A single crystal silicon wafer surface defect detection device

Abstract

The present invention discloses a single crystal silicon wafer surface defect detection device, wherein: the detection platform is located at the tail of the feeding mechanism; a first rodless cylinder is installed on one side of the bottom plate, and a support rod is provided on the upper surface of the first slider of the first rodless cylinder; a second rodless cylinder is installed horizontally on the upper surface of the support rod; a first telescopic rod is installed on the lower surface of the second slider of the second rodless cylinder; a driving motor is installed on the push rod of the first telescopic rod, and a cross bar is installed on the driving motor; a fixed image acquisition device and an image acquisition device that can move left and right are installed on the lower surface of the cross bar. The present invention moves the single crystal silicon wafer to the workbench for detection by setting a feeding mechanism, and takes photos of the single crystal silicon wafer through the image acquisition device. By setting an adjustable and movable image acquisition device at the lower end of the cross bar, scanning and detection of silicon wafers of different specifications and sizes can be realized, thereby expanding the scope of use of the device, improving versatility, and reducing production costs.

Description

Technical Field

[0001] The invention belongs to the technical field of single silicon wafer detection, and in particular relates to a single crystal silicon wafer surface defect detection device. Background Art

[0002] At present, the trend of new energy industry is obvious, and the photovoltaic industry is developing rapidly. As the main raw material of solar cells, silicon wafers have led to an increasing demand for silicon wafers. Moreover, the flatness of the silicon wafer surface directly affects the quality of solar cells. Using unqualified silicon wafers to make solar cells may cause the solar cells to be directly scrapped, which is a waste of cost and resources.

[0003] Most of the existing silicon wafer surface inspection equipment is dedicated equipment, which can only inspect a single type of silicon wafer and has poor versatility. To solve this problem, a single crystal silicon wafer surface defect inspection device is now designed. Summary of the invention

[0004] The purpose of the present invention is to provide a single crystal silicon wafer surface defect detection device, which moves the single crystal silicon wafer to a workbench for detection through a loading mechanism, photographs the single crystal silicon wafer for detection through an image acquisition device, and moves the detected silicon wafer to a unloading conveyor belt through a unloading structure; the problem of realizing automated testing of single crystal silicon wafers and the versatility of detection equipment are solved.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a single crystal silicon wafer surface defect detection device, comprising a workbench and a loading mechanism arranged on one side of the workbench; the workbench is provided with a detection table for performing surface defect detection on silicon wafers, and a unloading mechanism for unloading; the detection table is located at the tail of the loading mechanism, and the detection table comprises a base plate, and a backlight plate is installed on the upper surface of the base plate; a side plate for detecting and positioning the silicon wafer is respectively provided on the adjacent two sides of the upper surface of the base plate; a first rodless cylinder is installed on one side of the base plate, and a support rod is provided on the upper surface of the first slider of the first rodless cylinder; a second rodless cylinder is horizontally installed on the upper surface of the support rod; a first telescopic rod is installed on the lower surface of the second slider of the second rodless cylinder; a mounting plate is provided on the push rod of the first telescopic rod, a driving motor is installed in the middle of the lower surface of the mounting plate, and a cross bar is installed on the rotating shaft of the driving motor; a fixedly installed image acquisition device and an image acquisition device that can be moved left and right are installed on the lower surface of the cross bar.

[0007] As a preferred technical solution of the present application, the loading mechanism includes a loading conveyor belt for feeding and a loading control console; a loading robot for moving the silicon wafers on the loading conveyor belt to the workbench is installed in the middle of the upper surface of the loading control console.

[0008] As a preferred technical solution of the present application, the unloading mechanism includes a unloading conveyor belt for unloading; and an unloading robot arm for moving the inspected silicon wafers to the unloading conveyor belt.

[0009] As a preferred technical solution of the present application, a gripping mechanism is installed at one end of the loading robot and the unloading robot that contacts the silicon wafer; a plurality of vacuum suction cups are installed on the gripping mechanism, and the gripping mechanism adsorbs and fixes the silicon wafer through the vacuum suction cups.

[0010] As a preferred technical solution of the present application, the base plate is fixed to the upper surface of the workbench by a plurality of fixing columns.

[0011] As a preferred technical solution of the present application, a fixing plate is respectively provided at the two outer ends of the side plate, a second telescopic rod is provided on the outer side surface of the fixing plate, a push rod of the second telescopic rod passes through the fixing plate, and a push plate for fixing the silicon wafer is installed at the end.

[0012] As a preferred technical solution of the present application, the fixedly installed image acquisition device is installed at one end of the lower surface of the cross bar; a slide groove is provided at the other end of the lower surface of the cross bar, and a limit groove is respectively provided on the two opposite inner sides of the slide groove; a lead screw is provided in the middle of the slide groove, and one end of the lead screw is connected to the rotating shaft of the lead screw motor; a third slider is movably installed in the middle of the slide groove, and a threaded hole meshing with the lead screw is provided on the side of the third slider; the lead screw drives the third slider to move left and right along the slide groove; an image acquisition device is installed on the lower surface of the third slider.

[0013] As a preferred technical solution of the present application, a limit baffle is respectively installed at both ends of the third sliding block; a through groove for the lead screw to pass through is provided in the middle of the upper surface of the limit baffle; a limit block cooperating with the limit groove is respectively provided on the two opposite side surfaces of the limit baffle; a mounting seat is respectively provided at both ends of the lower surface of the limit baffle, a mounting hole is provided in the middle of the mounting seat, and a fixing bolt for fixing the limit baffle is installed in the mounting hole.

[0014] As a preferred technical solution of the present application, the two adjacent side surfaces of the mounting plate are respectively provided with a side plate, and a contact switch for controlling the rotation direction of the screw motor is provided in the middle of the bottom of the inner side surface of the two side plates, and the contact switch cooperates with the contact block installed on the upper surface of the cross bar.

[0015] The present invention has the following beneficial effects:

[0016] The present invention moves the single crystal silicon wafer to the workbench for testing by setting a loading mechanism, and takes photos of the single crystal silicon wafer for testing by an image acquisition device, thereby replacing manual visual inspection and improving the testing efficiency; and moves the tested silicon wafer to a feeding conveyor belt by a feeding structure, thereby realizing the automated testing of the single crystal silicon wafer;

[0017] And by arranging the side plate, the second telescopic rod and the push plate on the testing table to coordinately position and fix the silicon wafer, the initial positioning of the loaded silicon wafer is achieved, and it can be applied to silicon wafers of different specifications and sizes;

[0018] The crossbar is controlled to rotate by setting a driving motor, the crossbar is driven to move in different directions by setting a first rodless cylinder and a second rodless cylinder, and an image acquisition device is set on the lower surface of the crossbar to scan the silicon wafer; scanning and detecting the edges of the silicon wafer in different directions is realized;

[0019] By arranging an adjustable and movable image acquisition device at the lower end of the crossbar, scanning and detection of silicon wafers of different specifications and sizes can be realized, thereby expanding the application range of the device, improving versatility and reducing production costs.

[0020] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0022] Figure 1 It is a structural schematic diagram of a single crystal silicon wafer surface defect detection device;

[0023] Figure 2 It is the structural diagram of the testing platform;

[0024] Figure 3 It is a structural schematic diagram of the detection platform from another perspective;

[0025] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0026] Figure 5 is a schematic diagram of the structure of the crossbar from an upward viewing angle;

[0027] Figure 6 is a cross-sectional view of the crossbar;

[0028] Figure 7 A cross-sectional view of the limit baffle. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] See also Figure 1-7 As shown, the present invention is a single crystal silicon wafer surface defect detection device, comprising a workbench 4 and a loading mechanism arranged on one side of the workbench 4; the loading mechanism comprises a loading conveyor belt 1 for feeding and a loading control console 2; a loading manipulator 201 for moving the silicon wafer 3 on the loading conveyor belt 1 to the workbench 4 is installed in the middle of the upper surface of the loading control console 2;

[0032] The workbench 4 is provided with a detection table 5 for performing surface defect detection on the silicon wafer 3, and a material unloading mechanism for unloading; the material unloading mechanism includes a material unloading conveyor belt 8 for unloading; and a material unloading manipulator 6 for moving the silicon wafer after detection to the material unloading conveyor belt 8;

[0033] The ends of the loading robot 201 and the unloading robot 6 that are in contact with the silicon wafer 3 are equipped with a gripping mechanism 7 ; a plurality of vacuum suction cups 701 are installed on the gripping mechanism 7 , and the gripping mechanism 7 adsorbs and fixes the silicon wafer 3 through the vacuum suction cups 701 .

[0034] The inspection table 5 is located at the tail end of the loading mechanism, and the inspection table 5 includes a base plate 501, which is fixed on the upper surface of the workbench 4 by a plurality of fixing columns 5012; a backlight plate 5011 is installed on the upper surface of the base plate 501; two adjacent sides of the upper surface of the base plate 501 are respectively provided with a side plate 5013 for detecting and positioning the silicon wafer 3; the two outer ends of the side plate 5013 are respectively provided with a fixing plate 5014, and the outer side surface of the fixing plate 5014 is provided with a second telescopic rod 502, the push rod of the second telescopic rod 502 passes through the fixing plate 5014, and a push plate 5021 for fixing the silicon wafer 3 is installed at the end. As a supplementary solution to this embodiment, the end surface of the push plate 5021 is compounded with a layer of rubber pad, and the rubber pad is provided for buffering to prevent the push plate 5021 from causing damage to the silicon wafer 3.

[0035] A first rodless cylinder 503 is installed on one side of the base plate 501, and a support rod 504 is provided on the upper surface of the first slider 5031 of the first rodless cylinder 503; a second rodless cylinder 505 is horizontally installed on the upper surface of the support rod 504; a first telescopic rod 506 is installed on the lower surface of the second slider 5051 of the second rodless cylinder 505; a mounting plate 5061 is provided on the push rod of the first telescopic rod 506, a driving motor 507 is installed in the middle of the lower surface of the mounting plate 5061, and a cross bar 508 is installed on the rotating shaft of the driving motor 507; a fixed image acquisition device 509 and an image acquisition device 509 that can be moved left and right are installed on the lower surface of the cross bar 508.

[0036] In one embodiment, the image acquisition device 509 uses a CCD camera to scan and photograph the edge of the silicon wafer 3, and then transmits the image data to the processor for comparison processing, thereby realizing the detection of surface defects of the silicon wafer 3.

[0037] Preferably, in one embodiment, a fixedly mounted image acquisition device 509 is mounted on one end of the lower surface of the cross bar 508; a slide groove 5082 is provided at the other end of the lower surface of the cross bar 508, and a limit groove 5087 is respectively provided on two opposite inner side surfaces of the slide groove 5082; a lead screw 5083 is provided in the middle of the slide groove 5082, and one end of the lead screw 5083 is connected to the rotating shaft of the lead screw motor 5085; a third slider 5084 is movably installed in the middle of the slide groove 5082, and a threaded hole meshing with the lead screw 5083 is provided on the side of the third slider 5084; the lead screw 5083 drives the third slider 5084 to move left and right along the slide groove 5082; an image acquisition device 509 is installed on the lower surface of the third slider 5084.

[0038] Among them, a limit baffle 5086 is respectively installed at both ends of the third slider 5084; a through groove 50861 is provided in the middle of the upper surface of the limit baffle 5086 for the screw 5083 to pass through; the two opposite side surfaces of the limit baffle 5086 are respectively provided with a limit block 80862 that cooperates with the limit groove 5087; a mounting seat 50863 is respectively provided at both ends of the lower surface of the limit baffle 5086, and a mounting hole 80864 is provided in the middle of the mounting seat 50863, and a fixing bolt for fixing the limit baffle 5086 is installed in the mounting hole 80864.

[0039] The working principle and beneficial effects of the above technical solution are:

[0040] The third slider 5084 is driven to slide along the slide groove 5082 by the lead screw motor 5085, thereby adjusting the position of the image acquisition device 509, and the distance between the two image acquisition devices 509 is controlled by adjusting the position of the limit baffle 5086;

[0041] By arranging an adjustable and movable image acquisition device 509 at the lower end of the crossbar 508, scanning and detection of silicon wafers 3 of different specifications and sizes can be achieved, thereby expanding the application range of the device, improving versatility, and reducing production costs.

[0042] Preferably, in one embodiment, two adjacent side surfaces of the mounting plate 5061 are respectively provided with a side plate 5062, and a contact switch 5063 for controlling the rotation direction of the screw motor 5085 is provided in the middle of the bottom of the inner side surface of each side plate 5062, and the contact switch 5063 cooperates with the contact block 5081 installed on the upper surface of the cross bar 508.

[0043] The working principle of the above technical solution is:

[0044] In the initial state, the staff adjusts the positions of the two limit baffles 5086 according to the size of the silicon wafer 3 to be tested;

[0045] When the crossbar 508 is in the horizontal position in the initial state, the contact block 5081 contacts the contact switch 5063 on the horizontal side plate 5062, controls the lead screw motor 5085 to rotate forward, drives the third slider 5084 to move forward until it hits the limit baffle 5086 at the front end, and the lead screw motor 5085 stops rotating, controls the first rodless cylinder 503 to operate and controls the first slider 5031 to move from left to right to scan the two longitudinal edges of the silicon wafer 3; after the scanning is completed, the first slider 5031 returns to the initial position;

[0046] The driving motor 507 is controlled to rotate 90° so that the crossbar 508 is adjusted to the longitudinal position, the contact block 5081 contacts the contact switch 5063 on the longitudinal side plate 5062, the lead screw motor 5085 is controlled to reverse, and the third slider 5084 is driven to move backward until it hits the rear end limit baffle 5086, the lead screw motor 5085 stops rotating, and the second rodless cylinder 505 is controlled to operate and control the second slider 5051 to move from left to right to scan the two lateral edges of the silicon wafer 3; after the scanning is completed, the second slider 5051 returns to the initial position;

[0047] Thus, the two image acquisition devices 509 are used to acquire images of the edge positions of the silicon wafer 3 in four directions, and the acquired image data is processed by the processor.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0049] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A single crystal silicon wafer surface defect detection device, characterized in that: It comprises a workbench (4) and a loading mechanism arranged on one side of the workbench (4); The workbench (4) is provided with a detection table (5) for performing surface defect detection on the silicon wafer (3), and a material unloading mechanism for unloading materials; The detection platform (5) is located at the rear of the loading mechanism, and comprises a bottom plate (501), and a backlight plate (5011) is installed on the upper surface of the bottom plate (501); two adjacent sides of the upper surface of the bottom plate (501) are respectively provided with a side plate (5013) for detecting and positioning the silicon wafer (3); A first rodless cylinder (503) is installed on one side of the bottom plate (501), and a support rod (504) is provided on the upper surface of a first slider (5031) of the first rodless cylinder (503); a second rodless cylinder (505) is installed transversely on the upper surface of the support rod (504); A first telescopic rod (506) is installed on the lower surface of the second sliding block (5051) of the second rodless cylinder (505); a mounting plate (5061) is provided on the push rod of the first telescopic rod (506), a driving motor (507) is installed in the middle of the lower surface of the mounting plate (5061), and a cross bar (508) is installed on the rotating shaft of the driving motor (507); A fixed image acquisition device (509) and an image acquisition device (509) movable left and right are installed on the lower surface of the crossbar (508); The fixedly mounted image acquisition device (509) is mounted on one end of the lower surface of the crossbar (508); A slide groove (5082) is provided at the other end of the lower surface of the crossbar (508), and two opposite inner side surfaces of the slide groove (5082) are respectively provided with a limiting groove (5087); A lead screw (5083) is provided in the middle of the slide groove (5082), and one end of the lead screw (5083) is connected to the rotating shaft of the lead screw motor (5085); A third sliding block (5084) is movably installed in the middle of the sliding groove (5082), and a threaded hole meshing with the lead screw (5083) is provided on the side surface of the third sliding block (5084); The lead screw (5083) drives the third slider (5084) to move left and right along the slide groove (5082); an image acquisition device (509) is installed on the lower surface of the third slider (5084).

2. The single crystal silicon wafer surface defect detection device according to claim 1, characterized in that: The feeding mechanism comprises a feeding conveyor belt (1) for feeding materials and a feeding control console (2); A loading robot (201) for moving the silicon wafer (3) on the loading conveyor belt (1) to the workbench (4) is installed in the middle of the upper surface of the loading control console (2).

3. The single crystal silicon wafer surface defect detection device according to claim 2, characterized in that: The unloading mechanism comprises a unloading conveyor belt (8) for unloading materials; And a material unloading robot (6) for moving the inspected silicon wafer to a material unloading conveyor belt (8).

4. The single crystal silicon wafer surface defect detection device according to claim 3, characterized in that: A gripping mechanism (7) is installed at one end of the loading robot (201) and the unloading robot (6) that contacts the silicon wafer (3); A plurality of vacuum suction cups (701) are installed on the grasping mechanism (7), and the grasping mechanism (7) absorbs and fixes the silicon wafer (3) via the vacuum suction cups (701).

5. The single crystal silicon wafer surface defect detection device according to claim 1, characterized in that: The bottom plate (501) is fixed on the upper surface of the workbench (4) via a plurality of fixing columns (5012).

6. The single crystal silicon wafer surface defect detection device according to claim 1, characterized in that: A fixing plate (5014) is respectively provided at the two outer ends of the side plate (5013); a second telescopic rod (502) is provided on the outer side surface of the fixing plate (5014); a push rod of the second telescopic rod (502) passes through the fixing plate (5014), and a push plate (5021) for fixing the silicon wafer (3) is installed at the end thereof.

7. The single crystal silicon wafer surface defect detection device according to claim 1, characterized in that: A limit baffle (5086) is respectively installed at both ends of the third sliding block (5084); A through groove (50861) for the lead screw (5083) to pass through is provided in the middle of the upper surface of the limit baffle (5086); Two opposite side surfaces of the limit baffle (5086) are respectively provided with a limit block (80862) that cooperates with the limit groove (5087); A mounting seat (50863) is respectively provided at both ends of the lower surface of the limit baffle (5086), a mounting hole (80864) is provided in the middle of the mounting seat (50863), and a fixing bolt for fixing the limit baffle (5086) is installed in the mounting hole (80864).

8. The single crystal silicon wafer surface defect detection device according to claim 1, characterized in that: Two adjacent side surfaces of the mounting plate (5061) are respectively provided with a side plate (5062), and a contact switch (5063) for controlling the rotation direction of the lead screw motor (5085) is provided in the middle of the bottom of the inner side surface of each of the side plates (5062), and the contact switch (5063) cooperates with a contact block (5081) installed on the upper surface of the cross bar (508).

Images