Electromagnetic float-mold injection molding process and structure

Abstract

The application discloses an electromagnetic floating in-mold injection forming process, which belongs to the technical field of in-mold injection forming processes. First, a memory steel wire and a power line are connected by silica gel in a product cavity of a first forming mold. Then, a high-temperature-resistant magnet and a power supply device are arranged into an electromagnetic floating structure around a product cavity of a second forming mold. The magnetic field formed by the current in the power line and the memory steel wire and the magnetic field of the high-temperature-resistant magnet are matched to make the power line and the memory steel wire suspend in the product cavity of the second forming mold by the magnetic field force generated after the power is turned on. Finally, silica gel raw materials are injected into the product cavity of the second forming mold after the mold is closed by using a silica gel injection molding machine to avoid the technical problem that the power line or the memory steel wire is exposed outside the silica gel shell after in-mold injection forming.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of in-mold injection molding process, in particular to an electromagnetic floating in-mold injection molding process and a structure using the same. BACKGROUND

[0002] The existing Bluetooth earphone neck product is mainly composed of the following components: memory wire, power line, product shape silicone.

[0003] The traditional production method of the aforementioned Bluetooth earphone neck product is as follows: mainly using in-mold forming process of oil pressure silicone / solid silicone, specifically: first calculating the amount of silicone for single mold; then placing silicone, power line and memory wire together in the preset mold cavity according to the direction and sequence requirements; finally, starting the oil pressure machine for in-mold forming processing to complete the production.

[0004] For example, Chinese patent CN117382076A discloses an oil pressure forming device for silicone products and a method for using the same, which comprises a base, a pressure forming component, a transfer component and a blanking component arranged on the base, the transfer component is used to realize the transfer of silicone products; the pressure forming component is used to form the silicone and prevent accidental start-up from causing harm to personnel; the blanking component is used to take the product after pressure forming and cut off the flash waste. The technical solution disclosed in the patent can ensure that the mold is in place and then the silicone is filled for forming operation, while protecting the safety of personnel; realize the transfer of the product, so that the feeding pipe does not interfere with the blanking operation, improve the blanking speed; can quickly blank the product, cut off the product flash at the same time, directly collect and pack the finished product, without manual operation of personnel, simplify the operation process and improve the efficiency.

[0005] However, the above-mentioned in-mold oil pressure forming process of silicone products cannot avoid the technical problem of existing Bluetooth earphone neck product that the power line and memory wire are exposed during oil pressure forming. Specifically, when using oil pressure silicone forming process to produce the existing Bluetooth earphone neck product, the state inside the mold cavity after the mold closing action cannot be observed or perceived by the operator in real time; therefore, the operator cannot control or adjust the position of the power line and memory wire in real time; thus, the product produced has high defect rate, which mainly manifests in that the power line and memory wire are not in the middle tolerance position of the product, the power line and memory wire will swing in the upward and downward directions of the product, resulting in that the power line or memory wire in the finished product is exposed outside the silicone shell.

[0006] Further, the in-mold injection molding is a plastic processing technology which melts solid plastic according to a certain melting point, injects into a mold through the pressure of an injection machine at a certain speed, and solidifies the plastic through the water channel cooling to obtain a product same as the designed mold cavity. The plastic processing technology is mainly used for the molding processing of thermoplastic plastics, and can also be used for the molding processing of thermosetting plastics.

[0007] Based on this, the in-mold injection molding can be combined with the silicone oil pressure technology to solve the technical problem of the exposure of the power cord and the memory steel wire of the Bluetooth earphone neck product during the oil pressure molding. SUMMARY

[0008] Based on this, it is necessary to provide an electromagnetic floating in-mold injection molding process for solving the technical problem of the exposure of the power cord and the memory steel wire of the Bluetooth earphone neck product during the oil pressure molding.

[0009] An electromagnetic floating in-mold injection molding process, comprising the following steps:

[0010] S1: connecting the power cord and the memory steel wire required for manufacturing the Bluetooth earphone neck product through a first molding mold to obtain a first product;

[0011] S2: providing an electromagnetic floating structure around the product cavity of a second molding mold, so that the first product placed in the product cavity of the second molding mold is always suspended at a preset position in the product cavity structure after being powered on;

[0012] S3: starting an injection machine to inject and fill the material in the product cavity of the second molding mold, so that the filled material covers the periphery of the suspended first product to obtain a second product;

[0013] S4: further processing the second product to obtain a Bluetooth earphone neck product.

[0014] Specifically, the method for providing the electromagnetic floating structure around the product cavity of the second molding mold is:

[0015] S21: installing magnets on both sides of the top of the first product in the product cavity of the second molding mold according to the magnetic field direction, one side N level and the other side S level;

[0016] S22: providing a power positive and negative device around the second molding mold at the junction of the power cord part of the Bluetooth earphone neck product, and leading the powered structure from the power positive and negative device to the outside of the second molding mold;

[0017] S23: placing the first product in the product cavity of the second molding mold, and electrically connecting the first product with the power positive and negative device;

[0018] S24: connecting the power supply positive and negative electrode device to the power supply, and making the product in the product cavity of the second forming mold always float at the preset position by adjusting the output voltage of the power supply positive and negative electrode device and the injection parameters of the injection machine.

[0019] Further, a structure applied to the electromagnetic floating mold inner injection molding process, comprising: an injection cavity structure, a forming framework structure, a magnet structure, and an external power supply positive and negative electrode structure; the forming framework structure is movably arranged in the injection cavity structure, the N level of the magnet structure is arranged on one side of the injection cavity structure, and the S level of the magnet structure is arranged on the other side of the injection cavity structure; the external power supply positive and negative electrode structure is arranged on the adjacent side of the injection cavity structure, and the external power supply positive and negative electrode structure is electrically connected with the forming framework structure.

[0020] Further, the external power supply positive and negative electrode structure has an insulating support seat body, an insulating isolation cover body, an electrode connecting column structure, an electrode locking structure, an electrode top end sealing structure, and an electrode bottom end sealing structure.

[0021] Further, the insulating isolation cover body is arranged above the insulating support seat body, and two electrode connecting column structures are movably arranged in the insulating support seat body.

[0022] Further, each electrode connecting column structure is electrically connected with one end of the forming framework structure, and the insulating isolation cover body is arranged above the connection between each electrode connecting column structure and the forming framework structure.

[0023] Further, each electrode locking structure is connected to one electrode connecting column structure, the electrode top end sealing structure is arranged above two electrode connecting column structures after penetrating the insulating isolation cover body, and the electrode bottom end sealing structure is arranged at the bottom of two electrode connecting column structures.

[0024] Further, the electrode locking structure has an electrode locking part and an electrode connecting piece.

[0025] Further, the electrode locking part is movably arranged on the electrode connecting column structure, and the electrode connecting piece is connected with the electrode locking part and the electrode connecting column structure respectively.

[0026] Further, the electrode top end sealing structure has a top end sealing block, a pressing piece, and a spring structure; the top end sealing block is arranged above two electrode connecting column structures, the pressing piece abuts against the top of the top end sealing block after penetrating the insulating isolation cover body, and the spring structure is connected with the pressing piece.

[0027] In summary, the electromagnetic floating in-mold injection molding process of the application first connects the memory wire and the power cord of the Bluetooth earphone neck product in the product cavity of the first molding mold with silica gel, and the silica gel material can be injected by the silica gel injection machine after the first molding mold is closed. Then, the product cavity in the second molding mold is optimized in structure, and the periphery of the product cavity of the molding mold is provided with an electromagnetic floating structure using high-temperature-resistant magnets and a power supply device. The magnetic field formed by the current in the power cord and the memory wire cooperates with the magnetic field of the high-temperature-resistant magnets to make the power cord and the memory wire rely on the magnetic field force generated after being electrified to float in the product cavity of the second molding mold. Finally, the silica gel injection machine is used to inject silica gel raw materials in the product cavity of the second molding mold after the mold is closed, and by adjusting the injection pressure, injection speed and other injection parameters of the silica gel injection machine, the magnetic field force can be guaranteed to be controlled within the range of the preset intermediate tolerance value of the product. Therefore, the technical problem that the power cord and the memory wire are exposed outside the silica gel shell after in-mold injection molding of the product is solved. Therefore, the electromagnetic floating in-mold injection molding process of the application solves the technical problem that the power cord and the memory wire are easily exposed during oil pressure molding of the Bluetooth earphone neck product. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 The flowchart of the electromagnetic floating in-mold injection molding process of the application is shown in the figure;

[0029] Figure 2 The structure diagram of the electromagnetic floating in-mold injection molding structure of the application is shown in the figure;

[0030] Figure 3 The explosion structure diagram of another direction of the electromagnetic floating in-mold injection molding structure of the application is shown in the figure;

[0031] Figure 4 The explosion structure diagram of another direction of part of the electromagnetic floating in-mold injection molding structure of the application is shown in the figure;

[0032] Figure 5 The structure diagram of another direction of part of the electromagnetic floating in-mold injection molding structure of the application is shown in the figure;

[0033] Figure 6 The explosion structure diagram of another direction of part of the electromagnetic floating in-mold injection molding structure of the application is shown in the figure;

[0034] Figure 7 The structure diagram of another direction of the electromagnetic floating in-mold injection molding structure of the application is shown in the figure. DETAILED DESCRIPTION

[0035] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described below in detail with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in many different manners without the specific details, and it is to be understood that the present application is not limited to the specific embodiments described below and that the specific embodiments are given for the purposes of exemplification only.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0037] In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0038] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0040] It is to be understood that when an element as a "fixed" or "disposed" on another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only implementation.

[0041] Please refer to Figure 1 The electromagnetic floating mold injection molding process of the present application comprises the following steps:

[0042] First, prepare the first molding mold, the second molding mold, the silicone injection machine, the power transformer, the high-temperature-resistant magnet, the silicone material, the Bluetooth earphone neck product power cord material, the Bluetooth earphone neck product memory steel wire material and other necessary materials;

[0043] S1: first use the first molding mold to connect the power cord and the memory steel wire required to make the Bluetooth earphone neck product to obtain a one-shot product;

[0044] S2: at the top of the two sides of the one-shot product passing through the product cavity of the second molding mold, install magnets according to the magnetic field direction, one side N level and the other side S level;

[0045] S3: at the junction of the power cord of the Bluetooth earphone neck product, a power positive and negative device is provided, which is insulated from the second molding mold on all sides, and the power supply is led to the outside of the second molding mold from the side of the power positive and negative device;

[0046] S4: Put the one-shot product made in step S1 into the product cavity of the second molding mold, so that the junction of the power cord of the one-shot product is electrically connected to the power positive and negative device;

[0047] S5: Connect the power supply to the power positive and negative device, adjust the output voltage of the power positive and negative device and the injection parameters of the silicone injection machine, so that the one-shot product in the product cavity of the second molding mold is always suspended at a predetermined position;

[0048] S6: Start the silicone injection machine to inject silicone material in the product cavity of the second molding mold, thereby obtaining a two-shot product, and then perform edge trimming and other finishing processes on the two-shot product to obtain a Bluetooth earphone neck product.

[0049] Specifically, in the electromagnetic floating in-mold injection molding process of the application, first, the skeleton material of the Bluetooth earphone neck product, i.e. the material of the memory steel wire and the power cord, is connected to each other by using the first molding mold; the connection between the two can be connected by silica gel in the product cavity of the first molding mold, and the silica gel material can be injected by the silica gel injection machine after the first molding mold is closed. After that, the product cavity in the second molding mold is optimized in structure, so that the high-temperature-resistant magnet and the power supply device are arranged in the electromagnetic floating structure form around the product cavity, and the magnetic field formed by the current in the power cord and the memory steel wire cooperates with the magnetic field of the high-temperature-resistant magnet itself to make the power cord and the memory steel wire rely on the magnetic field force after being electrified to float in the product cavity of the second molding mold. Finally, the silica gel injection machine is used to inject silica gel raw material into the product cavity of the second molding mold after the mold is closed, and by adjusting the injection pressure, injection speed and other injection parameters of the silica gel injection machine, the magnetic field force can be guaranteed to control the skeleton material within the range of the preset intermediate tolerance value of the product; thus, the technical problem that the power cord or the memory steel wire is exposed outside the silica gel shell after the product is in-mold injection molded is solved.

[0050] Further, please continue to refer to Figures 2 to 7 A structure using the electromagnetic floating in-mold injection molding process, which comprises: an injection cavity structure 1, a molding skeleton structure 2, a magnet structure 3, and an external power supply positive and negative electrode structure 4; the molding skeleton structure 2 is movably arranged in the injection cavity structure 1, one side of the injection cavity structure 1 is provided with the N level of the magnet structure 3, and the other side of the injection cavity structure 1 is provided with the S level of the magnet structure 3; the external power supply positive and negative electrode structure 4 is arranged on the adjacent side of the injection cavity structure 1, and the external power supply positive and negative electrode structure 4 is electrically connected with the molding skeleton structure 2.

[0051] Specifically, the technical scheme of the electromagnetic floating in-mold injection molding structure, the injection cavity structure 1 is arranged in the injection molding mold, and the molding framework structure 2 is movably arranged in the injection cavity structure 1. The two ends of the molding framework structure 2 are electrically connected to the positive electrode and the negative electrode of the external power supply positive and negative electrode structure 4, respectively. When the external power supply is connected to the external power supply positive and negative electrode structure 4, the current of the external power supply flows from the positive electrode of the external power supply positive and negative electrode structure 4 into the molding framework structure 2, and then flows back to the external power supply through the negative electrode of the external power supply positive and negative electrode structure 4. Since the molding framework structure 2 is made of conductive material, for example, it can be composed of the power cord and the memory wire structure of the Bluetooth earphone neck product. When the current flows in the molding framework structure 2, a magnetic field is generated around the molding framework structure 2 due to electromagnetic induction. The N level and the S level of the magnet structure 3 are arranged on the two sides of the injection cavity structure 1. Specifically, an N level of a magnet can be arranged on one side of the injection cavity structure 1, and an S level of another magnet can be arranged on the other side. The two magnets can constitute the magnet structure 3. In addition, the N level and the S level of the same magnet can be arranged on the two sides of the injection cavity structure 1, and the magnet can constitute the magnet structure 3. Thus, the magnet structure 3 can generate a magnetic field in the injection cavity structure 1. The magnetic field can act on the magnetic field generated by the molding framework structure 2 after being electrified. Thus, the molding framework structure 2 can be suspended in the injection cavity structure 1 after being electrified. Then, the injection mechanism can be used to fill the injection cavity structure 1 with silica gel and other materials, which can uniformly cover the periphery of the molding framework structure 2 to form a shell structure. Thus, the molding framework structure 2 can be formed into a uniform in-mold injection product.

[0052] Further, the external power supply positive and negative electrode structure 4 has an insulating support seat body 401, an insulating isolation cover body 402, an electrode connecting column structure 403, an electrode locking structure 404, an electrode top end plugging structure 405, and an electrode bottom end plugging structure 406; the insulating isolation cover body 402 is arranged above the insulating support seat body 401, and two electrode connecting column structures 403 are movably sleeved in the insulating support seat body 401; each electrode connecting column structure 403 is electrically connected to one end of the shaped framework structure 2, and the insulating isolation cover body 402 is arranged above the connection between each electrode connecting column structure 403 and the shaped framework structure 2; each electrode locking structure 404 is connected to the electrode connecting column structure 403, the electrode top end plugging structure 405 is arranged above the two electrode connecting column structures 403 after passing through the insulating isolation cover body 402, and the electrode bottom end plugging structure 406 is arranged at the bottom of the two electrode connecting column structures 403.

[0053] Specifically, the external power supply positive and negative electrode structure 4 mainly serves to insulate and isolate the part of the shaped framework structure 2 and the rest of the injection molding mold connected in conductive connection with the external power supply. More specifically, generally, the shaped framework structure 2 has two ends, and each end is electrically connected to one electrode connecting column structure 403, one of which serves as the positive electrode of the external power supply, and the other as the negative electrode; so that the shaped framework structure 2 and the external power supply form a conductive loop. In addition, the insulating support seat body 401 can pass through the plate structure of the mold and form insulating isolation so that the electrode connecting column structure 403 is arranged therein; the insulating isolation cover body 402 can further insulate and cover the connection between the electrode connecting column structure 403 and the shaped framework structure 2. Further, after the two electrode connecting column structures 403 are electrically connected to the shaped framework structure 2, the electrode locking structure 404 can lock the conductive connection between the two. Then, the electrode top end plugging structure 405 is used to supplement the insulating isolation of the place. In addition, the bottom of the two electrode connecting column structures 403 is the connection part to the external power supply, which can be insulated and plugged by the electrode bottom end plugging structure 406, so that the setting range of the insulating support seat body 401 and the insulating isolation cover body 402 is completely insulated and isolated, so that the external power supply positive and negative electrode structure 4 and the external mold plate are completely insulated and isolated.

[0054] Further, the electrode locking structure 404 has an electrode locking part 404a and an electrode connecting piece 404b; the electrode locking part 404a is movably arranged on the electrode connecting column structure 403, and the electrode connecting piece 404b connects the electrode locking part 404a and the electrode connecting column structure 403 respectively. Specifically, one end of the cable connected between the electrode connecting column structure 403 and the shaped framework structure 2 is connected to the shaped framework structure 2, and the other end can be put between the electrode locking part 404a and the electrode connecting column structure 403, and then the electrode connecting piece 404b is used to lock and connect the two.

[0055] Further, the electrode top end sealing structure 405 has a top end sealing block 405a, a pressing piece 405b and a spring structure 405c; the top end sealing block 405a is arranged on the two electrode connecting column structures 403, the pressing piece 405b abuts against the top of the top end sealing block 405a after passing through the insulating isolation cover 402, and the spring structure 405c is connected with the pressing piece 405b. Specifically, after the spring structure 405c is pressed by the external mold block structure, the spring can be transmitted to the top end sealing block 405a through the pressing piece 405b, so that the top end sealing block 405a covers the two electrode connecting column structures 403.

[0056] Further, in an embodiment, an upper mold core structure 5 is arranged above the external power supply positive and negative electrode structure 4, and a lower mold core structure 6 is arranged below the external power supply positive and negative electrode structure 4; the upper mold core structure 5 and the lower mold core structure 6 are arranged to be opened and closed oppositely, and the injection cavity structure 1 is arranged between the upper mold core structure 5 and the lower mold core structure.

[0057] Further, the shaped framework structure 2 has a power line part 201 and a memory steel wire part 202, the power line part 201 and the memory steel wire part 202 are arranged in a stacked manner, and the power line part 201 and the memory steel wire part 202 can be connected by using silica gel in a mold core forming manner.

[0058] In summary, the electromagnetic floating in-mold injection molding process of the present application first connects the memory wire and the power cord of the Bluetooth earphone neck product in the product cavity of the first molding mold with silica gel, and the silica gel material can be injected by the silica gel injection machine after the first molding mold is closed. Thereafter, the product cavity in the second molding mold is optimized in structure, and the periphery of the product cavity of the molding mold is provided with an electromagnetic floating structure using high-temperature-resistant magnets and a power supply device. The magnetic field formed by the current in the power cord and the memory wire cooperates with the magnetic field of the high-temperature-resistant magnets to make the power cord and the memory wire rely on the magnetic field force generated after being electrified to float in the product cavity of the second molding mold. Finally, the silica gel injection machine is used to inject silica gel raw materials in the product cavity of the second molding mold after the mold is closed, and by adjusting the injection pressure, injection speed and other injection parameters of the silica gel injection machine, the magnetic field force can be guaranteed to be controlled within the range of the preset intermediate tolerance value of the product. Thus, the technical problem that the power cord and the memory wire are exposed outside the silica gel shell after in-mold injection molding of the product due to the inability to control the position of the power cord or the memory wire is solved. Therefore, the electromagnetic floating in-mold injection molding process solves the technical problem that the power cord and the memory wire are easily exposed during oil pressure molding of the Bluetooth earphone neck product.

[0059] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present disclosure.

[0060] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An electromagnetic floating mold in-mold injection molding process, characterized in that, It includes the following steps: S1: First, the power cord and memory steel wire required for making the Bluetooth headset neckband product are connected through the first molding mold to obtain a shot product; S2: An electromagnetic levitation structure is provided around the product cavity of the second molding mold. The electromagnetic levitation structure includes magnets disposed on both sides of the product cavity and an external power supply positive and negative pole structure (4). The product is placed into the product cavity of the second molding mold, so that the product is electrically connected to the external power supply positive and negative pole structure (4). S3: The product is powered on by the positive and negative pole structure (4) of the external power supply. The power line and memory steel wire in the product generate a magnetic field after being powered on, which interacts with the magnetic field of the magnet, so that the product is suspended in the preset position in the product cavity. S4: Start the injection molding machine to inject filler material into the product cavity of the second molding mold, so that the filler material covers and fills the periphery of the suspended first-shot product, thereby obtaining the second-shot product; S5: Further processing of the two-shot product yields a Bluetooth headset neckband product.

2. The electromagnetic floating mold in-mold injection molding process according to claim 1, characterized in that: The method of providing an electromagnetic levitation structure around the product cavity of the second molding die is as follows: S21: Magnets are installed on both sides of the top of the product cavity of the second molding mold, with one side being N-class and the other side being S-class according to the direction of the magnetic field. S22: At the junction of the power cord parts of the Bluetooth headset neckband product, an external power supply positive and negative pole structure (4) is provided, which is insulated from the second molding mold on all four sides, and the energized structure is led to the outside of the second molding mold from the external power supply positive and negative pole structure (4). S23: Place the first shot product into the product cavity of the second molding mold, so that the first shot product is electrically connected to the positive and negative pole structure (4) of the external power supply. S24: Connect the external power supply positive and negative structure (4) to the power supply. By adjusting the output voltage of the external power supply positive and negative structure (4) and the injection parameters of the injection machine, the product in the product cavity of the second molding mold is always suspended at the preset position.

3. A structure applying the electromagnetic floating mold in-mold injection molding process as described in any one of claims 1-2, characterized in that, It includes: an injection cavity structure (1), a molding skeleton structure (2), a magnet structure (3), and an external power supply positive and negative pole structure (4); the molding skeleton structure (2) is movably disposed in the injection cavity structure (1), the N pole of the magnet structure (3) is disposed on one side of the injection cavity structure (1), and the S pole of the magnet structure (3) is disposed on the other side of the injection cavity structure (1); the external power supply positive and negative pole structure (4) is disposed on the adjacent side of the injection cavity structure (1), and the external power supply positive and negative pole structure (4) is electrically connected to the molding skeleton structure (2); The magnet structure (3) is a high temperature resistant magnet. The magnet structure (3) is respectively disposed on both sides of the injection cavity structure (1). The positive and negative pole structure (4) of the external power supply is electrically connected to the molding skeleton structure (2) through the electrode connection column structure (403) to form a closed loop. An upper mold core structure (5) is provided above the external power supply positive and negative pole structure (4), and a lower mold core structure (6) is provided below the external power supply positive and negative pole structure (4). The upper mold core structure (5) and the lower mold core structure (6) are arranged to open and close relative to each other, and the injection cavity structure (1) is located between the upper mold core structure (5) and the lower mold core structure (6). The external power supply positive and negative pole structure (4) has an insulating support base (401), an insulating isolation cover (402), an electrode connecting post structure (403), an electrode locking structure (404), an electrode top sealing structure (405), and an electrode bottom sealing structure (406); the insulating isolation cover (402) is provided above the insulating support base (401), and two electrode connecting post structures (403) are movably sleeved in the insulating support base (401); each electrode connecting post structure (403) is electrically connected to one end of the molded skeleton structure (2), and the insulating isolation cover (402) is provided to cover the connection between each electrode connecting post structure (403) and the molded skeleton structure (2).

4. The electromagnetic floating mold in-mold injection molding structure according to claim 3, characterized in that: Each of the electrode locking structures (404) is connected to one of the electrode connecting post structures (403). The electrode top sealing structure (405) passes through the insulating cover (402) and covers the two electrode connecting post structures (403). The electrode bottom sealing structure (406) covers the bottom of the two electrode connecting post structures (403).

5. The electromagnetic floating mold in-mold injection molding structure according to claim 4, characterized in that: The electrode locking structure (404) has an electrode locking part (404a) and an electrode connector (404b).

6. The electromagnetic floating mold in-mold injection molding structure according to claim 5, characterized in that: The electrode locking part (404a) is movably disposed on the electrode connecting post structure (403), and the electrode connector (404b) connects the electrode locking part (404a) and the electrode connecting post structure (403) respectively.

7. The electromagnetic floating mold in-mold injection molding structure according to claim 6, characterized in that: The electrode tip sealing structure (405) has a tip sealing block (405a), a clamping member (405b), and a spring structure (405c); the tip sealing block (405a) is disposed on the two electrode connecting post structures (403), the clamping member (405b) passes through the insulating isolation cover (402) and abuts against the top of the tip sealing block (405a), and the spring structure (405c) is connected to the clamping member (405b).

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