Server and data center

Abstract

The invention relates to the technical field of operation and maintenance architecture, and discloses a server and a data center, the server comprises a case, a middle backboard module, a data processing module, a fan module, an expansion module and a power supply module, the middle backboard module is arranged in the case and extends along a first direction, and a circuit is arranged in the middle backboard module for signal transmission; the number of the data processing module is at least one, and the data processing module is located on the side, in the second direction, of the middle backboard module and is in wireless connection with the middle backboard module; the fan module is wirelessly connected with the middle backboard module; the extension module is wirelessly connected with the middle backboard module and is used for connecting extension equipment; the power supply module is wirelessly connected with the middle backboard module; wherein the expansion module, the fan module, the data processing module and the power supply module are arranged in the case along a first direction and perform signal interaction with each other through the middle backboard module; the problems that the server cannot meet the PUE index and the noise is high can be solved or improved.

Description

Technical Field

[0001] The present application relates to the field of operation and maintenance architecture technology, and specifically to servers and data centers. Background Art

[0002] The high-power components used inside the server mainly include the CPU (Central Processing Unit) and GPU (Graphics Processing Unit). The power consumption of the processor has been greatly increased, with the maximum power consumption of the processor exceeding 500W, even exceeding 700W, or even higher.

[0003] In related technologies, servers are mainly cooled by air. As the power consumption of processors continues to increase, air cooling has gradually reached a cooling bottleneck. At the same time, as the PUE (Power Usage Effectiveness) requirements of data centers become increasingly stringent, under the influence of high-power processors and the trend of reducing energy consumption, it is necessary to focus on how to improve air cooling.

[0004] To improve the system heat dissipation of the server, the fan speed can be increased, but this will increase the fan power consumption, causing the power consumption of the server system to increase, affecting the PUE index of the data center, and increasing the fan speed will increase the noise of the data center. Summary of the invention

[0005] The present application provides a server and a data center to solve or improve the problem that the server cannot meet the PUE index and has high noise.

[0006] On the one hand, the present application provides a server having a first direction and a second direction intersecting each other, including: a chassis, a mid-backplane module, a data processing module, a fan module, an expansion module and a power supply module, and the specific scheme is as follows.

[0007] A mid-backplane module, disposed in the chassis and extending along the first direction, wherein the mid-backplane module has a built-in circuit for signal transmission; A data processing module, at least one of which is provided, and the data processing module is located on one side of the mid-backplane module along the second direction and is wirelessly connected to the mid-backplane module; A fan module, wirelessly connected to the mid-backplane module; An expansion module, wirelessly connected to the mid-backplane module, for connecting an expansion device; A power module, wirelessly connected to the mid-backplane module; The expansion module, the fan module, the data processing module and the power supply module are arranged in the chassis along the first direction, and perform signal exchange with each other through the mid-backplane module.

[0008] By setting a mid-backplane module extending along a first direction in the chassis, and arranging the expansion module, fan module, data processing module and power supply module along the first direction in the chassis, and all of them are wirelessly connected to the mid-backplane module, the control signal and power supply signal transmission between the expansion module, fan module, data processing module and power supply module can be achieved through the mid-backplane module, so that there is no need to set up cables, the resistance of the heat dissipation airflow generated by the fan module can be reduced, the flow rate of the heat dissipation airflow can be increased, thereby improving the air cooling effect inside the server, reducing the energy consumption of the fan module to meet the PUE index requirements, and reducing noise.

[0009] In an optional implementation, one data processing module is disposed on both sides of the mid-backplane module along the second direction.

[0010] In an optional embodiment, the data processing module located on one side of the mid-backplane module is centrally symmetrically arranged with respect to the data processing module located on the other side of the mid-backplane module, and the symmetry axes of the data processing modules located on both sides of the mid-backplane module are perpendicular to both the first direction and the second direction.

[0011] In an optional embodiment, the data processing module includes a pull-out component and a mainboard unit, the mainboard unit is arranged on the pull-out component, and slots are arranged on both side surfaces of the chassis along the second direction. The pull-out component is inserted into the slots so that the mainboard unit and the mid-backplane module are connected by hot plugging along the second direction.

[0012] In an optional embodiment, the extension module and the power supply module are respectively connected to the two ends of the mid-backplane module along the first direction, and the fan module and the data processing module are located between the extension module and the power supply module; wherein the extension module and the power supply module are plugged into the chassis along the first direction, and the extension module is hot-swappable connected to the mid-backplane module.

[0013] In an optional embodiment, the expansion module includes at least one expansion module, and a plurality of expansion plug-in slots are arranged on one end face of the expansion module along the first direction, and the other end face of the expansion module along the first direction is hot-swappable connected to the mid-backplane module.

[0014] In an optional embodiment, the power module includes a first signal board, a power supply unit and an extension unit, the first signal board extends along the second direction, the first signal board is plugged into the mid-backplane module along the first direction, the power supply unit and the extension unit are each provided with at least one, the power supply unit and the extension unit are arranged side by side along the second direction, and are both wirelessly connected to the first signal board.

[0015] In an optional embodiment, the power supply unit and the expansion unit are both hot-plug connected to one side of the first signal board along the first direction, and the first signal board is hot-plug connected to the midplane module along another side of the first direction.

[0016] In an optional embodiment, a plurality of ventilation holes are provided on the first signal plate; and / or a ventilation slot is provided on the extension module.

[0017] In an optional embodiment, the fan module includes a fan unit and a second signal board, the second signal board extends along the second direction, a plurality of the fan units are provided, the plurality of the fan units are arranged side by side along the second direction and are wirelessly connected to the second signal board, the second signal board is wirelessly connected to the mid-backplane module, and the plurality of the fan units are arranged in two groups and are respectively located on both sides of the mid-backplane module.

[0018] In an optional embodiment, an air guide component is further included, wherein the fan module is arranged between the expansion module and the data processing module, and two air guide components are arranged, which are respectively located on both sides of the mid-backplane module and are both located between the fan module and the power supply module.

[0019] In an optional implementation, a first control module is disposed on the second signal board, and the first control module is capable of controlling the rotation speed difference of the fan units located on both sides of the mid-backplane module to be 30%-45%.

[0020] In an optional embodiment, the mainboard unit is provided with a mainboard high-speed signal plug, a mainboard low-speed signal plug and a mainboard power supply plug plugged with the mid-backplane module at an edge portion thereof close to the mid-backplane module, and the mainboard high-speed signal plug, the mainboard low-speed signal plug and the mainboard power supply plug are arranged at intervals along the first direction; Among them, the mainboard high-speed signal plug is used to provide high-speed signals to the expansion device, and the mainboard low-speed signal plug is used to provide low-speed control signals and PCIE signals to the expansion device, as well as to provide low-speed control signals to the fan module and the power module.

[0021] In an optional embodiment, the mid-backplane module includes a board body and a fixing frame, and the board body is fixed in the chassis through the fixing frame; And / or, on one side of the board body along the second direction, a first extension plug interface, a fan control plug interface, a mainboard high-speed signal plug interface, a mainboard low-speed signal plug interface, a mainboard power supply plug interface and a first power supply plug interface are sequentially arranged along the first direction; on another side of the board body along the second direction, a first extension plug interface, a fan power supply plug interface, a mainboard power supply plug interface, a mainboard low-speed signal plug interface, a mainboard high-speed signal plug interface and a second extension plug interface are sequentially arranged along the first direction; wherein, the two first extension plug interfaces located on both sides of the mid-backplane module are respectively used to connect with the two extension modules in the extension module to transmit control signals and power supply signals; the two groups of the mainboard high-speed signal plug interface, the mainboard low-speed signal plug interface and the mainboard power supply plug interface located on both sides of the mid-backplane module are respectively used to connect with the data processing modules located on both sides of the mid-backplane module; the fan control plug interface and the fan power supply plug interface are used to connect with the fan module; the first power supply plug interface and the second extension plug interface are used to connect with the power supply module.

[0022] On the other hand, the present application also provides a data center, comprising a server in any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the related technologies, the drawings required for use in the specific implementation methods or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A framework diagram of a server according to an embodiment of the present application; Figure 2 A front view of an expansion module in a server according to an embodiment of the present application; Figure 3 A rear view of an expansion module in a server according to an embodiment of the present application; Figure 4 A rear view of another expansion module in a server according to an embodiment of the present application; Figure 5 A framework diagram of a fan module in a server according to an embodiment of the present application; Figure 6 A framework diagram of a mainboard unit in a server according to an embodiment of the present application; Figure 7A framework diagram of one side of a mid-backplane module in a server according to an embodiment of the present application; Figure 8 A frame diagram of the other side of a backplane module in a server according to an embodiment of the present application; Fig. 9 A framework diagram of a second information board in a server according to an embodiment of the present application; Fig.10 A view of an expansion module end provided in a server in an embodiment of the present application; Fig.11 This is a view of a server provided with a power module terminal in an embodiment of the present application; Fig.12 A view of a server provided with a drawer component in an embodiment of the present application; Fig.13 A framework diagram of an expansion unit in a server according to an embodiment of the present application; Fig.14 A framework diagram of a power supply unit in a server according to an embodiment of the present application.

[0025] Description of reference numerals: X, first direction; Y, second direction; 1. Mid-backplane module; 2. Data processing module; 3. Fan module; 4. Expansion module; 5. Power module; 11. First expansion interface; 12. Fan control interface; 13. Motherboard high-speed signal interface; 14. Motherboard low-speed signal interface; 15. Motherboard power interface; 16. Second expansion interface; 17. Fan power interface; 18. First power interface; 21. Pull-out component; 22. Mainboard unit; 221, mainboard high-speed signal plug; 222, mainboard low-speed signal plug; 223, mainboard power supply plug; 31. Fan unit; 32. Second signal board; 321. fan control plug; 322. fan power supply plug; 323. first control module; 41. expansion module; 42. ventilation slot; 43. first expansion plug; 51. first signal board; 52. power supply unit; 53. expansion unit; 511, first power supply plug; 512, second extension plug; 513, second power supply interface; 514, third extension interface; 521, a second power supply plug; 531, a third extension plug. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0027] In related technologies, servers are mainly cooled by air. As the power consumption of processors continues to increase, air cooling has gradually reached a cooling bottleneck. At the same time, as the PUE (Power Usage Effectiveness) requirements of data centers become increasingly stringent, under the influence of high-power processors and the trend of reducing energy consumption, it is necessary to focus on how to improve air cooling.

[0028] To improve the system heat dissipation of the server, the fan speed can be increased, but this will increase the fan power consumption, causing the power consumption of the server system to increase, affecting the PUE index of the data center, and increasing the fan speed will increase the noise of the data center.

[0029] Therefore, the present application provides a server and a data center to solve or improve the problem that the server cannot meet the PUE index and has high noise.

[0030] Combine the following Figures 1 to 14 , describing an embodiment of the present application.

[0031] According to an embodiment of the present application, on the one hand, a server is provided, having a first direction X and a second direction Y intersecting each other, such as Figure 1 As shown, it includes a chassis, a mid-backplane module 1, a data processing module 2, a fan module 3, an expansion module 4 and a power supply module 5. The specific scheme is as follows.

[0032] like Figure 1 As shown, the mid-backplane module 1 can be fixed in the chassis by snapping or screwing an I-nail with a stud in the chassis, and extends along the first direction X. The mid-backplane module 1 has a built-in circuit for signal transmission, including control signals and power supply signals, etc.; at least one data processing module 2 is provided, and the data processing module 2 is located on one side of the mid-backplane module 1 along the second direction Y, and is wirelessly connected to the mid-backplane module 1; the fan module 3 is wirelessly connected to the mid-backplane module 1; the extension module 4 is wirelessly connected to the mid-backplane module 1, and is used to connect the extension device; the power supply module 5 is wirelessly connected to the mid-backplane module 1.

[0033] Among them, the expansion module 4, the fan module 3, the data processing module 2 and the power supply module 5 are arranged in the chassis along the first direction X, and signal interaction is performed between them through the mid-backplane module 1. Specifically, the signal interaction includes control signals, power supply signals and other various signals that need to be transmitted for the operation of the service area system.

[0034] Specifically, the angle between the first direction X and the second direction Y may be 60° to 90°, specifically 60°, 70°, 80° and 90°, preferably 90° ( Figure 1 Of course, other angles are possible according to specific needs.

[0035] It should be noted that the "wireless connection" mentioned above refers to connection without cables, and can be connected by plugging, welding, etc.

[0036] It should be explained that “the data processing module 2 is located on one side of the mid-backplane module 1 along the second direction Y” means that the data processing module 2 and the mid-backplane module 1 are arranged side by side along the second direction Y.

[0037] It should also be noted that in “the expansion module 4, the fan module 3, the data processing module 2 and the power module 5 are arranged in the chassis along the first direction X”, the expansion module 4, the fan module 3, the data processing module 2 and the power module 5 can be arranged in any order along the first direction X. For example, the fan module 3 can be set at any position along the first direction X in the chassis, specifically at the two end positions and the middle position along the first direction X in the chassis. The expansion module 4, the data processing module 2 and the power module 5 can also be adjusted at will in the chassis along the first direction X according to specific heat dissipation requirements.

[0038] Specifically, the chassis can be a metal box or a plastic box, etc., and can be selected according to specific needs, such as a box with waterproof material.

[0039] In this embodiment, if Figure 1 As shown, by setting a mid-backplane module 1 extending along a first direction X in the chassis, and arranging the extension module 4, the fan module 3, the data processing module 2 and the power module 5 in the chassis along the first direction X, and all of them are wirelessly connected to the mid-backplane module 1, so that the control signal and power supply signal transmission between the extension module 4, the fan module 3, the data processing module 2 and the power module 5 can be realized through the mid-backplane module 1, so that there is no need to set up cables, the resistance of the heat dissipation airflow generated by the fan module can be reduced, the flow rate of the heat dissipation airflow can be increased, thereby improving the air-cooling heat dissipation effect inside the server, reducing the energy consumption of the fan module 3 to meet the PUE index requirements, and reducing noise.

[0040] In one embodiment, Figure 1As shown, a data processing module 2 is disposed on both sides of the mid-backplane module 1 along the second direction Y, that is, the number of the data processing modules 2 is two.

[0041] In this embodiment, by providing a data processing module 2 on both sides of the mid-backplane module 1, the size of the server can be reduced and the area occupied by the server can be reduced.

[0042] In some embodiments not shown, multiple data processing modules 2 are arranged on both sides of the middle backplane module 1 along the second direction Y; specifically, the number of data processing modules 2 can be 3 to 6, specifically 3, 4, 5 and 6; specifically, if there are multiple data processing modules 2 located on one side of the middle backplane module 1, the multiple data processing modules 2 can be arranged side by side along the first direction X and connected to the middle backplane module 1; or multiple data processing modules 2 can be arranged at intervals and overlap along the third direction and connected to the middle backplane module 1, wherein the third direction is arranged at an angle to both the first direction X and the second direction Y, and preferably, any two of the first direction X, the second direction Y and the third direction are arranged vertically.

[0043] In one embodiment, Figure 1 , Figure 7 and Figure 8 As shown, the data processing module 2 located on one side of the middle backplane module 1 is centrally symmetrically arranged with the data processing module 2 located on the other side of the middle backplane module 1, and the symmetry axes of the data processing modules 2 located on both sides of the middle backplane module 1 are perpendicular to both the first direction X and the second direction Y; that is, the data processing modules 2 located on both sides of the middle backplane module 1 are of the same model, and the data processing module 2 located on one side of the middle backplane module 1 can be installed on the other side of the middle backplane module 1 by rotating it 180° around the center of symmetry; that is to say, the data processing modules 2 can be universally used.

[0044] In the specific use process, such as Figure 1 , Figure 7 and Figure 8 As shown, the data processing module 2 has multiple connection parts with the mid-backplane module 1, and the types are different. For example, the data processing module 2 is provided with a mainboard high-speed signal plug 221, a mainboard low-speed signal plug 222, and a mainboard power supply plug 223, which are respectively used to plug with the mainboard high-speed signal plug interface 13, the mainboard low-speed signal plug interface 14, and the mainboard power supply plug interface 15 on the mid-backplane module 1. Then, the mainboard high-speed signal plug interface 13, the mainboard low-speed signal plug interface 14, and the mainboard power supply plug interface 15 located on both sides of the mid-backplane module 1 are also centrally symmetrically arranged.

[0045] In this implementation, by arranging the data processing modules 2 on both sides of the mid-backplane 1 in a centrally symmetrical manner, the data processing modules 2 on both sides of the mid-backplane module 1 can be made universal, thereby reducing the development cost of the server.

[0046] In some embodiments not shown, the data processing modules 2 located on both sides of the mid-backplane module 1 may be symmetrically arranged, and the center plane of symmetry is perpendicular to the second direction Y; that is, the data processing modules 2 located on both sides of the mid-backplane module 1 are of different models, and in this case, the plug-in structure located on both sides of the mid-backplane module 1 for connecting to the data processing modules 2 is also a symmetrical structure.

[0047] In some embodiments not shown, the data processing module 2 located on one side of the mid-backplane module 1 is centrally symmetrically arranged with the data processing module 2 located on the other side of the mid-backplane module 1, and the symmetry axes of the data processing modules 2 located on both sides of the mid-backplane module 1 are arranged parallel to the first direction X. At this time, the plug-in structure located on both sides of the mid-backplane module 1 for connecting with the data processing module 2 is also a centrally symmetrical structure.

[0048] In one embodiment, Figure 6 and Fig.12 As shown, the data processing module 2 includes a drawer component 21 and a mainboard unit 22. The mainboard unit 22 can be fixedly arranged on the drawer component 21 by means of a snap-on structure or screw connection. Fig.12 As shown, slots are provided on both sides of the chassis along the second direction Y, and the pull-out components 21 are plugged into the slots so that the mainboard unit 22 and the mid-backplane module 1 are connected along the second direction Y by hot plugging.

[0049] Specifically, Figure 6 and Fig.12 As shown, the pull-out component 21 can be a drawer with slide rails installed on both sides, and correspondingly, slide grooves are installed at the positions corresponding to the slide rails in the slot, and an avoidance portion is provided at the position of the drawer close to the mid-back panel module 1, so that the plug on the mainboard unit 22 can be connected to the mid-back panel module 1 through a hot-swap board; of course, the pull-out component 21 can also be a flat plate or other types of structures, as long as it can be blindly plugged into the slot to facilitate blind plugging of the mainboard unit 22 and the mid-back panel module 1.

[0050] In this embodiment, the mainboard unit 22 is fixed on the pull-out component 21, and slots are provided on both sides of the chassis along the second direction Y, and the pull-out component 21 and the slots are plugged in along the second direction Y, thereby not only achieving blind plug-in of the mainboard unit 22 and the mid-backplane module 1, but also facilitating disassembly and assembly; at the same time, the mainboard unit 22 and the mid-backplane module 1 are connected through hot plugging, and when there are multiple data processing modules 2 in the server, the server can be repaired without cutting off the power supply.

[0051] In one embodiment, Figure 1 As shown, the expansion module 4 and the power module 5 are respectively connected to the two ends of the mid-backplane module 1 along the first direction X by plugging, and the fan module 3 and the data processing module 2 are located between the expansion module 4 and the power module 5; Figure 1 As shown, the expansion module 4 and the power module 5 are plugged into the chassis along the first direction X, and the expansion module 4 is hot-pluggably connected to the mid-backplane module 1 .

[0052] Specifically, Figure 2 As shown, the expansion module 4 may be provided with a plurality of connection parts for connecting with expansion devices (such as a solid state drive, a mechanical hard drive, etc.) without cables.

[0053] More specifically, both the expansion module 4 and the power module 5 are provided with a guide portion to cooperate with the guide groove portion in the chassis, so that the expansion module 4 and the chassis are blindly plugged along the first direction X, and the power module 5 and the chassis are blindly plugged along the first direction X. Furthermore, the guide portion can be provided on the edge of the expansion module 4 or the edge of the power module 5, and extend to a rectangular parallelepiped or other structure along the first direction X. As long as it can slide and cooperate with the guide groove portion, the blind installation of the expansion module 4 or the power module 5 along the first direction X can be realized.

[0054] It is worth noting that the plugging direction of the expansion module 4 and the chassis is opposite to the plugging direction of the power module 5 and the chassis.

[0055] In this embodiment, if Figure 1 As shown, by respectively arranging the power module 5 and the extension module 4 at the two end positions of the mid-backplane module 1 along the first direction X, and plugging them with the mid-backplane module 1 along the first direction X, the power module 5 and the extension module 4 can be easily disassembled and repaired when a failure occurs; at the same time, the extension module 4 is connected to the mid-backplane module 1 through hot plugging, so that the extension module 4 can be removed for maintenance without cutting off the power supply of the server, thereby improving the maintenance convenience of the server.

[0056] In a specific embodiment, Figure 1 As shown, the expansion module 4 includes at least one expansion module 41, such as Figure 2 As shown, the expansion module 41 is provided with a plurality of expansion slots on one end surface along the first direction X. Figure 3 and Figure 4 As shown, the other end face of the extension module 41 along the first direction X is connected to the mid-backplane module 1 through hot plugging. Specifically, the number of the extension modules 41 can be 1 to 4, specifically any one of 1, 2, 3 and 4. Preferably, as shown in FIG. Figure 1 and Fig.10As shown, the number of extension modules 41 is preferably 2; when the number of extension modules 41 exceeds 3, the extension modules 41 can be wirelessly connected to a circuit board, and the circuit board is then hot-plugged to the mid-backplane module 1.

[0057] Specifically, Figures 2 to 4 As shown, taking the number of expansion modules 41 as 2 as an example, the expansion module 41 is an NVME backplane (NVME, namely Non-Volatile Memory express, is a high-performance storage access and transmission protocol); the two NVME backplanes are arranged side by side along the second direction Y.

[0058] On one of the NVME backplanes, such as Figure 2 As shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a backplane interface widely used in industrial-grade solid-state drives (SSDs) or mechanical hard drives (HDDs)) are arranged on the side facing the outside of the chassis to expand 12 NVME SSDs; Figure 3 As shown, at the lower right corner of the side facing the inside of the chassis is a first expansion plug 43, which is specifically a high-density connector for plugging with the mid-backplane module 1 to implement the input of uplink signals of the expansion device, the input of low-speed signals and power supply.

[0059] On another NVME backplane, such as Figure 2 As shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a backplane interface widely used in industrial-grade solid-state drives (SSDs) or mechanical hard drives (HDDs)) are arranged on the side facing the outside of the chassis to expand 12 NVME SSDs; Figure 4 As shown, at the lower left corner of the side facing the inside of the chassis is a first expansion plug 43, specifically a high-density connector, which is used to be plugged into the mid-backplane module 1 to implement the input of uplink signals of the expansion device, the input of low-speed signals and power supply.

[0060] The 48 upstream PCIE lane signals of the two NVME backplanes come from the two data processing modules 2 respectively, and the low-speed signals of the two NVME backplanes come from the baseboard management controllers of the two data processing modules 2 respectively, which are used to monitor the status of 12 NVMESSDs, and the power supply is taken from the middle backplane.

[0061] Specifically, Figures 2 to 4 As shown, a plurality of ventilation slots 42 are arranged on the expansion module 41 to facilitate air intake.

[0062] In this embodiment, the expansion module 4 includes at least one expansion module 41, and a plurality of expansion plug-in slots are arranged on one end face of the expansion module 41 along the first direction X. The other end face of the expansion module 41 along the first direction X is connected to the mid-backplane module 1 through hot plugging. Therefore, when there are multiple expansion modules 41, they can be grouped for disassembly and maintenance, thereby improving the operating efficiency of the server during maintenance.

[0063] In one embodiment, Figure 1 As shown, the power module 5 includes a first signal board 51, a power supply unit 52 and an extension unit 53. The first signal board 51 extends along the second direction Y. The first signal board 51 is plugged into the mid-backplane module 1 along the first direction X. Both the power supply unit 52 and the extension unit 53 are provided with at least one. The power supply unit 52 and the extension unit 53 are arranged side by side along the second direction Y and are both wirelessly connected to the first signal board 51.

[0064] It should be noted that the first signal board 51 can transmit control signals, power supply signals and other interactive signals required by the power supply unit 52 and the extension unit 53 and other components.

[0065] Specifically, the expansion unit 53 is a PCIE expansion board, which is used to plug in a PCIE Riser.

[0066] In this embodiment, by providing an expansion unit 53 in the power module 5, expansion equipment can be further added to the server.

[0067] In a specific embodiment, Figure 1 As shown, the power supply unit 52 and the expansion unit 53 are both connected to one side of the first signal board 51 along the first direction X through hot plugging, and the other side of the first signal board 51 along the first direction X is hot plugged to the mid-backplane module 1.

[0068] Specifically, Fig.11 As shown, the power supply unit 52 is an AC power supply, the number is 1 to 2, preferably 2; the expansion unit 53 is a PCIE expansion board, the number is 1 to 2, preferably 2, wherein the two expansion units 53 are respectively connected to the two data processing modules 2 for signal connection.

[0069] Specifically, Fig. 9 As shown, a second extension plug 512 and a first power supply plug 511 are provided in the middle and upper part of one side of the first signal board 51 close to the mid-backplane module 1, which are used to be plugged in with the mid-backplane module 1; the second extension plug 512 realizes information interaction between the extension device in the extension unit 53 and the data processing module 2, and the first power supply plug 511 realizes providing power to the mid-backplane module 1.

[0070] like Fig. 9As shown, at least one third extension plug interface 514 and at least one second power supply plug interface 513 are provided on the side of the first signal board 51 away from the mid-backplane module 1, and the third extension plug interface 514 is used to be plugged with the third extension plug 531 on the extension unit 53, as shown in FIG. Fig.14 As shown, the second power supply socket 513 is used to be plugged into the second power supply plug 521 on the power supply unit 52 .

[0071] More specifically, Fig. 9 As shown, the second power supply socket 513 is a CRPS socket (Common Redundant Power Supply, a server power supply specification with a standardized design); Fig.13 As shown, the third expansion interface 514 is a PCIERiser (PCIE+power supply) ~ female connector, connected to the expansion unit 53, the power supply is directly taken from the first signal board 51, and the 32 upstream PCIE lanes come from a data processing module 2, such as Fig.13 As shown, each expansion unit 53 can expand 1 x16 slot and 2 x8 slots.

[0072] The second expansion plug 512 is a low-speed signal-male connector, which is connected to the second expansion interface 16 of the mid-backplane module 1. The second expansion interface 16 is specifically a PCIE Riser~female connector. The uplink PCIE signal comes from the 32 PCIE Lanes of the two data processing modules 2, and the low-speed signal comes from the baseboard management controllers of the two data processing modules 2. They are respectively connected to the two expansion units 53 for monitoring and management of PCIE devices, and are also connected to the power supply unit 52 for monitoring and management of the power supply. The power supply unit 52 can also be called a PSU (Power Supply Unit).

[0073] In one embodiment, a plurality of ventilation holes are provided on the first signal plate 51; and / or Figure 2 As shown, the expansion module 4 is provided with a ventilation slot 42; specifically, the shape of the ventilation hole can be set according to the shapes of other components on the first signal board 51, and common shapes include rectangle, circle, etc.; the ventilation slot 42 is set between two adjacent expansion devices on the expansion module 4, and is rectangular, and can also be set to other shapes according to needs, such as circle, etc.

[0074] In this embodiment, by providing ventilation holes on the first signal board 51 and ventilation slots 42 on the expansion module 4, the resistance to the cooling airflow can be reduced, the heat dissipation efficiency can be improved, and the energy consumption of the fan module and the noise can be reduced.

[0075] In one embodiment, Figure 1 and Figure 5As shown, the fan module 3 includes a fan unit 31 and a second signal board 32, the second signal board 32 extends along the second direction Y, and a plurality of fan units 31 are provided, and the plurality of fan units 31 are arranged side by side along the second direction Y, and are wirelessly connected to the second signal board 32 by plugging or welding, and the second signal board 32 is wirelessly connected to the mid-backplane module 1 by plugging or welding, as shown in FIG. Figure 1 As shown, the plurality of fan units 31 are arranged in two groups and are respectively located on two sides of the mid-backplane module 1 .

[0076] Specifically, the fan unit 31 is a 6056 fan module; the number of the fan units 31 is 4 to 8, specifically any one of 4, 6 and 8. Preferably, the number of the fan units 31 is 6 (as shown in the figure), with 3 on each side of the backplane module 1.

[0077] Specifically, Figure 5 As shown, the second signal board 32 is provided with a fan control plug 321 and a fan power plug 322 to be plugged with the fan control plug interface 12 and the fan power plug interface 17 on the mid-backplane module 1. More specifically, the fan control plug 321 and the fan power plug 322 are both high-density connectors.

[0078] In this embodiment, if Figure 1 As shown, multiple fan units 31 are wirelessly connected to the second signal board 32, the second signal board 32 is connected to the mid-backplane module 1, and the multiple fan units 31 are divided into two groups and are respectively located on both sides of the mid-backplane module 1. The speeds of the fan units 31 are respectively controlled by the data processing modules 2 located on both sides of the mid-backplane module 1 to perform air cooling on the data processing modules 2 located on both sides of the mid-backplane module 1, thereby improving the temperature control accuracy of the system.

[0079] In one embodiment, each fan unit 31 is plugged into the chassis along the first direction X, and each fan unit 31 is hot-pluggably connected to the second signal board 32 along the first direction X; specifically, a guide groove extending along the first direction X is provided in the chassis, and a slider corresponding to the guide groove is provided on the outer periphery of the fan unit 31. The fan unit 31 is slidably plugged into the chassis through the sliding cooperation between the slider and the guide groove, so as to realize the hot-pluggable connection between the fan unit 31 and the second signal board 32.

[0080] During the specific maintenance process of the server, when a fan unit 31 is found to be faulty, the expansion module 41 corresponding to the position of the faulty fan unit 31 in the expansion module 4 is first removed from the front window end of the server, and then the faulty fan unit 31 is removed from the front window of the server for replacement, thereby enabling the fan unit 31 to be repaired without powering off the server.

[0081] In one embodiment, the server also includes an air guide component, the fan module 3 is arranged between the expansion module 4 and the data processing module 2, and two air guide components are provided, which are respectively located on both sides of the backplane module 1 and are both located between the fan module 3 and the power module 5.

[0082] Specifically, the air guide assembly is two air guide plates extending along the first direction X. The shape of the air guide assembly along the first direction X can be selected and set according to specific needs.

[0083] In this embodiment, by setting the fan module 3 between the expansion module 4 and the data processing module 2, the air cooling effect on the data processing module 2 can be enhanced; and the two air guide components are respectively set on both sides of the backplane module 1, and both are located between the fan module 3 and the power module 5, which can reduce the leakage of air flow and improve the air cooling effect on the data processing module 2.

[0084] In one embodiment, Figure 5 As shown, a first control module 323 is provided on the second signal board 32, specifically a CPLD (Complex Programmable Logic Device), and the first control module 323 can control the speed difference of the fan units 31 located on both sides of the mid-backplane module 1 to be 30%~45%; specifically, the speed difference of the fan units 31 located on both sides of the mid-backplane module 1 is any one of 30%, 35%, 40% and 45%, preferably 40%.

[0085] During specific use, when one data processing module 2 controls the speed of the fan unit 31 on its corresponding side to 80%, and another data processing module 2 controls the speed of the fan unit 31 on its corresponding side to 30%, in order to avoid the speed difference of the fan units 31 on both sides of the backplane module 1 being too large to cause backflow, the first control module 323 can increase the speed of the fan unit 31 with a low speed, increasing its speed from 30% to 40%, thereby making the speed difference 40%.

[0086] After the first control module 323 detects an abnormality in the baseboard management controller on the data processing module 2 through the hardware watchdog, it can control the fan unit 31 to dissipate heat for the server at full speed.

[0087] In this embodiment, the first control module 323 is provided to adjust the speed difference of the fan units 31 located on both sides of the mid-backplane module 1, thereby reducing backflow and improving the air cooling effect.

[0088] In one embodiment, Figure 6As shown, the mainboard unit 22 is provided with a mainboard high-speed signal plug 221, a mainboard low-speed signal plug 222 and a mainboard power supply plug 223 which are plugged into the mid-backplane module 1 at the edge thereof near the mid-backplane module 1. The mainboard high-speed signal plug 221, the mainboard low-speed signal plug 222 and the mainboard power supply plug 223 are arranged at intervals along the first direction X.

[0089] Among them, the mainboard high-speed signal plug 221 is used to provide high-speed signals to the expansion device, and the mainboard low-speed signal plug 222 is used to provide low-speed control signals and PCIE signals to the expansion device, as well as to provide low-speed control signals to the fan module 3 and the power module 5.

[0090] Specifically, the motherboard high-speed signal plug 221 is a PCIE X48 / high-density connector-male plug, the motherboard low-speed signal plug 222 is a PCIE X32 / high-density connector-male plug, and the motherboard power supply plug 223 is a power supply male plug.

[0091] In this embodiment, the motherboard unit 22 is hot-plugged and connected to the mid-backplane module 1 through the motherboard high-speed signal plug 221, the motherboard low-speed signal plug 222 and the motherboard power supply plug 223, so that the interaction of various signals can be achieved.

[0092] In one embodiment, the mid-backplane module 1 includes a board body and a fixing frame, and the board body is fixed in the chassis through the fixing frame. Specifically, the board body is a circuit board with a thickness of 3 mm to 5 mm, and the fixing frame is a plastic bracket.

[0093] like Figure 7 As shown, on one side of the board body along the second direction Y, a first expansion socket 11, a fan control socket 12, a mainboard high-speed signal socket 13, a mainboard low-speed signal socket 14, a mainboard power supply socket 15 and a first power supply socket 18 are sequentially arranged along the first direction X.

[0094] like Figure 8 As shown, on the other side of the board body along the second direction Y, a first expansion socket 11, a fan power socket 17, a mainboard power socket 15, a mainboard low-speed signal socket 14, a mainboard high-speed signal socket 13 and a second expansion socket 16 are sequentially arranged along the first direction X.

[0095] The two first expansion plug interfaces 11 located on both sides of the middle backplane module 1 are respectively used to connect with the two expansion modules 41 in the expansion module 4 to transmit control signals and power supply signals; Specifically, Figure 7 , Figure 8 and Figure 3As shown, the first expansion interface is connected to the first expansion plug 43 on the expansion module 41, the upstream 48 PCIE lane signals come from the processor in the data processing module 2, the upstream low-speed signals come from the baseboard management controller of the data processing module 2, and the power supply comes from the first signal board 51.

[0096] like Figure 7 , Figure 8 and Figure 6 As shown, two groups of motherboard high-speed signal plug-in interfaces 13, motherboard low-speed signal plug-in interfaces 14 and motherboard power supply plug-in interfaces 15 are located on both sides of the mid-backplane module 1, which are respectively used to connect with the data processing modules 2 located on both sides of the mid-backplane module 1.

[0097] Specifically, the high-speed signal plug interface is PCIE X48 / high-density connector-female head, which is connected to the PCIEX48 / high-density connector-male head of the motherboard unit 22. The upstream 48 PCIE lane signals come from the processor of the data processing module 2, and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53.

[0098] The motherboard low-speed signal plug-in interface 14 is a PCIE X32 / high-density connector-female head, which is connected to the PCIEX32 / high-density connector-male head of the motherboard unit 22. The upstream 32 PCIE lane signals come from the processor of the data processing module 2, which are used to provide the PCIE signal of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53. The low-speed signal comes from the processor and baseboard management controller of the node 1, which is used to provide the PCIE signal of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53, and provide the low-speed control signal output by the data processing module 2 to the power supply unit 52 and the fan module 3.

[0099] like Figure 7 , Figure 8 and Figure 6 As shown, the mainboard power supply interface 15 is a power supply female connector, which is connected to the power supply male connector of the mainboard unit 22 for supplying power to the data processing module 2 .

[0100] like Figure 7 , Figure 8 and Figure 5As shown, the fan control socket 12 and the fan power supply socket 17 are used to connect to the fan module 3. Specifically, the fan control socket 12 is a female plug, which is connected to the fan control plug 321 (male plug) on ​​the second signal board 32; the uplink controller signal comes from the baseboard management controller of the two data processing modules 2, which sends a PWM signal for controlling the speed of the fan unit 31 and a TACH signal for obtaining the fan speed information in combination with the heat dissipation regulation strategy; the fan power supply socket 17 is a female plug, which is connected to the fan power supply plug 322 (male plug) on ​​the second signal board 32 to power the fan unit 31.

[0101] like Figure 7 , Figure 8 and Fig. 9 As shown, the first power supply interface 18 and the second extension interface 16 are used to connect to the power module 5. Specifically, the first power supply interface 18 is connected to the first power supply plug 511 on the first signal board 51, and the second extension interface 16 is connected to the second extension plug 512 on the extension unit 53.

[0102] In this embodiment, the middle backplane module 1 is connected to the extension module 4, the fan module 3, the data processing module 2 and the power module 5 through plugs and plug interfaces, which has a simple structure and is easy to install.

[0103] The following is a comprehensive description of all the above solutions using an embodiment.

[0104] This embodiment provides a server having a first direction X and a second direction Y intersecting each other, such as Figure 1 As shown, it includes a chassis, a mid-backplane module 1, a data processing module 2, a fan module 3, an expansion module 4 and a power supply module 5. The specific scheme is as follows.

[0105] like Figure 1 As shown, the mid-backplane module 1 can be fixed in the chassis by snap-fitting or screwing an I-nail with a stud in the chassis, and extends along a first direction X. The mid-backplane module 1 has a built-in circuit for signal transmission, including control signals and power supply signals, etc.; at least one data processing module 2 is provided, and the data processing module 2 is located on one side of the mid-backplane module 1 along the second direction Y, and is wirelessly connected to the mid-backplane module 1; the fan module 3 is wirelessly connected to the mid-backplane module 1; the extension module 4 is wirelessly connected to the mid-backplane module 1, and is used to connect an extension device; the power supply module 5 is wirelessly connected to the mid-backplane module 1.

[0106] Among them, the expansion module 4, the fan module 3, the data processing module 2 and the power supply module 5 are arranged in the chassis along the first direction X, and signal interaction is performed between them through the mid-backplane module 1. Specifically, the signal interaction includes control signals, power supply signals and other various signals that need to be transmitted for the operation of the service area system.

[0107] Specifically, the angle between the first direction X and the second direction Y may be 60° to 90°, specifically 60°, 70°, 80° and 90°, preferably 90° ( Figure 1 Of course, other angles are possible according to specific needs.

[0108] Specifically, the chassis can be a metal box or a plastic box, etc., and can be selected according to specific needs, such as a box with waterproof material.

[0109] Further, such as Figure 1 As shown, a data processing module 2 is disposed on both sides of the mid-backplane module 1 along the second direction Y, that is, the number of the data processing modules 2 is two.

[0110] Further, such as Figure 1 , Figure 7 and Figure 8 As shown, the data processing module 2 located on one side of the middle backplane module 1 is centrally symmetrically arranged with the data processing module 2 located on the other side of the middle backplane module 1, and the symmetry axes of the data processing modules 2 located on both sides of the middle backplane module 1 are perpendicular to both the first direction X and the second direction Y; that is, the data processing modules 2 located on both sides of the middle backplane module 1 are of the same model, and the data processing module 2 located on one side of the middle backplane module 1 can be installed on the other side of the middle backplane module 1 by rotating it 180° around the center of symmetry; that is to say, the data processing modules 2 can be universally used.

[0111] Further, such as Figure 6 and Fig.12 As shown, the data processing module 2 includes a drawer component 21 and a mainboard unit 22. The mainboard unit 22 can be fixedly arranged on the drawer component 21 by means of a snap-on structure or screw connection. Fig.12 As shown, slots are provided on both sides of the chassis along the second direction Y, and the pull-out components 21 are plugged into the slots so that the mainboard unit 22 and the mid-backplane module 1 are connected along the second direction Y by hot plugging.

[0112] Specifically, Figure 6 and Fig.12 As shown, the pull-out component 21 can be a drawer with slide rails installed on both sides, and correspondingly, slide grooves are installed at the positions corresponding to the slide rails in the slot, and an avoidance portion is provided at the position of the drawer close to the mid-back panel module 1, so that the plug on the mainboard unit 22 can be connected to the mid-back panel module 1 through a hot-swap board; of course, the pull-out component 21 can also be a flat plate or other types of structures, as long as it can be blindly plugged into the slot to facilitate blind plugging of the mainboard unit 22 and the mid-back panel module 1.

[0113] Further, such as Figure 1As shown, the expansion module 4 and the power module 5 are respectively connected to the two ends of the mid-backplane module 1 along the first direction X by plugging, and the fan module 3 and the data processing module 2 are located between the expansion module 4 and the power module 5; Figure 1 As shown, the expansion module 4 and the power module 5 are plugged into the chassis along the first direction X, and the expansion module 4 is hot-pluggably connected to the mid-backplane module 1 .

[0114] Specifically, Figure 2 As shown, the expansion module 4 may be provided with a plurality of connection parts for connecting with expansion devices (such as a solid state drive, a mechanical hard drive, etc.) without cables.

[0115] More specifically, both the expansion module 4 and the power module 5 are provided with a guide portion to cooperate with the guide groove portion in the chassis, so that the expansion module 4 and the chassis are blindly plugged along the first direction X, and the power module 5 and the chassis are blindly plugged along the first direction X. Furthermore, the guide portion can be provided on the edge of the expansion module 4 or the edge of the power module 5, and extend to a rectangular parallelepiped or other structure along the first direction X. As long as it can slide and cooperate with the guide groove portion, the blind installation of the expansion module 4 or the power module 5 along the first direction X can be realized.

[0116] It is worth noting that the plugging direction of the expansion module 4 and the chassis is opposite to the plugging direction of the power module 5 and the chassis.

[0117] Further, such as Figure 1 As shown, the expansion module 4 includes at least one expansion module 41, such as Figure 2 As shown, the expansion module 41 is provided with a plurality of expansion slots on one end surface along the first direction X. Figure 3 and Figure 4 As shown, the other end face of the extension module 41 along the first direction X is connected to the mid-backplane module 1 through hot plugging. Specifically, the number of the extension modules 41 can be 1 to 4, specifically any one of 1, 2, 3 and 4. Preferably, as shown in FIG. Figure 1 and Fig.10 As shown, the number of extension modules 41 is preferably 2; when the number of extension modules 41 exceeds 3, the extension modules 41 can be wirelessly connected to a circuit board, and the circuit board is then hot-plugged to the mid-backplane module 1.

[0118] Specifically, Figures 2 to 4 As shown, taking the number of expansion modules 41 as 2 as an example, the expansion module 41 is an NVME backplane (NVME, i.e. Non-Volatile Memory express, is a high-performance storage access and transmission protocol); the two NVME backplanes are both along the second direction Y, and the two NVME backplanes are arranged side by side along the second direction Y.

[0119] On one of the NVME backplanes, such as Figure 2 As shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a backplane interface widely used in industrial-grade solid-state drives (SSDs) or mechanical hard drives (HDDs)) are arranged on the side facing the outside of the chassis to expand 12 NVME SSDs; Figure 3 As shown, at the lower right corner of the side facing the inside of the chassis is a first expansion plug 43, which is specifically a high-density connector for plugging with the mid-backplane module 1 to implement the input of uplink signals of the expansion device, the input of low-speed signals and power supply.

[0120] On another NVME backplane, such as Figure 2 As shown, 12 SFF 8639 connectors (also known as U.2 connectors, which are a backplane interface widely used in industrial-grade solid-state drives (SSDs) or mechanical hard drives (HDDs)) are arranged on the side facing the outside of the chassis to expand 12 NVME SSDs; Figure 4 As shown, at the lower left corner of the side facing the inside of the chassis is a first expansion plug 43, specifically a high-density connector, which is used to be plugged into the mid-backplane module 1 to implement the input of uplink signals of the expansion device, the input of low-speed signals and power supply.

[0121] The 48 upstream PCIE lane signals of the two NVME backplanes come from the two data processing modules 2 respectively, and the low-speed signals of the two NVME backplanes come from the baseboard management controllers of the two data processing modules 2 respectively, which are used to monitor the status of 12 NVMESSDs, and the power supply is taken from the middle backplane.

[0122] Specifically, Figures 2 to 4 As shown, a plurality of ventilation slots 42 are arranged on the expansion module 41 to facilitate air intake.

[0123] Further, such as Figure 1 As shown, the power module 5 includes a first signal board 51, a power supply unit 52 and an extension unit 53. The first signal board 51 extends along the second direction Y. The first signal board 51 is plugged into the mid-backplane module 1 along the first direction X. Both the power supply unit 52 and the extension unit 53 are provided with at least one. The power supply unit 52 and the extension unit 53 are arranged side by side along the second direction Y and are both wirelessly connected to the first signal board 51.

[0124] It should be noted that the first signal board 51 can transmit control signals, power supply signals and other interactive signals required by the power supply unit 52 and the extension unit 53 and other components.

[0125] Specifically, the expansion unit 53 is a PCIE expansion board, which is used to plug in a PCIE Riser.

[0126] Further, such as Figure 1 As shown, the power supply unit 52 and the expansion unit 53 are both connected to one side of the first signal board 51 along the first direction X through hot plugging, and the other side of the first signal board 51 along the first direction X is hot plugged to the mid-backplane module 1.

[0127] Specifically, Fig.11 As shown, the power supply unit 52 is an AC power supply, the number is 1 to 2, preferably 2; the expansion unit 53 is a PCIE expansion board, the number is 1 to 2, preferably 2, wherein the two expansion units 53 are respectively connected to the two data processing modules 2 for signal connection.

[0128] Specifically, Fig. 9 As shown, a second extension plug 512 and a first power supply plug 511 are provided in the middle and upper part of one side of the first signal board 51 close to the mid-backplane module 1, which are used to be plugged in with the mid-backplane module 1; the second extension plug 512 realizes information interaction between the extension device in the extension unit 53 and the data processing module 2, and the first power supply plug 511 realizes providing power to the mid-backplane module 1.

[0129] like Fig. 9 As shown, at least one third extension plug interface 514 and at least one second power supply plug interface 513 are provided on the side of the first signal board 51 away from the mid-backplane module 1, and the third extension plug interface 514 is used to be plugged with the third extension plug 531 on the extension unit 53, as shown in FIG. Fig.14 As shown, the second power supply socket 513 is used to be plugged into the second power supply plug 521 on the power supply unit 52 .

[0130] More specifically, Fig. 9 As shown, the second power supply socket 513 is a CRPS socket (Common Redundant Power Supply, a server power supply specification with a standardized design); Fig.13 As shown, the third expansion interface 514 is a PCIERiser (PCIE+power supply) ~ female connector, connected to the expansion unit 53, the power supply is directly taken from the first signal board 51, and the 32 upstream PCIE lanes come from a data processing module 2, such as Fig.13 As shown, each expansion unit 53 can expand 1 x16 slot and 2 x8 slots.

[0131] The second expansion plug 512 is a low-speed signal-male connector, which is connected to the second expansion interface 16 of the mid-backplane module 1. The second expansion interface 16 is specifically a PCIE Riser~female connector. The uplink PCIE signal comes from the 32 PCIE Lanes of the two data processing modules 2, and the low-speed signal comes from the baseboard management controllers of the two data processing modules 2. They are respectively connected to the two expansion units 53 for monitoring and management of PCIE devices, and are also connected to the power supply unit 52 for monitoring and management of the power supply. The power supply unit 52 can also be called a PSU (Power Supply Unit).

[0132] Furthermore, the first signal plate 51 is provided with a plurality of ventilation holes; and / or, as Figure 2 As shown, the expansion module 4 is provided with a ventilation slot 42; specifically, the shape of the ventilation hole can be set according to the shapes of other components on the first signal board 51, and common shapes include rectangle, circle, etc.; the ventilation slot 42 is set between two adjacent expansion devices on the expansion module 4, and is rectangular, and can also be set to other shapes according to needs, such as circle, etc.

[0133] Further, such as Figure 1 and Figure 5 As shown, the fan module 3 includes a fan unit 31 and a second signal board 32, the second signal board 32 extends along the second direction Y, and a plurality of fan units 31 are provided, and the plurality of fan units 31 are arranged side by side along the second direction Y, and are wirelessly connected to the second signal board 32 by plugging or welding, and the second signal board 32 is wirelessly connected to the mid-backplane module 1 by plugging or welding, as shown in FIG. Figure 1 As shown, the plurality of fan units 31 are arranged in two groups and are respectively located on two sides of the mid-backplane module 1 .

[0134] Specifically, the fan unit 31 is a 6056 fan module; the number of the fan units 31 is 4 to 8, specifically any one of 4, 6 and 8. Preferably, the number of the fan units 31 is 6 (as shown in the figure), with 3 on each side of the backplane module 1.

[0135] Specifically, Figure 5 As shown, the second signal board 32 is provided with a fan control plug 321 and a fan power plug 322 to be plugged with the fan control plug interface 12 and the fan power plug interface 17 on the mid-backplane assembly. More specifically, the fan control plug 321 and the fan power plug 322 are both high-density connectors.

[0136] Furthermore, each fan unit 31 is plugged into the chassis along the first direction X, and each fan unit 31 is hot-pluggably connected to the second signal board 32 along the first direction X; specifically, a guide groove extending along the first direction X is provided in the chassis, and a slider corresponding to the slide groove is provided on the outer periphery of the fan unit 31. The fan unit 31 is slidably plugged into the chassis through the sliding cooperation between the slider and the guide groove, so as to realize the hot-pluggable connection between the fan unit 31 and the second signal board 32.

[0137] During the specific maintenance process of the server, when a fan unit 31 is found to be faulty, the expansion module 41 corresponding to the position of the faulty fan unit 31 in the expansion module 4 is first removed from the front window end of the server, and then the faulty fan unit 31 is removed from the front window of the server for replacement, thereby enabling the fan unit 31 to be repaired without powering off the server.

[0138] Furthermore, the server also includes an air guide component, the fan module 3 is arranged between the expansion module 4 and the data processing module 2, and two air guide components are provided, which are respectively located on both sides of the backplane module 1 and are both located between the fan module 3 and the power module 5.

[0139] Specifically, the air guide assembly is two air guide plates extending along the first direction X. The shape of the air guide assembly along the first direction X can be selected and set according to specific needs.

[0140] Further, such as Figure 5 As shown, a first control module 323 is provided on the second signal board 32, specifically a CPLD (Complex Programmable Logic Device), and the first control module 323 can control the speed difference of the fan units 31 located on both sides of the mid-backplane module 1 to be 30%~45%; specifically, the speed difference of the fan units 31 located on both sides of the mid-backplane module 1 is any one of 30%, 35%, 40% and 45%, preferably 40%.

[0141] During specific use, when one data processing module 2 controls the speed of the fan unit 31 on its corresponding side to 80%, and another data processing module 2 controls the speed of the fan unit 31 on its corresponding side to 30%, in order to avoid the speed difference of the fan units 31 on both sides of the backplane module 1 being too large to cause backflow, the first control module 323 can increase the speed of the fan unit 31 with a low speed, increasing its speed from 30% to 40%, thereby making the speed difference 40%.

[0142] After the first control module 323 detects an abnormality in the baseboard management controller on the data processing module 2 through the hardware watchdog, it can control the fan unit 31 to dissipate heat for the server at full speed.

[0143] Further, such as Figure 6 As shown, the mainboard unit 22 is provided with a mainboard high-speed signal plug 221, a mainboard low-speed signal plug 222 and a mainboard power supply plug 223 which are plugged into the mid-backplane module 1 at the edge thereof near the mid-backplane module 1. The mainboard high-speed signal plug 221, the mainboard low-speed signal plug 222 and the mainboard power supply plug 223 are arranged at intervals along the first direction X.

[0144] Among them, the mainboard high-speed signal plug 221 is used to provide high-speed signals to the expansion device, and the mainboard low-speed signal plug 222 is used to provide low-speed control signals and PCIE signals to the expansion device, as well as to provide low-speed control signals to the fan module 3 and the power module 5.

[0145] Specifically, the motherboard high-speed signal plug 221 is a PCIE X48 / high-density connector-male plug, the motherboard low-speed signal plug 222 is a PCIE X32 / high-density connector-male plug, and the motherboard power supply plug 223 is a power supply male plug.

[0146] Furthermore, the mid-backplane module 1 includes a board body and a fixing frame, and the board body is fixed in the chassis through the fixing frame. Specifically, the board body is a circuit board with a thickness of 3mm to 5mm, and the fixing frame is a plastic bracket.

[0147] like Figure 7 As shown, on one side of the board body along the second direction Y, a first expansion socket 11, a fan control socket 12, a mainboard high-speed signal socket 13, a mainboard low-speed signal socket 14, a mainboard power supply socket 15 and a first power supply socket 18 are sequentially arranged along the first direction X.

[0148] like Figure 8 As shown, on the other side of the board body along the second direction Y, a first expansion socket 11, a fan power socket 17, a mainboard power socket 15, a mainboard low-speed signal socket 14, a mainboard high-speed signal socket 13 and a second expansion socket 16 are sequentially arranged along the first direction X.

[0149] The two first expansion plug interfaces 11 located on both sides of the middle backplane module 1 are respectively used to connect with the two expansion modules 41 in the expansion module 4 to transmit control signals and power supply signals; Specifically, Figure 7 , Figure 8 and Figure 3As shown, the first expansion interface is connected to the first expansion plug 43 on the expansion module 41, the upstream 48 PCIE lane signals come from the processor in the data processing module 2, the upstream low-speed signals come from the baseboard management controller of the data processing module 2, and the power supply comes from the first signal board 51.

[0150] like Figure 7 , Figure 8 and Figure 6 As shown, two groups of motherboard high-speed signal plug-in interfaces 13, motherboard low-speed signal plug-in interfaces 14 and motherboard power supply plug-in interfaces 15 are located on both sides of the mid-backplane module 1, which are respectively used to connect with the data processing modules 2 located on both sides of the mid-backplane module 1.

[0151] Specifically, the high-speed signal plug interface is PCIE X48 / high-density connector-female head, which is connected to the PCIEX48 / high-density connector-male head of the motherboard unit 22. The upstream 48 PCIE lane signals come from the processor of the data processing module 2, and are used to provide the PCIE signals of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53.

[0152] The motherboard low-speed signal plug-in interface 14 is a PCIE X32 / high-density connector-female head, which is connected to the PCIEX32 / high-density connector-male head of the motherboard unit 22. The upstream 32 PCIE lane signals come from the processor of the data processing module 2, which are used to provide the PCIE signal of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53. The low-speed signal comes from the processor and baseboard management controller of the node 1, which is used to provide the PCIE signal of the data processing module 2 to the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53, and provide the low-speed control signal output by the data processing module 2 to the power supply unit 52 and the fan module 3.

[0153] like Figure 7 , Figure 8 and Figure 6 As shown, the mainboard power supply interface 15 is a power supply female connector, which is connected to the power supply male connector of the mainboard unit 22 for supplying power to the data processing module 2 .

[0154] like Figure 7 , Figure 8 and Figure 5As shown, the fan control socket 12 and the fan power supply socket 17 are used to connect to the fan module 3. Specifically, the fan control socket 12 is a female plug, which is connected to the fan control plug 321 (male plug) on ​​the second signal board 32; the uplink controller signal comes from the baseboard management controller of the two data processing modules 2, which sends a PWM signal for controlling the speed of the fan unit 31 and a TACH signal for obtaining the fan speed information in combination with the heat dissipation regulation strategy; the fan power supply socket 17 is a female plug, which is connected to the fan power supply plug 322 (male plug) on ​​the second signal board 32 to power the fan unit 31.

[0155] like Figure 7 , Figure 8 and Fig. 9 As shown, the first power supply interface 18 and the second extension interface 16 are used to connect to the power module 5. Specifically, the first power supply interface 18 is connected to the first power supply plug 511 on the first signal board 51, and the second extension interface 16 is connected to the second extension plug 512 on the extension unit 53.

[0156] During the assembly process of the above server, Figure 1 As shown, the second signal board 32 is first fixed in the chassis, and then the mid-backplane module 1 is installed in the chassis.

[0157] The fan unit 31 is inserted into the chassis along the first direction X from the front window of the server, so that the fan unit 31 is hot-swapped and connected to the second signal board 32 .

[0158] The two expansion modules 41 are inserted into the front window of the chassis, so that the expansion modules 41 are hot-swappedly connected to the mid-backplane module 1 .

[0159] The two drawer components 21 with the mainboard units 22 fixed thereon are respectively inserted into the chassis from the slots on both sides of the chassis, so that the mainboard unit 22 is hot-swappedly connected to the mid-backplane module 1 .

[0160] The first signal board 51 is inserted into the chassis along the first direction X from the rear window of the server, so that the first signal board 51 is hot-swappedly connected to the mid-backplane module 1 .

[0161] The expansion unit 53 and the power supply unit 52 are inserted into the chassis along the first direction X, so that the expansion unit 53 and the power supply unit 52 are both hot-swapped connected to the first signal board 51 .

[0162] The above-mentioned server assembly method enables multiple components to be repaired without cutting off the power supply and shutting down the server.

[0163] According to an embodiment of the present application, on the other hand, a data center is provided, comprising a server in any one of the above embodiments.

[0164] In this embodiment, the data center includes the above-mentioned server and has the same technical effect as the above-mentioned server.

[0165] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A server having a first direction (X) and a second direction (Y) intersecting each other, characterized in that: include: Chassis; A mid-backplane module (1) is arranged in the chassis and extends along the first direction (X), the mid-backplane module (1) having a built-in circuit for signal transmission; A data processing module (2), at least one of which is provided, the data processing module (2) being located on one side of the mid-backplane module (1) along the second direction (Y) and being wirelessly connected to the mid-backplane module (1); A fan module (3) wirelessly connected to the mid-backplane module (1); An extension module (4) wirelessly connected to the mid-backplane module (1) and used for connecting an extension device; A power module (5) wirelessly connected to the mid-backplane module (1); The expansion module (4), the fan module (3), the data processing module (2) and the power supply module (5) are arranged in the chassis along the first direction (X), and perform signal exchange with each other through the mid-backplane module (1).

2. The server according to claim 1, characterized in that: One data processing module (2) is arranged on each of the two sides of the mid-backplane module (1) along the second direction (Y).

3. The server according to claim 2, characterized in that: The data processing module (2) located on one side of the mid-backplane module (1) is centrally symmetrically arranged with the data processing module (2) located on the other side of the mid-backplane module (1), and the symmetry axes of the data processing modules (2) located on both sides of the mid-backplane module (1) are perpendicular to both the first direction (X) and the second direction (Y).

4. The server according to any one of claims 1 to 3, characterized in that: The data processing module (2) comprises a drawer component (21) and a mainboard unit (22); the mainboard unit (22) is arranged on the drawer component (21); slots are arranged on both side surfaces of the chassis along the second direction (Y); the drawer component (21) is plugged into the slots, so that the mainboard unit (22) is connected to the mid-backplane module (1) along the second direction (Y) by hot plugging.

5. The server according to any one of claims 1 to 3, characterized in that: The expansion module (4) and the power module (5) are respectively connected to two ends of the mid-backplane module (1) along the first direction (X), and the fan module (3) and the data processing module (2) are located between the expansion module (4) and the power module (5); The expansion module (4) and the power module (5) are plugged into the chassis along the first direction (X), and the expansion module (4) is hot-pluggably connected to the mid-backplane module (1).

6. The server according to claim 5, characterized in that: The expansion module (4) comprises at least one expansion module (41), a plurality of expansion plug-in slots being arranged on one end face of the expansion module (41) along the first direction (X), and another end face of the expansion module (41) along the first direction (X) being connected to the mid-backplane module (1) via hot plugging.

7. The server according to claim 6, characterized in that: The power module (5) comprises a first signal board (51), a power supply unit (52) and an extension unit (53); the first signal board (51) extends along the second direction (Y); the first signal board (51) is plugged into the mid-backplane module (1) along the first direction (X); at least one of the power supply unit (52) and the extension unit (53) are provided; the power supply unit (52) and the extension unit (53) are arranged side by side along the second direction (Y) and are both wirelessly connected to the first signal board (51).

8. The server according to claim 7, characterized in that: The power supply unit (52) and the expansion unit (53) are both connected to one side of the first signal board (51) along the first direction (X) through hot plugging, and the first signal board (51) is connected to the mid-backplane module (1) through hot plugging along another side of the first direction (X).

9. The server according to claim 7, characterized in that: The first signal plate (51) is provided with a plurality of ventilation holes; And / or, a ventilation slot (42) is provided on the extension module (41).

10. The server according to any one of claims 1 to 3, characterized in that: The fan module (3) comprises a fan unit (31) and a second signal board (32); the second signal board (32) extends along the second direction (Y); a plurality of the fan units (31) are provided; the plurality of fan units (31) are arranged side by side along the second direction (Y) and are wirelessly connected to the second signal board (32); the second signal board (32) is wirelessly connected to the mid-backplane module (1); and the plurality of fan units (31) are arranged in two groups and are respectively located on two sides of the mid-backplane module (1).

11. The server according to claim 10, characterized in that: It also includes an air guide component, wherein the fan module (3) is arranged between the expansion module (4) and the data processing module (2), and two air guide components are arranged, which are respectively located on both sides of the mid-backplane module (1) and are both located between the fan module (3) and the power module (5).

12. The server according to claim 11, characterized in that The second signal board (32) is provided with a first control module (323), and the first control module (323) is capable of controlling the rotation speed difference of the fan units (31) located on both sides of the mid-back board module (1) to be 30%-45%.

13. The server according to claim 4, characterized in that: The mainboard unit (22) is provided with a mainboard high-speed signal plug (221), a mainboard low-speed signal plug (222) and a mainboard power supply plug (223) plugged into the mainboard module (1) at an edge portion thereof close to the middle backplane module (1); the mainboard high-speed signal plug (221), the mainboard low-speed signal plug (222) and the mainboard power supply plug (223) are arranged at intervals along the first direction (X); The mainboard high-speed signal plug (221) is used to provide a high-speed signal to the expansion device, and the mainboard low-speed signal plug (222) is used to provide a low-speed control signal and a PCIE signal to the expansion device, and to provide a low-speed control signal to the fan module (3) and the power module (5).

14. The server according to claim 2 or 3, characterized in that: The mid-backplane module (1) comprises a plate body and a fixing frame, wherein the plate body is fixed in the chassis via the fixing frame; And / or, on a side surface of the board body along the second direction (Y), a first expansion plug interface (11), a fan control plug interface (12), a mainboard high-speed signal plug interface (13), a mainboard low-speed signal plug interface (14), a mainboard power supply plug interface (15) and a first power supply plug interface (18) are sequentially arranged along the first direction (X); On the other side of the board body along the second direction (Y), a first expansion plug interface (11), a fan power plug interface (17), a mainboard power plug interface (15), a mainboard low-speed signal plug interface (14), a mainboard high-speed signal plug interface (13) and a second expansion plug interface (16) are sequentially arranged along the first direction (X); Wherein, the two first extension plug interfaces (11) located on both sides of the middle backplane module (1) are respectively used to connect to the two extension modules (41) in the extension module (4) to transmit control signals and power supply signals; Two groups of the mainboard high-speed signal plug-in interface (13), the mainboard low-speed signal plug-in interface (14) and the mainboard power supply plug-in interface (15) located on both sides of the mid-backplane module (1) are respectively used to connect to the data processing modules (2) located on both sides of the mid-backplane module (1); The fan control plug interface (12) and the fan power supply plug interface (17) are used to connect to the fan module (3); The first power supply socket (18) and the second extension socket (16) are used to connect to a power supply module (5).

15. A data center, characterized in that: include: A server as claimed in any one of claims 1 to 14.

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