Electromagnetic shielding structure, manufacturing method thereof, packaging structure and manufacturing method thereof

Abstract

The invention provides a manufacturing method of an electromagnetic shielding structure, and the method comprises the steps: providing an auxiliary molding layer which is provided with a plurality of first holes in a penetrating manner; and arranging a plastic package body on the auxiliary forming layer, wherein part of the plastic package body is filled into the first opening. And removing the auxiliary molding layer to form a plurality of grooves in the plastic package body, and arranging shielding layers on the outer surface of the plastic package body and the inner walls of the plurality of grooves to form the electromagnetic shielding structure. The manufacturing method provided by the invention is relatively high in adaptability, and is beneficial to reducing the problem of glue overflow in packaging. In addition, the invention also provides a battery shielding structure, a packaging structure and a manufacturing method thereof.

Description

Technical Field

[0001] The present application relates to the field of electromagnetic shielding, and in particular to an electromagnetic shielding structure and a manufacturing method thereof, a packaging structure and a manufacturing method thereof. Background Art

[0002] The radio frequency transmitting devices in wireless devices can cause serious electromagnetic interference to other components. Radio frequency transmitting devices must be effectively isolated to limit their interference with other nearby components and avoid performance degradation of other components. The general selective shielding technology mainly achieves electromagnetic shielding of radio frequency transmitting devices by setting plastic sealant on the outer surface of the radio frequency transmitting device and then setting a conductive shielding layer on the plastic sealant. However, the selective shielding technology requires the use of a dedicated plastic sealant mold, and it is easy for glue to overflow at the connection between the mold and the circuit board, affecting other functions of the circuit board. Summary of the invention

[0003] In order to solve the problems involved in the background technology, the present application provides an electromagnetic shielding structure and a manufacturing method thereof.

[0004] In addition, the present application also provides a packaging structure and a manufacturing method thereof.

[0005] A method for manufacturing an electromagnetic shielding structure includes the following steps: providing an auxiliary molding layer, wherein the auxiliary molding layer is penetrated by a plurality of first openings; arranging a plastic sealing body on the auxiliary molding layer, wherein part of the plastic sealing body is filled into the first openings; removing the auxiliary molding layer to form a plurality of grooves on the plastic sealing body, and arranging a shielding layer on the outer surface of the plastic sealing body and the inner walls of the plurality of grooves to form the electromagnetic shielding structure.

[0006] In some possible implementations, the steps are further included: a second opening is set through the plastic packaging body, a portion of the auxiliary molding layer is exposed at the bottom of the second opening, the second opening is staggered with the first opening, and a conductor is set in the second opening, and the conductor is electrically connected to the shielding layer.

[0007] In some possible implementations, the step of "disposing a shielding layer on the outer surface of the plastic package body and the inner walls of the plurality of grooves" includes: disposing the shielding layer on the surface of the plastic package body and the inner walls of the plurality of grooves by sputtering.

[0008] An electromagnetic shielding structure includes a plastic package and a shielding layer. The plastic package has a first surface, a second surface, and a plurality of connecting surfaces connected between the first surface and the second surface, and the connecting surfaces are concave to form a groove. The shielding layer is provided with the first surface, the second surface, and the plurality of connecting surfaces, and a portion of the shielding layer is filled into the inner wall of the groove.

[0009] In some possible implementations, the plastic package body is provided with a second opening, and the second opening passes through the first surface and the second surface. The electromagnetic shielding structure also includes a conductor, and the conductor is arranged in the second opening and electrically connected to the shielding layer.

[0010] A method for manufacturing a packaging structure comprises the following steps: providing a circuit board assembly, the circuit board assembly comprising a circuit board and a plurality of components to be packaged spaced apart on the circuit board; providing an auxiliary molding layer on the circuit board, the auxiliary molding layer being provided with a plurality of first openings, and the components to be packaged being provided with the first openings; providing a plastic sealing body on the auxiliary molding material and the components to be packaged, and partially filling the first openings with the plastic sealing body; removing the auxiliary molding layer, thereby forming a plurality of grooves on the plastic sealing body, and forming a shielding layer on the outer surface of the plastic sealing body and the inner wall of the groove, wherein the shielding layer is electrically connected to the circuit board, and the packaging structure is obtained.

[0011] In some possible implementations, the step of "arranging an auxiliary molding layer on the circuit board" includes: arranging the auxiliary molding layer on the entire page of the circuit board. The step of "arranging a plastic sealing body on the auxiliary molding material" includes: arranging the plastic sealing body on the entire page of the auxiliary molding material, and the end face of the plastic sealing body is flush with the end face of the auxiliary molding layer. The manufacturing method also includes the step of removing part of the outer edge of the plastic sealing body so that the end face of the plastic sealing body is staggered with the end face of the auxiliary molding layer.

[0012] In some possible implementations, the material of the auxiliary molding layer includes one or more of vinyl resin, alkyd resin, amino resin, epoxy resin, acrylic resin, etc.; the step of "removing the auxiliary molding layer" includes: heating the auxiliary removal layer.

[0013] In some possible embodiments, before the step of "forming a shielding layer on the outer surface of the plastic package body and the inner wall of the groove", the step also includes: setting a second opening through the plastic package body, and partially exposing the circuit board at the bottom of the second opening; after the step of "forming a shielding layer on the outer surface of the plastic package body and the inner wall of the groove", the step also includes: setting a conductor in the second opening, and the conductor electrically connects the circuit board and the shielding layer.

[0014] A packaging structure includes a circuit board assembly, a plastic package and a shielding layer. The circuit board assembly includes a circuit board and a plurality of components to be packaged that are spaced apart on the circuit board. The plastic package is disposed on the circuit board, covers the components to be packaged, and has a first surface, a second surface and a plurality of connection surfaces connected between the first surface and the second surface, wherein the connection surfaces are concave to form a groove. The shielding layer is disposed on the first surface and the second surface, a portion of the shielding layer is disposed on the inner wall of the groove, and the shielding layer is electrically connected to the circuit board.

[0015] The manufacturing method of the electromagnetic shielding structure provided in the present application is to first set a plastic packaging body on the auxiliary molding layer, then remove the auxiliary molding layer to form a groove on the plastic packaging body, and finally set a shielding layer on the outer surface of the plastic packaging body (including the inner wall of the groove). The whole process is simple and easy, and is conducive to reducing the overflow of glue formed in the process of setting the plastic packaging body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic cross-sectional view of an auxiliary molding layer provided in one embodiment of the present application.

[0017] Figure 2 for Figure 1 The schematic cross-sectional view of the auxiliary molding layer after the plastic sealing body is provided is shown.

[0018] Figure 3 for Figure 2 The cross-sectional schematic diagram shown is a plastic package body after a second opening is provided.

[0019] Figure 4 To remove Figure 3 Schematic cross-sectional view of the auxiliary molding layer shown.

[0020] Figure 5 for Figure 4 The cross-sectional schematic diagram of the shielding structure obtained by arranging a shielding layer on the plastic package shown.

[0021] Figure 6 A schematic cross-sectional view of a circuit board provided in accordance with an embodiment of the present application.

[0022] Figure 7 for Figure 6 The schematic cross-sectional view of the circuit board after the electronic components are arranged is shown.

[0023] Figure 8 for Figure 7 The schematic cross-sectional view of the circuit board shown is after the auxiliary molding layer is provided.

[0024] Fig. 9 for Figure 8 The schematic cross-sectional view of the auxiliary molding layer after the plastic sealing body is provided is shown.

[0025] Fig.10 for Fig. 9 The cross-sectional schematic diagram shown is a plastic package body after a second opening is provided.

[0026] Fig.11 To remove Fig.10 Schematic cross-sectional view of the auxiliary molding layer shown.

[0027] Fig.12 for Fig.11 The cross-sectional schematic diagram of the packaging structure obtained after the plastic package body is provided with a shielding layer is shown.

[0028] Fig.13 A schematic cross-sectional view of a packaging structure provided in another embodiment of the present application.

[0029] Main component symbols

[0030] Package structure 100

[0031] Circuit board 10

[0032] Insulation layer 11

[0033] First circuit layer 12

[0034] The second circuit layer 13

[0035] The first solder resist layer 14

[0036] Second solder resist layer 15

[0037] Electronic components 20

[0038] Passive components 21

[0039] Circuit board assembly 23

[0040] Auxiliary molding layer 30

[0041] The first opening 31

[0042] Intermediate 32

[0043] Plastic package 40

[0044] First surface 41

[0045] Second surface 42

[0046] Connection surface 43

[0047] Extended surface 431

[0048] Second opening 44

[0049] Groove 45

[0050] Shielding layer 50

[0051] Electromagnetic shielding structure 51

[0052] Conductor 52

[0053] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0055] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. When an element is considered to be "disposed on" another element, it may be directly disposed on the other element or there may be a central element at the same time.

[0056] See also Figures 1 to 5 An embodiment of the present application provides a method for manufacturing an electromagnetic shielding structure 51, which specifically includes the steps of:

[0057] S1: Please see Figure 1 , providing an auxiliary molding layer 30 , wherein the auxiliary molding layer 30 is penetrated by a plurality of first openings 31 .

[0058] In this embodiment, the auxiliary molding layer 30 includes an adhesive layer (not shown), and the material of the adhesive layer includes one or more of vinyl resin, alkyd resin, amino resin, epoxy resin, acrylic resin, etc. The adhesive layer has the property of thermal debonding, and when the temperature is ≥190°C, the adhesive layer loses its viscosity.

[0059] S2: See Figure 2 A plastic sealing body 40 is disposed on one side of the auxiliary molding layer 30, and a portion of the plastic sealing body 40 is filled into the first opening 31. The plastic sealing body 40 includes a first surface 41, a second surface 42, and a plurality of connecting surfaces 43 connected between the first surface 41 and the second surface 42.

[0060] In this embodiment, the plastic package 40 is made of a material with good insulation and mechanical properties, such as epoxy resin, polyimide, polytetrafluoroethylene, silicone resin, etc. The plastic package 40 is used to cover and fix the electronic component 20 .

[0061] In this example, see Figure 3Step S2 further includes: setting a second opening 44 through the middle part of the plastic package body 40, part of the auxiliary molding layer 30 is exposed at the bottom of the second opening 44, the second opening 44 is staggered with the first opening 31, and removing part of the end of the plastic package body 40, so that the connecting surface 43 of the plastic package body 40 extends toward the middle part of the plastic package body 40 to form a deepening surface 431, the deepening surface 431 is staggered with the end surface of the auxiliary molding layer 30 to form a stepped groove 432, and the stepped groove 432 can facilitate the setting of the shielding layer 50 on the outer surface of the plastic package body 40 (see Figure 5 ).

[0062] S4: See Figure 4 , the auxiliary molding layer 30 is removed to form a plurality of grooves 45 in the plastic package body 40 , and some of the grooves 45 are connected to the second opening 44 .

[0063] S5: See Figure 5 , a shielding layer 50 is provided on the outer surface of the plastic package 40 and the inner walls of the plurality of grooves 45 to form the electromagnetic shielding structure 51. Specifically, the shielding layer 50 is provided on the surface of the plastic package 40 and the inner walls of the plurality of grooves 45 by sputtering. In other embodiments of the present application, the shielding layer 50 can also be manufactured by spray printing, ink printing, electroplating, etc.

[0064] In this embodiment, step S5 further includes: setting a conductor 52 in the second opening 44, the conductor 52 being electrically connected to the shielding layer 50. Specifically, the conductor 52 is set in the second opening 44 by filling a conductive paste. In other embodiments of the present application, the conductor 52 can also be formed in the second opening 44 by electroplating or the like.

[0065] Compared with the prior art, the manufacturing method of the electromagnetic shielding structure 51 provided in the present application has the following advantages:

[0066] (i) By setting the plastic package body 40 on the auxiliary molding layer 30, then removing the auxiliary molding layer 30 to form a groove 45 on the plastic package body 40, and finally setting the shielding layer 50 on the outer surface of the plastic package body 40 (including the inner wall of the groove 45), it is helpful to reduce the overflow of glue formed in the process of setting the plastic package body 40, and then reduce the degumming process.

[0067] (ii) By setting a second opening 44 in the plastic package 40 and then setting a conductor 52 in the second opening 44, the electromagnetic shielding structure 51 can be divided according to the setting position of the second opening 44, so as to form a plurality of electromagnetic shielding structures 51 to shield different components respectively. The whole process is simple and easy, so that there is no need to use a dedicated special mold in the process of setting the plastic package 40 in the auxiliary molding layer 30. In other words, the entire auxiliary molding layer 30 can be packaged by a mold, which is conducive to improving packaging efficiency and reducing processing costs.

[0068] (III) By arranging the shielding layer 50 on the outer surface of the plastic package body 40 and the inner wall of the groove 45, an inverted "T"-shaped structure is formed, so that the shielding layer 50 can have a strong bonding force with the plastic package body 40, which is beneficial to improving the integrity of the electromagnetic shielding structure 51.

[0069] See also Figure 5 The embodiment of the present application further provides an electromagnetic shielding structure 51, comprising a plastic package body 40 and a shielding layer 50. The plastic package body 40 has a first surface 41, a second surface 42, and a plurality of connecting surfaces 43 connected between the first surface 41 and the second surface 42. The connecting surface 43 is concave to form a groove 45. The shielding layer 50 is provided with the first surface 41, the second surface 42, and the plurality of connecting surfaces 43. Part of the shielding layer 50 is filled into the inner wall of the groove 45.

[0070] In this embodiment, the plastic package body 40 is provided with a second opening 44 , which passes through the first surface 41 and the second surface 42 . The electromagnetic shielding structure also includes a conductor 52 , which is arranged in the second opening 44 and electrically connected to the shielding layer 50 .

[0071] See also Figures 6 to 11 The present application provides a method for manufacturing a packaging structure 100, comprising the steps of:

[0072] S1: Please see Figure 6 A circuit board 10 is provided, the circuit board 10 includes an insulating layer 11, a first circuit layer 12, a second circuit layer 13, a first solder mask 14 and a second solder mask 15. The first circuit layer 12 and the second circuit layer 13 are respectively arranged on opposite sides of the insulating layer 11. The first solder mask 14 is arranged in a wire groove of the first circuit layer 12. The second solder mask 15 is arranged in a wire groove of the second circuit layer 13.

[0073] In this embodiment, the material of the insulating layer 11 includes at least one of epoxy resin (EP), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), poly(ether-ether-ketone), PEEK, polyphenylene oxide (PPO), polyimide (PI), polyester resin (PET) and polyethylene naphthalate diformic acid glycol ester (PEN). The first solder mask 14 and the second solder mask 15 include at least one of organic solder mask ink, inorganic solder mask ink and low melting point glass.

[0074] S2: See Figure 7 At least two electronic components 20 are spaced apart from each other in the first circuit layer 12 , and the electronic components 20 are soldered to the first circuit layer 12 to achieve electrical connection with the first circuit layer, thereby obtaining a circuit board assembly 23 .

[0075] In this embodiment, the electronic component 20 includes at least one of a frequency transmitting device, a chip, a high frequency plug, a connector, and an antenna. Step S2 also includes: at least two passive components 21 are arranged at intervals on the first circuit layer 12, and the passive components 21 include at least one of a resistor, a capacitor, and an inductor.

[0076] S3: See Figure 8 The auxiliary molding layer 30 is disposed on the first circuit layer 12 and the first solder mask layer 14 , and the auxiliary molding layer 30 is penetrated by a plurality of first openings 31 . The electronic components 20 and the passive components 21 pass through the first openings 31 to obtain an intermediate body 32 .

[0077] In this embodiment, the auxiliary molding layer 30 is a two-layer structure, including an adhesive layer (not shown) and a protective substrate layer (not shown) disposed on one side of the adhesive layer. The protective substrate layer is made of polyimide or polytetrafluoroethylene. The adhesive layer has the characteristic of thermal debonding. When the temperature is ≤180°C, it can be tightly bonded to the circuit board product. When the temperature is ≥190°C, the adhesive loses its viscosity and is peeled off from the plastic package 40, the first circuit layer 12 and the first solder mask 14 without residual adhesive.

[0078] S4: See Fig. 9, the plastic encapsulation body 40 is arranged on the auxiliary molding layer 30 and the outer surface of the electronic component 20. The plastic encapsulation body 40 covers the electronic component 20. Part of the plastic encapsulation body 40 is filled into the first opening 31 and connected to the first circuit layer 12. The plastic encapsulation body 40 has the first surface 41, the second surface 42 and a plurality of connecting surfaces 43. The first surface 41 and the second surface 42 are arranged at intervals, and the connecting surface 43 is connected between the first surface 41 and the second surface 42. The first surface 41 is arranged to face away from the first circuit layer 12, and the second surface 42 is arranged to face the first circuit layer 12.

[0079] In this embodiment, step S4 includes: arranging the plastic sealing body 40 on the entire surface of the intermediate body 32 , and the connecting surface 43 of the plastic sealing body 40 is flush with the end surface of the auxiliary molding layer 30 .

[0080] S5: See Fig.10 A second opening 44 is provided in the plastic packaging body 40 , and the second opening 44 passes through the first surface 41 and the second surface 42 , so that part of the auxiliary molding layer 30 is exposed at the bottom of the second opening 44 .

[0081] In this embodiment, step S5 further includes: removing part of the edge portion of the plastic package body 40, that is, the connecting surface 43 is deepened toward the central area of ​​the plastic package body 40 to form a deepening surface 431. The deepening surface 431 is staggered from the end surface of the auxiliary molding layer 30 to form a step portion 432, so as to facilitate subsequent sputtering at both ends of the plastic package body 40. Specifically, the second opening 44 and the deepening surface 431 are both formed by laser etching.

[0082] S6: See Fig.11 , the auxiliary molding layer 30 is removed, so that a plurality of grooves 45 are formed at one end of the plastic package 40 facing the first circuit layer 12. The extended surface 431 connects part of the grooves 45 at both ends of the plastic package 40, and the second opening 44 connects another part of the grooves 45 of the plastic package 40.

[0083] In this embodiment, step S6 specifically includes heating the auxiliary molding layer 30 to a temperature exceeding 190° C., so that the adhesive layer of the auxiliary molding layer 30 loses its viscosity, thereby facilitating the removal of the auxiliary molding layer 30 .

[0084] S7: See Fig.12A shielding layer 50 is disposed on the outer surface of the plastic package body 40, and part of the shielding layer 50 is filled into the grooves 45 at both ends of the plastic package body 40 to obtain an electromagnetic shielding structure 51. Part of the shielding layer 50 filled into the grooves 45 is connected to the grounding circuit (not shown) of the first circuit layer 12, thereby achieving electromagnetic shielding of the electronic component 20.

[0085] In this embodiment, in step S7 , the shielding layer 50 is formed on the outer surface of the plastic package body 40 , for example, the first surface 41 , the extended surface 431 , and the inner wall of the groove 45 , by sputtering.

[0086] In this embodiment, step S7 further includes: setting a conductor 52 in the second opening 44, and filling part of the conductor 52 into another part of the groove 45 connected to the second opening 44 to obtain the packaging structure 100. The conductor 52 is electrically connected to the grounding circuit of the first circuit layer 12, so as to achieve multi-directional shielding of the electronic component 20. The conductor 52 is a conductive paste. In other embodiments of the present application, please refer to Fig.13 , the conductor 52 may be a hollow structure.

[0087] Compared with the prior art, the manufacturing method of the package structure 100 provided in the present application has the following advantages:

[0088] (i) By providing grooves 45 at both ends of the plastic package body 40 and providing a shielding layer 50 in the grooves 45, while the grooves 45 can also accommodate other components, the electronic components 20 in the shielding layer 50 are closer to other components outside the shielding layer 50, thereby facilitating improving the density of component arrangement of the circuit board 10.

[0089] (ii) By setting the plastic sealing body 40 on the entire intermediate body 32, and then punching holes (second openings 44) in the plastic sealing body 40 and filling them with the conductor 52, shielding of different electronic components 20 is achieved. There is no need to use a special mold to set the plastic sealing body 40, but only a universal mold suitable for setting the plastic sealing body 40 on the entire intermediate body 32 is needed, which is beneficial to improving processing efficiency and reducing processing costs.

[0090] See also Fig.12, an embodiment of the present application further provides a packaging structure 100, the packaging structure 100 includes a circuit board assembly 23, a plastic package body 40 and a shielding layer 50. The circuit board assembly 23 includes a circuit board 10 and a plurality of electronic components 20 arranged at intervals on the circuit board 10. The plastic package body is arranged on the circuit board, the plastic package body covers the electronic components 20, and the plastic package body 40 has a first surface 41, a second surface 42 and a plurality of extended surfaces 431 connected between the first surface 41 and the second surface 42. The extended surface 431 is concave to form the groove 45. The shielding layer 50 is arranged on the first surface 41 and the second surface 42, and part of the shielding layer 50 is arranged on the inner wall of the groove 45, and the shielding layer 50 is electrically connected to the circuit board 10.

[0091] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in the actual application process. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for manufacturing an electromagnetic shielding structure, characterized in that: Includes steps: Providing an auxiliary molding layer, wherein the auxiliary molding layer is provided with a plurality of first openings; A plastic sealing body is arranged on the auxiliary molding layer, and a part of the plastic sealing body is filled into the first opening; removing the auxiliary molding layer to form a plurality of grooves in the plastic package body, and A shielding layer is arranged on the outer surface of the plastic package body and the inner walls of the plurality of grooves to form the electromagnetic shielding structure.

2. The manufacturing method according to claim 1, characterized in that Also includes the steps: A second opening is provided through the plastic package body, a part of the auxiliary molding layer is exposed at the bottom of the second opening, and the second opening is staggered with the first opening; and A conductor is disposed in the second opening, and the conductor is electrically connected to the shielding layer.

3. The manufacturing method according to claim 1, characterized in that: The step of "arranging a shielding layer on the outer surface of the plastic package body and the inner walls of the plurality of grooves" includes: The shielding layer is arranged on the surface of the plastic package body and the inner walls of the plurality of grooves by sputtering.

4. An electromagnetic shielding structure, characterized in that: include: A plastic package body, comprising a first surface, a second surface and a plurality of connection surfaces connected between the first surface and the second surface, wherein the connection surfaces are concave to form grooves; A shielding layer is provided on the first surface, the second surface and the plurality of connecting surfaces, and a portion of the shielding layer is filled into the inner wall of the groove.

5. The shielding structure according to claim 4, characterized in that: The plastic package body is provided with a second opening, and the second opening passes through the first surface and the second surface. The electromagnetic shielding structure also includes a conductor, and the conductor is arranged in the second opening and electrically connected to the shielding layer.

6. A method for manufacturing a packaging structure, characterized in that: Includes steps: A circuit board assembly is provided, the circuit board assembly comprising a circuit board and a plurality of components to be packaged which are spaced apart and arranged on the circuit board; An auxiliary molding layer is provided on the circuit board, wherein the auxiliary molding layer is provided with a plurality of first openings, and the components to be packaged pass through the first openings; Arranging a plastic encapsulation body on the auxiliary molding material and the component to be encapsulated, and partially filling the first opening with the plastic encapsulation body; removing the auxiliary molding layer, thereby forming a plurality of grooves in the plastic package body, and A shielding layer is formed on the outer surface of the plastic package body and the inner wall of the groove, and the shielding layer is electrically connected to the circuit board to obtain the packaging structure.

7. The manufacturing method according to claim 6, characterized in that: The step of "arranging an auxiliary molding layer on the circuit board" includes: arranging the auxiliary molding layer on the entire circuit board; The step of "arranging a plastic sealing body on the auxiliary molding material" includes: arranging the plastic sealing body on the entire sheet of the auxiliary molding material, wherein the end surface of the plastic sealing body is flush with the end surface of the auxiliary molding layer; The manufacturing method further comprises the step of removing a portion of the outer edge of the plastic sealing body so that the end surface of the plastic sealing body is staggered with the end surface of the auxiliary molding layer.

8. The manufacturing method according to claim 6, characterized in that: The material of the auxiliary molding layer includes one or more of vinyl resin, alkyd resin, amino resin, epoxy resin, and acrylic resin, and the step of "removing the auxiliary molding layer" includes: heating the auxiliary removal layer.

9. The manufacturing method according to claim 7, characterized in that: Before the step of "forming a shielding layer on the outer surface of the plastic package and the inner wall of the groove", the method further includes: setting a second opening through the plastic package, and partially exposing the circuit board at the bottom of the second opening; After the step of "forming a shielding layer on the outer surface of the plastic package body and the inner wall of the groove", the method further includes: arranging a conductor in the second opening, wherein the conductor electrically connects the circuit board and the shielding layer.

10. A packaging structure, characterized in that: include: A circuit board assembly, the circuit board assembly comprising a circuit board and a plurality of components to be packaged which are spaced apart on the circuit board; A plastic package body is arranged on the circuit board, the plastic package body covers the component to be packaged, and has a first surface, a second surface and a plurality of connection surfaces connected between the first surface and the second surface, the connection surfaces are concave to form grooves; A shielding layer is disposed on the first surface and the second surface, a portion of the shielding layer is disposed on an inner wall of the groove, and the shielding layer is electrically connected to the circuit board.

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