Shell, preparation method thereof and electronic equipment

A multi-metal housing structure with varying thermal conductivities addresses the challenge of heat dissipation in electronic devices, achieving efficient heat dissipation, reduced thickness, and reduced thickness, and weight, while maintaining structural stability and cost-effectiveness.

CN119183264APending Publication Date: 2024-12-24HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202310745238.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-21
Publication Date
2024-12-24

AI Technical Summary

Technical Problem

Existing electronic device housings face challenges in achieving effective heat dissipation while maintaining low manufacturing costs, thickness, and weight, as integrating high thermal conductivity parts increases production costs and device thickness and weight.

Method used

A housing structure composed of multiple metal parts with varying thermal conductivities, where a first part with lower thermal conductivity surrounds a second part with higher thermal conductivity, connected by a third part with a specific thickness and metal composition, allowing for efficient heat dissipation and reduced overall thickness and weight.

Benefits of technology

The solution provides a housing that meets heat dissipation requirements with lower costs, thinner thickness, and lighter weight, enhancing structural stability and enabling large-scale production.

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Abstract

The invention provides a shell, a preparation method thereof and electronic equipment. The housing includes a first portion, a second portion, and a third portion. The first part surrounds at least part of the third part, and the second part is connected between the first part and the third part. The first portion includes a first metal, the third portion includes a second metal, and the second portion includes the first metal and the second metal. The heat conductivity coefficient of the second metal is different from that of the first metal. And on the metallographic structure of the shell, the thickness of the second part is H1, and H1 is larger than or equal to 0.1 micron and smaller than or equal to 30 microns. The shell comprises the first metal and the second metal which are different in heat conductivity coefficient. In addition, the shell only adopts the metal with higher heat conductivity coefficient at the part with higher heat dissipation requirement, so that the manufacturing cost is reduced while the heat dissipation requirement of the electronic equipment is met. And the second part and the third part are jointly embedded in the first part, so that the overall thickness of the shell is reduced, and the overall weight of the shell is also reduced.
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