Electronic component manufacturing apparatus and electronic component manufacturing method

Abstract

The invention provides an electronic component manufacturing device and an electronic component manufacturing method. Fragmentation of a ceramic green sheet and internal electrode paste are not easy to remain on the surface of a lamination head. The electronic component manufacturing device (100) is provided with a laminating head (40) for conveying ceramic green sheets (21) and a laminating table (150) for laminating the conveyed ceramic green sheets (21), and is characterized in that the laminating head (40) is provided with an adsorption surface (40a) for adsorbing and conveying the ceramic green sheets (21), and the adsorption surface (40a) is located at a position opposite to the laminating table (150). The suction surface (40a) is provided with a plurality of suction holes (41), and at least a part of the suction surface (40a) is provided with a coating layer (50).

Description

Technical Field

[0001] The present invention relates to an apparatus for manufacturing an electronic component and a method for manufacturing an electronic component. Background Art

[0002] As a method for manufacturing electronic components such as laminated ceramic capacitors, there is known a method of laminating ceramic green sheets obtained by forming ceramic materials into sheets before firing, press-forming them, and then firing and singulating them, thereby mass-producing small electronic components at one time.

[0003] As a manufacturing device used in the manufacture of such electronic components, for example, Patent Document 1 discloses a manufacturing device for stacked electronic components, which comprises: a workbench for adsorbing and holding a carrier film having a ceramic green sheet formed on the upper surface, a cutter for cutting the ceramic green sheet on the carrier film into a given size, and an adsorption head for adsorbing and holding the ceramic green sheet obtained after cutting into the given size and peeling it off from the carrier film.

[0004] The surface of the adsorption head that contacts the ceramic green sheet is provided with suction holes, and the ceramic green sheet is adsorbed by sucking air from the suction holes, so that the ceramic green sheet can be peeled from the carrier film.

[0005] Prior Art Literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 9-129502 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] Internal electrodes are sometimes printed on ceramic green sheets.

[0010] When adsorbing such a ceramic green sheet, if the surface with the internal electrode printed on it is adsorbed, the internal electrode paste sometimes adheres to the surface of the adsorption head (also called the stacking head) and causes poor attraction, failure in peeling of the ceramic green sheet, and wrinkles in the ceramic green sheet, or causes poor stacking.

[0011] Furthermore, broken pieces of the ceramic green sheet generated by cutting the ceramic green sheet may adhere to the surface of the lamination head, causing suction failure and lamination failure.

[0012] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an apparatus for manufacturing electronic components in which fragments of ceramic green sheets and internal electrode paste are unlikely to remain on the surface of a lamination head.

[0013] Means used to solve problems

[0014] The manufacturing device of electronic components of the present invention is a manufacturing device of electronic components comprising a stacking head for conveying ceramic raw sheets and a stacking table for stacking the conveyed ceramic raw sheets, and is characterized in that the stacking head comprises an adsorption surface for adsorbing the ceramic raw sheets for conveying, the adsorption surface is located opposite to the stacking table, a plurality of suction holes are provided on the adsorption surface, and a coating is arranged on at least a portion of the adsorption surface.

[0015] Effects of the Invention

[0016] According to the present invention, it is possible to provide an apparatus for manufacturing electronic components in which fragments of ceramic green sheets and internal electrode paste are unlikely to remain on the surface of a lamination head. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a diagram schematically showing an example of an electronic component manufacturing apparatus according to the present invention.

[0018] Figure 2 Yes Figure 1 FIG. 1 is an enlarged plan view of a cutting region and a stacking region in an electronic component manufacturing apparatus shown.

[0019] Figure 3 FIG. 1 is a cross-sectional view schematically showing an example of a lamination head.

[0020] Figure 4 This is a cross-sectional view schematically showing how ceramic green sheets are stacked on a stacking table using a stacking head.

[0021] Figure 5 It is an exploded perspective view schematically showing the structure of another example of the lamination head.

[0022] Figure 6 yes Figure 5 A cross-sectional view of the stacking head is shown.

[0023] Description of Reference Numerals

[0024] 10: resin film;

[0025] 20: Ceramic green sheet;

[0026] 21: Ceramic green sheet obtained after cutting;

[0027] 23: printed internal electrode paste (internal electrode pattern);

[0028] 25: internal electrode sheet;

[0029] 30: raw material sheet;

[0030] 40: stacking head;

[0031] 40a: first main surface (adsorption surface) of the stacking head;

[0032] 40b: second main surface of the stacking head;

[0033] 41: suction hole;

[0034] 41a: wall surface of the suction hole;

[0035] 42: decompression chamber (suction mechanism);

[0036] 50: coating;

[0037] 100: Electronic component manufacturing equipment;

[0038] 110: Roll-out mechanism;

[0039] 120: coiling mechanism;

[0040] 130: cutting station;

[0041] 140: stripping station;

[0042] 150: stacking table;

[0043] 210: Head body;

[0044] 210a: surface of the head body;

[0045] 211: suction hole (second suction hole);

[0046] 213: suction tube;

[0047] 220: mesh component;

[0048] 230: adsorption board;

[0049] 230a: first main surface of the adsorption plate;

[0050] 231: suction hole (first suction hole);

[0051] 235: bending part;

[0052] 240: stacking head;

[0053] C: cut-off area;

[0054] L: Lamination area. DETAILED DESCRIPTION

[0055] The following is an explanation of the manufacturing device of the electronic component of the present invention. However, the present invention is not limited to the following structure, and can be appropriately changed and applied within the scope of not changing the main purpose of the present invention. In addition, the structure obtained by combining two or more of the preferred structures of the present invention described below is also the present invention.

[0056] In this specification, terms that indicate the relationship between elements (for example, "opposite", "orthogonal", etc.) and terms that indicate the shape of an element (for example, "rectangular", etc.) do not have strict meanings but are intended to indicate a substantially equivalent range, for example, including a difference of a few percent.

[0057] The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, and scales may differ from those of actual products.

[0058] [Electronic component manufacturing equipment]

[0059] The manufacturing device of electronic components of the present invention is a manufacturing device of electronic components comprising a stacking head for conveying ceramic raw sheets and a stacking table for stacking the conveyed ceramic raw sheets, and is characterized in that the stacking head comprises an adsorption surface for adsorbing the ceramic raw sheets for conveying, the adsorption surface is located opposite to the stacking table, a plurality of suction holes are provided on the adsorption surface, and a coating is arranged on at least a portion of the adsorption surface.

[0060] Figure 1 This is a diagram schematically showing an example of an electronic component manufacturing apparatus according to the present invention.

[0061] exist Figure 1 In the electronic component manufacturing apparatus 100 shown in FIG. 1 , the raw material sheet 30 is unwound from the unwinding mechanism 110 and is taken up by the taking-up mechanism 120 for conveyance. Figure 1 In FIG. 1 , an arrow from the unwinding mechanism 110 toward the winding mechanism 120 indicates a direction in which the original sheet 30 is conveyed.

[0062] The raw material sheet 30 passes through the cutting region C and the laminating region L while being conveyed from the unwinding mechanism 110 to the winding mechanism 120 .

[0063] A tension control mechanism such as a suction roller may be provided in the middle.

[0064] Figure 2 Yes Figure 1 FIG. 1 is an enlarged plan view of a cutting region and a stacking region in an electronic component manufacturing apparatus shown.

[0065] The green sheet 30 is formed by laminating the ceramic green sheets 20 on the resin film 10 serving as a support, and is conveyed so as to pass through the cutting region C and the laminating region L.

[0066] The cutting stage 130 is arranged in the cutting region C, and the peeling stage 140 and the laminating stage 150 are arranged in the laminating region L.

[0067] Thus, the raw material sheet 30 is conveyed to pass over the cutting stage 130 and the peeling stage 140 .

[0068] The arrangement is such that when passing over the cutting station 130 and the peeling station 140, the resin film 10 constituting the raw material sheet 30 is in contact with the cutting station 130 and the peeling station 140, and the ceramic green sheet 20 is not in contact with the cutting station 130 and the peeling station 140. Therefore, it can be said that the ceramic green sheet 20 is exposed on the upper surface of the raw material sheet 30.

[0069] In the cutting area C, a cutting table 130 is provided.

[0070] On the cutting table 130 , the ceramic green sheet 20 is cut into a predetermined shape (a rectangular shape indicated by a dashed line).

[0071] The method of cutting the ceramic green sheet 20 is not particularly limited, and an example thereof includes a method of pressing a cutting blade against the surface of the ceramic green sheet 20. Alternatively, the ceramic green sheet 20 may be cut by rotating a roller-shaped blade.

[0072] Alternatively, the ceramic green sheet may be cut using a laser or the like instead of a cutter.

[0073] Furthermore, it is preferable that the resin film 10 serving as a support body is not completely cut when the ceramic green sheet 20 is cut.

[0074] The cutting of the ceramic green sheet 20 in the cutting region C may be performed in a state where the conveyance of the green sheet 30 is stopped, or may be performed in a state where the green sheet 30 is being conveyed.

[0075] The ceramic green sheet 21 cut into a predetermined shape in the cutting region C is transported as a raw material sheet 30 to a laminating region L described later together with the resin film 10 serving as a support by the operation of the unwinding mechanism 110 and the winding mechanism 120 .

[0076] At the same time, a new green sheet 30 is supplied from the unwinding mechanism 110 to the cutting region C. The ceramic green sheets 20 constituting the new green sheet 30 are ceramic green sheets that have not yet been cut.

[0077] The laminating area L is a region having the peeling stage 140 and the laminating stage 150 .

[0078] In the peeling stage 140 , the ceramic green sheet 21 obtained by cutting in the cutting region C is peeled from the resin film 10 by a laminating head (not shown).

[0079] At this time, the resin film 10 constituting the green sheet 30 may be adsorbed on the green sheet 30 side surface of the peeling table 140. By adsorbing the resin film 10 on the peeling table 140, when the ceramic green sheet 21 obtained after cutting is peeled from the green sheet 30, it is easy to prevent peeling defects in which the resin film 10 as a support is lifted up at the same time.

[0080] The ceramic green sheets 21 obtained after cutting may be peeled off from the green sheet 30 while the conveyance of the green sheet 30 is stopped or while the green sheet 30 is being conveyed.

[0081] The ceramic green sheets 21 that have been separated from the resin film 10 by the laminating head and cut are transported to the laminating stage 150 and laminated.

[0082] The stacking table 150 may also include a heating mechanism. In this case, the heating temperature is preferably 50° C. or higher and 80° C. or lower. As long as the temperature is above the softening point of the binder contained in the ceramic green sheet 21, the ceramic green sheet 21 obtained after cutting is heated at a temperature within the above range, so that the ceramic green sheet 21 obtained after cutting can be easily stacked.

[0083] When stacking the cut ceramic green sheets 21 on the stacking table 150, a stacking head applies pressure to the cut ceramic green sheets 21. By stacking the cut ceramic green sheets 21 with pressure, positional displacement of the cut ceramic green sheets 21 can be prevented.

[0084] The ceramic green sheets 21 obtained after cutting may be stacked directly on the stacking table 150 , or may be stacked on a plate-shaped jig or the like placed on the stacking table 150 .

[0085] After the cut ceramic green sheet 21 is conveyed from the peeling stage 140 to the laminating stage 150 , a portion where the resin film 10 is exposed is formed on the peeling stage 140 as a trace of the peeled ceramic green sheet.

[0086] In this state, the raw material sheet 30 is transported by the operation of the unwinding mechanism 110 and the winding mechanism 120, whereby the exposed portion of the resin film 10 is transported to the side of the winding mechanism 120, and the raw material sheet 30 including the ceramic raw sheet 21 obtained after being cut into a given shape in the cutting area C and the resin film 10 supporting it is re-transported on the peeling table 140.

[0087] The cutting of the ceramic green sheet 20 in the cutting region C and the peeling, conveyance, and lamination of the ceramic green sheets 21 obtained after the cutting in the laminating region L may be performed simultaneously.

[0088] Moreover, at the time point when the cutting of the ceramic green sheet 20 in the cutting area C and the stacking of the ceramic green sheets 21 obtained after cutting in the stacking area L are completed, the raw material sheet 30 is transported by the operation of the unwinding mechanism 110 and the winding mechanism 120, thereby supplying the ceramic green sheet 21 obtained after cutting in the cutting area C to the peeling table 140, and supplying the new ceramic green sheet 20 that has not yet been cut to the cutting table.

[0089] By repeating the above-mentioned operation, the cut ceramic green sheets 21 can be stacked on the stacking table 150 .

[0090] [Layer Head]

[0091] Next, the lamination head will be described.

[0092] Figure 3 FIG. 1 is a cross-sectional view schematically showing an example of a lamination head.

[0093] like Figure 3 As shown, the lamination head 40 has a substantially plate-like shape having a first main surface 40 a and a second main surface 40 b that are opposed to each other in the thickness direction.

[0094] A plurality of suction holes 41 are formed on the surface of the first main surface 40 a .

[0095] All of the plurality of suction holes 41 are connected to the decompression chamber 42 .

[0096] By decompressing the decompression chamber 42, air is sucked from the suction holes 41, so that the ceramic green sheet can be adsorbed. Therefore, the first main surface 40a is also referred to as an adsorption surface. In addition, the decompression chamber 42 is also referred to as a suction mechanism.

[0097] The decompression chamber 42 as a suction mechanism is arranged on the second main surface 40 b side of the lamination head 40 .

[0098] The decompression chamber 42 is connected to, for example, a vacuum pump (not shown) provided outside the lamination head 40 , and the air in the decompression chamber 42 is sucked by the vacuum pump, thereby sucking air from each suction hole 41 .

[0099] Alternatively, one laminating head may include a plurality of decompression chambers. In this case, it is possible to switch between air suction and non-air suction for each suction hole group connected to each decompression chamber.

[0100] Figure 4 This is a cross-sectional view schematically showing how ceramic green sheets are stacked on a stacking table using a stacking head.

[0101] Figure 4 The figure shows a state where another ceramic green sheet 21 is stacked on the surface of one ceramic green sheet 21 after one ceramic green sheet 21 has been stacked on the stacking table 150. The other ceramic green sheet 21 is an internal electrode sheet 25 having an internal electrode pattern 23 printed on its surface.

[0102] like Figure 4 As shown, an internal electrode sheet 25 having an internal electrode pattern 23 printed on the surface of the ceramic green sheet 21 obtained after cutting is attracted to the first main surface 40a of the lamination head 40. Figure 4The stacking head 40 is further moved downward to stack the ceramic green sheets 21 constituting the internal electrode sheets 25 on the ceramic green sheets 21 stacked on the stacking table 150. Thereafter, the internal electrode sheets 25 are released from the adsorption of the stacking head 40, and the stacking head 40 is moved upward. When the stacking head 40 moves upward, the internal electrode sheets 25 are not adsorbed by the stacking head 40, and thus are stacked on the stacking table 150.

[0103] Through the above steps, the ceramic green sheets 21 or the internal electrode sheets 25 can be stacked on the stacking stage 150 using the stacking head 40 .

[0104] At this time, if necessary, the lamination head 40 may be pressed toward the lamination stage 150 to press-bond the internal electrode sheet 25 to the ceramic green sheet 21 .

[0105] In addition, the first main surface 40a of the lamination head 40 is a surface facing the lamination stage 150. Therefore, the first main surface 40a of the lamination head 40 is a suction surface.

[0106] like Figure 4 As shown, the ceramic green sheet 21 obtained after cutting may also be printed with an internal electrode pattern 23 as needed. In this case, the stacking head 40 may directly adsorb the surface of the ceramic green sheet 21 obtained after cutting (i.e., the portion where the internal electrode pattern 23 is not formed), or may adsorb the surface of the internal electrode pattern 23.

[0107] A plurality of suction holes 41 are formed on the first main surface 40 a serving as an adsorption surface.

[0108] The coating layer 50 is disposed on at least a portion of the first main surface 40a, which is an adsorption surface. The coating layer 50 may be disposed on only a portion of the first main surface 40a, or may be disposed on the entire first main surface 40a.

[0109] If the coating layer 50 is disposed on at least a portion of the first main surface 40a as the suction surface, the cut pieces of the ceramic green sheet and the internal electrode paste are less likely to remain on the suction surface of the lamination head, thereby suppressing suction defects and lamination defects.

[0110] Preferably, the coating layer 50 is further disposed on at least a portion of the surface of the wall surface 41 a constituting the suction hole 41 .

[0111] If the coating layer 50 is disposed on at least a portion of the surface of the wall surface 41 a constituting the suction hole 41 , it is possible to prevent the ceramic green sheet and the internal electrode paste from remaining near the suction hole 41 , thereby further suppressing adsorption defects and lamination defects.

[0112] Furthermore, even if ceramic green sheets or internal electrode paste remain near the suction holes, they can be easily removed by blowing air from the suction holes.

[0113] The shape of the suction hole 41 is preferably a tapered shape in which the hole diameter gradually decreases from the first main surface 40 a toward the second main surface 40 b .

[0114] Preferably, the thickness of the coating layer 50 formed on the surface of the wall surface 41 a constituting the suction hole 41 is thicker as it is closer to the first main surface 40 a , and is thinner as it is closer to the second main surface 40 b .

[0115] If the shape of the suction hole is the tapered shape and the coating becomes thicker as it approaches the first main surface and thinner as it approaches the second main surface, clogging of the suction hole due to formation of the coating can be suppressed.

[0116] In addition, it is assumed that the wall surface 41 a constituting the suction hole 41 includes all surfaces that are not parallel to the first main surface 40 a among the surfaces exposed on the first main surface 40 a .

[0117] The thickness of the coating layer on the adsorption surface is not particularly limited, but is, for example, preferably 1 μm or less, more preferably 0.1 μm or more and 1 μm or less, and further preferably 0.1 μm or more and 0.5 μm or less.

[0118] Preferably, the coating layer is formed on an area of ​​95% or more and 100% or less of the first main surface. However, it is assumed that the area of ​​the wall surface of the suction hole is not included in the calculation of the above area.

[0119] Preferably, the coating layer includes a first coating layer containing carbon as an element.

[0120] The coating may be one layer or two or more layers.

[0121] Preferably, the coating layer includes a second coating layer having fluorine and silicon as elements.

[0122] Preferably, a first coating layer containing carbon as an element and a second coating layer containing fluorine and silicon as elements are stacked in this order from the adsorption surface.

[0123] In addition, instead of the second coating layer containing fluorine and silicon as elements, the second coating layer containing iron and carbon as elements may be formed.

[0124] When the coating layer includes multiple layers, the total thickness of the coating layer is preferably 0.1 μm or more and 1 μm or less. When the total thickness of the coating layer is less than 0.1 μm, the effect of preventing the ceramic green sheet fragments and the internal electrode paste from being easily left on the surface of the stacking head may not be fully exerted. In addition, when the total thickness of the coating layer exceeds 1 μm, it is difficult to cause static electricity to move from the coating layer to the stacking head body, so static electricity may be easily accumulated in the coating layer.

[0125] The average thickness of the coating layer disposed on the surface of the wall constituting the suction hole is not particularly limited, but is preferably 1 μm or less, more preferably 0.1 μm to 1 μm, and further preferably 0.1 μm to 0.5 μm.

[0126] The average thickness of the coating layer disposed on the surface of the wall constituting the suction hole was determined by the following method.

[0127] First, the length of the coating formed on the wall surface constituting the suction hole in the thickness direction of the stacking head is calculated. Next, the position that divides the coating into two in the thickness direction of the stacking head is determined, that is, the middle position of the coating distributed in the thickness direction. Finally, a vertical line is drawn from the wall surface constituting the suction hole toward the coating at the middle position, and the length from the vertical line to the surface of the coating is set as the average thickness of the coating.

[0128] The coating can be formed, for example, by placing the laminating head in an atmosphere containing the components to be coated. As time passes, the components to be coated enter the suction hole and move forward, so that the coating can be made thinner in the depth of the suction hole, and the thickness of the coating is thicker as it is closer to the first main surface and thinner as it is closer to the second main surface.

[0129] The shape of the laminating head is not particularly limited as long as it has a planar shape serving as an adsorption surface, and examples thereof include a plate-like shape having a first main surface serving as an adsorption surface and a second main surface facing the first main surface.

[0130] The material constituting the stacking head is not particularly limited, but is preferably a metal.

[0131] The lamination head is preferably a metal plate having a first main surface and a second main surface facing each other in the thickness direction and having a thickness of 0.5 mm or less.

[0132] In this case, it is preferable that the first main surface is an adsorption surface, and a suction mechanism is provided on the second main surface side.

[0133] The length of the suction hole is not particularly limited.

[0134] In addition, the number of the suction holes and the intervals between the suction holes are not particularly limited.

[0135] The lamination head may include a heating mechanism. Preferably, the heating mechanism is a mechanism capable of heating the temperature of the first main surface of the lamination head to 50° C. or higher and 80° C. or lower.

[0136] By heating the ceramic green sheets to a temperature of 50° C. or higher and 80° C. or lower, the ceramic green sheets can be easily stacked.

[0137] Figure 5It is an exploded perspective view schematically showing the structure of another example of the lamination head.

[0138] exist Figure 5 In the illustrated laminating head 240 , a suction plate 230 is disposed on a surface 210 a of a head main body 210 having a suction mechanism and suction holes 211 , with a mesh member 220 interposed therebetween.

[0139] The suction mechanism includes a suction pipe 213 led out from the side of the head body 210, and a decompression chamber (not shown) formed inside the head body 210 and connected to the suction hole 211 inside the head body 210. This form is also an example in which the suction mechanism is provided on the second main surface side of the stacking head. The first main surface and the second main surface of the stacking head will be described later.

[0140] Suction holes 231 are provided on the first main surface 230a of the suction plate 230. Therefore, the first main surface 230a of the suction plate 230 provided with the suction holes 231 is the first main surface of the lamination head 240 and is a suction surface.

[0141] The suction plate 230 has a first main surface 230 a provided with suction holes 231 and a bent portion 235 not provided with the suction holes 231 , and is fixed to the head main body 210 via the bent portion 235 .

[0142] The suction holes 231 provided on the first main surface 230a of the adsorption plate 230 are also referred to as first suction holes to distinguish them from the suction holes 211 provided on the surface 210a of the head body 210. In addition, the suction holes 211 provided on the surface 210a of the head body 210 are also referred to as second suction holes.

[0143] When the air in the decompression chamber is sucked through the suction pipe 213 , air is sucked from the first suction holes 231 through the second suction holes 211 , so that the ceramic green sheet can be sucked on the first main surface 230 a of the suction plate 230 (the suction surface of the laminating head 240 ).

[0144] The length of the first suction hole 231 is not particularly limited, but is preferably not less than 0.1 mm and not more than 0.5 mm.

[0145] A coating may be formed on at least a portion of the surface 210 a of the head body 210 where the second suction holes 211 are formed.

[0146] Furthermore, a coating may be formed on the surface of the inner wall of the opening of the second suction hole 211 .

[0147] Furthermore, the second suction hole 211 may have a tapered shape in which the hole diameter gradually decreases from the surface 210 a toward the opposite side in the thickness direction.

[0148] The mesh member 220 is a mesh-like structure, and can make the air flowing between the first suction holes 231 and the second suction holes 211 uniform.

[0149] Therefore, even when the aperture of the second suction hole 211 is larger than that of the first suction hole 231 or the number of the second suction hole 211 is greater than that of the first suction hole 231, the air flow can be uniformed by the mesh member 220, thereby achieving uniform suction by using the first suction hole 231.

[0150] As the mesh member 220 , for example, metal or the like can be used.

[0151] Figure 6 yes Figure 5 A cross-sectional view of the stacking head is shown.

[0152] like Figure 6 As shown, the coating layer 50 and the first suction holes 231 are provided on the first main surface 230 a of the adsorption plate 230 constituting the lamination head 240 .

[0153] The first main surface 230 a of the suction plate 230 also serves as a suction surface of the lamination head 240 .

[0154] Preferably, the second suction holes 211 provided in the head main body 210 are arranged at intervals longer than the intervals at which the first suction holes 231 provided in the first main surface 230 a of the adsorption plate 230 are arranged.

[0155] In addition, it is preferable that the hole diameter of the second suction hole 211 provided in the head main body 210 is larger than the hole diameter of the first suction hole 231 provided in the first main surface 230 a of the adsorption plate 230 .

[0156] In addition, the adsorption plate 230 is detachable.

[0157] Therefore, the suction holes 231 provided on the first main surface 230a of the adsorption plate 230 can be replaced with another adsorption plate in which the hole diameter, arrangement number and arrangement pattern are optimized to match the characteristics of the ceramic green sheet as the transported object.

[0158] The ceramic green sheet contains ceramic particles containing, for example, Ba and Ti, and is formed by applying a slurry containing a binder, a dispersant, and the like on a resin film and drying the slurry.

[0159] The coating method is not particularly limited, and various coating methods such as gravure coating and die coating can be used.

[0160] The thickness of the ceramic green sheet is not particularly limited, but is about 0.2 μm or more and 3.0 μm or less.

[0161] If necessary, an internal electrode pattern may be printed on the surface of the ceramic green sheet. The ceramic green sheet on which the internal electrode pattern is printed is also referred to as an internal electrode sheet.

[0162] The internal electrode pattern can be formed by printing an internal electrode paste in which metal particles, a binder, an organic solvent, and a dispersant are mixed on a ceramic green sheet.

[0163] The printing method is not particularly limited, and various printing methods such as screen printing and gravure printing can be used.

[0164] The thickness of the internal electrode pattern is not particularly limited, but is approximately 0.1 μm or more and 3.0 μm or less.

[0165] The ceramic green sheet may be handled in a state where it is stacked on a resin film serving as a support (raw material sheet) and wound up in a roll.

[0166] In this case, the film is unwound by the unwinding mechanism, cut into a predetermined shape at or near the peeling region, peeled from the surface of the resin film by the crimping head, and stacked on the stacking table.

[0167] [Method for manufacturing electronic component]

[0168] The method for producing an electronic component of the present invention is characterized by laminating ceramic green sheets using the apparatus for producing an electronic component of the present invention.

[0169] By using the electronic component manufacturing apparatus of the present invention, ceramic green sheets can be stacked on the stacking table. At this time, broken pieces of the ceramic green sheets and internal electrode paste are unlikely to remain on the surface of the stacking head, so that suction failure and stacking failure are unlikely to occur.

[0170] Therefore, in the method for manufacturing an electronic component of the present invention using the manufacturing apparatus for an electronic component of the present invention, defects of the electronic component due to poor suction and poor lamination can be suppressed.

[0171] In this specification, the following matters are described.

[0172] The present disclosure (1) is an electronic component manufacturing device comprising a stacking head for conveying ceramic green sheets and a stacking table for stacking the conveyed ceramic green sheets, characterized in that:

[0173] The stacking head includes a suction surface for sucking and transporting the ceramic green sheet, and the suction surface is located at a position opposite to the stacking stage.

[0174] A plurality of suction holes are provided on the adsorption surface.

[0175] A coating is disposed on at least a portion of the adsorption surface.

[0176] The present disclosure (2) is a manufacturing device for an electronic component according to the present disclosure (1), wherein the coating layer is further arranged on at least a portion of the surface of the wall constituting the suction hole.

[0177] The present disclosure (3) is a device for manufacturing an electronic component according to the present disclosure (1) or (2), wherein the coating layer includes a first coating layer containing carbon as an element.

[0178] The present disclosure (4) is a manufacturing device for electronic components according to the present disclosure (3), wherein the coating layer further comprises a second coating layer containing fluorine and silicon as elements.

[0179] The first coating layer and the second coating layer are sequentially arranged from the adsorption surface.

[0180] The present disclosure (5) is a manufacturing device for electronic components according to any one of the present disclosures (1) to (4), wherein the lamination head is a metal plate having a first main surface and a second main surface facing each other in the thickness direction and having a thickness of 0.5 mm or less.

[0181] The first main surface of the metal plate is the adsorption surface,

[0182] A suction mechanism is provided on the second main surface side of the metal plate.

[0183] The present disclosure (6) is a device for manufacturing an electronic component according to any one of the present disclosures (1) to (5), wherein the coating layer on the adsorption surface has a thickness of 0.1 μm or more and 1 μm or less.

[0184] The present disclosure (7) is a method for manufacturing an electronic component, characterized in that ceramic green sheets are stacked using the electronic component manufacturing apparatus described in any one of the present disclosures (1) to (6).

Claims

1. An electronic component manufacturing device comprising a stacking head for conveying ceramic green sheets and a stacking table for stacking the conveyed ceramic green sheets, characterized in that: The stacking head includes a suction surface for sucking and transporting the ceramic green sheet, and the suction surface is located at a position opposite to the stacking stage. A plurality of suction holes are provided on the adsorption surface. A coating is disposed on at least a portion of the adsorption surface.

2. The electronic component manufacturing device according to claim 1, wherein: The coating layer is also disposed on at least a portion of a surface of a wall constituting the suction hole.

3. The electronic component manufacturing device according to claim 1 or 2, wherein: The coating layer includes a first coating layer containing carbon as an element.

4. The electronic component manufacturing apparatus according to claim 3, wherein: The coating layer further comprises a second coating layer containing fluorine and silicon as elements, The first coating layer and the second coating layer are sequentially arranged from the adsorption surface.

5. The electronic component manufacturing apparatus according to any one of claims 1 to 4, wherein: The lamination head is a metal plate having a first main surface and a second main surface facing each other in the thickness direction and having a thickness of 0.5 mm or less. The first main surface of the metal plate is the adsorption surface, A suction mechanism is provided on the second main surface side of the metal plate.

6. The electronic component manufacturing apparatus according to any one of claims 1 to 5, wherein: On the adsorption surface, the coating layer has a thickness of 0.1 μm or more and 1 μm or less.

7. A method for manufacturing an electronic component, characterized in that: The ceramic green sheets are stacked using the electronic component manufacturing apparatus according to any one of claims 1 to 6.

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