MEMS probe wet electroplating device

Abstract

The invention discloses an MEMS probe wet electroplating device in the field of semiconductor probes, and the MEMS probe wet electroplating device comprises an electroplating pool, the electroplating pool is provided with a plurality of liquid tanks which are sequentially arranged in the transverse direction, the left side and the right side of the electroplating pool are correspondingly provided with side vertical seats, and the two side vertical seats are symmetrically distributed on the left side and the right side of the electroplating pool; supporting seats are arranged at the tops of the two side vertical seats, first transverse guide rails are arranged on the supporting seats, a transverse moving seat capable of transversely moving is movably connected to the two first guide rails, two parallel second longitudinal guide rails are arranged on the lower side of the transverse moving seat, a longitudinal moving seat is movably connected to the two second guide rails, and a lead screw lifting machine is arranged on the lower side of the longitudinal moving seat. The working end of the lead screw elevator faces downwards and is connected with a movable tank body for placing a probe; and a corresponding liquid tank of the electroplating tank is connected with an automatic liquid preparation pipeline assembly. According to the invention, the concentration of the medicament is controlled, the yield of the product and the stability of the process are greatly improved, and the electroplating efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor probes, and in particular relates to a MEMS probe wet electroplating device. Background Art

[0002] In the history of semiconductor development, probes are used to detect defective chips on wafers before they are packaged and remove them, thereby avoiding cost waste and low yield caused by discovering problems after packaging, and ensuring that each chip meets the design specifications and performance consistency. Therefore, the introduction of probes is hailed as a milestone in semiconductor chip wafer-level testing.

[0003] At present, the high-end probe industry is mainly divided into cantilever probes, vertical probes and MEMS probes. Cantilever probes are mainly used for wafer testing of display drivers, logic and memory devices. Vertical probes are mainly used for testing mobile phone processor chips, GPU chips or RF chips. With the continuous development of semiconductor technology, the size of bumps on chips has decreased, the number has increased, the pad metal layer and the dielectric layer between low-k layers have become thinner, and vertical probes have become difficult to meet. Therefore, micro MEMS probes with higher accuracy, higher sensitivity, higher stability and finer diameter (less than 25.4μm) have emerged.

[0004] MEMS probes are extremely fine and their quality requirements are even more stringent, so it is particularly important to control the probe yield.

[0005] Wet chemical plating is a key process for MEMS probes, but it has the following problems: 1. Electrochemical reaction will occur when the MEMS probe is plated in the plating agent, which will cause the concentration of the plating agent to change. The stability of the agent concentration is also the key to the product yield. Unstable chemical agent concentration will seriously increase the surface defects of the product. Currently, the entire industry has not found a reasonable solution, and the product yield is extremely unstable. 2. When plating the MEMS probe, personnel are required to move the probes to the corresponding agent tanks one by one, resulting in low efficiency. Summary of the invention

[0006] The purpose of the present invention is to provide a MEMS probe wet electroplating device, which aims to solve the problems of unstable product yield and low probe electroplating efficiency caused by fluctuations in chemical agent concentration in the current MEMS probe wet chemical electroplating; spectral analysis technology is applied to the field of MEMS probe wet electroplating to achieve the control of agent concentration, greatly improve the product yield and process stability, and improve the electroplating efficiency.

[0007] The objective of the present invention is achieved as follows: A MEMS probe wet electroplating device comprises an electroplating pool, wherein the electroplating pool is provided with a plurality of liquid tanks arranged in sequence along the transverse direction, a side stand is arranged corresponding to the left and right sides of the electroplating pool, the side stand is parallel to the length direction of the electroplating pool, two side stands are symmetrically distributed on the left and right sides of the electroplating pool, a support seat is arranged on the top of the two side stands, a transverse guide rail 1 is arranged on the support seat, a transverse movement seat that can be moved laterally is movably connected to the two guide rails 1, two parallel longitudinal guide rails 2 are arranged on the lower side of the transverse movement seat, a longitudinal movement seat is movably connected to the two guide rails 2, a screw lift is arranged on the lower side of the longitudinal movement seat, the working end of the screw lift faces downward and is connected to a movable tank body for placing the probe, the movable tank body is arranged corresponding to the electroplating pool, and an automatic liquid distribution pipeline assembly is connected to the corresponding liquid tank of the electroplating pool.

[0008] The mounting plate of the present invention is positioned and placed in the movable tank body, and then the screw lift drives the mechanical arm grasping the movable tank body to move up and down, the longitudinal movement seat drives the probe to move longitudinally, and the transverse movement seat drives the probe to move transversely, so that the probe is placed in each liquid tank in turn for electroplating or cleaning, thereby improving the efficiency of automatic electroplating. Compared with the prior art, the beneficial effects of the present invention are: MEMS probe wet electroplating equipment, the composition of the plating solution in the third liquid tank is: sodium hydroxide with a mass concentration ratio of 7-8%, sodium carbonate with a mass concentration ratio of 39-40%, sodium silicate with a mass concentration ratio of 49-50%, and the balance is water; the composition of the plating solution in the fifth liquid tank is: aminosulfonic acid with a mass concentration ratio of 4-6%, sulfuric acid with a mass concentration ratio of 2-3%, and the balance is water; the drying tank is an empty tank; the composition of the plating solution in the eleventh liquid tank is: sodium gold sulfite with a mass concentration ratio of 7-9%, ethylenediamine with a mass concentration ratio of 3.5-4.5%, sodium sulfite with a mass concentration ratio of 7-10%, copper sulfate with a mass concentration ratio of 16-18%, and the balance is water. Introduce absorption spectroscopy concentration analyzer on the reagent circulation pipeline of slots 3, 5, and 11, and connect the instrument network to the PLC control system of the MEMS probe wet electroplating equipment. During the production process, set the concentration data to be collected every 10s-30s and uploaded to the equipment control system. Through system analysis, when the concentration is low, the control system will add the corresponding dose of reagent stock solution according to the concentration value. When the concentration is high, it will be adjusted with pure water to maintain the concentration stability and ensure the stability of product yield.

[0009] As a further improvement of the present invention, thirteen liquid tanks are provided on the electroplating pool, and the upper part of each liquid tank is open.

[0010] As a further improvement of the present invention, the height of the side stand is higher than the height of the electroplating tank, at least two sliders 1 spaced laterally are provided on the left and right sides of the lower surface of the transverse shift seat, each slider 1 is movably connected to the corresponding guide rail 1, a rack is provided laterally on the outer side of any guide rail 1, an L-shaped mounting seat is provided on the transverse shift seat corresponding to the rack, a driving motor is provided on the mounting seat, the output shaft of the driving motor faces downward and is provided with a gear, the gear is meshed with the rack. The driving motor drives the gear to roll along the rack, drives the transverse shift seat to move laterally, and the guide rail 1 and the slider 1 provide guidance.

[0011] As a further improvement of the present invention, at least two sliders 2 spaced longitudinally are provided on both sides of the upper surface of the longitudinal displacement seat, the sliders 2 are T-shaped, and each slider 2 is movably connected to the corresponding guide rail 2. Two mounting supports symmetrically distributed on the left and right sides are provided on the lower side of the longitudinal displacement seat, and longitudinal lead screws are rotatably provided on the two mounting supports, and either end of the lead screw passes through a mounting support and is transmission-connected to the reduction motor. The lead screw is located between the two rows of sliders 2 on the left and right sides, and a lead screw nut is sleeved on the lead screw, which is transmission-connected to the longitudinal displacement seat. When the lead screw rotates, the lead screw nut drives the longitudinal displacement seat to move longitudinally, and the guide rail 2 and the slider 2 provide guidance.

[0012] As a further improvement of the present invention, the working end of the screw lift is provided with a longitudinal mechanical arm, and mechanical grippers are provided at both ends of the lower side of the mechanical arm. The cross section of the mobile tank body in the vertical direction is composed of a rectangle at the top and an inverted trapezoid at the bottom. The cross section of the mobile tank body in the horizontal direction is rectangular. Vertical insertion grooves are provided on the inner walls on both sides of the mobile tank body. The left and right edges of the mounting plate are vertically matched and inserted into the insertion grooves on both sides. Multiple MEMS probes are vertically arranged on the mounting plate, and the top of the mounting plate is located below the top of the mobile tank body in the vertical direction. The two mechanical grippers of the mechanical arm clamp the handles on the left and right sides of the top of the mobile tank body respectively. The upper part of the mobile tank body is open, and the surroundings and bottom of the mobile tank body are all covered with multiple through holes, and the aperture of the through holes is 1-2mm. The probe is positioned and placed in the mobile tank body through the mounting plate, and the liquid enters the mobile tank body through the through hole to electroplate or clean the probe on the mounting plate.

[0013] As a further improvement of the present invention, the first liquid tank is an empty tank, the second liquid tank is an overflow cleaning tank, the third liquid tank is an electroplating liquid tank, the fourth liquid tank is an overflow cleaning tank, the fifth liquid tank is an electroplating liquid tank, the sixth liquid tank is an overflow cleaning tank, the seventh liquid tank is an overflow cleaning tank, the eighth liquid tank is an overflow cleaning tank, the ninth liquid tank is a drying tank, the tenth liquid tank is an overflow cleaning tank, the eleventh liquid tank is an electroplating liquid tank, the twelfth liquid tank is an overflow cleaning tank, and the thirteenth liquid tank is a slow pull cleaning tank.

[0014] As a further improvement of the present invention, each of the overflow cleaning tanks is filled with clean water, and the slow-pull cleaning tank is also filled with clean water. Side tanks are provided on the left and right sides of each overflow cleaning tank, and the top height of the side tanks is higher than the top height of the overflow cleaning tank. The liquid in the overflow cleaning tank overflows into the side tanks; the composition of the electroplating solution in the third liquid tank is: sodium hydroxide with a mass concentration ratio of 7-8%, sodium carbonate with a mass concentration ratio of 39-40%, sodium silicate with a mass concentration ratio of 49-50%, and the remainder is water; the composition of the electroplating solution in the fifth liquid tank is: mass concentration ratio of 7-8% sodium hydroxide, mass concentration ratio of 39-40%, mass concentration ratio of 49-50%, and the remainder is water. The concentration ratio of aminosulfonic acid is 4-6%, the mass concentration ratio of sulfuric acid is 2-3%, and the balance is water; the drying tank is an empty tank; the composition of the electroplating solution in the eleventh liquid tank is: sodium gold sulfite with a mass concentration ratio of 7-9%, ethylenediamine with a mass concentration ratio of 3.5-4.5%, sodium sulfite with a mass concentration ratio of 7-10%, copper sulfate with a mass concentration ratio of 16-18%, and the balance is water; the sides of the fourth, sixth and eighth liquid tanks are connected to quick-drain pipes, and a number of spray heads are provided corresponding to the probes in the fourth, sixth and eighth liquid tanks. The two mechanical grippers of the robotic arm grasp the mobile tank body and send the probe on the mounting plate to the top of the first liquid tank for waiting; then send the probe to the second liquid tank for cleaning; then send the probe to the third liquid tank for electroplating, and control the temperature of the electroplating solution to 45-55 degrees Celsius; then send the probe to the fourth liquid tank, first spray it with clean water on the top, and then enter the tank for cleaning; then send the probe to the fifth liquid tank for electroplating, and the temperature of the electroplating solution is 45-55 degrees Celsius; then send the probe to the sixth liquid tank, first spray it with clean water on the top , and then enter the tank for cleaning; then send the probe into the seventh liquid tank for cleaning; then send the probe into the eighth liquid tank, first spray it with clean water on the top, and then enter the tank for cleaning; then send the probe into the ninth liquid tank for drying; then send the probe into the tenth liquid tank for cleaning; then send the probe into the eleventh liquid tank for electroplating, the plating liquid temperature is 55-65 degrees Celsius; then send the probe into the twelfth liquid tank for cleaning; finally, send the probe into the thirteenth liquid tank, and slowly pull the probe upwards for the last cleaning.

[0015] As a further improvement of the present invention, each of the electroplating tanks is provided with an automatic liquid distribution pipeline assembly, which includes two side tank bodies arranged on the left and right sides of the corresponding electroplating tank, the top height of the side tank body is higher than the top height of the electroplating tank, the liquid in the electroplating tank overflows into the side tank body, the bottom of any side tank body is connected to the bottom of the corresponding electroplating tank through a circulation pipeline, the circulation pipeline is provided with a control valve, an absorption spectrometry concentration meter, a circulation pump, a heater, a filter and a flow display meter in sequence, the sides of the electroplating tank are connected with an emptying pipe, and the emptying pipe is provided with an emptying opening and closing valve. The absorption spectrometry concentration meter measures the concentration of each solvent in the electroplating solution, and the electroplating tank is connected with a number of corresponding pipelines for adding each component solvent of the electroplating solution and a pure water pipeline, and the addition of solvents or the increase or decrease of concentration is achieved through the pipeline. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the electroplating cell of the present invention.

[0017] Figure 2 This is a schematic diagram of the structure of the automatic liquid distribution pipeline assembly of the electroplating tank.

[0018] Figure 3 A side view of the electroplating tank.

[0019] Figure 4 It is a side view of the longitudinal shift seat.

[0020] Figure 5 It is a cross-sectional view of the mobile tank in the horizontal direction.

[0021] Figure 6 A side view of the overflow cleaning tank.

[0022] Among them, 1 electroplating tank, 2 liquid tank, 3 side stand, 4 support seat, 5 guide rail 1, 6 transverse seat, 7 guide rail 2, 8 longitudinal seat, 9 screw lift, 10 moving trough body, 11 slider 1, 12 rack, 13 mounting seat, 14 driving motor, 15 gear, 16 slider 2, 17 mounting support, 18 screw, 19 reduction motor, 20 screw nut, 21 mechanical arm, 22 mechanical clamp, 23 insertion slot, 24 mounting plate, 25 MEMS probe, 26 handle, 27 side trough body, 28 circulation pipeline, 29 control valve, 30 absorption spectrometry concentration meter, 31 circulation pump, 32 heater, 33 filter, 34 flow display meter, 35 drain pipe, 36 drain opening and closing valve. DETAILED DESCRIPTION

[0023] like Figure 1-6As shown, a MEMS probe wet electroplating device comprises an electroplating pool 1, on which a plurality of liquid tanks 2 arranged in sequence along the transverse direction are opened, and a side stand 3 is arranged corresponding to the left and right sides of the electroplating pool 1, and the side stand 3 is parallel to the length direction of the electroplating pool 1, and the two side stands 3 are symmetrically distributed on the left and right sides of the electroplating pool 1, and a support seat 4 is arranged on the top of the two side stands 3, and a transverse guide rail 1 5 is arranged on the support seat 4, and a transverse movement seat 6 that can be moved laterally is movably connected to the two guide rails 1 5, and two parallel longitudinal guide rails 2 7 are arranged on the lower side of the transverse movement seat 6, and a longitudinal movement seat 8 is movably connected to the two guide rails 2 7, and a screw lift 9 is arranged on the lower side of the longitudinal movement seat 8, and the working end of the screw lift 9 faces downward and is connected to a movable tank body 10 for placing the probe, and the movable tank body 10 is arranged corresponding to the electroplating pool 1, and an automatic liquid distribution pipeline assembly is connected to the corresponding liquid tank 2 of the electroplating pool 1.

[0024] There are thirteen liquid tanks 2 on the electroplating pool 1, and the upper part of each liquid tank 2 is open. The height of the side stand 3 is higher than the height of the electroplating pool 1. At least two sliders 11 spaced laterally are provided on the left and right sides of the lower surface of the transverse displacement seat 6. Each slider 11 is movably connected with the corresponding guide rail 5. A rack 12 is provided laterally on the outer side of any guide rail 5. An L-shaped mounting seat 13 is provided on the transverse displacement seat 6 corresponding to the rack 12. A driving motor 14 is provided on the mounting seat 13. The output shaft of the driving motor 14 faces downward and is provided with a gear 15. The gear 15 is meshed with the rack 12. The driving motor 14 drives the gear 15 to roll along the rack 12, driving the transverse displacement seat 6 to move laterally, and the guide rail 5 and the slider 11 provide guidance. At least two sliders 16 spaced longitudinally are provided on both sides of the upper surface of the longitudinal shift seat 8. The sliders 16 are T-shaped. Each slider 16 is movably connected to the corresponding guide rail 7. Two mounting supports 17 symmetrically distributed on the lower side of the longitudinal shift seat 8 are provided. A longitudinal lead screw 18 is rotatably provided on the two mounting supports 17. Either end of the lead screw 18 passes through a mounting support 17 and is transmission-connected to a reduction motor 19. The lead screw 18 is located between the two rows of sliders 16 on the left and right sides. A lead screw nut 20 is sleeved on the lead screw 18. The lead screw nut 20 is transmission-connected to the longitudinal shift seat 8. When the lead screw 18 rotates, the lead screw nut 20 drives the longitudinal shift seat 8 to move longitudinally, and the guide rail 7 and the slider 16 provide guidance.

[0025] A longitudinal mechanical arm 21 is provided at the working end of the screw lift 9, and mechanical clamps 22 are provided at the left and right ends of the lower side of the mechanical arm 21. The cross-section of the mobile trough body 10 in the vertical direction is composed of a rectangle at the top and an inverted trapezoid at the bottom. The cross-section of the mobile trough body 10 in the horizontal direction is rectangular. Vertical insertion grooves 23 are provided on the left and right inner walls of the mobile trough body 10. The left and right side edges of the mounting plate 24 are vertically inserted into the insertion grooves 23 on both sides. A plurality of MEMS probes 25 are vertically arranged on the mounting plate 24, and the top of the mounting plate 24 is located below the top of the mobile trough body 10 in the vertical direction. The two mechanical clamps 22 of the mechanical arm 21 respectively clamp the handles 26 on the left and right sides of the top of the mobile trough body 10. The upper part of the mobile trough body 10 is open, and the surroundings and bottom of the mobile trough body 10 are covered with a plurality of through holes, and the aperture of the through holes is 1-2 mm. The probe is positioned and placed in the movable tank body 10 through the mounting plate 24 , and the liquid enters the movable tank body 10 through the through hole to electroplate or clean the probe on the mounting plate 24 .

[0026] The first liquid tank 2 is an empty tank, the second liquid tank 2 is an overflow cleaning tank, the third liquid tank 2 is an electroplating liquid tank, the fourth liquid tank 2 is an overflow cleaning tank, the fifth liquid tank 2 is an electroplating liquid tank, the sixth liquid tank 2 is an overflow cleaning tank, the seventh liquid tank 2 is an overflow cleaning tank, the eighth liquid tank 2 is an overflow cleaning tank, the ninth liquid tank 2 is a drying tank, the tenth liquid tank 2 is an overflow cleaning tank, the eleventh liquid tank 2 is an electroplating liquid tank, the twelfth liquid tank 2 is an overflow cleaning tank, and the thirteenth liquid tank 2 is a slow pull cleaning tank.

[0027] Each of the overflow cleaning tanks is filled with clean water, and the slow-pull cleaning tank is also filled with clean water. Side tanks 27 are provided on the left and right sides of each overflow cleaning tank. The top height of the side tanks 27 is higher than the top height of the overflow cleaning tank, and the liquid in the overflow cleaning tank overflows into the side tanks 27; the composition of the electroplating solution in the third liquid tank 2 is: sodium hydroxide with a mass concentration ratio of 7-8%, sodium carbonate with a mass concentration ratio of 39-40%, sodium silicate with a mass concentration ratio of 49-50%, and the remainder is water; the composition of the electroplating solution in the fifth liquid tank 2 is: mass concentration ratio The composition of the electroplating solution in the eleventh liquid tank 2 is: 4-6% aminosulfonic acid, 2-3% sulfuric acid by mass concentration, and the balance is water; the drying tank is an empty tank; the composition of the electroplating solution in the eleventh liquid tank 2 is: 7-9% sodium sulfite by mass concentration, 3.5-4.5% ethylenediamine by mass concentration, 7-10% sodium sulfite by mass concentration, 16-18% copper sulfate by mass concentration, and the balance is water; the sides of the fourth, sixth and eighth liquid tanks 2 are connected with quick exhaust pipes, and a number of spray heads are provided corresponding to the probes in the fourth, sixth and eighth liquid tanks 2. The two mechanical grippers 22 of the mechanical arm 21 grasp the movable tank body 10 and send the probe on the mounting plate 24 to the top of the first liquid tank 2 for waiting; then send the probe to the second liquid tank 2 for cleaning; then send the probe to the third liquid tank 2 for electroplating, and control the temperature of the electroplating solution to be 45-55 degrees Celsius; then send the probe to the fourth liquid tank 2, first spray it with clean water on the top, and then enter the tank for cleaning; then send the probe to the fifth liquid tank 2 for electroplating, and the temperature of the electroplating solution is 45-55 degrees Celsius; then send the probe to the sixth liquid tank 2, first spray it with clean water on the top The probe is then sent into the seventh liquid tank 2 for cleaning; the probe is then sent into the eighth liquid tank 2, where it is first sprayed with clean water and then entered into the tank for cleaning; the probe is then sent into the ninth liquid tank 2 for drying; the probe is then sent into the tenth liquid tank 2 for cleaning; the probe is then sent into the eleventh liquid tank 2 for electroplating, and the temperature of the electroplating solution is 55-65 degrees Celsius; the probe is then sent into the twelfth liquid tank 2 for cleaning; finally, the probe is sent into the thirteenth liquid tank 2, and the probe is slowly pulled upward for the last cleaning.

[0028] Each of the electroplating tanks is provided with an automatic liquid distribution pipeline assembly, which includes two side tank bodies 27 arranged on the left and right sides of the corresponding electroplating tank. The top height of the side tank body 27 is higher than the top height of the electroplating tank. The liquid in the electroplating tank overflows into the side tank body 27. The bottom of any side tank body 27 is connected to the bottom of the corresponding electroplating tank through a circulation pipeline 28. The circulation pipeline 28 is sequentially provided with a control valve 29, an absorption spectrometry concentration meter 30, a circulation pump 31, a heater 32, a filter 33 and a flow display meter 34. The sides of the electroplating tanks are connected with an emptying pipe 35, and the emptying pipe 35 is provided with an emptying opening and closing valve 36. The absorption spectrometry concentration meter 30 measures the concentration of each solvent in the electroplating solution. The electroplating tank is connected with a number of corresponding pipelines for adding each component solvent of the electroplating solution and a pure water pipeline, and the addition of solvents or the increase or decrease of concentration is achieved through the pipelines.

[0029] The mounting plate 24 of the present invention is positioned and placed in the movable trough body 10, and then the screw lift 9 drives the mechanical arm 21 grasping the movable trough body 10 to move up and down, the longitudinal movement seat 8 drives the probe to move longitudinally, and the transverse movement seat 6 drives the probe to move transversely, so that the probe is placed in each liquid tank 2 in turn for electroplating or cleaning, thereby improving the efficiency of automatic electroplating. The advantages of the present invention are: MEMS probe 25 wet electroplating equipment, the composition of the electroplating solution in the third liquid tank 2 is: sodium hydroxide with a mass concentration ratio of 7-8%, sodium carbonate with a mass concentration ratio of 39-40%, sodium silicate with a mass concentration ratio of 49-50%, and the balance is water; the composition of the electroplating solution in the fifth liquid tank 2 is: aminosulfonic acid with a mass concentration ratio of 4-6%, sulfuric acid with a mass concentration ratio of 2-3%, and the balance is water; the drying tank is an empty tank; the composition of the electroplating solution in the eleventh liquid tank 2 is: sodium gold sulfite with a mass concentration ratio of 7-9%, ethylenediamine with a mass concentration ratio of 3.5-4.5%, sodium sulfite with a mass concentration ratio of 7-10%, copper sulfate with a mass concentration ratio of 16-18%, and the balance is water. Introduce absorption spectroscopy concentration analyzer on the reagent circulation pipeline of slots 3, 5, and 11, and connect the instrument network to the PLC control system of the MEMS probe 25 wet electroplating equipment. During the production process, set the concentration data to be collected every 10s-30s and uploaded to the equipment control system. Through system analysis, when the concentration is low, the control system will add the corresponding dose of reagent stock solution according to the concentration value. When the concentration is high, it will be adjusted by pure water to maintain the concentration stability and ensure the stability of product yield.

[0030] When the present invention is working, the equipment automatically prepares liquid according to the set concentration in the automatic liquid replacement mode, and the preparation time is about 30 minutes; after the liquid preparation is completed, the equipment automatically starts the reagent heating cycle, and at the same time, after the tank temperature reaches the process temperature, the concentration collection function is automatically turned on and the concentration is collected every 10s-30s to control the concentration fluctuation to be stable within the set value ±0.1%; after the reagent is prepared, the corresponding process that has been set is selected, and the product is put into the equipment (1200 probes are installed on each mounting plate 24); during the operation, the reagent concentration will be continuously collected and uploaded, and the system will make adjustments to the liquid replenishment according to the feedback concentration data to maintain the stability of the reagent concentration; after the process is completed, the product will be dried and transferred to the inspection department for product surface quality inspection.

[0031] The present invention can maintain the concentration fluctuation of the MEMS probe 25 wet electroplating equipment within ±0.1%, greatly improving the process capability of the product. According to the test, the research can improve the probe yield by about 9%, control surface defects such as surface dirt and floccules within 3%, and process defects such as bumps and metal contamination within 1%.

[0032] The present invention is not limited to the above-mentioned embodiments. On the basis of the technical solution disclosed in the present invention, technicians in this field can make some substitutions and deformations to some technical features therein according to the disclosed technical content without creative labor, and these substitutions and deformations are all within the protection scope of the present invention.

Claims

1. A MEMS probe wet electroplating device, comprising an electroplating pool, wherein the electroplating pool is provided with a plurality of liquid tanks arranged in sequence in a transverse direction, characterized in that: A side stand is provided corresponding to the left and right sides of the electroplating pool, the side stand is parallel to the length direction of the electroplating pool, the two side stands are symmetrically distributed on the left and right sides of the electroplating pool, a support seat is provided on the top of the two side stands, a transverse guide rail 1 is provided on the support seat, the two guide rails 1 are movably connected with a transverse movement seat that can move laterally, two parallel longitudinal guide rails 2 are provided on the lower side of the transverse movement seat, the two guide rails 2 are movably connected with a longitudinal movement seat, a screw lift is provided on the lower side of the longitudinal movement seat, the working end of the screw lift faces downward and is connected to a movable trough body for placing a probe, the movable trough body is provided corresponding to the electroplating pool, and an automatic liquid distribution pipeline assembly is connected to the corresponding liquid tank of the electroplating pool.

2. A MEMS probe wet electroplating device according to claim 1, characterized in that: There are thirteen liquid tanks on the electroplating pool, and the upper part of each liquid tank is open.

3. A MEMS probe wet electroplating device according to claim 1 or 2, characterized in that: The height of the side stand is higher than that of the electroplating pool. At least two sliders spaced laterally are provided on the left and right sides of the lower surface of the transverse shift seat. Each slider is movably connected to a corresponding guide rail. A rack is provided laterally on the outer side of any guide rail. An L-shaped mounting seat is provided on the transverse shift seat corresponding to the rack. A driving motor is provided on the mounting seat. The output shaft of the driving motor faces downward and is provided with a gear, which meshes with the rack.

4. A MEMS probe wet electroplating device according to claim 1 or 2, characterized in that: At least two sliders 2 spaced longitudinally are provided on the left and right sides of the upper surface of the longitudinal movement seat, and the sliders 2 are T-shaped. Each slider 2 is movably connected to the corresponding guide rail 2. Two mounting supports symmetrically distributed on the left and right sides are provided on the lower side of the longitudinal movement seat. A longitudinal lead screw is rotatably provided on the two mounting supports. Either end of the lead screw passes through a mounting support and is transmission-connected to the reduction motor. The lead screw is located between the two rows of sliders 2 on the left and right sides. A lead screw nut is sleeved on the lead screw, and the lead screw nut is transmission-connected to the longitudinal movement seat.

5. A MEMS probe wet electroplating device according to claim 1 or 2, characterized in that: The working end of the screw lift is provided with a longitudinal mechanical arm, and mechanical clamps are provided at the left and right ends of the lower side of the mechanical arm. The cross-section of the movable slot in the vertical direction is composed of a rectangle at the top and an inverted trapezoid at the bottom, and the cross-section of the movable slot in the horizontal direction is rectangular. Vertical insertion slots are provided on the left and right inner walls of the movable slot, and the left and right side edges of the mounting plate are vertically inserted into the insertion slots on both sides. Multiple MEMS probes are vertically arranged on the mounting plate, and the top of the mounting plate is located below the top of the movable slot in the vertical direction. The two mechanical clamps of the mechanical arm respectively clamp the left and right handles on the top of the movable slot, and the upper part of the movable slot is open. A plurality of through holes are provided around and on the bottom of the movable slot, and the aperture of the through holes is 1-2 mm.

6. A MEMS probe wet electroplating device according to claim 2, characterized in that: The first liquid tank is an empty tank, the second liquid tank is an overflow cleaning tank, the third liquid tank is an electroplating liquid tank, the fourth liquid tank is an overflow cleaning tank, the fifth liquid tank is an electroplating liquid tank, the sixth liquid tank is an overflow cleaning tank, the seventh liquid tank is an overflow cleaning tank, the eighth liquid tank is an overflow cleaning tank, the ninth liquid tank is a drying tank, the tenth liquid tank is an overflow cleaning tank, the eleventh liquid tank is an electroplating liquid tank, the twelfth liquid tank is an overflow cleaning tank, and the thirteenth liquid tank is a slow pull cleaning tank.

7. A MEMS probe wet electroplating device according to claim 6, characterized in that: Each overflow cleaning tank is filled with clean water, and the slow-pull cleaning tank is also filled with clean water. Side tanks are provided on the left and right sides of each overflow cleaning tank. The top height of the side tank is higher than the top height of the overflow cleaning tank. The liquid in the overflow cleaning tank overflows into the side tanks. The composition of the electroplating solution in the third liquid tank is: sodium hydroxide with a mass concentration ratio of 7-8%, sodium carbonate with a mass concentration ratio of 39-40%, sodium silicate with a mass concentration ratio of 49-50%, and the remainder is water. The composition of the electroplating solution in the fifth liquid tank is: sodium hydroxide with a mass concentration ratio of 4- 6% aminosulfonic acid, 2-3% sulfuric acid by mass concentration, and the balance is water; the drying tank is an empty tank; the electroplating solution in the eleventh liquid tank is composed of: 7-9% sodium sulfite by mass concentration, 3.5-4.5% ethylenediamine by mass concentration, 7-10% sodium sulfite by mass concentration, 16-18% copper sulfate by mass concentration, and the balance is water; the sides of the fourth, sixth and eighth liquid tanks are connected with quick exhaust pipes, and a number of spray heads are provided corresponding to the probes in the fourth, sixth and eighth liquid tanks.

8. A MEMS probe wet electroplating device according to claim 7, characterized in that: Each of the electroplating liquid tanks is provided with an automatic liquid distribution pipeline assembly, which includes two side tank bodies arranged on the left and right sides of the corresponding electroplating liquid tank. The top height of the side tank body is higher than the top height of the electroplating liquid tank. The liquid in the electroplating liquid tank overflows into the side tank body. The bottom of any side tank body is connected to the bottom of the corresponding electroplating liquid tank through a circulation pipeline. The circulation pipeline is sequentially provided with a control valve, an absorption spectrometry concentration meter, a circulation pump, a heater, a filter and a flow display meter. The sides of the electroplating liquid tanks are connected with drain pipes, and the drain pipes are provided with drain opening and closing valves.

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