Semiconductor packaging equipment

Abstract

The invention discloses equipment which is used in a semiconductor packaging process, and by replacing a known mode that a material box is used for bearing objects to be processed, the objects are conveyed to a simple-structure object frame through a conveying track or an automatic guided vehicle or taken out from the object frame, so that the labor cost and the material box cost can be reduced in the mass production process of packaging bodies.

Description

Technical Field

[0001] This technology relates to production equipment used in the semiconductor packaging manufacturing process, and handling devices that operate in conjunction with the production equipment. Background Art

[0002] In the conventional semiconductor packaging process, a chip is combined with a lead frame or a substrate to form an object (40_refer to Figure 2 ), until the object is divided into a separate package body, the chip bonding / flip chip bonding machine, plasma cleaning machine, wire bonding machine, molding machine, printer, single cutting machine and other production equipment in between, different production equipment has processing devices for different processes such as wire bonding or glue injection, and the magazine that has been used for more than 30 years to carry objects to perform processing operations, and the magazine can carry 5 to 40 objects or more objects according to different styles, so that the above equipment has an input device or a discharge device for carrying the magazine, which increases the volume, weight, space and cost. At the same time, the frame or circuit board or bracket (frame) that carries the chip is known to have an area less than 100mm*300mm (millimeters), but the area is getting bigger and bigger, which makes the volume, weight, space and cost of the production equipment increase; such as Figure 1, which is a schematic diagram of a conventional production equipment, and takes the RAPID fully automatic wire bonding machine of the manufacturer K&S GEN-S series as an example, the wire bonding machine 1 is composed of a feeding device LD, a discharging device UL, a main operating system OS, a platform 14 and a control box 18. The main operating system OS is connected to the platform 14 and has a display 11, a microscope 13, a processing platform 19 and a base 10, etc. The processing platform 19 has a conveying device and a processing area composed of a pressing plate and a hot plate. The conveying device is composed of components such as a clamp and a driving device for moving the clamp position. The clamp moves to the feeding device LD to clamp the object located in the material box 30, and the object is divided into multiple times from the front end. Move to the processing area for processing. After the end of the object is processed, the fixture clamps the object and moves it to the material box 30 located at the unloading device UL. This continuous cycle allows the wire bonding machine 1 to automatically perform processing operations. The feeding device LD and the unloading device UL are both engaged with the platform 14. When the length, width and height of the object including the chip are 300mm*100mm*0.2mm, the length, width and height of the feeding device LD and the unloading device UL are greater than 400mm*400mm*400mm. The feeding device LD and the unloading device UL are respectively located at the inlet and outlet of the processing platform 19. The material box 30 is a material box on the material side or the material discharging side, and is respectively composed of an electronic circuit module, a driving device, a carrier 12, a guide rail L1 and two material box platforms M, wherein the carrier 12 is used to carry the material box 30, and the material box 30 can be moved up and down by means of the driving device, the guide rail L1 and the carrier 12, and the objects in the material box 30 are sent to the processing platform 19 one by one, and the material box 30 of the discharging device UL automatically receives the objects sent from the processing platform 19 one by one, until there are no objects in the material box 30 on the material feeding side, or the material box 30 on the material discharging side is full of objects, and the material feeding device LD automatically replaces another material box 30 carrying the objects to be processed, and The unloading device UL automatically replaces another empty material box 30, so that the circulating wire bonding machine 1 can continuously perform processing operations, and the control box 18 is connected to the platform 14 to accommodate the electronic circuit module used by the feeding device LD, the unloading device UL and the main operating system OS to perform the operation of the production equipment; as the industry needs to reduce costs and more effective management methods, the method of placing or taking out the material box 30 by manual or unmanned transport vehicles in the production equipment can no longer meet the needs. In addition to the high cost of labor and material boxes, the material box 30 is large in size and heavy in weight, which makes the transportation platform costly or unreliable and ineffective. Summary of the invention

[0003] The object containing the chip has the characteristics of being significantly smaller in height and weight than the material box, so that the feeding device and / or the discharging device of the new or conventional production equipment can be removed and replaced with a rack with a simple structure, small size and light weight, so that a low-height, light-weight and low-cost transport platform can be selected when transporting objects, making it easier to implement the method of directly transporting objects. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 : A schematic diagram of a conventional wire bonding machine having a feeding device and a discharging device;

[0005] Figure 2 : Schematic diagram of a wire bonding machine having a rack;

[0006] Figure 3 : Schematic diagram of production equipment with storage space;

[0007] Figure 4-5 : Schematic diagram of wire bonding machine and handling platform;

[0008] Figure 6 : Schematic diagram of a wire bonding machine having a rack;

[0009] Figure 7 : Schematic diagram of multiple wire bonding machines sharing a microscope.

[0010] Explanation of symbols

[0011] 1, 1A, 1B, 1C, 1D. Wire bonding machine 10..........base

[0012] 11.........Display 12, 12a, 72, 72a, 82. Carrier

[0013] 13.........Microscope 14.........Platform

[0014] 16, 17........Shelf 18............Control box

[0015] 19........Processing platform 20........Storage space

[0016] 30..........Box 40, 40a..........Object

[0017] 70, 7T, 80....Transporting platform 71, 81, L1......Guide rail

[0018] 74, 74a, 84....Transporter 75, 85, 1R....Stretch your arms

[0019] 90..........Stand LD........Feeding device

[0020] M.........Material Box OS.......Main Operating System

[0021] R.........Code readerSK.........Storage shelf

[0022] UL........Discharging deviceY.........Conductor

[0023] Z.........Transmission lineZb........Identification component DETAILED DESCRIPTION

[0024] The present invention is suitable for production equipment such as chip loading machines, plasma cleaning machines, wire bonding machines, molding machines, printers and single-cutting machines for manufacturing packages by directly transporting objects. Figure 2 The schematic diagram of a production equipment is a wire bonding machine. The wire bonding machine 1A is optimized based on the conventional K&S GEN-S series RAPID fully automatic wire bonding machine. It is not equipped with a feeding device (LD) and a discharging device (UL). It is composed of a main operating system OS, a platform 14, a control box 18 and two racks 16 and 17. The characteristics and symbols of the main operating system OS are the same as those of the Figure 1 The conventional main operating system OS is the same as that used in the prior art, and is also connected to the platform 14, and has a processing platform 19 and a processing device, etc. The processing device includes the main processing technology. The present embodiment is the process of wire bonding. The processing platform 19 has a processing area, a fixture and a driving device for moving the fixture position, which is used to automatically transport an object 40 including a chip, and the side of the processing platform 19 can be implemented as a feeding side or a discharging side, so that the object can be automatically moved from the feeding side of the processing platform 19 to the processing area, or automatically moved from the processing area to the discharging side of the processing platform 19, and depending on the different production machines, the feeding side and the discharging side can be located on the same side, or the feeding side and the discharging side can be located at the same position. The control box 18 is connected to the platform 14 to accommodate various electronic circuit modules for executing the operation of the wire bonding machine 1A. The two racks 16 and 17 are respectively located on the feeding side or the discharging side of the processing platform 19, and are respectively arranged corresponding to the processing platform 19, so as to automatically feed the object 40 into the processing platform 19 or take it out. Among them, the rack 16 is located on the feeding side, and the object 40 in the rack 16 can be automatically fed into the processing platform 19 by a clamp. Because the wire bonding machine 1A does not have a conventional complex feeding device (LD) and a discharging device (LD), and the racks 16 and 17 carry an object 40, a simple rack structure can be designed according to the volume of the object 40, so that the rack can be composed of at least one metal or plastic component. For example, if the volume of the object 40 is 300mm*100mm*0.2mm, the volume of the racks 16 and 17 can be designed to be 300mm*110mm*4mm, so that the volume of the racks 16 and 17 is significantly smaller than Figure 1 The conventional volume of the loading device (LD) and the unloading device (UL) is 400mm*400mm*400mm, and in particular, the height of the loading device (LD) is 400mm, which is 100 times the height of the racks 16 and 17, which is 4mm. At the same time, the object 40 can be carried by a person or a handling platform (70_ Figure 4) is transported to the rack 16, or taken out from the rack 17. In addition to the above advantages, the wire bonding machine 1A is compared with Figure 1 The conventional wire bonding machine 1 has at least the following advantages: 1) Low equipment cost: Since the wire bonding machine 1A does not have a material feeding device (LD) and a material discharging device (UL), and the control box 18 does not need to accommodate the electronic circuit module for controlling the material feeding device (LD) and the material discharging device (UL), the unit price of purchase can be reduced; 2) Low rack cost: When producing objects 40 of the same width, since the racks 16 and 17 set in the wire bonding machine 1A do not need to be replaced, the usage of the racks 16 and 17 is significantly lower than the usage of the material box 30, which can reduce the cost of purchasing, storing and managing the material boxes; 3) Improved management efficiency: Since the wire bonding machine 1A does not have a material feeding device (LD) and a material discharging device (UL), a lot of space can be freed up on the material feeding side or the material discharging side of the processing platform 19 for setting a camera or a reader R or other equipment, and the camera or the reader R can capture the bar code (bar code) or two-dimensional bar code (QR code) combined with the object 40. The data of identification components such as code or radio frequency electronic tag (RFID) can be used for error prevention, production deployment and analysis to improve management efficiency.

[0025] Figure 3 This is a schematic diagram of a production equipment with storage space, and takes a fully automatic wire bonding machine as an example. Figure 3 The figures in the upper right corner and the upper left dotted circle are top views of the racks 16 and 17, respectively. The symbols and features of the wire bonding machine 1B are the same as those of the Figure 2 The wire bonding machine 1A shown is similar, and the same parts refer to Figure 2 The difference is that the display (11) is not provided. The wire bonding machine 1B can be provided with a storage space 20. The storage space 20 can be in a suitable form such as a bracket, a box, or a platform for placing items such as a wire box, a capillary, a hot plate, or a pressing plate, or a platform for personnel to inspect products. The above items are transported by means of a transport platform (70_refer to Figure 4 ) and placed in the storage space 20, which can be arranged in the area or the periphery of the wire bonding machine 1B, Figure 3 The storage space 20 in the rack 16 area is shown to be a wire box for placing copper wires, so that the wires do not need to be delivered by personnel, saving manpower, and the processed objects 40 can be moved to the surface of the bracket 90 located at the periphery of the rack 17, and the surface of the bracket 90 is implemented as the storage space 20, thereby allowing personnel to use a microscope (13_refer to Figure 7 ) inspects the objects placed on the racks 16, 17 or the storage space 20 of the wire bonding machine 1B. This not only reduces the time it takes for personnel to move the objects 40 out of the wire bonding machine 1B to other locations for inspection and return them, but also prevents personnel from putting the objects 40 back into the wrong wire bonding machine (1B) and causing material mixing.

[0026] The racks are used to carry objects, so that the production equipment can not only Figure 2-3 In addition to the features and advantages of the present invention, a transport platform can also be used to transport objects. The transport platform is an unmanned transport device and can be set up on the ceiling, floor, wall column, or in front of or behind the production equipment to reduce the number of people and costs for transporting objects. The transport platform can directly take / place objects 40 on the racks 16, 17 or the work platform 19, so that the wire bonding machine can be set up or not set up with racks 16, 17 according to needs. Figure 4 The following is a schematic diagram of a fully automatic wire bonding machine and a handling platform, and a wire bonding machine 1B and 1C with racks 16 and 17 as an example. The characteristics and symbols of the wire bonding machines 1B and 1C are the same as those of the Figures 2-3 The wire bonding machines 1A and 1B are similar. For similarities, please refer to Figures 2-3The transport platform 80 is set up on the floor. The transport platform 80 has a guide rail 81, a carrier 82, a transport vehicle 84 and an extension arm 85. The carrier 82 is used to carry the object 40. After the transport vehicle 84 is connected to the guide rail 81, it can move according to the programming instruction. At the same time, because the transport platform 80 is set up on the floor, the guide rail 81 can be replaced with a wheel. The extension arm 85 is a mechanical arm that can change its position. It is connected with the transport vehicle 84 and the carrier 82 and is located between the transport vehicle 84 and the carrier 82. By extending the arm 85, the carrier 82 can be moved to a specified position to carry the object 40. 0 is sent to the working platform 19 or the rack 17, 16 of the wire bonding machine 1B, 1C, and the object 40 is taken out from the working platform 19 or the rack 17, 16 of the wire bonding machine 1B, 1C. In addition, the transport platform 80 may also have an area for storing the object 40 or the material box 30, and another transport platform 70 is set on the ceiling and has a guide rail 71, a carrier 72 and a transport vehicle 74, and the way to drive the transport vehicle 74 to move can be a motor or a magnet or other suitable methods. The transport vehicle 74 can be located above, below or on the side of the guide rail 71. After the transport vehicle 74 is combined with the guide rail 71, it can move according to the programming instruction. The carrier 72 is combined with the transport vehicle 74 and is used to carry the object 40. At the same time, the transport platform 70 may also have an extension arm 75, which is connected to the transport vehicle 74 and the carrier 72 and is located between the transport vehicle 74 and the carrier 72. The carrier 72 can be moved to a specified position by the extension arm 75 to send the object 40 to the working platform 19 or the rack 17, 16 of the wire bonding machine 1B, 1C, and to take the object 40 out of the working platform 19 or the rack 17, 16 of the wire bonding machine 1B, 1C. When the transport platform 70 does not have the extension arm (75), it can be moved by other carriers or transport platforms. The carrier 82 of the platform 80 is used to take the object 40 out of the carrier 72 of the transport platform 70 and move it to the working platform 19 or the rack 16, 17 of the wire bonding machine 1B, 1C, and take the object 40 out of the working platform 19 or the rack 16, 17 of the wire bonding machine 1B, 1C and move it to the carrier 72, or the rack (16) of the wire bonding machine 1C is combined with the extension arm 1R so that the rack 16 can be moved to a specified position to put the object 40 into the carrier 72 of the transport platform 70 or take it out, or the transport platform 70 has a power transmission line Z and a conductor Y, and the power transmission line Z is arranged around the guide rail 71 or combined with the guide rail 71, Figure 4It is shown that it is arranged around the guide rail 71 to receive and transmit external power. The conductor Y is located between the power line Z and the transport vehicle 74 to receive and transmit the power of the conductor Z for use by the transport vehicle 74, so that the battery, drive motor and other electrical components (not shown) in the transport vehicle 74 can operate normally. At the same time, the characteristics of the transport platform 70 having the power line Z and the conductor Y are irrelevant to the placement of the object 40, so that the transport platform 70 having the power line Z and the conductor Y can be expanded to various indoor environments or processes, and is not limited to the process of making the packaging system. By comparing the above description, Figure 1 The conventional wire bonding machine 1 and the material box 30 for transporting the object 40 have at least the following advantages: 1) Low cost: The conventional material box 30 has a height of about 200 mm, while the height of the object 40 is less than 0.2 mm. When the material box 30 carries 40 objects 40, its volume, height and weight are significantly greater than the objects 40. Among them, the height of the material box 30 is about 1,000 times the height of the object 40. When the transport platform 70 and 80 transport the material box 30, it is necessary to use a high-load, large-volume, and heavy-weight guide rail, a carrier, a transport vehicle, and an extension arm. When the transport platform 70 and 80 transport the object 40, it is possible to use a low-load, small-volume, and light-weight guide rail, a carrier. , transport carts and outreaching arms, so the transport platform 70, 80 with a lower unit price can be selected for the transport object 40; 2) High reliability: The guide rail is designed based on the condition of transporting the object 40. If it is transporting a material box 30, the guide rail is prone to obvious deformation after long-term use due to the large size and weight of the transport platform 70, 80 carriers, transport carts and outreaching arms, and even cannot be used due to large deformation. To avoid deformation of the guide rail, it is necessary to use a guide rail of higher grade and unit price. If it is transporting an object 40, the guide rail is not easy to deform due to the small size and light weight of the transport platform 70, 80 carriers, transport carts and outreaching arms, so the guide rail has a higher reliability when transporting the object 40.

[0027] Figure 5 Take the wire bonding machine as an example and the schematic diagram of the transport platform. The transport platform 7T and Figure 4 The transport platform 70 is similar, and the same parts can be found in Figure 4The difference lies in the transport vehicle and the carrier. First, referring to the upper right corner of the figure, the transport vehicle 74 is connected in series with at least one transport vehicle 74a, so that the two transport vehicles 74 and 74a are like a train, and at least two objects 40 can be transported in one trip. Moreover, the transport vehicle 74a can reduce weight and cost by using the traction of the transport vehicle 74 without setting a power device. Next, referring to the central position at the top of the figure, a transport vehicle 74 is connected in series or side by side with at least two carriers 72, so that the transport vehicle 74 can transport at least two objects 40 in one trip. Next, referring to the upper left and lower left corners of the figure, the lower left corner is a side view of a carrier 72a of different embodiments. Each carrier 72a can carry at least two objects 40, so that the transport vehicle 74 can transport at least two objects 40 in one trip. Various combinations derived from the above-mentioned transport vehicles 74, 74a and carriers 72, 72a can reduce costs because the transport vehicle 74 transports at least two objects 40 in one trip, such as: see Figure 5 At the upper right or upper center position, when the carrier 72 is replaced by the carrier 72a, the transport vehicle 74 can transport at least four objects 40 in one trip, making the transportation efficiency higher and the cost lower. In addition, the carrier 72a can also be designed to carry only one object 40 according to the needs, making the carrier 72a more practical; the characteristics and symbols of the wire bonding machine 1B are the same as those of the wire bonding machine 1B. Figures 2 to 4 The wire bonding machines 1A and 1B are similar. For similarities, please refer to Figures 2 to 4 , the difference is the rack, which is used in combination with different forms of carriers 72, 72a according to different needs, such as: when the rack 16 is combined with the carrier 72a without the object 40, the carrier 72a can receive the object 40 from the transport platform 7T, or such as: the rack 16 can directly receive the carrier 72a from the transport platform 7T, and the carrier 72a has at least one object 40, or such as: after the carrier 72a located on the rack 17 carries the object 40, the carrier 72a can be moved away from the wire bonding machine 1B by the transport platform 7T according to needs, or only the object 40 located on the carrier 72a can be moved away from the wire bonding machine 1B. By using the above-mentioned racks in different ways, the racks 16 and 17 can hold at least one or more objects 40, thereby reducing the number of times and costs of transportation by the transport vehicle 74; in addition, each of the above-mentioned carriers 72, 72a can be connected with a bar code (Bar code) or two-dimensional barcode (QR code) or radio frequency electronic tag (RFID) and other different identification components Zb are combined for production management or material tracking. In addition, Figure 4 and Figure 5 The transport platform 70, 7T is used to transport the object 40, so that the total height of the transport platform 70, 7T when transporting the object 40 is lower than that of the conventional transport box (30_ Figure 1 ) is significantly reduced, usually by one material box height or at least 15 cm, so that sufficient space can be freed up under the transport platforms 70, 7T to set up the storage rack SK. Figure 5For example, the storage rack SK is used for storing objects 40 or material boxes, especially the storage rack SK for storing objects 40. The storage rack SK is located at the periphery of the guide rail 71 and can be engaged with the transport platform 70, 7T or not, and is set at a position that does not interfere with the transport of the object 40 by the transport vehicle 74, 74. It can be located below or on the side below the carrier 72, 72a, especially at a position below the carrier 72, 72a. Therefore, setting up the storage rack SK can reduce the number of storage cabinets for storing material boxes on the floor and minimize the distance and time for the carrier 72, 72a to pick up the object 40, thereby reducing the space for setting up the storage cabinet and the number and cost of the transport vehicle 74.

[0028] According to the way of transporting objects, conventional production equipment can be modified into Figure 2 to Figure 5 In addition to the embodiment, it can also be slightly modified to achieve the object transport method, such as Figure 6 This is a schematic diagram of a production equipment using a fully automatic wire bonding machine as an example. The symbols and features of the wire bonding machine 1D are similar to Figure 1 The symbols and features of the conventional wire bonding machine 1 are similar. Figure 1 The difference is that the carrier 12a of the feeding device LD and the unloading device UL is that the carrier 12a is combined with the racks 16 and 17 instead of carrying the conventional material box (30). The present embodiment is respectively combined with one rack 16 and two racks 17. The racks 16 and 17 are used to carry objects 40, so that multiple racks 17 can be stacked together, or one rack 16 can carry one or more objects 40, so that the carrier 12a can carry multiple objects 40 by means of the racks 16 and 17. At the same time, the upper part or the short side or the long side of the racks 16 and 17 can be an open space, so that personnel or a handling platform (70, 80_ Figure 4 ) of the carrier (72, 82), it is easy to put in or take out the object 40 from the rack 16, 17. Accordingly, the modified wire bonding machine 1D can also reduce the number and cost of racks or material boxes by virtue of the optimized carrier 12a and the racks 16, 17. When using the conveying platform (70, 80) to convey objects, it is not necessary to modify or slightly modify the carrier of the conveying platform, so that the racks 16, 17 have fewer restrictions than the material box (30) and are more practical. In addition, the conventional material box (30) only has an open space on the short side, and the object 40 can only be put in or taken out from the short side, making it difficult or impossible for the extended arm and carrier of the conveying platform (70, 80) to put the object 40 into the material box (30) or take it out, which is not effective.

[0029] The capability of equipment for producing packaging bodies is increasingly improved, which results in low utilization rate of non-essential devices of conventional production equipment and waste. At the same time, since the production equipment does not use a material box to transport objects, the space originally used for setting up a material input device or / and a material output device can be freed up for setting up non-essential devices, so that multiple production equipment can share a non-essential device to reduce costs. Figure 7 This is a schematic diagram of an embodiment in which multiple production equipment share non-essential devices, and takes a wire bonding machine and a microscope as an example. The characteristics and symbols of the wire bonding machines 1B, 1C, and 1D are similar to those of Figures 2 to 4 The wire bonding machines 1B and 1C are similar. For similarities, please refer to Figures 2 to 4 The difference is: the base is used for combining with the microscope, and it can be connected with the wire bonding machine or not, and can be especially arranged in the space vacated by the original feeding device or discharging device of the wire bonding machine, or arranged between two wire bonding machines. First, referring to the wire bonding machine 1D and the adjacent wire bonding machine 1C, a base 10 and a microscope 13 are arranged in the space on the left side of the wire bonding machine 1C, and the microscope 13 can be switched between the two wire bonding machines 1C and 1D, so that the two wire bonding machines 1C and 1D share the same microscope 13. Next, referring to the wire bonding machine 1B and the adjacent wire bonding machine 1C, a base 10 is arranged in the space on the left side of the wire bonding machine 1C, and a base 10 and a microscope 13 are arranged in the space on the right side of the wire bonding machine 1B, and the microscope 13 is arranged in the space on the left side of the wire bonding machine 1C. 3 can be switched between the two wire bonding machines 1B and 1C, so that the two wire bonding machines 1B and 1C share a microscope 13. At the same time, one or more wire bonding machines can be added between the wire bonding machine 1B and the wire bonding machine 1C, so that three or more wire bonding machines share a microscope 13. Next, referring to the wire bonding machines 1B, 1C, and 1D, the base 10 is moved out of the wire bonding machines 1B, 1C, and 1D, and is set above or in front of the wire bonding machines 1B, 1C, and 1D. In this embodiment, it is set above the wire bonding machine. When the microscope 13 is engaged with the base 10, it can be switched between the wire bonding machines 1B, 1C, and 1D, so that the four wire bonding machines share a microscope 13. The above methods can make multiple wire bonding machines share a microscope and reduce the number and cost of microscopes.

[0030] The above embodiments are merely illustrative of the principles and effects of the present technology. Therefore, equivalent modifications or changes made without departing from the technical features of the present disclosure should still be covered by the scope of the claims of this application.

Claims

1. A production equipment, which is suitable for making a wafer loading machine, a plasma cleaning machine, a wire bonding machine, a molding machine, a printer and a singulation machine for manufacturing a package body, and has a main operating system, a platform and a control box, wherein the main operating system is connected to the platform and has a processing platform and a processing device, wherein the processing device includes a main processing process, wherein the processing platform has a processing area, a fixture and a driving device for moving the fixture position for automatically transporting objects, and the side of the processing platform is implemented as a feeding side or a discharging side, so that the object can be automatically moved from the feeding side of the processing platform to the processing area, or automatically moved from the processing area to the discharging side, and the object is combined with at least one wafer.

2. The production equipment according to claim 1, characterized in that: The objects are delivered to the infeed side of the production equipment by the transport platform, or taken out from the outfeed side of the production equipment by the transport platform.

3. The production equipment according to claim 1, characterized in that: A rack is provided for placing objects. The rack is located at the feeding side or the discharging side of the processing platform and is arranged corresponding to the processing platform.

4. The production equipment according to claim 3, characterized in that: The objects are delivered to the rack on the infeed side by the transport platform, or taken out from the rack on the outfeed side by the transport platform.

5. The production equipment according to claim 3, characterized in that: The object rack is connected to a carrier, and the carrier carries at least one object, or the carrier has an identification component for identifying the object.

6. The production equipment according to claim 1, characterized in that: The production equipment is implemented as a wire bonding machine, and at least another wire bonding machine is added at an adjacent position of the wire bonding machine. At the same time, a base and a microscope are set for use by the wire bonding machine, and the base is connected to the wire bonding machine or not connected to the wire bonding machine, so that two or more wire bonding machines share a microscope. When the microscope is connected to the base, the microscope is switched between at least two wire bonding machines, so that two or more wire bonding machines share a microscope.

7. The production equipment according to claim 1, characterized in that: There is a storage space in or around the production equipment, and the storage space is used to place objects or other items. The objects are transported to the storage space by a transport platform, and personnel can use a microscope to examine the objects placed on the shelf or in the storage space.

8. The production equipment according to claim 1, characterized in that: A camera or a barcode reader is provided, which is located around the rack and is used to capture identification component data associated with the object or the carrier.

9. The production equipment according to claim 1, characterized in that: The invention has a feeding device and / or a discharging device, which are connected to the platform and are respectively located at the feeding side or the discharging side of the main operating system. The feeding device and the discharging device have at least a driving device, a guide rail, a carrier and a rack. The carrier carries at least one rack, and the rack is used to carry objects combined with the chip.

10. A transport platform, which is used in combination with the production equipment described in any one of claims 1 to 9. The transport platform is used to transport objects, is mounted on a ceiling or a wall column, and has a transport cart, a carrier and a guide rail. The carrier is used to carry objects. After the transport cart is combined with the guide rail, it moves according to programming instructions. The carrier is combined with the transport cart to send objects to the rack of the production equipment, or to take objects out of the rack of the production equipment. At the same time, the object is bonded to at least one chip.

11. The transport platform according to claim 10, characterized in that: in, A transport vehicle on the transport platform carries at least two carriers, the two carriers are connected in series or in parallel, or the two transport vehicles are connected in series.

12. The transport platform according to claim 10, characterized in that: The transport platform has an extension arm, which is located between the carrier and the transport vehicle to deliver objects to the racks of the production equipment or to take objects out of the racks of the production equipment.

13. The transport platform according to claim 10, characterized in that: The transport platform has a storage rack, which is located at the periphery of the guide rail for placing objects and is arranged at a position that does not interfere with the transport of objects by the transport vehicle. The storage rack is located below or on the side of the carrier, especially below the carrier.

14. A transport platform, which is used in conjunction with the production equipment described in any one of claims 1-9. The transport platform is set up on the floor and moves according to programming instructions. It has a carrier, a trolley and an extension arm. The carrier is used to carry objects. The extension arm is a mechanical arm that can change its position. It is connected to the trolley and the carrier and is located between the trolley and the carrier. The carrier is moved to a specified position by extending the arm to place objects in the rack of the production equipment or take objects out from the rack of the production equipment. At the same time, the object is connected to at least one chip.

15. The transport platform according to claim 14, characterized in that: The transport platform has a magazine for storing objects, so that the extended arm can take the objects from the magazine or return the objects to the magazine.

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