Photoelectric component packaging structure

Abstract

The invention relates to the technical field of photoelectric element processing, in particular to a photoelectric element packaging structure which comprises a bottom shell and an outer shell, the surfaces of the sides, close to each other, of the bottom shell and the outer shell are provided with a fixing piece and a clamping piece respectively, a cavity is formed in the inner side of the bottom shell, and a connecting base is fixedly installed on the bottom wall of the inner side of the cavity; clamping rods are symmetrically installed on the outer walls of the two sides of the connecting base, clamping plates are jointly and slidably connected to the outer sides of the two clamping rods on the same side, rotating buckling pieces are arranged on the inner sides of the two ends of the two clamping plates, abutting bases are fixedly connected to the top ends of the two clamping plates, and clamping bases are fixedly connected to the top ends of the abutting bases; a plurality of sets of jacks are formed in the upper portion of the inner side of the connecting base, a circuit board body is arranged on the upper portion of the inner side of the connecting base, a circuit board can be rapidly fixed, heat of an integrated circuit board in the packaging box can be reduced, and the heat dissipation performance of the interior of the packaged integrated circuit board in an integrated circuit is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular provides a photoelectric component packaging structure. Background Art

[0002] For printed circuit boards (PCBs) with optoelectronic components integrated on the circuit board, optoelectronic components can realize the transmission, reception and processing of optical signals, providing strong support for the high-speed communication and high-efficiency operation of electronic devices. When the optical signal propagates through the photoconductive layer, it is received by the optoelectronic components and converted into electrical signals, which can then be transmitted and processed on the circuit board. Similarly, electrical signals can also be converted into optical signals for transmission. With the continuous development of electronic technology, circuit boards with optoelectronic components will develop towards higher speed, higher density, lower power consumption and more intelligent directions. They are mainly composed of substrates, conductive layers, photoconductive layers and electronic components. The substrate is made of high-performance materials such as high-purity glass fiber to ensure the insulation and mechanical strength of the circuit board; the conductive layer is mostly made of metals such as copper, which is used to transmit electrical signals; the optical layer is the core part of the circuit board, and uses materials with high refractive index and low transmission loss, such as polymer optical waveguides, to guide the propagation of optical signals; electronic components include lasers, photodiodes, etc., which work with the optical layer to complete the transmission, reception and processing of optical signals. The packaging structure is to protect the tiny components on the circuit board, provide good mechanical and environmental protection, and provide the necessary connections to realize electrical functions. The following are some common integrated circuit packaging structures.

[0003] Most of the existing packaging structures are fixed by glue dispensing. When there is loss, hot melt is needed to melt the glue before the circuit board can be removed. In addition, this method has low heat dissipation performance during packaging, which affects the use of the circuit board. Therefore, we need to improve the above problems. Summary of the invention

[0004] The purpose of the present invention is to solve the problems existing in the background technology and to propose an optoelectronic component packaging structure.

[0005] To achieve the above objectives, the present invention provides an optoelectronic component packaging structure, including a bottom shell and an outer shell, wherein the bottom shell and the outer shell are respectively provided with fixing parts and clamping parts on their side surfaces close to each other, a cavity is opened on the inner side of the bottom shell, a connecting seat is fixedly installed on the inner bottom wall of the cavity, and the outer walls on both sides of the connecting seat are symmetrically provided with clamping rods, and the outer sides of the two clamping rods on the same side are slidably connected with clamping plates together, and rotating buckling parts are arranged on the inner sides of both ends of the two clamping plates, and the top ends of the two clamping plates are fixedly connected with abutments, and the top ends of the buttresses are fixedly connected with the clamping seat, and multiple groups of jacks are opened on the upper inner side of the connecting seat, and a circuit board body is arranged on the upper inner side of the connecting seat, and pins are connected to the corresponding jacks at the bottom of the circuit board body, and heat dissipation grooves are opened on both sides of the circuit board body and close to the position of the clamping seat, a heat absorption plate is fixedly installed on the inner side of the heat dissipation groove, and a cooling part is arranged on the top of the clamping seat.

[0006] Preferably, the fixing member comprises clamping columns respectively installed at the inner corners of the bottom shell, and a cushion frame is commonly sleeved on the outer sides of the four clamping columns.

[0007] Preferably, the clamping parts include clamping sleeves respectively fixedly connected to the bottom corners of the shell, corresponding to the movable clamping between the clamping sleeves and the clamping columns.

[0008] Preferably, the rotating buckle parts include rectangular grooves opened on the inner side of the splint, a rotating shaft is rotatably installed at the lower inner side of the rectangular groove, a connecting plate is sleeved on the outer side of the rotating shaft, a bent buckle is fixedly installed on the outer side of one end of the connecting plate, and a button is fixedly installed on the other end of the connecting plate.

[0009] Preferably, a fixing strip is fixedly connected to the outer side of the connecting seat near the bending buckle position, a V-shaped piece is fixedly connected to the outer side of both ends of the fixing strip, and a support column is fixedly connected to the upper side of one end of the V-shaped piece, and the bending buckle and the support column are movably clamped.

[0010] Preferably, the cooling components all include a slot opened at the top of the card seat, a socket is movably mounted inside the slot, an injection tube is vertically connected to the top of the socket, multiple groups of heat dissipation boxes are installed on the outside of the injection tube, and a header is threadedly connected to the top of the outside of the injection tube.

[0011] Preferably, outer walls at both ends of the shell are fixedly connected with fixing plates, and inner sides of two groups of fixing plates are provided with connecting holes.

[0012] Preferably, the multiple groups of heat dissipation boxes are all arranged in a triangular shape, and the outer walls on both sides of the multiple groups of heat dissipation boxes are against the surface of the heat absorption plate.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] By means of the provided splint, clamping rod, retaining seat, retaining column and buckle, the circuit board body can be quickly inserted into the jack inside the connecting seat and clamped on the outside of the circuit board body. The buckle locks the corresponding retaining column, so that the corresponding retaining seat and clamping seat can be clamped on the outside of the circuit board body, and the installation is fast, simple and quick.

[0015] By arranging multiple groups of inclined heat dissipation boxes above the corresponding card holders, the outer walls of the heat dissipation boxes on both sides are in contact with the heat absorbing plate, and the heat of the circuit board body can be absorbed while being pressed against the circuit board body, thereby reducing the heat of the integrated circuit board inside the bottom shell and improving the heat dissipation performance inside the packaged circuit board in the integrated circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the connection and separation between the outer shell and the bottom shell of the present invention;

[0018] Figure 3 This is a schematic diagram of the connection between the bottom shell and the circuit board body of the present invention;

[0019] Figure 4 It is a schematic diagram showing the connection between the bottom shell and the circuit board body of the present invention from another angle;

[0020] Figure 5 It is a schematic diagram of the splint structure of the present invention;

[0021] Figure 6 This is a schematic diagram of the circuit board body structure of the present invention;

[0022] Figure 7 This is a schematic diagram of the structure of the connecting seat of the present invention;

[0023] Figure 8 It is a schematic diagram of the disassembly of the cooling element part structure of the present invention;

[0024] Fig. 9 For the present invention Figure 7 Enlarged view of point A in the middle.

[0025] In the figure: 1, bottom shell; 2, outer shell; 3, fixing plate; 4, circuit board body; 5, heat absorbing plate; 6, clamping sleeve; 7, splint; 8, clamping column; 9, stopper; 10, clamping rod; 11, connecting seat; 12, heat dissipation box; 13, injection pipe; 14, clamping seat; 15, fixing strip; 16, heat dissipation slot; 17, button; 18, rotating shaft; 19, rectangular slot; 20, pin; 21, jack; 22, slot; 23, socket; 24, protrusion; 25, connecting plate; 26, buckle; 27, stopper; 28, V-shaped piece; 29, cushion frame; 30, cavity; 31, connecting hole. DETAILED DESCRIPTION

[0026] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] like Figure 1-Figure 9 The optoelectronic component packaging structure shown in the figure includes a bottom shell 1 and an outer shell 2. The surfaces of the bottom shell 1 and the outer shell 2 on one side close to each other are respectively provided with fixing parts and clamping parts. A cavity 30 is opened on the inner side of the bottom shell 1. A connecting seat 11 is fixedly installed on the inner bottom wall of the cavity 30. Clamping rods 10 are symmetrically installed on the outer walls of both sides of the connecting seat 11. The outer sides of the two clamping rods 10 on the same side are slidably connected with a clamping plate 7. Rotating buckles are arranged on the inner sides of both ends of the two clamping plates 7. The tops of the two clamping plates 7 are fixedly connected with a retaining seat 9. The top of the retaining seat 9 is fixedly connected with a clamping seat 14. A plurality of clamping plates are opened on the upper inner side of the connecting seat 11. A group of jacks 21 are provided, and a circuit board body 4 is arranged on the upper inner side of the connecting seat 11. Pins 20 are connected to the corresponding jacks 21 at the bottom of the circuit board body 4. The jacks 21 opened at the connecting seat 11 can be clamped with the pins 20 at the circuit board body 4, so that the circuit board body 4 can be connected. Heat dissipation grooves 16 are opened on both sides of the circuit board body 4 and close to the position of the card seat 14. A heat absorbing plate 5 is fixedly installed inside the heat dissipation groove 16. The heat absorbing plate 5 is used to absorb the heat at the heat dissipation groove 16. A cooling component is provided on the top of the card seat 14, and then the heat is cooled and dissipated through the cooling component.

[0029] The fixing member comprises clamping columns 8 respectively installed at the inner corners of the bottom shell 1 , and a cushion frame 29 is commonly sleeved on the outer sides of the four clamping columns 8 .

[0030] The clamping parts include clamping sleeves 6 respectively fixedly connected to the bottom corners of the shell 2, and the corresponding clamping sleeves 6 are movably clamped with the clamping columns 8. The clamping sleeves 6 and the clamping columns 8 are movably clamped together, so that the bottom shell 1 and the shell 2 can be assembled.

[0031] The rotating fastening parts include rectangular grooves 19 that are all opened on the inner side of the splint 7, and a rotating shaft 18 is rotatably installed at the lower inner side of the rectangular groove 19. The rectangular groove 19 is used to install the rotating shaft 18. A connecting plate 25 is sleeved on the outer side of the rotating shaft 18, and a bent buckle 26 is fixedly installed on the outer side of one end of the connecting plate 25, and a button 17 is fixedly installed on the other end of the connecting plate 25. A fixing bar 15 is fixedly connected to the outer side of the connecting seat 11 and close to the bent buckle 26. V-shaped pieces 28 are fixedly connected to the outer sides of both ends of the fixing bar 15, and a support column 27 is fixedly connected to the upper side of one end of the V-shaped piece 28. The bent buckle 26 and the support column 27 are movably clamped. As the splint 7 approaches, the button 17 at one end of the bent buckle 26 can drive the bent buckle 26 to rotate up and down, and then one end of the bent buckle 26 is clamped from the outer side of the support column 27 when it approaches, so that the splint 7 is connected to the connecting seat 11.

[0032] The cooling parts all include a slot 22 opened at the top of the card seat 14, and a socket 23 is movably installed on the inner side of the slot 22. The cooperation between the socket 23 and the slot 22 can install the injection tube 13 to one side of the heat absorbing plate 5. The top of the socket 23 is vertically connected to the injection tube 13, and multiple groups of heat dissipation boxes 12 are installed on the outer side of the injection tube 13. A head 24 is threadedly connected to the upper side of the outer side of the injection tube 13, and the head 24 can seal the liquid inlet of the injection tube 13.

[0033] The outer walls at both ends of the shell 2 are fixedly connected with fixing plates 3, and the inner sides of the two sets of fixing plates 3 are provided with connecting holes 31. The outer shell 2 and the bottom shell 1 can be conveniently installed through the provided fixing plates 3 and connecting holes 31.

[0034] The multiple heat dissipation boxes 12 are all triangular in shape, and the outer walls on both sides of the multiple heat dissipation boxes 12 are against the surface of the heat absorbing plate 5. The heat dissipation boxes 12 are arranged in an inverted triangle. The coolant is injected inside and then dissipates the heat on the surface of the heat absorbing plate 5 through the adjacent surface. The coolant can be maintained and added regularly.

[0035] Working principle: When in use, the multiple groups of pins 20 at the bottom of the circuit board body 4 are correspondingly inserted into the jacks 21 at the upper end of the inner side of the connecting seat 11, and then the corresponding clamps 7 on both sides of the connecting seat 11 are moved to both sides of the circuit board body 4, so that the retaining seats 9 and the clamping seats 14 at both ends of the clamping plates 7 are pressed against each other in the heat dissipation grooves 16 on the inner side of the circuit board body 4, and then the bent buckles 26 at the clamping plates 7 are moved by hand, so that the bent buckles 26 wrap the retaining columns 27 at the top and clamp them on the outside. In this way, the two clamps 7 can be connected to the connecting seat 11, and the retaining seats 9 can be pressed against the surface of the circuit board body 4. The injection tube 13 above the clamping seat 14 can be poured with coolant. When in use, the coolant is connected to the heat dissipation box 12, and the heat dissipation box 12 can diffuse the heat adsorbed on the surface of the heat absorbing plate 5, thereby ensuring the use of the circuit board body 4.

[0036] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. An optoelectronic component packaging structure, comprising a bottom shell (1) and an outer shell (2), characterized in that: A fixing part and a clamping part are respectively arranged on the surfaces of one side where the bottom shell (1) and the outer shell (2) are close to each other. A cavity (30) is opened inside the bottom shell (1). A connecting seat (11) is fixedly installed on the inner bottom wall of the cavity (30). Clamping rods (10) are symmetrically installed on the outer walls of both sides of the connecting seat (11). A clamping plate (7) is slidably connected to the outer sides of two clamping rods (10) on the same side. Rotating fastening parts are arranged on the inner sides of both ends of the two clamping plates (7). A stop seat (9) is fixedly connected to the top ends of the two clamping plates (7). The top of the stop (9) is fixedly connected to a card seat (14), a plurality of groups of jacks (21) are provided on the inner upper side of the connection seat (11), a circuit board body (4) is provided on the inner upper side of the connection seat (11), pins (20) are connected to the bottom of the circuit board body (4) corresponding to the jacks (21), heat dissipation grooves (16) are provided on both sides of the circuit board body (4) and close to the card seat (14), a heat absorbing plate (5) is fixedly installed on the inner side of the heat dissipation groove (16), and a cooling element is provided on the top of the card seat (14).

2. The optoelectronic component packaging structure according to claim 1, characterized in that: The fixing member comprises clamping columns (8) respectively mounted at the inner corners of the bottom shell (1), and a cushion frame (29) is commonly sleeved on the outer sides of the four clamping columns (8).

3. The optoelectronic component packaging structure according to claim 1, characterized in that: The clamping parts include clamping sleeves (6) respectively fixedly connected to the bottom corners of the housing (2), corresponding to the movable clamping between the clamping sleeves (6) and the clamping columns (8).

4. The optoelectronic component packaging structure according to claim 1, characterized in that: The rotating buckle parts include rectangular grooves (19) each provided on the inner side of the clamping plate (7), a rotating shaft (18) is rotatably mounted on the lower inner side of the rectangular groove (19), a connecting plate (25) is sleeved on the outer side of the rotating shaft (18), a bent buckle (26) is fixedly mounted on the outer side of one end of the connecting plate (25), and a button (17) is fixedly mounted on the other end of the connecting plate (25).

5. The optoelectronic component packaging structure according to claim 4, characterized in that: A fixing strip (15) is fixedly connected to the outside of the connection seat (11) and near the bent buckle (26), a V-shaped piece (28) is fixedly connected to the outside of both ends of the fixing strip (15), and a support column (27) is fixedly connected to the top of one end of the V-shaped piece (28), and the bent buckle (26) and the support column (27) are movably clamped.

6. The optoelectronic component packaging structure according to claim 1, characterized in that: The cooling components all include a slot (22) opened at the top of the card seat (14), a socket (23) is movably mounted inside the slot (22), a liquid injection pipe (13) is vertically connected to the top of the socket (23), a plurality of heat dissipation boxes (12) are connected and mounted on the outside of the liquid injection pipe (13), and a head (24) is threadedly connected to the top of the outside of the liquid injection pipe (13).

7. The optoelectronic component packaging structure according to claim 1, characterized in that: The outer walls at both ends of the housing (2) are fixedly connected with fixing plates (3), and the inner sides of the two groups of fixing plates (3) are provided with connecting holes (31).

8. The optoelectronic component packaging structure according to claim 6, characterized in that: The multiple groups of heat dissipation boxes (12) are all arranged in a triangular shape, and the outer walls on both sides of the multiple groups of heat dissipation boxes (12) are against the surface of the heat absorption plate (5).

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