Coupling device for integrated circuit package and mainboard socket

Abstract

The embodiment of the invention provides a coupling device for an integrated circuit package and a mainboard socket, and the device comprises a carrying disc and a precarrying plate, the carrying disc is used for installing a target integrated circuit package, and the target integrated circuit package is an integrated circuit package to be coupled to a target mainboard socket; the preloading plate is used for fixedly installing a loading disc of the target integrated circuit package, the preloading plate is connected with a plane structure provided with the target mainboard socket through a revolute pair, and the target mainboard socket is arranged on the preloading plate under the condition that the preloading plate rotates to a target position around a common axis corresponding to the revolute pair. The target integrated circuit package mounted on the carrier disc is coupled with the target mainboard socket. According to the invention, the problem that the coupling accuracy of the integrated circuit package and the mainboard socket is low is solved, and the effect of improving the coupling accuracy of the integrated circuit package and the mainboard socket is further achieved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of communications, and in particular, to a coupling device for an integrated circuit package and a motherboard socket. Background Art

[0002] With the development of semiconductor technology, chips, as an integrated circuit, are composed of a large number of transistors. Multiple transistors generate multiple 1 and 0 signals, which are set to specific functions. At present, chips have played a vital role in various fields. During the use of chips, the integrated circuit package needs to be coupled to the corresponding motherboard socket.

[0003] In the related art, it is usually necessary to manually align the integrated circuit package with the motherboard socket and then couple the integrated circuit package to the corresponding motherboard socket. However, the use of the above method will result in extremely low efficiency of the entire coupling process. At the same time, manually clamping the integrated circuit package may not only cause dirty package PADs (solder pads), but may also increase the risk of scratching the IC socket terminals due to low coupling accuracy.

[0004] In view of the problems in the related art such as low accuracy of coupling between the integrated circuit package and the motherboard socket, no effective solution has been proposed yet. Summary of the invention

[0005] An embodiment of the present invention provides a coupling device for an integrated circuit package and a mainboard socket, so as to at least solve the problem of low accuracy in coupling the integrated circuit package and the mainboard socket in the related art.

[0006] According to one embodiment of the present invention, a coupling device for an integrated circuit package and a motherboard socket is provided, comprising: a carrier plate and a pre-load plate, wherein:

[0007] The carrier is used to install a target integrated circuit package, wherein the target integrated circuit package is an integrated circuit package to be coupled to a target motherboard socket;

[0008] The pre-loading plate is used to fix the carrier on which the target integrated circuit package is installed. The pre-loading plate is connected to the planar structure on which the target mainboard socket is set via a rotating pair. When the pre-loading plate is rotated to the target position around the common axis corresponding to the rotating pair, the target integrated circuit package installed on the carrier is coupled to the target mainboard socket.

[0009] In an exemplary embodiment, a first clamping module is provided on the front surface of the carrier, wherein the target integrated circuit package is mounted on the front surface, and the first clamping module is used to clamp the target integrated circuit package. When the target integrated circuit package is clamped by the first clamping module, the target integrated circuit package is in a first preset area of ​​the front surface, and the first preset area has the same shape as the target integrated circuit package.

[0010] In an exemplary embodiment, the first clamping module includes P first clamping blocks, wherein the P first clamping blocks are respectively arranged at the edges of the first preset area, the P first clamping blocks are used to limit the target integrated circuit package to the first preset area, and P is a positive integer greater than or equal to 4.

[0011] In an exemplary embodiment, the first clamping block includes a first horizontal limiting structure and a first vertical limiting structure, wherein:

[0012] The first horizontal limiting structure is used to limit the horizontal movement of the target integrated circuit package in the first preset area;

[0013] The first vertical limiting structure is used to limit the vertical movement of the target integrated circuit package in the first preset area.

[0014] In an exemplary embodiment, the first clamping block is connected to the carrier through the first horizontal limiting structure. When the first clamping block is arranged at the edge of the first preset area, the first horizontal limiting structure and the first vertical limiting structure are in an inverted L shape, the first vertical limiting structure faces the first preset area, and a chamfer is set at the end of the first vertical limiting structure.

[0015] In an exemplary embodiment, a second clamping module and a target limit module are provided on the back surface of the carrier, wherein the target limit module is used to limit the carrier to a second preset area of ​​the preload plate, the second preset area has the same shape as the carrier, and the second clamping module is used to clamp the preload plate when the carrier is placed in the second preset area.

[0016] In an exemplary embodiment, the target limit module includes T limit blocks, and the preload plate is provided with T limit holes that cooperate with the limit blocks. The T limit blocks and the T limit holes are assembled to limit the carrier to a second preset area of ​​the preload plate, and T is a positive integer greater than or equal to 1.

[0017] In an exemplary embodiment, the second clamping module includes Q second clamping blocks, wherein the Q second clamping blocks are respectively arranged on a group of opposite sides of the back plate surface, and Q is a positive integer greater than or equal to 2.

[0018] In an exemplary embodiment, the second clamping block includes a second horizontal limiting structure and a second vertical limiting structure, wherein the second horizontal limiting structure is used to limit the horizontal movement of the carrier in the second preset area; and the second vertical limiting structure is used to limit the vertical movement of the carrier in the second preset area.

[0019] In an exemplary embodiment, the preload plate is connected to a planar structure on which the target motherboard socket is provided via a rotating pair, and when a carrier on which the target integrated circuit package is mounted is fixed to the preload plate, and when the preload plate is rotated to a target position around a common axis corresponding to the rotating pair, a second preset area coincides with a third preset area corresponding to the target motherboard socket, and the target integrated circuit package in the first preset area is coupled to the target motherboard socket, the first preset area being an area on the front disk surface of the carrier for mounting the target integrated circuit package, and the second preset area being an area on the preload plate for fixing the carrier on which the target integrated circuit package is mounted.

[0020] Through the present invention, a coupling device for an integrated circuit package and a motherboard socket is proposed, comprising: a carrier and a pre-loaded plate. When there is a target integrated circuit package to be coupled to a target motherboard socket, the carrier in the coupling device can be used to install the target integrated circuit package. At the same time, the pre-loaded plate in the coupling device can fix the carrier on which the target integrated circuit package is installed. Since the pre-loaded plate and the planar structure on which the target motherboard socket is set are connected through a rotating pair, the pre-loaded plate can drive the target integrated circuit package on the carrier to rotate around the common axis corresponding to the rotating pair. Therefore, when the pre-loaded plate rotates to the target position around the common axis corresponding to the rotating pair, the target integrated circuit package installed on the carrier can be coupled to the target motherboard socket. The above technical solution can solve the problem of low accuracy in coupling the integrated circuit package with the motherboard socket, thereby achieving the effect of improving the accuracy in coupling the integrated circuit package with the motherboard socket. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a coupling device between an integrated circuit package and a motherboard socket according to an embodiment of the present application;

[0022] Figure 2 is a schematic diagram of a front surface of a carrier according to an embodiment of the present application;

[0023] Figure 3is a schematic diagram of a first clamping module according to an embodiment of the present application;

[0024] Figure 4 is a schematic diagram of a first clamping block according to an embodiment of the present application;

[0025] Figure 5 is a schematic diagram of a back surface of a carrier according to an embodiment of the present application;

[0026] Figure 6 is a schematic diagram of a target limiting module and a limiting hole according to an embodiment of the present application;

[0027] Figure 7 is a schematic diagram of a second clamping module according to an embodiment of the present application;

[0028] Figure 8 is a schematic diagram of a second clamping block according to an embodiment of the present application;

[0029] Fig. 9 is a schematic diagram of a front disk surface and a back disk surface of a carrier disk on which a target integrated circuit package is installed according to an embodiment of the present application;

[0030] Fig.10 is a schematic diagram of a pre-loading plate with a loading tray fixed thereon according to an embodiment of the present application;

[0031] Fig.11 is a schematic diagram of a target position according to an embodiment of the present application. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and in combination with the embodiments.

[0033] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0034] This embodiment provides a coupling device between an integrated circuit package and a motherboard socket. Figure 1 is a schematic diagram of a coupling device between an integrated circuit package and a motherboard socket according to an embodiment of the present application, such as Figure 1As shown, it includes: a carrier 10 and a pre-loading plate 20, wherein the carrier 10 is used to install a target integrated circuit package 30, and the target integrated circuit package 30 is an integrated circuit package to be coupled to a target motherboard socket 40; the pre-loading plate 20 is used to fix the carrier 10 with the target integrated circuit package 30 installed, and the pre-loading plate 20 is connected to the planar structure on which the target motherboard socket 40 is set through a rotating pair. When the pre-loading plate 20 rotates to the target position around the common axis corresponding to the rotating pair, the target integrated circuit package 30 installed on the carrier 10 is coupled to the target motherboard socket 40.

[0035] Optionally, the planar structure on which the target motherboard socket is provided may be, but is not limited to, a pad structure, and a printed circuit board and a backplane may be disposed below the pad structure in sequence, which is not limited here.

[0036] Optionally, the target integrated circuit package is connected to the terminal of the mainboard IC socket through the PAD (solder pad) on the surface of the substrate to achieve signal transmission. The solder pad PAD is the pin in the component package. In actual applications, solder is used to connect the pins of components such as resistors, capacitors, inductors, chips, etc. and the solder pad PAD together.

[0037] Optionally, the terminal of the motherboard IC (Integrate Circuit) socket is a connection element in electronic and electrical components, which is a part that connects the conductor to the receiving terminal in the device or cable. It usually contains a group of metal bars that can provide wire connections for input, output, power supply and ground. Because it plays a vital role in circuit connection, it has a wide range of applications.

[0038] Optionally, when the preload plate rotates to the target position around the common axis corresponding to the rotation pair, the target integrated circuit package can be, but is not limited to, parallel to the planar structure of the target motherboard socket, and thus the target integrated circuit package can be coupled to the target motherboard socket. The above rotation process can be understood as the preload plate can open and close around the rotation pair and the planar structure of the target motherboard socket. When the preload plate and the planar structure are closed, the target integrated circuit package will be accurately coupled to the target motherboard socket, thereby improving the accuracy of the coupling between the integrated circuit package and the motherboard socket. On the one hand, the above process avoids human hands from touching the target integrated circuit package, thereby reducing the risk of causing dirty package PAD. On the other hand, the entire coupling process only requires rotating the preload plate until it is closed with the motherboard socket, thereby greatly improving the coupling efficiency. More notably, during the above coupling process, the target integrated circuit package is fixed on the carrier, and the carrier is fixed on the preload plate, thereby preventing the target integrated circuit package from being displaced during the coupling process, thereby ensuring that when the preload plate is closed with the motherboard socket, the target integrated circuit package can be accurately docked with the motherboard socket, thereby greatly improving the coupling accuracy, thereby greatly increasing the risk of scratching the IC socket terminal, thereby improving the use effect of the target integrated circuit package, and the service life of the IC socket terminal.

[0039] In an optional embodiment, a first clamping module 101 is disposed on the front surface of the carrier plate 10. Figure 2 is a schematic diagram of the front surface of a carrier according to an embodiment of the present application, such as Figure 2 As shown, the target integrated circuit package 30 is installed on the front disk surface, and the first clamping module 101 is used to clamp the target integrated circuit package 30. When the target integrated circuit package 30 is clamped by the first clamping module 101, the target integrated circuit package 30 is in a first preset area of ​​the front disk surface, and the first preset area has the same shape as the target integrated circuit package 30.

[0040] Optionally, in the present application, the shape and size of the target integrated circuit package are not limited, but for ease of understanding, the target integrated circuit package is taken as a rectangular parallelepiped as an example for explanation below, and the target integrated circuit package is clamped in a first preset area by a first clamping module 101, wherein the first preset area can be but is not limited to the maximum inscribed rectangular parallelepiped area of ​​the first clamping module 101. It can be understood that the first preset area of ​​the first clamping module 101 can fit tightly with the target integrated circuit package to achieve a clamping effect.

[0041] Optionally, when the target integrated circuit package is in the first preset area of ​​the front disk surface, the first clamping module 101 can clamp the target integrated circuit package to prevent the target integrated circuit package from moving.

[0042] In an optional embodiment, the first clamping module 101 includes P first clamping blocks 1011, wherein the P first clamping blocks 1011 are respectively arranged at the edges of the first preset area, and the P first clamping blocks 1011 are used to limit the target integrated circuit package 30 to the first preset area, and P is a positive integer greater than or equal to 4.

[0043] Optional, Figure 3 is a schematic diagram of a first clamping module according to an embodiment of the present application, such as Figure 3 As shown, taking P value 6 as an example, the first clamping module 101 includes 6 first clamping blocks 1011, and the 6 first clamping blocks 1011 are respectively arranged at the edges of the first preset area, wherein the P first clamping blocks 1011 can be respectively and evenly arranged at the edges of the first preset area, or can be non-uniformly arranged at the edges of the first preset area, so as to clamp the target integrated circuit package in the first preset area.

[0044] In an optional embodiment, the first clamping block 1011 includes a first horizontal limiting structure 1011-1 and a first vertical limiting structure 1011-2, wherein the first horizontal limiting structure 1011-1 is used to limit the horizontal movement of the target integrated circuit package 30 in the first preset area; and the first vertical limiting structure 1011-2 is used to limit the vertical movement of the target integrated circuit package 30 in the first preset area.

[0045] Optionally, the P first clamping blocks 1011 are intended to clamp the target integrated circuit package in a first preset area, including limiting the vertical and horizontal movement of the target integrated circuit package in the first preset area. Therefore, a first clamping block includes a first horizontal limiting structure 1011-1 and a first vertical limiting structure 1011-2, wherein the first horizontal limiting structure 1011-1 can limit the horizontal movement of the target integrated circuit package in the first preset area, and the first vertical limiting structure 1011-2 can limit the vertical movement of the target integrated circuit package in the first preset area, and the two limiting structures work together to ensure that the target integrated circuit package is clamped in the first preset area.

[0046] In an optional embodiment, the first clamping block 1011 is connected to the carrier 10 through the first horizontal limiting structure 1011-1. When the first clamping block 1011 is set at the edge of the first preset area, the first horizontal limiting structure 1011-1 and the first vertical limiting structure 1011-2 are inverted L-shape, the first vertical limiting structure 1011-2 faces the first preset area, and a chamfer is set at the end of the first vertical limiting structure 1011-2.

[0047] Optional, Figure 4 is a schematic diagram of a first clamping block according to an embodiment of the present application, such as Figure 4 As shown, Figure 3 Taking the first first clamping block 1011 among the six first clamping blocks 1011 as an example, it can be seen from the enlarged view that the first clamping block 1011 includes a first horizontal limiting structure 1011-1 and a first vertical limiting structure 1011-2, wherein the first horizontal limiting structure 1011-1 and the first vertical limiting structure 1011-2 can be regarded as two parts of the first clamping block 1011, and the first clamping block 1011 is connected to the carrier as a whole to present an inverted L shape, and the lower end of the inverted L shape is the first horizontal limiting structure 1011-1 connected to the carrier 10, and the upper end is the first vertical limiting structure 1011-2 with a chamfered end, which can prevent the target integrated circuit package from being scratched during the clamping process, and at the same time, the first vertical limiting structure 1011-2 is oriented toward the first preset area, which can limit the vertical movement of the target integrated circuit package in the first preset area.

[0048] In an optional embodiment, a second clamping module 102 and a target limit module 103 are provided on the back surface of the carrier 10, wherein the target limit module 103 is used to limit the carrier 10 to a second preset area of ​​the preload plate 20, the second preset area has the same shape as the carrier 10, and the second clamping module 102 is used to clamp the preload plate 20 when the carrier 10 is placed in the second preset area.

[0049] Optionally, the above record states that the target integrated circuit package is installed in the first preset area by the first clamping module 101 on the front surface of the carrier, the target integrated circuit package is the installed object, and the carrier is the object for installation. The following describes the relevant structure of the carrier switching role as the installed object and installing it on the pre-loaded board. Figure 5 is a schematic diagram of a back plate surface of a carrier plate according to an embodiment of the present application, such as Figure 5 As shown, the back plate surface is provided with a second clamping module 102 and a target limiting module 103 , and the carrier plate, as an installation object, is installed in the second preset area of ​​the preload plate 20 through the second clamping module 102 and the target limiting module 103 .

[0050] In an alternative embodiment, Figure 6 is a schematic diagram of a target limiting module and a limiting hole according to an embodiment of the present application, such as Figure 6As shown, the target limit module 103 includes T limit blocks 103-1, and the preload plate 20 is provided with T limit holes 103-2 that cooperate with the limit blocks 103-1. The T limit blocks 103-1 and the T limit holes 103-2 are assembled to limit the carrier 10 to the second preset area of ​​the preload plate 20, and T is a positive integer greater than or equal to 1.

[0051] Optionally, the target limit module 103 limits the carrier 10 to the second preset area of ​​the preload plate 20 by means of cooperation between T limit blocks 103-1 included in the target limit module 103 and T limit holes 103-2 provided on the preload plate 20. At this time, only the target limit module 103 is used for limitation, and the carrier 10 may still be displaced relative to the preload plate 20, and needs to be further clamped by a second clamping module.

[0052] In an optional embodiment, the second clamping module 102 includes Q second clamping blocks 1021, wherein the Q second clamping blocks 1021 are respectively arranged on a group of opposite sides of the back plate surface, and Q is a positive integer greater than or equal to 2.

[0053] Optional, Figure 7 is a schematic diagram of a second clamping module according to an embodiment of the present application, such as Figure 7 As shown, taking Q value 4 as an example, the second clamping module 102 includes four second clamping blocks 1021, and the four second clamping blocks 1021 are respectively arranged at the edges of the second preset area, wherein the four second clamping blocks 1021 can be respectively and evenly arranged at the edges of the second preset area, or can be non-uniformly arranged at the edges of the second preset area, so as to confine the carrier to the second preset area.

[0054] In an optional embodiment, the second clamping block 1021 includes a second horizontal limiting structure and a second vertical limiting structure, wherein the second horizontal limiting structure is used to limit the horizontal movement of the carrier 10 in the second preset area; and the second vertical limiting structure is used to limit the vertical movement of the carrier 10 in the second preset area.

[0055] Optional, Figure 8 is a schematic diagram of a second clamping block according to an embodiment of the present application, such as Figure 8 As shown, Figure 7Taking the second second clamping block 1021 among the four second clamping blocks 1021 as an example, the structure of the second clamping block may include two types, namely, second clamping block 1021 type 1 and second clamping block 1021 type 2. The second clamping block 1021 of type 1 is in an inverted L shape, and the head has a chamfer. The second clamping block 1021 of type 2 is separated from the body by a groove. From the enlarged view, it can be seen that the second clamping block 1021 includes a second horizontal limiting structure 1021-1 and a second vertical limiting structure 1021-2. The second horizontal limiting structure 1021-1 can limit the horizontal movement of the carrier 10 in the second preset area; the second vertical limiting structure 1021-2 can limit the vertical movement of the target integrated circuit package 30 in the second preset area.

[0056] In an optional embodiment, the pre-loading plate 20 is connected to the planar structure on which the target motherboard socket 40 is provided via a rotating pair, and when the carrier 10 on which the target integrated circuit package 30 is installed is fixed to the pre-loading plate 20, and when the pre-loading plate 20 is rotated to the target position around the common axis corresponding to the rotating pair, the second preset area coincides with the third preset area corresponding to the target motherboard socket 40, and the target integrated circuit package 30 in the first preset area is coupled with the target motherboard socket 40, the first preset area is the area on the front disk surface of the carrier 10 for installing the target integrated circuit package 30, and the second preset area is the area on the pre-loading plate 20 for fixing the carrier 10 on which the target integrated circuit package 30 is installed.

[0057] Optional, Fig. 9 is a schematic diagram of a front disk surface and a back disk surface of a carrier disk on which a target integrated circuit package is installed according to an embodiment of the present application, such as Fig. 9 As shown, the target integrated circuit package is installed in the first preset area, Fig.10 is a schematic diagram of a pre-loading plate with a loading tray fixed thereto according to an embodiment of the present application, such as Fig.10 As shown, the carrier 10 with the target integrated circuit package 30 mounted thereon is fixed to the second preset area of ​​the pre-loading plate, and the pre-loading plate 20 can rotate around the common axis corresponding to the rotation pair, Fig.11 is a schematic diagram of a target position according to an embodiment of the present application, such as Fig.11As shown, by flipping the preload plate 20, when the preload plate 20 is rotated to the target position around the common axis corresponding to the rotating pair, the preload plate 20 and the target motherboard socket 40 are closed, that is, the second preset area coincides with the third preset area corresponding to the target motherboard socket 40, and the target integrated circuit package 30 in the first preset area is coupled with the target motherboard socket 40. At this time, the pre-installation of the target integrated circuit package 30 and the target motherboard socket 40 can be achieved by the screws on the preload plate. The first preset area is the area on the front disk surface of the carrier 10 for installing the target integrated circuit package 30, and the second preset area is the area on the preload plate 20 for fixing the carrier 10 with the target integrated circuit package 30 installed.

[0058] It should be noted that the coupling device for the integrated circuit package and the motherboard socket proposed in the present application relates to the field of integrated circuit packaging, and is applied to the coupling assembly scenario of large-size LGA (Land Grid Array, planar grid array package) integrated circuit package and IC socket. It can realize automatic alignment of the target integrated circuit package and the target motherboard socket, avoiding the risk of dirty package PAD and scratching IC socket terminals during manual installation.

[0059] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A coupling device for an integrated circuit package and a motherboard socket, characterized in that: include: Carrier and pre-load plates, where The carrier is used to install a target integrated circuit package, wherein the target integrated circuit package is an integrated circuit package to be coupled to a target motherboard socket; The pre-loading plate is used to fix the carrier on which the target integrated circuit package is installed. The pre-loading plate is connected to the planar structure on which the target mainboard socket is set via a rotating pair. When the pre-loading plate is rotated to the target position around the common axis corresponding to the rotating pair, the target integrated circuit package installed on the carrier is coupled to the target mainboard socket.

2. The device according to claim 1, characterized in that A first clamping module is provided on the front surface of the carrier, wherein the target integrated circuit package is mounted on the front surface, and the first clamping module is used to clamp the target integrated circuit package. When the target integrated circuit package is clamped by the first clamping module, the target integrated circuit package is in a first preset area of ​​the front surface, and the first preset area has the same shape as the target integrated circuit package.

3. The device according to claim 2, characterized in that The first clamping module includes P first clamping blocks, wherein the P first clamping blocks are respectively arranged at the edges of the first preset area, and the P first clamping blocks are used to limit the target integrated circuit package to the first preset area, and P is a positive integer greater than or equal to 4.

4. The device according to claim 3, characterized in that The first clamping block includes a first horizontal limiting structure and a first vertical limiting structure, wherein: The first horizontal limiting structure is used to limit the horizontal movement of the target integrated circuit package in the first preset area; The first vertical limiting structure is used to limit the vertical movement of the target integrated circuit package in the first preset area.

5. The device according to claim 4, characterized in that The first clamping block is connected to the carrier through the first horizontal limiting structure. When the first clamping block is set at the edge of the first preset area, the first horizontal limiting structure and the first vertical limiting structure are in an inverted L shape, the first vertical limiting structure faces the first preset area, and a chamfer is set at the end of the first vertical limiting structure.

6. The device according to claim 1, characterized in that A second clamping module and a target limiting module are provided on the back surface of the carrier, wherein the target limiting module is used to limit the carrier to a second preset area of ​​the preload plate, the second preset area has the same shape as the carrier, and the second clamping module is used to clamp the preload plate when the carrier is placed in the second preset area.

7. The device according to claim 6, characterized in that The target limit module includes T limit blocks, and the preload plate is provided with T limit holes that cooperate with the limit blocks. The T limit blocks and the T limit holes are assembled to limit the carrier to a second preset area of ​​the preload plate, and T is a positive integer greater than or equal to 1.

8. The device according to claim 6, characterized in that The second clamping module includes Q second clamping blocks, wherein the Q second clamping blocks are respectively arranged on a group of opposite sides of the back plate surface, and Q is a positive integer greater than or equal to 2.

9. The device according to claim 8, characterized in that The second clamping block includes a second horizontal limiting structure and a second vertical limiting structure, wherein the second horizontal limiting structure is used to limit the horizontal movement of the carrier in the second preset area; the second vertical limiting structure is used to limit the vertical movement of the carrier in the second preset area.

10. The device according to any one of claims 1 to 9, characterized in that The pre-loading plate is connected to the planar structure on which the target motherboard socket is provided via a rotating pair; when the carrier on which the target integrated circuit package is installed is fixed to the pre-loading plate, and when the pre-loading plate is rotated to the target position around the common axis corresponding to the rotating pair, the second preset area coincides with the third preset area corresponding to the target motherboard socket, and the target integrated circuit package in the first preset area is coupled to the target motherboard socket; the first preset area is an area on the front disk surface of the carrier for installing the target integrated circuit package, and the second preset area is an area on the pre-loading plate for fixing the carrier on which the target integrated circuit package is installed.

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