Sammer imaging camera suitable for adjustable oblique photographing and working method thereof

Abstract

The invention discloses a Sammer imaging camera suitable for adjustable oblique photographing and a method thereof. The Sammer imaging camera comprises a camera shell, a lens frame is arranged on the camera shell, and a lens is installed on the lens frame. A sensor circuit board is embedded in the camera shell and directly faces the lens; a sensor is installed in the center of the sensor circuit board, and four piezoelectric ceramics are installed on the two sides of the sensor on the sensor circuit board and comprise the first piezoelectric ceramic, the second piezoelectric ceramic, the third piezoelectric ceramic and the fourth piezoelectric ceramic. The lens collects structured light, an optical signal is sensed through the sensor, the optical signal is converted into a voltage signal, the voltage signal is transmitted to the piezoelectric ceramic, the piezoelectric ceramic deforms when receiving the voltage signal, displacement or force is generated, and the sensor circuit board is driven to incline by an angle, so that the Gremer's law is met. According to the invention, the Gremer's law relationship among the camera, the lens and the object plane can be satisfied, and the resolution and utilization rate of the structured light and the camera picture are improved.

Description

Technical Field

[0001] The invention relates to the technical field of optical imaging, and in particular to a Sham imaging camera capable of taking photos with adjustable tilt and a working method thereof. Background Art

[0002] With the development of computer vision and 3D imaging technology, structured light projection and stereo vision have become important means to obtain 3D information of objects. Traditional structured light systems calculate the depth information of the object surface by projecting specific grating or stripe patterns onto the target object and using a camera to capture the deformation of these patterns. However, in practical applications, due to the relative position change between the camera and the structured light projector or the shape and material characteristics of the object itself, the structured light pattern may not completely overlap with the camera's photosensitive area (i.e., the frame), thus affecting the accuracy and integrity of 3D reconstruction.

[0003] In addition, in order to adapt to different application scenarios, such as close-range high-precision measurement or long-distance fast scanning, the camera needs to be able to flexibly adjust the tilt angle of its sensor to ensure that the structured light pattern can always maintain a good overlap with the camera's frame even at different working distances.

[0004] Therefore, there is an urgent need for a Sham imaging camera with adjustable tilt for taking photos. Summary of the invention

[0005] The invention provides a Sham imaging camera suitable for adjustable tilt photography, comprising: a camera housing (1), a lens frame (2) being provided on the camera housing (1) and a lens being installed thereon, a sensor circuit board (3) being embedded in the camera housing (1), the sensor circuit board (3) being directly opposite to the lens, a sensor (4) being installed in the center of the sensor circuit board (3), and four piezoelectric ceramics being installed on both sides of the sensor (4) on the sensor circuit board (3), comprising a piezoelectric ceramic 1 (5), a piezoelectric ceramic 2 (6), a piezoelectric ceramic 3 (7) and a piezoelectric ceramic 4 (8); structured light is collected by the lens, a light signal is sensed by the sensor (4), the light signal is converted into a voltage signal, the voltage signal is transmitted to the piezoelectric ceramic, the piezoelectric ceramic is deformed when receiving the voltage signal, a displacement or force is generated, and the sensor circuit board (3) is driven to tilt at an angle to satisfy the Sham's law.

[0006] In the Sham imaging camera suitable for adjustable tilt photography as described above, the lens installed on the camera housing (1) is responsible for collecting external light and focusing it on the sensor (4) in the center of the sensor circuit board (3).

[0007] In the above-mentioned Sham imaging camera suitable for adjustable tilt photography, the sensor (4) located in the center of the sensor circuit board (3) is the core element of the camera to realize image acquisition and conversion. When the lens collects structured light, the light is focused by the lens and irradiated to the sensor (4). The sensor (4) uses the photoelectric effect to convert the light signal into an electrical signal and transmits it to the piezoelectric ceramic 1 (5), the piezoelectric ceramic 2 (6), the piezoelectric ceramic 3 (7) and the piezoelectric ceramic 4 (8).

[0008] As described above, a Sham imaging camera suitable for adjustable tilt photography comprises four piezoelectric ceramics, including piezoelectric ceramic one (5), piezoelectric ceramic two (6), piezoelectric ceramic three (7), and piezoelectric ceramic four (8), which are respectively mounted on both sides of a sensor (4) on a sensor circuit board (3) and connected to the sensor circuit board (3); when the sensor (4) converts an optical signal into a voltage signal, the voltage signal is transmitted to the piezoelectric ceramic one (5), the piezoelectric ceramic two (6), the piezoelectric ceramic three (7), and the piezoelectric ceramic four (8); when the four piezoelectric ceramics receive the voltage signal, they will deform, generate displacement or force, and these deformations and forces will act on the sensor circuit board (3), driving the sensor circuit board (3) to tilt at a certain angle.

[0009] A Sham imaging camera suitable for adjustable tilt photography as described above is characterized in that piezoelectric ceramics are a material that can convert electrical energy into mechanical energy (or vice versa), and this property is called the piezoelectric effect; when the piezoelectric ceramics receive a voltage signal, they deform and generate displacement or force with an accuracy of nanometers; four piezoelectric ceramics that can be stretched and retracted with high precision realize accurate tilt angle control of the camera sensor circuit board.

[0010] The present invention also provides a method for a Sham imaging camera suitable for adjustable tilt photography, comprising:

[0011] The lens mounted on the camera housing collects external light, which is focused on the sensor in the center of the sensor circuit board to obtain the light intensity;

[0012] The sensor uses the photoelectric effect to convert light intensity into electrical signals, and transmits them to four piezoelectric ceramics to cause them to deform and generate displacement;

[0013] The deformation generated by the four piezoelectric ceramics acts on the sensor circuit board, causing the sensor circuit board to tilt at a certain angle.

[0014] As described above, a method suitable for a Sham imaging camera with adjustable tilt photography is described. The Sham imaging camera is designed based on Sham's law. When the extended surfaces of the three surfaces, namely the object plane, the image plane and the lens plane, intersect in a straight line, a comprehensive and clear image can be obtained. Piezoelectric ceramics can control the tilt angle of the sensor circuit board with high precision, so that the camera, the lens and the object plane satisfy Sham's law.

[0015] As described above, a method suitable for a Sham imaging camera with adjustable tilt photography, wherein the four piezoelectric ceramics are respectively located at the four corners of the sensor circuit board, and the tilt angle of the sensor circuit board is adjusted by controlling the deformation amount of each piezoelectric ceramic.

[0016] The present invention also provides a computer storage medium, characterized in that it comprises: at least one memory and at least one processor;

[0017] A memory for storing one or more program instructions;

[0018] A processor is used to run one or more program instructions to execute a method suitable for a Sham imaging camera with adjustable tilt photography.

[0019] The beneficial effects achieved by the present invention are as follows: by utilizing the high-precision telescopic characteristics of piezoelectric ceramics, nanometer-level tilt angle adjustment can be achieved, which greatly improves the camera's adaptability to different working distances, thereby significantly improving the resolution and utilization of structured light and camera frames; compared with traditional manual mechanical adjustment methods, piezoelectric ceramics have extremely fast response speeds and can complete the adjustment of the tilt angle in an instant, meeting the needs of high-speed shooting and real-time changing scenes. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0021] Figure 1 This is a structural diagram of a Sham imaging camera suitable for adjustable tilt photography provided in Example 1 of the present application.

[0022] Figure 2 This is a rendering of a Sham imaging camera suitable for adjustable tilt photography provided in Example 1 of the present application.

[0023] Figure 3 This is a piezoelectric ceramic force diagram of a Sham imaging camera suitable for adjustable tilt photography provided in Example 1 of the present application.

[0024] Figure 4 Embodiment 1 of the present application provides an imaging principle diagram of a Sham imaging camera suitable for adjustable tilt photography.

[0025] Figure 5 It is a schematic diagram of a method for a Sham imaging camera suitable for adjustable tilt photography provided in Example 2 of the present application. DETAILED DESCRIPTION

[0026] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0027] Embodiment 1

[0028] like Figures 1 to 4 As shown, the first embodiment of the present application provides a Sham imaging camera suitable for adjustable tilt photography, including:

[0029] A camera housing (1) is provided with a lens frame (2) on which a lens is mounted. A sensor circuit board (3) is embedded in the camera housing (1), the sensor circuit board (3) faces the lens (2), a sensor (4) and a control chip are mounted in the center of the sensor circuit board (3), and four retractable piezoelectric ceramics are mounted on both sides of the sensor (4) on the sensor circuit board (3), including a piezoelectric ceramic 1 (51), a piezoelectric ceramic 2 (52), a piezoelectric ceramic 3 (53) and a piezoelectric ceramic 4 (54).

[0030] When taking pictures at different working distances, the structured light projector emits structured light, which is collected by the lens, and the light signal is sensed by the sensor (4), which converts the light signal into a voltage signal, which is transmitted to the control chip. The control chip calculates the deformation of the piezoelectric ceramic, and the piezoelectric ceramic deforms according to the deformation, generating displacement or force, which drives the sensor circuit board (3) to tilt at an angle to satisfy Sham's law.

[0031] The camera housing (1) is the external protective structure of the entire camera, and is usually made of a strong and durable material, such as metal or high-strength plastic. It provides a stable installation and support environment for the various components inside the camera. The shape and size of the camera housing are carefully designed to meet the functional requirements and ergonomic requirements of the camera. A lens frame (2) is provided on the camera housing (1), and the size and shape of the lens frame (2) match the lens of the camera, ensuring that the lens can be accurately installed on the camera housing and can capture clear images. The camera housing also plays a role in dustproof, waterproof and shockproof, protecting the sensitive components inside the camera from the influence of the external environment.

[0032] The lens frame (2) is a specific area on the camera housing (1) for mounting the lens of the camera. Its shape and size match the lens of the camera to ensure that the lens can be firmly mounted on the camera and can work properly. The lens frame (2) is made of high-strength material to withstand the weight of the lens and external pressure. In this camera, the position and angle of the lens frame (2) are carefully designed so that the lens can accurately capture structured light and provide high-quality image data for subsequent image processing.

[0033] The sensor circuit board (3) is one of the core components of the camera, and is responsible for receiving the light collected by the lens and converting it into an electrical signal. Various electronic components, such as sensors, amplifiers, filters, etc., are installed on the sensor circuit board (3). The design of the sensor circuit board needs to take into account factors such as signal transmission and processing efficiency, noise suppression, and power consumption control. In this camera, the sensor circuit board (3) is embedded in the camera housing (1) and is directly opposite to the lens frame (2) to ensure that the light collected by the lens can be accurately received by the sensor (4).

[0034] The sensor (4) is located in the center of the sensor circuit board (3) and is the core element of the camera to achieve image acquisition and conversion. The appearance of the sensor (4) is rectangular and the surface is smooth and flat. It is generally made of semiconductor material and has good photoelectric conversion performance. The thickness of the sensor (4) is usually thin so that it can be tightly installed on the sensor circuit board (3). When the lens collects structured light, the light is focused by the lens and irradiated onto the sensor (4). The sensor (4) uses the photoelectric effect to convert the light signal into an electrical signal. Specifically, when light is irradiated onto the photosensitive material of the sensor, it will stimulate the movement of electrons and generate a current or voltage signal. The intensity of this electrical signal is proportional to the intensity of the light irradiated onto the sensor. The sensor can convert the external optical image into an electrical signal in real time by quickly responding to and accurately converting the light signal, providing a basis for subsequent signal processing and image display.

[0035] The piezoelectric ceramic 1 (51), piezoelectric ceramic 2 (52), piezoelectric ceramic 3 (53), and piezoelectric ceramic 4 (54) are important components of the camera and are responsible for controlling the tilt angle of the sensor circuit board (3) to satisfy Scham's law. Piezoelectric ceramic is a material with piezoelectric effect. When it is subjected to a voltage signal, it will deform and generate displacement or force, such as Figure 2As shown. In the camera, four piezoelectric ceramics are respectively installed at the four corners of the sensor (4) on the sensor circuit board (3), one end of which is connected to the sensor circuit board (3), and the other end is fixed at the corresponding position inside the camera housing (1). When the sensor (4) converts the light signal into a voltage signal, the voltage signal will be transmitted to piezoelectric ceramic one (51), piezoelectric ceramic two (52), piezoelectric ceramic three (53), and piezoelectric ceramic four (54). Piezoelectric ceramic one (51), piezoelectric ceramic two (52), piezoelectric ceramic three (53), and piezoelectric ceramic four (54) will deform when receiving the voltage signal, generating displacement or force, and these deformations and forces will act on the sensor circuit board (3), driving the sensor circuit board (3) to tilt at a certain angle. By precisely controlling the voltage signal received by the piezoelectric ceramics, high-precision adjustment of the tilt angle of the sensor circuit board can be achieved. Such adjustment enables the camera to keep the extended surfaces of the three planes of imaging, lens, and measurement intersecting in a straight line at different working distances, satisfying Sham's law, such as Figure 4 As shown, a comprehensive and clear image is obtained.

[0036] Embodiment 2

[0037] like Figure 5 As shown, a working method of a Sham imaging camera suitable for adjustable tilt photography provided in Embodiment 2 of the present application specifically includes:

[0038] Step 510: The sensor obtains external light intensity, where the external light intensity is obtained by collecting external light through a camera installed on the camera housing and focusing the light on the sensor in the center of the sensor circuit board;

[0039] The camera collects external light and focuses it on the sensor in the center of the sensor circuit board to obtain light intensity. Let the collected light intensity be I, and (x, y, z) represents the spatial coordinates. Select the center of the sensor circuit board as the origin O, establish a coordinate system, the X-axis points to the right side of the lens, the Y-axis points to the top of the lens, and the Z-axis is perpendicular to the surface of the sensor circuit board and points outward. Four piezoelectric ceramics are installed at the four corners of the sensor circuit board, and each piezoelectric ceramic can produce linear displacement along the X-axis or Y-axis direction.

[0040] The light intensity in the image captured by the sensor is expressed as:

[0041]

[0042] Where I(x,y,z) is the light intensity of the sensor at point (x,y,z); L(x',y',z') is the brightness of the light source at the spatial point (x',y',z'); T(x-x',y-y',z-z') is the transmission function, which describes the transmission characteristics on the path from the light source to the sensor; x1, x2, y1, y2, z1, z2 are the lower and upper limits of the integration area in the X, Y, and Z axis directions respectively.

[0043] Furthermore, the photoelectric effect is used to convert the optical signal (light intensity) into an electrical signal (voltage signal).

[0044] Step 520: The sensor converts light intensity into electrical signals using the photoelectric effect, and transmits the electrical signals to the control chip;

[0045] After the sensor receives light, it uses the photoelectric effect to convert the light intensity I into an electrical signal V sensor , the formula for photoelectric conversion is: V sensor =f(I(x,y)), where V sensor is the voltage signal generated by the sensor; I(x,y) is the light intensity at the sensor at point (x,y); and f(·) is a function used to extract the voltage signal from the light intensity distribution.

[0046] Furthermore, the tilt angle of the sensor circuit board is adjusted by the deformation of the electro-ceramic.

[0047] Step 530: The control chip calculates the deformation amounts of the four piezoelectric ceramics according to the electrical signals transmitted by the sensors, and sends the deformation amounts to the corresponding piezoelectric ceramics;

[0048] The electrical signal V generated by the sensor sensor The control chip calculates the deformation of the four piezoelectric ceramics. After receiving the deformation of the control chip, the piezoelectric ceramics will deform and produce displacement with an accuracy of nanometers. The calculation formula for the deformation of piezoelectric ceramics is: where d i is the deformation of the i-th piezoelectric ceramic; k p is the piezoelectric coefficient, which is determined by the properties of the piezoelectric material; c p is the nonlinear coefficient; V i The voltage applied to the i-th piezoelectric ceramic is equal to the voltage signal V generated by the sensor sensor , α is the adjustment coefficient related to voltage, which is transmitted to the four piezoelectric ceramics to cause deformation and displacement.

[0049] Step 540 : The deformation generated by the four piezoelectric ceramics acts on the sensor circuit board, driving the sensor circuit board to tilt at a corresponding angle.

[0050] The deformation generated by the four piezoelectric ceramics acts on the sensor circuit board, causing the sensor circuit board to tilt at a certain angle Δθ; the displacement and rotation of the sensor circuit board are calculated using the geometric relationship between the deformation of the piezoelectric ceramics and the sensor circuit board. Specifically, the formula is used This set of formulas is used to calculate the overall displacement and rotation of the sensor board, including the displacement Δx along the X-axis and Y-axis 总 and Δy 总 and the rotation angles Δθ around the X and Y axes x and Δθ y , where Δx 总 and Δy 总 are the displacements of the sensor circuit board along the X-axis and Y-axis respectively; d i is the deformation of the i-th piezoelectric ceramic; θ i is the angle of displacement generated by the i-th piezoelectric ceramic relative to the X-axis; r i is the X-axis or Y-axis distance of the i-th piezoelectric ceramic relative to the center of the sensor circuit board; Δθ x and Δθ y are the rotation angles of the sensor circuit board around the X-axis and Y-axis respectively; β and γ are adjustment coefficients related to the distance.

[0051] Considering the influence of the stiffness of the sensor circuit board on the displacement and rotation, the displacement and rotation values ​​are corrected to reflect the actual behavior of the sensor circuit board. Specifically, the formula is used Where Δx 总 and Δy 总 represents the original displacement of the sensor circuit board along the X-axis and Y-axis; Δθ x and Δθ y Indicates the original rotation angle of the sensor board around the X-axis and Y-axis; Δx 修正 and Δy 修正 represents the corrected displacement of the sensor board along the X-axis and Y-axis; Δθ x修正 and Δθ y修正 represents the corrected rotation angle of the sensor board around the X-axis and Y-axis; k s The stiffness coefficient of the sensor circuit board reflects the ability of the circuit board to resist deformation. Such adjustment enables the camera to keep the extended surfaces of the imaging, lens, and measurement planes intersecting in a straight line at different working distances, satisfying Sham's law and obtaining a comprehensive and clear image.

[0052] Corresponding to the above embodiment, an embodiment of the present invention provides a computer storage medium, including: at least one memory and at least one processor;

[0053] The memory is used to store one or more program instructions;

[0054] The processor is used to run one or more program instructions to execute a working method of a Sham imaging camera suitable for adjustable tilt photography.

[0055] Corresponding to the above-mentioned embodiment, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer storage medium contains one or more program instructions, and the one or more program instructions are used by a processor to execute a working method of a Sham imaging camera suitable for adjustable tilt photography.

[0056] The embodiments disclosed in the present invention provide a computer-readable storage medium, in which computer program instructions are stored. When the computer program instructions are executed on a computer, the computer executes the above-mentioned working method of a Sham imaging camera suitable for adjustable tilt photography.

[0057] In the embodiment of the present invention, the processor may be an integrated circuit chip having the signal processing capability. The processor may be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0058] The methods, steps and logic block diagrams disclosed in the embodiments of the present invention can be implemented or executed. The general processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the embodiments of the present invention can be directly embodied as a hardware decoding processor for execution, or can be executed by a combination of hardware and software modules in the decoding processor. The software module can be located in a mature storage medium in the field such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The processor reads the information in the storage medium and completes the steps of the above method in combination with its hardware.

[0059] The storage medium may be a memory, which may be, for example, a volatile memory or a nonvolatile memory, or may include both volatile and nonvolatile memory.

[0060] Among them, the non-volatile memory can be a read-only memory (ROM), a programmable ROM (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory.

[0061] The volatile memory may be a random access memory (RAM) which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate synchronous DRAM (DDRSDRAM), enhanced synchronous DRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM bus DRAM (DRRAM).

[0062] The storage media described in the embodiments of the present invention are intended to include, but are not limited to, these and any other suitable types of memory.

[0063] Those skilled in the art will appreciate that in one or more of the above examples, the functions described in the present invention can be implemented using a combination of hardware and software. When software is used, the corresponding functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein communication media include any media that facilitates the transmission of computer programs from one place to another. Storage media can be any available media that can be accessed by general or special-purpose computers.

[0064] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solution of the present invention should be included in the scope of protection of the present invention.

Claims

1. A Sham imaging camera suitable for adjustable tilt photography, characterized in that: include: A camera housing (1) is provided with a lens frame (2) on which a lens is installed. A sensor circuit board (3) is embedded in the camera housing (1). The sensor circuit board (3) faces the lens. A sensor (4) and a control chip are installed in the center of the sensor circuit board (3). Four piezoelectric ceramics are installed on both sides of the sensor (4) on the sensor circuit board (3), including a piezoelectric ceramic 1 (51), a piezoelectric ceramic 2 (52), a piezoelectric ceramic 3 (53) and a piezoelectric ceramic 4 (54). The control chip is connected to the four piezoelectric ceramics. The lens collects structured light, senses a light signal through the sensor (4), converts the light signal into a voltage signal, transmits the voltage signal to the control chip, and the control chip calculates the deformation of the four piezoelectric ceramics. The four piezoelectric ceramics are deformed according to the corresponding deformation, generating displacement or force, thereby driving the sensor circuit board (3) to tilt at an angle to satisfy Sham's law.

2. A Sham imaging camera suitable for adjustable tilt photography as claimed in claim 1, characterized in that: The lens mounted on the camera housing (1) is responsible for collecting external light and focusing it on the sensor (4) in the center of the sensor circuit board (3).

3. A Sham imaging camera suitable for adjustable tilt photography as claimed in claim 2, characterized in that: The sensor (4) located in the center of the sensor circuit board (3) is a core element of the camera for realizing image acquisition and conversion. When the lens acquires structured light, the light is focused by the lens and irradiated to the sensor (4). The sensor (4) utilizes the photoelectric effect to convert the light signal into an electrical signal and transmits it to the piezoelectric ceramic 1 (51), the piezoelectric ceramic 2 (52), the piezoelectric ceramic 3 (53) and the piezoelectric ceramic 4 (54).

4. A Sham imaging camera suitable for adjustable tilt photography as claimed in claim 3, characterized in that: Four piezoelectric ceramics, including piezoelectric ceramic one (51), piezoelectric ceramic two (52), piezoelectric ceramic three (53) and piezoelectric ceramic four (54), are respectively mounted on the four corners of a sensor (4) on a sensor circuit board (3) and connected to the sensor circuit board (3); when the sensor (4) converts an optical signal into a voltage signal, the voltage signal is transmitted to the piezoelectric ceramic one (51), the piezoelectric ceramic two (52), the piezoelectric ceramic three (53) and the piezoelectric ceramic four (54); when the four piezoelectric ceramics receive the voltage signal, they will deform, generating displacement or force, and these deformations and forces will act on the sensor circuit board (3), driving the sensor circuit board (3) to tilt at a certain angle.

5. A Sham imaging camera suitable for adjustable tilt photography as claimed in claim 4, characterized in that: When the piezoelectric ceramic receives a voltage signal, it deforms and generates displacement or force. Four high-precision stretchable piezoelectric ceramics achieve accurate tilt angle control of the camera sensor circuit board.

6. A working method for a Sham imaging camera with adjustable tilt for photographing, applied to the Sham imaging camera as claimed in any one of claims 1 to 5, characterized in that: include: The sensor obtains the external light intensity, which is the light intensity obtained by collecting external light through a camera installed on the camera housing and focusing the light on the sensor in the center of the sensor circuit board; The sensor uses the photoelectric effect to convert light intensity into electrical signals, and transmits them to four piezoelectric ceramics to cause them to deform and generate displacement; The deformation generated by the four piezoelectric ceramics acts on the sensor circuit board, causing the sensor circuit board to tilt at a certain angle.

7. A computer storage medium, characterized in that: include: at least one memory and at least one processor; A memory for storing one or more program instructions; A processor is used to run one or more program instructions to execute the working method of a Sham imaging camera suitable for adjustable tilt photography as described in claim 6.

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