Electronic device

Abstract

The invention discloses an electronic device which comprises a frame and further comprises an antenna connecting plate, the antenna connecting plate is attached to the first side face of the frame, and a grounding elastic piece is arranged on the antenna connecting plate; wherein the frame outwards forms a conductive structure, the conductive structure comprises a first conductive part and a second conductive part, and the plane where the first conductive part is located and the plane where the first side face is located form an included angle or are parallel to each other. The second conductive part is respectively connected with the first conductive part and the first side surface; and the grounding elastic sheet is electrically connected with the side wall of the first conductive part.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] With the popularization and promotion of smart phones, users have higher and higher requirements for the functions and experience of mobile phones. Antenna performance, as one of the core functions that affects the user experience, needs to be a topic of continuous research. In some usage scenarios, such as typical gaming scenarios, the antennas at the top and bottom of the phone will be held by human hands, resulting in reduced antenna radiation efficiency. To solve this problem, a solution was designed to insert an antenna plate on the side of the middle frame. Through this antenna plate, the antenna can be placed in the middle of the entire machine, thus avoiding the problem of human hands blocking the antenna when the phone is placed horizontally.

[0003] In the electrical connection scheme of the conventional antenna board, a slot is added to the inner side of the middle frame along the width direction of the middle frame, and the gold-plated sheet is welded to the bottom of the slot. In order to ensure the feasibility of welding, the width of the middle frame slot needs to be increased accordingly. Increasing the width of the middle frame slot will lead to a reduction in battery space. At the same time, increasing the width of the middle frame slot will reduce the strength of the middle frame. Summary of the invention

[0004] An embodiment of the present application provides an electronic device to solve the problem that the existing grounding solution of the antenna board will lead to a reduction in battery space and a decrease in the strength of the middle frame.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, including a frame 20, and further including:

[0007] An antenna connection plate 10, wherein the antenna connection plate 10 is disposed in close contact with the first side surface of the frame 20, and a grounding spring 101 is disposed on the antenna connection plate 10;

[0008] Among them, the frame 20 is formed with a conductive structure 30 outwardly, and the conductive structure 30 includes a first conductive part 31 and a second conductive part 32. The plane where the first conductive part 31 is located forms an angle or is parallel to the plane where the first side surface is located. The second conductive part 32 is respectively connected to the first conductive part 31 and the first side surface. The grounding spring 101 is electrically connected to the side wall of the first conductive part 31.

[0009] Thus, in the above scheme of the present application, the frame is formed with a conductive structure including a first conductive part and a second conductive part outwardly, the plane where the first conductive part is located forms an angle or is parallel to the plane where the first side surface is located, and the grounding spring on the antenna connection plate is electrically connected to the side wall of the first conductive part. In this scheme, the grounding spring is electrically connected to the conductive structure formed outwardly by the frame, so that the grounding requirement of the antenna connection plate is realized, and therefore there is no need to open a groove on the inner side of the frame to connect the grounding spring of the antenna connection plate, thereby avoiding the problem of reducing the battery space and reducing the strength of the middle frame due to adding a groove on the inner side of the middle frame along the width direction of the middle frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A schematic diagram of an electronic device showing some embodiments of the present application;

[0011] Figure 2 A schematic diagram showing an antenna connection board according to some embodiments of the present application;

[0012] Figure 3 A schematic diagram of an electronic device showing some embodiments of the present application;

[0013] Figure 4 Indicates along Figure 3 Cross-sectional view in the direction indicated by the arrow;

[0014] Figure 5 A schematic diagram showing the connection between the L-shaped bottom solder gold-plated sheet and the antenna connection board in the existing solution;

[0015] Figure 6 A schematic diagram showing a first gold-plated sheet according to some embodiments of the present application;

[0016] Figure 7 A schematic diagram showing an air-avoidance opening of some embodiments of the present application;

[0017] Figure 8 A schematic diagram of an electronic device showing some embodiments of the present application;

[0018] Fig. 9 Indicates along Figure 8 Cross-sectional view in the direction indicated by the arrow. DETAILED DESCRIPTION

[0019] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0020] like Figure 1 As shown, an embodiment of the present application provides an electronic device, including a frame 20, and further including:

[0021] The antenna connecting plate 10 is arranged in contact with the first side surface of the frame 20, and the antenna connecting plate 10 is connected to the main board 60 and the antenna radiator 40 respectively, wherein Figure 2 As shown, a grounding spring 101 is provided on the antenna connection plate 10;

[0022] Among them, Figure 3 and Figure 4 As shown, the frame 20 is formed with a conductive structure 30 outwardly, and the conductive structure 30 includes a first conductive part 31 and a second conductive part 32. An angle is formed between the plane where the first conductive part 31 is located and the plane where the first side surface is located. The second conductive part 32 is respectively connected to the first conductive part 31 and the first side surface. The grounding spring 101 is electrically connected to the side wall of the first conductive part.

[0023] Optionally, the conductive structure is a metal structure.

[0024] In the embodiment of the present application, the antenna connecting plate 10 can also be described as a small antenna plate.

[0025] The frame 20 is used to connect the front panel and the rear shell of the electronic device. Optionally, a battery storage compartment is provided on the frame. Optionally, the first side surface can be understood as the outer side surface of the frame 20.

[0026] In some embodiments of the present application, the frame 20 may also be described as a frame body or a middle frame.

[0027] Optionally, the angle has a value range of (0, 90] degrees.

[0028] Optionally, when the plane where the first conductive portion 31 is located is parallel to the plane where the first side surface is located, it can be understood that the second conductive portion 32 is respectively parallel to the plane where the first conductive portion 31 is located and the plane where the first side surface is located.

[0029] In some embodiments of the present application, the first conductive part 31 is a first metal plate, the second conductive part 32 is a second metal plate, and the second metal plate is vertically connected to the first metal plate and the first side surface, respectively. Here, the first conductive part 31, the second conductive part 32 and the first side surface are connected to form a U-shaped conductive structure. Optionally, in the above scheme, the grounding spring clip 101 is electrically connected to the side wall of the first conductive part 31 to form a complete ground return path of the antenna connecting plate 10 → grounding spring clip 101 → U-shaped conductive structure → battery accommodating compartment, thereby realizing the grounding requirement of the antenna connecting plate.

[0030] Optionally, the antenna connecting plate 10 is connected to a mainboard 60 of the electronic device through a flexible printed circuit board 50 .

[0031] In the above scheme, the structure of the frame 20 of the electronic device is changed, and the frame 20 is formed with a conductive structure 30 including a first conductive part and a second conductive part outwardly, and the plane where the first conductive part (31) is located forms an angle or is parallel to the plane where the first side surface is located. In this scheme, the grounding spring is electrically connected to the conductive structure formed by the frame outwardly, so that the grounding requirement of the antenna connection plate is realized, and thus there is no need to open a groove on the inner side of the frame to connect the grounding spring of the antenna connection plate. For example, the first conductive part can be understood as a conductive part arranged along the length direction of the frame, and the second conductive part can be understood as a conductive part arranged along the width direction of the frame. The grounding spring on the antenna connection plate is connected to the side wall of the first conductive part, that is, the grounding spring is connected to the conductive part arranged along the length direction of the frame, so there is no need to open a groove along the width direction of the frame toward one side of the battery storage compartment (that is, toward the inner side of the frame) to connect the grounding spring, thereby avoiding the problem of reducing the battery space and reducing the frame strength due to adding a groove on the inner side of the middle frame along the width direction of the middle frame.

[0032] Optionally, as a first implementation method, the electronic device also includes a first gold-plated sheet 301, which is arranged on the side wall of the first conductive part 31 facing the first side surface, and the grounding spring sheet 101 is electrically connected to the side wall of the first conductive part 31 through the first gold-plated sheet 301.

[0033] In the first implementation, the first gold-plated sheet 301 can also be described as a side-welded gold-plated sheet. The first gold-plated sheet 301 can be arranged in close contact with the side wall of the first conductive part 31, so that a complete return path of the antenna connecting plate 10 → grounding spring 101 → first gold-plated sheet 301 → U-shaped conductive structure → battery compartment can be formed, thereby achieving the grounding requirement of the antenna connecting plate. Since the first gold-plated sheet can be side-welded on the middle frame, such as Figure 5 As shown, compared with the existing L-shaped bottom solder gold-plated sheet 70, the length ratio of the gold-plated sheet in the return path is shortened, and the slot width of the middle frame corresponding to the antenna connecting plate along the width direction, i.e., the X-axis direction, is reduced, thereby increasing the battery space and optimizing the battery capacity. At the same time, the slot width is reduced, which can optimize the strength of the middle frame and improve the reliability of the middle frame.

[0034] Alternatively, if Figure 2 As shown, a feeding spring 102 is also provided on the antenna connecting plate 10 , and the feeding spring 102 is connected to the antenna radiator 40 of the electronic device through a second gold-plated sheet 103 .

[0035] The antenna radiator 40 is a part of a metal outer frame of the electronic device, and the metal outer frame is disposed on the periphery of the frame 20 .

[0036] Optionally, the second gold-plated sheet 103 is connected to the antenna radiator 40 by welding.

[0037] The second gold-plated sheet 103 is provided with a contact area and a soldering point area. The soldering point area is soldered to the antenna radiator 40 , and the contact area 3011 is electrically connected to the feeding spring 102 .

[0038] The feeding spring 102 on the antenna connection board 10 is connected to the antenna radiator 40 to achieve feeding of the antenna radiator by the antenna connection board.

[0039] In an embodiment of the present application, the antenna radiator 40 is located on the first side of the metal outer frame, and the antenna radiator is located between the top and the bottom of the first side. For example, the antenna radiator is located in the middle of the first side. In this way, the problem of human hands blocking the antenna in a horizontally placed electronic device can be effectively avoided, thereby effectively improving the radiation efficiency of the antenna.

[0040] Optionally, the second gold-plated sheet 103 has the same structure as the first gold-plated sheet 301 .

[0041] In the embodiment of the present application, the second gold-plated sheet 103 and the first gold-plated sheet 301 adopt the same structure, for example, both use the same type of gold-plated sheet, so that the material can be reused in large quantities.

[0042] Alternatively, if Figure 6 As shown, the first gold-plated sheet 301 includes a contact area 3011 and a soldering point area 3012 . The soldering point area 3012 is soldered to the side wall of the first conductive portion 31 , and the contact area 3011 is electrically connected to the grounding spring sheet 101 .

[0043] Optionally, the first gold-plated sheet in the embodiment of the present application is a planar plate-shaped structure.

[0044] In the existing solution, since the L-shaped bottom-welded gold-plated sheet has a relatively slender welding position, it is not easy to clamp during the welding process, and it can be offset in the three directions of X, Y and Z. At the same time, the pressure claw structure is too weak and easily deformed, resulting in loose pressing, and the welding yield rate will be significantly reduced, resulting in an increase in the cost of the middle frame. The first gold-plated sheet in this application is a side-welded gold-plated sheet, and the welding yield rate of the side-welded gold-plated sheet is better than the welding yield rate of the L-shaped bottom-welded gold-plated sheet, thereby achieving the purpose of reducing costs and increasing efficiency.

[0045] Optionally, the welding point area 3012 includes at least two welding points arranged in a preset arrangement order.

[0046] For example, the solder joint area includes two rows of solder joints arranged in parallel. By setting a plurality of solder joints, the soldering positions between the first conductive part and the first gold-plated sheet can be effectively increased, thereby effectively improving the soldering yield of the first gold-plated sheet.

[0047] Alternatively, if Figure 7 As shown, a clearance opening 201 is provided in the frame 20 at a position corresponding to the end of the first conductive portion 31 .

[0048] Optionally, the above-mentioned air avoidance is provided at the outer edge of the position corresponding to the end of the first conductive part 31 in the frame 20. By providing the above-mentioned air avoidance, the distance between the end of the first conductive part and the position of the above-mentioned frame corresponding to the end can be increased, for example, the distance between the two upper ends in the above-mentioned U-shaped conductive structure can be increased, thereby effectively ensuring that there is sufficient welding space to weld the first gold-plated sheet 301 on the side wall of the above-mentioned first conductive part 31.

[0049] The above-mentioned gap can be understood as a gap in the middle frame. In the first implementation, in order to ensure the feasibility of the actual operation of side welding the first gold-plated sheet, it is necessary to make a gap in the middle frame corresponding to the welding point of the first gold-plated sheet to avoid the gap. During the welding process, the middle frame is kept tilted at 45° by a jig, and the middle frame gap retaining wall avoids the edge of the welding point area by 0.4mm, thereby effectively ensuring the welding feasibility of the first gold-plated sheet.

[0050] Alternatively, if Figure 8 and Fig. 9 As shown, as a second implementation manner, a laser engraved area is provided on the side wall of the first conductive part 31 , and the grounding spring 101 is in contact with and connected to the laser engraved area.

[0051] In the second implementation, since the grounding position has low requirements on the contact surface impedance, the grounding spring 101 can be directly contacted and connected with the above-mentioned conductive structure 30, thereby forming a complete ground return path of the antenna connecting plate 10 → grounding spring 101 → U-shaped conductive structure → battery accommodating compartment. At the same time, in order to ensure the grounding reliability, the contact area with the grounding spring in the side wall of the above-mentioned first conductive part 31 is laser engraved to form the above-mentioned laser engraved area, which can further simplify the grounding system and realize the grounding scheme of the antenna small board without gold-plated sheet, thereby further reducing the cost.

[0052] In the embodiment of the present application, by changing the structure of the middle frame, the grounding spring sheet is electrically connected to the conductive structure formed by the frame toward the periphery, thereby realizing the grounding requirement of the antenna connecting plate. Therefore, there is no need to open a groove on the inner side of the frame to connect the grounding spring sheet of the antenna connecting plate, thereby achieving the purpose of replacing the L-shaped bottom solder gold-plated sheet with the side solder gold-plated sheet or directly canceling the L-shaped bottom solder gold-plated sheet, thereby solving the problems of large space occupation, high cost and multiple material states caused by the use of the L-shaped bottom solder gold-plated sheet.

[0053] Optionally, the electronic device includes but is not limited to: terminal devices such as mobile phones, tablet computers, wearable devices, or other electronic devices with antenna devices, etc., and the embodiments of the present application are not limited thereto.

[0054] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0055] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

[0056] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0057] The above is a preferred embodiment of the present application. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present application. These improvements and modifications are also within the scope of protection of the present application.

Claims

1. An electronic device, comprising a frame, characterized in that: Also includes: An antenna connection plate, the antenna connection plate is arranged in contact with the first side surface of the frame, and a grounding spring is arranged on the antenna connection plate; Among them, the frame forms a conductive structure outwardly, and the conductive structure includes a first conductive part and a second conductive part. The plane where the first conductive part is located forms an angle or is parallel to the plane where the first side surface is located. The second conductive part is respectively connected to the first conductive part and the first side surface, and the grounding spring is electrically connected to the side wall of the first conductive part.

2. The electronic device according to claim 1, characterized in that: It also includes a first gold-plated sheet, which is arranged on the side wall of the first conductive part facing the first side surface, and the grounding spring is electrically connected to the side wall of the first conductive part through the first gold-plated sheet.

3. The electronic device according to claim 2, characterized in that: The antenna connection plate is also provided with a feeding spring, and the feeding spring is connected to the antenna radiator of the electronic device through a second gold-plated sheet; The antenna radiator is a part of the metal outer frame of the electronic device, and the metal outer frame is arranged on the periphery of the frame.

4. The electronic device according to claim 3, characterized in that: The second gold-plated sheet has the same structure as the first gold-plated sheet.

5. The electronic device according to claim 2, characterized in that: A clearance opening is provided in the frame at a position corresponding to the end of the first conductive part.

6. The electronic device according to claim 2, characterized in that: The first gold-plated sheet includes a contact area and a soldering point area, the soldering point area is soldered to the side wall of the first conductive portion, and the contact area is electrically connected to the grounding spring sheet.

7. The electronic device according to claim 6, characterized in that: The welding point area includes at least two welding points arranged in a preset arrangement order.

8. The electronic device according to claim 1, characterized in that: A laser-engraved area is arranged on the side wall of the first conductive part, and the grounding spring is in contact with and connected to the laser-engraved area.

9. The electronic device according to claim 1, characterized in that: A battery accommodating compartment is arranged on the frame.

10. The electronic device according to claim 1, characterized in that: The antenna connection board is connected to the main board of the electronic device through a flexible circuit board.

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