Cutting machine and diamond wire jumper detection device and detection method of cutting machine

Abstract

The invention discloses a cutting machine and a diamond wire jumper detection device and method of the cutting machine, the detection device comprises a guide rail, the guide rail is arranged on the outer side of at least one guide wheel close to a target silicon piece in the height direction in the width direction, and the axis of the guide rail is parallel or approximately parallel to the axis of the guide wheel close to the target silicon piece; the moving assembly is arranged on the guide rail in a sliding mode and is driven by the driving part to reciprocate along the track of the guide rail; the detection head is used for detecting the displacement value of each diamond wire wound on the guide wheel close to the target silicon piece in the corresponding limiting groove in the length direction, the detection head is located above the guide wheel close to the target silicon piece in the height direction, and the detection head and the guide wheel are arranged in a spaced mode; and the detection head is positioned on one side of the target silicon piece in the width direction and is spaced from the target silicon piece. According to the method, the abnormal working condition of the diamond wire in the cutting process can be detected in time, and false alarm can be avoided so as to improve the detection accuracy.

Description

Technical Field

[0001] The invention relates to the technical field of photovoltaic manufacturing, and in particular to a cutting machine, a diamond wire jumper detection device and a detection method for the cutting machine. Background Art

[0002] Solar cell silicon wafers are cut from silicon blocks or silicon rods by multi-wire cutting machines. With the development trend of the silicon wafer industry, diamond wire multi-wire cutting technology has become the mainstream technology for multi-wire cutting. Diamond wire multi-wire cutting technology is to first wrap the diamond wire around the guide wheel groove of the guide wheel, thereby limiting the horizontal movement of the diamond wire and making its cutting position constant. Multiple diamond wires are wound in circles to form a wire mesh, and the silicon rod is installed on the workbench. The workbench feeds in the direction close to the diamond wire according to the set feed speed. At the same time, the diamond wire moves at high speed to cut the silicon rod into silicon wafers.

[0003] With the advancement of diamond wire thinning and sheeting, the guide wheel groove pitch is getting smaller and smaller, and the groove depth is getting shallower and shallower. During the diamond wire cutting process, acceleration and deceleration, as well as foreign objects, can easily cause the diamond wire to jump out of the guide wheel groove. At the same time, due to the elastic properties of the diamond wire as a string during the forward and reverse switching of the diamond wire cutting, the diamond wire will vibrate. As the vibration amplitude increases, the probability of the diamond wire jumping out of the guide wheel groove will also increase. The diamond wire that jumps out of the guide wheel groove will rub against the diamond wire in the adjacent guide wheel groove, which will cause the diamond wire to break and form a broken wire. After the wire breaks, the machine needs to be stopped to connect or rewire the broken wire, which greatly affects production efficiency and increases production costs.

[0004] In the prior art, in order to timely detect abnormal working conditions of the diamond wire during the cutting process to avoid wire breakage, an infrared transmitter and an infrared receiver are usually set at both ends of the wire roller to monitor whether the diamond wire is in a non-bow state when being cut by a silicon rod or a silicon block.

[0005] However, in order to ensure the detection effect, the infrared transmitter and infrared receiver need to be kept horizontal or slightly lower than the position of the diamond wire when not cutting, and close to the diamond wire. When the diamond wire is cut, cutting fluid needs to be sprayed on the diamond wire to achieve the purpose of cooling and lubrication. The cutting fluid will be thrown as the diamond wire rotates, and it may be thrown on the infrared transmitter and infrared receiver. Since the cutting fluid also contains silicon powder generated during cutting, the signal transmitting and receiving ends of the infrared transmitter and infrared receiver will be blocked, causing the machine to generate false alarms. Summary of the invention

[0006] The technical problem to be solved by the present invention is how to timely detect abnormal working conditions of the diamond wire during the cutting process and avoid false alarms to improve the detection accuracy.

[0007] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

[0008] A diamond wire jumper detection device is used to detect the state of a diamond wire wound on a guide wheel of a cutting mechanism during cutting, wherein the guide wheel is provided with a plurality of limit grooves along the length direction, and the limit grooves of at least two of the guide wheels are matched one-to-one to form a routing track for winding the diamond wire, and a plurality of the diamond wires are wound one-to-one in a plurality of routing tracks to form a diamond wire net in combination, and in the height direction, the diamond wire net is arranged below the target silicon piece to cut the target silicon piece, and the diamond wire jumper detection device comprises:

[0009] A guide rail, in the width direction, the guide rail is arranged on the outer side of at least one guide wheel close to the target silicon component in the height direction, and the axis of the guide rail is parallel or substantially parallel to the axis of the guide wheel close to the target silicon component;

[0010] A moving assembly is slidably disposed on the guide rail and reciprocates along the track of the guide rail under the drive of the driving member;

[0011] A detection head is arranged on the moving component and is used to detect the displacement value of each diamond wire wound on the guide wheel close to the target silicon part in the length direction in the corresponding limit groove. The detection head is located above the guide wheel close to the target silicon part in the height direction and is spaced apart from the guide wheel, and the detection head is located on one side of the target silicon part in the width direction and is spaced apart from the target silicon part.

[0012] Furthermore, the diamond wire mesh is arranged across the portion between the two guide wheels close to the target silicon part in the height direction to form a cutting surface, the projection width of the cutting surface in the height direction is greater than the width of the target silicon part, and the projections of the two guide wheels in the height direction do not overlap, and the detection head is used to detect the displacement value of the diamond wire forming the cutting surface in the corresponding limit groove in the length direction.

[0013] Further, the two guide wheels whose projections in the height direction do not overlap and are close to the target silicon part rotate clockwise, and the detection head is arranged on the left side of the target silicon part in the width direction;

[0014] or;

[0015] The two guide wheels whose projections in the height direction do not overlap and are close to the target silicon part rotate counterclockwise, and the detection head is arranged on the right side of the target silicon part in the width direction;

[0016] or;

[0017] Two guide wheels whose projections in the height direction do not overlap and are close to the target silicon part rotate back and forth clockwise and counterclockwise, and the detection head is arranged on both sides of the target silicon part in the width direction.

[0018] Furthermore, the detection head is connected to the control mechanism of the cutting mechanism by signal, and when the displacement value of the diamond wire detected by the detection head is greater than the displacement protection threshold, the control mechanism controls the guide wheel to stop rotating.

[0019] Furthermore, the detection head includes a diffuse reflection laser displacement sensor, and the emission light emitted by the laser displacement sensor is projected onto the diamond wire constituting the cutting surface, and after the emission light reaches the diamond wire constituting the cutting surface, it is diffusely reflected back to the laser displacement sensor.

[0020] Furthermore, the detection head also includes an alarm component and a controller, and the controller is respectively connected to the alarm component, the laser displacement sensor, and the control mechanism by signal. The controller controls the alarm component to alarm and send a signal to the control mechanism according to the detection result of the laser displacement sensor.

[0021] Furthermore, the diamond wire jumper detection device further comprises a positioning component, and the controller is respectively connected to the positioning component and the driving member by signal;

[0022] The positioning component is used to detect the relative position of the moving component and the guide rail, and the controller controls the driving member to drive the moving component to move forward or backward along the track of the guide rail according to the detection result of the positioning component.

[0023] Furthermore, the positioning component includes triggering members arranged at both ends of the guide rail and an identification member arranged on the moving component, and the identification member is close to or contacts the triggering member so that the triggering member sends a trigger signal to the controller.

[0024] The present invention further provides a detection method applied to the diamond wire jumper detection device as described in any one of the above items, the detection method comprising:

[0025] Step 1: Preset the wire diameter, initial detection position, end detection position and spacing range of adjacent diamond wires of each diamond wire in the diamond wire jumper detection device;

[0026] Step 2: When the diamond wire mesh cuts the target silicon piece, the diamond wire jumper detection device is started to continuously scan the current position data of each diamond wire to obtain the displacement value of each diamond wire and the actual wire spacing between adjacent diamond wires;

[0027] Step 3: Take multiple valid displacement values ​​to calculate the reference value of the diamond wire displacement;

[0028] Step 4: Compare the displacement value of the diamond wire with the reference value of the diamond wire displacement, determine whether the diamond wire jumps based on the comparison result, and issue a shutdown alarm when the diamond wire jumps.

[0029] The present invention also provides a cutting machine, comprising:

[0030] frame;

[0031] A cutting mechanism is mounted on the frame, the cutting mechanism comprises at least two guide wheels, a plurality of limit grooves are arranged on the guide wheels along the length direction, the limit grooves of at least two guide wheels are matched one-to-one to form a routing track for winding diamond wires, and a plurality of diamond wires are wound one-to-one in the plurality of routing tracks to form a diamond wire net;

[0032] a crystal support mechanism, mounted on the frame and located above the cutting mechanism, the crystal support mechanism being used to fix the target silicon piece, and the crystal support mechanism being configured to be able to approach or move away from the cutting mechanism in a height direction, so that the cutting mechanism can cut the target silicon piece; and

[0033] The diamond wire jump detection device as described in any of the above items is used to detect the state of the diamond wire wound on the guide wheel during the cutting process.

[0034] Due to the application of the above technical solution, the beneficial effects of the present invention compared with the prior art are:

[0035] 1. The diamond wire jumper detection device provided by the present invention uses a detection head to detect the displacement value of each diamond wire wound on the guide wheel close to the target silicon part in the corresponding limit groove in the length direction, so that when the diamond wire jumps, the machine is stopped and an alarm is sounded in time to protect the cutting machine, thereby achieving the purpose of preventing wire breakage, avoiding stopping for connecting or rewiring the broken wire, improving production efficiency, and further reducing the silicon chip fragmentation rate caused by wire breakage. Compared with the prior art, in the present application, the detection head is located above the guide wheel close to the target silicon part in the height direction and is spaced from the guide wheel, and the detection head is located on one side of the target silicon part in the width direction and is spaced from the target silicon part, thereby avoiding the detection head from being contaminated by the cutting fluid during the detection process, avoiding the false alarm caused by the detection device being affected by the silicon powder in the cutting fluid, and improving the detection accuracy.

[0036] 2. The detection method of the diamond wire jumper detection device provided by the present invention presets the initial position numerical data and the displacement protection threshold of each diamond wire in the detection device, and then continuously detects the current position numerical data of each diamond wire during the cutting process, and compares the current position numerical data with the preset initial position numerical data to determine whether the diamond wire jumps. The detection method is simple and easy for users to operate.

[0037] 3. The cutting machine provided by the present invention is provided with the diamond wire jumper detection device of the present application. Since the diamond wire jumper detection device can timely detect the abnormal working of the diamond wire during the cutting process and avoid false alarms, compared with the prior art, the cutting machine of the present application has higher production efficiency and better silicon part cutting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 It is a schematic diagram of the three-dimensional structure of a diamond wire jumper detection device according to Embodiment 1 of the present invention;

[0040] Figure 2 It is a front view structural schematic diagram of the diamond wire jumper detection device and the cutting mechanism after being assembled according to Embodiment 1 of the present invention;

[0041] Figure 3 It is a structural schematic diagram when the diamond wire and the limiting groove are matched one to one;

[0042] Figure 4 This is a schematic diagram of the structure of the diamond wire when it is jumper;

[0043] Figure 5 Schematic diagram of the flow of a detection method of a diamond wire jumper detection device according to Embodiment 2 of the present invention;

[0044] Figure 6 It is a schematic diagram of the three-dimensional structure of the cutting machine according to embodiment 3 of the present invention.

[0045] Description of reference numerals:

[0046] 1-guide rail; 11-main body; 12-slide groove; 13-anti-drop end cap; 14-threaded fastener; 2-moving component; 21-guide slide plate; 22-mounting plate; 3-detection head; 31-laser displacement sensor; 4-positioning component; 41-trigger; 42-identification component; 10-diamond wire jumper detection device; 20-cutting mechanism; 201-guide wheel; 202-limiting groove; 203-diamond wire; 30-crystal support mechanism; 100-target silicon part. DETAILED DESCRIPTION

[0047] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0048] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0049] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0050] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0051] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0053] Example 1

[0054] See also Figures 1 to 4 Combined with Figure 6 The diamond wire jumper detection device 10 provided in this embodiment is used to detect the state of the diamond wire 203 wound on the guide wheel 201 of the cutting mechanism 20 during the cutting process, and is connected to the control mechanism (not shown) of the cutting mechanism 20 by signal. Among them, the control mechanism is suitable for controlling the cutting mechanism 20 to stop or run according to the detection result of the diamond wire jumper detection device. The control mechanism can be a processor, a central processing unit, or other general-purpose processors, digital signal processors, application-specific integrated circuits, off-the-shelf programmable gate arrays or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. It is a conventional setting and will not be described here.

[0055] It should be noted that the cutting mechanism 20 has at least two guide wheels 201, each guide wheel 201 is provided with a plurality of limit grooves 202 along the length direction, and the limit grooves 202 of at least two guide wheels 201 are matched one-to-one to form a routing track for winding the diamond wire 203, and the plurality of diamond wires 203 are wound one-to-one in the plurality of routing tracks to form a diamond wire net (such as Figure 3 ), in the height direction, the diamond wire mesh is arranged below the target silicon piece 100 for cutting the target silicon piece 100. The diamond wire mesh is arranged across the portion between the two guide wheels 201 close to the target silicon piece 100 in the height direction to form a cutting surface, the projection width of the cutting surface in the height direction is greater than the width of the target silicon piece 100, and the projections of the two guide wheels 201 in the height direction do not overlap.

[0056] The diamond wire jumper detection device 10 of this embodiment includes a guide rail 1, a moving assembly 2 slidably disposed on the guide rail 1, and a detection head 3 disposed on the moving assembly 2. The moving assembly 2 reciprocates along the track of the guide rail 1 under the drive of a driving member (not numbered) to drive the detection head 3 to reciprocate along the track of the guide rail 1.

[0057] It should be noted that the above-mentioned driving member can be adjusted according to the design requirements, such as motors, cylinders, etc. When the driving member is a cylinder, one end of the cylinder is connected to the moving component 2, and the other end is fixed to the end of the guide rail 1, so that the cylinder can move the moving component 2 along the axial extension and contraction to drive the moving component 2; when the driving member is a motor, the driving member is connected to the moving component 2 through a transmission member to convert the rotational motion of the motor into the horizontal movement of the moving component 2. The transmission member can be a gear transmission, etc. The structures of the transmission member, motor and cylinder are all conventional structures and will not be elaborated here.

[0058] In this embodiment, in the width direction, the guide rail 1 is arranged on the outside of at least one guide wheel 201 close to the target silicon component 100 in the height direction, and the axis of the guide rail 1 is parallel or approximately parallel to the axis of the guide wheel 201 close to the target silicon component 100. Specifically, the guide rail 1 includes a main body 11 and slide grooves 12 relatively opened on the upper and lower sides of the main body 11 along the length direction of the main body 11, the moving component 2 includes a guide slide plate 21 with two ends respectively inserted into the two slide grooves 12 and a mounting plate 22 arranged on the guide slide plate 21, and the detection head 3 is mounted on the mounting plate 22. Anti-detachment end caps 13 are arranged at both ends of the guide rail 1, and the anti-detachment end caps 13 are used to limit the movement of the moving component 2 along the track of the guide rail 1 so as to detach from the guide rail 1 in the length direction. In order to facilitate the subsequent cleaning and maintenance of the moving component 2 and the guide rail 1, the anti-detachment end caps 13 are detachably mounted on the end of the guide rail 1 through threaded fasteners 14.

[0059] It should be noted that the width direction is as follows: Figure 1 As shown by the arrow a in the middle, the height direction is Figure 1 As shown by the arrow b in the middle, the length direction is Figure 1 As shown by arrow c.

[0060] The detection head 3 is used to detect the displacement value of each diamond wire 203 wound on the guide wheel 201 close to the target silicon part 100 in the length direction in the corresponding limit groove 202. The detection head 3 is located above the guide wheel 201 close to the target silicon part 100 in the height direction and is spaced apart from the guide wheel 201, and the detection head 3 is located on one side of the target silicon part 100 in the width direction and is spaced apart from the target silicon part 100.

[0061] By arranging the detection head 3 according to the above position, so that the detection head 3 is located obliquely above the cutting mechanism 20, the detection head 3 is prevented from being contaminated by the cutting fluid during the detection process, thereby avoiding the false alarm caused by the silicon powder in the cutting fluid affecting the detection device, so as to improve the detection accuracy. Among them, the cutting fluid is a liquid sprayed onto the diamond wire mesh during the cutting process for cooling and lubrication. The cutting fluid will be scattered as the diamond wire mesh rotates, and the cutting fluid also contains silicon powder generated during cutting. It is well known to those skilled in the art and will not be elaborated here.

[0062] In order to further improve the detection accuracy, in this embodiment, the detection head 3 is used to detect the displacement value of the diamond wire 203 forming the cutting surface in the length direction in the corresponding limit groove 202. Specifically, the number of guide wheels 201 of the cutting mechanism 20 is three, and the three guide wheels 201 are arranged in an inverted triangle. Of course, in other embodiments, the number of guide wheels 201 can also be set to two, four, five, etc., which is not specifically limited here.

[0063] Specifically, in the height direction, two of the three guide wheels 201 are arranged left and right and are located above the remaining guide wheel 201, and the two guide wheels 201 located above are horizontal, and the portion of the diamond wire mesh spanning between the two guide wheels 201 located above is the cutting surface, and the projection width D of the cutting surface in the height direction is greater than the width D1 of the target silicon part 100 (such as Figure 2 ) so that the cutting surface can completely cut the target silicon piece 100. The detection head 3 is used to detect the diamond wire 203 spanning between the two guide wheels 201 located above. This part of the diamond wire 203 contacts the target silicon piece 100, which is prone to wire jump (such as Figure 4 ), by making the detection head 3 detect only the portion of the diamond wire 203, accurate detection can be achieved, the detection efficiency can be improved and resources can be saved.

[0064] In this embodiment, the detection head 3 can be set on the left side of the target silicon part 100 in the width direction, or on the right side in the width direction, or on both sides in the width direction. Specifically, when the two guide wheels 201 whose projections in the height direction do not overlap and are close to the target silicon part 100 rotate clockwise, the detection head 3 is set on the left side of the target silicon part 100 in the width direction; when the two guide wheels 201 whose projections in the height direction do not overlap and are close to the target silicon part 100 rotate counterclockwise, the detection head 3 is set on the right side of the target silicon part 100 in the width direction; when the two guide wheels 201 whose projections in the height direction do not overlap and are close to the target silicon part 100 reciprocate clockwise and counterclockwise, the detection head 3 is set on both sides of the target silicon part 100 in the width direction. It can be adjusted according to design requirements.

[0065] As can be seen from the foregoing, the diamond wire jumper detection device is connected to the control mechanism signal of the cutting mechanism 20, and the control mechanism can control the cutting mechanism 20 to stop or run according to the detection result of the diamond wire jumper detection device. The detection head 3 is configured to include a diffuse reflection laser displacement sensor 31, and the emission light emitted by the laser displacement sensor 31 is projected on the diamond wire 203 constituting the cutting surface, and after the emission light reaches the diamond wire 203 constituting the cutting surface, it is diffusely reflected back to the laser displacement sensor 31 to detect the displacement value of each diamond wire 203 in the cutting surface in the corresponding limit groove 202 in the length direction. When the detected displacement value is greater than the displacement protection threshold, the control mechanism controls the guide wheel 201 to stop rotating according to the signal, so that the cutting mechanism 20 stops running.

[0066] The diffuse reflection laser displacement sensor 31 is a sensor that uses laser technology for measurement. It is composed of a laser, a laser detector and a measurement circuit. It can accurately measure the position, displacement and other changes of the measured object without contact. It can also measure precise geometric measurements such as displacement, thickness, vibration, distance and diameter.

[0067] It should be noted that the above-mentioned displacement protection threshold is the maximum distance that the diamond wire 203 can move in the length direction in the corresponding limit groove 202. The displacement protection threshold is set according to the width of the limit groove 202 and the cutting accuracy requirements of the target silicon part 100, and the present application does not limit this. For example, the displacement protection threshold corresponding to the diamond wire 203 is determined according to the jumper position of the diamond wire 203. For example, the distance between the position of the diamond wire 203 when jumping and the initial position in the middle of the limit groove 202 can be obtained, and the displacement protection threshold of the diamond wire 203 moving toward both ends at the initial position can be determined according to the obtained distance value. In the above manner, the displacement of the diamond wire 203 from the middle of the limit groove 202 to both ends can be made consistent with the trigger mechanism of the detection head 3 sending a signal to the control mechanism.

[0068] In order to facilitate the user to know the abnormal state of the diamond wire 203, and when the detection head 3 detects the abnormal state of the diamond wire 203, the control mechanism can promptly control the guide wheel 201 to stop rotating, so as to stop the cutting mechanism 20. In this embodiment, the detection head 3 also includes an alarm component (not shown) and a controller (not shown), and the controller is respectively connected to the alarm component, the laser displacement sensor 31 and the control mechanism signal, and the controller controls the alarm component to alarm according to the detection result of the laser displacement sensor 31. Among them, the alarm component can be specifically a combination of one or more of a speaker, a buzzer, an indicator light or a voice prompt, which can be adjusted in combination with design requirements and is not specifically limited here.

[0069] The controller may be a processor, a central processing unit, or other general-purpose processors, digital signal processors, application-specific integrated circuits, off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0070] Taking this embodiment as an example, the measurement method of the above-mentioned laser displacement sensor 31 is laser triangulation. Its working principle is: the laser transmitter emits a visible red laser through a lens to the surface of the object to be measured, that is, the surface of the diamond wire 203 constituting the cutting surface, and the laser reflected by the diamond wire 203 passes through the receiver lens and is received by the internal CCD linear camera. Combined with the known initial position numerical data of the diamond wire 203 and the preset displacement protection threshold, the controller can determine whether the displacement value of the diamond wire 203 in the corresponding limit groove 202 in the length direction is within the displacement protection threshold range. And send a signal to the control mechanism according to the detection result.

[0071] In order to enable the moving component 2 to reciprocate on the guide rail 1 to achieve continuous detection of the diamond wire 203, in this embodiment, the diamond wire jumper detection device 10 also includes a positioning component 4, and the controller is respectively connected to the positioning component 4 and the driving member by signal. Among them, the positioning component 4 is used to detect the relative position of the moving component 2 and the guide rail 1. The controller controls the driving member to drive the moving component 2 to move forward or backward along the track of the guide rail 1 according to the detection result of the positioning component 4 (combined with the detection result of the positioning component 4). Figure 1 coordinate system).

[0072] Specifically, the positioning assembly 4 includes a trigger member 41 disposed at both ends of the guide rail 1 and an identification member 42 disposed on the moving assembly 2, and the identification member 42 is close to or contacts the trigger member 41, so that the trigger member 41 sends a trigger signal to the controller. Among them, the identification member 42 can be disposed at the top and / or bottom of the guide slide 21, and the identification member 42 can be integrally formed with the guide slide 21, or the identification member 42 is fixedly mounted on the top of the guide slide 21, or the identification member 42 is detachably mounted on the top of the guide slide 21. In this embodiment, the identification member 42 is detachably mounted on the top of the guide slide 21 by bolts as an example for explanation, and the two trigger members 41 are respectively disposed at both ends of the top of the guide rail 1 and fixed to the guide rail 1 by bolts.

[0073] In some optional embodiments, the trigger member 41 is a switch device, and the switch device is displaced to be triggered when it contacts the identification member 42. The identification member 42 is correspondingly configured as a structure that can contact the switch device, such as a plate or a column mounted on the guide plate 21. During the detection process, the rectangular plate moves along the track of the guide rail 1 with the guide plate 21 under the drive of the driving member. When the guide plate 21 moves to the end of the guide rail 1, the rectangular plate contacts the switch device to cause the switch device to be displaced and triggered.

[0074] The switch device has a transmission element on the outside and a contact that cooperates with the transmission element on the inside. There is a certain distance between the transmission element and the contact. The transmission element can be a pin, a button, a lever, a roller, etc. The external force acts on the transmission element to move the transmission element toward the contact until the transmission element contacts the contact. At this time, the switch device is triggered to send a signal to the control. Among them, the above-mentioned external force is provided by a rectangular plate. The wiring method, structure and working principle of the switch device are conventional technologies, and their types are not specifically limited here.

[0075] In some other optional embodiments, the trigger member 41 is a pressure sensor, and the pressure sensor is triggered when it contacts the identification member 42. Specifically, the guide rail 1 and the guide slide 21 are both provided with a docking portion for docking with each other, and the pressure sensor is provided on the docking portion of the guide rail 1. The docking portion on the guide slide 21 forms the identification member 42, and the identification member 42 is a structure that can at least partially contact the docking portion of the guide rail 1, such as a plate or a column. The driving member drives the moving assembly 2 to move along the track of the guide rail 1, so that the identification member 42 contacts the docking portion on either end of the guide rail 1, and under the continuous drive of the driving member, pressure is applied to the pressure sensor to trigger it and send a signal to the controller.

[0076] A pressure sensor is a device or apparatus that can sense pressure signals and convert them into usable output electrical signals according to certain rules. Pressure sensors are usually composed of pressure sensitive elements and signal processing units. According to different test pressure types, pressure sensors can be divided into gauge pressure sensors, differential pressure sensors and absolute pressure sensors. Its wiring method, structure and working principle are conventional technologies and will not be elaborated in detail here.

[0077] In some other optional embodiments, the positioning component 4 is a photoelectric sensor. Specifically, the receiver and detection circuit of the photoelectric sensor are installed on the end of the guide rail 1 as a trigger 41, and the transmitter is installed on the guide plate as an identification member 42. The photoelectric sensor is a device that converts light signals (infrared, visible and ultraviolet radiation) into electrical signals, and is generally composed of a transmitter, a receiver and a detection circuit.

[0078] It should be noted that the structure of the positioning component 4 is not limited to the above three embodiments, and can also be set as a combination of any two of the above three embodiments. In addition, without creative work, other conventional structures can be obtained based on the structure of the above positioning component 4 as the positioning component 4, such as setting the positioning component 4 as a Hall sensor, etc. No examples are given here.

[0079] Example 2

[0080] See also Figure 5 This embodiment provides a detection method applied to a diamond wire jumper detection device. The structure of the diamond wire jumper detection device is the same as or similar to the structure of the diamond wire jumper detection device in Example 1. For details, please refer to Example 1 and will not be elaborated here.

[0081] The diamond wire jumper detection device can detect the state of the diamond wire wound on the guide wheel of the cutting machine during the cutting process, so as to timely detect the abnormal working situation of the diamond wire during the cutting process. The corresponding detection method is as follows:

[0082] Step 1: Preset the wire diameter, initial detection position, end detection position and spacing range of adjacent diamond wires of each diamond wire in the diamond wire jumper detection device.

[0083] Specifically, the diamond wire jumper detection device sets the starting detection position x1 and the ending detection position x2 according to the wire mesh distance of the arranged diamond wires. The system automatically calculates the detection range x, and sets the spacing range as of adjacent diamond wires and the wire diameter d of the diamond wire according to the guide wheel groove pitch.

[0084] Step 2: When the diamond wire mesh is cutting the target silicon piece, start the diamond wire jumper detection device to continuously scan the current position data of each diamond wire to obtain the displacement value of each diamond wire and the actual wire spacing between adjacent diamond wires.

[0085] Specifically, according to the operating state of the cutting machine, it is determined to start the left detection head 3 or the right detection head 3 or the detection heads 3 on both sides. When the detection head 3 moves driven by the moving component 2, the actual line spacing value am is obtained according to the displacement value tn of the detected diamond wire.

[0086] Step 3: Take multiple valid displacement values ​​to calculate the reference value of the diamond wire displacement.

[0087] Specifically, when the actual wire spacing value am is within the set spacing range as, the displacement value tn of the diamond wire detected at this time is a valid value. The average value of 3 or more displacement values ​​(t1, t2, t3) is taken as the reference value tb of the diamond wire displacement = (t1 + t2 + t3) / 3. Due to the different degrees of wear of the diamond wire, the cutting ability of each diamond wire is different, which will cause the wire bow formed by the diamond wire to change. At this time, the displacement value tn detected by the detection head 3 will move forward with the detection head 3, and the reference value tb of each section of the wire network will change, tb = (t(n-2) + t(n-1) + tn) / 3.

[0088] Step 4: Compare the displacement value of the diamond wire with the reference value of the diamond wire displacement, determine whether the diamond wire jumps based on the comparison result, and issue a shutdown alarm when the diamond wire jumps.

[0089] Specifically, the displacement value tn of a single diamond wire is compared with the reference value tb. When the difference is greater than 60% of the wire diameter of the diamond wire, that is, tb-t(n-2)≥0.6d, it is considered that a jumper fault occurs in the diamond wire, and the machine is shut down and an alarm is sounded.

[0090] As mentioned above, the diamond wire jumper detection device also includes: a memory and data stored in the memory that can be retrieved and deleted and / or a computer program that can be run on the controller, such as the initial position numerical data and displacement protection threshold data of each diamond wire, and a program for comparing the initial position numerical data of each diamond wire with the current position numerical data of each diamond wire. The memory can be an internal storage unit on the controller or an external storage device, such as a smart memory card, a secure digital card, a flash memory card, etc. The controller implements the steps in the above detection method when executing the computer program.

[0091] It should be noted that the computer program for the controller to execute to implement the steps in the above detection method can be implemented using an existing control program, which will not be described in detail here.

[0092] Example 3

[0093] See also Figure 6 Combined with Figure 2 The cutting machine provided in this embodiment includes a frame (not shown), a cutting mechanism 20 and a crystal support mechanism 30 installed on the frame, and a diamond wire jumper detection device 10, which is used to detect whether there is a jumper on the diamond wire 203 on the cutting mechanism 20 during the cutting process.

[0094] Specifically, the cutting mechanism 20 includes at least two guide wheels 201, and a plurality of limit grooves 202 are arranged on the guide wheels 201 along the length direction. The limit grooves 202 of at least two guide wheels 201 are matched one-to-one to form a routing track for winding diamond wires 203, and a plurality of diamond wires 203 are wound one-to-one in a plurality of routing tracks to form a diamond wire net. The crystal support mechanism 30 is located above the cutting mechanism 20, and is used to fix the target silicon part 100, and the crystal support mechanism 30 is configured to be close to or away from the cutting mechanism 20 in the height direction, so that the cutting mechanism 20 cuts the target silicon part 100.

[0095] In this embodiment, the cutting mechanism 20 is provided with three guide wheels 201, which are arranged in an inverted triangle, and two guide wheels 201 close to the target silicon part 100 in the height direction are arranged horizontally, and the number of diamond wire jumper detection devices 10 is set to two, and they are respectively arranged on the outside of the two guide wheels 201 close to the target silicon part 100 in the height direction. Of course, in other embodiments, the guide wheels 201 can also be set to two or four, which is not specifically limited here.

[0096] In this embodiment, the structure of the diamond wire jumper detection device 10 is similar to or the same as that of the diamond wire jumper detection device in Embodiment 1. For details, please refer to Embodiment 1 and no further details will be given here.

[0097] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A diamond wire jumper detection device, used for detecting the state of the diamond wire wound on the guide wheel of the cutting mechanism during the cutting process, the guide wheel is provided with a plurality of limit grooves along the length direction, the limit grooves of at least two of the guide wheels are matched one-to-one to form a routing track for winding the diamond wire, a plurality of the diamond wires are wound one-to-one in a plurality of routing tracks to form a diamond wire net, in the height direction, the diamond wire net is arranged below the target silicon piece for cutting the target silicon piece, characterized in that, The diamond wire jumper detection device comprises: A guide rail, in the width direction, the guide rail is arranged on the outer side of at least one guide wheel close to the target silicon component in the height direction, and the axis of the guide rail is parallel or substantially parallel to the axis of the guide wheel close to the target silicon component; A moving assembly is slidably disposed on the guide rail and reciprocates along the track of the guide rail under the drive of the driving member; A detection head is arranged on the moving component and is used to detect the displacement value of each diamond wire wound on the guide wheel close to the target silicon part in the length direction in the corresponding limit groove. The detection head is located above the guide wheel close to the target silicon part in the height direction and is spaced apart from the guide wheel, and the detection head is located on one side of the target silicon part in the width direction and is spaced apart from the target silicon part.

2. The diamond wire jumper detection device according to claim 1, characterized in that: The diamond wire mesh is arranged across the portion between the two guide wheels close to the target silicon part in the height direction to form a cutting surface, the projection width of the cutting surface in the height direction is greater than the width of the target silicon part, and the projections of the two guide wheels in the height direction do not overlap, and the detection head is used to detect the displacement value of the diamond wire forming the cutting surface in the corresponding limit groove in the length direction.

3. The diamond wire jumper detection device according to claim 2, characterized in that: The two guide wheels whose projections in the height direction do not overlap and are close to the target silicon part rotate clockwise, and the detection head is arranged on the left side of the target silicon part in the width direction; or; The two guide wheels whose projections in the height direction do not overlap and are close to the target silicon part rotate counterclockwise, and the detection head is arranged on the right side of the target silicon part in the width direction; or; Two guide wheels whose projections in the height direction do not overlap and are close to the target silicon part rotate back and forth clockwise and counterclockwise, and the detection head is arranged on both sides of the target silicon part in the width direction.

4. The diamond wire jumper detection device according to claim 3, characterized in that: The detection head is connected to the control mechanism of the cutting mechanism by signal. When the displacement value of the diamond wire detected by the detection head is greater than the displacement protection threshold, the control mechanism controls the guide wheel to stop rotating.

5. The diamond wire jumper detection device according to claim 4, characterized in that: The detection head includes a diffuse reflection laser displacement sensor, and the emission light emitted by the laser displacement sensor is projected onto the diamond wire constituting the cutting surface, and after the emission light reaches the diamond wire constituting the cutting surface, it is diffusely reflected back to the laser displacement sensor.

6. The diamond wire jumper detection device according to claim 5, characterized in that: The detection head also includes an alarm component and a controller. The controller is respectively connected to the alarm component, the laser displacement sensor, and the control mechanism by signal. The controller controls the alarm component to alarm and send a signal to the control mechanism according to the detection result of the laser displacement sensor.

7. The diamond wire jump detection device according to claim 6, characterized in that: The diamond wire jumper detection device further includes a positioning component, and the controller is respectively connected to the positioning component and the driving member by signal; The positioning component is used to detect the relative position of the moving component and the guide rail, and the controller controls the driving member to drive the moving component to move forward or backward along the track of the guide rail according to the detection result of the positioning component.

8. The diamond wire jumper detection device according to claim 7, characterized in that: The positioning component includes triggering members arranged at both ends of the guide rail and an identification member arranged on the moving component. The identification member is close to or contacts the triggering member, so that the triggering member sends a trigger signal to the controller.

9. A detection method applied to the diamond wire jumper detection device according to any one of claims 1 to 8, characterized in that: The detection method comprises: Step 1: Preset the wire diameter, initial detection position, end detection position and spacing range of adjacent diamond wires of each diamond wire in the diamond wire jumper detection device; Step 2: When the diamond wire mesh cuts the target silicon piece, the diamond wire jumper detection device is started to continuously scan the current position data of each diamond wire to obtain the displacement value of each diamond wire and the actual wire spacing between adjacent diamond wires; Step 3: Take multiple valid displacement values ​​to calculate the reference value of the diamond wire displacement; Step 4: Compare the displacement value of the diamond wire with the reference value of the diamond wire displacement, determine whether the diamond wire jumps based on the comparison result, and issue a shutdown alarm when the diamond wire jumps.

10. A cutting machine, characterized in that: include: frame; A cutting mechanism is mounted on the frame, the cutting mechanism comprises at least two guide wheels, a plurality of limit grooves are arranged on the guide wheels along the length direction, the limit grooves of at least two guide wheels are matched one-to-one to form a routing track for winding diamond wires, and a plurality of diamond wires are wound one-to-one in the plurality of routing tracks to form a diamond wire net; A crystal support mechanism is installed on the frame and located above the cutting mechanism, the crystal support mechanism is used to fix the target silicon piece, and the crystal support mechanism is configured to be able to approach or move away from the cutting mechanism in the height direction, so that the cutting mechanism can cut the target silicon piece; as well as The diamond wire jumper detection device according to any one of claims 1 to 8 is used to detect the state of the diamond wire wound on the guide wheel during the cutting process.

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