Display panel and display device

Abstract

A display panel comprises a substrate, a display structure layer, a packaging structure layer, a touch control structure layer and a plurality of frame signal lines. The display structure layer comprises a plurality of display organic insulating layers and a plurality of display inorganic insulating layers, and the plurality of display organic insulating layers are located on the sides, away from the substrate, of the plurality of display inorganic insulating layers. The touch structure layer is located on the side, away from the substrate, of the packaging structure layer and comprises a touch inorganic insulating layer. The touch inorganic insulating layer comprises a first inorganic boundary part located in the first frame area, and the first inorganic boundary part is in direct contact with the at least one display organic insulating layer and is not in direct contact with the multiple display inorganic insulating layers. The frame signal lines are located in the first frame area, located on the sides, away from the substrate, of the display inorganic insulating layers and located on the sides, close to the substrate, of the touch inorganic insulating layers, and a voltage difference exists between at least two adjacent frame signal lines.

Description

Technical Field

[0001] This article relates to but is not limited to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and Quantum-dot Light Emitting Diode (QLED) are active light-emitting display devices with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, extremely high response speed, light weight, flexibility and low cost. Summary of the invention

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] Embodiments of the present application provide a display panel and a display device.

[0005] On the one hand, this embodiment provides a display panel, comprising: a substrate, a display structure layer, an encapsulation structure layer, a touch structure layer, and a plurality of frame signal lines. The display structure layer is located on the substrate, and comprises a plurality of display organic insulation layers and a plurality of display inorganic insulation layers, wherein the plurality of display organic insulation layers are located on a side of the plurality of display inorganic insulation layers away from the substrate. The encapsulation structure layer is located on a side of the display structure layer away from the substrate. The touch structure layer is located on a side of the encapsulation structure layer away from the substrate, and comprises a touch inorganic insulation layer; the touch inorganic insulation layer comprises: a first inorganic boundary portion located in a first frame region, the first inorganic boundary portion is in direct contact with at least one display organic insulation layer of the plurality of display organic insulation layers, and is not in direct contact with the plurality of display inorganic insulation layers. A plurality of frame signal lines are located in the first frame region, the plurality of frame signal lines are located on a side of the plurality of display inorganic insulation layers away from the substrate and on a side of the touch inorganic insulation layer close to the substrate, and a voltage difference exists between at least two adjacent frame signal lines of the plurality of frame signal lines. The display panel satisfies at least one of the following: the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the overlapping area of ​​the orthographic projections of the at least two border signal lines located in different conductive layers on the base substrate is greater than 0; the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the orthographic projections of the at least two border signal lines located in the same conductive layer closest to the touch inorganic insulating layer on the base substrate is greater than 0.

[0006] In some exemplary embodiments, a minimum distance between the first inorganic boundary portion of the touch-sensitive inorganic insulating layer and an overlapping region of an orthographic projection of the at least two frame signal lines on the base substrate is greater than 20 micrometers.

[0007] In some exemplary embodiments, the plurality of border signal lines include: at least one first border signal line and a plurality of second border signal lines; the plurality of second border signal lines are located in the same conductive layer, and the first border signal line and the plurality of second border signal lines are located in different conductive layers; the first border signal line is configured to transmit a constant power signal, and an orthographic projection of the first border signal line on the base substrate at least partially overlaps with an orthographic projection of at least one of the plurality of second border signal lines on the base substrate.

[0008] In some exemplary embodiments, the display structure layer further includes: a plurality of display metal layers; the plurality of second frame signal lines and the display metal layer closest to the touch structure layer among the plurality of display metal layers are in the same layer structure.

[0009] In some exemplary embodiments, the multiple display metal layers include: a first source-drain metal layer, a second source-drain metal layer, and a third source-drain metal layer located on the side of the multiple display inorganic insulating layers away from the base substrate; the multiple second border signal lines and the third source-drain metal layer are in the same layer structure, and the first border signal line is located on the side of the multiple second border signal lines close to the base substrate.

[0010] In some exemplary embodiments, the first border area includes: a first routing area, a bending area, and a second routing area arranged in sequence along a direction away from the effective area; the orthographic projection of the touch-sensitive inorganic insulating layer on the base substrate does not overlap with the bending area; the first inorganic boundary portion of the touch-sensitive inorganic insulating layer is located in the second routing area and is adjacent to the bending area.

[0011] In some exemplary embodiments, the display structure layer includes: a plurality of sub-pixels located in the effective area and a plurality of data lines connected to the plurality of sub-pixels. The base substrate also includes: a second frame area located on the remaining side of the effective area, the second frame area is provided with a gate drive circuit, and the gate drive circuit is configured to provide gate control signals to the plurality of sub-pixels. The first frame area also includes: at least one first signal access area located on the side of the second wiring area away from the bending area; the first signal access area is provided with a plurality of first contact pads. The second wiring area is provided with at least one first power adapter line, a plurality of data adapter lines, a plurality of first drive transmission lines, a plurality of first drive connection lines, and a plurality of second drive connection lines; the first power adapter line is configured to transmit a constant first power signal. The plurality of data lines are connected to a portion of the first contact pads of the first signal access area through the plurality of data adapter lines; the plurality of first drive transmission lines and the plurality of second drive connection lines are located on both sides of the first signal access area along the first direction; the plurality of first drive transmission lines are connected to the plurality of second drive connection lines through the plurality of first drive connection lines, and are configured to transmit control signals provided to the gate drive circuit; the plurality of first drive connection lines are located on one side of the first signal access area close to the bending area. The first frame signal line includes: the first power adapter line, and the plurality of second frame signal lines include: the plurality of first drive connection lines.

[0012] In some exemplary embodiments, the plurality of first drive connection lines are located on a side of the plurality of first drive transmission lines and the plurality of second drive connection lines away from the substrate substrate. The first power adapter line is located on a side of the plurality of data adapter lines away from the substrate substrate, and is located on a side of the plurality of first drive connection lines close to the substrate substrate.

[0013] In some exemplary embodiments, the first border area further includes: a second signal access area located on a side of the first signal access area away from the bending area, and a plurality of second contact pads are provided in the second signal access area. The second routing area is also provided with a plurality of second drive transmission lines, and the plurality of second drive transmission lines and the plurality of first drive transmission lines are located on the same side of the first signal access area. The plurality of second contact pads include: at least one first group of second contact pads, at least one second group of second contact pads, and at least one third group of second contact pads; the first group of second contact pads is connected to a portion of the first contact pads in the first signal access area; the second group of second contact pads is connected to the plurality of second drive transmission lines; the third group of second contact pads is connected to the plurality of second drive connection lines; the second group of second contact pads and the third group of second contact pads are located on both sides of the first group of second contact pads.

[0014] In some exemplary embodiments, the second wiring area is provided with at least one second power adapter line and a plurality of touch adapter lines, and the second power adapter line is configured to transmit a constant second power signal. The first frame signal line includes: the second power adapter line; the plurality of second frame signal lines include: the plurality of touch adapter lines.

[0015] In some exemplary embodiments, the display panel further includes: an auxiliary organic insulating layer located in the first frame region, the auxiliary organic insulating layer being located on a side of the plurality of display organic insulating layers away from the base substrate and on a side of the touch inorganic insulating layer close to the base substrate. The orthographic projection of the auxiliary organic insulating layer on the base substrate covers the orthographic projection of the at least two frame signal lines on the base substrate.

[0016] In some exemplary embodiments, an orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate partially overlaps an orthographic projection of the auxiliary organic insulating layer on the base substrate.

[0017] In some exemplary embodiments, the touch structure layer includes: a touch barrier layer, a first touch conductive layer, a touch interlayer insulating layer, a second touch conductive layer and a touch protection layer sequentially arranged on the packaging structure layer; the touch inorganic insulating layer includes the touch barrier layer, or includes the touch barrier layer and the touch interlayer insulating layer.

[0018] On the other hand, this embodiment provides a display device, including the display panel as described above.

[0019] Other aspects will be apparent upon reading and understanding the drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0021] Figure 1 is a schematic diagram of a display panel according to at least one embodiment of the present disclosure; Figure 2 A partial plan view of a touch area of ​​a display panel according to at least one embodiment of the present disclosure; Figure 3A A partial cross-sectional schematic diagram of an effective area of ​​a display panel according to at least one embodiment of the present disclosure; Figure 3B is another partial cross-sectional schematic diagram of an active area of ​​a display panel according to at least one embodiment of the present disclosure; Figure 3Cis another partial cross-sectional schematic diagram of an active area of ​​a display panel according to at least one embodiment of the present disclosure; Figure 4 A partial plan view of a first frame region of a display panel according to at least one embodiment of the present disclosure; Figure 5 for Figure 4 Schematic diagram of local wiring in the middle area S1; Figure 6 for Figure 4 A partial plan view of the middle area S1; Figure 7 for Figure 4 A partial plan view of the middle area S2; Fig. 8A for Figure 6 Schematic diagram of the local section along the PP' direction; Figure 8B for Figure 6 Schematic diagram of the local section along the QQ' direction; Figure 8C for Figure 6 Another partial cross-sectional schematic diagram along the PP' direction; Fig. 9 for Figure 5 A local plan view of the Fig. 10A for Fig. 9 Schematic diagram of the local section along the RR' direction; Fig. 10B for Fig. 9 Schematic diagram of the local section along the UU' direction; Fig.11 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] The embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The embodiments can be implemented in a plurality of different forms. A person skilled in the art can easily understand the fact that the method and content can be transformed into other forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0023] In the drawings, the size of one or more components, the thickness of a layer, or an area is sometimes exaggerated for the sake of clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to the size, and the shape and size of one or more components in the drawings do not reflect the true proportion. In addition, the drawings schematically show ideal examples, and one embodiment of the present disclosure is not limited to the shapes or values ​​shown in the drawings.

[0024] The ordinal numbers such as "first", "second", and "third" in this specification are provided to avoid confusion of constituent elements, and are not intended to limit the quantity. The "plurality" in this disclosure means two or more.

[0025] In this specification, for the sake of convenience, the words and phrases indicating the orientation or positional relationship such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the orientation of the constituent elements being described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the circumstances.

[0026] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or a connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal connection of two elements. For ordinary technicians in this field, the meaning of the above terms in this disclosure can be understood according to the circumstances. Among them, "connection" may include "electrical connection", and "electrical connection" may include the situation where constituent elements are connected together through an element with some electrical function. There is no special restriction on "elements with some electrical function" as long as they can transmit electrical signals between connected constituent elements. Examples of "elements with some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with multiple functions.

[0027] In this specification, a transistor refers to an element including at least three terminals: a gate (gate electrode), a drain, and a source. A transistor has a channel region between a drain (drain electrode terminal, drain region, or drain electrode) and a source (source electrode terminal, source region, or source electrode), and current can flow through the drain, the channel region, and the source. In this specification, a channel region refers to a region through which current mainly flows.

[0028] In this specification, the first electrode may be a drain electrode, the second electrode may be a source electrode, or the first electrode may be a source electrode, the second electrode may be a drain electrode. In addition, the gate electrode may also be referred to as a control electrode. In the case of using transistors with opposite polarities or in the case of a change in the direction of current during circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged. Therefore, in this specification, the "source electrode" and the "drain electrode" may be interchanged.

[0029] In this specification, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.

[0030] In this specification, circles, ellipses, triangles, rectangles, trapezoids, pentagons or hexagons are not in the strict sense, but may be approximate circles, approximate ellipses, approximate triangles, approximate rectangles, approximate trapezoids, approximate pentagons or approximate hexagons, etc. There may be some small deformations caused by tolerances, such as chamfers, arc edges and deformations.

[0031] In this specification, "about" and "approximately" mean that the limits are not strictly defined and the situation within the range of process and measurement errors is allowed. In this disclosure, "same" includes the situation where the numerical value differs within 10%, such as the situation where the numerical value differs within 5%.

[0032] In this specification, A extends along direction B means that A may include a main part and a secondary part connected to the main part, the main part is a line, line segment or strip-shaped body, the main part extends along direction B, and the length of the main part extending along direction B is greater than the length of the secondary part extending along other directions. In this specification, "A extends along direction B" means "the main part of A extends along direction B".

[0033] In this specification, "A and B are of the same layer structure" means that A and B are formed simultaneously by the same patterning process. "The same layer" does not always mean that the thickness of the layer or the height of the layer is the same in the cross-sectional view. "The orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection range of A, or the orthographic projection of A covers the orthographic projection of B.

[0034] In some implementations, the display panel may be integrated with a touch structure. The display panel may include: a liquid crystal display (LCD) substrate, or an organic light emitting diode (OLED) display substrate, or a plasma display device (PDP) display substrate, or an electrophoretic display (EPD) display substrate. For example, the display panel may include an OLED display substrate and a touch structure. The touch structure may be disposed on the encapsulation layer of the display substrate to form a touch structure on a thin film encapsulation (Touch on Thin Film Encapsulation, or Touch on TFE for short). The display structure and the touch structure are integrated together, and have the advantages of being thin, light, and foldable, and can meet product requirements such as flexible folding and narrow bezels.

[0035] In some examples, the Touch on TFE structure mainly includes a Flexible Multi-Layer On Cell (FMLOC) structure and a Flexible Single-Layer On Cell (FSLOC) structure. The FMLOC structure is based on the working principle of mutual capacitance detection. Generally, two conductive layers are used to form the drive (Tx) electrode and the sense (Rx) electrode. The integrated circuit (IC) detects the mutual capacitance between the drive electrode and the sense electrode to achieve touch control. The FSLOC structure is based on the working principle of self-capacitance (or voltage) detection. Generally, a single conductive layer is used to form the touch electrode. The integrated circuit detects the self-capacitance (or voltage) of the touch electrode to achieve touch control.

[0036] The inventors noticed in their research that in a display panel integrating a display structure and a touch structure, a touch inorganic insulating layer is provided before preparing the conductive layer of the touch structure or between adjacent conductive layers of the touch structure, and the edge of the touch inorganic insulating layer can directly contact the inorganic insulating layer in the display structure to form an inorganic closed space, so that water vapor cannot invade. However, when the touch inorganic insulating layer has a boundary that cannot directly contact the inorganic insulating layer in the display structure (for example, the boundary of the touch inorganic insulating layer located in the bending area away from the display area), and the boundary is close to the conductive layer of the display structure, if water vapor invades the boundary, the water vapor will not be able to overflow during the trust process, which can easily lead to direct electrochemical corrosion of the signal wiring of the conductive layer of the display structure. When there is a voltage difference between the signal wirings, the corrosion of the signal wirings will be further aggravated.

[0037] The present embodiment provides a display panel and a display device, which can improve the corrosion of signal wiring during the reliability process.

[0038] The present embodiment provides a display panel, comprising: a substrate, a display structure layer, an encapsulation structure layer, a touch structure layer, and a plurality of frame signal lines. The display structure layer is located on the substrate, and comprises a plurality of display organic insulation layers and a plurality of display inorganic insulation layers, wherein the plurality of display organic insulation layers are located on a side of the plurality of display inorganic insulation layers away from the substrate. The encapsulation structure layer is located on a side of the display structure layer away from the substrate. The touch structure layer is located on a side of the encapsulation structure layer away from the substrate, and comprises a touch inorganic insulation layer; the touch inorganic insulation layer comprises: a first inorganic boundary portion located in a first frame region, the first inorganic boundary portion is in direct contact with at least one display organic insulation layer of the plurality of display organic insulation layers, and is not in direct contact with the plurality of display inorganic insulation layers. A plurality of frame signal lines are located in the first frame region, the plurality of frame signal lines are located on a side of the plurality of display inorganic insulation layers away from the substrate and on a side of the touch inorganic insulation layer close to the substrate, and a voltage difference exists between at least two adjacent frame signal lines of the plurality of frame signal lines. The display panel satisfies at least one of the following: the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the overlapping area of ​​the orthographic projections of the at least two border signal lines located in different conductive layers on the base substrate is greater than 0; the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the orthographic projections of the at least two border signal lines located in the same conductive layer closest to the touch inorganic insulating layer on the base substrate is greater than 0.

[0039] In some examples, adjacent border signal lines may include: border signal lines that are close to each other in a plane parallel to the substrate, such as border signal lines that are located in the same conductive layer and have no other lines between them; border signal lines that are close to each other in a direction perpendicular to the plane of the substrate, such as border signal lines that are located in adjacent conductive layers and have no other lines between them in a direction perpendicular to the substrate.

[0040] In some examples, multiple frame signal lines with voltage differences are adjacent to each other along a plane parallel to the base substrate and are located on the same conductive layer closest to the touch inorganic insulating layer. Then, in the first frame region, the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the orthographic projection of the multiple frame signal lines with voltage differences on the base substrate is greater than 0. In other words, in the first frame region, the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer and the multiple adjacent frame signal lines with voltage differences on the base substrate may not overlap.

[0041] In some examples, multiple frame signal lines with voltage differences are adjacent in a direction perpendicular to the base substrate, and then in the first frame region, the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the overlapping region of the orthographic projection of the multiple frame signal lines with voltage differences on the base substrate is greater than 0. In other words, in the first frame region, the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the overlapping region of the orthographic projection of the multiple frame signal lines with voltage differences on the base substrate may not overlap.

[0042] In some examples, the voltage difference between two border signal lines may mean that the two border signal lines are configured to transmit different signals. For example, one of the border signal lines transmits a constant voltage signal, and the other border signal line transmits a pulse signal. For another example, both border signal lines transmit pulse signals, and when one border signal line transmits a high level signal, the other border signal line transmits a low level signal.

[0043] The display panel provided in this embodiment can improve the corrosion of the frame signal line caused by water vapor invading from the first inorganic boundary portion of the touch control inorganic insulating layer that is not in direct contact with the inorganic insulating layer of the display structure layer by removing the touch control inorganic insulating layer at the positions of the plurality of frame signal lines where there is a voltage difference. This embodiment can improve the corrosion of the frame signal line in the first frame area during the reliability process and avoid the resulting poor display.

[0044] In some exemplary embodiments, the minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the substrate and the overlapping area of ​​the orthographic projection of the at least two frame signal lines with a voltage difference on the substrate can be greater than 20 microns. The distance setting of this example can improve the corrosion of the frame signal line due to water vapor intrusion.

[0045] In some exemplary embodiments, the plurality of frame signal lines may include: at least one first frame signal line and a plurality of second frame signal lines. The plurality of second frame signal lines may be located in the same conductive layer, and the first frame signal line and the plurality of second frame signal lines may be located in different conductive layers. The first frame signal line may be configured to transmit a constant power signal, and the orthographic projection of the first frame signal line on the substrate substrate may at least partially overlap with the orthographic projection of at least one of the plurality of second frame signal lines on the substrate substrate. In some examples, the display structure layer may further include: a plurality of display metal layers; the plurality of second frame signal lines and the display metal layer closest to the touch structure layer among the plurality of display metal layers may be of the same layer structure. For example, the plurality of display metal layers may include: a first source-drain metal layer, a second source-drain metal layer, and a third source-drain metal layer located on the side of the plurality of inorganic insulating layers of the display structure layer away from the substrate substrate; the plurality of second frame signal lines and the third source-drain metal layer may be of the same layer structure, and the first frame signal line may be located on the side of the plurality of second frame signal lines close to the substrate substrate.

[0046] In some exemplary embodiments, the first frame area may include: a first routing area, a bending area, and a second routing area arranged in sequence along a direction away from the effective area. The orthographic projection of the touch inorganic insulating layer on the base substrate may not overlap with the bending area; the first inorganic boundary portion of the touch inorganic insulating layer may be located in the second routing area and adjacent to the bending area. In some examples, in order to ensure the bending performance of the bending area, the touch inorganic insulating layer is not provided in the bending area; the touch inorganic insulating layer includes a first inorganic boundary portion close to the bending area in the second routing area, and the edge of the first inorganic boundary portion may face the bending area. Since the first inorganic boundary portion is in direct contact with the display organic insulating layer of the display structure layer and does not contact the display inorganic insulating layer to form an inorganic closed space, there is a risk of water vapor invading along the edge position of the first inorganic boundary portion. In this example, the positional relationship between the first inorganic boundary portion of the touch inorganic insulating layer and the plurality of frame signal lines with a voltage difference is adjusted in the second routing area, which can improve the routing corrosion in the setting area of ​​the frame signal line with a voltage difference, thereby avoiding the display abnormality caused thereby.

[0047] In some exemplary embodiments, the first border signal line and the plurality of second border signal lines are both located in the second routing area. The first border signal line may include at least one of the following: a first power adapter line for transmitting a first power signal, a second power adapter line for transmitting a second power signal. Among them, the first power signal may be greater than the second power signal. The plurality of second border signal lines may include at least one of the following: a plurality of first drive connection lines, a plurality of touch adapter lines. The orthographic projection of the first power adapter line on the substrate substrate may at least partially overlap with the orthographic projection of at least one first drive connection line on the substrate substrate; the orthographic projection of the second power adapter line on the substrate substrate may at least partially overlap with the orthographic projection of at least one touch adapter line on the substrate substrate.

[0048] In some exemplary embodiments, the display panel may further include: an auxiliary organic insulating layer located in the first frame area, the auxiliary organic insulating layer being located on a side of the multiple display organic insulating layers away from the base substrate, and being located on a side of the touch inorganic insulating layer close to the base substrate; the orthographic projection of the auxiliary organic insulating layer on the base substrate may cover the orthographic projection of the at least two frame signal lines on the base substrate. In some examples, the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate may partially overlap with the orthographic projection of the auxiliary organic insulating layer on the base substrate. In this example, the auxiliary organic insulating layer may be provided to ensure the covering of multiple frame signal lines.

[0049] The solution of this embodiment is described below by means of some examples.

[0050] Figure 1 is a schematic diagram of a display panel according to at least one embodiment of the present disclosure. Figure 1 FIG. 1 is a schematic plan view of a display panel before the bending process is performed. Figure 1 As shown, the display panel may include: an active area AA, and a frame area BB surrounding the active area AA. For example, the frame area BB may include: a first frame area B1 located on one side of the active area AA, and a second frame area located on the other side of the active area AA (for example, it may include an upper frame area B2, a left frame area B3, and a right frame area B4). The first frame area B1 may be the lower frame of the display panel.

[0051] In some examples, such as Figure 1As shown, the active area AA can be a flat area configured to display dynamic images or still images, and can also be configured for touch sensing. The active area AA can be both a display area and a touch area. The touch area and display area in the following description refer to the active area AA. In some examples, the active area AA can be a rectangle, such as a rounded rectangle. In other examples, the active area AA can be other shapes such as a circle or an ellipse. In other examples, the display panel can be a flexible panel, so the display panel can be deformable, such as curling, bending, folding or rolling up.

[0052] In some examples, such as Figure 1 As shown, the effective area AA may include: a plurality of sub-pixels PX, a plurality of gate lines GL, and a plurality of data lines DL. The plurality of sub-pixels PX may be arranged in an array along a first direction D1 and a second direction D2. The first direction D1 intersects with the second direction D2, for example, the first direction D1 may be perpendicular to the second direction D2. The plurality of gate lines GL may extend along the first direction D1 and be arranged along the second direction D2. The plurality of data lines DL may extend along the second direction D2 and be arranged along the first direction D1. The orthographic projections of the plurality of gate lines GL and the plurality of data lines DL on the substrate may intersect to form a plurality of sub-pixel regions, and a sub-pixel PX may be provided in each sub-pixel region. The plurality of data lines DL may be electrically connected to the plurality of sub-pixels PX, and configured to provide data signals to the plurality of sub-pixels PX. The plurality of gate lines GL may be electrically connected to the plurality of sub-pixels PX, and configured to provide gate control signals to the plurality of sub-pixels PX. In some examples, the gate control signal may include: a scan signal and a light emitting control signal, or may include a scan signal, or may include a scan signal, a light emitting control signal, and a reset control signal.

[0053] In some examples, such as Figure 1 As shown, the first direction D1 may be parallel to the extension direction of the gate line GL in the display area AA, and the first direction D1 may also be called a row direction; the second direction D2 may be parallel to the extension direction of the data line DL in the display area AA, and the second direction D2 may also be called a column direction.

[0054] In some examples, one pixel unit of the active area AA may include three sub-pixels, which may be a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively. In other examples, one pixel unit may include four sub-pixels, which may be a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel, respectively, or the four sub-pixels may include: one red sub-pixel, one blue sub-pixel, and two green sub-pixels.

[0055] In some examples, a sub-pixel may include: a pixel circuit and a light-emitting element electrically connected to the pixel circuit. The pixel circuit may include multiple transistors and at least one capacitor. For example, the pixel circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C or 8T1C structure. Wherein, T in the above circuit structure refers to a thin film transistor, C refers to a capacitor, the number before T represents the number of thin film transistors in the circuit, and the number before C represents the number of capacitors in the circuit. In some examples, the multiple transistors in the pixel circuit may be P-type transistors, or may be N-type transistors. Using the same type of transistors in the pixel circuit can simplify the process flow, reduce the process difficulty of the display panel, and improve the yield of the product. In other examples, the multiple transistors in the pixel circuit may include P-type transistors and N-type transistors.

[0056] In some examples, multiple transistors in a pixel circuit may use low-temperature polysilicon thin-film transistors, or may use oxide thin-film transistors, or may use low-temperature polysilicon thin-film transistors and oxide thin-film transistors. The active layer of the low-temperature polysilicon thin-film transistor uses low-temperature polysilicon (LTPS), and the active layer of the oxide thin-film transistor uses oxide semiconductor (Oxide). Low-temperature polysilicon thin-film transistors have the advantages of high mobility and fast charging, and oxide thin-film transistors have the advantages of low leakage current. Integrating low-temperature polysilicon thin-film transistors and oxide thin-film transistors on a display panel, namely the LTPS+Oxide (LTPO for short) display panel, can take advantage of the advantages of both, can achieve low-frequency driving, can reduce power consumption, and can improve display quality.

[0057] In some examples, the light-emitting element may be any one of a light-emitting diode (LED), an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a micro-LED (including: mini-LED or micro-LED), etc. For example, the light-emitting element may be an OLED, and the light-emitting element may emit red light, green light, blue light, or white light, etc. when driven by its corresponding pixel circuit. The color of the light emitted by the light-emitting element may be determined as required. In some examples, the light-emitting element may include: an anode, a cathode, and an organic light-emitting layer located between the anode and the cathode. The anode of the light-emitting element may be electrically connected to the corresponding pixel circuit. However, this embodiment is not limited to this.

[0058] In some examples, the shape of the light-emitting element of the sub-pixel can be a rectangle, a rhombus, a pentagon, or a hexagon. When a pixel unit includes three sub-pixels, the light-emitting elements of the three sub-pixels can be arranged in parallel horizontally, vertically, or in a triangle; when a pixel unit includes four sub-pixels, the light-emitting elements of the four sub-pixels can be arranged in parallel horizontally, vertically, or in a square. However, this embodiment is not limited to this.

[0059] Figure 2 FIG. 1 is a partial plan view of a touch area of ​​a display panel according to at least one embodiment of the present disclosure. Figure 2 As shown, taking the display panel integrated with a mutual capacitance touch structure to form an FMLOC structure as an example, the touch area AA may include a plurality of first touch units 530 and a plurality of second touch units 540. The first touch unit 530 may extend along the first direction D1, and the plurality of first touch units 530 may be arranged in sequence along the second direction D2; the second touch unit 540 may extend along the second direction D2, and the plurality of second touch units 540 may be arranged in sequence along the first direction D1. Each first touch unit 530 may include a plurality of first touch electrodes 531 and a first connecting portion 532 arranged in sequence along the first direction D1, and the first touch electrodes 531 and the first connecting portion 532 may be alternately arranged and connected in sequence. Each second touch unit 540 may include a plurality of second touch electrodes 541 arranged in sequence along the second direction D2, and the plurality of second touch electrodes 541 may be arranged at intervals, and adjacent second touch electrodes 541 may be connected to each other through the second connecting portion 542. In some examples, the film layer where the second connection portion 542 is located may be different from the film layer where the first touch electrode 531 and the second touch electrode 541 are located.

[0060] In some examples, such as Figure 2 As shown, the first touch electrode 531 and the second touch electrode 541 may be in the form of transparent conductive electrodes. In other examples, the first touch electrode 531 and the second touch electrode 541 may be in the form of a metal grid, which may be formed by interweaving a plurality of metal wires, which may include a plurality of grid patterns, and the grid pattern may be a polygon formed by a plurality of metal wires. The first touch electrode 531 and the second touch electrode 541 in the form of a metal grid have the advantages of low resistance, small thickness, and fast response speed.

[0061] In some examples, such as Figure 2As shown, the first touch electrode 531 and the second touch electrode 541 may have a rhombus shape, for example, a regular rhombus, a horizontally long rhombus, or a vertically long rhombus. In other examples, the first touch electrode 531 and the second touch electrode 541 may have any one or more of a triangle, a square, a trapezoid, a parallelogram, a pentagon, a hexagon, and other polygons, which is not limited in the embodiments of the present disclosure.

[0062] Figure 3A A partial cross-sectional schematic diagram of an effective area of ​​a display panel according to at least one embodiment of the present disclosure. Figure 3A The structure of a sub-pixel in the effective area is used as an example for illustration. In this example, the same type of multiple transistors in the pixel circuit is used as an example for illustration. For example, multiple transistors in the pixel circuit can all use low-temperature polysilicon thin-film transistors. In other examples, multiple transistors in the pixel circuit can use low-temperature polysilicon thin-film transistors and oxide thin-film transistors. In addition, this example uses the display panel integrated with a mutual capacitance touch structure to form an FMLOC structure as an example for illustration.

[0063] In some examples, such as Figure 3A As shown, in the direction perpendicular to the display panel, the effective area of ​​the display panel may include: a base substrate 10, and a circuit structure layer 20, a light emitting structure layer 30, a packaging structure layer 40 and a touch structure layer 50 sequentially arranged on the base substrate 10. Among them, the display structure layer may include a circuit structure layer 20 and a light emitting structure layer 30. The circuit structure layer 20 may include at least: a pixel circuit of a plurality of sub-pixels, and the pixel circuit of each sub-pixel may include a plurality of transistors and at least one capacitor. The light emitting structure layer 30 may include at least: a light emitting element of a plurality of sub-pixels. The touch structure layer 50 uses the packaging structure layer 40 as a substrate. In some possible implementations, other film layers (for example, a color filter layer) may be arranged between the touch structure layer 50 and the packaging structure layer 40, which is not limited in the present disclosure.

[0064] In some examples, the base substrate 10 may include a first flexible material layer, a first inorganic material layer, a base semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The first flexible material layer and the second flexible material layer may be made of polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, etc. The first inorganic material layer and the second inorganic material layer may be made of silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the base substrate 10. The base semiconductor layer may be made of amorphous silicon (a-Si). However, this embodiment is not limited to this.

[0065] In some examples, Figure 3AIn the figure, a thin film transistor 21 and a capacitor 22 included in each sub-pixel are used as an example for illustration. In some examples, the circuit structure layer 20 of the effective area may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source-drain metal layer, a second source-drain metal layer and a third source-drain metal layer arranged on the base substrate 10. The multiple display metal layers of the display structure layer of this example may include: a first gate metal layer, a second gate metal layer, a first source-drain metal layer, a second source-drain metal layer and a third source-drain metal layer. A first gate insulating layer 101 may be arranged between the semiconductor layer and the first gate metal layer, a second gate insulating layer 102 may be arranged between the first gate metal layer and the second gate metal layer, an interlayer insulating layer 103 may be arranged between the second gate metal layer and the first source-drain metal layer, a passivation layer 104 and a first flat layer 105 may be arranged between the first source-drain metal layer and the second source-drain metal layer, a second flat layer 106 may be arranged between the second source-drain metal layer and the third source-drain metal layer, and a third flat layer 107 may be arranged on the side of the third source-drain metal layer away from the base substrate 10. Among them, the multiple display inorganic insulating layers of the display structure layer may include: a first gate insulating layer 101, a second insulating layer 102, an interlayer insulating layer 103 and a passivation layer 104, and the multiple display organic insulating layers of the display structure layer may include: a first flat layer 105, a second flat layer 106 and a third flat layer 107. However, this embodiment is not limited to this. In other examples, a buffer layer may be provided on the side of the semiconductor layer close to the base substrate, and the buffer layer may prevent harmful substances in the base substrate from invading the interior of the display panel, and may also increase the adhesion of the film layer in the display panel on the base substrate. In other examples, a bottom shading metal layer (BSM, Bottom Shielding Metal) may be provided on the side of the buffer layer close to the base substrate, and the bottom shading metal layer may be configured to at least partially cover the active layer of the thin film transistor of the pixel circuit to prevent external light from affecting the performance of the thin film transistor.

[0066] In some examples, the first gate metal layer, the second gate metal layer, the first source-drain metal layer, the second source-drain metal layer and the third source-drain metal layer may be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, etc. The semiconductor layer may be made of amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene or polythiophene, that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology or organic technology.

[0067] In some examples, such as Figure 3A As shown, the semiconductor layer of the effective area may include: an active layer 210 of the thin film transistor 21. The active layer 210 of the thin film transistor 21 may include: a first area 2101, a second area 2102, and a channel area 2100 located between the first area 2101 and the second area 2102. The first gate metal layer may include: a gate 213 of the thin film transistor 21, and a first electrode 221 of the capacitor 22. The orthographic projection of the gate 213 of the thin film transistor 21 on the substrate 10 may cover the orthographic projection of the channel area 2100 of the active layer 210 on the substrate 10. The second gate metal layer may include: a second electrode 222 of the capacitor 22. The orthographic projections of the second electrode 222 and the first electrode 221 of the capacitor 22 on the substrate 10 may at least partially overlap, for example, the two may overlap. The first source-drain metal layer may include: a source 211 and a drain 212 of the thin film transistor 21. The interlayer insulating layer 103 may be provided with a plurality of vias (for example, including a first pixel via and a second pixel via) in the effective area. The interlayer insulating layer 103, the second gate insulating layer 102 and the first gate insulating layer 101 in the first pixel via may be removed to expose at least a portion of the surface of the first region 2101 of the active layer 210; the interlayer insulating layer 103, the second gate insulating layer 102 and the first gate insulating layer 101 in the second pixel via may be removed to expose at least a portion of the surface of the second region 2102 of the active layer 210. The source electrode 211 of the thin film transistor 21 may be electrically connected to the first region 2101 of the active layer 210 through the first pixel via, and the drain electrode 212 may be electrically connected to the second region 2102 of the active layer 210 through the second pixel via. The second source-drain metal layer may include: a first transfer electrode 231. The first transfer electrode 231 can be electrically connected to the drain 212 of the thin film transistor 21 of the pixel circuit through the third pixel via hole opened in the passivation layer 104 and the first flat layer 105. The third source-drain metal layer may include: a second transfer electrode 232. The second transfer electrode 232 can be electrically connected to the first transfer electrode 231 located in the second source-drain metal layer through the fourth pixel via hole opened in the second flat layer 106. The second transfer electrode 232 can be electrically connected to the first electrode 301 (e.g., anode) of the light-emitting element through the fifth pixel via hole opened in the third flat layer 107. In this example, the electrical connection between the pixel circuit and the light-emitting element can be realized through the first transfer electrode 231 and the second transfer electrode 232.

[0068] In some examples, the gate line of the effective area may be located in the first gate metal layer, the data line of the effective area may be located in the second source-drain metal layer or the third source-drain metal layer, and the high potential power line of the effective area may be located in at least one of the second source-drain metal layer and the third source-drain metal layer. This embodiment is not limited to this. The circuit structure layer of this example may include three source-drain metal layers, which can avoid arranging more wiring in a single source-drain metal layer, thereby facilitating the realization of a narrow frame structure.

[0069] In some examples, such as Figure 3A As shown, the light emitting structure layer 30 may include: a pixel definition layer 304 and a plurality of light emitting elements. For example, each light emitting element may include: a stacked first electrode 301, an organic light emitting layer 302 and a second electrode 303. The first electrode 301 of the light emitting element may be an anode, and the first electrode 301 may be disposed on the third flat layer 107, and electrically connected to the second transfer electrode 232 through a fifth pixel via hole provided in the third flat layer 107. The pixel definition layer 304 is disposed on the first electrode 301 and the third flat layer 107, and the pixel definition layer 304 may be provided with a plurality of pixel openings, and one pixel opening may expose at least part of the surface of a corresponding first electrode 301. At least part of the organic light emitting layer 302 may be disposed in one pixel opening and connected to the corresponding first electrode 301. The second electrode 303 may be disposed on the organic light emitting layer 302 and connected to the organic light emitting layer 302. The organic light emitting layer 302 may emit light of corresponding colors under the drive of the first electrode 301 and the second electrode 303. A spacer column layer may be further disposed on the side of the pixel definition layer 304 away from the substrate 10 , and the spacer column layer may include a plurality of spacer columns (PS). In some examples, the pixel definition layer 434 may be made of materials such as polyimide, acrylic, or polyethylene terephthalate.

[0070] In some examples, the organic light-emitting layer 302 of the light-emitting element may include a light-emitting layer (EML, Emitting Layer), and one or more film layers including a hole injection layer (HIL, Hole Injection Layer), a hole transport layer (HTL, Hole Transport Layer), a hole blocking layer (HBL, Hole Block Layer), an electron blocking layer (EBL, Electron Block Layer), an electron injection layer (EIL, Electron Injection Layer), and an electron transport layer (ETL, Electron Transport Layer). Under the voltage drive of the first electrode 301 and the second electrode 303, the light-emitting characteristics of the organic material can be used to emit light according to the required grayscale.

[0071] In some examples, the light-emitting layers of light-emitting elements of different colors may be different. For example, a red light-emitting element includes a red light-emitting layer, a green light-emitting element includes a green light-emitting layer, and a blue light-emitting element includes a blue light-emitting layer. In order to reduce the process difficulty and improve the yield, the hole injection layer and the hole transport layer on one side of the light-emitting layer may use a common layer, and the electron injection layer and the electron transport layer on the other side of the light-emitting layer may use a common layer. In some examples, any one or more of the hole injection layer, the hole transport layer, the electron injection layer, and the electron transport layer can be made by a single process (a single evaporation process or a single inkjet printing process), and isolation is achieved by means of a surface step difference of the formed film layer or by surface treatment. For example, any one or more of the hole injection layer, the hole transport layer, the electron injection layer, and the electron transport layer corresponding to adjacent sub-pixels may be isolated. In some examples, the organic light-emitting layer may be formed by evaporation using a fine metal mask (FMM, FineMetal Mask) or an open mask (Open Mask), or may be formed by an inkjet process.

[0072] In some examples, such as Figure 3A As shown, the encapsulation structure layer 40 may include a first encapsulation layer 401, a second encapsulation layer 402, and a third encapsulation layer 403 stacked. Among them, the first encapsulation layer 401 and the third encapsulation layer 403 may be made of inorganic materials, the second encapsulation layer 402 may be made of organic materials, and the second encapsulation layer 402 may be arranged between the first encapsulation layer 401 and the third encapsulation layer 403 to ensure that external water vapor cannot enter the light-emitting element. However, this embodiment is not limited to this. For example, the encapsulation structure layer may adopt a five-layer stacked structure of inorganic / organic / inorganic / organic / inorganic.

[0073] In some examples, such as Figure 3A As shown, in the direction perpendicular to the display panel, the touch structure layer 50 of the effective area may include: a touch barrier layer (TBL, Touch Barrier Layer) 501, a first touch conductive layer (TMA, Touch Metal A) 511, a touch interlayer insulating layer (TLD) 502, a second touch conductive layer (TMB, Touch Metal B) 512 and a touch protection layer (OC, Optical Cover) 503 arranged in sequence.

[0074] In some examples, the first touch conductive layer 511 may include: a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of first connecting portions; the plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of first connecting portions may be formed by the same patterning process, and the first touch electrodes and the first connecting portions may be an integrated structure connected to each other. The second touch conductive layer 512 may include a plurality of second connecting portions; the second connecting portions may be connected to adjacent second touch electrodes through vias provided in the touch interlayer insulating layer 502. In other examples, the first touch conductive layer may include the aforementioned first touch electrodes, the second touch electrodes, and the first connecting portions, and the second touch conductive layer may include the aforementioned second connecting portions.

[0075] In some examples, the first touch electrode may be a driving (Tx) electrode, and the second touch electrode may be a sensing (Rx) electrode. Alternatively, the first touch electrode may be a sensing (Rx) electrode, and the second touch electrode may be a driving (Tx) electrode.

[0076] In some examples, the touch barrier layer 501 and the touch interlayer insulating layer 502 may be inorganic insulating layers, and the touch protection layer 503 may be an organic insulating layer. For example, the touch barrier layer 501 and the touch interlayer insulating layer 502 may be any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and may be a single layer, a multilayer or a composite layer. The touch protection layer 503 may be made of polyimide (PI) or the like. In this example, the touch inorganic insulating layer may include a touch barrier layer 501 and a touch interlayer insulating layer 502.

[0077] In other examples, the touch barrier layer 501 may be an inorganic insulating layer, and the touch interlayer insulating layer 502 and the touch protection layer 503 may be organic insulating layers. By setting the touch interlayer insulating layer 502 as an organic insulating layer, the crack problem generated in the reliability test of the display panel (such as the crack problem generated in the anti-arch test of the foldable display panel) can be improved, thereby improving the anti-bending ability of the display panel, which is conducive to improving the product yield and competitiveness of the display panel. In this example, the touch inorganic insulating layer may include the touch barrier layer 501.

[0078] In some examples, the first touch conductive layer 511 and the second touch conductive layer 512 can be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, ITO / Ag / ITO, etc.

[0079] Figure 3BFIG. 1 is another partial cross-sectional schematic diagram of the effective area of ​​the display panel of at least one embodiment of the present disclosure. Figure 3B As shown, only the first planar layer 105 can be disposed between the first source-drain metal layer and the second source-drain metal layer of the circuit structure layer 20, and the passivation layer can be omitted. The remaining structure of the display panel of this example can refer to the description of the above embodiment, so it will not be repeated here.

[0080] Figure 3C FIG. 1 is another partial cross-sectional schematic diagram of the effective area of ​​the display panel of at least one embodiment of the present disclosure. Figure 3C As shown, this example takes the display panel integrating a self-capacitive touch structure to form an FSLOC structure as an example for explanation. In the direction perpendicular to the display panel, the touch structure layer 50 of the effective area AA may include: a touch barrier layer 501, a first touch conductive layer 511 and a touch protection layer 503 arranged in sequence. The first touch conductive layer 511 may include a plurality of touch electrodes. The touch barrier layer 501 may be an inorganic insulating layer, and the touch protection layer 503 may be an organic insulating layer. In this example, the touch inorganic insulating layer may include a touch barrier layer 501. The remaining structure of the display panel of this example can refer to the description of the aforementioned embodiment, so it will not be repeated here.

[0081] In some examples, such as Figure 1 As shown, the touch structure layers of the left frame area B3 and the right frame area B4 of the display panel may each include: a plurality of touch lead lines 521. The plurality of touch lead lines 521 may be electrically connected to the first touch unit and the second touch unit in the active area AA, respectively. Figure 3A Taking the film layer structure shown as an example, the multiple touch lead wires 521 can be located in the first touch conductive layer, or in the second touch conductive layer; or the multiple touch lead wires 521 can be alternately arranged in the first touch conductive layer and the second touch conductive layer.

[0082] Figure 4 FIG. 1 is a partial plan view of a first border region of a display panel according to at least one embodiment of the present disclosure. Figure 1 and Figure 4As shown, the first border area B1 of the display panel may include: a first routing area B11, a bending area B12, and a second routing area B13 arranged in sequence along a direction away from the active area AA. The first routing area B11 may be connected to the active area AA, and the first routing area B11 may be provided with at least a first power border line 411, a second power border line 412, a plurality of display lead lines, and a plurality of touch lead lines 521. The first power border line 411 may extend along the first direction D1 in the first routing area B11, and may be configured to connect the high potential power line in the active area AA; the second power border line 412 may extend along the first direction D1 in the first routing area B11, and may be configured to connect the low potential power lines in the third border area B13 and the fourth border area B14.

[0083] In some examples, the first power border line 411 can be a double-layer wiring structure, for example, including a first power wiring layer and a second power wiring layer, the first power wiring layer can be the same layer structure as the first source and drain metal layer of the effective area, and the second power wiring layer can be the same layer structure as the second source and drain metal layer of the effective area. The first power wiring layer and the second power wiring layer can be overlapped over a large area by digging out the groove formed by the first flat layer. The second power wiring layer can extend to the effective area and be connected to the high potential power line in the effective area.

[0084] In some examples, the second power border line 412 can be a three-layer wiring structure, for example, including a third power routing layer, a fourth power routing layer and a fifth power routing layer; the third power routing layer can be the same layer structure as the first source and drain metal layer of the effective area, the fourth power routing layer can be the same layer structure as the second source and drain metal layer of the effective area, and the fifth power routing layer can be the same layer structure as the third source and drain metal layer of the effective area. The third power routing layer and the fourth power routing layer can achieve large-area overlap by digging out the grooves formed by the first flat layer, and the fifth power routing layer can be connected to the fourth power routing layer through multiple vias opened in the second flat layer. The fifth power routing layer can be connected to multiple low-potential power connection lines located in the third source and drain metal layer in the effective area, for example, it can be an integrated structure to achieve electrical connection with the second power border line in the upper frame area.

[0085] In some examples, such as Figure 1As shown, the multiple display lead lines in the first routing area B11 may include at least: multiple data lead lines 251, multiple drive lead lines (not shown). Multiple data lead lines 251 can be electrically connected to multiple data lines DL in the effective area AA, for example, multiple data lead lines 251 and multiple data lines DL can be electrically connected one by one. Multiple data lead lines 251 can be arranged in the first routing area B11 in a fan-out routing manner and extend to the bending area B12. For example, multiple data lead lines 251 can be alternately arranged in the first gate metal layer and the second gate metal layer. Multiple drive lead lines can extend from the left frame area B3 and the right frame area B4 to the first routing area B11, and multiple drive lead lines can be electrically connected to the gate drive circuit in the left frame area B3 and the right frame area B4. Multiple drive lead lines can be configured to provide control signals to the gate drive circuit, for example, the control signal can include a start signal, a clock signal, etc. The plurality of touch lead lines 521 may extend from the left frame area B3 and the right frame area B4 to the first wiring area B11 , and may be located on a side of the plurality of display lead lines away from the base substrate.

[0086] In some examples, such as Figure 1 and Figure 4 As shown, the bending area B12 is connected between the first routing area B11 and the second routing area B13, and can be configured so that the second routing area B13 is bent to the back of the effective area AA. The bending area B12 can be provided with multiple bending connection lines, for example, it can include multiple data bending connection lines 252, multiple driving bending connection lines (not shown), multiple touch bending connection lines 522, first power bending connection lines (not shown) and second power bending connection lines (not shown). The first power bending connection line can be electrically connected to the first power border line 411 in the first routing area B11, and the second power bending connection line can be electrically connected to the second power border line 412 in the first routing area B11. Multiple data bending connection lines 252 can be electrically connected to multiple data lead lines 251, multiple driving bending connection lines can be electrically connected to multiple driving lead lines, and multiple touch bending connection lines 522 can be electrically connected to multiple touch lead lines 521.

[0087] In some examples, such as Figure 1 As shown, the plurality of bending connection lines may all extend along the second direction D2, and the plurality of bending connection lines may be in the same layer structure. FIG. 3A to FIG. 3C Taking the film structure shown as an example, a plurality of bending connection lines can be located in the second source-drain metal layer. For example, a plurality of touch bending connection lines 522 can be located on opposite sides of a plurality of data bending connection lines 252 in the first direction D1. However, this embodiment is not limited to this.

[0088] In some examples, such as Figure 1As shown, the second routing area B13 may be provided with a plurality of adapter lines, for example, may include: a plurality of data adapter lines 253 and a plurality of touch adapter lines 523. The plurality of data adapter lines 253 may be electrically connected to the plurality of data bending connection lines 252, for example, in a one-to-one correspondence. The plurality of touch adapter lines 523 may be electrically connected to the plurality of touch bending connection lines 522, for example, in a one-to-one correspondence.

[0089] In some examples, the first border area B1 may include: at least one first signal access area B131 and at least one second signal access area B132 . Figure 1 A first signal access area B131 and a second signal access area B132 are used as examples for illustration. In other examples, the display panel may be a large-size panel or a folding panel, and the display panel may include multiple first signal access areas B131 or multiple second signal access areas B132, multiple first signal access areas B131 may be arranged in sequence along the first direction D1, and multiple second signal access areas B132 may be arranged in sequence along the first direction D1. The first signal access area B131 may be located on the side of the second signal access area B132 close to the effective area AA. For example, the second signal access area B132 may be located on the side of the first signal access area B131 away from the bending area B12 in the second direction D2.

[0090] In some examples, such as Figure 1 and Figure 4 As shown, the first signal access area B131 can also be called a driver chip setting area. The first signal access area B131 can be provided with a plurality of first contact pads, and the plurality of first contact pads can be configured to be bound and connected to at least one driver chip. For example, the driver chip can be configured to generate a data signal required for driving a sub-pixel. For example, the plurality of first contact pads in the first signal access area B131 may include: a first group of first contact pads and a second group of first contact pads, and the second group of first contact pads may be located on a side of the first group of first contact pads away from the bending area B12. The first group of first contact pads can be connected to a plurality of data transfer lines 253.

[0091] In some examples, such as Figure 1 and Figure 4As shown, the second signal access area B132 can also be called a circuit binding area. The second signal access area B132 can be provided with a plurality of second contact pads. The plurality of second contact pads can be arranged in a row along the first direction D1, for example. The plurality of second contact pads can be configured to be bound and connected to at least one circuit board (for example, a flexible printed circuit (FPC)). For example, an external circuit board can be configured to generate a touch signal provided to the touch structure layer and to receive a touch sensing signal. The second group of first contact pads in the first signal access area B131 can be electrically connected to the plurality of second contact pads through a plurality of pin connection lines to perform signal transmission between the first signal access area B131 and the second signal access area B132.

[0092] In some examples, the second routing area B13 may also include: a first circuit area located on the side of the first signal access area B131 close to the bending area B12, and the first circuit area may be provided with multiple test circuits (not shown). The test circuit may be configured to be electrically connected to the multiple data lead-out lines 251 through multiple data transfer lines 253 and multiple data bending connection lines 252, and provide test data signals to the multiple data lines DL in the effective area AA during the test phase. The first circuit area may also include multiple electrostatic discharge circuits to provide a path for electrostatic discharge. For example, multiple data bending connection lines 252 can be electrically connected to the test circuit after being transferred through multiple data transfer lines 253, and multiple data transfer lines 253 can be located on the side of the multiple data bending connection lines 252 close to the substrate substrate, which can facilitate the arrangement of the routing connected to the test circuit. For example, multiple data transfer lines 253 can be alternately arranged in the first gate metal layer and the second gate metal layer.

[0093] Below Figure 4 Take the structure in the second routing area B13 as an example to illustrate. Figure 4 In the figure, two first signal access areas B131 are used as an example to illustrate Figure 4 The multiple data transfer lines 253 within are schematically illustrated as a whole.

[0094] In some examples, such as Figure 4 As shown, the second routing area B13 may also be provided with a plurality of first power adapter lines (e.g., two first power adapter lines 413a and 413b), and a plurality of second power adapter lines (e.g., three second power adapter lines 414a, 414b, and 414c). The plurality of first power adapter lines may be connected to the first power border line 411 in the first routing area B11 through the plurality of first power bending connection lines in the bending area B12; the plurality of second power adapter lines may be connected to the second power border line 412 in the first routing area B11 through the plurality of second power bending connection lines in the bending area B12.

[0095] In some examples, along the first direction D1, the second power adapter 414a, the first power adapter 413a, the second power adapter 414c, the first power adapter 413b and the second power adapter 414b are arranged in sequence. The second power adapters 414a and 414b may extend at least along the second direction D2. The first power adapters 413a and 413b, and the second power adapter 414c may be roughly n-shaped. Taking the first power adapter 413a as an example, the first power adapter 413a may include a first main body extending along the first direction D1, and a first extension portion and a second extension portion extending along the second direction D2, the first extension portion being connected to one end of the first main body, and the second extension portion being connected to the other end of the first main body. The first extension portion of the first power adapter 413a is adjacent to the second power adapter 414a, and the second extension portion is adjacent to the second power adapter 414c. The first extension portion and the second extension portion of the first power adapter 413a may extend to connect to the corresponding second contact pad in the second signal access area B132.

[0096] In some examples, the first power adapter lines 413a and 413b and the second power adapter lines 414a and 414b in the second routing area B13 can all be double-layer routing structures, for example, they can include a routing layer with the same layer structure as the first source and drain metal layer of the effective area, and a routing layer with the same layer structure as the second source and drain metal layer; the second power adapter line 414c can be a three-layer routing structure, for example, it can include a routing layer with the same layer structure as the first source and drain metal layer of the effective area, a routing layer with the same layer structure as the second source and drain metal layer of the effective area, and a routing layer with the same layer structure as the third source and drain metal layer of the effective area.

[0097] Figure 5 for Figure 4 Schematic diagram of local wiring in area S1. In some examples, such as Figure 4 and Figure 5As shown, the second routing area B13 may also be provided with a plurality of drive transmission lines 61, a plurality of first drive connection lines 621a and 621b, and a plurality of second drive connection lines 622a and 622b. The plurality of drive transmission lines 61 may be connected to the plurality of drive lead-out lines of the first routing area B11 through the plurality of drive bending connection lines of the bending area B12. The plurality of drive transmission lines 61 may include: a plurality of first drive transmission lines 611a and 611b, and a plurality of second drive transmission lines 612a and 612b. Among them, the plurality of first drive transmission lines 611a and the plurality of second drive transmission lines 612a may be located on one side of the plurality of data transfer lines 253 along the first direction D1, and the plurality of first drive transmission lines 611b and the plurality of second drive transmission lines 612b may be located on the other side of the plurality of data transfer lines 253 along the first direction D1. The plurality of first drive transmission lines 611a may be connected to the plurality of second drive connection lines 622a through the plurality of first drive connection lines 621a. The plurality of first drive transmission lines 611b may be connected to the plurality of second drive connection lines 622b through the plurality of first drive connection lines 621b. For example, the plurality of first drive transmission lines 611a may be electrically connected to the plurality of first drive connection lines 621a in a one-to-one correspondence, and the plurality of first drive connection lines 621a may be electrically connected to the plurality of second drive connection lines 622a in a one-to-one correspondence.

[0098] In some examples, the plurality of first driving connection lines 621a may be located on a side of the first first signal access area B131 close to the bending area B12, and the plurality of first driving connection lines 621b may be located on a side of the second first signal access area B131 close to the bending area B12. The plurality of second driving connection lines 622a and 622b may be located in the middle area between the two first signal access areas B131.

[0099] In some examples, the multiple second contact pads of the second signal access area B132 can include: two first groups of second contact pads 811a and 811b, two second groups of second contact pads 812a and 812b, two third groups of second contact pads 813a and 813b, two fourth groups of second contact pads 814a and 814b, four fifth groups of second contact pads 815a, 815b, 815c and 815d, and four sixth groups of second contact pads 816a, 816b, 816c and 816d. Along the first direction D1, the two third groups of second contact pads 813a and 813b can be located in the middle of the two first groups of second contact pads 811a and 811b, the second group of second contact pads 812a and 812b can be located on both sides of the two first groups of second contact pads 811a and 811b, the fourth group of second contact pads 814a can be located on the side of the second group of second contact pads 812a away from the first group of second contact pads 811a, and the fourth group of second contact pads 814b can be located on the side of the second group of second contact pads 812b away from the first group of second contact pads 811b.

[0100] In some examples, multiple second contact pads in the first group of second contact pads 811a are configured to connect to the second group of first contact pads in the first first signal access area B131, and multiple second contact pads in the first group of second contact pads 811b are configured to connect to the second group of first contact pads in the second first signal access area B131. Multiple second contact pads in the second group of second contact pads 812a can be configured to connect to multiple second drive transmission lines 612a; multiple second contact pads in the second group of second contact pads 812b can be configured to connect to multiple second drive transmission lines 612b. Multiple second contact pads in the third group of second contact pads 813a can be configured to connect to multiple second drive connection lines 622a; multiple second contact pads in the third group of second contact pads 813b can be configured to connect to multiple second drive connection lines 622b. Multiple second contact pads in the fourth group of second contact pads 814a and 814b can be configured to connect to multiple touch transfer lines 523. The plurality of second contact pads in the fifth group of second contact pads 815a and 815b can be configured to be connected to the first power adapter line 413a; the plurality of second contact pads in the fifth group of second contact pads 815c and 815d can be configured to be connected to the first power adapter line 413b. The plurality of second contact pads in the sixth group of second contact pads 816a can be configured to be connected to the second power adapter line 414a; the plurality of second contact pads in the sixth group of second contact pads 816d can be configured to be connected to the second power adapter line 414b; the plurality of second contact pads in the sixth group of second contact pads 816b and 816c can be configured to be connected to the second power adapter line 414c.

[0101] In some examples, the first border area B1 may have a first center line along the first direction D1, the first center line extends along the second direction D2, and the routing lines in the second routing area B13 may be arranged substantially symmetrically about the first center line.

[0102] In some examples, such as Figure 4 and Figure 5 As shown, multiple second drive transmission lines 612a of multiple drive transmission lines 61 in the second wiring area B13 can be connected to the second group of second contact pads 812a, multiple first drive transmission lines 611a can be connected to the third group of second contact pads 813a through multiple first drive connection lines 621a and multiple second drive connection lines 622a, and the second group of second contact pads 812a and the third group of second contact pads 813a can be located on both sides of the first group of first contact pads 811a along the first direction D1. In this example, by arranging the second contact pads connected to the drive transmission lines on both sides of the first group of second contact pads, the number of second contact pads required for the drive transmission lines can be met, for example, the requirements of the folding display panel can be supported.

[0103] In some examples, such as Figure 5 As shown, the plurality of first drive transmission lines 611a and the plurality of second drive transmission lines 612a may be arranged in sequence along the first direction D1. For example, the plurality of first drive transmission lines 611a may be located on one side of the first main body of the plurality of second drive transmission lines 612a close to the first power adapter line 413a. In other examples, the plurality of first drive transmission lines 611a and the plurality of second drive transmission lines 612a may be arranged alternately along the first direction D1, or partially alternately.

[0104] In some examples, such as Figure 5 As shown, a plurality of first drive transmission lines 611a and a plurality of second drive transmission lines 612a may be located on a side of the first power adapter line 413a and the second power adapter line 414a close to the substrate substrate. For example, a plurality of first drive transmission lines 611a and a plurality of second drive transmission lines 612a may be in the same layer structure as the first gate metal layer or the second gate metal layer in the effective area. A plurality of first drive connection lines 621a may be located on a side of the first power adapter line 413a away from the substrate substrate. The orthographic projection of the first power adapter line 413a on the substrate substrate may at least partially overlap with the orthographic projection of the plurality of first drive connection lines 621a on the substrate substrate. For example, the orthographic projection of each first drive connection line 621a on the substrate substrate may partially overlap with the orthographic projection of the first power adapter line 413a on the substrate substrate. For example, a plurality of first drive connection lines 621a may be in the same layer structure as the third source-drain metal layer in the effective area, and a plurality of second drive connection lines 622a may be in the same layer structure as the first source-drain metal layer in the effective area.

[0105] Figure 6 for Figure 4 Schematic diagram of a local plan view of the middle area S1. Figure 7 for Figure 4 Schematic diagram of a local plan view of the middle area S2. Fig. 8A for Figure 6 Schematic diagram of the local cross-section along the PP' direction. Figure 8B for Figure 6 Schematic diagram of the local section along the QQ' direction.

[0106] In some examples, such as Figures 6 to 8BAs shown, the plurality of first drive connection lines 621a may extend at least along the first direction D1, and may be arranged in sequence along the second direction D2 in a direction away from the bending area B12. The orthographic projections of the plurality of first drive connection lines 621a on the substrate substrate may overlap with the orthographic projections of the first power adapter line 413a on the substrate substrate. For example, the orthographic projections of each first drive connection line 621a on the substrate substrate may partially overlap with the orthographic projections of the first power adapter line 413a on the substrate substrate. The plurality of second drive connection lines 622a may be located on one side of the plurality of first drive connection lines 621a close to the substrate substrate.

[0107] In some examples, such as Fig. 8A and Figure 8B As shown, the multiple data transfer lines of the second wiring area B13 may include: multiple first data transfer lines 253a with the same layer structure as the first gate metal layer of the effective area and multiple second data transfer lines 253b with the same layer structure as the second gate metal layer of the effective area. The first power transfer line 413a may include: a sixth power wiring layer 413-1 with the same layer structure as the first source and drain metal layer of the effective area, and a seventh power wiring layer 413-2 with the same layer structure as the second source and drain metal layer of the effective area. The seventh power wiring layer 413-2 can be electrically connected to the sixth power wiring layer 413-1 over a large area through the grooves provided in the first flat layer 105. The multiple first drive connection lines 621a can be in the same layer structure as the third source and drain metal layer of the effective area. The multiple second drive connection lines 622a can, for example, be in the same layer structure as the first source and drain metal layer of the effective area. In this example, the first power adapter line 413a can be used as a shielding layer, and is disposed between the plurality of first drive connection lines 621a and the plurality of data adapter lines 253 , so as to avoid signal crosstalk between the first drive connection lines 621a and the data adapter lines 253 .

[0108] In some examples, Figure 3A and Figure 3B As an example of the film structure shown in FIG. 1 , the touch inorganic insulating layer in the first frame region B1 may include: a touch barrier layer and a touch interlayer insulating layer stacked in a stack; Figure 3C Taking the film layer structure shown as an example, the touch inorganic insulating layer in the first frame area B1 may include: a touch barrier layer. The touch inorganic insulating layer and the bending area B12 may not overlap in their orthographic projection on the base substrate. The touch inorganic insulating layer includes: a first inorganic boundary portion 505 located in the second wiring area B13, and an edge 5051 of the first inorganic boundary portion 505 close to the bending area B12 may be a non-straight edge.

[0109] In some examples, in order to ensure the bending performance of the bending area B12, the bending area B12 is not provided with a touch inorganic insulating layer. The touch inorganic insulating layer has a first inorganic boundary portion 505 close to the bending area B12 in the second wiring area B13, and the edge 5051 of the first inorganic boundary portion 505 faces the bending area B12. Since the first inorganic boundary portion 505 is in direct contact with the display organic insulating layer (for example, the third flat layer 107), and does not directly contact the display inorganic insulating layer to form an inorganic closed space, there is a risk of water vapor invading along the edge position of the first inorganic boundary portion 505. The plurality of first drive connection lines are configured to transmit a plurality of control signals provided to the gate drive circuit, and there is a voltage difference between the adjacent plurality of first drive connection lines, and the first power adapter line is configured to transmit a constant first power signal (for example, a constant high voltage signal), and there is a voltage difference between the plurality of first drive connection lines and the first power adapter line. Under the impetus of the high and low voltage difference, the area is prone to rapid wiring corrosion, resulting in display abnormality. In this example, the relative position relationship between the touch inorganic insulating layer and the plurality of first drive connection lines and the first power adapter line is adjusted to improve the corrosion risk of the first drive connection lines due to water vapor intrusion.

[0110] In some examples, such as Figures 6 to 8B As shown, the edge 5051 of the first inorganic boundary portion 505 of the touch inorganic insulating layer may be located on the side of the plurality of first drive connection lines 621a away from the bending area B12. The orthographic projection of the first inorganic boundary portion 505 on the base substrate may not overlap with the overlapping area of ​​the orthographic projection of the first power adapter line 413a and the plurality of first drive connection lines 621a on the base substrate. In other words, the first inorganic boundary portion 505 does not cover the overlapping area of ​​the orthographic projection of the first power adapter line 413a and the plurality of first drive connection lines 621a on the base substrate.

[0111] In some examples, such as Figure 6 and Figure 7 As shown, the orthographic projection of the first inorganic boundary portion 505 on the substrate substrate may not overlap with the orthographic projection of the plurality of first driving connection lines 621a on the substrate substrate. The orthographic projection of the first inorganic boundary portion 505 on the substrate substrate may partially overlap with the orthographic projection of the first power adapter line 413a on the substrate substrate.

[0112] In some examples, such as Fig. 8A As shown, along the second direction D2, the edge 5051 of the first inorganic boundary portion 505 of the touch inorganic insulating layer and the overlapping area of ​​the orthographic projection of the first power adapter line 413a and the plurality of first driving connection lines 621a on the base substrate may have a first distance L1. Figure 8BAs shown, along the first direction D1, the edge 5051 of the first inorganic boundary portion 505 of the touch inorganic insulating layer may have a second distance L2 between the overlapped area of ​​the orthographic projection of the first power adapter line 413a and the plurality of first drive connection lines 621a on the substrate. The first distance L1 and the second distance L2 may be greater than 20 microns. For example, the first distance L1 and the second distance L2 may be the same. For another example, the first distance L1 may be greater than the second distance L2.

[0113] In some examples, such as Fig. 8A and Figure 8B As shown, the second wiring area B13 may be provided with a fourth flat layer (i.e., the aforementioned auxiliary organic insulating layer) 108, and the fourth flat layer 108 may be located on the side of the third flat layer 107 away from the substrate 10, and on the side of the first inorganic boundary portion 505 of the touch inorganic insulating layer close to the substrate 10. The orthographic projection of the fourth flat layer 108 on the substrate substrate may cover the orthographic projection of the plurality of first drive connection lines 621a on the substrate substrate. The orthographic projection of the fourth flat layer 108 on the substrate substrate may partially overlap with the orthographic projection of the first power adapter line 414a on the substrate substrate. For example, the fourth flat layer 108 may be a co-layer structure with the pixel definition layer of the effective area, or may be an organic insulating layer prepared by adding a step between the third flat layer and the pixel definition layer. Since part of the underlying organic insulating layer (e.g., the third planar layer 107) is etched during the etching process of the touch inorganic insulating layer of the second wiring area B13, this example can ensure coverage of the wiring in the same layer structure as the third source and drain metal layer by setting the fourth planar layer 108.

[0114] In some examples, such as Fig. 8A and Figure 8B As shown, the orthographic projection of the fourth planar layer 108 on the base substrate may partially overlap with the orthographic projection of the first inorganic boundary portion 505 on the base substrate. There is a partial overlap between the edge of the fourth planar layer 108 and the edge 5051 of the first inorganic boundary portion 505 of the touch-sensitive inorganic insulating layer. The edge 5051 of the first inorganic boundary portion 505 may cover the edge of the fourth planar layer 108 adjacent to the first inorganic boundary portion 505.

[0115] In this example, the touch inorganic insulating layer above the overlapping area of ​​the first power adapter line and the plurality of first drive connection lines is removed, thereby improving the situation where water vapor invades through the edge of the first inorganic boundary portion of the touch inorganic insulating layer and causes wiring corrosion.

[0116] Figure 8C for Figure 6 Another partial cross-sectional schematic diagram along the PP' direction in FIG. Figure 8CAs shown, the fourth flat layer 108 may not be provided in the second wiring area B13. The thickness of the third flat layer 107 in the second wiring area B13 may be greater than or equal to the thickness of the third flat layer 107 in the effective area to ensure that the wiring arranged in the same layer as the third source and drain metal layer in the second wiring area B13 is covered. The rest of the description of the display panel of this embodiment can refer to the description of the aforementioned embodiment, so it will not be repeated here.

[0117] In other examples, the multiple display metal layers of the display structure layer of the effective area may include: a first source-drain metal layer and a second source-drain metal layer. The first power adapter line may be the same layer structure as the first power metal layer, and the multiple first drive connection lines may be the same layer structure as the second source-drain metal layer. In other examples, the multiple display metal layers of the display structure of the effective area may include: a first source-drain metal layer, a second source-drain metal layer, a third source-drain metal layer and a fourth source-drain metal layer arranged in sequence; wherein the multiple first drive connection lines may be the same layer structure as the fourth source-drain metal layer, and the first power adapter line may be located on the side of the multiple first drive connection lines close to the substrate. Among them, the positional relationship between the first inorganic boundary portion of the touch inorganic insulating layer and the first power adapter line and the multiple first drive connection lines can be as described above.

[0118] Fig. 9 for Figure 5 A local plan view of the . Fig. 10A for Fig. 9 Schematic diagram of the local section along the RR' direction. Fig. 10B for Fig. 9 Schematic diagram of the local section along the UU' direction.

[0119] In some examples, Figure 3A and Figure 3B Taking the film structure shown in the figure as an example, when the inter-touch insulating layer is an organic insulating layer and the touch switch wires of the second wiring area B13 are arranged on the first touch conductive layer and the second touch conductive layer, the touch switch wires are easily corroded due to the water vapor and residual corrosion factors in the inter-touch insulating layer. Figures 9 to 10B As shown, the multiple touch-sensing adapters 523 can be in the same layer structure as the third source-drain metal layer of the effective area. In other examples, when the display structure layer includes multiple source-drain metal layers, the multiple touch-sensing adapters can be in the same layer structure as the source-drain metal layer closest to the touch structure layer. For example, when the display structure layer includes a first source-drain metal layer and a second source-drain metal layer, the multiple touch-sensing adapters can be in the same layer structure as the second source-drain metal layer.

[0120] In some examples, the second power adapter line 414a can be located on a side of the multiple touch adapter lines 523 close to the substrate. For example, the second power adapter line 414a may include: an eighth power routing layer 414-1 that is in the same layer structure as the first source-drain metal layer of the effective area, and a ninth power routing layer 414-2 that is in the same layer structure as the second source-drain metal layer of the effective area. The ninth power routing layer 414-2 can achieve a large-area electrical connection with the eighth power routing layer 414-1 through a groove opened in the first flat layer 105. The second power adapter line 414a of this example can be used as a shielding layer to avoid multiple touch adapter lines 523 and routing lines in the same layer structure as the second gate metal layer and the first gate metal layer (for example, including Figure 5 Signal crosstalk occurs between the multiple driving transmission lines 61 shown.

[0121] In some examples, the multiple touch adapters 523 can be configured to transmit positive signals, for example, with a voltage range of 1.5V to 3.5V, and the second power adapter 414a is configured to transmit negative signals. There is a voltage difference between the second power adapter 414a and the multiple touch adapters 523. This example improves the corrosion risk of water vapor intrusion on the multiple touch adapters by adjusting the relative position relationship between the touch inorganic insulating layer and the multiple touch adapters and the second power adapter.

[0122] In some examples, in the boundary area between the bending area B12 and the second routing area B13, the multiple touch bending connection lines 522 can be electrically connected to the multiple touch transfer lines 523 through multiple first touch connection electrodes (for example, including multiple first touch connection electrodes 524a and 524b), multiple second touch connection electrodes 525, and multiple third touch connection electrodes 526a and 526b. The multiple first touch connection electrodes 524a can be in the same layer structure as the first gate metal layer of the effective area, the multiple first touch connection electrodes 524b can be in the same layer structure as the second gate metal layer of the effective area, the multiple second touch connection electrodes 525 can be in the same layer structure as the second source and drain metal layer of the effective area, and the multiple third touch connection electrodes 526a and 526b can be in the same layer structure as the first source and drain metal layer of the effective area.

[0123] In some examples, such as Fig. 10AAs shown, a touch bending connection line 522 can be connected to one end of the first touch connection electrode 524a (or the first touch connection electrode 524b) through a third touch connection electrode 526a, and the other end of the first touch connection electrode 524a (or the first touch connection electrode 524b) can be connected to the second touch connection electrode 525 through a third touch connection electrode 526b, and the second touch connection electrode 525 can be connected to a touch adapter line 523. In other examples, the third touch connection electrode can be omitted, and the first touch connection electrode can be directly connected to the second touch connection electrode and the touch bending connection line.

[0124] In some examples, in the first direction D1, a crack detection adapter line (for example, including crack detection adapter lines 601 and 602) may be provided on one side of the plurality of touch adapter lines 523 close to the edge of the display panel. The crack detection adapter lines 601 and 602 may be configured to detect whether there is a crack in the touch structure layer. The crack detection adapter line 601 may, for example, be a co-layer structure with the first gate metal layer, and the crack detection adapter line 602 may, for example, be a co-layer structure with the second gate metal layer.

[0125] In some examples, such as Figures 9 to 10B As shown, the orthographic projection of the first inorganic boundary portion 505 of the touch inorganic insulating layer on the substrate substrate may not overlap with the overlapping area of ​​the orthographic projection of the second power adapter line 414a and the multiple touch adapter lines 523 on the substrate substrate. In other words, the first inorganic boundary portion 505 does not cover the overlapping area of ​​the orthographic projection of the second power adapter line 414a and the multiple touch adapter lines 523 on the substrate substrate. For example, the orthographic projection of the first inorganic boundary portion 505 on the substrate substrate may not overlap with the orthographic projection of the multiple touch adapter lines 523 on the substrate substrate. The orthographic projection of the first inorganic boundary portion 505 on the substrate substrate may partially overlap with the orthographic projection of the second power adapter line 414a on the substrate substrate. In other examples, the orthographic projection of the first inorganic boundary portion 505 on the substrate may not overlap with the overlapping area of ​​the orthographic projections of the second power adapter line 414a and the multiple touch adapter lines 523 on the substrate, and may partially overlap with the orthographic projections of the multiple touch adapter lines 523 on the substrate, and may partially overlap with the orthographic projection of the second power adapter line 414a on the substrate.

[0126] In some examples, such as Fig. 10B As shown, along the first direction D1, the edge 5051 of the first inorganic boundary portion 505 of the touch inorganic insulating layer may have a third distance L3 between the overlapped area of ​​the orthographic projection of the second power adapter line 414a and the plurality of touch adapter lines 523 on the substrate. The third distance L3 may be greater than 20 microns. For example, the third distance L3 may be the same as the aforementioned first distance L1.

[0127] In this example, the inorganic touch insulating layer above the overlapping area of ​​the second power adapter and the multiple touch adapters is removed, so as to improve the situation that water vapor invades through the edge of the first inorganic boundary portion of the inorganic touch insulating layer and causes wiring corrosion. The rest of the description of the display panel of this example can refer to the description of the above embodiment, so it will not be repeated here.

[0128] In other examples, except for the position near the bending area, the positions of multiple border signal lines in the first border area where the first inorganic boundary portion of the touch inorganic insulating layer does not contact the display inorganic insulating layer and there is a voltage difference can all be etched using the method of the aforementioned embodiment to adjust the positional relationship between the first inorganic boundary portion of the touch inorganic insulating layer and the corresponding border signal line to improve the wiring corrosion situation.

[0129] Fig.11 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. Fig.11 As shown, the display device 91 includes a display panel 910. The display panel 910 may be an OLED display panel. The display device 91 may be: an OLED display device, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, or a navigator, or any other product or component with display and touch functions. However, this embodiment is not limited thereto.

[0130] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0131] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A display panel, characterized in that: include: The substrate comprises: an effective area and a first frame area located on one side of the effective area; A display structure layer, located on the base substrate, comprising a plurality of display organic insulating layers and a plurality of display inorganic insulating layers, wherein the plurality of display organic insulating layers are located on a side of the plurality of display inorganic insulating layers away from the base substrate; A packaging structure layer, located on a side of the display structure layer away from the base substrate; A touch control structure layer, located on a side of the encapsulation structure layer away from the base substrate, comprising a touch control inorganic insulating layer; the touch control inorganic insulating layer comprises: a first inorganic boundary portion located in the first frame region, the first inorganic boundary portion directly contacts at least one display organic insulating layer among the plurality of display organic insulating layers, and has no direct contact with the plurality of display inorganic insulating layers; a plurality of frame signal lines, located in the first frame region, the plurality of frame signal lines being located on a side of the plurality of display inorganic insulating layers away from the base substrate and on a side of the touch inorganic insulating layer close to the base substrate, and a voltage difference existing between at least two adjacent frame signal lines among the plurality of frame signal lines; The display panel satisfies at least one of the following: The minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the overlapping area of ​​the orthographic projection of the at least two frame signal lines located in different conductive layers on the base substrate is greater than 0; The minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the orthographic projection of the at least two frame signal lines located on the same conductive layer closest to the touch inorganic insulating layer on the base substrate is greater than 0.

2. The display panel according to claim 1, characterized in that: The minimum distance between the orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate and the overlapping area of ​​the orthographic projection of the at least two frame signal lines on the base substrate is greater than 20 micrometers.

3. The display panel according to claim 1, characterized in that: The plurality of frame signal lines include: at least one first frame signal line and a plurality of second frame signal lines; the plurality of second frame signal lines are located in the same conductive layer, and the first frame signal line and the plurality of second frame signal lines are located in different conductive layers; The first border signal line is configured to transmit a constant power signal, and an orthographic projection of the first border signal line on the base substrate at least partially overlaps with an orthographic projection of at least one second border signal line among the plurality of second border signal lines on the base substrate.

4. The display panel according to claim 3, characterized in that: The display structure layer further includes: a plurality of display metal layers; the plurality of second frame signal lines and the display metal layer closest to the touch structure layer among the plurality of display metal layers are in the same layer structure.

5. The display panel according to claim 4, characterized in that: The multiple display metal layers include: a first source-drain metal layer, a second source-drain metal layer and a third source-drain metal layer located on the side of the multiple display inorganic insulating layers away from the base substrate; the multiple second border signal lines and the third source-drain metal layer are in the same layer structure, and the first border signal line is located on the side of the multiple second border signal lines close to the base substrate.

6. The display panel according to any one of claims 3 to 5, characterized in that: The first border area includes: a first routing area, a bending area, and a second routing area which are sequentially arranged in a direction away from the effective area; The orthographic projection of the touch-sensitive inorganic insulating layer on the base substrate does not overlap with the bending area; The first inorganic boundary portion of the touch inorganic insulating layer is located in the second wiring area and is adjacent to the bending area.

7. The display panel according to claim 6, characterized in that: The display structure layer includes: a plurality of sub-pixels located in the effective area and a plurality of data lines connected to the plurality of sub-pixels; The base substrate further comprises: a second frame region located on the remaining side of the active region, the second frame region being provided with a gate driving circuit, the gate driving circuit being configured to provide a gate control signal to the plurality of sub-pixels; The first frame area further includes: at least one first signal access area located on a side of the second wiring area away from the bending area; the first signal access area is provided with a plurality of first contact pads; The second wiring area is provided with at least one first power adapter line, a plurality of data adapter lines, a plurality of first drive transmission lines, a plurality of first drive connection lines and a plurality of second drive connection lines; the first power adapter line is configured to transmit a constant first power signal; The plurality of data lines are connected to a portion of first contact pads of the first signal access area through the plurality of data transfer lines; the plurality of first drive transmission lines and the plurality of second drive connection lines are located on both sides of the first signal access area along a first direction; the plurality of first drive transmission lines are connected to the plurality of second drive connection lines through the plurality of first drive connection lines, and are configured to transmit control signals provided to the gate drive circuit; the plurality of first drive connection lines are located on a side of the first signal access area close to the bending area; The first frame signal line includes: the first power adapter line, and the plurality of second frame signal lines include: the plurality of first drive connection lines.

8. The display panel according to claim 7, characterized in that: The plurality of first driving connection lines are located on a side of the plurality of first driving transmission lines and the plurality of second driving connection lines away from the substrate; The first power adapter line is located on a side of the plurality of data adapter lines away from the base substrate, and is located on a side of the plurality of first driving connection lines close to the base substrate.

9. The display panel according to claim 7, characterized in that: The first frame area further includes: a second signal access area located at a side of the first signal access area away from the bending area, and a plurality of second contact pads are disposed in the second signal access area; The second wiring area is further provided with a plurality of second drive transmission lines, and the plurality of second drive transmission lines and the plurality of first drive transmission lines are located on the same side of the first signal access area; The plurality of second contact pads include: at least one first group of second contact pads, at least one second group of second contact pads, and at least one third group of second contact pads; The first group of second contact pads are connected to a portion of first contact pads in the first signal access area; The second group of second contact pads is connected to the plurality of second drive transmission lines; The third group of second contact pads is connected to the plurality of second driving connection lines; The second group of second contact pads and the third group of second contact pads are located on both sides of the first group of second contact pads.

10. The display panel according to claim 6, characterized in that: The second wiring area is provided with at least one second power adapter line and a plurality of touch adapter lines, and the second power adapter line is configured to transmit a constant second power signal; The first frame signal line includes: the second power adapter line; the multiple second frame signal lines include: the multiple touch adapter lines.

11. The display panel according to claim 1, characterized in that: The display panel further includes: an auxiliary organic insulating layer located in the first frame region, the auxiliary organic insulating layer being located on a side of the plurality of display organic insulating layers away from the base substrate and on a side of the touch inorganic insulating layer close to the base substrate; The orthographic projection of the auxiliary organic insulating layer on the base substrate covers the orthographic projection of the at least two frame signal lines on the base substrate.

12. The display panel according to claim 11, characterized in that: The orthographic projection of the first inorganic boundary portion of the touch inorganic insulating layer on the base substrate partially overlaps with the orthographic projection of the auxiliary organic insulating layer on the base substrate.

13. The display panel according to claim 1, characterized in that: The touch control structure layer includes: a touch control barrier layer, a first touch control conductive layer, a touch control interlayer insulating layer, a second touch control conductive layer and a touch control protection layer which are sequentially arranged on the packaging structure layer; the touch control inorganic insulating layer includes the touch control barrier layer, or includes the touch control barrier layer and the touch control interlayer insulating layer.

14. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 13.

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