A magnetic assembly bonding method

Abstract

The present invention discloses a magnetic assembly bonding method, which comprises: when the magnets are arranged according to the Halbach polarity mutual attraction, the mutual attraction surface between the guide magnet and the non-guide magnet is adjusted to the minimum attraction force by controlling the thickness of the iron plate, thereby adjusting the spacing between the guide magnet and the non-guide magnet, and realizing the control of the thickness of the glue layer between the magnets; when the magnets are arranged according to the same polarity mutual repulsion, the magnetic assembly also includes an iron piece, and the maximum attraction force of the iron plate on half of the assembly and another magnet is adjusted by controlling the thickness of the iron plate, and the maximum attraction force is greater than the repulsion force between the half of the assembly and another magnet after the two are bonded, thereby positioning the other magnet after bonding with the half of the assembly, and realizing the control of the thickness of the glue layer between the magnets. The present invention can control the thickness of the glue layer of the magnetic assembly, improve the shear strength of the magnetic assembly, and ensure the performance of the product.

Description

Technical Field

[0001] The invention relates to the technical field of magnetic component processing, and in particular to a magnetic component bonding method. Background Art

[0002] Magnetic assembly bonding is a crucial part of the magnetic assembly manufacturing process, which directly affects the performance and service life of the magnetic assembly. Among them, Halbach magnetic assemblies and mutually exclusive magnetic assemblies are the most common production forms.

[0003] For Halbach magnetic components, magnets attract each other when arranged with the correct polarity, so it is only necessary to simply arrange them, apply glue and bond the iron parts; if there is no need to bond the iron parts, the magnets need to be separated by a certain distance, arranged and glued, and then pressure-bonded. In contrast, mutually exclusive magnetic components usually require bonding iron parts between two mutually exclusive magnets, first bonding one magnet to the iron part, and then using tooling to assist the other magnet to bond to the iron part under pressure.

[0004] During the bonding process of magnetic assemblies, the thickness of the glue layer between the magnets will be controlled according to production needs. Halbach magnetic assemblies are attracted to each other. When squeezed and positioned by external force, the thickness of the glue layer between the magnets will tend to zero, resulting in a decrease in the shear strength of the magnetic assembly, affecting the performance and quality of the magnetic assembly. Mutually repelling magnetic assemblies are difficult to accurately position when manually bonded because the magnets repel each other, which affects the control of the glue layer thickness. Even if glue with non-controlled glue layer thickness is used for bonding, the repulsive force between the magnets will affect the close fit of the magnets, resulting in poor curing of the glue, which will also lead to a decrease in the shear strength of the magnetic assembly. The use of precise positioning tooling will increase production costs, and the efficiency of using tooling for bonding is also relatively low. Summary of the invention

[0005] The object of the present invention is to provide a magnetic assembly bonding method, which can effectively control the thickness of the glue layer between magnets and improve the shear strength and production efficiency of the magnetic assembly.

[0006] To achieve the above object, the solution of the present invention is: a magnetic component bonding method, the bonding method is:

[0007] When the magnets are arranged according to the Halbach polarity mutual attraction, at least one guide magnet and at least one non-guide magnet are arranged adjacent to each other, the polarity direction of the guide magnet is horizontal, and the polarity direction of the non-guide magnet is vertical, the bonding surface of the magnet is glued, and the iron plate is adsorbed on the polarity surface of the non-guide magnet. By controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guide magnet is adjusted to the minimum suction force, thereby adjusting the spacing between the guide magnet and the non-guide magnet, and realizing the control of the thickness of the glue layer between the magnets;

[0008] When the magnets are arranged with the same polarity and mutually repel each other, the magnetic assembly also includes an iron piece, and the polar surface of one of the magnets is bonded to one side of the iron piece to form a half assembly, and the half assembly is adsorbed on the iron plate through the non-polar surface of one of the magnets, and the iron piece of the half assembly is opposite to the other magnet, and the iron piece is located between the two magnets, and the non-polar surface of the other magnet is adsorbed on the iron plate. The maximum suction force of the iron plate on the half assembly and the other magnet is adjusted by controlling the thickness of the iron plate, and the maximum suction force is greater than the repulsive force between the two after the half assembly and the other magnet are bonded, so that the other magnet is positioned after being bonded to the half assembly, and the thickness of the glue layer between the magnets is controlled.

[0009] In a preferred embodiment, when the magnets are arranged according to the Halbach polarity attraction, there are multiple guide magnets, multiple non-guide magnets, the guide magnets and the non-guide magnets are arranged at intervals, and the iron plate is adsorbed on the polarity surfaces of all non-guide magnets.

[0010] In a preferred embodiment, the number of the guide magnet is one, the number of the non-guide magnet is one, the magnetic pole on the left side of the guide magnet is an S pole, the magnetic pole on the right side of the guide magnet is an N pole, the magnetic pole on the bottom side of the non-guide magnet is an S pole, and the magnetic pole on the top side of the non-guide magnet is an N pole, the upper top surface of the guide magnet and the upper top surface of the non-guide magnet form the mutually repulsive surface, the right side surface of the guide magnet and the left side surface of the non-guide magnet form a mutually attractive surface, the repulsive force between the mutually repulsive surfaces of the guide magnet and the non-guide magnet is greater than the attractive force between the mutually attractive surfaces of the guide magnet and the non-guide magnet, and when the mutually attractive surface has the minimum attractive force, the mutually repulsive surface has the maximum repulsive force.

[0011] In a preferred embodiment, the number of the guide magnet is one, the number of the non-guide magnets is two, the non-polar surfaces of the two non-guide magnets are respectively adsorbed on the polar surfaces on both sides of the guide magnet, the polarity direction of the guide magnet is horizontal, and the polarity direction of the two non-guide magnets is longitudinal and the magnetic poles are in opposite directions.

[0012] In a preferred embodiment, the iron plate and the iron piece are both made of magnetic conductive material.

[0013] Preferably, the magnetic assembly is simulated by ANSYS software to adjust the thickness of the iron plate.

[0014] After adopting the above scheme, the beneficial effects of the present invention are:

[0015] 1. For the Halbach magnetic assembly, the present invention adsorbs an iron plate on the polar surface of the non-guided magnet, and the polar surface is located on one side of the magnet mutual attraction surface. By controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guided magnet is adjusted to the minimum attraction force, so that the attraction between the non-guided magnet and the iron plate is greater than the minimum attraction force of the mutual attraction surface. Even if the distance between the magnets is very small, they will not be adsorbed together, so that the thickness of the glue layer between the mutual attraction surfaces can be controlled, the shear strength of the magnetic assembly is improved, and the performance of the product is guaranteed.

[0016] 2. For the mutually repelling magnetic assembly, the present invention first bonds the polar surface of one of the magnets to one side of the iron piece to form a half assembly, and the half assembly is adsorbed on the iron plate through the non-polar surface of one of the magnets, and the non-polar surface of the other magnet is adsorbed on the iron plate. The maximum suction force of the iron plate on the half assembly and the other magnet is adjusted by controlling the thickness of the iron plate, and the maximum suction force is greater than the repulsive force between the half assembly and the other magnet after the two are bonded, which can reduce the difficulty of bonding the other magnet to the half assembly and improve production efficiency. Moreover, the half assembly will not be displaced due to the repulsive force during bonding, making the bonding more accurate and convenient, and it is easier to control the thickness of the glue layer, thereby improving the shear strength of the magnetic assembly and ensuring the performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the arrangement of the Halbach magnetic assembly of two magnets in the first embodiment of the present invention;

[0018] Figure 2 is a schematic diagram of the Halbach magnetic assembly of two magnets in the first embodiment of the present invention being bonded in a conventional manner and simulated using ANSYS software;

[0019] Figure 3 It is a schematic diagram of the Halbach magnetic assembly of two magnets in the first embodiment of the present invention adsorbing a thin iron plate on the polar surface of the non-guide magnet and simulating using ANSYS software;

[0020] Figure 4 It is a schematic diagram of the Halbach magnetic assembly of two magnets in the first embodiment of the present invention adsorbing a thick iron plate on the polar surface of the non-guide magnet and simulating using ANSYS software;

[0021] Figure 5 is a schematic diagram of the arrangement of the Halbach magnetic assembly of three magnets in the second embodiment of the present invention;

[0022] Figure 6 is a schematic diagram of the Halbach magnetic assembly of three magnets in the second embodiment of the present invention being bonded in a conventional manner and simulated using ANSYS software;

[0023] Figure 7It is a schematic diagram of the Halbach magnetic assembly of three magnets in the second embodiment of the present invention, in which a thin iron plate is adsorbed on the polar surfaces of all non-guide magnets and simulated using ANSYS software;

[0024] Figure 8 It is a schematic diagram of the Halbach magnetic assembly of three magnets in the second embodiment of the present invention adsorbing a thick iron plate on the polar surfaces of all non-guide magnets and simulating using ANSYS software;

[0025] Fig. 9 is a schematic diagram of the arrangement of the mutually repelling magnetic components of two magnets in the third embodiment of the present invention;

[0026] Fig.10 is a schematic diagram of the mutually repelling magnetic components of two magnets in the third embodiment of the present invention being bonded in a conventional manner and simulated using ANSYS software;

[0027] Fig.11 The mutually repelling magnetic assembly of two magnets in the third embodiment of the present invention is a schematic diagram of first bonding the second magnet to one side of the iron piece to form a half assembly, then adsorbing the half assembly and the first magnet on a thin iron plate through the non-polar surface of the magnet, and simulating using ANSYS software;

[0028] Fig.12 The mutually repelling magnetic assembly of two magnets in the third embodiment of the present invention is a schematic diagram of first bonding the second magnet to one side of the iron piece to form a half assembly, then adsorbing the half assembly and the first magnet on a thicker iron plate through the non-polar surface of the magnet, and simulating using ANSYS software;

[0029] Fig.13 This is an interface diagram of adjusting the thickness of the iron plate by using ANSYS software simulation in an embodiment of the present invention;

[0030] Fig.14 It is a schematic diagram of the magnetic force line distribution of the magnetic component simulated by ANSYS software in an embodiment of the present invention.

[0031] Description of labels:

[0032] 1. Guide magnet; 2. Non-guide magnet; 3. Iron plate; 4. Iron piece; 5. First magnet; 6. Second magnet. DETAILED DESCRIPTION

[0033] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0034] A magnetic assembly bonding method, the bonding method comprising:

[0035] When the magnets are arranged according to the Halbach polarity mutual attraction, at least one guide magnet and at least one non-guide magnet are arranged adjacent to each other, the polarity direction of the guide magnet is horizontal, and the polarity direction of the non-guide magnet is vertical, the bonding surface of the magnet is glued, and the iron plate is adsorbed on the polarity surface of the non-guide magnet. By controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guide magnet is adjusted to the minimum suction force, thereby adjusting the spacing between the guide magnet and the non-guide magnet, and realizing the control of the thickness of the glue layer between the magnets;

[0036] When the magnets are arranged with the same polarity and mutually repel each other, the magnetic assembly also includes an iron piece, and the polar surface of one of the magnets is bonded to one side of the iron piece to form a half assembly, and the half assembly is adsorbed on the iron plate through the non-polar surface of one of the magnets, and the iron piece of the half assembly is opposite to the other magnet, and the iron piece is located between the two magnets, and the non-polar surface of the other magnet is adsorbed on the iron plate. The maximum suction force of the iron plate on the half assembly and the other magnet is adjusted by controlling the thickness of the iron plate, and the maximum suction force is greater than the repulsive force between the two after the half assembly and the other magnet are bonded, so that the other magnet is positioned after being bonded to the half assembly, and the thickness of the glue layer between the magnets is controlled.

[0037] Specifically, when the magnets are arranged according to the Halbach polarity attraction, at least one guiding magnet and at least one non-guiding magnet are arranged adjacent to each other and adsorbed together, and the number and polarity direction of the guiding magnets and the non-guiding magnets are adjusted according to actual production needs.

[0038] For the Halbach magnetic assembly, the guide magnet will gather the magnetic lines of force on one side of the entire magnetic assembly and weaken the distribution of the magnetic lines of force on the other side. Therefore, the iron plate must be adsorbed on the polar surface of the non-guide magnet, and the polar surface is located on the side of the magnet mutual attraction surface. With this setting, when controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guide magnet can be adjusted to the minimum attraction force. If the iron plate is adsorbed on the side where the magnetic lines of force of the magnetic assembly converge, the attraction force of the mutual attraction surface between the guide magnet and the non-guide magnet will be increased.

[0039] By controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guide magnet is adjusted to the minimum attraction force, so that the attraction between the non-guide magnet and the iron plate is greater than the minimum attraction force of the mutual attraction surface. Even if the distance between the magnets is very small, they will not be adsorbed together, so that the spacing between the guide magnet and the non-guide magnet can be adjusted, and the thickness of the adhesive layer between the mutual attraction surfaces can be controlled to improve the shear strength of the magnetic assembly and ensure the performance of the product. Of course, the thickness of the adhesive layer can also be further adjusted according to actual needs in conjunction with the limit tooling.

[0040] In the actual production process, for mutually exclusive magnetic components, two magnets are usually arranged with the same polarity and mutually exclusive. This is because when three or more magnets are arranged mutually exclusive, the magnetic lines of force of the middle magnet will be weakened by the magnetic lines of force of the magnets on both sides, making the performance of the three or more magnets after bonding less than ideal. Therefore, when bonding the mutually exclusive magnetic components, the number of magnets is preferably two, but not limited to this. The present bonding method is also applicable to three or more magnets.

[0041] Therefore, when the magnets are arranged in a mutually exclusive manner with the same polarity, the polar surface of one of the magnets is first bonded to one side of the iron part to form a half component. The half component is adsorbed on the iron plate through the non-polar surface of one of the magnets, and then the non-polar surface of the other magnet is adsorbed on the iron plate. The maximum suction force of the half component and the other magnet on the iron plate is adjusted by controlling the thickness of the iron plate, and the maximum suction force is greater than the repulsion between the half component and the other magnet after the two are bonded. When the suction force is greater than the repulsion force, bonding becomes very easy. At this time, it will be easier to bond and position the other magnet when it is bonded to the half component, and the half component will not be displaced due to the repulsion. Compared with using a pressure-maintaining bonding tool to forcibly bond the magnets together, it can greatly reduce production costs, overcome the influence of repulsion on bonding difficulty and efficiency, improve production efficiency, make bonding more accurate and convenient, and make it easier to control the thickness of the glue layer, improve the shear strength of the magnetic component, and ensure the performance of the product.

[0042] This bonding method is suitable for scenarios where the thickness of the glue layer between magnets needs to be controlled and scenarios where the thickness of the glue layer between magnets does not need to be controlled. When the thickness of the glue layer between magnets needs to be controlled, such as a Halbach magnetic assembly with two magnets, the thickness of the glue layer needs to be controlled at 1mm. By controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guide magnet is adjusted to the minimum suction force. The threshold spacing between the two magnets is 0.9mm. At this time, when the spacing between the two magnets is controlled at 1mm using a limit fixture, the thickness of the glue layer can be controlled. Of course, this bonding method is also applicable to Halbach magnetic assemblies when the thickness of the glue layer is not controlled.

[0043] Similarly, when there is no need to control the thickness of the glue layer between magnets, for example, when two mutually exclusive magnetic components are arranged, the maximum suction force of the two magnets and the iron parts on the iron plate can be adjusted by controlling the thickness of the iron plate. If the maximum suction force is greater than the repulsion between the magnets, the magnets can be positioned, and the glue between the two magnets and the iron parts will not be affected by the repulsion and can be cured smoothly. Of course, when the thickness of the glue layer needs to be controlled for two mutually exclusive magnetic components, this bonding method is also applicable. Since the magnets can be positioned, it will be easier to use the limit fixture to limit the bonding of the two magnets.

[0044] It should be noted that the choice of glue is different depending on whether the thickness of the glue layer needs to be controlled when bonding the magnetic components. For example, AB glue is usually used when the thickness of the glue layer is controlled, but it is not limited to this. The thickness of the glue layer is also adjusted according to the actual situation. This bonding method is applicable to the Halbach magnetic components or the mutually exclusive magnetic components when the thickness of the glue layer is controlled or not.

[0045] Of course, in other preferred embodiments, there are multiple guide magnets, and there are multiple non-guide magnets. The guide magnets and the non-guide magnets are arranged at intervals, and the iron plates are adsorbed on the polarity surfaces of all non-guide magnets. The number can be adjusted according to actual needs.

[0046] Furthermore, the iron plate and the iron parts are both made of magnetic conductive materials, which have good magnetic conductivity and can guide the distribution of magnetic lines of force. The iron plate made of magnetic conductive materials can absorb magnets, and by adjusting the thickness of the iron plate, the spacing between the magnets can be accurately controlled, thereby achieving accurate control of the thickness of the glue layer, which helps to improve the bonding accuracy and stability of the magnetic assembly. Of course, other materials can also be selected in other embodiments.

[0047] Further, if Fig.13 and Fig.14 As shown, the magnetic assembly is simulated by ANSYS software to adjust the thickness of the iron plate. ANSYS software can accurately simulate the magnetic field distribution inside the magnetic assembly, including the direction of the magnetic lines of force, the distribution of magnetic induction intensity, etc. Through simulation, the influence of different iron plate thicknesses on the magnetic field distribution can be intuitively seen, so as to select the optimal iron plate thickness. Of course, other simulation software can also be selected in other embodiments.

[0048] Embodiment 1:

[0049] Embodiment 1 The number of the guide magnet 1 is one, and the number of the non-guide magnet 2 is one. Figure 1 and Figure 2 As shown, the magnetic pole on the left side of the guide magnet 1 is an S pole, the magnetic pole on the right side of the guide magnet 1 is an N pole, the magnetic pole on the lower side of the non-guide magnet 2 is an S pole, and the magnetic pole on the upper side of the non-guide magnet 2 is an N pole. The upper top surface of the guide magnet 1 and the upper top surface of the non-guide magnet 2 form the mutually repelling surface, and the right side surface of the guide magnet 1 and the left side surface of the non-guide magnet 2 form a mutually attractive surface. The repulsive force of the mutually repelling surface of the guide magnet 1 and the non-guide magnet 2 is greater than the attractive force of the mutually attractive surface of the guide magnet 1 and the non-guide magnet 2, and when the mutually attractive surface is the minimum attractive force, the mutually repelling surface has the maximum repulsive force. For the Halbach magnetic assembly of two magnets, the mutually attractive surface between the guide magnet 1 and the non-guide magnet 2 is adjusted to the minimum attractive force by controlling the thickness of the iron plate 3. At this time, the mutually repelling surface of the guide magnet 1 and the non-guide magnet 2 has the maximum repulsive force.

[0050] like Figure 2As shown in Table 1, for the Halbach magnetic assembly with two magnets, when conventional bonding is adopted, simulation using ANSYS software shows that the guide magnet 1 on the left is subjected to a suction force of 0.28N from the non-guide magnet on the right, i.e., the force in the positive direction of the X-axis.

[0051] Table 1:

[0052]

[0053] And adopt the bonding method of the present invention, such as Figure 3 , Figure 4 As shown in Table 1, a thinner iron plate 3 is added under the non-guide magnet 2, and the suction force of the non-guide magnet 2 on the guide magnet 1 is reduced to 0.095N. The thickness of the iron plate 3 under the non-guide magnet 2 is further adjusted, and a simulation test is performed every time the thickness of the iron plate 3 increases by 0.1mm. When the iron plate 3 increases to a certain thickness, the suction force on the left guide magnet 1 on the right non-guide magnet 2 changes to repulsion, and the repulsion is 0.38N, that is, the negative sign in the table represents the negative force of the X-axis.

[0054] Embodiment 2:

[0055] Embodiment 2 The number of the guide magnet 1 is one, the number of the non-guide magnet 2 is two, and the non-polar surfaces of the two non-guide magnets 2 are respectively adsorbed on the polar surfaces on both sides of the guide magnet 1. Figure 5 As shown, the polarity direction of the guide magnet 1 is horizontal, the polarity direction of the two non-guide magnets 2 is vertical and the magnetic poles are opposite, and the three magnets are arranged in an adsorption manner. For a Halbach magnetic assembly with three or more magnets, when the attraction between the guide magnet 1 and the non-guide magnet 2 is reduced by controlling the thickness of the iron plate 3, the attraction between the guide magnet 1 and the non-guide magnet 2 will only become smaller and smaller.

[0056] like Figure 6 As shown in Table 2, for the Halbach magnetic assembly with three magnets, when conventional bonding is adopted, simulation using ANSYS software shows that the suction force on the left non-guide magnet 2 by the middle guide magnet 1 is 0.75N, and the suction force on the right non-guide magnet 2 by the middle guide magnet 1 is 0.81N.

[0057] Table 2:

[0058]

[0059] And adopt the bonding method of the present invention, such as Figure 7 , Figure 8As shown in Table 2, a thinner iron plate 3 is added under the left and right non-guide magnets 2, and the suction force of the left non-guide magnet 2 by the middle guide magnet 1 is reduced to 0.54N, and the suction force of the right non-guide magnet 2 by the middle guide magnet 1 is reduced to 0.57N. Further adjust the thickness of the iron plate 3 under the non-guide magnet 2. When the iron plate 3 increases to a certain thickness, the suction force of the left and right non-guide magnets 2 by the middle guide magnet 1 will continue to decrease and tend to zero, but it is not equal to zero. At this time, the suction force of the left non-guide magnet 2 by the middle guide magnet 1 is 0.15N, and the suction force with the iron plate 3 below is 2.29N.

[0060] Therefore, for Example 1 and Example 2, the mutual attraction surface between the guide magnet 1 and the non-guide magnet 2 is adjusted to the minimum attraction force by controlling the thickness of the iron plate 3, so that the attraction force between the non-guide magnet 2 and the iron plate 3 is greater than the minimum attraction force of the mutual attraction surface. Even if the distance between the magnets is very small, they will not be adsorbed together, thereby adjusting the spacing between the guide magnet 1 and the non-guide magnet 2, controlling the thickness of the glue layer between the mutual attraction surfaces, improving the shear strength of the magnetic assembly, and ensuring the performance of the product.

[0061] Embodiment three:

[0062] In the third embodiment, Fig. 9 As shown, the two magnets are arranged to repel each other and an iron piece 4 is set between the two magnets. When bonding in a conventional manner, the second magnet 6 is first bonded to one side of the iron piece 4, and then the first magnet 5 is bonded to the other side of the iron piece 4 using a positioning fixture. Fig.10 As shown in Table 3, the simulation using ANSYS software shows that the repulsive force on the first magnet 5 from half of the components is 2.52N.

[0063] Table 3:

[0064]

[0065] And adopt the bonding method of the present invention, such as Fig.11 , Fig.12 As shown in Table 3, the second magnet 6 is first bonded to one side of the iron piece 4 to form a half assembly, and then the half assembly and the first magnet 5 are adsorbed on the iron plate 3 added at the bottom through the non-polar surface of the magnet. When the iron plate 3 added at the bottom is thin, the repulsive force on the first magnet 5 from the half assembly is 1.58N, and the suction force on the iron plate 3 added at the bottom is 0.86N. When the iron plate 3 added at the bottom reaches a certain thickness, the repulsive force on the first magnet 5 from the middle half assembly is 2.73N, and the suction force on the iron plate 3 added at the bottom is 9.31N. At this time, the suction force between the magnetic assembly and the bottom iron plate 3 is greater than the repulsive force between the magnetic assemblies.

[0066] Therefore, for Example 3, the maximum suction force of the iron plate 3 on half of the component and the other magnet is adjusted by controlling the thickness of the iron plate 3, and the maximum suction force is greater than the repulsive force between the half of the component and the other magnet after the two are bonded. When the suction force is greater than the repulsive force, bonding becomes very easy. At this time, it will be easier to bond and position the other magnet to the half of the component, and the half of the component will not be displaced due to the repulsive force. Overcoming the influence of the repulsive force on the difficulty and efficiency of bonding, improving production efficiency, making bonding more accurate and convenient, and making it easier to control the thickness of the glue layer, improving the shear strength of the magnetic component, and ensuring the performance of the product.

[0067] The directional terms mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to different locations and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0068] The above description is only a preferred embodiment of the present invention and is not a limitation on the design of this case. Any equivalent changes made based on the design key of this case shall fall within the protection scope of this case.

Claims

1. A magnetic assembly bonding method, characterized in that: The bonding method is: When the magnets are arranged according to the Halbach polarity mutual attraction, at least one guide magnet and at least one non-guide magnet are arranged adjacent to each other, the polarity direction of the guide magnet is horizontal, and the polarity direction of the non-guide magnet is vertical, the bonding surface of the magnet is glued, and the iron plate is adsorbed on the polarity surface of the non-guide magnet. By controlling the thickness of the iron plate, the mutual attraction surface between the guide magnet and the non-guide magnet is adjusted to the minimum suction force, thereby adjusting the spacing between the guide magnet and the non-guide magnet, and realizing the control of the thickness of the glue layer between the magnets; When the magnets are arranged with the same polarity and mutually repel each other, the magnetic assembly also includes an iron piece. The polar surface of one of the magnets is bonded to one side of the iron piece to form a half assembly. The half assembly is adsorbed on the iron plate through the non-polar surface of one of the magnets, and the non-polar surface of the other magnet is adsorbed on the iron plate. The iron piece of the half assembly is opposite to the other magnet, and the iron piece is located between the two magnets. The maximum suction force of the iron plate on the half assembly and the other magnet is adjusted by controlling the thickness of the iron plate, and the maximum suction force is greater than the repulsive force between the two after the half assembly and the other magnet are bonded, so that the other magnet is positioned after being bonded to the half assembly, thereby realizing the control of the thickness of the glue layer between the magnets.

2. A magnetic assembly bonding method as claimed in claim 1, characterized in that: When the magnets are arranged according to the Halbach polarity attraction, the number of the guide magnets is multiple, the number of the non-guide magnets is multiple, the guide magnets and the non-guide magnets are arranged alternately, and the iron plate is adsorbed on the polarity surfaces of all the non-guide magnets.

3. A magnetic assembly bonding method as claimed in claim 2, characterized in that: The number of the guide magnet is one, the number of the non-guide magnet is one, the magnetic pole on the left side of the guide magnet is an S pole, the magnetic pole on the right side of the guide magnet is an N pole, the magnetic pole on the bottom side of the non-guide magnet is an S pole, and the magnetic pole on the top side of the non-guide magnet is an N pole. The upper top surface of the guide magnet and the upper top surface of the non-guide magnet form a mutually repelling surface, the right side surface of the guide magnet and the left side surface of the non-guide magnet form a mutually attractive surface, the repulsive force between the mutually repelling surfaces of the guide magnet and the non-guide magnet is greater than the attractive force between the mutually attractive surfaces of the guide magnet and the non-guide magnet, and when the mutually attractive surface has the minimum attractive force, the mutually repulsive surface has the maximum repulsive force.

4. A magnetic assembly bonding method as claimed in claim 2, characterized in that: The number of the guide magnet is one, the number of the non-guide magnets is two, the non-polar surfaces of the two non-guide magnets are respectively adsorbed on the polar surfaces on both sides of the guide magnet, and the magnetic poles of the two non-guide magnets are in opposite directions.

5. A magnetic assembly bonding method as claimed in claim 1, characterized in that: The iron plate and the iron piece are both made of magnetic conductive material.

6. A magnetic assembly bonding method as claimed in claim 1, characterized in that: The magnetic assembly is simulated by ANSYS software to adjust the thickness of the iron plate.

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