Server mainboard heat dissipation structure and server

Abstract

The embodiment of the invention provides a server mainboard heat dissipation structure and a server. The server mainboard heat dissipation structure comprises a shell, and an air bellow assembly is arranged at the bottom of the shell; the top plate is provided with radiating fins; the shell is connected with the top plate through a clamping assembly; when the clamping assembly is in the separated state, the shell is slidably connected with the top plate, an opening is formed in the shell, and multiple sets of server mainboards are installed on the shell through the opening; when the clamping assembly is in a fastening state, the air bellow assembly outputs cold air to the bottom of the shell and reaches the cooling fins through the server mainboard, the server mainboard transmits heat to the cooling fins through the shell and the top plate, and the cooling fins are used for dissipating heat in the cold air and heat from the server mainboard. According to the embodiment of the invention, the server mainboard can be quickly disassembled and assembled, so that the server is conveniently installed, the server mainboard in the shell is cooled through the cooling fins, and the purpose of cooling the server is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a server mainboard heat dissipation and a server. Background Art

[0002] A server is a type of computer that runs faster, has a higher load, and is more expensive than an ordinary computer. A server provides computing or application services to other clients in the network. The server has high-speed CPU (central processing unit) computing power, long-term reliable operation, powerful I / O (input / output) external data throughput capacity, and better scalability. Based on the services provided by the server, the server generally has the ability to respond to service requests, provide services, and guarantee services. For assembled servers, the heat dissipation of assembled servers mainly depends on the ventilation of the air duct for heat dissipation. Due to the closure of the main body, the heat dissipation effect of the wind in the air duct is poor, which makes it difficult for the server to dissipate heat. Summary of the invention

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a server mainboard heat dissipation and a server that overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, an embodiment of the present invention discloses a server mainboard heat dissipation structure, including:

[0005] A shell, a bellows assembly is disposed at the bottom of the shell; a top plate, a heat sink is disposed on the top plate; the shell and the top plate are connected via a snap-fit ​​assembly;

[0006] When the clamping assembly is in a separated state, the outer shell is slidably connected to the top plate, and the outer shell forms an opening, through which the outer shell is used to mount multiple sets of server mainboards; when the clamping assembly is in a fastened state, the bellows assembly outputs cold air to the bottom of the outer shell, which passes through the server mainboard to reach the heat sink, and the server mainboard transfers heat to the heat sink through the outer shell and the top plate, and the heat sink is used to dissipate heat in the cold air and heat from the server mainboard.

[0007] Optionally, the bellows assembly comprises:

[0008] The bellows body is fixed to the bottom of the shell; an open accommodating cavity is provided in the bellows body;

[0009] A fan, disposed in the open accommodating cavity, for generating and outputting cold air through the open side of the open accommodating cavity;

[0010] A filter screen is arranged at the opening side of the open accommodating cavity and is used for filtering the cold air.

[0011] Optionally, the snap-fit ​​assembly includes:

[0012] A snap-fit ​​groove is arranged at the top of the housing; a snap-fit ​​block is arranged at the bottom of the top plate; the snap-fit ​​groove and the snap-fit ​​block are slidably connected;

[0013] A connecting rod, one end of which passes through the engaging groove and the engaging block, and an operating block is arranged at the other end of the connecting rod; when the operating block is combined with the connecting rod, the engaging assembly is in the fastened state; when the operating block is separated from the connecting rod, the engaging assembly is in the separated state.

[0014] Optionally, the snap-fit ​​assembly further includes:

[0015] The outer side wall of the connecting rod is provided with an external thread;

[0016] An internal thread is provided on the inner side wall of the engaging block;

[0017] The internal thread and the external thread cooperate with each other.

[0018] Optionally, the server mainboard has a socket, and the server mainboard heat dissipation structure further includes:

[0019] A fixing component is connected to the socket and is used to fix the socket.

[0020] Optionally, the fixing assembly includes:

[0021] A plug connected to the socket;

[0022] A connecting rod, the middle region of which is mounted on both sides of the plug;

[0023] A buckle, one end of which is mounted on one end of the connecting rod; the other end of the buckle is provided with an inclined surface, which extends to the side of the socket, and the buckle is used to be fixedly connected to the socket through the inclined surface under the action of the connecting rod;

[0024] A pressure plate is installed at the other end of the connecting rod and is used to release the fixed connection between the inclined surface and the socket.

[0025] Optionally, the connecting rod is an elastic connecting rod.

[0026] Optionally, the heat sinks are arranged at equal intervals on the top of the top plate.

[0027] Optionally, it also includes:

[0028] Positioning blocks, arranged on both sides of the shell, for positioning the shell;

[0029] A plate body, mounted on one side of the positioning block;

[0030] A spring is installed on the other side of the positioning block. A snap buckle is installed on one side of the spring. The snap buckle is used to fasten the positioning block and the housing under the action of the spring.

[0031] In a second aspect of the present invention, an embodiment of the present invention discloses a server, including a server mainboard and the server mainboard heat dissipation structure as described above, wherein the server mainboard is installed in the server mainboard heat dissipation structure, and the server mainboard heat dissipation structure is used to dissipate heat from the server mainboard.

[0032] The embodiments of the present invention include the following advantages:

[0033] The embodiment of the present invention is provided with a shell, a bellows assembly is provided at the bottom of the shell; a top plate, a heat sink is provided on the top plate; the shell and the top plate are connected by a snap assembly; when the snap assembly is in a separated state, the shell and the top plate are slidably connected, the shell forms an opening, and the shell is installed with multiple sets of server motherboards through the opening; when the snap assembly is in a fastened state, the bellows assembly outputs cold air to the bottom of the shell, passes through the server motherboard to reach the heat sink, the server motherboard transfers heat to the heat sink through the shell and the top plate, and the heat sink is used to dissipate the heat in the cold air and the heat from the server motherboard. After the server motherboard is installed, the embodiment of the present invention can open the shell to quickly disassemble and assemble the server motherboard by assembling, thereby realizing the convenient disassembly and assembly of the assembled server, and when closed, the bottom provides cold air to blow to the server motherboard to cool the server motherboard, and the cooled cold air and the cold amount emitted by the server motherboard are directed to the heat sink on the top of the top plate, and the heat sink further absorbs heat to quickly dissipate the heat, dissipate the heat inside the shell, and achieve the purpose of server heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of a server mainboard heat dissipation structure of the present invention;

[0035] Figure 2 It is a schematic diagram of a top cross-sectional structure of an embodiment of a heat dissipation structure of a server motherboard of the present invention;

[0036] Figure 3 It is a front cross-sectional structural schematic diagram of a server mainboard heat dissipation structure of the present invention;

[0037] Figure 4 yes Figure 3 A partial cross-section at the center is an enlarged structural diagram;

[0038] Figure 5 It is a schematic diagram of a partial cross-sectional structure of a bellows assembly of the present invention;

[0039] Figure 6 It is a schematic diagram of the connection structure of the positioning block, the plate body and the spring of the present invention;

[0040] Figure 7 It is a schematic diagram of the fixing assembly of the present invention.

[0041] Description of reference numerals:

[0042] 100-housing, 110-support foot, 200-bellows assembly, 210-bellows body, 220-fan, 230-filter, 300-top plate, 400-heat sink, 500-clamping assembly, 510-clamping slot, 520-connecting rod, 530-clamping block 530, 540-operating block, 600-server motherboard, 610-socket, 700-fixing assembly, 710-plug, 720-connecting rod, 730-buckle, 740-pressure plate, 810-positioning block, 820-plate, 830-spring. DETAILED DESCRIPTION

[0043] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] Reference Figure 1 , showing a three-dimensional schematic diagram of a heat dissipation structure of a server motherboard 600 of the present invention, referring to Figure 2 , shows a schematic diagram of a top cross-sectional structure of a heat dissipation structure of a server motherboard 600 according to the present invention; referring to Figure 3 , shows a front cross-sectional structure of a heat dissipation structure of a server motherboard 600 of the present invention, and the heat dissipation structure of the server motherboard 600 may specifically include:

[0045] A housing 100, wherein a bellows assembly 200 is disposed at the bottom of the housing 100; a top plate 300, wherein a heat sink 400 is disposed on the top plate 300; the housing 100 and the top plate 300 are connected via a snap-fit ​​assembly 500;

[0046] When the snap-fit ​​assembly 500 is in a separated state, the housing 100 and the top plate 300 are slidably connected, the housing 100 forms an opening, and the housing 100 is used to install multiple sets of server motherboards 600; when the snap-fit ​​assembly 500 is in a fastened state, the bellows assembly 200 outputs cold air to the bottom of the housing 100, passes through the server motherboard 600 and reaches the heat sink 400, and the server motherboard 600 transfers heat to the heat sink 400 through the housing 100 and the top plate 300, and the heat sink 400 is used to dissipate heat in the cold air and heat from the server motherboard 600.

[0047] In the embodiment of the present invention, the heat dissipation structure of the server motherboard 600 may include a housing 100, a bellows assembly 200, a top plate 300, a heat sink 400 and a snap assembly 500. The housing 100 is installed on the bearing base of other components, and there is no accommodating cavity in the housing 100, which can be used to install the server motherboard 600. The side of the server motherboard 600 is installed with a socket 610. The top plate 300 is detachably connected to the housing 100 through the snap assembly 500, and a heat sink 400 is arranged on the top plate 300. The bellows assembly 200 is arranged at the bottom of the housing 100. The heat sink 400 and the heat sink 400 together dissipate the heat generated by the server motherboard 600 in the server. When the snap-fit ​​assembly 500 is in a fastened state, the bellows assembly 200 outputs cold air to the bottom of the housing 100, passes through the server mainboard 600 and reaches the heat sink 400. The server mainboard 600 transfers heat to the heat sink 400 through the housing 100 and the top plate 300. That is, at this time, the heat sink 400 can receive the heat directly transferred from the server mainboard 600 and the heat transferred by the cold air, and then dissipate the heat in the cold air and the heat from the server mainboard 600. Since the heat of the server mainboard 600 is directly dissipated and the cold air can be used for cooling again, the cold air after dissipation can again dissipate the heat of the server mainboard 600 inside the housing 100, thereby achieving a good heat dissipation effect.

[0048] When the locking assembly 500 is in a separated state, the outer shell 100 and the top plate 300 can be slidably connected, and the outer shell 100 forms an opening. The outer shell 100 can install multiple sets of server motherboards 600 through the opening, so that the interior of the outer shell 100 can be easily repaired and maintained, and the server motherboard 600 can process different data.

[0049] The embodiment of the present invention comprises a shell 100, a bellows assembly 200 is disposed at the bottom of the shell 100, and a top plate 300, a heat sink 400 is disposed on the top plate 300; the shell 100 and the top plate 300 are connected via a snap assembly 500; when the snap assembly 500 is in a separated state, the shell 100 and the top plate 300 are slidably connected, the shell 100 forms an opening, and the shell 100 is provided with multiple groups of server motherboards 600 through the opening; when the snap assembly 500 is in a fastened state, the bellows assembly 200 outputs cold air to the bottom of the shell 100, passes through the server motherboard 600 and reaches the heat sink 400, the server motherboard 600 transfers heat to the heat sink 400 through the shell 100 and the top plate 300, and the heat sink 400 is used to dissipate heat in the cold air and heat from the server motherboard 600. According to the embodiment of the present invention, after the server motherboard 600 is installed, the shell 100 can be opened to quickly disassemble and assemble the server motherboard 600 through assembly, thereby realizing convenient disassembly and assembly of the assembled server, and when closed, the bottom provides cold air to blow toward the server motherboard 600 to cool the server motherboard 600, and the cooled cold air and the cold energy emitted to the outside by the server motherboard 600 are both directed to the heat sink 400 on the top of the top plate 300, and the heat sink 400 further absorbs heat to quickly dissipate the heat, thereby dissipating the heat inside the shell 100, thereby achieving the purpose of server heat dissipation.

[0050] Specifically, the bellows assembly 200 includes:

[0051] The bellows body 210 is fixed to the bottom of the housing 100; an open receiving cavity is provided in the bellows body 210;

[0052] A fan 220 is disposed in the open accommodating cavity and is used to generate and output cold air through the open side of the open accommodating cavity;

[0053] The filter screen 230 is arranged at the opening side of the open accommodating cavity and is used for filtering the cold air.

[0054] You can refer to Figure 5, the bellows assembly 200 includes a bellows body 210, a fan 220 and a filter 230. The bellows body 210 is fixed to the bottom of the housing 100. An open accommodating cavity is provided in the bellows body 210, and a fan 220 is installed in the open accommodating cavity. The fan 220 is a fan device used to enhance air flow and accelerate heat dissipation. It generates airflow by rotating to take away the heat generated inside the server, thereby keeping the temperature of the server hardware within an acceptable range and preventing performance degradation, system crash and even hardware damage caused by overheating. The server fan 220 can be divided into multiple types. For example, according to the power type, it can be divided into DC fans and AC fans; according to the number of fan blades, it can be divided into single-leaf fans and multi-leaf fans; according to the speed and air volume, it can be divided into low-speed and low-air volume fans and high-speed and high-air volume fans. Different types of server fans 220 have different characteristics and application scenarios. Including DC fans: usually have lower noise and higher efficiency, suitable for server environments with strict requirements on noise and long-term operation. AC fans: relatively simple structure, low cost, but noise and efficiency may be slightly inferior to DC fans. High-speed, high-air-volume fan: can quickly take away a lot of heat, suitable for high-density, high-power server applications.

[0055] A filter 230 is installed inside the bellows body 210. Specifically, it can be installed on the opening side of the open accommodating cavity. The filter 230 can filter dust and impurities in the air to prevent them from entering the server motherboard 600 and the heat sink 400, thereby maintaining the cleanliness and heat dissipation efficiency of the server motherboard 600 and the heat sink 400. The filter 230 can effectively block impurities such as dust and particulate matter in the air from entering the radiator, and prevent these impurities from adhering to the heat sink 400 and affecting the heat dissipation effect. By preventing the accumulation of dust, the filter 230 can reduce the degradation of the heat dissipation performance of the radiator due to excessive dust, thereby extending the service life of the radiator. Keeping the radiator clean can ensure smooth air circulation, improve heat dissipation efficiency, and help the server maintain a stable temperature when running at high load for a long time. The material and structure of the filter 230 can be determined according to the actual product. For example, the filter 230 is mostly made of materials such as metal mesh, nylon mesh or fiber cloth. The structure of the filter 230 can be an integrated filter 230 or a split detachable filter 230, wherein the filter 230 is usually designed to be detachable or washable to facilitate regular cleaning and maintenance.

[0056] Furthermore, through holes are provided at the top and bottom ends of the bellows, and the through holes are symmetrically distributed with respect to the central axis of the bellows.

[0057] When the fan 220 is started, the fan 220 will start to rotate and generate airflow. The airflow enters the bellows through the vents, takes away the hot air inside the server, and is discharged out of the box after being accelerated by the fan 220. At the same time, fresh air from the outside enters the box through the through holes, forming a cycle. Through this continuous cycle, the heat inside the server is effectively discharged, thereby achieving the purpose of heat dissipation and cooling.

[0058] Reference Figure 2 and Figure 3 As shown, the heat sink 400 has a large surface area and can absorb heat to quickly dissipate heat. At the same time, the fan 220 at the bottom of the shell 100 can start working. The fan 220 can suck air into the shell 100 to suck out the hot air inside the shell 100 and dissipate heat inside the shell 100. The filter 230 can filter dust to prevent dust from entering the inside of the shell 100.

[0059] In an optional embodiment of the present invention, the engaging assembly 500 includes:

[0060] The engaging groove 510 is disposed at the top of the housing 100; the engaging block 530 is disposed at the bottom of the top plate 300; the engaging groove 510 and the engaging block 530 are slidably connected;

[0061] A connecting rod 520, one end of which passes through the locking groove 510 and the locking block 530, and a locking block 540 is arranged at the other end of the connecting rod 520; when the locking block 540 is combined with the connecting rod 520, the locking assembly 500 is in the fastened state; when the locking block 540 is separated from the connecting rod 520, the locking assembly 500 is in the separated state.

[0062] like Figure 4The housing 100 and the top plate 300 form a sliding structure through the snap assembly 500, and the snap block 530 at the top of the top plate 300 can slide into the snap groove 510 at the top of the housing 100. One end of the connecting rod 520 passes through the snap groove 510 and the snap block 530, and the snap block 540 is arranged at the other end of the connecting rod 520. The connecting rod 520, the snap block 530, and the housing 100 form a snap structure. Further, the connecting rod 520 can be a threaded rod, so that a stable connection is made through a thread. The snap block 540 can be a screw block for a twisting operation, and the operation can be quickly performed by twisting. The connecting rod 520 can be fixed to the snap block 530 and the housing 100 by operating the snap block 540, so that the top plate 300 can be fixed to the top of the housing 100, and the heat sink 400 above the top plate 300 can dissipate heat. Fine anti-slip grooves can also be provided on the snap block 540, so that when operating the snap block 540, the friction between the snap block 540 and the user can be increased, so that it can be rotated conveniently and quickly. In addition, by rotating the snap block 540, the top plate 300 can be removed to repair and maintain the inside of the shell 100.

[0063] Furthermore, the engaging assembly 500 further includes:

[0064] The outer side wall of the connecting rod 520 is provided with an external thread;

[0065] The inner wall of the locking block 530 is provided with an internal thread;

[0066] The internal thread and the external thread cooperate with each other.

[0067] In the embodiment of the present invention, external threads are evenly arranged on the outer wall of the connecting rod 520, and internal threads matching the external threads are evenly arranged on the inner wall of the locking block 530. The connecting rod 520 and the locking block 530 are firmly connected through the threads.

[0068] In an optional embodiment of the present invention, the heat dissipation structure of the server mainboard 600 further includes: a support leg 110,

[0069] The support leg 110 is installed at the bottom of the housing 100 .

[0070] The legs 110 abut against other servers, thereby ensuring that a certain distance is created between the main structures of the servers, which facilitates wiring.

[0071] In an optional embodiment of the present invention, the heat dissipation structure of the server mainboard 600 further includes:

[0072] Positioning blocks 810, disposed on both sides of the housing 100, for positioning the housing 100;

[0073] A plate body 820 is installed on one side of the positioning block 810;

[0074] The spring 830 is installed on the other side of the positioning block 810 . A snap-fit ​​buckle is installed on one side of the spring 830 . The snap-fit ​​buckle is used to fasten the positioning block 810 and the housing 100 under the action of the spring 830 .

[0075] Positioning blocks 810, plate bodies 820 and springs 830 are provided on both sides of the housing 100 to position the housing 100 so that the housing 100 can be fixedly connected with other parts. A plate body 820 is installed on one side of the positioning block 810, and mounting screws are movably connected to the top and bottom of the plate body 820. A spring 830 is installed on one side of the positioning block 810, and a snap buckle is installed on one side of the spring 830.

[0076] You can refer to Figure 2 and Figure 6 As shown, the shell 100 and the positioning block 810 form a sliding structure and can be interactively connected to each other. The shell 100 can slide into the positioning block 810 for installation. The positioning block 810 can be installed on a wall or inside a cabinet through a plate 820 and mounting screws. The shell 100 can be assembled by sliding into the positioning block 810. At the same time, the snap buckle is conical, and the spring 830 on one side is elastic. After the base slides into the positioning block 810, the snap buckle will automatically snap into the base, making the base installation more stable. The conical snap buckle will not affect the installation and disassembly of the device, so that the device can be quickly disassembled and assembled.

[0077] In an optional embodiment of the present invention, the server mainboard 600 has a socket 610, and the heat dissipation structure of the server mainboard 600 further includes:

[0078] The fixing assembly 700 is connected to the socket 610 and is used to fix the socket 610 .

[0079] The socket 610 is connected to the fixing assembly 700 , and the fixing assembly 700 is used to fix the outer periphery of the socket 610 to fix the socket 610 .

[0080] Specifically, the fixing assembly 700 includes:

[0081] A plug 710 connected to the socket 610;

[0082] A connecting rod 720, wherein the middle region of the connecting rod 720 is mounted on both sides of the plug 710;

[0083] A buckle 730, one end of which is mounted on one end of the connecting rod 720; the other end of the buckle 730 is provided with an inclined surface, which extends to the side of the socket 610, and the buckle 730 is used to be fixedly connected to the socket 610 through the inclined surface under the action of the connecting rod 720;

[0084] The pressing plate 740 is installed at the other end of the connecting rod 720 and is used to release the fixed connection between the inclined surface and the socket 610.

[0085] In the embodiment of the present invention, a socket 610 is installed at one end of the server motherboard 600. The fixing assembly 700 includes a plug 710, a buckle 730, a connecting rod 720 and a pressure plate 740. The plug 710 is installed at one end of the socket 610. Connecting rods 720 are installed on both sides of the plug 710, a pressure plate 740 is installed on one side of the connecting rod 720, and a buckle 730 is installed at one end of the connecting rod 720. A card slot is provided at one end of the socket 610, and the plug 710 and the socket 610 form a card-fitting structure.

[0086] Connecting rods 720 are installed on both sides of the plug 710 , a pressing plate 740 is installed on one side of the connecting rod 720 , and a buckle 730 is installed at one end of the connecting rod 720 .

[0087] See attached Figure 7 As shown, the plug 710 can be inserted into the socket 610. After the plug 710 is inserted into the socket 610, the connecting rods 720 on both sides of the plug 710 can be made of elastic plastic materials, that is, the connecting rods 720 are elastic connecting rods 720. The elastic plastic material includes but is not limited to thermoplastic polyurethane, styrene-based thermoplastic elastomer, polyvinyl chloride, chlorinated polyethylene, ethylene-vinyl acetate copolymer, silicone rubber, and polyolefin-based thermoplastic elastomer.

[0088] One end of the buckle 730 at one end of the connecting rod 720 is provided with an inclined surface. Therefore, when the plug 710 is inserted into the socket 610, the buckle 730 will be directly stuck in the grooves on both sides of the socket 610. The buckle 730 will fix the plug 710 on the socket 610. When the plug 710 needs to be removed, the pressure plate 740 can be pressed to drive the connecting rod 720 to rotate. The rotation of the connecting rod 720 allows the buckle 730 to no longer be stuck on the socket 610.

[0089] Furthermore, a heat shrink film is provided between the socket 610 and the plug 710 to cover the socket 610 and the plug 710. When the server emits heat, the heat emitted by the server can be used to cause the volume of the heat shrink film to shrink, so that the heat shrink film can tightly wrap the socket 610 and the plug 710 to prevent the socket 6107 and the plug 710 from falling off. The heat shrink film is various thermoplastic films, such as polyethylene (PE), polyvinyl chloride (PVC), etc.

[0090] In an optional embodiment of the present invention, the heat sinks 400 are arranged at equal intervals on the top of the top plate 300 .

[0091] The heat sink 400 is made of heat-conducting metal, and transfers the heat source attached to the radiator or other heat dissipation device to it, and transfers the heat to the environment through a higher surface area. At the same time, under the condition of appropriate speed, the heat transfer can be accelerated by forcing the gas to flow through the heat sink 400. The heat sink 400 can be made of silver, copper, aluminum, steel, etc., and the embodiment of the present invention does not specifically limit the specific material.

[0092] Specifically, the heat sink 400 may be a fin-type heat sink 400, which is arranged at equal intervals on the top of the top plate 300. The heat sink 400 uses fins to increase the heat dissipation area, and the heat dissipation area of ​​the radiator is greatly increased, so that heat can be transferred to the fin surface more quickly and quickly dissipated to the surrounding environment. The arrangement of the fins can not only improve the heat dissipation efficiency, but also reduce the volume and weight of the heat dissipation part, making it more compact and lightweight.

[0093] Reference Figure 2 and Figure 3 As shown, the heat sink 400 has a large surface area and can absorb heat to quickly dissipate heat. At the same time, the fan 220 at the bottom of the shell 100 can start working. The fan 220 can suck air into the shell 100 to suck out the hot air inside the shell 100 and dissipate heat inside the shell 100. The filter 230 can filter dust to prevent dust from entering the inside of the shell 100.

[0094] The embodiment of the present invention has a plug 710 movably connected to one end of the socket 610, and the plug 710 can be inserted into the socket 610. After the plug 710 is inserted into the socket 610, the connecting rods 520 on both sides of the plug 710 can be made of elastic plastic material, and the buckle 730 at one end of the connecting rod 520 is provided with an inclined surface at one end. Therefore, when the plug 710 is inserted into the socket 610, the buckle 730 will be directly stuck in the grooves on both sides of the socket 610, and the buckle 730 will fix the plug 710 on the socket 610. When the plug 710 needs to be removed, the pressure plate 740 can be pressed to drive the connecting rod 520 to rotate. The connecting rod 520 rotates so that the buckle 730 is no longer stuck on the socket 610, and the plug 710 can be removed, thereby achieving the purpose of facilitating the fixing of the plug 710 on the server. A heat sink 400 is provided at the top of the top plate 300, and the heat sink 400 has a large surface area and can absorb heat to quickly dissipate heat. At the same time, the fan 220 at the bottom of the shell 100 can start working. The fan 220 can suck air into the shell 100, suck out the hot air inside the shell 100, and dissipate the heat inside the shell 100. The filter 230 can filter dust to prevent dust from entering the shell 100, thereby achieving the purpose of the server facilitating the heat dissipation of the device.

[0095] An embodiment of the present invention further discloses a server, including a server mainboard 600 and the heat dissipation structure of the server mainboard 600 as described above, wherein the server mainboard 600 is installed in the heat dissipation structure of the server mainboard 600, and the heat dissipation structure of the server mainboard 600 is used to dissipate heat from the server mainboard 600.

[0096] In an embodiment of the present invention, the server includes a server mainboard 600 and a heat dissipation structure of the server mainboard 600. When the server mainboard 600 is running, the heat dissipation structure of the server mainboard 600 is started synchronously to dissipate heat for the server mainboard 600, thereby ensuring that the server mainboard 600 can run stably and realize corresponding business processing.

[0097] Specifically, the heat dissipation structure of the server mainboard 600 includes:

[0098] A housing 100, wherein a bellows assembly 200 is disposed at the bottom of the housing 100; a top plate 300, wherein a heat sink 400 is disposed on the top plate 300; the housing 100 and the top plate 300 are connected via a snap-fit ​​assembly 500;

[0099] When the snap-fit ​​assembly 500 is in a separated state, the housing 100 and the top plate 300 are slidably connected, the housing 100 forms an opening, and the housing 100 is used to install multiple sets of server motherboards 600; when the snap-fit ​​assembly 500 is in a fastened state, the bellows assembly 200 outputs cold air to the bottom of the housing 100, passes through the server motherboard 600 and reaches the heat sink 400, and the server motherboard 600 transfers heat to the heat sink 400 through the housing 100 and the top plate 300, and the heat sink 400 is used to dissipate heat in the cold air and heat from the server motherboard 600.

[0100] Optionally, the bellows assembly 200 includes:

[0101] The bellows body 210 is fixed to the bottom of the housing 100; an open receiving cavity is provided in the bellows body 210;

[0102] A fan 220 is disposed in the open accommodating cavity and is used to generate and output cold air through the open side of the open accommodating cavity;

[0103] The filter screen 230 is arranged at the opening side of the open accommodating cavity and is used for filtering the cold air.

[0104] Optionally, the engaging assembly 500 includes:

[0105] The engaging groove 510 is disposed at the top of the housing 100; the engaging block 530 is disposed at the bottom of the top plate 300; the engaging groove 510 and the engaging block 530 are slidably connected;

[0106] A connecting rod 520, one end of which passes through the locking groove 510 and the locking block 530, and a locking block 540 is arranged at the other end of the connecting rod 520; when the locking block 540 is combined with the connecting rod 520, the locking assembly 500 is in the fastened state; when the locking block 540 is separated from the connecting rod 520, the locking assembly 500 is in the separated state.

[0107] Optionally, the engaging assembly 500 further includes:

[0108] The outer side wall of the connecting rod 520 is provided with an external thread;

[0109] The inner wall of the locking block 530 is provided with an internal thread;

[0110] The internal thread and the external thread cooperate with each other.

[0111] Optionally, the server mainboard 600 has a socket 610, and the heat dissipation structure of the server mainboard 600 further includes:

[0112] The fixing assembly 700 is connected to the socket 610 and is used to fix the socket 610 .

[0113] Optionally, the fixing assembly 700 includes:

[0114] A plug 710 connected to the socket 610;

[0115] A connecting rod 720, wherein the middle region of the connecting rod 720 is mounted on both sides of the plug 710;

[0116] A buckle 730, one end of which is mounted on one end of the connecting rod 720; the other end of the buckle 730 is provided with an inclined surface, which extends to the side of the socket 610, and the buckle 730 is used to be fixedly connected to the socket 610 through the inclined surface under the action of the connecting rod 720;

[0117] The pressing plate 740 is installed at the other end of the connecting rod 720 and is used to release the fixed connection between the inclined surface and the socket 610.

[0118] Optionally, the connecting rod 720 is an elastic connecting rod 720 .

[0119] Optionally, the heat sinks 400 are arranged at equal intervals on the top of the top plate 300 .

[0120] Optionally, it also includes:

[0121] Positioning blocks 810, disposed on both sides of the housing 100, for positioning the housing 100;

[0122] A plate body 820 is installed on one side of the positioning block 810;

[0123] The spring 830 is installed on the other side of the positioning block 810 . A snap-fit ​​buckle is installed on one side of the spring 830 . The snap-fit ​​buckle is used to fasten the positioning block 810 and the housing 100 under the action of the spring 830 .

[0124] The embodiment of the present invention comprises a shell 100, a bellows assembly 200 is disposed at the bottom of the shell 100, and a top plate 300, a heat sink 400 is disposed on the top plate 300; the shell 100 and the top plate 300 are connected via a snap assembly 500; when the snap assembly 500 is in a separated state, the shell 100 and the top plate 300 are slidably connected, the shell 100 forms an opening, and the shell 100 is provided with multiple groups of server motherboards 600 through the opening; when the snap assembly 500 is in a fastened state, the bellows assembly 200 outputs cold air to the bottom of the shell 100, passes through the server motherboard 600 and reaches the heat sink 400, the server motherboard 600 transfers heat to the heat sink 400 through the shell 100 and the top plate 300, and the heat sink 400 is used to dissipate heat in the cold air and heat from the server motherboard 600. According to the embodiment of the present invention, after the server motherboard 600 is installed, the shell 100 can be opened to quickly disassemble and assemble the server motherboard 600 through assembly, thereby realizing convenient disassembly and assembly of the assembled server, and when closed, the bottom provides cold air to blow toward the server motherboard 600 to cool the server motherboard 600, and the cooled cold air and the cold energy emitted to the outside by the server motherboard 600 are both directed to the heat sink 400 on the top of the top plate 300, and the heat sink 400 further absorbs heat to quickly dissipate the heat, thereby dissipating the heat inside the shell 100, thereby achieving the purpose of server heat dissipation.

[0125] The above disclosure is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A server motherboard heat dissipation structure, characterized in that: include: A shell, a bellows assembly is disposed at the bottom of the shell; a top plate, a heat sink is disposed on the top plate; the shell and the top plate are connected via a snap-fit ​​assembly; When the clamping assembly is in a separated state, the outer shell is slidably connected to the top plate, and the outer shell forms an opening, through which the outer shell is used to mount multiple sets of server mainboards; when the clamping assembly is in a fastened state, the bellows assembly outputs cold air to the bottom of the outer shell, which passes through the server mainboard to reach the heat sink, and the server mainboard transfers heat to the heat sink through the outer shell and the top plate, and the heat sink is used to dissipate heat in the cold air and heat from the server mainboard.

2. The server motherboard heat dissipation structure according to claim 1, characterized in that: The bellows assembly comprises: The bellows body is fixed to the bottom of the shell; an open accommodating cavity is provided in the bellows body; A fan, disposed in the open accommodating cavity, for generating and outputting cold air through the open side of the open accommodating cavity; A filter screen is arranged at the opening side of the open accommodating cavity and is used for filtering the cold air.

3. The server motherboard heat dissipation structure according to claim 1, characterized in that: The snap-fit ​​assembly comprises: A snap-fit ​​groove is arranged at the top of the housing; a snap-fit ​​block is arranged at the bottom of the top plate; the snap-fit ​​groove and the snap-fit ​​block are slidably connected; A connecting rod, one end of which passes through the engaging groove and the engaging block, and an operating block is arranged at the other end of the connecting rod; when the operating block is combined with the connecting rod, the engaging assembly is in the fastened state; when the operating block is separated from the connecting rod, the engaging assembly is in the separated state.

4. The server mainboard heat dissipation structure according to claim 3, characterized in that: The snap-fit ​​assembly also includes: The outer side wall of the connecting rod is provided with an external thread; An internal thread is provided on the inner side wall of the engaging block; The internal thread and the external thread cooperate with each other.

5. The server motherboard heat dissipation structure according to claim 1, characterized in that: The server mainboard has a socket, and the server mainboard heat dissipation structure also includes: A fixing component is connected to the socket and is used to fix the socket.

6. The server mainboard heat dissipation structure according to claim 5, characterized in that: The fixing assembly comprises: A plug connected to the socket; A connecting rod, the middle region of which is mounted on both sides of the plug; A buckle, one end of which is mounted on one end of the connecting rod; the other end of the buckle is provided with an inclined surface, which extends to the side of the socket, and the buckle is used to be fixedly connected to the socket through the inclined surface under the action of the connecting rod; A pressure plate is installed at the other end of the connecting rod and is used to release the fixed connection between the inclined surface and the socket.

7. The server mainboard heat dissipation structure according to claim 6, characterized in that: The connecting rod is an elastic connecting rod.

8. The server mainboard heat dissipation structure according to claim 1, characterized in that: The heat sinks are arranged at equal intervals on the top of the top plate.

9. The server mainboard heat dissipation structure according to claim 1, characterized in that: Also includes: Positioning blocks, arranged on both sides of the shell, for positioning the shell; A plate body, mounted on one side of the positioning block; A spring is installed on the other side of the positioning block. A snap buckle is installed on one side of the spring. The snap buckle is used to fasten the positioning block and the housing under the action of the spring.

10. A server, characterized in that: It comprises a server mainboard and a server mainboard heat dissipation structure as claimed in any one of claims 1 to 9, wherein the server mainboard is installed in the server mainboard heat dissipation structure, and the server mainboard heat dissipation structure is used to dissipate heat from the server mainboard.

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