Electronic atomization equipment and control method and device thereof

Abstract

The invention relates to electronic atomization equipment and a control method and device thereof. The electronic atomization equipment comprises a processing module, a power module, a capacitor and a heating body, the heating body comprises a ceramic base body, and a plurality of straight-through micropores penetrating through the ceramic base body are formed in the ceramic base body; the processing module is used for controlling the power supply module to provide energy for the heating body through the capacitor according to a preset frequency when the heating body is heated; the duty ratio of the preset frequency ranges from 70% to 100%. The electronic atomization equipment can reduce noise in the atomization process.

Description

Technical Field

[0001] The present application relates to the field of atomization equipment, and in particular to an electronic atomization equipment and a control method and device thereof. Background Art

[0002] The prior art discloses an electronic atomization device, which is generally composed of a heating element, a battery, a control circuit and other parts. The heating element is the core component of the electronic cigarette, and its characteristics determine the atomization effect and the user experience.

[0003] Cotton core heating element core is an existing heating element, most of which are metal heating wires wrapped around cotton ropes or fiber ropes. The liquid aerosol to be atomized is absorbed by both ends of the cotton rope and then transferred to the central heating wire for heating and atomization. Due to the limited area at the end of the cotton rope, the liquid adsorption and transmission efficiency are low. In addition, the cotton rope structure has poor stability, and is prone to dry burning, carbon deposition, and burnt smell after multiple thermal cycles.

[0004] Porous ceramic heating element is another widely used heating element, which consists of two parts: porous ceramic substrate and metal heating film. The porous ceramic provides liquid conduction and storage functions, and the metal heating film realizes the heating and atomization of the liquid aerosol generation matrix. However, it is difficult to accurately control the position distribution and size accuracy of the micropores in porous ceramics prepared by high-temperature sintering.

[0005] In order to solve the above problems, researchers have tried to replace the disordered porous structure with a straight-through microporous structure. However, straight-through microporous heating elements, especially thin straight-through microporous heating elements, are prone to noise. Summary of the invention

[0006] Based on this, it is necessary to provide an electronic atomization device and a control method and device thereof that can reduce the noise of a straight-through microporous heating element in order to address the above-mentioned technical problems.

[0007] In a first aspect, the present application provides an electronic atomization device, the electronic atomization device comprising:

[0008] A processing module, a power module and a heating element, wherein the heating element comprises a ceramic substrate, and a plurality of straight micro-holes penetrating the ceramic substrate are arranged on the ceramic substrate;

[0009] The processing module is used to control the power supply module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%.

[0010] In one embodiment, the duty cycle of the preset frequency ranges from 85% to 100%.

[0011] In one embodiment, the thickness of the ceramic substrate ranges from 0.1 mm to 2 mm, and the pore size of the through micropores ranges from 1 um to 100 um.

[0012] In one embodiment, the thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm, and the pore size of the through micropores ranges from 10 um to 50 um.

[0013] In one embodiment, the ratio of the thickness of the ceramic substrate to the pore size of the through micropores ranges from 50:1 to 3:1.

[0014] In one embodiment, each of the through microhole arrays is disposed on the ceramic substrate, and the ratio of the center distance of the through microholes to the hole diameter is in a range of 3:1 to 1.5:1.

[0015] In one embodiment, the heating element includes a first sub-heating element and a second sub-heating element, and the first sub-heating element and the second sub-heating element are both provided with a plurality of straight micropores penetrating the ceramic substrate, and the straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

[0016] In a second aspect, the present application further provides a control method for an electronic atomization device, wherein the electronic atomization device has a heating element, and a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate, the method comprising:

[0017] When the heating element is heated, the power module is controlled to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency; the duty cycle range of the preset frequency is 70% to 100%.

[0018] In a third aspect, the present application further provides a control device for an electronic atomization device, wherein the electronic atomization device has a heating element, and a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate, and the device comprises:

[0019] The control module is used to control the power module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%.

[0020] The above-mentioned electronic atomization device and its control method and device, the electronic atomization device includes: a processing module, a power module and a heating element, the heating element includes a ceramic substrate, and the ceramic substrate is provided with a plurality of straight-through micropores that penetrate the ceramic substrate; the processing module is used to control the power module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%. Through the above-mentioned method, the present application controls the power module to provide energy through the capacitor in a preset frequency when the heating element is heated, so that in the process of providing energy to the heating element, the discharge characteristics of the capacitor are used to reduce the cooling time of the heating element, or the direct current method is used to eliminate the cooling time of the heating element, thereby reducing the noise caused by the vibration of the heating element during the pulse control process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a heating element in one embodiment;

[0022] Figure 2 A schematic diagram of the process of generating the bumping phenomenon in one embodiment;

[0023] Figure 3 This is a schematic diagram of the structure of an electronic atomization device in one embodiment;

[0024] Figure 4 A schematic diagram of vibration and noise comparison test results in a DC and pulse heating process in one embodiment;

[0025] Figure 5 This is a schematic diagram of voltage variation of a heating body in one embodiment;

[0026] Figure 6 is a schematic side view of a heating element in another embodiment;

[0027] Figure 7 This is a schematic diagram of a flow chart of a control method of an electronic atomization device in one embodiment;

[0028] Figure 8 Schematic diagram of the module structure of a control device for an electronic atomization device in one embodiment. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] The inventors found that straight-through microporous heating elements are easier to take in air than those with disordered porous structures, and the process of taking in air will produce a sound similar to boiling water. If low-frequency and consistent boiling continues, it will also cause vibration and noise, affecting the user experience. The straight-through microporous heating element here refers to a hole that penetrates the substrate with a basically straight center line.

[0031] like Figure 1 As shown, the heating element 130 is a thin heating element (a thin heating element refers to a heating element with a thickness of less than 3 mm), including a ceramic substrate 131, a heating film 132 and an electrode 133, wherein the ceramic substrate 131 has a relative atomization surface 1311 and a liquid absorption surface 1312, and a plurality of straight micropores 1313 are arranged on the ceramic substrate 131, and the straight micropores 1313 are through holes penetrating the ceramic substrate 131, and the straight micropores 1313 connect the liquid absorption surface 1312 and the atomization surface 1311.

[0032] The through micropores 1313 are used to guide the atomized matrix from the liquid absorption surface 1312 to the atomization surface 1311. That is, the atomized matrix in the electronic atomization device flows to the liquid absorption surface 1312 of the ceramic substrate 131 through the lower liquid channel, and is guided to the atomization surface 1311 by the capillary force of the through micropores 1313; that is, the atomized matrix flows from the liquid absorption surface 1312 to the atomization surface 1311 under the action of gravity and / or capillary force, and the atomized matrix is ​​heated and atomized on the atomization surface 1311 of the heating element 130 to generate aerosol.

[0033] However, during use, the inventor found that Figure 1 The heating element 130 shown will cause problems of high noise and vibration. The matrix is ​​as follows: the electronic atomization device uses a constant power 100HZ pulse heating method for atomization. The pulse method means that it is not a continuous power output, but an output in the form of a duty cycle, which is convenient for adjusting the duty cycle to adjust the output power. For example, when the output power is 15w, if you want to achieve a constant power output of 7.5w, adjust the duty cycle to 50%. At this time, 50% of the time, the heating element 130 is heated normally, and 50% of the time, the heating element 130 is not heated. The replenishment of the atomization matrix will cause the heating film 132 in the heating element 130 to cool down during the unheated time. This pulse control method can ensure that the problem of the heating element 130 will not be too high, but the constant power pulse control method is prone to instantaneous high power. And instantaneous high power will cause the boiling phenomenon of the atomization matrix.

[0034] In order to better understand the phenomenon of explosive boiling, the phenomenon of explosive boiling is first explained: during the heating process, pulse control will lead to instantaneous high power. At this time, the high power will cause the heating element 130 to heat up quickly and heat the atomized matrix to quickly reach the boiling point. Due to the lack of a vaporization core, there is no boiling but the temperature continues to rise to form an overheated liquid. Once this overheated liquid is triggered to boil (it can be triggered by changes in the external environment, such as shaking), it will be very violent, that is, it will form a violent boiling. The vaporization core refers to something that can trigger the boiling of the liquid, such as bubbles. If a zeolite with many tiny pores is used for heating, the air in the pores will escape due to the heat to form small bubbles. These small bubbles can serve as vaporization centers, so that the solution can boil in time after the temperature reaches the boiling point, and the solution temperature will not rise again, and no overheated liquid will be generated, and there will be no violent boiling. According to the above description, it can be seen that the smoother the surface of the heating film, the easier it is to form a violent boiling phenomenon.

[0035] At the same time, the straight micropores 1313 are easier to enter the air than the porous structure. When the temperature of the liquid is much higher than the boiling point, the saturated vapor pressure of the small bubbles in the straight micropores 1313 will be higher than the external pressure. The preset bubbles will grow and expand rapidly, pushing the straight micropores 1313 to spray to the outside, that is, the liquid spray phenomenon occurs, such as Figure 2 As described above, the air entering the through micropores 1313 forms small bubbles in the holes. During the heating process, the steam in the bubbles increases and expands, and continues to increase from left to right, so that it is ejected from the through micropores 1313, driving other atomized matrices to cause liquid spraying, which will be felt as obvious vibration and noise to the user. Electronic atomization equipment generally adopts a pulse control method, so there will be periodic liquid spraying, which will cause periodic vibration and noise, affecting the suction experience.

[0036] To solve the above problems, the following embodiments are proposed.

[0037] In one embodiment, an electronic atomization device is provided, such as Figure 3 As shown, the electronic atomization device includes:

[0038] The processing module 120, the power module 110 and the heating element 130, the heating element 130 includes a ceramic substrate 131, and the ceramic substrate 131 is provided with a plurality of straight micropores 1313 that penetrate the ceramic substrate 131, and the axis of the straight micropores 1313 is perpendicular to the ceramic substrate 131, that is, the extension direction of the straight micropores 1313 is perpendicular to the ceramic substrate 131. In this embodiment, the ceramic substrate 131 is in the form of a sheet. It can be understood that the sheet is relative to the block, and the ratio of the length to the thickness of the sheet is larger than the ratio of the length to the thickness of the block; for example, a rectangular sheet. The ceramic substrate 131 can also be in the form of a flat plate, an arc, a cylinder, etc., and is specifically designed according to needs. The other structures of the electronic atomization device are arranged in coordination with the shape of the ceramic substrate 131.

[0039] As an embodiment, the power module 110 can be connected to the processing module 120 and the capacitor 140 respectively, and the capacitor 140 is connected to the heating element 130. At this time, the processing module 120 can send a control instruction to the power module 110 to control the output power and battery frequency of the power module 110. As another embodiment, the power module 110, the processing module 120, the capacitor 140 and the heating element 130 can be connected in sequence. At this time, the processing module 120 can control the on-off between the processing module 120 and the heating element 130 by realizing its own on-off, thereby controlling the battery frequency of the power module 120. As another embodiment, the power module 110 can be connected to the processing module 120 and the heating element 130 respectively. At this time, the processing module 120 can send a control instruction to the power module 110 to control the output power of the power module 110 and provide energy to the heating element 130 in a direct current manner. As another embodiment, the power module 110, the processing module 120 and the heating element 130 may be connected in sequence, and the output power of the power module 110 may be controlled to provide energy to the heating element 130 in a direct current manner.

[0040] The battery frequency refers to the number of times the direction of the AC current output by the power module 110 changes within a unit time (1 second).

[0041] The power module 110 is used to provide energy to the processing module 120 and the heating element 130 respectively, so that the processing module 120 and the heating element 130 can work normally.

[0042] In the present application, the heating element 130 is a thin heating element, and the thickness of the ceramic substrate 131 of the heating element 130 ranges from 0.1 mm to 2 mm. The thickness of the ceramic substrate 131 is the distance between the liquid absorption surface 1312 and the atomization surface 1311. When the thickness of the ceramic substrate 131 is greater than 2 mm, it cannot meet the liquid supply demand, resulting in a decrease in the amount of aerosol, and the heat loss caused is large, and the cost of setting the ceramic substrate 131 is high; when the thickness of the ceramic substrate 131 is less than 0.1 mm, the strength of the ceramic substrate 131 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. Preferably, the thickness of the ceramic substrate 131 ranges from 0.3 mm to 0.8 mm, and the appropriate thickness can be selected according to actual needs in the specific implementation.

[0043] The pore size of the through micropores 1313 on the ceramic substrate 131 ranges from 1um to 100um. When the pore size of the through micropores 1313 is less than 1μm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol; when the pore size of the through micropores 1313 is greater than 100μm, the aerosol-generating matrix is ​​likely to flow out of the through micropores 1313, causing liquid leakage. Preferably, the pore size of the through micropores 1313 ranges from 10um to 50um, and a suitable pore size can be selected according to actual needs in specific implementation.

[0044] The ratio of the thickness of the ceramic substrate 131 to the aperture of the through micropores 1313 is in the range of 50:1 to 3:1, so as to improve the liquid supply capacity. When the ratio of the thickness of the ceramic substrate 131 to the aperture of the through micropores 1313 is greater than 50:1, the atomization matrix supplied by the capillary action of the through micropores 1313 is difficult to meet the atomization demand, which is not only easy to cause dry burning, but also the amount of aerosol generated by a single atomization decreases; when the ratio of the thickness of the ceramic substrate 131 to the aperture of the through micropores 1313 is less than 3:1, the aerosol generation matrix is ​​easy to flow out of the through micropores 1313, causing waste, resulting in a decrease in atomization efficiency, and then reducing the total aerosol amount. Preferably, each of the through micropore arrays is arranged on the ceramic substrate, and the ratio of the hole center distance of the through micropores to the aperture is in the range of 3:1 to 1.5:1, which can be selected according to actual needs in the specific implementation.

[0045] The thickness of the heating film 132 is 200nm-5μm; the material of the heating film 132 is one or more of aluminum or its alloy, copper or its alloy, silver or its alloy, nickel or its alloy, chromium or its alloy, platinum or its alloy, titanium or its alloy, zirconium or its alloy, palladium or its alloy, iron or its alloy, gold or its alloy, molybdenum or its alloy, niobium or its alloy, tantalum or its alloy. Preferably, the thickness of the heating film 132 is 200nm-10μm; the material of the heating film 132 is one or more of stainless steel, nickel-chromium-iron alloy, and nickel-based corrosion-resistant alloy. The heating film 132 allows the corresponding straight-through micropores 1313 to be exposed.

[0046] The processing module 120 is used to control the power module 110 to provide energy to the heating element 130 through the capacitor 140 in the electronic atomization device in a direct current manner or at a preset frequency when the heating element 130 is heated; the duty cycle range of the preset frequency is 70% to 100%.

[0047] When the user draws on the electronic atomization device, the processing module 120 detects the puffing action through the airflow sensor in the electronic atomization device. As an embodiment, after detecting the puffing action, the airflow sensor sends information that the electronic atomization device is being puffed to the processing module 120, or the processing module 120 obtains the signal detected by the airflow sensor, and detects whether the electronic atomization device is being puffed according to the signal detected by the airflow sensor. As another embodiment, the user can also trigger the heating start signal / puff start signal through the physical / virtual button in the electronic atomization device, so that the processing module 120 detects that the electronic atomization device is being puffed.

[0048] After detecting that the electronic atomization device is inhaled, the power module 110 is controlled to provide energy to the heating element 130 through the capacitor 140, so that the heating element 130 is heated, or the power module 110 is controlled to provide energy to the heating element 130 in a direct current manner, so that the heating element 130 is heated. It can be understood that when energy is provided in a direct current manner, the capacitor 140 may not be set in the electronic atomization device.

[0049] Since current electronic atomization devices usually use a pulsed control method, that is, heating for part of the time and not heating for part of the time within a unit cycle, the heating film 132 will cool down during the non-powered time. Therefore, the aerosol will have a pulsed smoke output (smoke / liquid spray). In order to reduce the cooling of the heating film 132 during the non-heating time and ensure that the heating film 132 is continuously at a high temperature that can be atomized, the power module 110 of the present application provides energy to the heating element 130 through the capacitor 140. The capacitor 140 can be a single capacitor or a capacitor array. By utilizing the discharge characteristics of the capacitor 140 (discharging requires time), the non-powered time is reduced, which is equivalent to increasing the duty cycle to reduce the cooling time of the heating film. Figure 4 As shown in the figure, a constant power of 7.5W was used, and part of the cartridge tube was cut off to expose the atomization chamber for testing. One test was conducted using DC and the other using 100Hz. Vibration traces were clearly seen in the pulse test results, while no obvious vibration was found in the DC test results, that is, the vibration and noise detected by the DC test were significantly improved. Therefore, by analogy, the characteristic that the capacitor 140 needs time to discharge can clearly reduce vibration and noise. Figure 5 As shown, the power module 110 provides energy to the heating element 130 in a pulsed manner, and the waveform of its voltage changing with time is a square wave. The voltage on the heating element 130 becomes a wave-shaped, so that the time for the voltage on the heating element 130 to reach 0 (i.e., non-heating time) is greatly reduced. The duty cycle range of the preset frequency of the present application is 70% to 100% to reduce the non-heating time. Preferably, the duty cycle range of the preset frequency is 85% to 100%.

[0050] The electronic atomization device includes: a processing module, a power module and a heating element, wherein the heating element includes a ceramic substrate, and the ceramic substrate is provided with a plurality of straight-through micropores penetrating the ceramic substrate; the processing module is used to control the power module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%. Through the above method, the present application controls the power module to provide energy through the capacitor in a preset frequency when the heating element is heated, so that in the process of providing energy to the heating element, the discharge characteristics of the capacitor are used to reduce the cooling time of the heating element, or the direct current method is used to eliminate the cooling time of the heating element, thereby reducing the noise caused by the vibration of the heating element during the pulse control process.

[0051] As an example, Figure 6 As shown, the heating element 130 includes a first sub-heating element 1301 and a second sub-heating element 1302, and the first sub-heating element 1301 and the second sub-heating element 1302 are both provided with a plurality of straight micropores 1313 penetrating the ceramic substrate (the straight micropores 1313 on the second sub-heating element 1302 are not shown in the figure), and the straight micropores 1313 on the first sub-heating element 1301 and the straight micropores 1313 on the second sub-heating element 1302 can be connected to facilitate the atomization matrix from the liquid absorption surface of the second sub-heating element 1302 to the atomization surface of the first sub-heating element 1301.

[0052] Based on the same inventive concept, the embodiment of the present application also provides a control method for an electronic atomization device for realizing the electronic atomization device involved above. The implementation scheme for solving the problem provided by the method is similar to the implementation scheme recorded in the above electronic atomization device, so the specific limitations in the control method embodiments of one or more electronic atomization devices provided below can refer to the limitations on electronic atomization devices above, and will not be repeated here.

[0053] In one embodiment, Figure 7 As shown, the present application provides a control method for an electronic atomization device, wherein the electronic atomization device has a heating element, and a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate. Based on the above embodiment, the method includes:

[0054] Step 710, when the heating element is heated, control the power module to provide energy to the heating element through the capacitor in the electronic atomization device at a preset frequency; the duty cycle range of the preset frequency is 70% to 100%.

[0055] The execution process of each step in this implementation can refer to the above embodiment and will not be repeated here.

[0056] The control method of the above-mentioned electronic atomization device, the present application controls the power supply module to provide energy through the capacitor at a preset frequency when the heating element is heated, so that in the process of providing energy to the heating element, the discharge characteristics of the capacitor are utilized to reduce the cooling time of the heating element, or the cooling time of the heating element is eliminated by direct current, thereby reducing the noise generated by the vibration of the heating element during the pulse control process.

[0057] As an embodiment, the duty cycle of the preset frequency ranges from 85% to 100%.

[0058] As an embodiment, the thickness of the ceramic substrate ranges from 0.1 mm to 2 mm, and the pore size of the through micropores ranges from 1 um to 100 um.

[0059] As an embodiment, the thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm, and the pore size of the through micropores ranges from 10 um to 50 um.

[0060] As an embodiment, the ratio of the thickness of the ceramic substrate to the pore size of the through micropores ranges from 50:1 to 3:1.

[0061] As an embodiment, each of the through microhole arrays is arranged on the ceramic substrate, and the ratio of the hole center distance of the through microholes to the hole diameter ranges from 3:1 to 1.5:1.

[0062] As an embodiment, the heating element includes a first sub-heating element and a second sub-heating element, and the first sub-heating element and the second sub-heating element are both provided with a plurality of straight micropores penetrating the ceramic substrate, and the straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

[0063] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0064] Based on the same inventive concept, the embodiment of the present application also provides a control device for an electronic atomization device for implementing the control method of the electronic atomization device involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the control method of the electronic atomization device above, so the specific limitations in the control device embodiments of one or more electronic atomization devices provided below can refer to the limitations of the control method of the electronic atomization device above, and will not be repeated here.

[0065] In one embodiment, Figure 8 As shown, a control device for an electronic atomization device is provided, wherein the electronic atomization device has a heating element, and a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate, including:

[0066] The control module 810 controls the power module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%.

[0067] As an embodiment, the duty cycle of the preset frequency ranges from 85% to 100%.

[0068] As an embodiment, the thickness of the ceramic substrate ranges from 0.1 mm to 2 mm, and the pore size of the through micropores ranges from 1 um to 100 um.

[0069] As an embodiment, the thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm, and the pore size of the through micropores ranges from 10 um to 50 um.

[0070] As an embodiment, the ratio of the thickness of the ceramic substrate to the pore size of the through micropores ranges from 50:1 to 3:1.

[0071] As an embodiment, each of the through microhole arrays is arranged on the ceramic substrate, and the ratio of the hole center distance of the through microholes to the hole diameter ranges from 3:1 to 1.5:1.

[0072] As an embodiment, the heating element includes a first sub-heating element and a second sub-heating element, and the first sub-heating element and the second sub-heating element are both provided with a plurality of straight micropores penetrating the ceramic substrate, and the straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

[0073] Each module in the control device of the above-mentioned electronic atomization device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of the processing module in the computer device in the form of hardware (that is, the control module 810 is equivalent to the processing module 120), or can be stored in the memory of the computer device in the form of software, so that the processing module can call and execute the operations corresponding to each of the above modules.

[0074] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of the control method of the electronic atomization device described in any of the above embodiments are implemented.

[0075] The execution process of each step in this implementation can refer to the above embodiment and will not be repeated here.

[0076] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processing modules involved in each embodiment provided in this application may be general processing modules, central processing modules, graphics processing modules, digital signal processing modules, programmable logic devices, data processing logic devices based on quantum computing, etc., but are not limited to this.

[0077] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. An electronic atomization device, characterized in that: The electronic atomization device comprises: A processing module, a power module and a heating element, wherein the heating element comprises a ceramic substrate, and a plurality of straight micro-holes penetrating the ceramic substrate are arranged on the ceramic substrate; The processing module is used to control the power supply module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%.

2. The electronic atomization device according to claim 1, characterized in that: The duty cycle of the preset frequency ranges from 85% to 100%.

3. The electronic atomization device according to claim 1, characterized in that: The thickness of the ceramic substrate ranges from 0.1 mm to 2 mm, and the pore size of the through micropores ranges from 1 um to 100 um.

4. The electronic atomization device according to claim 3, characterized in that: The thickness of the ceramic substrate ranges from 0.3 mm to 0.8 mm, and the pore size of the through micropores ranges from 10 um to 50 um.

5. The electronic atomization device according to claim 1, characterized in that: The ratio of the thickness of the ceramic substrate to the pore size of the through micropores ranges from 50:1 to 3:

1.

6. The electronic atomization device according to claim 1, characterized in that: Each of the through micropore arrays is arranged on the ceramic substrate, and the ratio of the hole center distance of the through micropores to the hole diameter ranges from 3:1 to 1.5:

1.

7. The electronic atomization device according to claim 1, characterized in that: The heating element includes a first sub-heating element and a second sub-heating element. The first sub-heating element and the second sub-heating element are both provided with a plurality of straight micropores penetrating the ceramic substrate. The straight micropores on the first sub-heating element and the straight micropores on the second sub-heating element can be conductive.

8. A control method for an electronic atomization device, characterized in that: The electronic atomization device has a heating element, and a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate. The method comprises: When the heating element is heated, the power module is controlled to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency; the duty cycle range of the preset frequency is 70% to 100%.

9. The method according to claim 1, characterized in that: The duty cycle of the preset frequency ranges from 85% to 100%.

10. A control device for an electronic atomization device, characterized in that: The electronic atomization device has a heating element, and a ceramic substrate of the heating element is provided with a plurality of straight micropores penetrating the ceramic substrate. The device comprises: The control module is used to control the power module to provide energy to the heating element through the capacitor in the electronic atomization device in a direct current manner or at a preset frequency when the heating element is heated; the duty cycle range of the preset frequency is 70% to 100%.

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