Cleaning device and semiconductor equipment

Abstract

The invention relates to a cleaning device and semiconductor equipment. The cleaning device can be used for cleaning a eutectic head of the semiconductor equipment. The cleaning device comprises a cleaning table, a grinding part, a sweeping part and a driving mechanism. The grinding part and the sweeping part are both arranged on the cleaning table, the driving mechanism is connected with the cleaning table and used for driving the cleaning table to move to a waiting position and a working position, the cleaning table is located below the eutectic head at the working position, the grinding part is used for grinding the eutectic head, and the sweeping part is used for sweeping the eutectic head. And the sweeping part is used for sweeping the eutectic head.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a cleaning device and semiconductor equipment. Background Art

[0002] With the continuous development of semiconductor technology, chip manufacturing processes are also constantly improving. COF (Chip On Film) is an important packaging technology. It is widely used in display driver chips, sensors and other fields due to its advantages such as high density, lightness, and flexibility. In the COF production process, the die bonder head is a key component used to solder the IC (integrated circuit) chip to the COF by hot pressing. Due to the high operating frequency of the equipment, it usually completes the die bonding of a product every 1.5 seconds on average. Therefore, the die bonder head needs to be maintained regularly during the production process to ensure the cleanliness of the working area where it adsorbs the IC to avoid dust, particles and foreign matter affecting the die bonding accuracy.

[0003] However, the conventional technical solution has the problems of low cleaning efficiency and unsatisfactory cleaning effect when cleaning the die bonding head.

[0004] BACKGROUND OF THE PRESENT APPLICATION The above information disclosed is only for understanding the background of the concept of the present application and may contain information that does not constitute the prior art. Summary of the invention

[0005] Based on this, in order to solve the above problems, it is necessary to provide a cleaning device and a semiconductor equipment.

[0006] A cleaning device for cleaning a eutectic head of a semiconductor device, the cleaning device comprising:

[0007] Cleaning station;

[0008] A grinding piece, the grinding piece is arranged on the cleaning table;

[0009] A sweeping brush, the sweeping brush being arranged on the cleaning table;

[0010] A driving mechanism is connected to the cleaning table and is used to drive the cleaning table to move to a standby position and a working position. When in the working position, the cleaning table is located below the eutectic head, the grinding member is used to grind the eutectic head, and the sweeping member is used to sweep the eutectic head.

[0011] The above-mentioned cleaning device of the present application includes at least the following beneficial effects: the cleaning device can automatically move the cleaning table to the standby position and the working position through the driving mechanism, realize the automatic cleaning of the eutectic head of the semiconductor equipment, reduce manual intervention, and improve production efficiency. The driving mechanism of the cleaning device is connected to the cleaning table, and the position of the cleaning table can be flexibly adjusted to ensure that the grinding piece and the sweeping brush piece can effectively contact and clean different parts of the eutectic head, and adapt to semiconductor equipment of different models and specifications. When in the standby position, the cleaning table can stay outside the working area of ​​the eutectic head to avoid interfering with the movement and normal operation of the eutectic head. When the eutectic head needs to be cleaned, the cleaning table can be moved to the working position. Since the grinding piece and the sweeping brush piece are provided on the cleaning table, the eutectic head can be cleaned in two steps. First, the eutectic head is ground by the grinding piece to remove stubborn impurities on the surface; then the residual dust and particles are further cleaned by the sweeping brush piece to ensure the cleanliness of the surface of the eutectic head. By regularly and automatically cleaning the eutectic head, dust, particles and foreign matter can be effectively removed to prevent these impurities from affecting the working performance of the eutectic head, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device of the present application improves the cleaning efficiency and cleaning effect through an automated, efficient and precise cleaning process, thereby ensuring production efficiency and product quality.

[0012] In one embodiment, the working position includes a first working position and a second working position, and the cleaning table is configured to be able to move to the first working position first and then to the second working position under the drive of the driving mechanism; in the first working position, the grinding member is located under the eutectic head and presses the end face of the eutectic head for grinding; in the second working position, the sweeping member is located under the eutectic head and is used to sweep the end face of the eutectic head. By dividing the cleaning process into two steps, first grinding at the first working position and then sweeping at the second working position, the thoroughness of the cleaning is ensured. The grinding member can effectively remove stubborn impurities on the end face of the eutectic head, while the sweeping member can remove fine particles and dust remaining after grinding, thereby achieving a higher cleaning effect.

[0013] In one embodiment, the top of the cleaning table is provided with a first limiting groove and a second limiting groove, the grinding piece is detachably embedded in the first limiting groove, and the sweeping brush piece is detachably embedded in the second limiting groove. The grinding piece and the sweeping brush piece are detachably embedded in the limiting groove, making their installation and removal very convenient. The design of the limiting groove ensures the stability and accuracy of the grinding piece and the sweeping brush piece during the cleaning process, avoids the displacement or loosening of the parts during the cleaning process, thereby ensuring the consistency and reliability of the cleaning effect. According to the specific cleaning requirements, grinding pieces and sweeping brush pieces of different materials and shapes can be selected to enhance the adaptability and flexibility of the cleaning device. When the grinding piece or the sweeping brush piece is worn or damaged, a new part can be quickly replaced, reducing the equipment downtime and improving the maintenance efficiency. The detachable design enables the cleaning device to adapt to grinding pieces and sweeping brush pieces of different types and specifications. Through convenient replacement and maintenance, the wear problem of the grinding piece and the sweeping brush piece can be dealt with in time, avoiding the decline of the cleaning effect and the damage of the equipment due to the wear of the parts, thereby extending the service life of the cleaning device and the semiconductor equipment.

[0014] In one embodiment, the cleaning device further includes at least two hooks, which are detachably connected to the cleaning table and are distributed on both sides of the grinding piece, and the at least two hooks are hooked to the side of the grinding piece facing away from the first limiting groove to fix the grinding piece in the first limiting groove. By providing the hooks, the grinding piece can be firmly fixed in the first limiting groove to prevent the grinding piece from shifting or loosening during the cleaning process, thereby ensuring the stability and consistency of the grinding process and improving the cleaning effect. The design of the detachable connection between the hook and the cleaning table makes the installation and disassembly of the grinding piece more convenient. When the grinding piece needs to be replaced, the grinding piece can be easily removed by simply loosening the hooks, which simplifies the operation process and saves time and labor costs.

[0015] In one embodiment, the sweeping brush member includes a fixed plate and a plurality of brush heads, the fixed plate is detachably embedded in the second limiting groove, the plurality of brush heads are spaced apart and are all connected to the side of the fixed plate facing away from the second limiting groove, and the brush heads are used to sweep and brush the end face of the eutectic head. The fixed plate is detachably embedded in the second limiting groove, making the installation and removal of the sweeping brush member very convenient. When the brush head is worn or damaged, a new sweeping brush member can be quickly replaced to reduce equipment downtime and improve maintenance efficiency. The plurality of brush heads are spaced apart and are all connected to the side of the fixed plate facing away from the second limiting groove, so that the brush heads can be evenly distributed in the cleaning area, and the end face of the eutectic head can be swept comprehensively and effectively to ensure the consistency and reliability of the cleaning effect.

[0016] In one embodiment, the first limiting groove and the second limiting groove are arranged side by side, and the grinding member and the sweeping member are arranged side by side.

[0017] In one embodiment, the cleaning device further comprises a dust suction assembly arranged on the cleaning table, the dust suction assembly comprises a suction pipe and a dust suction frame connected to the suction pipe, a suction hole is provided in the dust suction frame, the suction hole is connected to the suction pipe, the dust suction frame, the grinding member and the sweeping brush member are all arranged on the top of the cleaning table, the dust suction frame is enclosed to form a dust blocking groove, the dust blocking groove surrounds the grinding member and the sweeping brush member, a dust suction channel connected to the suction hole is provided on the groove wall of the dust blocking groove, and the dust suction channel is extended on the groove wall of the dust blocking groove in the direction of surrounding the grinding member and the sweeping brush member. By providing the dust suction assembly, the dust and debris generated by grinding and sweeping can be sucked and collected in time during the cleaning process, so as to avoid their accumulation inside and on the surface of the equipment, reduce the wear and corrosion of the equipment, thereby extending the service life of the cleaning device and related equipment, and can also keep the working environment clean, reduce the suspension of dust in the air, reduce the risk of dust inhalation by operators, and improve the safety and health of the working environment. The dust blocking groove formed by the dust suction frame effectively surrounds the grinding parts and the sweeping brush parts, limiting the diffusion range of dust. The design of the dust suction channel ensures that the dust can be quickly sucked away by the suction pipe. The dust suction channel extends in the direction of surrounding the grinding parts and the sweeping brush parts, and can be adjusted according to specific cleaning needs and equipment layout, further reducing the diffusion of dust in the air and improving the hygiene level of the working environment.

[0018] In one embodiment, the cleaning table includes a frame, a first bracket and a second bracket, the grinding member and the sweeping member are arranged on the top of the first bracket, the first bracket is nested in the second bracket, the second bracket is nested in the frame, and the first bracket can rotate relative to the second bracket in a first rotation direction, and the second bracket can rotate relative to the frame in a second rotation direction to adjust the grinding surface of the grinding member to be parallel to the end face of the eutectic head. The nested design of the first bracket and the second bracket realizes multi-directional adjustment capability. The first bracket and the second bracket rotate relative to each other in different rotation directions, respectively, so that the grinding surface of the grinding member can be accurately adjusted to be parallel to the end face of the eutectic head, ensuring high precision of the grinding and cleaning process. Through precise adjustment, it is ensured that the grinding member and the end face of the eutectic head always maintain the best contact state, reducing excessive wear caused by non-parallel contact, thereby extending the service life of the equipment.

[0019] In one embodiment, the plane in which the first rotation direction is located is perpendicular to the plane in which the second rotation direction is located. By designing the planes in which the first rotation direction and the second rotation direction are located to be perpendicular to each other, the cleaning device can be adjusted in two directions. This multi-dimensional adjustment capability allows the device to more accurately adjust the grinding surface of the grinding piece to be parallel to the end face of the eutectic head.

[0020] In one embodiment, the cleaning station further comprises a first rotating shaft, a first adjusting member, a second rotating shaft and a second adjusting member, the first bracket is connected to the second bracket in rotation along the first rotation direction through the first rotating shaft, the second bracket is connected to the frame in rotation along the second rotation direction through the second rotating shaft, the first adjusting member is used to adjust the rotation angle of the first bracket relative to the second bracket in the first rotation direction, and the second adjusting member is used to adjust the rotation angle of the second bracket relative to the frame in the second rotation direction. Through the combination of the first rotating shaft and the first adjusting member, and the second rotating shaft and the second adjusting member, multi-dimensional precise adjustment is achieved. The adjusting member can carefully control the rotation angle of the bracket to ensure the parallelism between the grinding surface and the end face of the eutectic head. Precise angle adjustment ensures that the grinding member and the sweeping member can work in the best position, avoids cleaning dead corners and uneven cleaning, and improves the overall cleaning effect. Through precise adjustment, the best contact state between the grinding member and the end face of the eutectic head is ensured, and excessive wear caused by poor contact is reduced, thereby extending the service life of the equipment.

[0021] In one embodiment, the first rotation axis and the second rotation axis are perpendicular to each other.

[0022] In one embodiment, the first adjusting member is an eccentric rod, the first adjusting member includes a first eccentric end and a first operating end which are far from each other, a first adjusting hole is provided on the first bracket, the first eccentric end extends into the first adjusting hole, the first operating end is rotatably arranged in the second bracket and is used for operation to drive the first eccentric end to rotate in the first adjusting hole, the outer peripheral surface of the first eccentric end abuts against the hole wall of the first adjusting hole to drive the first bracket to rotate around the first rotating shaft, so as to adjust the rotation angle of the first bracket relative to the second bracket in the first rotation direction. The eccentric rod design can provide fine angle adjustment. By rotating the operating end, the operator can accurately adjust the angle of the first bracket to ensure that the grinding surface of the grinding member is parallel to the end face of the eutectic head. The abutment between the eccentric end and the adjusting hole wall provides stable support, avoids shaking and deviation during the adjustment process, and ensures the stability and reliability of the grinding and cleaning process. Through precise angle adjustment, it is ensured that the grinding member and the sweeping member can work in the best position, avoids cleaning dead angles and uneven cleaning, and improves the overall cleaning effect.

[0023] In one embodiment, the second adjusting member is an eccentric rod, the second adjusting member includes a second eccentric end and a second operating end that are far away from each other, the second bracket is provided with a second adjusting hole, the second eccentric end extends into the second adjusting hole, the second operating end is rotatably arranged in the frame and is used for operation to drive the second eccentric end to rotate in the second adjusting hole, the outer peripheral surface of the second eccentric end abuts against the hole wall of the second adjusting hole to drive the second bracket to rotate around the second rotating shaft, so as to adjust the rotation angle of the second bracket relative to the frame in the second rotation direction. The design of the second eccentric member as an eccentric rod can provide fine angle adjustment. By rotating the second operating end, the operator can accurately adjust the angle of the second bracket to ensure that the grinding surface of the grinding member is parallel to the end face of the eutectic head. The abutment of the second eccentric end with the wall of the adjustment hole provides stable support, avoids shaking and deviation during the adjustment process, and ensures the stability and reliability of the grinding and cleaning process. Through precise angle adjustment, it is ensured that the grinding member and the sweeping member can work in the best position, avoids cleaning dead angles and uneven cleaning, and improves the overall cleaning effect.

[0024] In one embodiment, the cleaning device further comprises a fastener, a first positioning hole is provided on the frame, a second positioning hole is provided on the second bracket, the fastener is inserted and removably penetrated through the first positioning hole and extends into the second positioning hole, when the fastener is pulled out from the second positioning hole, the second bracket can rotate relative to the second bracket, when the fastener is inserted into the second positioning hole, the fastener can limit the rotation of the second bracket relative to the frame. The design of the fastener provides an additional fixing means to ensure that the second bracket will not rotate accidentally due to vibration or other external forces when the cleaning device is working, thereby improving the stability and reliability of the equipment. When the angle of the second bracket needs to be adjusted, the fastener can be pulled out to adjust it, and the fastener can be inserted and fixed after the adjustment is completed. When the fastener is pulled out, the angle of the second bracket can be accurately adjusted by the second adjusting member to ensure that the grinding piece is parallel to the end face of the eutectic head, thereby improving the cleaning and grinding effects.

[0025] In one embodiment, the driving mechanism includes a first fixed frame, a first driving assembly, a second fixed frame and a second driving assembly, wherein the first driving assembly is arranged on the first fixed frame, the first driving assembly is connected to the first fixed frame and is used to drive the first fixed frame to perform translational motion along a first direction, the second driving assembly is arranged on the second fixed frame, the second driving assembly is connected to the cleaning table and is used to drive the cleaning table to perform lifting motion along a second direction; wherein the first direction and the second direction are perpendicular to each other. Through the combination of the first driving assembly and the second driving assembly, multi-dimensional adjustment of the cleaning device in the horizontal and vertical directions is achieved, and the flexibility and adaptability of the equipment are enhanced. The translational motion of the first driving assembly and the lifting motion of the second driving assembly can accurately adjust the position and height of the cleaning device, ensuring the accuracy and effectiveness of the cleaning process. Through precise positioning and height adjustment, the optimal contact state between the grinding piece and the surface to be cleaned is ensured, thereby improving the cleaning effect and efficiency.

[0026] The present application also provides a semiconductor device, which includes a eutectic head and a cleaning device as described in any of the above embodiments.

[0027] The semiconductor device mentioned above, because it includes the cleaning device described in any of the above embodiments, also includes at least the following beneficial effects: the cleaning device of the semiconductor device can automatically move the cleaning table to the standby position and the working position through the driving mechanism, thereby realizing the automatic cleaning of the eutectic head of the semiconductor device, reducing manual intervention and improving production efficiency. The driving mechanism of the cleaning device is connected to the cleaning table, and the position of the cleaning table can be flexibly adjusted to ensure that the grinding piece and the sweeping brush piece can effectively contact and clean different parts of the eutectic head, and adapt to semiconductor devices of different models and specifications. When in the standby position, the cleaning table can stay outside the working area of ​​the eutectic head to avoid interfering with the movement and normal operation of the eutectic head. When the eutectic head needs to be cleaned, the cleaning table can be moved to the working position. Since the cleaning table is provided with a grinding piece and a sweeping brush piece, the eutectic head can be cleaned in two steps. First, the eutectic head is ground by the grinding piece to remove stubborn impurities on the surface; then the residual dust and particles are further cleaned by the sweeping brush piece to ensure the cleanliness of the surface of the eutectic head. By automatically cleaning the eutectic head regularly, dust, particles and foreign matter can be effectively removed to prevent these impurities from affecting the working performance of the eutectic head, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device of the present application improves the cleaning efficiency and cleaning effect through an automated, efficient and precise cleaning process, thereby ensuring production efficiency and product quality.

[0028] In one embodiment, the semiconductor device further includes a bonding device and a third driving assembly, the cleaning device and the third driving assembly are both arranged on the frame, the third driving assembly is connected to the bonding device and is used to drive the eutectic head of the bonding device to perform translational movement along a third direction; wherein the first direction and the second direction are perpendicular to the third direction in pairs. Through the combination of the first, second and third driving assemblies, the multi-dimensional mutual movement of the eutectic head and the cleaning table in three mutually perpendicular directions is realized, the flexibility and adaptability of the equipment are enhanced, and it is ensured that when the eutectic head needs to be cleaned, the cleaning table and the grinding parts and sweeping parts thereon can be accurately located below the eutectic head.

[0029] In one embodiment, the drive mechanism further includes a first guide rail and a second guide rail, the first guide rail is disposed on the first fixed frame and parallel to the first direction, the second fixed frame is at least partially slidably disposed on the first guide rail, the second guide rail is disposed on the second fixed frame and parallel to the second direction, and the cleaning table is at least partially slidably disposed on the second guide rail. The design of the guide rails provides additional support and guidance, enhances the stability of the equipment during translation and lifting, and reduces jitter and error during movement. By enhancing stability and improving accuracy, the guide rail design improves the overall performance of cleaning and bonding operations and ensures an efficient workflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic structural diagram of a cleaning device provided in one embodiment of the present application.

[0032] Figure 2 A partially enlarged stereoscopic view of a cleaning device provided in one embodiment of the present application.

[0033] Figure 3 A schematic structural diagram of the cleaning table, grinding member, sweeping brush and other related components of a cleaning device provided in one embodiment of the present application.

[0034] Figure 4 An exploded schematic diagram of the cleaning table, grinding element, sweeping brush and other related components of the cleaning device provided in one embodiment of the present application.

[0035] Figure 5Another exploded schematic diagram of the cleaning table, grinding member, sweeping brush and other related components of the cleaning device provided in one embodiment of the present application.

[0036] Figure 6 A three-dimensional cross-sectional view of a cleaning table of a cleaning device provided in one embodiment of the present application.

[0037] Figure 7 A schematic structural diagram of a cleaning table of a cleaning device provided in one embodiment of the present application.

[0038] Figure 8 An exploded schematic diagram of a cleaning station of a cleaning device provided in one embodiment of the present application.

[0039] Fig. 9 A three-dimensional schematic diagram of a cleaning table of a cleaning device provided in one embodiment of the present application.

[0040] Fig.10 A cross-sectional view of a cleaning table of a cleaning device provided in one embodiment of the present application.

[0041] Fig.11 A schematic structural diagram of an adjusting member provided in one embodiment of the present application.

[0042] Fig.12 Another schematic structural diagram of a cleaning device provided in accordance with an embodiment of the present application.

[0043] Reference numerals:

[0044] 10. Cleaning device; 100. Cleaning table; 110. First bracket; 111. First limiting groove; 112. Second limiting groove; 113. Hook; 114. First adjustment hole; 120. Second bracket; 121. Second adjustment hole; 122. Second positioning hole; 130. Frame; 131. First positioning hole; 141. First rotating shaft; 142. Second rotating shaft; 151. First adjusting member; 1511. First eccentric end; 1512. First operating end; 152. Second adjusting member; 1521. Second eccentric end; 1522. First Two operating ends; 200, grinding member; 300, sweeping and brushing member; 310, fixing plate; 320, brush head; 400, driving mechanism; 411, first fixing frame; 412, first driving assembly; 421, second fixing frame; 422, second driving assembly; 431, first guide rail; 432, second guide rail; 500, dust suction assembly; 510, suction pipe; 520, dust suction frame; 521, suction hole; 522, dust blocking groove; 523, dust suction channel; 600, fastener; D1, first rotation direction; D2, second rotation direction. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0046] See also Figure 1 and Figure 2 In some embodiments, the present application provides a cleaning device 10, which can be used to clean the eutectic head (not shown) of a semiconductor device. The cleaning device 10 includes a cleaning table 100, a grinding piece 200, a sweeping brush piece 300, and a driving mechanism 400. The grinding piece 200 and the sweeping brush piece 300 are both arranged on the cleaning table 100, and the driving mechanism is connected to the cleaning table 100 and is used to drive the cleaning table 100 to move to a standby position and a working position. When in the working position, the cleaning table 100 is located below the eutectic head, the grinding piece 200 is used to grind the eutectic head, and the sweeping brush piece 300 is used to sweep the eutectic head. The grinding piece 200 may include but is not limited to an oil stone, and the sweeping brush piece 300 may include but is not limited to a heat-resistant silicone brush and a heat-resistant ceramic fiber brush.

[0047] The above-mentioned cleaning device 10 of the present application includes at least the following beneficial effects: the cleaning device 10 can automatically move the cleaning table 100 to the standby position and the working position through the driving mechanism 400, thereby realizing the automated cleaning of the eutectic head of the semiconductor equipment, reducing manual intervention and improving production efficiency. The driving mechanism 400 of the cleaning device 10 is connected to the cleaning table 100, and the position of the cleaning table 100 can be flexibly adjusted to ensure that the grinding member 200 and the sweeping brush member 300 can effectively contact and clean different parts of the eutectic head, and adapt to semiconductor equipment of different models and specifications. When in the standby position, the cleaning table 100 can stay outside the working area of ​​the eutectic head to avoid interfering with the movement and normal operation of the eutectic head. When the eutectic head needs to be cleaned, the cleaning table 100 can be moved to the working position. Since the grinding member 200 and the sweeping brush member 300 are provided on the cleaning table 100, the eutectic head can be cleaned in two steps. First, the eutectic head is ground by the grinding piece 200 to remove stubborn impurities on the surface; then the residual dust and particles are further cleaned by the sweeping brush 300 to ensure the cleanliness of the surface of the eutectic head. By regularly and automatically cleaning the eutectic head, dust, particles and foreign matter can be effectively removed to prevent these impurities from affecting the working performance of the eutectic head, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device 10 of the present application improves the cleaning efficiency and cleaning effect through an automated, efficient and precise cleaning process, thereby ensuring production efficiency and product quality.

[0048] Specifically, in some embodiments, the working position includes a first working position and a second working position, and the cleaning table 100 is configured to be able to move to the first working position first and then to the second working position under the drive of the driving mechanism 400; in the first working position, the grinding member 200 is located under the eutectic head and presses the end face of the eutectic head for grinding; in the second working position, the sweeping member 300 is located under the eutectic head and is used to sweep the end face of the eutectic head. By dividing the cleaning process into two steps, first grinding at the first working position and then sweeping at the second working position, the thoroughness of the cleaning is ensured. The grinding member 200 can effectively remove stubborn impurities on the end face of the eutectic head, while the sweeping member 300 can remove fine particles and dust remaining after grinding, thereby achieving a higher cleaning effect.

[0049] See also Figure 3 In some embodiments, a first limiting groove 111 and a second limiting groove 112 are provided on the top of the cleaning table 100, and the grinding member 200 is detachably embedded in the first limiting groove 111, and the sweeping brush member 300 is detachably embedded in the second limiting groove 112. The grinding member 200 and the sweeping brush member 300 are detachably embedded in the limiting grooves, making their installation and removal very convenient. The design of the limiting grooves ensures the stability and accuracy of the grinding member 200 and the sweeping brush member 300 during the cleaning process, avoids the displacement or loosening of the components during the cleaning process, and thus ensures the consistency and reliability of the cleaning effect. According to specific cleaning requirements, grinding members 200 and sweeping brush members 300 of different materials and shapes can be selected to enhance the adaptability and flexibility of the cleaning device 10. When the grinding member 200 or the sweeping brush member 300 is worn or damaged, a new part can be quickly replaced to reduce equipment downtime and improve maintenance efficiency. The detachable design enables the cleaning device 10 to adapt to different types and specifications of grinding members 200 and sweeping brush members 300. Through convenient replacement and maintenance, the wear problem of the grinding member 200 and the sweeping brush member 300 can be dealt with in time, avoiding the reduction of cleaning effect and equipment damage caused by component wear, thereby extending the service life of the cleaning device 10 and the semiconductor equipment.

[0050] Specifically, Figure 3 and Figure 4As shown, in some embodiments, the cleaning device 10 further includes at least two hooks 113, which are detachably connected to the cleaning table 100 and are distributed on both sides of the grinding piece 200, and the at least two hooks 113 are hooked on the side of the grinding piece 200 facing away from the first limiting groove 111 to fix the grinding piece 200 in the first limiting groove 111. By providing the hooks 113, the grinding piece 200 can be firmly fixed in the first limiting groove 111 to prevent the grinding piece 200 from shifting or loosening during the cleaning process, thereby ensuring the stability and consistency of the grinding process and improving the cleaning effect. The design of the detachable connection between the hooks 113 and the cleaning table 100 makes the installation and removal of the grinding piece 200 more convenient. When the grinding piece 200 needs to be replaced, the grinding piece 200 can be easily removed by simply loosening the hooks 113, which simplifies the operation process and saves time and labor costs.

[0051] Specifically, Figure 3 As shown, in some embodiments, the sweeping brush 300 includes a fixed plate 310 and a plurality of brush heads 320, the fixed plate 310 is detachably embedded in the second limiting groove 112, and the plurality of brush heads 320 are spaced and connected to the side of the fixed plate 310 facing away from the second limiting groove 112, and the brush heads 320 are used to sweep the end face of the eutectic head. The fixed plate 310 is detachably embedded in the second limiting groove 112, making the installation and removal of the sweeping brush 300 very convenient. When the brush head 320 is worn or damaged, a new sweeping brush 300 can be quickly replaced, reducing equipment downtime and improving maintenance efficiency. The plurality of brush heads 320 are spaced and connected to the side of the fixed plate 310 facing away from the second limiting groove 112, so that the brush heads 320 can be evenly distributed in the cleaning area, and the end face of the eutectic head is swept comprehensively and effectively, ensuring the consistency and reliability of the cleaning effect.

[0052] Specifically, Figure 3 and Figure 4 As shown, in some embodiments, the first limiting groove 111 and the second limiting groove 112 are arranged side by side, and the grinding member 200 and the sweeping member 300 are arranged side by side.

[0053] See also Figure 3 , Figure 4 , Figure 5 and Figure 6In some embodiments, the cleaning device 10 further includes a dust suction component 500 disposed on the cleaning table 100, the dust suction component 500 includes a suction pipe 510 and a dust suction frame 520 connected to the suction pipe 510, a suction hole 521 is provided in the dust suction frame 520, the suction hole 521 is communicated with the suction pipe 510, the dust suction frame 520, the grinding member 200 and the sweeping brush member 300 are all disposed on the top of the cleaning table 100, the dust suction frame 520 is surrounded by a dust blocking groove 522, the dust blocking groove 522 surrounds the grinding member 200 and the sweeping brush member 300, a dust suction channel 523 communicated with the suction hole 521 is provided on the groove wall of the dust blocking groove 522, and the dust suction channel 523 is extended on the groove wall of the dust blocking groove 522 in a direction surrounding the grinding member 200 and the sweeping brush member 300. By setting the dust suction component 500, the dust and debris generated by grinding and sweeping can be sucked and collected in time during the cleaning process to avoid accumulation inside and on the surface of the equipment, reduce wear and corrosion on the equipment, thereby extending the service life of the cleaning device 10 and related equipment, and can also keep the working environment clean, reduce the suspension of dust in the air, reduce the risk of operators inhaling dust, and improve the safety and health of the working environment. The dust blocking groove 522 formed by the dust suction frame 520 effectively surrounds the grinding member 200 and the sweeping brush member 300, limiting the diffusion range of dust. The design of the dust suction channel 523 ensures that the dust can be quickly sucked away by the suction pipe 510. The dust suction channel 523 is extended in the direction of surrounding the grinding member 200 and the sweeping brush member 300, and can be adjusted according to specific cleaning needs and equipment layout, further reducing the diffusion of dust in the air and improving the hygiene level of the working environment.

[0054] See also Figure 7 , Figure 8 , Fig. 9 and Fig.10In some embodiments, the cleaning station 100 includes a frame 130, a first bracket 110 and a second bracket 120, the grinding member 200 and the sweeping member 300 are arranged on the top of the first bracket 110, the first bracket 110 is nested in the second bracket 120, the second bracket 120 is nested in the frame 130, and the first bracket 110 can rotate relative to the second bracket 120 in a first rotation direction D1, and the second bracket 120 can rotate relative to the frame 130 in a second rotation direction D2, so as to adjust the grinding surface of the grinding member 200 to be parallel to the end face of the eutectic head. The nesting design of the first bracket 110 and the second bracket 120 realizes the multi-directional adjustment capability. The first bracket 110 and the second bracket 120 rotate relative to each other in different rotation directions, respectively, so that the grinding surface of the grinding member 200 can be accurately adjusted to be parallel to the end face of the eutectic head, ensuring the high precision of the grinding and cleaning process. Through precise adjustment, it is ensured that the grinding piece 200 and the end face of the eutectic head always maintain the best contact state, reducing excessive wear caused by non-parallel contact, thereby extending the service life of the equipment.

[0055] Specifically, in some embodiments, the plane where the first rotation direction D1 is located is perpendicular to the plane where the second rotation direction D2 is located. By designing the planes where the first rotation direction D1 and the second rotation direction D2 are located to be perpendicular to each other, the cleaning device 10 can be adjusted in two directions. This multi-dimensional adjustment capability allows the device to more accurately adjust the grinding surface of the grinding piece 200 to be parallel to the end face of the eutectic head.

[0056] Specifically, Fig. 9 and Fig.10As shown, in some embodiments, the cleaning table 100 further includes a first rotating shaft 141, a first adjusting member 151, a second rotating shaft 142 and a second adjusting member 152. The first bracket 110 is rotatably connected with the second bracket 120 along the first rotation direction D1 through the first rotating shaft 141, and the second bracket 120 is rotatably connected with the frame 130 along the second rotation direction D2 through the second rotating shaft 142. The first adjusting member 151 is used to adjust the rotation angle of the first bracket 110 relative to the second bracket 120 in the first rotation direction D1, and the second adjusting member 152 is used to adjust the rotation angle of the second bracket 120 relative to the frame 130 in the second rotation direction D2. Through the combination of the first rotating shaft 141 and the first adjusting member 151, and the second rotating shaft 142 and the second adjusting member 152, multi-dimensional precise adjustment is achieved. The adjusting member can carefully control the rotation angle of the bracket to ensure the parallelism between the grinding surface and the end face of the eutectic head. Precise angle adjustment ensures that the grinding piece 200 and the sweeping piece 300 can work in the best position, avoiding cleaning dead corners and uneven cleaning, and improving the overall cleaning effect. Through precise adjustment, the best contact state between the grinding piece 200 and the end face of the eutectic head is ensured, reducing excessive wear caused by poor contact, thereby extending the service life of the equipment.

[0057] Specifically, Fig. 9 and Fig.10 As shown, in some embodiments, the first rotating shaft 141 and the second rotating shaft 142 are perpendicular to each other.

[0058] Furthermore, if Fig. 9As shown, in some embodiments, the first adjusting member 151 is an eccentric rod, the first adjusting member 151 includes a first eccentric end 1511 and a first operating end 1512 which are far from each other, the first bracket 110 is provided with a first adjusting hole 114, the first eccentric end 1511 extends into the first adjusting hole 114, the first operating end 1512 is rotatably arranged in the second bracket 120 and is used for operation to drive the first eccentric end 1511 to rotate in the first adjusting hole 114, the outer peripheral surface of the first eccentric end 1511 abuts against the hole wall of the first adjusting hole 114 to drive the first bracket 110 to rotate around the first rotating shaft 141, so as to adjust the rotation angle of the first bracket 110 relative to the second bracket 120 in the first rotation direction D1. The eccentric rod design can provide fine angle adjustment, and by rotating the operating end, the operator can accurately adjust the angle of the first bracket 110 to ensure that the grinding surface of the grinding member 200 is parallel to the end surface of the eutectic head. The abutment between the eccentric end and the adjusting hole wall provides stable support, avoiding shaking and deviation during the adjustment process, ensuring the stability and reliability of the grinding and cleaning process. Through precise angle adjustment, the grinding member 200 and the sweeping brush member 300 can work in the best position, avoiding cleaning dead corners and uneven cleaning, and improving the overall cleaning effect.

[0059] Furthermore, if Fig.10 As shown, in some embodiments, the second adjusting member 152 is an eccentric rod, and the second adjusting member 152 includes a second eccentric end 1521 and a second operating end 1522 that are far away from each other. The second bracket 120 is provided with a second adjusting hole 121, and the second eccentric end 1521 extends into the second adjusting hole 121. The second operating end 1522 is rotatably arranged in the frame 130 and is used for operation to drive the second eccentric end 1521 to rotate in the second adjusting hole 121. The outer peripheral surface of the second eccentric end 1521 abuts against the hole wall of the second adjusting hole 121 to drive the second bracket 120 to rotate around the second rotating shaft 142 to adjust the rotation angle of the second bracket 120 relative to the frame 130 in the second rotation direction D2. The design of the second eccentric member as an eccentric rod can provide fine angle adjustment. By rotating the second operating end 1522, the operator can accurately adjust the angle of the second bracket 120 to ensure that the grinding surface of the grinding member 200 is parallel to the end surface of the eutectic head. The abutment between the second eccentric end 1521 and the wall of the adjustment hole provides stable support, avoiding shaking and deviation during the adjustment process, ensuring the stability and reliability of the grinding and cleaning process. Through precise angle adjustment, the grinding member 200 and the sweeping member 300 can work at the best position, avoiding cleaning dead angles and uneven cleaning, and improving the overall cleaning effect.

[0060] Furthermore, Figure 8 and Fig.10 As shown, in some embodiments, the cleaning device 10 further includes a fastener 600, a first positioning hole 131 is provided on the frame 130, and a second positioning hole 122 is provided on the second bracket 120, and the fastener 600 is inserted and removably penetrated in the first positioning hole 131 and extends into the second positioning hole 122, when the fastener 600 is pulled out from the second positioning hole 122, the second bracket 120 can rotate relative to the second bracket 120, and when the fastener 600 is inserted into the second positioning hole 122, the fastener 600 can limit the rotation of the second bracket 120 relative to the frame 130. The design of the fastener 600 provides an additional fixing means to ensure that the second bracket 120 will not rotate accidentally due to vibration or other external forces when the cleaning device 10 is working, thereby improving the stability and reliability of the device. When the angle of the second bracket 120 needs to be adjusted, the fastener 600 can be adjusted by simply pulling out the fastener 600, and the fastener 600 is inserted and fixed after the adjustment is completed. When the fastener 600 is pulled out, the angle of the second bracket 120 can be accurately adjusted through the second adjustment member 152 to ensure that the grinding member 200 is parallel to the end surface of the eutectic head, thereby improving the cleaning and grinding effects.

[0061] See also Fig.12 In some embodiments, the driving mechanism 400 includes a first fixed frame 411, a first driving assembly 412, a second fixed frame 421 and a second driving assembly 422, wherein the first driving assembly 412 is disposed on the first fixed frame 411, the first driving assembly 412 is connected to the first fixed frame 411 and is used to drive the first fixed frame 411 to perform translational motion along a first direction, the second driving assembly 422 is disposed on the second fixed frame 421, the second driving assembly 422 is connected to the cleaning table 100 and is used to drive the cleaning table 100 to perform lifting motion along a second direction; wherein the first direction is perpendicular to the second direction. Through the combination of the first driving assembly 412 and the second driving assembly 422, multi-dimensional adjustment of the cleaning device 10 in the horizontal and vertical directions is achieved, thereby enhancing the flexibility and adaptability of the device. The translational motion of the first driving assembly 412 and the lifting motion of the second driving assembly 422 can accurately adjust the position and height of the cleaning device 10, thereby ensuring the accuracy and effectiveness of the cleaning process. Through precise positioning and height adjustment, the best contact state between the grinding piece 200 and the cleaned surface is ensured, thereby improving the cleaning effect and efficiency. The specific form of the drive assembly is not limited here, and the first drive assembly 412 and the second drive assembly 422 may include but are not limited to a cylinder, a motor, an electric push rod, etc.

[0062] Specifically, Fig.12As shown, in some embodiments, the driving mechanism 400 further includes a first guide rail 431 and a second guide rail 432, the first guide rail 431 is disposed on the first fixed frame 411 and is parallel to the first direction, the second fixed frame 421 is at least partially slidably disposed on the first guide rail 431, the second guide rail 432 is disposed on the second fixed frame 421 and is parallel to the second direction, and the cleaning table 100 is at least partially slidably disposed on the second guide rail 432. The design of the guide rail provides additional support and guidance, enhances the stability of the device during translation and lifting, and reduces jitter and error during movement. By enhancing stability and improving accuracy, the guide rail design improves the overall performance of cleaning and bonding operations and ensures an efficient workflow.

[0063] In addition, the present application also provides a semiconductor device (not shown), which includes a eutectic head and a cleaning device 10 as described in any of the above embodiments.

[0064] The semiconductor device mentioned above, because it includes the cleaning device 10 described in any of the above embodiments, the semiconductor device also includes at least the following beneficial effects: the cleaning device 10 of the semiconductor device can automatically move the cleaning table 100 to the standby position and the working position through the driving mechanism 400, thereby realizing the automatic cleaning of the eutectic head of the semiconductor device, reducing manual intervention and improving production efficiency. The driving mechanism 400 of the cleaning device 10 is connected to the cleaning table 100, and the position of the cleaning table 100 can be flexibly adjusted to ensure that the grinding member 200 and the sweeping brush member 300 can effectively contact and clean different parts of the eutectic head, and adapt to semiconductor devices of different models and specifications. When in the standby position, the cleaning table 100 can stay outside the working area of ​​the eutectic head to avoid interfering with the movement and normal operation of the eutectic head. When the eutectic head needs to be cleaned, the cleaning table 100 can be moved to the working position. Since the grinding member 200 and the sweeping brush member 300 are provided on the cleaning table 100, the eutectic head can be cleaned in two steps. First, the eutectic head is ground by the grinding piece 200 to remove stubborn impurities on the surface; then the residual dust and particles are further cleaned by the sweeping brush 300 to ensure the cleanliness of the surface of the eutectic head. By regularly and automatically cleaning the eutectic head, dust, particles and foreign matter can be effectively removed to prevent these impurities from affecting the working performance of the eutectic head, thereby improving the quality and reliability of semiconductor products. In summary, the cleaning device 10 of the present application improves the cleaning efficiency and cleaning effect through an automated, efficient and precise cleaning process, thereby ensuring production efficiency and product quality.

[0065] Furthermore, in some embodiments, the semiconductor device further includes a bonding device and a third driving assembly, the cleaning device 10 and the third driving assembly are both arranged on the frame, the third driving assembly is connected to the bonding device and is used to drive the eutectic head of the bonding device to perform translational movement along a third direction; wherein the first direction and the second direction are perpendicular to the third direction in pairs. Through the combination of the first, second and third driving assemblies, the multi-dimensional mutual movement of the eutectic head and the cleaning table 100 in three mutually perpendicular directions is realized, the flexibility and adaptability of the equipment are enhanced, and it is ensured that when the eutectic head needs to be cleaned, the cleaning table 100 and the grinding member 200 and the sweeping member 300 thereon can be accurately located below the eutectic head.

[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

[0068] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0069] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0070] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0071] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0072] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0073] In the description of this specification, the description of reference terms "one embodiment", "other implementation methods", etc. means that the specific features, structures, materials or features described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

Claims

1. A cleaning device for cleaning a eutectic head of a semiconductor device, characterized in that: The cleaning device comprises: Cleaning station; A grinding piece, the grinding piece is arranged on the cleaning table; A sweeping brush, the sweeping brush being arranged on the cleaning table; A driving mechanism is connected to the cleaning table and is used to drive the cleaning table to move to a standby position and a working position. When in the working position, the cleaning table is located below the eutectic head, the grinding member is used to grind the eutectic head, and the sweeping member is used to sweep the eutectic head.

2. The cleaning device according to claim 1, characterized in that The working positions include a first working position and a second working position, and the cleaning table is configured to be able to move to the first working position first and then to the second working position under the drive of the driving mechanism; in the first working position, the grinding member is located under the eutectic head and presses the end surface of the eutectic head for grinding; in the second working position, the sweeping member is located under the eutectic head and is used to sweep the end surface of the eutectic head.

3. The cleaning device according to claim 1, characterized in that: A first limiting groove and a second limiting groove are formed on the top of the cleaning table. The grinding member is detachably embedded in the first limiting groove, and the sweeping member is detachably embedded in the second limiting groove.

4. The cleaning device according to claim 3, characterized in that: The cleaning device further comprises at least two hooks, which are detachably connected to the cleaning table and are distributed on both sides of the grinding piece, and the at least two hooks are hooked on a side of the grinding piece that is away from the first limiting groove to fix the grinding piece in the first limiting groove; And / or, the sweeping brush member comprises a fixed plate and a plurality of brush heads, the fixed plate is detachably embedded in the second limiting groove, the plurality of brush heads are spaced and connected to a side of the fixed plate facing away from the second limiting groove, and the brush heads are used to sweep the end surface of the eutectic head; And / or, the first limiting groove and the second limiting groove are arranged side by side, and the grinding member and the sweeping member are arranged side by side.

5. The cleaning device according to claim 1, characterized in that: The cleaning device also includes a dust suction component arranged on the cleaning table, the dust suction component includes a suction pipe and a dust suction frame connected to the suction pipe, a suction hole is opened in the dust suction frame, the suction hole is connected to the suction pipe, the dust suction frame, the grinding member and the sweeping brush member are all arranged on the top of the cleaning table, the dust suction frame is surrounded by a dust blocking groove, the dust blocking groove surrounds the grinding member and the sweeping brush member, a dust suction channel connected to the suction hole is opened on the groove wall of the dust blocking groove, and the dust suction channel is extended on the groove wall of the dust blocking groove in a direction surrounding the grinding member and the sweeping brush member.

6. The cleaning device according to claim 1, characterized in that: The cleaning table includes a frame, a first bracket and a second bracket, the grinding piece and the brush piece are arranged on the top of the first bracket, the first bracket is nested in the second bracket, the second bracket is nested in the frame, and the first bracket can rotate relative to the second bracket in a first rotation direction, and the second bracket can rotate relative to the frame in a second rotation direction to adjust the grinding surface of the grinding piece to be parallel to the end face of the eutectic head.

7. The cleaning device according to claim 6, characterized in that: The cleaning table also includes a first rotating shaft, a first adjusting member, a second rotating shaft and a second adjusting member. The first bracket is rotatably connected to the second bracket along the first rotation direction via the first rotating shaft, and the second bracket is rotatably connected to the frame along the second rotation direction via the second rotating shaft. The first adjusting member is used to adjust the rotation angle of the first bracket relative to the second bracket in the first rotation direction, and the second adjusting member is used to adjust the rotation angle of the second bracket relative to the frame in the second rotation direction.

8. The cleaning device according to claim 7, characterized in that: The first rotating axis and the second rotating axis are perpendicular to each other; And / or, the plane where the first rotation direction is located is perpendicular to the plane where the second rotation direction is located; And / or, the first adjusting member is an eccentric rod, the first adjusting member includes a first eccentric end and a first operating end which are far away from each other, a first adjusting hole is provided on the first bracket, the first eccentric end extends into the first adjusting hole, the first operating end is rotatably penetrated by the second bracket and is used for operation to drive the first eccentric end to rotate in the first adjusting hole, the outer peripheral surface of the first eccentric end abuts against the hole wall of the first adjusting hole to drive the first bracket to rotate around the first rotating axis, so as to adjust the rotation angle of the first bracket relative to the second bracket in the first rotating direction; And / or, the second adjustment member is an eccentric rod, the second adjustment member includes a second eccentric end and a second operating end that are far away from each other, a second adjustment hole is provided on the second bracket, the second eccentric end extends into the second adjustment hole, the second operating end is rotatably inserted into the frame and is used for operation to drive the second eccentric end to rotate in the second adjustment hole, the outer peripheral surface of the second eccentric end abuts against the hole wall of the second adjustment hole to drive the second bracket to rotate around the second rotation axis, so as to adjust the rotation angle of the second bracket relative to the frame in the second rotation direction; And / or, the cleaning device also includes a fastener, a first positioning hole is provided on the frame, a second positioning hole is provided on the second bracket, the fastener is pluggable and inserted into the first positioning hole and extends into the second positioning hole, when the fastener is pulled out from the second positioning hole, the second bracket can rotate relative to the second bracket, and when the fastener is inserted into the second positioning hole, the fastener can limit the rotation of the second bracket relative to the frame.

9. The cleaning device according to claim 1, characterized in that: The driving mechanism includes a first fixed frame, a first driving assembly, a second fixed frame and a second driving assembly, wherein the first driving assembly is arranged on the first fixed frame, the first driving assembly is connected to the first fixed frame and is used to drive the first fixed frame to perform translational motion along a first direction, and the second driving assembly is arranged on the second fixed frame, the second driving assembly is connected to the cleaning table and is used to drive the cleaning table to perform lifting motion along a second direction; wherein the first direction and the second direction are perpendicular to each other.

10. A semiconductor device, characterized in that: The invention comprises a eutectic head and a cleaning device as claimed in any one of claims 1 to 9.

Images