Method for measuring quality of chemical nickel electroplated layer of electroplated product based on resistance meter

Abstract

The invention relates to a method for measuring the quality of a chemical nickel electroplated layer of an electroplated product based on a resistance meter. The specific quality measurement method comprises the following steps: S1, carrying out an electroplating experiment on the product; s2, detecting electroplated products with defects; s3, establishing a measurement standard; s4, product quality detection: measuring the resistance of the nickel coating on the surface of the product by adopting a resistance meter, and evaluating the compactness and conductivity of the nickel coating on the surface of the product according to the range of the resistance of the nickel coating; the detection mode can quickly evaluate the chemical nickel deposition quality, and avoids poor blistering performance of a plating layer caused by poor conductivity of the chemical nickel; the method for detecting the compactness and the conductivity of the chemical nickel electroplated layer is simple, rapid and convenient to operate; the detection efficiency of products is greatly improved, and the qualified rate of product production is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating, and in particular to a method for measuring the quality of chemical nickel electroplating layers of electroplated products based on an ohmmeter. Background Art

[0002] Conventional chemical nickel plating products use the chemical nickel dissolution method to measure the reaction speed during electroplating; this method has hysteresis and can only evaluate the reaction speed (calculate thickness), but cannot evaluate the quality of chemical nickel deposition, such as density, conductivity, etc.

[0003] Therefore, in order to quickly evaluate the chemical nickel deposition quality of the product and avoid adverse phenomena such as blistering of the coating caused by the poor conductivity of chemical nickel, a new measurement method is needed to quickly detect the quality of the product's electroplating layer. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for measuring the quality of the chemical nickel electroplating layer of an electroplated product based on an ohmmeter, which can solve the problem that the reaction rate of general chemical nickel electroplated products is measured by the chemical nickel dissolution method to calculate the thickness of the electroplating layer, which has a lag and cannot evaluate the density and conductivity of the product plating layer.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: a method for measuring the quality of chemical nickel electroplating layer of electroplating products based on an ohmmeter, and its innovation lies in: the specific quality measurement method is as follows:

[0006] S1: Product electroplating experiment: Use several square plates of the same material as the product to be electroplated as experimental substrates, and mark the reverse side of the experimental substrates to distinguish the slots; perform pre-plating treatment on the experimental substrates; then evenly place several square plates in each chemical nickel electroplating tank for surface electroplating; electroplate qualified experimental substrates and experimental substrates with density defects and thickness defects respectively; then take out the experimental substrates after electroplating, rinse them with pure water and blow dry them, take them to the laboratory, select qualified experimental substrates, use a multimeter to measure the surface resistance of the experimental substrates, and record the resistance value R1 of each experimental substrate;

[0007] S2: Detection of defective electroplated products: Use a multimeter to measure the surface resistance of the experimental substrate with density defects and thickness defects, and record the resistance value R2 of each experimental substrate;

[0008] S3: Establishment of measurement standards: Based on the maximum value of the measured resistance value R1 being enlarged by 5% and the minimum value being reduced by 5%, the qualified range of the resistance value R0 measured by the multimeter for electroplating products is selected; the maximum value of the resistance value R2 being enlarged by 5% and the minimum value being reduced by 5% is used as the reference range for defective products;

[0009] S4: Product quality inspection: Use a multimeter to measure the resistance value of the electroplated products. Products with resistance values ​​within the qualified range are regarded as qualified products; products with resistance values ​​not within the qualified range are regarded as unqualified products. At the same time, refer to the vertical line with R2 maximum value increased by 5% and minimum value reduced by 5% to determine whether the product has density defects and thickness defects.

[0010] Furthermore, in the S4 product quality inspection, the product qualification rate is calculated based on the total amount of inspected products and the number of qualified products.

[0011] The advantages of the present invention are:

[0012] 1) The present invention adopts an ohmmeter to measure the resistance of the nickel plating layer on the surface of the product, and evaluates the compactness and conductivity of the nickel plating layer on the surface of the product through the range of the nickel plating layer resistance; this detection method can quickly evaluate the chemical nickel deposition quality and avoid poor blistering performance of the plating layer caused by poor conductivity of chemical nickel; the method for detecting the compactness and conductivity of the chemical nickel electroplating layer is simple, fast and easy to operate; it greatly improves the detection efficiency of the product and improves the qualified rate of product production. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0014] Figure 1 The present invention is a flow chart of a method for measuring the quality of chemical nickel electroplating layer of an electroplating product based on an ohmmeter. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] like Figure 1 A method for measuring the quality of chemical nickel plating layer of electroplated products based on an ohmmeter is shown; the specific quality measurement method is as follows:

[0018] S1: Product electroplating experiment: Use several square plates of the same material as the product to be electroplated as experimental substrates, and mark the reverse side of the experimental substrates to distinguish the slots; perform pre-plating treatment on the experimental substrates; then evenly place several square plates in each chemical nickel electroplating tank for surface electroplating; electroplate qualified experimental substrates and experimental substrates with density defects and thickness defects respectively; then take out the experimental substrates after electroplating, rinse them with pure water and blow dry them, take them to the laboratory, select qualified experimental substrates, use a multimeter to measure the surface resistance of the experimental substrates, and record the resistance value R1 of each experimental substrate;

[0019] S2: Detection of defective electroplated products: Use a multimeter to measure the surface resistance of the experimental substrate with density defects and thickness defects, and record the resistance value R2 of each experimental substrate;

[0020] S3: Establishment of measurement standards: Based on the maximum value of the measured resistance value R1 being enlarged by 5% and the minimum value being reduced by 5%, the qualified range of the resistance value R0 measured by the multimeter for electroplating products is selected; the maximum value of the resistance value R2 being enlarged by 5% and the minimum value being reduced by 5% is used as the reference range for defective products;

[0021] S4: Product quality inspection: Use a multimeter to measure the resistance value of the electroplated products. Products with resistance values ​​within the qualified range are regarded as qualified products; products with resistance values ​​not within the qualified range are regarded as unqualified products. At the same time, refer to the vertical line with R2 maximum value increased by 5% and minimum value reduced by 5% to determine whether the product has density defects and thickness defects.

[0022] In S4 product quality testing, the product qualification rate is calculated based on the total amount of tested products and the number of qualified products.

[0023] The resistance of the nickel plating on the surface of the product is measured by an ohmmeter, and the density and conductivity of the nickel plating on the surface of the product are evaluated through the range of the nickel plating resistance. This detection method can quickly evaluate the quality of chemical nickel deposition and avoid poor blistering of the plating due to poor conductivity of chemical nickel. The density and conductivity detection method of the chemical nickel electroplating layer is simple, fast and easy to operate. It greatly improves the detection efficiency of the product and improves the qualified rate of product production.

[0024] Those skilled in the art should understand that the present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and improvements, and these changes and improvements shall all fall within the scope of the present invention claimed for protection.

Claims

1. A method for measuring the quality of chemical nickel plating layer of electroplated products based on an ohmmeter, characterized in that: The specific quality measurement methods are as follows: S1: Product electroplating experiment: Use several square plates of the same material as the product to be electroplated as experimental substrates, and mark the reverse side of the experimental substrates to distinguish the slots; perform pre-plating treatment on the experimental substrates; then evenly place several square plates in each chemical nickel electroplating tank for surface electroplating; electroplate qualified experimental substrates and experimental substrates with density defects and thickness defects respectively; then take out the experimental substrates after electroplating, rinse them with pure water and blow dry them, take them to the laboratory, select qualified experimental substrates, use a multimeter to measure the surface resistance of the experimental substrates, and record the resistance value R1 of each experimental substrate; S2: Detection of defective electroplated products: Use a multimeter to measure the surface resistance of the experimental substrate with density defects and thickness defects, and record the resistance value R2 of each experimental substrate; S3: Establishment of measurement standards: Based on the maximum value of the measured resistance value R1 being enlarged by 5% and the minimum value being reduced by 5%, the qualified range of the resistance value R0 measured by the multimeter for electroplating products is selected; the maximum value of the resistance value R2 being enlarged by 5% and the minimum value being reduced by 5% is used as the reference range for defective products; S4: Product quality inspection: Use a multimeter to measure the resistance value of the electroplated products. Products with resistance values ​​within the qualified range are regarded as qualified products; products with resistance values ​​not within the qualified range are regarded as unqualified products. At the same time, refer to the vertical line with R2 maximum value increased by 5% and minimum value reduced by 5% to determine whether the product has density defects and thickness defects.

2. The method for measuring the quality of chemical nickel plating layer of electroplated products based on an ohmmeter according to claim 1, characterized in that: In the S4 product quality inspection, the product qualification rate is calculated based on the total amount of inspected products and the number of qualified products.

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