A high-precision substrate bonding device for very warm liquid environments

Abstract

The application relates to the technical field of panel display, in particular to a high-precision substrate laminating device for a very warm liquid environment. The device comprises a base, a protective cover, a pressing module, a temperature control module, a lower laminating table and a visual positioning module. The base is provided with the protective cover. The pressing module is fixedly installed on the base in the protective cover and used for installing an upper substrate. The temperature control module is installed on the base in an inclined manner below the pressing module. The lower laminating table is installed in the temperature control module in an inclined manner and used for installing a lower substrate. The visual positioning module is fixedly installed on the base at one side of the temperature control module and extends into the temperature control module and is used for positioning the substrate. The application has the advantages of high laminating precision, good size adaptability, provision of a very warm working environment and reduction of bubble phenomenon, solves the problems of low laminating precision, poor size adaptability, only suitable for normal temperature use and easy bubbling of existing substrate laminating equipment, and meets the needs of substrate lamination in a very warm liquid.

Description

Technical Field

[0001] This application relates to the field of panel display technology, specifically to a high-precision substrate bonding device in a very low temperature liquid environment. Background Technology

[0002] Display panels are components responsible for displaying images and text information, and they are widely used in electronic devices such as mobile phones, televisions, and displays. Display panels are typically multi-layered composite structures, and the materials and processing techniques of each substrate are different. Therefore, in the production process of display panels, it is necessary to first manufacture the functional substrates of each layer, and then bond and assemble the substrates to form a multi-layered overall panel. This process requires the use of corresponding bonding equipment to complete the assembly.

[0003] Existing substrate bonding devices typically use tooling fixtures to position the substrates, and then manually close the fixtures to bond the substrates together. This structure has low bonding accuracy, and the substrates may not be accurately aligned, leading to misalignment during bonding. This reduces the yield of display panels. Furthermore, the tooling fixtures are usually custom-made and only suitable for substrates of specific sizes. When there are panels of different sizes, it is difficult to adjust and adapt them, often requiring multiple sets of equipment to meet the requirements, which increases production costs.

[0004] Furthermore, due to process requirements, the new display panel needs to complete the substrate bonding process in an extremely low-temperature environment. Existing technologies only require room temperature for normal production and processing, so there is no mature technology reserve for extremely low-temperature environments. If conventional heating or cooling equipment is directly installed, the temperature control effect is limited and it is difficult to meet the temperature requirements of the process. Using a liquid solution can generate a uniform working temperature, but existing equipment is difficult to operate normally in a liquid environment and is also prone to bubbling during the bonding process, affecting the bonding effect. Therefore, a new substrate bonding device for an extremely low-temperature liquid environment is needed to solve the above-mentioned shortcomings. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a high-precision substrate bonding device for very low temperature liquid environment, which aims to solve the technical problems of low bonding accuracy, poor size adaptability, only suitable for room temperature use and easy bubbling in the existing substrate bonding devices.

[0006] To achieve the above objectives, this application provides a high-precision substrate bonding device for extremely cold liquid environments, including a base, a protective cover, a pressing module, a temperature control module, a lower bonding stage, and a visual positioning module. The protective cover is mounted on the base, and the pressing module is fixedly installed on the base inside the protective cover. The pressing module is used to install the upper substrate. The temperature control module is installed at an angle on the base below the pressing module, and the lower bonding stage is installed at an angle inside the temperature control module. The lower bonding stage is used to install the lower substrate. The visual positioning module is fixedly installed on the base on one side of the temperature control module and extends into the temperature control module. The visual positioning module is used to position the substrate.

[0007] In some embodiments, the base consists of a cabinet and a marble platform. The marble platform is installed at an angle on the cabinet. A collection bottle is installed on one side of the cabinet to collect the circulating liquid from the filter. The cabinet is also equipped with a cabinet door. An electrical control board is installed inside the cabinet. Multiple universal casters and feet are symmetrically installed at the bottom of the cabinet. The feet are used to adjust the base to a horizontal position.

[0008] In some embodiments, the pressing module includes a gantry frame, a ball screw assembly, an assembly frame, a vacuum suction cup, an ultraviolet lamp, and a miniature push rod. The assembly frame is mounted on the gantry frame via the ball screw assembly. A vacuum suction cup is mounted at the bottom of the assembly frame. The vacuum suction cup is used to adsorb the upper substrate. The assembly frame is also equipped with an ultraviolet lamp and a miniature push rod.

[0009] In some embodiments, the temperature control module includes an adjustment seat, a support frame, and a heat insulation cavity. The support frame is fixedly installed on the adjustment seat, and the heat insulation cavity is installed on the support frame. The support frame is used to raise the heat insulation cavity to reduce heat conduction, and the heat insulation cavity is used to contain circulating liquid to achieve the function of heating or cooling.

[0010] In some embodiments, the adjusting seat includes a lower adjusting plate, a movable block, an adjusting motor, and an upper adjusting plate. Multiple adjusting slots are symmetrically arranged on the lower adjusting plate, and the movable block is installed in the adjusting slot. An adjusting motor is installed on the lower adjusting plate between the movable blocks. The output shaft of the adjusting motor is connected to the movable block. The adjusting motor is used to drive the movable block to move in the adjusting slot. The upper adjusting plate is fixedly installed on the top of the movable block.

[0011] In some embodiments, the support frame includes a lower support plate, an upper support plate, support shafts, an isolation groove, a water immersion detector, and a drain pipe. Multiple support shafts are fixedly installed on the lower support plate at intervals. Shaft seats are mounted at both ends of the support shafts. An upper support plate is fixedly installed on the top of the support shafts. A lower heat insulation block is installed between the upper support plate and the shaft seats. An isolation groove is installed below the upper support plate via an isolation block. The isolation groove is connected to the lower support plate via an auxiliary plate. A water immersion detector is installed inside the isolation groove. Drain pipes are also installed on the isolation groove, the lower support plate, and the upper support plate, respectively. The drain pipes are used to discharge circulating liquid when the support frame is filled with liquid.

[0012] In some embodiments, the heat-insulating cavity includes a heat insulation plate, an outer cavity, an inner cavity, upper heat insulation blocks, and a temperature probe. The outer cavity is fixedly installed on the heat insulation plate, and the inner cavity is fixedly installed on the heat insulation plate inside the outer cavity. The inner cavity is used to contain circulating fluid. Multiple upper heat insulation blocks are installed between the inner cavity and the outer cavity. The upper heat insulation blocks and the heat insulation plate are used to reduce heat conduction between the outer cavity and the inner cavity. Temperature probes are also inserted into the outer cavity and the inner cavity. The temperature probes are used to detect the temperature of the circulating fluid in the inner cavity.

[0013] In some embodiments, the outer cavity and inner cavity are trapezoidal, and multiple liquid circulation pipes are installed on the sides of the outer cavity and inner cavity. The liquid circulation pipes extend through the outer cavity into the inner cavity and are used to inject or discharge circulating liquid into the inner cavity. An overflow pipe is installed at the upper part of the inner cavity and is used to discharge circulating liquid in the inner cavity that exceeds the liquid level. Liquid level sensors are installed vertically at intervals in the outer cavity below the overflow pipe, and the probes of the liquid level sensors extend into the inner cavity.

[0014] In some embodiments, the lower bonding platform is a rectangular body used to place the lower substrate. A pair of lower connectors are mounted on the side of the lower bonding platform for connecting to a liquid supply device to inject or discharge circulating liquid into the lower bonding platform, further maintaining the lower substrate at the same temperature as the circulating liquid. Multiple negative pressure connectors are also mounted on the other side of the lower bonding platform for connecting to a vacuum pump to generate negative pressure. Negative pressure holes are provided on the lower bonding platform, communicating with the negative pressure connectors to adsorb the lower substrate using negative pressure. The interior of the lower bonding platform is layered with liquid channels and air channels, with the air channels communicating with the negative pressure connectors and negative pressure holes respectively. The liquid channels communicate with the lower connectors. Multiple sets of observation holes are also spaced apart on the lower bonding platform for visual positioning.

[0015] In some embodiments, the visual positioning module includes a positioning base, a lifting platform, a drive motor, a pad, a fine-tuning bracket, and a camera. The lifting platform is fixedly installed on the positioning base, and the pad is installed on the lifting platform. The drive motor is installed on one side of the lifting platform, and the fine-tuning bracket is installed on the pad on the other side of the lifting platform. The camera is installed on the fine-tuning bracket and the pad respectively.

[0016] In some embodiments, the visual positioning module includes a positioning base, a lifting platform, a drive motor, a pad, a fine-tuning bracket, and a camera. The lifting platform is fixedly installed on the positioning base, and the pad is installed on the lifting platform. The drive motor is installed on one side of the lifting platform, and the fine-tuning bracket is installed on the pad on the other side of the lifting platform. The camera is installed on the fine-tuning bracket and the pad respectively.

[0017] The beneficial effects of the technical solution provided in this application include:

[0018] This application provides a high-precision substrate bonding device for very low temperature liquid environments, which has the advantages of high bonding accuracy, good size adaptability, providing a very low temperature working environment and reducing the occurrence of bubbles. It solves the problems of low bonding accuracy, poor size adaptability, only suitable for room temperature use and easy bubbling in existing substrate bonding equipment, and meets the needs of substrate bonding in very low temperature liquid environments.

[0019] This application uses a vision positioning module to position and correct the substrate, and uses an adjustment seat in the temperature control module to finely adjust the position of the substrate, ensuring accurate alignment, reducing misalignment, improving the accuracy of substrate bonding, and increasing the yield. The lower bonding stage of this application is equipped with multiple sets of observation holes, which can be used to replace substrates of different sizes and adjust the position of the vision positioning module to achieve vision positioning through the corresponding observation holes without changing the mold, thus having good size adaptability.

[0020] This application provides an extremely low-temperature working environment through an insulated cavity and uses a liquid circulation pipe to inject circulating fluid to reduce the temperature of the substrate, thus achieving substrate bonding under extremely low-temperature conditions. Furthermore, it utilizes structures such as support frames and heat insulation plates to reduce heat conduction, thereby maintaining the extremely low-temperature state. In addition, this application also includes a temperature control module with an inclined structure and a lower bonding stage, allowing the circulating fluid to gradually fill the gaps between the substrates from one side, reducing the occurrence of air bubbles and improving the substrate bonding effect. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of this application;

[0022] Figure 2 This is a three-dimensional structural diagram of the hidden protective shield portion of this application;

[0023] Figure 3 This is a three-dimensional structural diagram of the base of this application;

[0024] Figure 4 This is a three-dimensional structural diagram of the pressure module of this application;

[0025] Figure 5 This is a three-dimensional structural diagram of the temperature control module of this application;

[0026] Figure 6 This is a three-dimensional structural diagram of the adjustment seat of this application;

[0027] Figure 7 This is a three-dimensional structural diagram of the support frame of this application;

[0028] Figure 8 This is a three-dimensional structural diagram of the insulation cavity of this application;

[0029] Figure 9This is a half-sectional structural diagram of the insulation cavity of this application;

[0030] Figure 10 This is a three-dimensional structural diagram of the lower bonding platform of this application;

[0031] Figure 11 This is a three-dimensional structural diagram of the visual positioning module of this application.

[0032] In the picture:

[0033] 1. Base; 11. Cabinet; 12. Marble platform; 13. Collection bottle; 14. Cabinet door; 15. Electrical control board; 16. Casters; 17. Foot cups;

[0034] 2. Protective cover;

[0035] 3. Downward pressing module; 31. Gantry frame; 32. Ball screw pair; 33. Assembly rack; 34. Vacuum suction cup; 35. Ultraviolet lamp; 36. Miniature push rod;

[0036] 4. Temperature control module; 41. Adjustment seat; 411. Lower adjustment plate; 412. Movable block; 413. Adjustment motor; 414. Upper adjustment plate; 415. Adjustment groove; 42. Support frame; 420. Lower support plate; 421. Upper support plate; 422. Support shaft; 423. Isolation groove; 424. Water immersion detector; 425. Drain pipe; 426. Shaft seat; 427. Lower heat insulation block; 428. Isolation block; 429. Auxiliary plate; 43. Insulation cavity; 431. Heat insulation plate; 432. Outer cavity; 433. Inner cavity; 434. Upper heat insulation block; 435. Temperature probe; 436. Liquid circulation pipe; 437. Overflow pipe; 438. Liquid level sensor;

[0037] 5. Lower bonding platform; 51. Lower connector; 52. Inspection hole; 53. Negative pressure connector; 54. Negative pressure hole;

[0038] 6. Visual positioning module; 61. Positioning seat; 62. Lifting platform; 63. Drive motor; 64. Pad; 65. Fine-tuning bracket; 66. Camera. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] This application provides a high-precision substrate bonding device for a very low temperature liquid environment. It uses a visual positioning module 6 and an adjustment seat 41 to position and correct the substrate, provides a very low temperature working environment through an insulation cavity 43, and uses a liquid circulation pipe 436 to inject circulating liquid to reduce the temperature of the substrate. This realizes the substrate bonding function in a very low temperature environment and solves the problems of low bonding accuracy, poor size adaptability, only suitable for room temperature use, and easy bubbling in the prior art.

[0041] like Figure 1 and Figure 2 As shown, a high-precision substrate bonding device for extremely low-temperature liquid environments includes a base 1, a protective cover 2, a pressing module 3, a temperature control module 4, a lower bonding stage 5, and a vision positioning module 6. Specifically, as shown... Figure 3 As shown, the base 1 consists of a cabinet 11 and a marble platform 12. A liquid collection bottle 13 is installed on one side of the cabinet 11. The liquid collection bottle 13 is used to collect the circulating liquid from filtration. The cabinet 11 is also equipped with a cabinet door 14. An electrical control board 15 is installed inside the cabinet 11. Multiple universal casters 16 and feet 17 are symmetrically installed at the bottom of the cabinet 11. The feet 17 are used to adjust the base 1 to a horizontal state. The marble platform 12 is installed on the cabinet 11 at an angle. The marble platform 12 has the advantages of high strength, high hardness and good wear resistance.

[0042] like Figure 1 As shown, a protective cover 2 is mounted on the base 1. The protective cover 2 is a rectangular frame and is used to provide protection to prevent the device from being interfered with during operation.

[0043] like Figure 2 As shown, a pressing module 3 is fixedly installed on the base 1 inside the protective cover 2. The pressing module 3 is used to install the upper substrate. Specifically, as shown... Figure 4 As shown, the pressing module 3 includes a gantry frame 31, a ball screw assembly 32, an assembly frame 33, a vacuum suction cup 34, an ultraviolet lamp 35, and a miniature push rod 36. The gantry frame 31 is fixedly connected to the marble platform 12. The assembly frame 33 is mounted on the gantry frame 31 via the ball screw assembly 32. The ball screw assembly 32 is used to drive the assembly frame 33 to move up and down. The bottom of the assembly frame 33 is equipped with a vacuum suction cup 34, which is used to adsorb the upper substrate. The assembly frame 33 is also equipped with an ultraviolet lamp 35 and a miniature push rod 36. The ultraviolet lamp 35 is used to irradiate and cure the optical adhesive, so that the bonded upper and lower substrates are kept fixed.

[0044] like Figure 2 As shown, a temperature control module 4 is installed at an angle on the base 1 below the pressure module 3. Specifically, as shown... Figure 5 As shown, the temperature control module 4 includes an adjustment seat 41, a support frame 42, and a heat preservation cavity 43. Further, as... Figure 6 As shown, the adjusting seat 41 includes a lower adjusting plate 411, a movable block 412, an adjusting motor 413, and an upper adjusting plate 414. The lower adjusting plate 411 is fixedly connected to the marble platform 12. Multiple adjusting slots 415 are symmetrically arranged on the lower adjusting plate 411. The movable block 412 is installed in the adjusting slot 415, and the movable block 412 can move within the adjusting slot 415 with a limited range. The adjusting motor 413 is installed on the lower adjusting plate 411 between the movable blocks 412. The output shaft of the adjusting motor 413 is connected to the movable block 412. Optionally, the adjusting motor 413 and the movable block 412 are threadedly connected so that the adjusting motor 413 drives the movable block 412 to move in the adjusting slot 415. The upper adjusting plate 414 is fixedly installed on the top of the movable block 412. The upper adjusting plate 414 is synchronously displaced under the action of the movable block 412.

[0045] like Figure 6 As shown, in a preferred embodiment of this application, a support frame 42 is fixedly mounted on the adjusting seat 41, specifically, as follows: Figure 7 As shown, the support frame 42 includes a lower support plate 420, an upper support plate 421, a support shaft 422, an isolation groove 423, a water immersion detector 424, and a drain pipe 425. The lower support plate 420 is fixedly connected to the upper adjusting plate 414. Multiple support shafts 422 are fixedly installed on the lower support plate 420 at intervals. Shaft seats 426 are installed at both ends of the support shafts 422. The upper support plate 421 is fixedly installed on the top of the support shafts 422. A lower heat insulation block 427 is installed between the upper support plate 421 and the shaft seats 426. The lower heat insulation block 427 is used to reduce heat conduction between the upper support plate 421 and the support shafts 422. The upper support plate 421... Below, an isolation groove 423 is installed via an isolation block 428. The isolation block 428 is used to reduce heat conduction between the upper support plate 421 and the isolation groove 423. The isolation groove 423 is connected to the lower support plate 420 via an auxiliary plate 429. The isolation groove 423 and the lower support plate 420 are enclosed tanks used to temporarily store liquid when leakage occurs in the circulating liquid. A water immersion detector 424 is installed inside the isolation groove 423. Drain pipes 425 are also installed on the isolation groove 423, the lower support plate 420 and the upper support plate 421 respectively. The drain pipes 425 are used to promptly discharge the circulating liquid when the water immersion detector 424 detects liquid ingress, preventing contamination of the base 1.

[0046] like Figure 6 As shown, in a preferred embodiment of this application, the support frame 42 is equipped with a heat insulation cavity 43. The advantage of this arrangement is that the heat insulation cavity 43 is raised by the support frame 42, reducing heat conduction. The heat insulation cavity 43 is used to contain the circulating fluid to achieve the function of heating or cooling. Specifically, as shown... Figure 8 and Figure 9As shown, the heat insulation cavity 43 includes a heat insulation plate 431, an outer cavity 432, an inner cavity 433, an upper heat insulation block 434, and a temperature probe 435. The heat insulation plate 431 is fixedly connected to the upper support plate 421. The outer cavity 432 is fixedly installed on the heat insulation plate 431. The inner cavity 433 is fixedly installed on the heat insulation plate 431 inside the outer cavity 432. The inner cavity 433 is used to contain circulating fluid. The outer cavity 432 and the inner cavity 433 are trapezoidal. Multiple liquid circulation pipes 436 are installed on the sides of the outer cavity 432 and the inner cavity 433. The liquid circulation pipes 436 pass through the outer cavity 432 and extend into the inner cavity 433. The liquid circulation pipes 436 are used to inject or discharge circulating fluid into the inner cavity 433.

[0047] An overflow pipe 437 is installed at the upper part of the inner cavity 433. The overflow pipe 437 is used to discharge circulating liquid exceeding the liquid level in the inner cavity 433. Liquid level sensors 438 are installed vertically at intervals in the outer cavity 432 below the overflow pipe 437. The probes of the liquid level sensors 438 extend into the inner cavity 433. Figure 9 As shown, multiple upper heat insulation blocks 434 are installed between the inner cavity 433 and the outer cavity 432. The upper heat insulation blocks 434 and the heat insulation plate 431 are used to reduce heat conduction between the outer cavity 432 and the inner cavity 433. Temperature probes 435 are also inserted on the outer cavity 432 and the inner cavity 433. The temperature probes 435 are used to detect the temperature of the circulating fluid in the inner cavity 433.

[0048] like Figure 2 As shown, in a preferred embodiment of this application, a lower bonding platform 5 is installed in an inclined position inside the temperature control module 4. The lower bonding platform 5 is used to install the lower substrate. The advantage of this setting is that the inclined state of the lower bonding platform 5 allows the circulating liquid to gradually seep in from the corners of the lower substrate and the upper substrate when the lower substrate and the upper substrate are bonded, until the gap between the lower substrate and the upper substrate is filled. This method can reduce bubbling and improve the bonding effect compared with the horizontal setting.

[0049] Specifically, such as Figure 10 As shown, the lower bonding platform 5 is a rectangular body used to place the lower substrate. The side of the lower bonding platform 5 is equipped with a pair of lower connectors 51, which are used to connect to a liquid supply device to inject or discharge circulating liquid into the lower bonding platform 5, thereby maintaining the lower substrate at the same temperature as the circulating liquid. The other side of the lower bonding platform 5 is also equipped with a plurality of negative pressure connectors 53, which are used to connect to a vacuum pump to generate negative pressure. Optionally, the lower bonding platform 5 is provided with a negative pressure hole 54, which is connected to the negative pressure connector 53 to use negative pressure to adsorb the lower substrate. As a preferred embodiment of this application, the negative pressure connector 53 is connected to the liquid collection bottle 13 on the cabinet 11 to temporarily store the circulating liquid in the inner cavity 433 sucked in by the negative pressure hole 54, preventing the circulating liquid from entering the vacuum pump and causing damage.

[0050] The lower bonding platform 5 has internally layered liquid channels and air channels. This layered design prevents interference between the liquid and air channels. The air channels are connected to the negative pressure connector 53 and the negative pressure hole 54, respectively, while the liquid channels are connected to the lower connector 51. The lower bonding platform 5 also has multiple sets of observation holes 52 spaced apart for visual positioning. Furthermore, the temperature control module 4 has the same observation holes 52 at corresponding positions to eliminate visual obstruction. As a feasible implementation of this application, each set of observation holes 52 corresponds to a substrate of a specific size. When replacing with a larger substrate, multiple negative pressure connectors 53 are connected to enhance the negative pressure capability and improve the stability when adsorbing the lower substrate.

[0051] like Figure 2 As shown, in a preferred embodiment of this application, a visual positioning module 6 is fixedly installed on the base 1 on one side of the temperature control module 4. The visual positioning module 6 extends into the temperature control module 4 and is used to position the substrate. Figure 11 As shown, the visual positioning module 6 includes a positioning base 61, a lifting platform 62, a drive motor 63, a pad 64, a fine-tuning bracket 65, and a camera 66. The positioning base 61 is fixedly connected to the marble platform 12. The positioning base 61 is a combination of a rectangular body and an I-shaped body. The lifting platform 62 is fixedly installed on the positioning base 61. The pad 64 is installed on the lifting platform 62. The drive motor 63 is installed on one side of the lifting platform 62. The drive motor 63 is connected to the lifting platform 62 through a ball screw assembly and is used to drive the lifting platform 62 to move up and down. The fine-tuning bracket 65 is installed on the pad 64 on the other side of the lifting platform 62. The camera 66 is installed on the fine-tuning bracket 65 and the pad 64 respectively. The lens group of the camera 66 is set below the observation hole 52 and is used for visual positioning of the substrate. The installation position of the camera 66 on the pad 64 is adjustable. When there are substrates of different sizes, the position of the camera 66 is disassembled and adjusted to align it with the new observation hole 52, so that the visual positioning can be re-established.

[0052] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0053] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0054] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A high-precision substrate bonding device for extremely low temperature liquid environments, comprising a base (1), a protective cover (2), a pressing module (3), a temperature control module (4), a lower bonding stage (5), and a vision positioning module (6), characterized in that: A protective cover (2) is mounted on the base (1). A pressing module (3) is fixedly installed on the base (1) inside the protective cover (2). The pressing module (3) is used to install the upper substrate. A temperature control module (4) is installed at an angle on the base (1) below the pressing module (3). A lower bonding platform (5) is installed at an angle inside the temperature control module (4). The lower bonding platform (5) is used to install the lower substrate. A visual positioning module (6) is fixedly installed on the base (1) on one side of the temperature control module (4). The visual positioning module (6) extends into the temperature control module (4). The visual positioning module (6) is used to position the substrate. The temperature control module (4) includes a support frame (42) and a heat insulation cavity (43). The heat insulation cavity (43) is mounted on the support frame (42). The support frame (42) is used to lift the heat insulation cavity (43) to reduce heat conduction. The heat insulation cavity (43) includes a heat insulation plate (431), an outer cavity (432) and an inner cavity (433). The inner cavity (433) is fixedly installed on the heat insulation plate (431) inside the outer cavity (432). The heat insulation plate (431) is used to reduce the heat conduction between the outer cavity (432) and the inner cavity (433). Multiple liquid circulation pipes (436) are installed on the sides of the outer cavity (432) and the inner cavity (433). The liquid circulation pipes (436) extend through the outer cavity (432) into the inner cavity (433) for injecting or discharging circulating liquid into the inner cavity (433) so that the heat preservation cavity can contain circulating liquid to achieve heating or cooling and provide a non-temperature working environment.

2. The high-precision substrate bonding device for a very low temperature liquid environment according to claim 1, characterized in that: The base (1) consists of a cabinet (11) and a marble platform (12). The marble platform (12) is installed on the cabinet (11) at an angle. A collection bottle (13) is installed on one side of the cabinet (11) for collecting the circulating liquid of the filter. The cabinet (11) is also equipped with a cabinet door (14). An electrical control board (15) is installed inside the cabinet (11). Multiple universal casters (16) and foot cups (17) are symmetrically installed at the bottom of the cabinet (11). The foot cups (17) are used to adjust the base (1) to a horizontal state.

3. The high-precision substrate bonding device for a very low-temperature liquid environment according to claim 1, characterized in that: The pressing module (3) includes a gantry (31), a ball screw pair (32), an assembly frame (33), a vacuum suction cup (34), an ultraviolet lamp (35), and a miniature push rod (36). The assembly frame (33) is mounted on the gantry (31) via the ball screw pair (32). The bottom of the assembly frame (33) is equipped with a vacuum suction cup (34), which is used to adsorb the upper substrate. The assembly frame (33) is also equipped with an ultraviolet lamp (35) and a miniature push rod (36).

4. The high-precision substrate bonding device for a very low-temperature liquid environment according to claim 1, characterized in that: The temperature control module (4) includes an adjustment seat (41), on which a support frame (42) is fixedly installed. The heat preservation cavity (43) is used to contain the circulating liquid to achieve the function of heating or cooling.

5. The high-precision substrate bonding device for a very low temperature liquid environment according to claim 4, characterized in that: The adjustment seat (41) includes a lower adjustment plate (411), a movable block (412), an adjustment motor (413), and an upper adjustment plate (414). The lower adjustment plate (411) is symmetrically provided with multiple adjustment slots (415). The movable block (412) is installed in the adjustment slot (415). The adjustment motor (413) is installed on the lower adjustment plate (411) between the movable blocks (412). The output shaft of the adjustment motor (413) is connected to the movable block (412). The adjustment motor (413) is used to drive the movable block (412) to move in the adjustment slot (415). The upper adjustment plate (414) is fixedly installed on the top of the movable block (412).

6. The high-precision substrate bonding device for a very low temperature liquid environment according to claim 4, characterized in that: The support frame (42) includes a lower support plate (420), an upper support plate (421), a support shaft (422), an isolation groove (423), a water immersion detector (424), and a drain pipe (425). Multiple support shafts (422) are fixedly installed at intervals on the lower support plate (420). Shaft seats (426) are installed at both ends of the support shafts (422). The upper support plate (421) is fixedly installed on the top of the support shafts (422). A lower support is installed between the upper support plate (421) and the shaft seats (426). The heat insulation block (427) and the upper support plate (421) are equipped with an isolation groove (423) through an isolation block (428). The isolation groove (423) is connected to the lower support plate (420) through an auxiliary plate (429). A water immersion detector (424) is installed in the isolation groove (423). The isolation groove (423), the lower support plate (420) and the upper support plate (421) are also equipped with drain pipes (425). The drain pipes (425) are used to discharge circulating liquid when the support frame (42) is filled with liquid.

7. The high-precision substrate bonding device for a very low temperature liquid environment according to claim 4, characterized in that: The heat insulation cavity (43) includes an upper heat insulation block (434) and a temperature probe (435). An outer cavity (432) is fixedly installed on the heat insulation plate (431). Multiple upper heat insulation blocks (434) are installed between the inner cavity (433) and the outer cavity (432). The upper heat insulation blocks (434) are used to reduce heat conduction between the outer cavity (432) and the inner cavity (433). Temperature probes (435) are also inserted on the outer cavity (432) and the inner cavity (433). The temperature probes (435) are used to detect the temperature of the circulating liquid in the inner cavity (433).

8. The high-precision substrate bonding device for a very low temperature liquid environment according to claim 7, characterized in that: The outer cavity (432) and inner cavity (433) are trapezoidal bodies. An overflow pipe (437) is installed on the upper part of the inner cavity (433). The overflow pipe (437) is used to discharge the circulating liquid in the inner cavity (433) that exceeds the liquid level. A liquid level sensor (438) is installed at intervals in the outer cavity (432) below the overflow pipe (437). The probe of the liquid level sensor (438) extends into the inner cavity (433).

9. The high-precision substrate bonding device for a very low-temperature liquid environment according to claim 1, characterized in that: The lower bonding platform (5) is a rectangular body used to place the lower substrate. The side of the lower bonding platform (5) is equipped with a pair of lower connectors (51). The lower connectors (51) are used to connect to the liquid supply equipment to inject or discharge circulating liquid into the lower bonding platform (5) to further maintain the lower substrate at the same temperature as the circulating liquid. The other side of the lower bonding platform (5) is also equipped with multiple negative pressure connectors (53). The negative pressure connectors (53) are used to connect to the vacuum pump to generate negative pressure. The lower bonding platform (5) is provided with negative pressure holes (54). The negative pressure holes (54) are connected to the negative pressure connectors (53) to use negative pressure to adsorb the lower substrate. The interior of the lower bonding platform (5) is provided with liquid flow channels and air channels in layers. The air channels are connected to the negative pressure connectors (53) and the negative pressure holes (54) respectively. The liquid flow channels are connected to the lower connectors (51). The lower bonding platform (5) is also provided with multiple sets of observation holes (52) at intervals. The observation holes (52) are used for visual positioning.

10. The high-precision substrate bonding device for a very low temperature liquid environment according to claim 1, characterized in that: The visual positioning module (6) includes a positioning base (61), a lifting platform (62), a drive motor (63), a pad (64), a fine-tuning bracket (65), and a camera (66). The lifting platform (62) is fixedly installed on the positioning base (61), and the pad (64) is installed on the lifting platform (62). The drive motor (63) is installed on one side of the lifting platform (62), and the fine-tuning bracket (65) is installed on the pad (64) on the other side of the lifting platform (62). The camera (66) is installed on the fine-tuning bracket (65) and the pad (64), respectively.

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