A polishing device for circuit board processing

Abstract

The present invention relates to the technical field of circuit board processing, and discloses a polishing device for circuit board processing, comprising a workbench, both sides of the workbench are fixedly connected with side support plates, the sides of the side support plates are movably connected with polishing mechanisms, the top of the polishing mechanism is movably connected with a clamping mechanism, the top of the clamping mechanism is placed with a circuit board to be processed, and the side of the side support plate away from the polishing mechanism is fixedly connected with a cleaning mechanism; the servo motor of the present invention moves the movable table by rotating a screw rod, and sends it to the bottom of a polishing assembly for polishing, when the movable table moves, the first bevel gear is driven to move on the side of the fixed screw rod through a connecting tube, the fixed screw rod is fixed, so the first bevel gear will rotate, when the first bevel gear rotates, the Z-type connecting rod rotates, and then the movable frame drives the clamping mechanism to reciprocate on both sides of the moving direction, so that the circuit board to be processed reciprocates when it is sent to the bottom of the polishing assembly, and the polishing is more uniform.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and more specifically to a polishing device for circuit board processing. Background Art

[0002] Circuit board is also called circuit board or printed circuit board, abbreviated as PCB in English. Circuit board is an indispensable component of electronic equipment. Circuit board is the support of electronic components and also the carrier of electrical connection of electronic components. Circuit board prints the circuit design on the board through electronic printing technology, so that each electronic component can be connected to each other through wires to realize specific circuit functions.

[0003] Circuit board polishing is an indispensable process in the production process of circuit boards. Polishing can remove burrs, unevenness and other defects on the surface of circuit boards, making the surface of circuit boards flatter and smoother, and can improve the conductivity and insulation properties of circuit boards. Circuit board polishing can also reduce oxidation and pollution on the surface of circuit boards, and extend the service life of circuit boards. Circuit board polishing is one of the important processes to ensure the quality and performance of circuit boards;

[0004] Nowadays, when a circuit board is polished, the circuit board is placed under a polishing mechanism and moved under the grinding wheel of the polishing mechanism to complete the polishing mechanism. However, the polishing effect of the circuit board when being polished by the polishing mechanism is limited, and it is impossible to polish all parts of the circuit board evenly. When the circuit board is moved under the polishing mechanism during polishing, the circuit board may shift. If the circuit board shifts, it cannot be guaranteed that all parts of the circuit board are polished. If the circuit board is greatly displaced, there is a possibility that the circuit board will fly out, which will cause danger to the staff.

[0005] When the circuit board is being polished, scraps generated by polishing will remain on the surface of the circuit board. In addition, if there are impurities on the surface of the circuit board before polishing, it will also have an adverse effect on the polishing process. Summary of the invention

[0006] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a polishing device for processing a circuit board to solve the technical problems raised in the background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a polishing device for processing a circuit board, comprising a workbench, both sides of the workbench are fixedly connected with side support plates, the middle part of the side of the side support plate is fixedly connected with a polishing assembly, the side of the polishing assembly is provided with a liquid adding assembly, the side of the side support plate is movably connected with a polishing mechanism, the top of the polishing mechanism is movably connected with a clamping mechanism, the top of the clamping mechanism is placed with a circuit board to be processed, and the side of the side support plate away from the polishing mechanism is fixedly connected with a cleaning mechanism;

[0008] The polishing mechanism includes a servo motor for providing power, a rotating screw is fixedly connected to the side of the servo motor, a movable platform is threadedly connected to the side of the rotating screw, a connecting cylinder is movably connected to the inside of the movable platform away from the rotating screw, a first bevel gear is fixedly connected to the side of the connecting cylinder, a fixed screw is threadedly connected to the inside of the first bevel gear, a second bevel gear is meshed with the top end of the first bevel gear, a Z-shaped connecting rod is fixedly connected to the top end of the second bevel gear, a movable frame is movably connected to the top end of the Z-shaped connecting rod, the Z-shaped connecting rod rotates in the movable frame, and the top end of the movable frame is fixedly connected to the bottom end of the clamping mechanism.

[0009] In a preferred embodiment, the liquid adding component adds polishing liquid to the circuit board to be processed, and the liquid adding component is located above the circuit board to be processed before polishing, the vacuum position of the cleaning mechanism is respectively located before and after polishing of the circuit board to be processed, and after the cleaning mechanism vacuums the top of the circuit board to be processed, the liquid adding component adds polishing liquid.

[0010] In a preferred embodiment, both sides of the fixed screw are fixedly connected to the side surfaces of the side support plate. When the first bevel gear moves on the side surface of the fixed screw, the first bevel gear drives the connecting cylinder to rotate, and a limiting groove is provided inside the movable platform for the connecting cylinder to rotate smoothly.

[0011] In a preferred embodiment, the bottom end of the clamping mechanism is fixedly connected to a sliding plate, the sliding plate is internally movably connected to a limiting rod, a sliding groove is provided inside the moving platform for the sliding plate to slide, both sides of the limiting rod are fixedly connected to the inside of the sliding groove in the moving platform, and the bottom end of the sliding plate is arc-shaped.

[0012] In a preferred embodiment, the clamping mechanism includes a reciprocating table that moves back and forth, and both sides of the top of the reciprocating table are fixedly connected with fixed blocks, a avoidance groove is opened inside the reciprocating table, and limit grooves are opened on both sides of the avoidance groove, one side inside the avoidance groove is fixedly connected with an electromagnet, and a magnetic block is provided on the side of the electromagnet, and connecting plates are movably connected on both sides of the magnetic block, and the sides of the two connecting plates away from the electromagnet are movably connected with sliding blocks, and the top of the sliding block is fixedly connected with a clamping block.

[0013] In a preferred embodiment, the sliding block is located inside the limiting groove, the side of the electromagnet is fixedly connected to a fixing rod, the side of the fixing rod away from the electromagnet is fixedly connected to a fixed top plate, and a limiting hole matching the fixing rod is opened inside the magnetic block, and the thickness of the fixing block and the clamping block is half the thickness of the polishing assembly.

[0014] In a preferred embodiment, the cleaning mechanism includes a blade group that rotates with the rotating screw, a collecting cylinder is provided on the side of the blade group, the side of the collecting cylinder is fixedly connected to the side of the side support plate, the side of the collecting cylinder away from the side support plate is fixedly connected to a discharge pipe, the top of the collecting cylinder is fixedly connected to the collecting cylinder, the side of the collecting cylinder away from the collecting cylinder is fixedly connected to a first branch pipe, and the side of the first branch pipe away from the gas main pipe is fixedly connected to a second branch pipe.

[0015] In a preferred embodiment, a filter plate is fixedly connected to the interior of the collecting cylinder, the filter plate is located on the side of the blade group away from the discharge pipe, and the gas main pipe can rotate inside the filter plate, the first branch pipe is located above the circuit board to be processed after polishing, and the second branch pipe is located above the circuit board to be processed before polishing.

[0016] Technical effects and advantages of the present invention:

[0017] 1. The servo motor of the present invention moves the moving platform by rotating the screw rod, and sends the circuit board to be processed to the bottom of the polishing assembly for polishing. When the moving platform moves, the first bevel gear is driven to move on the side of the fixed screw rod through the connecting tube. The fixed screw rod is fixed, so the first bevel gear will rotate. When the first bevel gear rotates, the Z-shaped connecting rod rotates, and then the moving frame drives the clamping mechanism to reciprocate on both sides of the moving direction, so that the circuit board to be processed reciprocates when it is sent to the bottom of the polishing assembly, and the polishing is more uniform;

[0018] 2. The present invention is provided with an electromagnet, a magnetic block, and a clamping block. The circuit board to be processed is placed between the fixed block and the clamping block. When the clamping mechanism is feeding, the electromagnet is positively energized and generates a magnetic repulsion force between the magnetic block. At this time, the magnetic block moves and causes the connecting plate to rotate. When the connecting plate rotates, the clamping block located in the limit groove drives the clamping block to move toward the fixed block, and the clamping block drives the circuit board to be processed to move toward the fixed block, so that the circuit board to be processed is automatically fixed;

[0019] 3. When the rotating screw of the present invention rotates, the blade group is driven to rotate. When the blade group rotates, air is extracted in the collecting tube, and the gas is discharged from the discharge pipe. Therefore, the first branch pipe and the second branch pipe will both extract air. The second branch pipe will extract impurities on the surface of the circuit board to be processed before polishing, and the first branch pipe will extract impurities after polishing, thereby improving the polishing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall front structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the overall back structure of the present invention.

[0022] Figure 3 It is a schematic diagram of the polishing mechanism structure of the present invention.

[0023] Figure 4 It is a schematic diagram of the exploded structure of the polishing mechanism of the present invention.

[0024] Figure 5 It is a schematic diagram of the structure of the first bevel gear and the connecting cylinder of the present invention.

[0025] Figure 6 It is a schematic diagram of the structure of the clamping mechanism of the present invention.

[0026] Figure 7 It is a schematic diagram of the exploded structure of the clamping mechanism of the present invention.

[0027] Figure 8 It is a schematic diagram of the cleaning mechanism structure of the present invention.

[0028] The reference numerals are: 1, workbench; 2, side support plate; 3, polishing assembly; 4, liquid adding assembly; 5, polishing mechanism; 501, servo motor; 502, rotating screw; 503, moving platform; 504, fixed screw; 505, first bevel gear; 506, connecting cylinder; 507, second bevel gear; 508, Z-type connecting rod; 509, moving frame; 510, sliding plate; 511, limit rod; 6, clamping mechanism; 601, reciprocating platform; 602 , fixed block; 603, electromagnet; 604, magnetic block; 605, connecting plate; 606, sliding block; 607, clamping block; 608, fixed rod; 609, fixed top plate; 610, avoidance groove; 611, limit groove; 7, cleaning mechanism; 701, blade group; 702, collecting cylinder; 703, discharge pipe; 704, filter plate; 705, gas main pipe; 706, first branch pipe; 707, second branch pipe; 8, circuit board to be processed. DETAILED DESCRIPTION

[0029] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures recorded in the following embodiments are merely illustrative. The polishing device for circuit board processing involved in the present invention is not limited to the various structures recorded in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0030] Reference Figure 1 and Figure 2 The present invention provides a polishing device for processing a circuit board, comprising a workbench 1, side support plates 2 are fixedly connected to both sides of the workbench 1, a polishing assembly 3 is fixedly connected to the middle of the side of the side support plate 2, a liquid adding assembly 4 is arranged on the side of the polishing assembly 3, a polishing mechanism 5 is movably connected to the side of the side support plate 2, a clamping mechanism 6 is movably connected to the top of the polishing mechanism 5, a circuit board 8 to be processed is placed on the top of the clamping mechanism 6, a cleaning mechanism 7 is fixedly connected to the side of the side support plate 2 away from the polishing mechanism 5, the liquid adding assembly 4 adds polishing liquid to the circuit board 8 to be processed, and the liquid adding assembly 4 is located above the circuit board 8 to be processed when it is not polished, the exhaust positions of the cleaning mechanism 7 are respectively located before and after the polishing of the circuit board 8 to be processed, and after the cleaning mechanism 7 exhausts air above the circuit board 8 to be processed, the liquid adding assembly 4 adds polishing liquid.

[0031] In the embodiment of the present application, before the circuit board 8 to be processed is polished, it will be evacuated through the cleaning mechanism 7 to absorb various impurities. After the impurities are extracted, the liquid adding component 4 will add polishing liquid to avoid adding polishing liquid first, so that the impurities on the surface of the circuit board 8 to be processed cannot be evacuated.

[0032] Reference Figure 3 , Figure 4 as well as Figure 5 The polishing mechanism 5 includes a servo motor 501 for providing power, a rotating screw 502 is fixedly connected to the side of the servo motor 501, a moving platform 503 is threadedly connected to the side of the rotating screw 502, and the moving platform 503 is movably connected to the inside of the moving platform 503 away from the rotating screw 502, a first bevel gear 505 is fixedly connected to the side of the connecting cylinder 506, and a fixed screw 504 is threadedly connected to the inside of the first bevel gear 505, and a second bevel gear 507 is meshed at the top of the first bevel gear 505, and a Z-type connecting rod 508 is fixedly connected to the top of the second bevel gear 507, and a moving frame 509 is movably connected to the top of the Z-type connecting rod 508, and the Z-type connecting rod 508 rotates in the moving frame 509, and the moving frame 509 is moved. The top of the movable frame 509 is fixedly connected to the bottom end of the clamping mechanism 6, and the two sides of the fixed screw 504 are fixedly connected to the side surfaces of the side support plate 2. When the first bevel gear 505 moves on the side of the fixed screw 504, the first bevel gear 505 drives the connecting tube 506 to rotate, and a limiting slide groove is provided inside the movable platform 503 for the connecting tube 506 to rotate smoothly. The bottom end of the clamping mechanism 6 is fixedly connected to a sliding plate 510, and the sliding plate 510 is internally movably connected with a limiting rod 511. The interior of the movable platform 503 is provided with a slide groove for the sliding plate 510 to slide. The two sides of the limiting rod 511 are fixedly connected to the inside of the slide groove in the movable platform 503, and the bottom end of the sliding plate 510 is arc-shaped.

[0033] In the embodiment of the present application, when the moving platform 503 moves, since the position of the fixed screw 504 is fixed, the fixed screw 504 will not rotate, and the moving platform 503 will drive the connecting tube 506 to move, and the connecting tube 506 and the first bevel gear 505 will rotate when the side of the fixed screw 504 moves, and at this time, the Z-type connecting rod 508 will rotate in the moving frame 509, and when the Z-type connecting rod 508 rotates in the moving frame 509, the moving frame 509 will reciprocate, thereby causing the clamping mechanism 6 to reciprocate. During polishing, the circuit board 8 to be processed moves back and forth when it moves under the polishing assembly 3, so that the circuit board 8 to be processed will be polished at different positions, improving the polishing effect, and when the clamping mechanism 6 moves back and forth, the clamping mechanism 6 drives the sliding plate 510 below to slide in the moving table 503, and the bottom end of the sliding plate 510 is arc-shaped, so that the friction force of the sliding plate 510 when sliding is smaller, and the sliding process is smoother. The position of the sliding plate 510 is fixed by the limit rod 511, which improves the stability of the clamping mechanism 6 when it moves back and forth.

[0034] Reference Figure 6 and Figure 7The clamping mechanism 6 includes a reciprocating table 601 for reciprocating movement, both sides of the top of the reciprocating table 601 are fixedly connected with fixed blocks 602, an avoidance groove 610 is provided inside the reciprocating table 601, and both sides of the avoidance groove 610 are provided with limit grooves 611, an electromagnet 603 is fixedly connected to one side of the avoidance groove 610, a magnetic block 604 is provided on the side of the electromagnet 603, and connecting plates 605 are movably connected to both sides of the magnetic block 604, and the two connecting plates 605 are away from the electromagnet 603. The sides are movably connected with sliding blocks 606, the top of the sliding blocks 606 is fixedly connected with a clamping block 607, the sliding blocks 606 are located inside the limiting groove 611, the sides of the electromagnet 603 are fixedly connected with a fixing rod 608, the side of the fixing rod 608 away from the electromagnet 603 is fixedly connected with a fixed top plate 609, a limiting hole matched with the fixing rod 608 is provided inside the magnetic block 604, the thickness of the fixing block 602 and the clamping block 607 is half the thickness of the polishing component 3.

[0035] In the embodiment of the present application, when the electromagnet 603 is energized in the positive direction and a magnetic repulsion force is generated between the magnetic block 604, the magnetic block 604 moves away from the electromagnet 603, causing the sliding block 606 to move and the clamping block 607 to move toward the fixed block 602. When the clamping block 607 moves toward the fixed block 602, it drives the circuit board 8 to be processed to move toward the fixed block 602. The clamping block 607 and the fixed block 602 clamp and fix the two circuit boards 8 to be processed. When the magnetic block 604 moves, the fixed rod 608 can limit the position of the magnetic block 604, so that the magnetic block 604 moves more smoothly. The bottom end of the clamping block 607 contacts the top end of the reciprocating table 601, and the thickness of the fixed block 602 and the clamping block 607 is half the thickness of the polishing component 3. When the polishing component 3 is clamped, it will not affect the polishing work of the polishing component 3.

[0036] Reference Figure 2 and Figure 8 The cleaning mechanism 7 includes a blade group 701 that rotates with the rotating screw 502, a collecting tube 702 is provided on the side of the blade group 701, and the side of the collecting tube 702 is fixedly connected to the side of the side support plate 2, and the side of the collecting tube 702 away from the side support plate 2 is fixedly connected to the discharge pipe 703, the top of the collecting tube 702 is fixedly connected to the collecting tube 702, and the side of the collecting tube 702 away from the collecting tube 702 is fixedly connected to the first branch pipe 706, and the side of the first branch pipe 706 away from the gas main pipe 705 is fixedly connected to the second branch pipe 707, and the inside of the collecting tube 702 is fixedly connected to a filter plate 704, the filter plate 704 is located on the side of the blade group 701 away from the discharge pipe 703, and the gas main pipe 705 can rotate inside the filter plate 704, the first branch pipe 706 is located above the circuit board 8 to be processed after grinding, and the second branch pipe 707 is located above the circuit board 8 to be processed before grinding.

[0037] In the embodiment of the present application, when the rotating screw 502 rotates, it will drive the blade group 701 to rotate. At this time, the blade group 701 will draw air in the collecting tube 702. When the collecting tube 702 is drawing air, the second branch pipe 707 and the first branch pipe 706 will draw air. When the second branch pipe 707 draws air, it will draw out the impurities of the circuit board 8 to be processed before polishing. When the first branch pipe 706 draws air, it will draw out the waste chips after polishing. The drawn impurities and waste chips are blocked by the filter plate 704, and the waste chips will not affect the blade group 701, so that the blade group 701 can be used for a long time, and the gas filtered by the filter plate 704 will be discharged through the exhaust pipe 703.

[0038] The working principle of the present invention is as follows: before polishing, the circuit board 8 to be processed is placed above the reciprocating table 601, and the circuit board 8 to be processed is located between the fixed block 602 and the clamping block 607. After the circuit board 8 to be processed is placed, the electromagnet 603 is energized in the positive direction to generate a magnetic repulsion force between the electromagnet 603 and the magnetic block 604. At this time, the magnetic block 604 moves away from the electromagnet 603. When the magnetic block 604 moves, the connecting plate 605 rotates and the sliding block 606 moves in the limiting groove 611. When the sliding block 606 moves, it drives the clamping block 607 to move toward the fixed block 602. When the clamping block 607 moves toward the fixed block 602, it drives the circuit board 8 to be processed to move toward the fixed block 602. The clamping block 607 and the fixed block 602 clamp and fix the circuit board 8 to be processed;

[0039] When the circuit board 8 to be processed is fixed, the servo motor 501 is started and drives the rotating screw 502 to rotate. The rotating screw 502 rotates so that the movable table 503 drives the clamping mechanism 6 to move to the bottom of the polishing assembly 3. Before reaching the polishing assembly 3, the liquid adding assembly 4 will add polishing liquid to the circuit board 8 to be processed. When the movable table 503 moves, it drives the first bevel gear 505 to move through the connecting tube 506. The fixed screw 504 is fixed by the side support plate 2 and cannot rotate. Therefore, when the first bevel gear 505 moves on the side of the fixed screw 504, it will rotate. When the first bevel gear 505 rotates, the Z-type connecting rod 508 rotates in the moving frame 509 through 407. When the Z-type connecting rod 508 rotates, the moving frame 509 drives the reciprocating table 601 to reciprocate on both sides of the moving direction. When the circuit board 8 to be processed moves to the bottom of the polishing assembly 3 for polishing, it will reciprocate to improve the polishing effect.

[0040] When the rotating screw 502 rotates, it drives the blade group 701 to rotate. When the blade group 701 rotates, it draws air in the collecting tube 702. Therefore, the gas in the collecting tube 702 is discharged from the discharge pipe 703. When the collecting tube 702 draws air, the second branch pipe 707 and the first branch pipe 706 draw air. When the second branch pipe 707 draws air, it draws out the impurities before polishing of the circuit board 8 to be processed. When the first branch pipe 706 draws air, it draws out the waste chips after polishing. The drawn impurities and waste chips are blocked by the filter plate 704.

[0041] When the polishing assembly 3 polishes the circuit board 8 to be processed, the servo motor 501 controls the rotating screw 502 to reverse, and the circuit board 8 to be processed will pass through the bottom of the polishing assembly 3 again and move back to its original position. At this time, it will be polished again. The second branch pipe 707 can be used to remove waste chips during polishing. After the circuit board 8 to be processed moves back to its original position, the magnetic block 604 is reversely energized and a magnetic attraction is generated between the magnetic block 604. At this time, the magnetic block 604 moves toward the electromagnet 603, and the clamping block 607 moves away from the fixed block 602, thereby loosening the circuit board 8 to be processed. At this time, the circuit board 8 to be processed can be turned over, or a new circuit board 8 to be processed can be placed.

[0042] Finally: The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A polishing device for processing a circuit board, comprising a workbench (1), characterized in that: The workbench (1) is fixedly connected to side support plates (2) on both sides, a polishing assembly (3) is fixedly connected to the middle of the side of the side support plate (2), a liquid adding assembly (4) is provided on the side of the polishing assembly (3), a polishing mechanism (5) is movably connected to the side of the side support plate (2), a clamping mechanism (6) is movably connected to the top of the polishing mechanism (5), a circuit board (8) to be processed is placed on the top of the clamping mechanism (6), and a cleaning mechanism (7) is fixedly connected to the side of the side support plate (2) away from the polishing mechanism (5); The polishing mechanism (5) comprises a servo motor (501) for providing power, a rotating screw (502) is fixedly connected to the side of the servo motor (501), a movable platform (503) is threadedly connected to the side of the rotating screw (502), a connecting cylinder (506) is movably connected to the inside of the movable platform (503) away from the rotating screw (502), a first bevel gear (505) is fixedly connected to the side of the connecting cylinder (506), and the first bevel gear (505) is fixedly connected to the side of the first bevel gear (505). 5) is connected to a fixed screw (504) through an internal thread, the top end of the first bevel gear (505) is meshed with a second bevel gear (507), the top end of the second bevel gear (507) is fixedly connected to a Z-shaped connecting rod (508), the top end of the Z-shaped connecting rod (508) is movably connected to a moving frame (509), the Z-shaped connecting rod (508) rotates in the moving frame (509), and the top end of the moving frame (509) is fixedly connected to the bottom end of the clamping mechanism (6); Both sides of the fixed screw (504) are fixedly connected to the side of the side support plate (2); when the first bevel gear (505) moves on the side of the fixed screw (504), the first bevel gear (505) drives the connecting cylinder (506) to rotate, and a limiting sliding groove is provided inside the movable platform (503) for allowing the connecting cylinder (506) to rotate smoothly; The bottom end of the clamping mechanism (6) is fixedly connected to a sliding plate (510), the sliding plate (510) is movably connected to a limiting rod (511) inside, a sliding groove for the sliding plate (510) to slide is provided inside the moving platform (503), both sides of the limiting rod (511) are fixedly connected to the inside of the sliding groove in the moving platform (503), and the bottom end of the sliding plate (510) is arc-shaped.

2. A polishing device for circuit board processing according to claim 1, characterized in that: The liquid adding component (4) adds polishing liquid to the circuit board (8) to be processed, and the liquid adding component (4) is located above the circuit board (8) to be processed before polishing. The exhaust position of the cleaning mechanism (7) is respectively located before and after polishing of the circuit board (8) to be processed, and after the cleaning mechanism (7) exhausts air above the circuit board (8) to be processed, the liquid adding component (4) adds polishing liquid.

3. A polishing device for circuit board processing according to claim 1, characterized in that: The clamping mechanism (6) comprises a reciprocating table (601) that moves back and forth, both sides of the top of the reciprocating table (601) are fixedly connected with fixed blocks (602), a avoidance groove (610) is provided inside the reciprocating table (601), both sides of the avoidance groove (610) are provided with limit grooves (611), one side of the avoidance groove (610) is fixedly connected with an electromagnet (603), a side of the electromagnet (603) is provided with a magnetic block (604), both sides of the magnetic block (604) are movably connected with connecting plates (605), the sides of the two connecting plates (605) away from the electromagnet (603) are movably connected with sliding blocks (606), and the top of the sliding block (606) is fixedly connected with a clamping block (607).

4. A polishing device for circuit board processing according to claim 3, characterized in that: The sliding block (606) is located inside the limiting groove (611); a fixing rod (608) is fixedly connected to the side of the electromagnet (603); a fixing top plate (609) is fixedly connected to the side of the fixing rod (608) away from the electromagnet (603); a limiting hole matching the fixing rod (608) is provided inside the magnetic block (604); and the thickness of the fixing block (602) and the clamping block (607) is half the thickness of the polishing assembly (3).

5. A polishing device for circuit board processing according to claim 1, characterized in that: The cleaning mechanism (7) comprises a blade group (701) that rotates along with the rotating screw (502); a collecting tube (702) is provided on the side of the blade group (701); the side of the collecting tube (702) is fixedly connected to the side of the side support plate (2); the side of the collecting tube (702) away from the side support plate (2) is fixedly connected to a discharge pipe (703); the top of the collecting tube (702) is fixedly connected to the collecting tube (702); the side of the collecting tube (702) away from the collecting tube (702) is fixedly connected to a first branch pipe (706); and the side of the first branch pipe (706) away from the gas main pipe (705) is fixedly connected to a second branch pipe (707).

6. A polishing device for circuit board processing according to claim 5, characterized in that: A filter plate (704) is fixedly connected to the interior of the collecting tube (702), and the filter plate (704) is located on the side of the blade group (701) away from the discharge pipe (703), and the gas main pipe (705) can rotate inside the filter plate (704), the first branch pipe (706) is located above the circuit board (8) to be processed after polishing, and the second branch pipe (707) is located above the circuit board (8) to be processed before polishing.

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