Motor controller design method and device, computer equipment, readable storage medium and program product
By using a motor controller design with multiple bridge arms in electric vehicles, and using a printed circuit board with stacked busbars to connect the high-voltage power supply, the problems of cost improvement and performance reduction in the high-voltage 800V system are solved, and high efficiency and Low-cost high-pressure realization.
Patent Information
- Application Number
- CN202411310539.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2024-12-24
AI Technical Summary
High-voltage 800V system has problems of cost improvement and performance reduction in electric vehicles, especially because traditional silicon-based IGBTs have large switching losses under 1200V voltage resistance and reduced system efficiency, so the industry has turned to higher cost silicon carbide materials.
Motor controller design with multiple bridge arms, each bridge arm is connected in parallel with the positive and negative electrodes of high voltage power supply and the high voltage DC midpoint through a printed circuit board set in a stacked busbar, including an insulated gate bipolar transistor and a freewheeling diode chip , realize a three-level structure to reduce costs and improve efficiency.
The three-level structure is introduced through the stacked busbar, which achieves fast charging and high-efficiency operation under the high-voltage platform, while avoiding cost improvement and performance reduction, and improving the overall efficiency of the system.
Smart Images
Figure CN119182337A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electronic technology, and in particular to a motor controller design method, device, computer equipment, computer-readable storage medium and computer program product. Background Art
[0002] The trend of high voltage in electric vehicles is very obvious, and it will enter a stage of rapid outbreak in the next few years. The high voltage 800V or even 1000V high voltage platform is mainly to achieve high voltage fast charging, shorten charging time, and solve the mileage anxiety of electric vehicles. At the same time, high voltage is conducive to improving efficiency, because the current demand is reduced by half for the same output power, and the wire does not need to be so thick, which is conducive to the lightweight of the whole vehicle. At the same time, the resistance heat energy consumption of the wire is also reduced, and the overall efficiency of the system is improved. When the system current remains unchanged, the charging power will double with the system voltage. Therefore, the 800V high voltage platform can easily achieve high power and high torque, as well as better acceleration performance. Although the improvement in energy replenishment efficiency brought by 800V to electric vehicles is a qualitative change, there are many problems to be solved in the 800V system.
[0003] The high-voltage 800V system requires a power module with a withstand voltage of 1200V. The traditional silicon-based insulated gate bipolar transistor (IGBT) generally has a withstand voltage of 750V. When it is increased to 1200V, the switching loss is very large and the system efficiency is greatly reduced. Therefore, the industry almost all uses silicon carbide (SiC) with a high-voltage platform, and the cost is more than three times that of traditional silicon-based IGBTs. Therefore, how to avoid cost increases and performance reductions while using high-voltage platforms to achieve fast charging and high efficiency brought by high voltage is an urgent problem to be solved. Summary of the invention
[0004] Based on this, it is necessary to provide a motor controller that can use a high-voltage platform at low cost in electric vehicles to address the above technical problems.
[0005] In the first aspect, the present application provides a motor controller, which includes multiple bridge arms, and the internal structure design of the multiple bridge arms is the same. The multiple bridge arms are connected in parallel between the positive and negative poles of the high-voltage power supply, and each bridge arm is also connected to the high-voltage DC midpoint and the motor; each bridge arm includes: a first panel and a second panel, and the first panel and the second panel are arranged in a laminated busbar.
[0006] In one embodiment, the first panel includes: a first strong current output chip, a second strong current output chip, and a first power chip; the second panel includes: a third strong current output chip, a fourth strong current output chip, and a second power chip; the first panel and the second panel are laminated and pressed together, the first strong current output chip and the fourth strong current output chip are arranged oppositely, the second strong current output chip and the third strong current output chip are arranged oppositely, and the first power chip and the second power chip are arranged oppositely; the first strong current output chip, the second strong current output chip, the third strong current output chip, and the fourth strong current output chip are connected in sequence, the other end of the first strong current output chip is connected to the positive electrode of the high voltage power supply, and the other end of the fourth strong current output chip is connected to the negative electrode of the high voltage power supply; one end of the first power chip is connected to the line between the first strong current output chip and the second strong current output chip, and the other end of the first power chip is connected to the midpoint of the high voltage direct current; one end of the second power chip is connected to the line between the third strong current output chip and the fourth strong current output chip, and the other end of the second power chip is connected to the midpoint of the high voltage direct current; the motor is connected to the line between the second strong current output chip and the third strong current output chip.
[0007] In one of the embodiments, the first panel includes: a first insulating layer, a first copper clad layer formed on the first insulating layer, a second insulating layer formed on the first copper clad layer, a first via hole is provided on the second insulating layer, and the chip included in the first panel is provided in a groove above the via hole; the first copper clad layer is connected to the chip included in the first panel through the first via hole; the first panel also includes: a third insulating layer formed on the second insulating layer, a second via hole is provided on the third insulating layer, a second copper clad layer is formed on the third insulating layer, a fourth insulating layer is formed on the second copper clad layer, and the second copper clad layer is connected to the chip included in the first panel through the second via hole.
[0008] In one embodiment, the first copper clad layer includes: a first forward copper clad layer, a first midpoint copper clad layer, and a first connection point copper clad layer; the second copper clad layer includes: a second forward copper clad layer, a second midpoint copper clad layer, and a second connection point copper clad layer; the first forward copper clad layer is connected to the first high-power output chip through the first via, the first midpoint copper clad layer is connected to the second high-power output chip through the first via, and the first connection point copper clad layer is connected to the first power chip through the first via; the second forward copper clad layer is connected to the first high-power output chip through the second via, the second midpoint copper clad layer is connected to the second high-power output chip through the second via, and the second connection point copper clad layer is connected to the first power chip through the second via.
[0009] In one embodiment, the motor controller also includes: a high-voltage power supply positive electrode connector, which is located between the third insulating layer and the fourth insulating layer, and the first high-voltage output chip is connected to the high-voltage power supply positive electrode connector, and the high-voltage power supply positive electrode connector is used to connect to the positive electrode of the high-voltage power supply.
[0010] In one embodiment, the motor controller further includes: a high-voltage DC midpoint connector, wherein the high-voltage DC midpoint connector is located between the third insulating layer and the fourth insulating layer, and the other end of the first power chip is connected to the high-voltage DC midpoint connector, and the high-voltage DC midpoint connector is used to be connected to the high-voltage DC midpoint.
[0011] In one embodiment, the first panel includes a first gate control pin for transmitting control signals of the first high-power output chip and the second high-power output chip, and the second panel includes a second gate control pin for transmitting control signals of the third high-power output chip and the fourth high-power output chip.
[0012] In one embodiment, the motor controller further includes: a heat sink, wherein the heat sink is located on a side of the first insulating layer away from the first copper cladding layer.
[0013] In one embodiment, each of the first strong power output chip, the second strong power output chip, the third strong power output chip and the fourth strong power output chip includes: an insulated gate bipolar transistor and a freewheeling diode chip; the source of the insulated gate bipolar transistor is connected to the cathode of the freewheeling diode chip, and the drain of the insulated gate bipolar transistor is connected to the anode of the freewheeling diode chip; the insulated gate bipolar transistor and the freewheeling diode chip share the same area, which is the terminal area and the cell area.
[0014] In one of the embodiments, the motor controller includes three bridge arms.
[0015] The motor controller includes a plurality of bridge arms, the internal structures of the plurality of bridge arms are designed in the same way, the plurality of bridge arms are connected in parallel between the positive and negative electrodes of the high-voltage power supply, and each bridge arm is also connected to the high-voltage DC midpoint and the motor; each bridge arm includes: a first panel and a second panel, and the first panel and the second panel are arranged in a laminated busbar. The method introduces three-level by means of a laminated busbar, allowing electric vehicles to achieve high voltage through a high-voltage platform to achieve fast charging and high-efficiency operation, while avoiding cost increases and performance reductions. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 is a three-level inverter topology diagram of a motor controller in one embodiment;
[0018] Figure 2 is a detailed topology diagram of a three-level inverter in another embodiment;
[0019] Figure 3 is a schematic structural diagram of a bridge arm in an embodiment;
[0020] Figure 4 is a schematic diagram of the side structure of a first panel in one embodiment;
[0021] Figure 5 It is a schematic diagram of the side structure after two layers of panels are pressed together in another embodiment. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0023] In one embodiment, Figure 1 As shown, a motor controller is provided, comprising:
[0024] The motor controller includes multiple bridge arms, the internal structures of the multiple bridge arms are designed in the same way, the multiple bridge arms are connected in parallel between the positive and negative poles of the high-voltage power supply, and each bridge arm is also connected to the midpoint of the high-voltage DC and the motor; each bridge arm includes: a first panel and a second panel, and the first panel and the second panel are arranged in a laminated busbar.
[0025] Optionally, the panel may be a printed circuit board.
[0026] Among them, the PCB is also called a printed circuit board or printed circuit board. It is the support of electronic components and the provider of electrical connections for electronic components. The PCB is made by electronic printing, transferring the circuit pattern to the printed circuit to form a circuit structure with certain functions.
[0027] Among them, the laminated busbar, also known as laminated busbar, composite busbar, etc., is a multi-layer composite structure connecting bar, which is regarded as the highway of the distribution system. This structure shows significant advantages in electrical and mechanical properties by laminating multiple layers of copper bars with insulating materials into a whole.
[0028] Exemplarily, the motor controller includes multiple bridge arms, the internal structure design of the multiple bridge arms is the same, the multiple bridge arms are connected in parallel between the positive and negative poles of the high-voltage power supply, and each bridge arm is also connected to the high-voltage DC midpoint and the motor; each bridge arm includes: a first PCB board and a second PCB board, and the first PCB board and the second PCB board are arranged with a laminated busbar.
[0029] In one embodiment, if Figure 2 As shown, each bridge arm includes: an insulated gate bipolar diode chip T1, a second insulated gate bipolar diode chip T2, a third insulated gate bipolar diode chip T3, a fourth insulated gate bipolar diode chip T4, a diode D1, a diode D2, a diode D3 and a diode D4, a first power chip D5, and a second power chip D6.
[0030] The motor controller includes a plurality of bridge arms, the internal structures of the plurality of bridge arms are designed in the same way, the plurality of bridge arms are connected in parallel between the positive and negative electrodes of the high-voltage power supply, and each bridge arm is also connected to the high-voltage DC midpoint and the motor; each bridge arm includes: a first panel and a second panel, and the first panel and the second panel are arranged in a laminated busbar. The method introduces three-level by means of a laminated busbar, allowing electric vehicles to achieve high voltage through a high-voltage platform to achieve fast charging and high-efficiency operation, while avoiding cost increases and performance reductions.
[0031] In one embodiment, if Figure 2 and Figure 3As shown, the first panel includes: a first strong current output chip, a second strong current output chip, and a first power chip; the second panel includes: a third strong current output chip, a fourth strong current output chip, and a second power chip; the first panel and the second panel are laminated and pressed, the first strong current output chip and the fourth strong current output chip are arranged relative to each other, the second strong current output chip and the third strong current output chip are arranged relative to each other, and the first power chip and the second power chip are arranged relative to each other; the first strong current output chip, the second strong current output chip, the third strong current output chip, and the fourth strong current output chip are connected in sequence, the other end of the first strong current output chip is connected to the positive electrode of the high voltage power supply, and the other end of the fourth strong current output chip is connected to the negative electrode of the high voltage power supply; one end of the first power chip is connected to the line between the first strong current output chip and the second strong current output chip, and the other end of the first power chip is connected to the midpoint of the high voltage direct current; one end of the second power chip is connected to the line between the third strong current output chip and the fourth strong current output chip, and the other end of the second power chip is connected to the midpoint of the high voltage direct current; the motor is connected to the line between the second strong current output chip and the third strong current output chip.
[0032] Optionally, the high-power output chip may be a reverse conducting insulated gate bipolar transistor (RC-IGBT).
[0033] Optionally, the power chip may be a diode.
[0034] Exemplarily, the first panel is the A side (front side), including: Q1 is a first RC-IGBT, including an insulated gate bipolar transistor T1 and a diode D1, Q2 is a second RC-IGBT, including an insulated gate bipolar transistor T2 and a diode D2, and D5 is a first diode; the second panel includes: Q3 is a third RC-IGBT, including an insulated gate bipolar transistor T3 and a diode D3, Q4 is a fourth RC-IGBT, including an insulated gate bipolar transistor T4 and a diode D4, and D6 is a second diode; the first panel and the second panel are laminated and pressed together, the first RC-IGBT and the fourth RC-IGBT are arranged oppositely, the second RC-IGBT and the third RC-IGBT are arranged oppositely, and the first diode and the second diode are arranged oppositely; the first RC -IGBT, the second RC-IGBT, the third RC-IGBT, and the fourth RC-IGBT are connected in sequence, the other end of the first RC-IGBT is connected to the positive pole DC+ of the high-voltage power supply, and the other end of the fourth RC-IGBT is connected to the negative pole of the high-voltage power supply; one end of the first diode is connected to the line between the first RC-IGBT and the second RC-IGBT, and the other end of the first diode is connected to the midpoint of the high-voltage DC; one end of the second diode is connected to the line between the third RC-IGBT and the fourth RC-IGBT, and the other end of the second diode is connected to the midpoint of the high-voltage DC; the motor is connected to the line between the second RC-IGBT and the third RC-IGBT.
[0035] The first panel also includes: a cooling substrate 17, an insulating layer 18, a forward copper clad layer 101, a midpoint copper clad layer 102, a contact copper clad layer 103, an output end copper clad layer 104, a first power chip 11, a first high-voltage output chip 12, a second high-voltage output chip 13, a high-voltage power supply positive electrode connector 14, a high-voltage DC midpoint connector 15, a high-voltage power supply output end connector 16, a via 19, and gate control pins 4-1-1, 4-2-1, 4-3-1, and 4-4-1.
[0036] The second panel also includes: a cooling substrate 27, an insulating layer 28, a negative copper clad layer 201, a midpoint copper clad layer 202, a connection point copper clad layer 203, an output end copper clad layer 204, a second power chip 21, a third strong power output chip 23, a fourth strong power output chip 22, a high-voltage power supply negative electrode connector 24, a high-voltage DC midpoint connector 25, a high-voltage power supply output end connector 26, a via 29, and gate control pins 4-1-1, 4-2-1, 4-3-1, and 4-4-1.
[0037] In this embodiment, the loop area is reduced by laminating and pressing the first panel and the second panel to prevent the parasitic inductance from being too large.
[0038] In one embodiment, if Figure 4 As shown, the first panel includes: a first insulating layer, a first copper clad layer formed on the first insulating layer, a second insulating layer formed on the first copper clad layer, a first via hole is arranged on the second insulating layer, and the chip included in the first panel is arranged in a groove above the via hole; the first copper clad layer is connected to the chip included in the first panel through the first via hole; the first panel also includes: a third insulating layer formed on the second insulating layer, a second via hole is arranged on the third insulating layer, a second copper clad layer is formed on the third insulating layer, a fourth insulating layer is formed on the second copper clad layer, and the second copper clad layer is connected to the chip included in the first panel through the second via hole.
[0039] Optionally, the insulating layer may be a fiberglass insulation board.
[0040] Among them, glass fiber insulation board, also called glass fiber board (FR-4), glass fiber composite board, etc., is made of glass fiber material and high heat-resistant composite material, and does not contain asbestos components that are harmful to the human body. It has high mechanical and dielectric properties, good heat resistance and moisture resistance, and good processability.
[0041] Exemplarily, 18 is a PCB insulating layer, the first copper clad layer is the upper copper clad layer among 101, 102 and 103, the second copper clad layer is the lower copper clad layer among 101, 102 and 103, the upper and lower copper clad layers 101 are connected to the power chip 11 through 4 vias, the upper and lower copper clad layers 102 are connected to the first high-voltage output chip 12 through 6 vias, and the upper and lower copper clad layers 103 are connected to the second high-voltage output chip 13 through 6 vias.
[0042] By adding a high temperature resistant insulation layer to the PCB, the motor controller can have better high temperature resistance and prevent safety hazards.
[0043] In one embodiment, if Figure 4 As shown, the first copper clad layer includes: a first forward copper clad layer, a first midpoint copper clad layer, and a first connection point copper clad layer; the second copper clad layer includes: a second forward copper clad layer, a second midpoint copper clad layer, and a second connection point copper clad layer; the first forward copper clad layer is connected to the first high-power output chip through the first via, the first midpoint copper clad layer is connected to the second high-power output chip through the first via, and the first connection point copper clad layer is connected to the first power chip through the first via; the second forward copper clad layer is connected to the first high-power output chip through the second via, the second midpoint copper clad layer is connected to the second high-power output chip through the second via, and the second connection point copper clad layer is connected to the first power chip through the second via.
[0044] Exemplarily, the first copper clad layer includes: a first forward copper clad layer 102, a first midpoint copper clad layer 101, and a first connection point copper clad layer 103; the second copper clad layer includes: a second forward copper clad layer 102, a second midpoint copper clad layer 101, and a second connection point copper clad layer 103; the first forward copper clad layer 102 is connected to the first strong current output chip 12 through the first via 19, the first midpoint copper clad layer 101 is connected to the first power chip 11 through the first via 19, and the first connection point copper clad layer 13 is connected to the second strong current output chip 13 through the first via 19; the second forward copper clad layer 102 is connected to the first strong current output chip 12 through the second via 19, the second midpoint copper clad layer 101 is connected to the second strong current output chip 11 through the second via 19, and the second connection point copper clad layer 103 is connected to the second power chip 13 through the second via 19.
[0045] In this embodiment, different layers of copper clad layers are connected to multiple chips by using multiple vias, so that the chips and copper clad layers can be placed in layers, which facilitates the subsequent lamination of busbars on the first panel and the second panel.
[0046] In one embodiment, if Figure 4 As shown, the motor controller also includes: a high-voltage power supply positive electrode connector, which is located between the third insulating layer and the fourth insulating layer, the first high-voltage output chip is connected to the high-voltage power supply positive electrode connector, and the high-voltage power supply positive electrode connector is used to connect to the positive electrode of the high-voltage power supply.
[0047] Exemplarily, the motor controller also includes: a high-voltage power supply positive electrode connector 14, wherein the high-voltage power supply positive electrode connector 14 is located between the third insulating layer and the fourth insulating layer, the first high-voltage output chip 102 is connected to the high-voltage power supply positive electrode connector 14, and the high-voltage power supply positive electrode connector 14 is used to connect to the positive electrode of the high-voltage power supply.
[0048] In this embodiment, all the first high-voltage output chips are connected to the high-voltage positive electrode connector, and connected to the high-voltage positive electrode through the high-voltage positive electrode connector, thereby preventing system unreliability caused by copper busbar connection between modules.
[0049] In one embodiment, if Figure 4 As shown, the motor controller also includes: a high-voltage DC midpoint connector, which is located between the third insulation layer and the fourth insulation layer, and the other end of the first power chip is connected to the high-voltage DC midpoint connector, and the high-voltage DC midpoint connector is used to connect to the high-voltage DC midpoint.
[0050] Exemplarily, the motor controller also includes: a high-voltage DC midpoint connector 15, wherein the high-voltage DC midpoint connector 15 is located between the third insulating layer and the fourth insulating layer, and the other end of the first power chip 11 is connected to the high-voltage DC midpoint connector 15, and the high-voltage DC midpoint connector is used to connect to the high-voltage DC midpoint.
[0051] In this embodiment, all the first strong power output chips are connected to the high-voltage positive electrode connector, and connected to the high-voltage positive electrode through the high-voltage positive electrode connector, so as to prevent large stray parameters caused by copper busbar connection between modules.
[0052] In one embodiment, if Figure 3 As shown, the first panel includes a first grid control pin for transmitting control signals of the first strong power output chip and the second strong power output chip, and the second panel includes a second grid control pin for transmitting control signals of the third strong power output chip and the fourth strong power output chip.
[0053] Exemplarily, the first panel includes first gate control pins 4-1-1, 4-2-1, 4-3-1 and 4-4-1, which are used to transmit control signals of the first strong power output chip and the second strong power output chip, and the second panel includes second gate control pins 4-1-1, 4-2-1, 4-3-1 and 4-4-1, which are used to transmit control signals of the third strong power output chip and the fourth strong power output chip.
[0054] Among them, the gate control pin is an important component of the MOS tube (Metal-Oxide-Semiconductor Field-EffectTransistor), which is responsible for controlling the conduction and cutoff of the field effect tube. MOS tube, also known as metal-oxide-semiconductor field-effect transistor, is a voltage-controlled semiconductor device. Its working principle is based on the electric field effect, and it controls the current of the output circuit by controlling the electric field effect of the input circuit. The pins of the MOS tube mainly include the gate (Gate, referred to as G), the source (Source, referred to as S) and the drain (Drain, referred to as D).
[0055] In this embodiment, the control signal is transmitted through the gate control pin, so that the gate voltage can be accurately controlled to achieve accurate control of the current in the circuit, thereby meeting different circuit requirements and protecting circuit safety.
[0056] In one embodiment, the motor controller further includes: a heat sink, wherein the heat sink is located on a side of the first insulating layer away from the first copper cladding layer.
[0057] Exemplarily, the motor controller further includes: a heat sink, wherein the heat sink is located on a side of the first insulating layer away from the first copper cladding layer.
[0058] In this embodiment, a radiator is installed to help the motor controller dissipate heat, thereby preventing the motor controller from overheating and protecting the safety of the circuit.
[0059] In one embodiment, each of the first strong power output chip, the second strong power output chip, the third strong power output chip and the fourth strong power output chip includes: an insulated gate bipolar transistor and a freewheeling diode chip; the source of the insulated gate bipolar transistor is connected to the cathode of the freewheeling diode chip, and the drain of the insulated gate bipolar transistor is connected to the anode of the freewheeling diode chip; the insulated gate bipolar transistor and the freewheeling diode chip share the same area, which is the terminal area and the cell area.
[0060] The terminal region is mainly located at the edge, and its function is to protect the cell region from excessive electric field strength, thereby preventing breakdown. The cell region is the main active area and is responsible for the main flow path of the current.
[0061] Exemplarily, each of the first strong power output chip, the second strong power output chip, the third strong power output chip and the fourth strong power output chip includes: an insulated gate bipolar transistor and a freewheeling diode chip; the source of the insulated gate bipolar transistor is connected to the cathode of the freewheeling diode chip, and the drain of the insulated gate bipolar transistor is connected to the anode of the freewheeling diode chip; the insulated gate bipolar transistor and the freewheeling diode chip share the same area, which is the terminal area and the cell area.
[0062] In one of the embodiments, the motor controller includes three bridge arms.
[0063] Exemplarily, the motor controller includes three bridge arms.
[0064] In this embodiment, three bridge arms can ensure that each phase of the controller can receive continuous power supply during its working cycle, thereby ensuring that the motor can run smoothly.
[0065] In an exemplary embodiment, Figure 5 As shown, the second panel and the first panel are first processed by the above method for multiple layers, and then placed relative to each other so that the two panels are pressed together to form a three-level power module of a bridge arm. The pressed panels also include: heat sinks 17 and 27, an insulating layer 28,
[0066] In an exemplary embodiment, the motor controller includes three bridge arms, the internal structure design of the three bridge arms is the same, the three bridge arms are connected in parallel between the positive and negative poles of the high-voltage power supply, and each bridge arm is also connected to the high-voltage DC midpoint and the motor; each bridge arm includes: a first PCB board and a second PCB board, and the first PCB board and the second PCB board are arranged with a laminated busbar. The first panel includes: a first RC-IGBT, a second RC-IGBT, and a first diode; the second panel includes: a third RC-IGBT, a fourth RC-IGBT, and a second diode; the first panel and the second panel are laminated and pressed together, the first RC-IGBT and the fourth RC-IGBT are arranged opposite to each other, the second RC-IGBT and the third RC-IGBT are arranged opposite to each other, and the first diode and the second diode are arranged opposite to each other; the first RC-IGBT, the second RC-IGBT, the third RC-IGBT, and the fourth RC-IGBT are connected in sequence, the other end of the first RC-IGBT is connected to the positive electrode of the high-voltage power supply, and the other end of the fourth RC-IGBT is connected to the negative electrode of the high-voltage power supply; one end of the first diode is connected to the line between the first RC-IGBT and the second RC-IGBT, and the other end of the first diode is connected to the midpoint of the high-voltage DC; one end of the second diode is connected to the line between the third RC-IGBT and the fourth RC-IGBT, and the other end of the second diode is connected to the midpoint of the high-voltage DC; the motor is connected to the line between the second RC-IGBT and the third RC-IGBT. The first panel also includes: a first insulating layer, a first copper clad layer formed on the first insulating layer, a second insulating layer formed on the first copper clad layer, a first via hole is arranged on the second insulating layer, and the chip included in the first panel is arranged in a groove above the via hole; the first copper clad layer is connected to the chip included in the first panel through the first via hole; the first panel also includes: a third insulating layer formed on the second insulating layer, a second via hole is arranged on the third insulating layer, a second copper clad layer is formed on the third insulating layer, a fourth insulating layer is formed on the second copper clad layer, and the second copper clad layer is connected to the chip included in the first panel through the second via hole.The first copper clad layer includes: a first forward copper clad layer, a first midpoint copper clad layer, and a first connection point copper clad layer; the second copper clad layer includes: a second forward copper clad layer, a second midpoint copper clad layer, and a second connection point copper clad layer; the first forward copper clad layer is connected to the first high-voltage output chip through the first via, the first midpoint copper clad layer is connected to the second high-voltage output chip through the first via, and the first connection point copper clad layer is connected to the first power chip through the first via; the second forward copper clad layer is connected to the first high-voltage output chip through the second via, the second midpoint copper clad layer is connected to the second high-voltage output chip through the second via, and the second connection point copper clad layer is connected to the first power chip through the second via. The motor controller also includes: a high-voltage power supply positive electrode connector, the high-voltage power supply positive electrode connector is located between the third insulating layer and the fourth insulating layer, the first high-voltage output chip is connected to the high-voltage power supply positive electrode connector, and the high-voltage power supply positive electrode connector is used to connect to the positive electrode of the high-voltage power supply. The first panel also includes a first gate control pin for transmitting control signals of the first and second strong power output chips, and the second panel includes a second gate control pin for transmitting control signals of the third and fourth strong power output chips. The motor controller also includes: a high-voltage DC midpoint connector, the high-voltage DC midpoint connector is located between the third insulating layer and the fourth insulating layer, the other end of the first power chip is connected to the high-voltage DC midpoint connector, and the high-voltage DC midpoint connector is used to connect to the high-voltage DC midpoint. The motor controller also includes: three bridge arms and a heat sink, the heat sink is located on the side of the first insulating layer away from the first copper cladding layer. Each of the first, second, third and fourth strong power output chips includes: an insulated gate bipolar transistor and a freewheeling diode chip; the source of the insulated gate bipolar transistor is connected to the cathode of the freewheeling diode chip, and the drain of the insulated gate bipolar transistor is connected to the anode of the freewheeling diode chip; the insulated gate bipolar transistor and the freewheeling diode chip share the same area, and the same area is the terminal area and the cell area.
[0067] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.
[0068] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.
Claims
1. A motor controller, characterized in that: The motor controller includes a plurality of bridge arms, the internal structures of the plurality of bridge arms are designed in the same way, the plurality of bridge arms are connected in parallel between the positive and negative poles of the high voltage power supply, and each bridge arm is also connected to the midpoint of the high voltage DC and the motor; each bridge arm includes: a first panel and a second panel, and the first panel and the second panel are arranged with a laminated busbar.
2. The motor controller according to claim 1, characterized in that: The first panel includes: a first strong power output chip, a second strong power output chip, and a first power chip; the second panel includes: a third strong power output chip, a fourth strong power output chip, and a second power chip; the first panel and the second panel are laminated and pressed together, the first strong power output chip and the fourth strong power output chip are arranged opposite to each other, the second strong power output chip and the third strong power output chip are arranged opposite to each other, and the first power chip and the second power chip are arranged opposite to each other; The first strong current output chip, the second strong current output chip, the third strong current output chip, and the fourth strong current output chip are connected in sequence, the other end of the first strong current output chip is connected to the positive electrode of the high voltage power supply, and the other end of the fourth strong current output chip is connected to the negative electrode of the high voltage power supply; One end of the first power chip is connected to the line between the first high-voltage output chip and the second high-voltage output chip, and the other end of the first power chip is connected to the high-voltage direct current midpoint; One end of the second power chip is connected to the line between the third high-power output chip and the fourth high-power output chip, and the other end of the second power chip is connected to the high-voltage direct current midpoint; The motor is connected to the line between the second high-power output chip and the third high-power output chip.
3. The motor controller according to claim 2, characterized in that: The first panel comprises: a first insulating layer, a first copper-clad layer formed on the first insulating layer, and a second insulating layer formed on the first copper-clad layer, wherein the second insulating layer is provided with a first via hole, and the chip included in the first panel is provided in a groove above the via hole; the first copper-clad layer is connected to the chip included in the first panel through the first via hole; The first panel also includes: a third insulating layer formed on the second insulating layer, a second via hole is provided on the third insulating layer, a second copper clad layer is formed on the third insulating layer, a fourth insulating layer is formed on the second copper clad layer, and the second copper clad layer is connected to the chip included in the first panel through the second via hole.
4. The motor controller according to claim 3, characterized in that: The first copper-clad layer includes: a first forward copper-clad layer, a first midpoint copper-clad layer, and a first connection point copper-clad layer; the second copper-clad layer includes: a second forward copper-clad layer, a second midpoint copper-clad layer, and a second connection point copper-clad layer; The first forward copper clad layer is connected to the first high-power output chip through the first via hole, the first midpoint copper clad layer is connected to the second high-power output chip through the first via hole, and the first connection point copper clad layer is connected to the first power chip through the first via hole; The second forward copper clad layer is connected to the first high-power output chip through the second via, the second midpoint copper clad layer is connected to the second high-power output chip through the second via, and the second connection point copper clad layer is connected to the first power chip through the second via.
5. The motor controller according to claim 3, characterized in that: The motor controller also includes: a high-voltage power supply positive electrode connector, which is located between the third insulating layer and the fourth insulating layer. The first high-voltage output chip is connected to the high-voltage power supply positive electrode connector, and the high-voltage power supply positive electrode connector is used to be connected to the positive electrode of the high-voltage power supply.
6. The motor controller according to claim 3, characterized in that: The motor controller also includes: a high-voltage DC midpoint connector, which is located between the third insulation layer and the fourth insulation layer, and the other end of the first power chip is connected to the high-voltage DC midpoint connector, and the high-voltage DC midpoint connector is used to connect to the high-voltage DC midpoint.
7. The motor controller according to claim 2, characterized in that: The first panel includes a first grid control pin for transmitting control signals of the first and second high-power output chips, and the second panel includes a second grid control pin for transmitting control signals of the third and fourth high-power output chips.
8. The motor controller according to claim 3, characterized in that: The motor controller further includes a heat sink, which is located on a side of the first insulating layer away from the first copper cladding layer.
9. The motor controller according to claim 2, characterized in that: Each of the first strong power output chip, the second strong power output chip, the third strong power output chip and the fourth strong power output chip comprises: an insulated gate bipolar transistor and a freewheeling diode chip; The source of the insulated gate bipolar transistor is connected to the cathode of the freewheeling diode chip, and the drain of the insulated gate bipolar transistor is connected to the anode of the freewheeling diode chip; the insulated gate bipolar transistor and the freewheeling diode chip share the same area, which is the terminal area and the cell area.
10. The motor controller according to any one of claims 1 to 9, characterized in that: The motor controller comprises three bridge arms.