Evaporation organic foreign matter removal equipment and method

Abstract

The invention discloses evaporation organic foreign matter removing equipment and method. A motion unit of the equipment drives an execution unit to move according to preset track parameters; the visual unit captures image information of a preset position in the evaporator, and the control unit compares the image information of the preset position in the evaporator at different moments to judge a foreign matter generation point location; the execution unit is used for melting, gasifying and removing the organic foreign matters at the foreign matter point positions in the evaporator according to the laser temperature generated by the pulse laser transmitter; the execution unit is further provided with an infrared laser auxiliary unit, the infrared laser auxiliary unit is fixedly connected with the execution unit, and the infrared laser auxiliary unit is used for emitting infrared auxiliary light to position laser light generated by the pulse laser emitter. According to the invention, personnel can be rapidly assisted in judging foreign matter generation points, time is saved for users, and accuracy is improved; and evaporation organic matters can be directly removed from the outside, so that the recovery time is shortened, and the benefit is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of vapor deposition machines, and in particular relates to a device and method for removing vapor-deposited organic foreign matter. Background Art

[0002] An evaporation machine is a device that uses heating to evaporate organic materials in a vacuum environment, causing the atoms or molecules in the organic materials to vaporize and escape from the surface to form a vapor flow, which then condenses into a solid film on the surface of the substrate or base.

[0003] However, during the operation of the vapor deposition machine, a small amount of organic matter sprayed from the evaporation source nozzle will adhere to the nozzle surface after condensation. Long-term accumulation will cause the organic matter to block the evaporation source nozzle, affecting the effect of the evaporation process. If the adhered organic matter is not discovered in time, it will accumulate for a long time, which is time-consuming and laborious to clean up, and will also affect the process capacity. Manual inspection is difficult to detect abnormal points in large-area products. The vapor deposition machine has a complex structure and limited space, and it is impossible to use existing tools to quickly and thoroughly remove foreign matter. It is necessary to develop a technical solution for removing organic foreign matter from vapor deposition. Summary of the invention

[0004] To this end, the present invention provides an evaporation organic foreign matter removal device and method to solve the problem that the evaporation process is poor due to the clogging of the nozzle by organic matter adhesion, which affects the process capacity and is difficult to detect manually.

[0005] In order to achieve the above-mentioned object, the present invention provides the following technical solutions: an evaporation organic foreign matter removal device, comprising a control unit, a motion unit, a visual unit and an execution unit;

[0006] A connection is established between the motion unit and the control unit, the motion unit is provided with a collaborative robot, and the motion unit is used to drive the execution unit to move according to preset trajectory parameters;

[0007] A connection is established between the visual unit and the control unit, the visual unit is used to capture image information of a preset position inside the evaporation machine, and the control unit compares the image information of the preset position inside the evaporation machine at different times to determine the point where the foreign matter is generated;

[0008] A connection is established between the execution unit and the control unit, the execution unit is connected to the motion unit, the execution unit includes a pulse laser transmitter, and the execution unit melts and gasifies the organic foreign matter at the foreign matter point inside the evaporation machine through the laser temperature generated by the pulse laser transmitter;

[0009] The execution unit is also configured with an infrared laser auxiliary unit, which is fixedly connected to the execution unit and is used to emit infrared auxiliary light to position the laser light generated by the pulse laser transmitter.

[0010] As a preferred solution for the evaporation organic foreign matter removal device, the control unit is provided with a PLC controller, a 485 communication module, a CC-Link communication module and an Ethernet communication module;

[0011] The PLC controller establishes a connection with the motion unit through the 485 communication module, performs control programming on the motion unit according to the RS485 serial communication protocol, and sets the control port and the point storage address;

[0012] The execution unit is further provided with an IO controller, the PLC controller is connected to the IO controller via the CC-Link communication module, and the IO controller is connected to the pulse laser transmitter;

[0013] The visual unit is provided with a HUB hub and an industrial camera, the PLC controller is connected to the HUB hub via the Ethernet communication module, and the HUB hub is connected to the industrial camera.

[0014] As a preferred solution of the evaporation organic foreign matter removal device, the pulse laser emitter adopts an infrared laser, and the infrared laser auxiliary unit is provided with an infrared optical axis locator;

[0015] The infrared auxiliary light emitted by the infrared laser auxiliary unit coincides with the laser optical path of the pulse laser emitter.

[0016] As a preferred solution for the evaporation organic foreign matter removal equipment, it also includes an equipment health monitoring unit. The equipment health monitoring unit sets monitoring parameters based on the point data of the abnormality of the evaporation machine, the size of foreign matter generated at each workstation, and the time period with high incidence of foreign matter. When the monitoring parameters reach the warning value, a health prompt of the evaporation machine is issued.

[0017] As a preferred solution for the evaporation organic foreign matter removal equipment, it also includes a handheld control monitoring unit, which is connected to the control unit. The handheld control monitoring unit is used to obtain real-time image information inside the evaporation machine captured by the visual unit so that operators can view the laser detection position.

[0018] The present invention also provides a method for removing organic foreign matter by evaporation, which uses the above-mentioned device for removing organic foreign matter by evaporation, and comprises the following steps:

[0019] Open the window shielding plate of the vapor deposition machine, and move the execution unit to a specified position through the motion unit so that the execution unit is close to the window of the vapor deposition machine;

[0020] Turn on the industrial camera light source of the visual unit to capture the image information of the preset position inside the evaporation machine, and compare the image information of the preset position inside the evaporation machine at different times to determine the location where the foreign matter is generated;

[0021] According to the point where the foreign matter is generated in the vapor deposition machine, the trajectory parameters of the motion unit are configured, the infrared laser auxiliary unit is started, and the motion unit is controlled to drive the infrared laser auxiliary unit to move according to the configured trajectory parameters, so that the infrared auxiliary light generated by the infrared laser auxiliary unit is irradiated on the point where the foreign matter is generated;

[0022] Turn off the infrared auxiliary light generated by the infrared laser auxiliary unit, turn on the pulse laser emitter of the execution unit, and irradiate the infrared light generated by the pulse laser emitter on the point where the foreign matter is generated. Use the temperature of the infrared light generated by the pulse laser emitter to melt, vaporize and remove the organic foreign matter at the foreign matter point inside the evaporator.

[0023] As a preferred solution for the method of removing organic foreign matter during vapor deposition, the image information at different times at preset positions inside the vapor deposition machine is compared to determine the location where the foreign matter is generated. The captured image information at preset positions inside the vapor deposition machine is numbered and named according to the work station, and used as standard sample file data to perform point matching and writing in combination with the trajectory parameters of the motion unit.

[0024] As a preferred solution for the method of removing organic foreign matter by evaporation, the temperature of the infrared light generated by the pulse laser emitter is used to melt and vaporize the organic foreign matter at the foreign matter point inside the evaporator to remove it. The motion unit is controlled to move along a circular trajectory of a preset radius, so as to drive the infrared light generated by the pulse laser emitter to move along a circular trajectory of a preset radius at the foreign matter generation point.

[0025] As a preferred solution for the method of removing organic foreign matter by evaporation, the temperature of the infrared light generated by the pulse laser emitter is used to melt and vaporize the organic foreign matter at the foreign matter point inside the evaporator to remove it. The motion unit is controlled to move along a trajectory of a preset direction and a specified distance, so as to drive the infrared light generated by the pulse laser emitter to move along a trajectory of a preset direction and a specified distance at the foreign matter generation point.

[0026] As a preferred solution for the method of removing organic foreign matter during evaporation, the temperature of the infrared light generated by the pulsed laser emitter is used to melt and vaporize the organic foreign matter at the foreign matter points inside the evaporator to remove it. According to the set foreign matter removal time, the motion unit is controlled to move along a circular trajectory with a preset radius, or the motion unit is controlled to move along a trajectory with a preset direction and a specified distance.

[0027] The present invention has the following advantages: a control unit, a motion unit, a visual unit and an execution unit are provided; a connection is established between the motion unit and the control unit, the motion unit is provided with a collaborative robot, and the motion unit is used to drive the execution unit to move according to preset trajectory parameters; a connection is established between the visual unit and the control unit, the visual unit is used to capture image information of a preset position inside the vapor deposition machine, and the control unit compares the image information of the preset position inside the vapor deposition machine at different times to determine the point where the foreign matter is generated; a connection is established between the execution unit and the control unit, the execution unit is connected to the motion unit, the execution unit includes a pulse laser transmitter, and the execution unit melts and vaporizes and removes organic foreign matter at the foreign matter point inside the vapor deposition machine through the laser temperature generated by the pulse laser transmitter; the execution unit is also configured with an infrared laser auxiliary unit, the infrared laser auxiliary unit is fixedly connected to the execution unit, and the infrared laser auxiliary unit is used to emit infrared auxiliary light to locate the laser light generated by the pulse laser transmitter. The present invention can quickly assist personnel in determining the point where foreign matter is generated, and correspond to the point, match the point data, and quickly reach the foreign matter point, saving time for users and improving accuracy; there is no need to break the vacuum and cool down the equipment, and there is no need to open the equipment chamber, and the evaporated organic matter can be removed directly from the outside, which reduces the recovery time and improves efficiency; it can achieve efficient and accurate processing of foreign matter blocking the holes, and ensure the stable operation and scientific and reasonable use of the evaporation equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0029] Figure 1 A schematic diagram of the structure of an evaporation organic foreign matter removal device provided in an embodiment of the present invention;

[0030] Figure 2 The figure is a schematic flow chart of a method for removing organic foreign matter from vapor deposition provided in an embodiment of the present invention.

[0031] In the figure, 1. control unit; 2. motion unit; 3. vision unit; 4. execution unit; 5. collaborative robot; 6. pulse laser transmitter; 7. infrared laser auxiliary unit; 8. PLC controller; 9. 485 communication module; 10. CC-Link communication module; 11. Ethernet communication module; 12. IO controller; 13. HUB hub; 14. industrial camera; 15. infrared optical axis locator; 16. equipment health monitoring unit; 17. handheld control monitoring unit. DETAILED DESCRIPTION

[0032] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1

[0034] See also Figure 1 , an embodiment of the present invention provides an evaporation organic foreign matter removal device, including a control unit 1, a motion unit 2, a visual unit 3 and an execution unit 4;

[0035] Wherein, a connection is established between the motion unit 2 and the control unit 1, the motion unit 2 is provided with a collaborative robot 5, and the motion unit 2 is used to drive the execution unit 4 to move according to the preset trajectory parameters;

[0036] Among them, a connection is established between the visual unit 3 and the control unit 1, the visual unit 3 is used to capture the image information of the preset position inside the evaporation machine, and the control unit 1 compares the image information of the preset position inside the evaporation machine at different times to determine the point where the foreign matter is generated;

[0037] Wherein, a connection is established between the execution unit 4 and the control unit 1, the execution unit 4 is connected to the motion unit 2, the execution unit 4 includes a pulse laser emitter 6, and the execution unit 4 melts and vaporizes the organic foreign matter at the foreign matter point inside the evaporation machine through the laser temperature generated by the pulse laser emitter 6;

[0038] The execution unit 4 is further configured with an infrared laser auxiliary unit 7 , which is fixedly connected to the execution unit 4 , and is used to emit infrared auxiliary light to position the laser light generated by the pulse laser emitter 6 .

[0039] In this embodiment, the control unit 1 is provided with a PLC controller 8, a 485 communication module 9, a CC-Link communication module 10 and an Ethernet communication module 11; the PLC controller 8 establishes a connection with the motion unit 2 through the 485 communication module 9, controls and programs the motion unit 2 according to the RS485 serial communication protocol, and sets the control port and the point storage address; the execution unit 4 is also provided with an IO controller 12, the PLC controller 8 establishes a connection with the IO controller 12 through the CC-Link communication module 10, and the IO controller 12 establishes a connection with the pulse laser transmitter 6; the visual unit 3 is provided with a HUB hub 13 and an industrial camera 14, the PLC controller 8 establishes a connection with the HUB hub 13 through the Ethernet communication module 11, and the HUB hub 13 establishes a connection with the industrial camera 14.

[0040] Specifically, the control unit 1, as the core of the evaporation organic foreign matter removal equipment, is equipped with a communication module adapted to the motion unit 2, the visual unit 3, and the execution unit 4 to ensure precise control and coordinated operation of the entire equipment. Among them, for the motion unit 2, control programming is carried out according to the RS485 serial communication protocol, and the control port and point storage address are set. The execution unit 4 uses the PIO bus as a communication bridge, and adjusts and switches the status of each point through the logical rules in the PLC program, thereby realizing the setting and control of the execution unit 4. For example: when a high level is input to the pin D22 of the PIO bus, the execution unit 4 turns on the red light; when a low level is input, the execution unit 4 turns off the red light.

[0041] In this embodiment, the motion unit 2 adopts a high-precision collaborative robot 5 with a repeatability accuracy of ±0.02mm and 6 degrees of freedom of motion to meet multi-angle control. At the actual work station, after multiple measurements, the spacing between the nozzles of the evaporator is 2cm and the glass refractive index of the evaporator equipment is drawn and calculated through the actual refraction path of the optical path.

[0042] Specifically, the calculation formula of the glass refractive index is: n = sinθ1 / sinθ2, where θ1 is the incident angle, θ2 is the refraction angle, and n is the refractive index. Since the incident angle and the refraction angle are proportional, the larger the incident angle, the larger the refraction angle, and the maximum spacing between the workstations is 1500mm.

[0043] According to the actual measurement value, the glass refractive index of the vapor deposition machine equipment is 1.5. After multiple measurements by adjusting the laser wavelength of the pulse laser emitter 6, the on-site environment, and the proximity to the vapor deposition machine window, the parameter λ is introduced. By adjusting the laser parameters, the refraction angle is adjusted within a certain range to meet a larger working range. From the actual effect observation, the farther the pulse laser emitter 6 is from the window, the smaller the working angle. When the maximum window distance is 5 cm, the pulse laser emitter 6 no longer meets all detection points.

[0044] Therefore, according to different laser distance points (abbreviated as optical distance), data can be measured and stored respectively. Among them, 0cm optical distance is used for point entry, and the corresponding program recipe of each nozzle point production motion unit 2 is stored. When the standard optical distance is used for clearing operation, the point can be directly called to quickly and accurately reach the clearing point, saving time and eliminating errors.

[0045] In this embodiment, the pulse laser emitter 6 adopts an infrared laser, and the infrared laser auxiliary unit 7 is provided with an infrared optical axis locator 15 ; the infrared auxiliary light emitted by the infrared laser auxiliary unit 7 coincides with the laser optical path of the pulse laser emitter 6 .

[0046] Specifically, the pulse laser emitter 6 uses an infrared laser, which can emit pulses with a wavelength of 1064nm and a maximum optical power of 200W. It has high-energy and high-precision laser emission capabilities, and the power is adjustable. The laser spot diameter is 5mm, and it has a large working range. It can melt and vaporize organic foreign matter through laser temperature, restore the nozzle cleanliness, and effectively remove organic foreign matter while ensuring safety.

[0047] Among them, in order to facilitate the operator to determine the clearing point, an infrared optical axis locator 15 is added to the pulse laser transmitter 6 to generate coaxial infrared light. The infrared auxiliary light coincides with the laser optical path. Infrared light is used for positioning before use. The infrared auxiliary optical path adjuster has an accuracy of up to 0.01mm, and the azimuth can be adjusted up, down, left and right to meet all usage points. At the same time, the infrared control is connected to the control unit 1 through the I signal. The point and moving direction are confirmed by turning on the infrared. After reaching the working position, the infrared is turned off and the pulse laser transmitter 6 is turned on to further ensure the accuracy of laser positioning.

[0048] In this embodiment, a handheld control monitoring unit 17 is also included. A connection is established between the handheld control monitoring unit 17 and the control unit 1. The handheld control monitoring unit 17 is used to obtain real-time image information inside the vapor deposition machine captured by the visual unit 3 so that operators can view the laser detection position.

[0049] Specifically, the visual unit 3 uses a 1080P high-definition camera with high resolution and image acquisition and processing capabilities, and is equipped with a handheld control monitoring unit 17, which assembles the monitoring display screen and the handheld operation screen together. The visual unit 3 is designed with two functions:

[0050] Function 1: By capturing the situation inside the vapor deposition machine with a camera and transmitting it to the handheld control monitoring unit 17 in real time, the user can clearly and intuitively understand the laser detection position and control the positioning accuracy;

[0051] Function 2: Use the camera to take pictures of the clean and perfect interior of the evaporation machine at a fixed angle and upload them to the system. Number and name the workstations in the upper computer, use image processing as standard sample file data, and combine the motion program recipe parameters collected and produced by motion unit 2 to perform point matching and writing. When the evaporation machine needs to be cleaned, move the points under the same motion program recipe parameters to ensure that the camera is at the same point when the sample is taken. Take pictures again, automatically identify the points where foreign matter is generated through image comparison, and automatically import the point data for movement to complete the removal of organic foreign matter.

[0052] In addition to automatically analyzing the locations where organic foreign matter is generated and performing laser mobile removal, photos can also be used as references to manually determine the removal conditions and perform equipment cleaning actions.

[0053] In a possible embodiment, due to the different working time of the evaporation machine nozzle, the different accumulation of organic foreign matter, and the different sizes of foreign matter, the station nozzle size of the evaporation machine is about 15mm, and the size of foreign matter varies from 2mm to 14mm. Therefore, after reaching the reference point, it is necessary to consider the required clearance distance for different foreign matter sizes, and a total of three methods are set:

[0054] Method 1: Set a fixed clearing distance of a circle with a diameter of 20 mm, set parameters in advance, train the motion logic of the collaborative robot 5 of the motion unit 2, and after reaching the preset point, the manipulator of the collaborative robot 5 performs circular motion to remove foreign objects;

[0055] Method 2: Set the moving direction and distance of the collaborative robot 5 of the motion unit 2. After reaching the clearing position, select the moving direction and distance of the manipulator of the collaborative robot 5 of the motion unit 2, and ensure the clearing effect according to the image feedback from the camera of the visual unit 3;

[0056] Method 3: According to the characteristics of the evaporation machine, if there are a lot of foreign matter accumulated at certain points, you can manually select the clearing point in the corresponding program recipe parameter of motion unit 2, set the clearing time, and automatically perform trajectory movement to complete the foreign matter removal.

[0057] In a possible embodiment, it also includes an equipment health monitoring unit 16. The equipment health monitoring unit 16 sets monitoring parameters according to the abnormal point data of the vapor deposition machine, the size of foreign matter generated at each workstation, and the time period with high incidence of foreign matter. When the monitoring parameters reach the warning value, a health prompt of the vapor deposition machine is issued.

[0058] Specifically, in order to make the entire equipment grow and predictable, a large amount of basic data can be collected through long-term use, such as data on points where abnormalities often occur, the size of foreign matter generated at each workstation, and time periods when foreign matter is most likely to occur. Through series of data, parameter monitoring is set, and prompts are given when the warning threshold is reached, so that users can confirm and prepare in advance. At the same time, for workstations with high incidence and serious foreign matter problems, data trends are recorded to facilitate users to check the work status at any time and plan equipment maintenance time.

[0059] Example 2

[0060] See also Figure 2 The embodiment of the present invention further provides a method for removing organic foreign matter by evaporation, which uses the above-mentioned device for removing organic foreign matter by evaporation, and includes the following steps:

[0061] S0. Push the evaporation organic foreign matter removal equipment to the working position, install the auxiliary support frame and the safety protection cover, and turn on the power supply;

[0062] S1, open the window shielding plate of the vapor deposition machine, and move the execution unit 4 to a specified position through the motion unit 2, so that the execution unit 4 is close to the window of the vapor deposition machine;

[0063] S2, turning on the industrial camera light source of the visual unit 3, capturing image information of a preset position inside the evaporation machine, and comparing the image information of the preset position inside the evaporation machine at different times to determine the location where the foreign matter is generated;

[0064] S3, configuring the trajectory parameters of the motion unit 2 according to the point where the foreign matter is generated inside the vapor deposition machine, starting the infrared laser auxiliary unit 7, and controlling the motion unit 2 to drive the infrared laser auxiliary unit 7 to move according to the configured trajectory parameters, so that the infrared auxiliary light generated by the infrared laser auxiliary unit 7 is irradiated on the point where the foreign matter is generated;

[0065] S4, turn off the infrared auxiliary light generated by the infrared laser auxiliary unit 7, turn on the pulse laser emitter 6 of the execution unit 4, the pulse laser emitter 6 emits infrared light to irradiate the point where the foreign matter is generated, and use the temperature of the infrared light generated by the pulse laser emitter 6 to melt, vaporize and remove the organic foreign matter at the foreign matter point inside the evaporator.

[0066] In a possible embodiment, step S5 is also included. After the foreign matter inside the vapor deposition machine is removed, the pulse laser emitter 6 is turned off, the industrial camera light source and the industrial camera of the visual unit 3 are turned off; the motion unit 2 is away from the window; the manager manually closes the vapor deposition machine window baffle; the auxiliary support frame and the safety protection cover are removed, the motion unit 2 is controlled to be stored in the cabinet, and the power is cut off.

[0067] In a possible embodiment, the image information at different times of the preset position inside the vapor deposition machine is compared to determine the point where the foreign matter is generated. The captured image information of the preset position inside the vapor deposition machine is numbered and named according to the work station, and used as standard sample file data, combined with the trajectory parameters of the motion unit 2 for point matching and writing.

[0068] Specifically, a camera is used to take a picture of the clean and perfect interior of the vapor deposition machine at a fixed angle and upload it to the system, the workstations are numbered and named in the upper computer, and the image processing is used as standard sample file data, combined with the motion program Recipe parameters collected and produced by the motion unit 2, to perform point matching and writing. When the vapor deposition machine equipment needs to be cleaned, the point is moved under the same motion program Recipe parameters to ensure that the camera is at the same point when the sample is taken. The picture is taken again, and the point where the foreign matter is generated is automatically identified through image comparison, and the point data is automatically imported for movement to complete the removal of organic foreign matter.

[0069] In a possible embodiment, the infrared light temperature generated by the pulse laser emitter 6 is used to melt and vaporize organic foreign matter at the foreign matter points inside the evaporator to remove the organic foreign matter. The motion unit 2 is controlled to move along a circular trajectory of a preset radius to drive the infrared light generated by the pulse laser emitter 6 to move along a circular trajectory of a preset radius at the foreign matter generation point.

[0070] In a possible embodiment, the infrared light temperature generated by the pulse laser emitter 6 is used to melt and vaporize organic foreign matter at the foreign matter point inside the evaporator to remove it, and the motion unit 2 is controlled to move along a trajectory of a preset direction and a specified distance, so as to drive the infrared light generated by the pulse laser emitter 6 to move along a trajectory of a preset direction and a specified distance at the foreign matter generation point.

[0071] In a possible embodiment, the infrared light temperature generated by the pulse laser emitter 6 is used to melt and vaporize organic foreign matter at foreign matter points inside the evaporator to remove the foreign matter. According to the set foreign matter removal time, the motion unit 2 is controlled to move along a circular trajectory of a preset radius, or the motion unit 2 is controlled to move along a trajectory of a preset direction and a specified distance.

[0072] In summary, the present invention is provided with a control unit 1, a motion unit 2, a visual unit 3 and an execution unit 4; a connection is established between the motion unit 2 and the control unit 1, and the motion unit 2 is provided with a collaborative robot 5, and the motion unit 2 is used to drive the execution unit 4 to move according to preset trajectory parameters; a connection is established between the visual unit 3 and the control unit 1, and the visual unit 3 is used to capture image information of a preset position inside the vapor deposition machine, and the control unit 1 compares the image information of the preset position inside the vapor deposition machine at different times to determine the point where the foreign matter is generated; a connection is established between the execution unit 4 and the control unit 1, and the execution unit 4 is connected to the motion unit 2, and the execution unit 4 includes a pulse laser emitter 6, and the execution unit 4 melts and vaporizes the organic foreign matter at the foreign matter point inside the vapor deposition machine through the laser temperature generated by the pulse laser emitter 6; the execution unit 4 is also configured with an infrared laser auxiliary unit 7, and the infrared laser auxiliary unit 7 is fixedly connected to the execution unit 4, and the infrared laser auxiliary unit 7 is used to emit infrared auxiliary light to locate the laser light generated by the pulse laser emitter 6. During use, the evaporation organic foreign matter removal equipment is pushed to the working position, the auxiliary support frame and the safety protection cover are installed, and the power is turned on; the evaporation machine window shield is opened, and the execution unit 4 is moved to the specified position through the motion unit 2, so that the execution unit 4 is close to the evaporation machine window; the industrial camera light source of the visual unit 3 is turned on to capture the image information of the preset position inside the evaporation machine, and the image information of the preset position inside the evaporation machine at different times is compared to determine the point where the foreign matter is generated; the trajectory parameters of the motion unit 2 are configured according to the point where the foreign matter is generated inside the evaporation machine, and the infrared Line laser auxiliary unit 7, according to the configured trajectory parameters, controls the motion unit 2 to drive the infrared laser auxiliary unit 7 to move, so that the infrared auxiliary light generated by the infrared laser auxiliary unit 7 is irradiated on the point where the foreign matter is generated; turns off the infrared auxiliary light generated by the infrared laser auxiliary unit 7, turns on the pulse laser emitter 6 of the execution unit 4, and the pulse laser emitter 6 emits infrared light to irradiate the point where the foreign matter is generated, and uses the infrared light temperature generated by the pulse laser emitter 6 to melt and gasify the organic foreign matter at the foreign matter point inside the vapor deposition machine. The present invention can quickly assist personnel in determining the point where the foreign matter is generated, and the corresponding point, matching point data, and quickly reaching the foreign matter point, saving time for users and improving accuracy; there is no need to break the vacuum and cool down the equipment, and there is no need to open the equipment chamber, and the vaporized organic matter can be removed directly from the outside, reducing the time for re-machine and improving efficiency; it can achieve efficient and accurate treatment of foreign matter blocking the hole, and ensure the stable operation and scientific and reasonable use of the vapor deposition machine equipment.

[0073] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A vapor deposition organic foreign matter removal device, characterized in that: It comprises a control unit (1), a motion unit (2), a visual unit (3) and an execution unit (4); The motion unit (2) is connected to the control unit (1), the motion unit (2) is provided with a collaborative robot (5), and the motion unit (2) is used to drive the execution unit (4) to move according to preset trajectory parameters; A connection is established between the visual unit (3) and the control unit (1), the visual unit (3) is used to capture image information of a preset position inside the vapor deposition machine, and the control unit (1) compares the image information of the preset position inside the vapor deposition machine at different times to determine the point where the foreign matter is generated; A connection is established between the execution unit (4) and the control unit (1); the execution unit (4) is connected to the motion unit (2); the execution unit (4) comprises a pulse laser emitter (6); the execution unit (4) melts and vaporizes organic foreign matter at foreign matter points inside the vapor deposition machine through the laser temperature generated by the pulse laser emitter (6); The execution unit (4) is further provided with an infrared laser auxiliary unit (7), the infrared laser auxiliary unit (7) being fixedly connected to the execution unit (4), and the infrared laser auxiliary unit (7) being used for emitting infrared auxiliary light to position the laser light generated by the pulse laser emitter (6).

2. The device for removing organic foreign matter by evaporation according to claim 1, characterized in that: The control unit (1) is provided with a PLC controller (8), a 485 communication module (9), a CC-Link communication module (10) and an Ethernet communication module (11); The PLC controller (8) establishes a connection with the motion unit (2) via the 485 communication module (9), performs control programming on the motion unit (2) according to the RS485 serial communication protocol, and sets a control port and a point storage address; The execution unit (4) is further provided with an IO controller (12), the PLC controller (8) is connected to the IO controller (12) via the CC-Link communication module (10), and the IO controller (12) is connected to the pulse laser transmitter (6); The visual unit (3) is provided with a HUB hub (13) and an industrial camera (14); the PLC controller (8) is connected to the HUB hub (13) via the Ethernet communication module (11); and the HUB hub (13) is connected to the industrial camera (14).

3. The device for removing organic foreign matter by evaporation according to claim 2, characterized in that: The pulse laser transmitter (6) adopts an infrared laser, and the infrared laser auxiliary unit (7) is provided with an infrared optical axis positioner (15); The infrared auxiliary light emitted by the infrared laser auxiliary unit (7) coincides with the laser light path of the pulse laser emitter (6).

4. The device for removing organic foreign matter by evaporation according to claim 1, characterized in that: It also includes an equipment health monitoring unit (16), which sets monitoring parameters based on the abnormal point data of the vapor deposition machine, the size of foreign matter generated at each workstation, and the time period when foreign matter is most likely to occur. When the monitoring parameters reach a warning value, a health prompt for the vapor deposition machine is issued.

5. The device for removing organic foreign matter by evaporation according to claim 1, characterized in that: It also includes a handheld control monitoring unit (17), wherein a connection is established between the handheld control monitoring unit (17) and the control unit (1), and the handheld control monitoring unit (17) is used to obtain real-time image information inside the vapor deposition machine captured by the visual unit (3) so that an operator can view the laser detection position.

6. A method for removing organic foreign matter by evaporation, using the device for removing organic foreign matter by evaporation according to any one of claims 1 to 5, characterized in that: The following steps are involved: Open the window shielding plate of the vapor deposition machine, and move the execution unit (4) to a specified position by means of the motion unit (2), so that the execution unit (4) is close to the window of the vapor deposition machine; Turning on the industrial camera light source of the visual unit (3) to capture image information of a preset position inside the vapor deposition machine, and comparing the image information of the preset position inside the vapor deposition machine at different times to determine the location where the foreign matter is generated; The motion unit (2) is configured with trajectory parameters according to the point where the foreign matter is generated inside the vapor deposition machine, the infrared laser auxiliary unit (7) is started, and the motion unit (2) is controlled according to the configured trajectory parameters to drive the infrared laser auxiliary unit (7) to move, so that the infrared auxiliary light generated by the infrared laser auxiliary unit (7) is irradiated on the point where the foreign matter is generated; The infrared auxiliary light generated by the infrared laser auxiliary unit (7) is turned off, and the pulse laser emitter (6) of the execution unit (4) is turned on. The pulse laser emitter (6) emits infrared light to irradiate the point where the foreign matter is generated. The temperature of the infrared light generated by the pulse laser emitter (6) is used to melt and vaporize the organic foreign matter at the foreign matter point inside the vapor deposition machine.

7. The method for removing vapor-deposited organic foreign matter according to claim 6, characterized in that: In the process of comparing the image information at different times of the preset positions inside the vapor deposition machine to determine the location where the foreign matter is generated, the captured image information at the preset positions inside the vapor deposition machine is numbered and named according to the workstations and used as standard sample file data to perform point matching and writing in combination with the trajectory parameters of the motion unit (2).

8. The method for removing vapor-deposited organic foreign matter according to claim 6, characterized in that: In the process of melting and gasifying the organic foreign matter at the foreign matter point inside the vapor deposition machine by utilizing the temperature of the infrared light generated by the pulse laser emitter (6), the motion unit (2) is controlled to move along a circular trajectory of a preset radius, so as to drive the infrared light generated by the pulse laser emitter (6) to irradiate the foreign matter generation point and move along a circular trajectory of a preset radius.

9. The method for removing vapor-deposited organic foreign matter according to claim 6, characterized in that: In the process of melting and gasifying the organic foreign matter at the foreign matter point inside the vapor deposition machine by utilizing the temperature of the infrared light generated by the pulse laser emitter (6), the motion unit (2) is controlled to move along a trajectory of a preset direction and a specified distance, so as to drive the infrared light generated by the pulse laser emitter (6) to move along a trajectory of a preset direction and a specified distance at the foreign matter generation point.

10. The method for removing vapor-deposited organic foreign matter according to claim 6, characterized in that: In the process of melting and gasifying the organic foreign matter at the foreign matter points inside the vapor deposition machine using the temperature of the infrared light generated by the pulsed laser emitter (6), the motion unit (2) is controlled to move along a circular trajectory of a preset radius, or the motion unit (2) is controlled to move along a trajectory of a preset direction and a specified distance, according to a set foreign matter removal time.

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