conductor is a grounding through conductor close to each of the pair of first through conductors. The fourth through conductor is a grounding through conductor that is close to each of the pair of second through conductors.

3. The wiring substrate according to claim 1 or 2, wherein: The pair of first openings and the pair of second openings are circular in a plan view.

4. The wiring substrate according to claim 2 or 3, wherein: The third through conductor, the fourth through conductor, and the central through conductor are arranged side by side on a straight line in the second direction.

5. The wiring substrate according to any one of claims 2 to 4, wherein: The pair of first through conductors, the pair of second through conductors, the third through conductor, the fourth through conductor, and the central through conductor are arranged side by side on a straight line in the second direction.

6. The wiring substrate according to any one of claims 2 to 5, wherein: When a distance between the third through conductor and the central through conductor along the second direction is L3 and a distance between the fourth through conductor and the central through conductor along the second direction is L4 in a plan view, L3=L4 is satisfied.

7. The wiring substrate according to any one of claims 1 to 6, wherein: The second ground conductor has a pair of third openings located at positions overlapping the pair of first signal lines and a pair of fourth openings located at positions overlapping the pair of second signal lines in a plan view.

8. The wiring substrate according to claim 7, wherein: In the second direction, when the size of the pair of first openings is set to OL1, the size of the pair of second openings is set to OL2, the size of the pair of third openings is set to OL3, and the size of the pair of fourth openings is set to OL4, OL1≥OL3 and OL2≥OL4 are satisfied.

9. The wiring substrate according to any one of claims 1 to 8, wherein: The first insulating layer has a protrusion, which extends outward from the second side surface of the second insulating layer along the first direction when viewed from above, and includes the first side surface. The protrusion has a first surface extending from the second side surface of the second insulating layer in the first upper surface of the first insulating layer toward the first direction, and a first opening and a second opening opened on the first surface. The pair of first signal lines and the pair of second signal lines are arranged extending on the first surface of the protruding portion, The first opening is located between the pair of first signal lines. The second opening is located between the pair of second signal lines.

10. The wiring substrate according to claim 9, wherein: When looking down, The pair of first signal lines respectively include a first connection portion and a first line portion extending inwardly from the first connection portion along the first direction. The pair of second signal lines respectively include a second connection portion and a second line portion extending inwardly from the second connection portion along the first direction. The first opening portion is located between a pair of the first line portions, The second opening portion is located between a pair of the second line portions, In the second direction, a dimension of the first line portion is shorter than a dimension of the first connecting portion, and a dimension of the second line portion is shorter than a dimension of the second connecting portion.

11. The wiring substrate according to claim 9 or 10, wherein: The protrusion has a first central cutout portion cut from the first surface to the first side surface, The first central cutout portion has a first inner wall surface connected to the first surface and the first side surface, and is located at a position overlapping with the central through conductor when viewed from the side in the first direction. The first ground conductor is arranged to extend from the first surface to the first inner wall surface.

12. The wiring substrate according to any one of claims 1 to 11, wherein: The second insulating layer has a second central cutout portion cut out from the second upper surface to the second side surface. The second central cutout portion has a second inner wall surface connected to the second upper surface and the second side surface, and is located at a position overlapping with the central through conductor when viewed from the side in the first direction. The second ground conductor is arranged to extend from the second upper surface to the second inner wall surface.

13. The wiring substrate according to any one of claims 2 to 12, wherein: The wiring substrate further includes a third ground conductor. The third insulating layer comprises: a third upper surface; a third lower surface on the opposite side of the third upper surface; a third side surface connecting the third upper surface and the third lower surface and being located on the same plane as the second side surface; an inner side surface connecting the third upper surface and the third lower surface and including a fourth side surface on the opposite side of the third side surface; and an inner cutout portion cut from the third upper surface to the fourth side surface. The inner side surface includes a lateral side surface along the first direction and a corner portion between the lateral side surface and the fourth side surface, The corner is in an arc shape when viewed from above. The inner cutout portion has a third inner wall surface continuous with the corner portion and the fourth side surface, The third ground conductor is located on the third upper surface and is arranged to extend from the third upper surface to the third inner wall surface.

14. A package for mounting an electronic component, wherein: have: substrate; a frame body, joined to the upper surface of the substrate; and The wiring board according to any one of claims 1 to 13 fixed to the frame.

15. An electronic module, wherein: have: The electronic component mounting package according to claim 14; an electronic component located on the upper surface of the substrate and electrically connected to the wiring substrate of the electronic component mounting package; as well as The cover body is located on the frame body and is located at a position covering the inside of the electronic component mounting package.

Images