High-precision non-normal-temperature liquid environment substrate laminating device

Abstract

The invention relates to the technical field of panel display, in particular to a high-precision non-normal-temperature liquid environment substrate laminating device. Comprising a base, a protective cover, a pressing module, a temperature control module, a lower laminating table and a visual positioning module, the protective cover is mounted on the base, the pressing module is fixedly mounted on the base in the protective cover and used for mounting an upper substrate, the temperature control module is obliquely mounted on the base below the pressing module, and the lower laminating table is obliquely mounted in the temperature control module and used for mounting the upper substrate. And a visual positioning module is fixedly mounted on the base on one side of the temperature control module, extends into the temperature control module and is used for positioning the substrate. The substrate laminating device has the advantages of being high in laminating precision, good in size adaptability, capable of providing a non-normal-temperature working environment and capable of reducing the bubble phenomenon, the problems that existing substrate laminating equipment is low in laminating precision, poor in size adaptability, only suitable for normal-temperature use and prone to blistering are solved, and the requirement for laminating the substrate in non-normal-temperature liquid is met.

Description

Technical Field

[0001] The present application relates to the field of panel display technology, and in particular to a high-precision substrate bonding device in an extremely low-temperature liquid environment. Background Art

[0002] The display panel is a component responsible for displaying images and text information. It is widely used in electronic devices such as mobile phones, televisions and display screens. Display panels are usually multi-layer composite structures, and the materials and processing techniques of each layer of substrate are different. Therefore, during the production process of the display panel, it is necessary to first produce the functional substrates of each layer, and then bond and assemble the substrates to form a multi-layer integral panel. This process requires the use of corresponding bonding devices to complete the assembly.

[0003] The substrate bonding device in the prior art usually uses a tooling fixture to position the substrate, and then manually closes the fixture to make the substrate fit tightly. The bonding accuracy of this structure is low, the substrates are not accurately aligned, and misalignment is prone to occur during bonding, which reduces the yield rate of the display panel. In addition, the tooling fixture is usually tailor-made and only adapts to substrates of specific sizes. When there are panels of different sizes, it is difficult to adjust and adapt, and multiple sets of equipment are often required to meet the requirements, increasing production costs.

[0004] In addition, due to process requirements, the new display panel needs to complete the substrate bonding process in a very low temperature environment. Since the existing technology only requires a room temperature environment for normal production and processing, there is no mature technical reserve for very low temperature environments. If conventional heating or cooling equipment is directly installed, the temperature control effect is limited and it is difficult to meet the temperature requirements of the process. The use of a liquid solution can produce a uniform working temperature, but the existing equipment is difficult to achieve normal operation in a liquid environment and is prone to bubbling during the bonding process, affecting the bonding effect. Therefore, a new substrate bonding device for an extremely low temperature liquid environment is needed to solve the above-mentioned deficiencies. Summary of the invention

[0005] In view of the defects of the prior art, the purpose of this application is to provide a high-precision substrate bonding device for an extremely low-temperature liquid environment, aiming to solve the technical problems of the existing substrate bonding devices, such as low bonding accuracy, poor dimensional adaptability, only being suitable for use at room temperature and easy bubbling.

[0006] To achieve the above-mentioned objectives, the present application provides a high-precision substrate bonding device for an extremely low-temperature liquid environment, comprising a base, a protective cover, a down-pressing module, a temperature control module, a lower bonding table and a visual positioning module, wherein the base is provided with a protective cover, and the down-pressing module is fixedly installed on the base inside the protective cover, the down-pressing module is used to install an upper substrate, a temperature control module is obliquely installed on the base below the down-pressing module, a lower bonding table is obliquely installed in the temperature control module, the lower bonding table is used to install a lower substrate, a visual positioning module is fixedly installed on the base on one side of the temperature control module, the visual positioning module extends into the temperature control module, and the visual positioning module is used to position the substrate.

[0007] In some embodiments, the base is composed of a cabinet and a marble platform, the marble platform is installed on the cabinet in an inclined state, a liquid collecting bottle is installed on one side of the cabinet for collecting the filtered circulating liquid, the cabinet is also provided with a cabinet door, an electrical control panel is installed in the cabinet, and a plurality of universal rollers and foot cups are symmetrically installed on the bottom of the cabinet, and the foot cups are used to adjust the base to a horizontal state.

[0008] In some embodiments, the pressing module includes a gantry, a ball screw pair, an assembly frame, a vacuum suction cup, an ultraviolet lamp and a micro push rod. The assembly frame is installed on the gantry through a ball screw pair. The bottom of the assembly frame is equipped with a vacuum suction cup, which is used to adsorb the upper substrate. The assembly frame is also equipped with an ultraviolet lamp and a micro push rod.

[0009] In some embodiments, the temperature control module includes an adjustment seat, a support frame and an insulation chamber. The support frame is fixedly mounted on the adjustment seat, and the insulation chamber is mounted on the support frame. The support frame is used to lift the insulation chamber to reduce heat conduction, and the insulation chamber is used to accommodate circulating fluid to achieve the function of heating or cooling.

[0010] In some embodiments, the adjustment seat includes a lower adjustment plate, a movable block, an adjustment motor and an upper adjustment plate. The lower adjustment plate is symmetrically provided with a plurality of adjustment slots, the movable blocks are installed in the adjustment slots, the adjustment motor is installed on the lower adjustment plate between the movable blocks, the output shaft of the adjustment motor is connected to the movable block, the adjustment motor is used to drive the movable block to move in the adjustment slot, and the upper adjustment plate is fixedly installed on the top of the movable block.

[0011] In some embodiments, the support frame includes a lower support plate, an upper support plate, a support shaft, an isolation groove, a water immersion detector and a drain pipe. A plurality of support shafts are fixedly installed on the lower support plate at intervals. Both end ends of the support shafts are provided with shaft seats. An upper support plate is fixedly installed on the top of the support shaft. A lower insulation block is provided between the upper support plate and the shaft seat. An isolation groove is provided below the upper support plate through the isolation block. The isolation groove is connected to the lower support plate through an auxiliary plate. A water immersion detector is installed in the isolation groove. Drain pipes are also provided on the isolation groove, the lower support plate and the upper support plate, respectively. The drain pipes are used to discharge circulating liquid when liquid is introduced into the support frame.

[0012] In some embodiments, the insulation chamber includes an insulation board, an outer cavity, an inner cavity, an upper insulation block and a temperature measuring probe. The outer cavity is fixedly installed on the insulation board, and the inner cavity is fixedly installed on the insulation board inside the outer cavity. The inner cavity is used to accommodate circulating fluid. Multiple upper insulation blocks are installed between the inner cavity and the outer cavity. The upper insulation blocks and insulation boards are used to reduce heat conduction between the outer cavity and the inner cavity. Temperature measuring probes are also inserted into the outer cavity and the inner cavity. The temperature measuring probes are used to detect the temperature of the circulating fluid in the inner cavity.

[0013] In some embodiments, the outer cavity and the inner cavity are trapezoidal bodies, and multiple liquid circulation pipes are installed on the sides of the outer cavity and the inner cavity. The liquid circulation pipes extend through the outer cavity into the inner cavity. The liquid circulation pipes are used to inject or discharge circulating liquid into the inner cavity. An overflow pipe is installed on the upper part of the inner cavity. The overflow pipe is used to discharge circulating liquid that exceeds the liquid level in the inner cavity. Liquid level sensors are installed at upper and lower intervals in the outer cavity below the overflow pipe, and the probe of the liquid level sensor extends into the inner cavity.

[0014] In some embodiments, the lower bonding table is a rectangular body for placing the lower substrate. A pair of lower joints are installed on the side of the lower bonding table. The lower joints are used to connect to a liquid supply device to inject or discharge circulating liquid to the lower bonding table, so as to further maintain the lower substrate at the same temperature as the circulating liquid. A plurality of negative pressure joints are also installed on the other side of the lower bonding table. The negative pressure joints are used to connect to a vacuum pump to generate negative pressure. A negative pressure hole is provided on the lower bonding table. The negative pressure hole is connected to the negative pressure joint and is used to absorb the lower substrate by negative pressure. The interior of the lower bonding table is layered with liquid flow channels and air channels. The air channels are respectively connected to the negative pressure joint and the negative pressure hole. The liquid flow channels are connected to the lower joint. A plurality of groups of observation holes are also arranged at intervals on the lower bonding table. The observation holes are used for visual positioning.

[0015] In some embodiments, the visual positioning module includes a positioning seat, a lifting platform, a driving motor, a pad, a fine-tuning bracket and a camera. The positioning seat is fixedly mounted with a lifting platform, the lifting platform is equipped with a pad, one side of the lifting platform is equipped with a driving motor, the pad on the other side of the lifting platform is equipped with a fine-tuning bracket, and cameras are respectively installed on the fine-tuning bracket and the pad.

[0016] In some embodiments, the visual positioning module includes a positioning seat, a lifting platform, a driving motor, a pad, a fine-tuning bracket and a camera. The positioning seat is fixedly mounted with a lifting platform, the lifting platform is equipped with a pad, one side of the lifting platform is equipped with a driving motor, the pad on the other side of the lifting platform is equipped with a fine-tuning bracket, and cameras are respectively installed on the fine-tuning bracket and the pad.

[0017] The beneficial effects of the technical solution provided by this application include:

[0018] The embodiment of the present application provides a high-precision substrate bonding device for a non-normally warm liquid environment, which has the advantages of high bonding accuracy, good dimensional adaptability, providing a non-normally warm working environment and reducing the occurrence of bubbles. It solves the problems of low bonding accuracy, poor dimensional adaptability, only being suitable for room temperature use and easy bubbling in existing substrate bonding equipment, and meets the needs of bonding substrates in non-normally warm liquids.

[0019] The present application adopts a visual positioning module to position and correct the substrate, and finely adjusts the position of the substrate through the adjustment seat in the temperature control module to ensure that the substrate can be accurately aligned, reduce misalignment, improve the accuracy of substrate bonding, and increase the yield rate; the lower bonding table of the present application is provided with multiple groups of observation holes, substrates of different sizes can be replaced, and the position of the visual positioning module can be adjusted to achieve visual positioning through the corresponding observation holes without changing the mold, and has good size adaptability.

[0020] The present application provides a very low temperature working environment through a heat preservation chamber, uses a liquid circulation pipe to inject circulating liquid to reduce the temperature of the substrate, realizes the substrate bonding function in a very low temperature environment, and uses structures such as a support frame and a heat insulation board to reduce heat conduction in order to maintain a very low temperature state. In addition, the present application also provides a temperature control module and a lower bonding table with an inclined structure, so that the circulating liquid gradually fills the gaps between the substrates from one side, reduces the phenomenon of bubbles, and improves the bonding effect of the substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the present application;

[0022] Figure 2 It is a three-dimensional structural schematic diagram of the hidden protective cover part of the present application;

[0023] Figure 3 It is a three-dimensional structural schematic diagram of the base of the present application;

[0024] Figure 4 is a schematic diagram of the three-dimensional structure of the pressing module of the present application;

[0025] Figure 5 It is a three-dimensional structural schematic diagram of the temperature control module of the present application;

[0026] Figure 6 It is a schematic diagram of the three-dimensional structure of the adjustment seat of the present application;

[0027] Figure 7 It is a three-dimensional structural schematic diagram of the support frame of the present application;

[0028] Figure 8 It is a schematic diagram of the three-dimensional structure of the heat preservation chamber of the present application;

[0029] Fig. 9It is a schematic diagram of a half-section structure of the heat preservation chamber of the present application;

[0030] Fig.10 It is a three-dimensional structural schematic diagram of the lower bonding platform of the present application;

[0031] Fig.11 It is a schematic diagram of the three-dimensional structure of the visual positioning module of the present application.

[0032] In the figure:

[0033] 1. Base; 11. Cabinet; 12. Marble platform; 13. Liquid collecting bottle; 14. Cabinet door; 15. Electrical control panel; 16. Universal roller; 17. Foot cup;

[0034] 2. Protective cover;

[0035] 3. Press down module; 31. Gantry; 32. Ball screw pair; 33. Assembly frame; 34. Vacuum suction cup; 35. Ultraviolet lamp; 36. Micro push rod;

[0036] 4. Temperature control module; 41. Adjustment seat; 411. Lower adjustment plate; 412. Movable block; 413. Adjustment motor; 414. Upper adjustment plate; 415. Adjustment slot; 42. Support frame; 420. Lower support plate; 421. Upper support plate; 422. Support shaft; 423. Isolation slot, 424. Water immersion detector; 425. Drain pipe; 426. Shaft seat; 427. Lower insulation block; 428. Isolation block; 429. Auxiliary plate; 43. Insulation cavity; 431. Insulation plate; 432. Outer cavity; 433. Inner cavity; 434. Upper insulation block; 435. Temperature probe; 436. Liquid circulation pipe; 437. Overflow pipe; 438. Liquid level sensor;

[0037] 5. Lower laminating table; 51. Lower joint; 52. Observation hole; 53. Negative pressure joint; 54. Negative pressure hole;

[0038] 6. Visual positioning module; 61. Positioning seat; 62. Lifting platform; 63. Driving motor; 64. Pad; 65. Fine-tuning bracket; 66. Camera. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0040] The embodiment of the present application provides a high-precision substrate bonding device for an extraordinary temperature liquid environment, which utilizes a visual positioning module 6 and an adjustment seat 41 to position and correct the substrate, provides an extraordinary temperature working environment through a heat preservation chamber 43, and uses a liquid circulation pipe 436 to inject circulating liquid to lower the temperature of the substrate, thereby realizing the substrate bonding function in an extraordinary temperature environment, and solving the problems of low bonding accuracy, poor dimensional adaptability, only being suitable for use at room temperature, and easy bubbling in the prior art.

[0041] like Figure 1 and Figure 2 As shown, a high-precision substrate bonding device in a non-cold liquid environment includes a base 1, a protective cover 2, a pressing module 3, a temperature control module 4, a lower bonding platform 5 and a visual positioning module 6. Specifically, as Figure 3 As shown, the base 1 is composed of a cabinet 11 and a marble platform 12. A liquid collecting bottle 13 is installed on one side of the cabinet 11. The liquid collecting bottle 13 is used to collect the filtered circulating liquid. The cabinet 11 is also provided with a cabinet door 14. An electrical control board 15 is installed in the cabinet 11. A plurality of universal rollers 16 and foot cups 17 are symmetrically installed at the bottom of the cabinet 11. The foot cups 17 are used to adjust the base 1 to a horizontal state. A marble platform 12 is installed in an inclined state on the cabinet 11. The marble platform 12 has the advantages of high strength, high hardness and good wear resistance.

[0042] like Figure 1 As shown, a protective cover 2 is installed on the base 1. The protective cover 2 is a rectangular frame body. The protective cover 2 is used to provide a protection function to prevent the device from being disturbed during operation.

[0043] like Figure 2 As shown, a pressing module 3 is fixedly mounted on the base 1 in the protective cover 2, and the pressing module 3 is used to install the upper substrate. Specifically, as shown in FIG. Figure 4 As shown, the pressing module 3 includes a gantry 31, a ball screw pair 32, an assembly frame 33, a vacuum suction cup 34, an ultraviolet lamp 35 and a micro push rod 36. The gantry 31 is fixedly connected to the marble platform 12. The assembly frame 33 is installed on the gantry 31 through the ball screw pair 32. The ball screw pair 32 is used to drive the assembly frame 33 to move up and down. The bottom of the assembly frame 33 is equipped with a vacuum suction cup 34, and the vacuum suction cup 34 is used to adsorb the upper substrate. The assembly frame 33 is also equipped with an ultraviolet lamp 35 and a micro push rod 36. The ultraviolet lamp 35 is used to irradiate and cure the optical glue to keep the bonded upper and lower substrates fixed.

[0044] like Figure 2 As shown, a temperature control module 4 is installed obliquely on the base 1 below the pressing module 3. Specifically, Figure 5 As shown, the temperature control module 4 includes an adjustment seat 41, a support frame 42 and a heat preservation chamber 43. Further, as Figure 6 As shown, the adjustment seat 41 includes a lower adjustment plate 411, a movable block 412, an adjustment motor 413 and an upper adjustment plate 414. The lower adjustment plate 411 is fixedly connected to the marble platform 12. A plurality of adjustment slots 415 are symmetrically arranged on the lower adjustment plate 411. The movable blocks 412 are installed in the adjustment slots 415, and the movable blocks 412 can produce limited range of movement in the adjustment slots 415. The lower adjustment plate 411 between the movable blocks 412 is equipped with an adjustment motor 413, and the output shaft of the adjustment motor 413 is connected to the movable block 412. Optionally, the adjustment motor 413 and the movable block 412 are threadedly connected so that the adjustment motor 413 drives the movable block 412 to move in the adjustment slot 415. The upper adjustment plate 414 is fixedly installed on the top of the movable block 412, and the upper adjustment plate 414 is synchronously displaced under the action of the movable block 412.

[0045] like Figure 6 As shown in FIG. 1 , as a preferred embodiment of the present application, a support frame 42 is fixedly mounted on the adjustment seat 41. Specifically, as shown in FIG. Figure 7 As shown, the support frame 42 includes a lower support plate 420, an upper support plate 421, a support shaft 422, an isolation groove 423, a water immersion detector 424 and a drain pipe 425. The lower support plate 420 is fixedly connected to the upper adjustment plate 414. A plurality of support shafts 422 are fixedly installed at intervals on the lower support plate 420. Both ends of the support shafts 422 are provided with shaft seats 426. The top of the support shaft 422 is fixedly installed with an upper support plate 421. A lower insulation block 427 is installed between the upper support plate 421 and the shaft seat 426. The lower insulation block 427 is used to reduce the heat conduction between the upper support plate 421 and the support shaft 422. An isolation groove 423 is installed below the upper support plate 421 through an isolation block 428, and the isolation block 428 is used to reduce the heat conduction between the upper support plate 421 and the isolation groove 423. The isolation groove 423 is connected to the lower support plate 420 through an auxiliary plate 429. The isolation groove 423 and the lower support plate 420 are closed grooves for temporarily storing liquid when the circulating liquid leaks. A water immersion detector 424 is installed in the isolation groove 423. The isolation groove 423, the lower support plate 420 and the upper support plate 421 are also respectively provided with a drain pipe 425. The drain pipe 425 is used to discharge the circulating liquid in time when the water immersion detector 424 detects liquid inflow to prevent contamination of the base 1.

[0046] like Figure 6 As shown in FIG. 1 , as a preferred embodiment of the present application, a heat preservation chamber 43 is mounted on the support frame 42. The advantage of this arrangement is that the heat preservation chamber 43 is lifted by the support frame 42 to reduce heat conduction. The heat preservation chamber 43 is used to accommodate the circulating fluid to achieve the function of heating or cooling. Specifically, as shown in FIG. Figure 8 and Fig. 9As shown, the insulation chamber 43 includes an insulation board 431, an outer cavity 432, an inner cavity 433, an upper insulation block 434 and a temperature measuring probe 435. The insulation board 431 is fixedly connected to the upper support plate 421. The outer cavity 432 is fixedly installed on the insulation board 431. The inner cavity 433 is fixedly installed on the insulation board 431 inside the outer cavity 432. The inner cavity 433 is used to accommodate circulating liquid. The outer cavity 432 and the inner cavity 433 are trapezoidal bodies. A plurality of liquid circulation pipes 436 are installed on the sides of the outer cavity 432 and the inner cavity 433. The liquid circulation pipes 436 pass through the outer cavity 432 and extend into the inner cavity 433. The liquid circulation pipes 436 are used to inject or discharge circulating liquid into the inner cavity 433.

[0047] An overflow pipe 437 is installed at the upper part of the inner cavity 433, and the overflow pipe 437 is used to discharge the circulating liquid exceeding the liquid level in the inner cavity 433. Liquid level sensors 438 are installed in the outer cavity 432 below the overflow pipe 437 at upper and lower intervals. The probe of the liquid level sensor 438 extends into the inner cavity 433. Fig. 9 As shown, a plurality of upper insulation blocks 434 are installed between the inner cavity 433 and the outer cavity 432. The upper insulation blocks 434 and the insulation plates 431 are used to reduce heat conduction between the outer cavity 432 and the inner cavity 433. Temperature measuring probes 435 are also installed on the outer cavity 432 and the inner cavity 433. The temperature measuring probes 435 are used to detect the temperature of the circulating fluid in the inner cavity 433.

[0048] like Figure 2 As shown, as a preferred embodiment of the present application, a lower bonding table 5 is installed in an inclined state in the temperature control module 4, and the lower bonding table 5 is used to install the lower substrate. The advantage of this arrangement is that the inclined state of the lower bonding table 5 allows the circulating liquid to gradually penetrate from the corners of the lower substrate and the upper substrate when the lower substrate and the upper substrate are bonded until the gap between the lower substrate and the upper substrate is filled. Compared with a horizontal arrangement, this method can reduce bubbling and improve the bonding effect.

[0049] Specifically, Fig.10 As shown, the lower bonding table 5 is a rectangular body for placing the lower substrate. A pair of lower joints 51 are installed on the side of the lower bonding table 5. The lower joints 51 are used to connect to the liquid supply equipment to inject or discharge the circulating liquid into the lower bonding table 5, so as to further maintain the lower substrate at the same temperature as the circulating liquid. A plurality of negative pressure joints 53 are also installed on the other side of the lower bonding table 5. The negative pressure joints 53 are used to connect to the vacuum pump to generate negative pressure. Optionally, a negative pressure hole 54 is provided on the lower bonding table 5, and the negative pressure hole 54 is connected to the negative pressure joint 53 for utilizing negative pressure to adsorb the lower substrate. As a preferred embodiment of the present application, the negative pressure joint 53 is connected to the liquid collecting bottle 13 on the cabinet 11 so as to temporarily store the circulating liquid in the inner cavity 433 sucked in by the negative pressure hole 54 to prevent the circulating liquid from entering the vacuum pump and causing damage.

[0050] The lower bonding platform 5 is internally layered with liquid channels and air channels. The advantage of this layered arrangement is that it prevents interference between the liquid channels and the air channels. The air channels are respectively connected to the negative pressure joint 53 and the negative pressure hole 54, and the liquid channels are connected to the lower joint 51. The lower bonding platform 5 is also provided with multiple groups of observation holes 52 at intervals. The observation holes 52 are used for visual positioning. Furthermore, the temperature control module 4 is provided with the same observation holes 52 at corresponding positions to eliminate visual obstruction. As a feasible implementation of the present application, each group of observation holes 52 corresponds to a substrate of a specific size. When a substrate of a larger size is replaced, multiple negative pressure joints 53 are connected to enhance the negative pressure capacity and improve the stability when the lower substrate is adsorbed.

[0051] like Figure 2 As shown, as a preferred embodiment of the present application, a visual positioning module 6 is fixedly installed on the base 1 on one side of the temperature control module 4, and the visual positioning module 6 extends into the temperature control module 4. The visual positioning module 6 is used to position the substrate. Fig.11 As shown, the visual positioning module 6 includes a positioning seat 61, a lifting platform 62, a driving motor 63, a pad 64, a fine-tuning bracket 65 and a camera 66. The positioning seat 61 is fixedly connected to the marble platform 12. The positioning seat 61 is a combination of a rectangular body and an I-shaped body. The lifting platform 62 is fixedly installed on the positioning seat 61, and the pad 64 is installed on the lifting platform 62. A driving motor 63 is installed on one side of the lifting platform 62. The driving motor 63 is connected to the lifting platform 62 through a ball screw combination and is used to drive the lifting platform 62 to move up and down. A fine-tuning bracket 65 is installed on the pad 64 on the other side of the lifting platform 62. Cameras 66 are respectively installed on the fine-tuning bracket 65 and the pad 64. The lens group of the camera 66 is arranged below the observation hole 52 for visual positioning of the substrate. The installation position of the camera 66 on the pad 64 is adjustable. When there are substrates of different sizes, the position of the camera 66 is disassembled and adjusted to align it with the new observation hole 52, so as to re-visually position it.

[0052] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0053] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0054] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A high-precision substrate bonding device in a very low temperature liquid environment, comprising a base (1), a protective cover (2), a pressing module (3), a temperature control module (4), a lower bonding platform (5) and a visual positioning module (6), characterized in that: A protective cover (2) is mounted on the base (1); a pressing module (3) is fixedly mounted on the base (1) inside the protective cover (2); the pressing module (3) is used to mount an upper substrate; a temperature control module (4) is obliquely mounted on the base (1) below the pressing module (3); a lower bonding platform (5) is obliquely mounted inside the temperature control module (4); the lower bonding platform (5) is used to mount a lower substrate; a visual positioning module (6) is fixedly mounted on the base (1) on one side of the temperature control module (4); the visual positioning module (6) extends into the temperature control module (4); the visual positioning module (6) is used to position the substrate.

2. A high-precision substrate bonding device in a very low temperature liquid environment according to claim 1, characterized in that: The base (1) is composed of a cabinet (11) and a marble platform (12). The marble platform (12) is installed in an inclined manner on the cabinet (11). A liquid collecting bottle (13) is installed on one side of the cabinet (11) for collecting filtered circulating liquid. The cabinet (11) is also provided with a cabinet door (14). An electrical control panel (15) is installed in the cabinet (11). A plurality of universal rollers (16) and foot cups (17) are symmetrically installed at the bottom of the cabinet (11). The foot cups (17) are used to adjust the base (1) to a horizontal state.

3. The high-precision substrate bonding device in a non-critical liquid environment according to claim 1, characterized in that: The pressing module (3) comprises a gantry (31), a ball screw pair (32), an assembly frame (33), a vacuum suction cup (34), an ultraviolet lamp (35) and a micro push rod (36). The gantry (31) is provided with the assembly frame (33) via the ball screw pair (32). The bottom of the assembly frame (33) is provided with a vacuum suction cup (34), and the vacuum suction cup (34) is used for adsorbing the upper substrate. The assembly frame (33) is also provided with an ultraviolet lamp (35) and a micro push rod (36).

4. The high-precision substrate bonding device in a very low temperature liquid environment according to claim 1, characterized in that: The temperature control module (4) comprises an adjustment seat (41), a support frame (42) and a heat preservation chamber (43); the adjustment seat (41) is fixedly mounted with the support frame (42); the heat preservation chamber (43) is mounted on the support frame (42); the support frame (42) is used to lift the heat preservation chamber (43) to reduce heat conduction; and the heat preservation chamber (43) is used to contain circulating fluid to achieve the function of heating or cooling.

5. The high-precision substrate bonding device in a non-critical liquid environment according to claim 4, characterized in that: The adjustment seat (41) comprises a lower adjustment plate (411), a movable block (412), an adjustment motor (413) and an upper adjustment plate (414); a plurality of adjustment slots (415) are symmetrically arranged on the lower adjustment plate (411); movable blocks (412) are installed in the adjustment slots (415); an adjustment motor (413) is installed on the lower adjustment plate (411) between the movable blocks (412); an output shaft of the adjustment motor (413) is connected to the movable block (412); the adjustment motor (413) is used to drive the movable block (412) to move in the adjustment slot (415); and an upper adjustment plate (414) is fixedly installed on the top of the movable block (412).

6. The high-precision substrate bonding device in a non-critical liquid environment according to claim 4, characterized in that: The support frame (42) comprises a lower support plate (420), an upper support plate (421), a support shaft (422), an isolation groove (423), a water immersion detector (424) and a drainage pipe (425). A plurality of support shafts (422) are fixedly installed on the lower support plate (420) in an interval manner. Both ends of the support shafts (422) are provided with shaft seats (426). The top of the support shaft (422) is fixedly installed with an upper support plate (421). A lower support plate (422) is installed between the upper support plate (421) and the shaft seat (426). An isolation block (427) is provided below the upper support plate (421) through an isolation block (428); the isolation groove (423) is connected to the lower support plate (420) through an auxiliary plate (429); a water immersion detector (424) is provided in the isolation groove (423); and drainage pipes (425) are provided on the isolation groove (423), the lower support plate (420) and the upper support plate (421), respectively. The drainage pipes (425) are used to discharge circulating liquid when liquid is introduced into the support frame (42).

7. The high-precision substrate bonding device in a non-critical liquid environment according to claim 4, characterized in that: The heat preservation cavity (43) comprises a heat insulation board (431), an outer cavity (432), an inner cavity (433), an upper heat insulation block (434) and a temperature measuring probe (435). The outer cavity (432) is fixedly mounted on the heat insulation board (431). The inner cavity (433) is fixedly mounted on the heat insulation board (431) inside the outer cavity (432). The inner cavity (433) is used to accommodate the circulating fluid. ) and the outer cavity (432), a plurality of upper insulation blocks (434) are installed between the outer cavity (432) and the inner cavity (433), the upper insulation blocks (434) and the insulation board (431) are used to reduce heat conduction between the outer cavity (432) and the inner cavity (433), and temperature measuring probes (435) are also inserted into the outer cavity (432) and the inner cavity (433), and the temperature measuring probes (435) are used to detect the temperature of the circulating fluid in the inner cavity (433).

8. The high-precision substrate bonding device in a non-critical liquid environment according to claim 7, characterized in that: The outer cavity (432) and the inner cavity (433) are trapezoidal bodies. A plurality of liquid circulation pipes (436) are installed on the sides of the outer cavity (432) and the inner cavity (433). The liquid circulation pipes (436) pass through the outer cavity (432) and extend into the inner cavity (433). The liquid circulation pipes (436) are used to inject or discharge circulating liquid into the inner cavity (433). An overflow pipe (437) is installed at the upper part of the inner cavity (433). The overflow pipe (437) is used to discharge circulating liquid exceeding the liquid level in the inner cavity (433). Liquid level sensors (438) are installed at upper and lower intervals in the outer cavity (432) below the overflow pipe (437). The probe of the liquid level sensor (438) extends into the inner cavity (433).

9. The high-precision substrate bonding device in a non-critical liquid environment according to claim 1, characterized in that: The lower bonding platform (5) is a rectangular body, used for placing the lower substrate. A pair of lower joints (51) are arranged on the side of the lower bonding platform (5). The lower joints (51) are used to connect to a liquid supply device, inject or discharge circulating liquid into the lower bonding platform (5), and further maintain the lower substrate at the same temperature as the circulating liquid. A plurality of negative pressure joints (53) are also arranged on the other side of the lower bonding platform (5). The negative pressure joints (53) are used to connect to a vacuum pump to generate negative pressure. A negative pressure hole (54) is arranged on the lower bonding platform (5). The negative pressure hole (54) is connected to the negative pressure joint (53) and is used to absorb the lower substrate by using negative pressure. A liquid flow channel and an air channel are arranged in layers inside the lower bonding platform (5). The air channel is connected to the negative pressure joint (53) and the negative pressure hole (54) respectively. The liquid flow channel is connected to the lower joint (51). A plurality of groups of observation holes (52) are also arranged at intervals on the lower bonding platform (5). The observation holes (52) are used for visual positioning.

10. The high-precision substrate bonding device in a very low temperature liquid environment according to claim 1, characterized in that: The visual positioning module (6) comprises a positioning seat (61), a lifting platform (62), a driving motor (63), a pad (64), a fine-tuning bracket (65) and a camera (66); the lifting platform (62) is fixedly mounted on the positioning seat (61); the pad (64) is mounted on the lifting platform (62); the driving motor (63) is mounted on one side of the lifting platform (62); the pad (64) on the other side of the lifting platform (62) is mounted on the fine-tuning bracket (65); and the camera (66) is mounted on the fine-tuning bracket (65) and the pad (64) respectively.

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