Lens assembly and electronic device including the same

Abstract

There is provided a lens assembly comprising: at least two lenses aligned along a first optical axis; an image sensor configured to receive light guided or converged through the at least two lenses; and at least one optical member disposed between the at least two lenses and the image sensor, receiving light incident through the at least two lenses, refracting or reflecting the light at least twice, and then guiding or emitting the light toward or out of the image sensor, a ratio of a long side of an imaging surface of an image sensor to a long side of an exit surface of a first optical member closest to the image sensor is within a specified range.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly, to a lens assembly and an electronic device including the lens assembly. Background Art

[0002] An electronic device may refer to a device that performs a specific function based on an embedded program, such as a household appliance, an electronic notebook, a portable multimedia player (PMP), a mobile communication terminal, a tablet personal computer (PC), a video / audio device, a desktop / laptop computer, a vehicle navigation system, etc. For example, these electronic devices may output stored information in the form of sound or images. With the increasing integration of electronic devices and the widespread use of ultra-high-speed and large-capacity wireless communications, various functions have recently begun to be provided in a single electronic device such as a mobile communication terminal. For example, various functions (e.g., entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and / or functions such as schedule management or electronic wallets and communication functions) have been integrated into a single electronic device.

[0003] The development of digital camera manufacturing technology has commercialized electronic devices equipped with small and lightweight camera modules. Electronic devices that are usually carried all the time (e.g., mobile communication terminals) are equipped with camera modules, allowing users to conveniently use various functions including not only still or moving image capture but also video conferencing and augmented reality.

[0004] Recently, electronic devices including multiple cameras have been widely used. The electronic device may include, for example, a camera module including a wide-angle camera and a telephoto camera. The electronic device may use the wide-angle camera to capture a wide range of scenes around the electronic device to obtain a wide-angle image, or may use the telephoto camera to capture a scene corresponding to a position relatively far from the electronic device to obtain a telephoto image. Therefore, compact electronic devices (e.g., smartphones) including multiple camera modules or lens assemblies have gradually replaced compact cameras and are expected to replace high-performance cameras (e.g., SLR cameras) in the future.

[0005] The above information may be provided as background to assist in understanding the present disclosure. No statement or determination is made as to whether any of the above description is applicable as prior art related to the present disclosure. Summary of the invention

[0006] Technical Solution According to an embodiment of the present disclosure, a lens assembly may include: at least two lenses, the at least two lenses are aligned along the direction of a first optical axis; an image sensor, the image sensor is configured to receive light guided or converged through the at least two lenses; and at least one optical component is disposed between the at least two lenses and the image sensor to receive light incident through the at least two lenses, refract or reflect the light at least twice, and then guide or emit the light toward the image sensor. In an embodiment, the lens assembly may satisfy the following [Conditional Formula 1] and [Conditional Formula 2].

[0007] [Conditional expression 1] 1.2= <w / img-X=<2.5。

[0008] [Conditional expression 2] 15=<Ang-min=<40.

[0009] Here, "img-X" represents the length of the longer side in the horizontal length / vertical length of the imaging surface (img) of the image sensor; "w" represents the length of the longer side in the horizontal length / vertical length of the exit surface facing the image sensor among the surface of the optical component closest to the image sensor among the at least one optical component (hereinafter, "the first optical component"); and "Ang-min" represents the minimum angle among the angles formed by two adjacent surfaces of the first optical component.

[0010] According to an embodiment of the present disclosure, an electronic device may include: a lens assembly, a memory storing instructions for acquiring an image; and a processor configured to execute the instructions to acquire an image by receiving external light using the lens assembly. In an embodiment, the lens assembly may include: at least two lenses aligned along a first optical axis direction; an image sensor configured to receive light guided or converged through the at least two lenses; and at least one optical component disposed between the at least two lenses and the image sensor to receive light incident through the at least two lenses, and refract or reflect the light at least twice, and then guide or emit the light toward the image sensor. In an embodiment, the lens assembly may satisfy the following [Conditional Formula 5] and [Conditional Formula 6].

[0011] [Conditional expression 5] 1.2= <w / img-X=<2.5。

[0012] [Conditional expression 6] 15=<Ang-min=<40.

[0013] Here, "img-X" represents the length of the longer side in the horizontal length / vertical length of the imaging surface (img) of the image sensor; "w" represents the length of the longer side in the horizontal length / vertical length of the exit surface facing the image sensor among the surface of the optical component closest to the image sensor among the at least one optical component (hereinafter, "the first optical component"); and "Ang-min" represents the minimum angle among the angles formed by two adjacent surfaces of the first optical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description in conjunction with the accompanying drawings.

[0015] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment.

[0016] Figure 2 is a front perspective view showing an electronic device according to an embodiment.

[0017] Figure 3 is a diagram showing a method according to an embodiment of the present invention. Figure 2 A rear perspective view of the electronic device shown in FIG.

[0018] Figure 4 is an exploded perspective view showing an electronic device according to an embodiment.

[0019] Figure 5 is a rear plan view showing a rear surface of the electronic device according to the embodiment.

[0020] Figure 6 is taken along line AA' according to an embodiment Figure 5 A cross-sectional view of a portion of an electronic device is shown.

[0021] Figure 7 is a view illustrating an optical path of a camera module in an electronic device according to an embodiment.

[0022] Figure 8 is a view showing a lens assembly according to an embodiment.

[0023] Fig. 9 is a view showing a first optical member of a lens assembly according to an embodiment.

[0024] Fig.10 is a view showing an imaging surface of an image sensor and an exit surface of a first optical member in a lens assembly according to an embodiment.

[0025] Fig.11 is a view showing a lens assembly according to an embodiment.

[0026] Fig.12 is a view showing an imaging surface of an image sensor and an exit surface of a first optical member in a lens assembly according to an embodiment.

[0027] Fig.13 is a view showing a lens assembly according to an embodiment.

[0028] Fig.14 is a view showing an imaging surface of an image sensor and an exit surface of a first optical member in a lens assembly according to an embodiment.

[0029] Throughout the drawings, similar reference numerals may be assigned to similar components, configurations, and / or structures. DETAILED DESCRIPTION

[0030] As electronic devices become more compact and lighter, it can be more convenient to carry electronic devices. In a scenario where the display is enlarged so that users can enjoy a larger screen even in a portable electronic device, the electronic device can become more compact and lightweight by reducing its thickness. However, in this case, due to the narrow space of the miniaturized electronic device, it may be difficult to install a lens assembly with good optical performance. For example, as the number or size of the lens assembly becomes larger, it is easier to ensure the good optical performance of the lens assembly; however, due to this, the design freedom may be reduced in terms of the arrangement of (one or more) lenses or image sensors in the miniaturized electronic device.

[0031] Embodiments of the present disclosure are to solve the above-mentioned problems and / or disadvantages and provide advantages as described below, and provide a lens assembly with improved design freedom and / or an electronic device including the lens assembly.

[0032] In the embodiments of the present disclosure, it is possible to provide a lens assembly that is easily disposed in a narrow space of an electronic device and / or an electronic device including the same.

[0033] Problems to be solved by the present disclosure are not limited to the above-mentioned problems, and other technical problems not mentioned can be clearly understood by ordinary technicians in the art from the following disclosure.

[0034] The following description with reference to the accompanying drawings may be provided to assist in a comprehensive understanding of the disclosure defined by the claims and their equivalents to variously implement the disclosure. The specific embodiments disclosed in the following description include various specific details to assist in understanding, but may be considered as one of various embodiments. Therefore, it is apparent to those skilled in the art that various changes and modifications of the various embodiments disclosed in the present disclosure may be made without departing from the technical concept and scope of the present disclosure. In addition, for the sake of clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0035] The terms and words used in the following description and claims are not limited to the bibliographic meanings, and can be used to clearly and consistently describe the various embodiments of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the present disclosure is provided for illustrative purposes only, and not for limiting the disclosure as defined by the scope of the claims and their equivalents.

[0036] It should be understood that the singular forms "a", "an", and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, it may be intended that the term "a surface of an element" includes one or more surfaces of the element.

[0037] Figure 1 1 is a block diagram showing an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. According to embodiments, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be integrated into a single component (e.g., the display module 160).

[0038] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121, or to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0039] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0040] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0041] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0042] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0043] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0044] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0045] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0046] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0047] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0048] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0049] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or motion) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0050] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0051] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0052] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0053] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0054] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0055] The antenna module 197 may transmit a signal or power to the outside (e.g., an external electronic device) or receive a signal or power from the outside (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include one antenna including a radiator formed by a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components (e.g., a radio frequency integrated circuit (RFIC)) in addition to the radiator may also be formed as part of the antenna module 197.

[0056] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high frequency band.

[0057] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0058] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0059] The electronic device according to (one or more) embodiments of the present disclosure may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0060] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., the second element)”, “coupled to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0061] As used in the embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or part of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0062] Embodiments of the present disclosure may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0063] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) the computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0064] According to an embodiment, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

[0065] In the following detailed description, the length direction, width direction and / or thickness direction of the electronic device will be mentioned, the length direction may refer to the "Y-axis direction", the width direction may refer to the "X-axis direction", and / or the thickness direction may refer to the "Z-axis direction". In an embodiment, in relation to the direction in which the element is oriented, in addition to the orthogonal coordinate system shown in the accompanying drawings, "negative / positive (- / +)" may also be mentioned together with it. For example, the front surface of the electronic device or housing may be defined as a "surface facing the +Z direction", and the rear surface of the electronic device or housing may be defined as a "surface facing the -Z direction". In an embodiment, the side surface of the electronic device or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and / or an area facing the -Y direction. In an embodiment, the "X-axis direction" may have a meaning including the "-X direction" and the "+X direction". For simplicity of description, the above is based on the orthogonal coordinate system shown in the accompanying drawings, and it should be noted that the direction or description of the element does not limit the various embodiments disclosed in the present disclosure.

[0066] Figure 2 is a front perspective view showing an electronic device 200 according to an embodiment of the present disclosure. Figure 3 The present invention is a diagram showing an embodiment of the present invention. Figure 2 FIG. 2 is a rear perspective view of the electronic device 200 shown in FIG.

[0067] Reference Figure 2 and Figure 3 According to an embodiment, the electronic device 200 may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space defined between the first surface 210A and the second surface 210B. In an embodiment, the housing may refer to a housing formed Figure 2The structure of some of the first surface 210A, the second surface 210B and the side surface 210C. According to an embodiment, at least a portion of the first surface 210A may be formed by a substantially transparent front plate 202 (e.g., a glass plate or a polymer plate including various coatings). The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated glass or colored glass, ceramic, polymer or metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of two or more of these materials. The side surface 210C may be formed by a side structure (or side frame structure) 218, which is coupled to the front plate 202 and the rear plate 211 and includes metal and / or polymer. In an embodiment, the rear plate 211 and the side structure 218 may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0068] In the illustrated embodiment, the front plate 202 may include two first regions 210D on two long edges of the front plate 202, the two first regions 210D extending seamlessly and curvedly from the first surface 210A toward the rear plate 211. Figure 3 ), the rear plate 211 may include two second areas 210E located on its two long edges, and the two second areas 210E are bent and seamlessly extended from the second surface 210B toward the front plate 202. According to an embodiment, the front plate 202 (or the rear plate 211) may include only one of the first areas 210D (or the second areas 210E). In an embodiment, some of the first areas 210D or the second areas 210E may not be included. In the above embodiment, when viewed from the side of the electronic device 200, the side structure 218 may have a first thickness (or width) for a side that does not include the first area 210D or the second area 210E, and may have a second thickness that is less than the first thickness for a side that includes the first area 210D or the second area 210E.

[0069] According to an embodiment, the electronic device 200 may include at least one or more of the display 201, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting element 206, and connector holes 208 and 209. In an embodiment, at least one of the components (e.g., the key input device 217 or the light emitting element 206) may be omitted from the electronic device 200, or the electronic device 200 may additionally include other components.

[0070] The display 201 may be visually exposed, for example, through a majority of the front plate 202. In an embodiment, at least a portion of the display 201 may be visually exposed through the front plate 202 forming the first surface 210A and the first area 210D. In an embodiment, an edge of the display 201 may be formed to be substantially the same as the contour shape of the front plate 202 adjacent to the edge. In an embodiment, the interval between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially constant so as to expand the visual exposure area of ​​the display 201.

[0071] In an embodiment, the screen display area of ​​the display 201 may form a groove or an opening in a portion thereof, and may include at least one or more of the audio module 214, the sensor module 204, the camera module 205, and the light emitting element 206 aligned with the groove or the opening. In an embodiment, at least one or more of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element 206 may be included on the rear surface of the screen display area of ​​the display 201. In an embodiment, the display 201 may be coupled to or arranged to be adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity of a touch (pressure), and / or a digitizer that detects a magnetic field type stylus. In an embodiment, at least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be set in the first area 210D and / or the second area 210E.

[0072] The audio modules 203, 207, and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214. The microphone hole 203 may include a microphone disposed therein to obtain external sound, and in an embodiment, a plurality of microphones may be disposed therein to be able to detect the direction of the sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a phone call receiver hole 214. In an embodiment, the speaker holes 207 and 214 and the microphone hole 203 are implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without the speaker holes 207 and 214.

[0073] The sensor modules 204, 216, and 219 may generate electrical signals or data values ​​corresponding to, for example, an internal operating state or an external environmental state of the electronic device 200. The sensor modules 204, 216, and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., an HRM sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed not only on the first surface 210A (e.g., the display 201) of the housing 210, but also on the second surface 210B. The electronic device 200 may also include Figure 1 At least one of the sensor modules 176, such as a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illumination sensor.

[0074] For example, the camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, and a second camera device 212 and / or a flash 213 disposed on a second surface 210B. The camera modules 205 and 212 may include one or more lenses, image sensors, and / or image signal processors. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, two or more lenses (e.g., an infrared camera lens, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 200.

[0075] The key input device 217 may be provided on the side surface 210C of the housing 210. In an embodiment, the electronic device 200 may not include part or all of the key input device 217, and the key input device 217 not included therein may be implemented in other forms, such as a soft key on the display 201. In an embodiment, the key input device may include a sensor module 216 provided on the second surface 210B of the housing 210.

[0076] The light emitting element 206 may be disposed, for example, on the first surface 210A of the housing 210. The light emitting element 206 may provide, for example, state information of the electronic device 200 in the form of light. In an embodiment, the light emitting element 206 may provide a light source that interacts with, for example, the operation of the camera module 205. The light emitting element 206 may include, for example, an LED, an IR LED, and a xenon lamp.

[0077] For example, the connector holes 208 and 209 may include: a first connector hole 208, which is capable of accommodating a connector for sending power and / or data to / receiving power and / or data from an external electronic device (e.g., a USB connector); and / or a second connector hole 209 (e.g., a headphone jack), which is capable of accommodating a connector for sending audio signals to / receiving audio signals from an external electronic device.

[0078] Figure 4 The present invention is shown in the embodiment of the present invention. Figure 2 1 is an exploded perspective view of the electronic device 200 shown in FIG.

[0079] Reference Figure 4 , the electronic device 300 (eg, Figure 2 or Figure 3 The electronic device 200 may include a side structure 310 (eg, Figure 2 side structure 218), a first support member 311 (eg, a bracket), a front plate 320 (eg, Figure 2 202), a display 330 (e.g., Figure 2 display 201), a printed circuit board 340 (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)), a battery 350, a second support member 360 (e.g., a rear case), an antenna 370, and a rear plate 380 (e.g., Figure 3 In an embodiment, in the electronic device 300, at least one of the components (eg, the first support member 311 or the second support member 360) may be omitted, or other components may be additionally included. At least one of the components of the electronic device 300 may be Figure 2 or Figure 3 At least one of the components of the electronic device 200 in FIG. 1 is the same or similar, and a redundant description thereof will be omitted below.

[0080] The first support member 311 may be disposed inside the electronic device 300 to be connected to the side structure 310, or may be integrated with the side structure 310. The first support member 311 may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer). The display 330 may be coupled to one surface of the first support member 311, and the printed circuit board 340 may be coupled to another surface of the first support member 311. A processor, a memory, and / or an interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor.

[0081] The memory may include, for example, volatile memory or non-volatile memory.

[0082] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect, for example, the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0083] The battery 350 as a device for supplying power to at least one component of the electronic device 300 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be provided on substantially the same plane as, for example, the printed circuit board 340. The battery 350 may be integrally provided inside the electronic device 300, or may be detachably provided on the electronic device 300.

[0084] The antenna 370 may be disposed between the back plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with, for example, an external electronic device, or may wirelessly transmit / receive power required for charging to / from an external electronic device. In an embodiment, the antenna structure may be formed by a portion of the side structure 310 and / or the first support member 311, or a combination thereof.

[0085] In the detailed description below, it is noted that reference may be made to the electronic devices 101, 102, 104, 200 or 300 in the aforementioned embodiments, and the components are given the same figure marks, which can be easily understood or omitted from the aforementioned embodiments, and a detailed description thereof may also be omitted.

[0086] Figure 5 FIG. 4 is a diagram showing an electronic device 400 (eg, Figures 1 to 4 A rear plan view of the electronic device 101, 102, 104, 200 or 300). Figure 6 According to an embodiment of the present disclosure, the image is taken along the line A-A'. Figure 5 4 is a cross-sectional view of a portion of an electronic device 400. Figure 7 is a view showing an optical path of a lens assembly 500 in an electronic device 400 according to an embodiment of the present disclosure.

[0087] Reference Figure 5 and Figure 6 According to an embodiment of the present disclosure, the electronic device 400 may include a device provided on a surface of the electronic device 400 (eg, Figure 3The camera window 385 may be provided on the second surface 210B of the back panel 380. In an embodiment, the camera window 385 may be a part of the back panel 380. In an embodiment, the camera window 385 may be coupled to the back panel 380 by a decorative member 389, and when viewed from the outside, the decorative member 389 may be exposed in the form of an outer periphery surrounding the camera window 385. According to an embodiment, the camera window 385 may include a plurality of transparent areas 387, and the electronic device 400 may receive external light or emit light to the outside through at least one of the transparent areas 387. For example, the electronic device 400 may include: at least one camera module (e.g., Figures 1 to 3 camera modules 180, 205, 212 and 213), the at least one camera module being arranged to correspond to at least some of the transparent areas 387; and at least one light source (e.g., an infrared light source), the at least one light source being arranged to correspond to other parts of the transparent areas 387. In an embodiment, the lens assembly 500 or the light source may receive external light through one of the transparent areas 387 or emit light to the outside of the electronic device 400. In an embodiment, the electronic device 400 and / or the lens assembly 500 may further include a camera supporting member 381. The camera supporting member 381 may enable the lens assembly 500 and / or at least one of other lens assemblies adjacent thereto (e.g., a wide-angle camera, an ultra-wide-angle camera, and / or a close-up camera) to be arranged or fixed inside the rear panel 380 or the camera window 385. In an embodiment, the camera supporting member 381 may be substantially Figure 4 A portion of the first supporting member 311 and / or the second supporting member 360 .

[0088] According to an embodiment, the electronic device 400 may include at least one of a wide-angle camera, an ultra-wide-angle camera, a close-up camera, a telephoto camera, or an infrared light diode as the lens assembly 500 or the light receiving element, and may include a flash (e.g., Figure 3 The electronic device 400 may be configured to use an infrared laser diode and an infrared photodiode to emit an infrared laser toward a subject and receive the infrared laser reflected by the subject, thereby detecting the distance or depth of the subject. In an embodiment, the electronic device 400 may be configured to capture an image of a subject through one or a combination of two or more cameras, and use a flash to provide illumination toward the subject as needed.

[0089] According to an embodiment, a wide-angle camera, an ultra-wide-angle camera, or a close-up camera among cameras may have a smaller length in the optical axis direction of (one or more) lenses than a telephoto camera (e.g., lens assembly 500). For example, the total length of (one or more) lenses 423a, 423b, or 423c of a telephoto camera (e.g., lens assembly 500) having a relatively large focal length may be greater than that of other cameras. The "total length" may be the distance from the object-side surface of the first lens on the object side to the imaging surface of the image sensor 411. As described in the embodiments below (e.g., Figure 8 In the lens assembly 600 in FIG. 1 ), when (one or more) other optical components (e.g., a reflector or a prism) are provided between (one or more) lenses and the image sensor, the “total length” may be the distance from the object-side surface of the first lens on the object side to the sensor-side surface of the first lens on the image sensor side. In an embodiment, although (one or more) lenses of the wide-angle camera, the ultra-wide-angle camera, or the close-up camera are arranged along the thickness of the electronic device 400 (e.g., in FIG. 1 ), the total length may be the distance from the object-side surface of the first lens on the object side to the sensor-side surface of the first lens on the image sensor side. Figure 4 or Figure 6 Although the lens assembly 500 is arranged in a direction (thickness measured in the Z-axis direction of the electronic device 400), the influence on the thickness of the electronic device 400 may be substantially small. For example, a wide-angle camera, an ultra-wide-angle camera, or a close-up camera may be provided in the electronic device 400 so that the direction in which light is incident from the outside to the electronic device 400 is substantially the same as the direction of the optical axis of (one or more) lenses. In an embodiment, compared with a wide-angle camera, an ultra-wide-angle camera, or a close-up camera, the lens assembly 500 (e.g., a telephoto camera) has a small viewing angle, but may be used to capture a subject at a greater distance, and may include more lenses 421a, 423a, 423b, and 423c. For example, when (one or more) lenses 423a, 423b, or 423c of the lens assembly 500 are arranged in the thickness direction (e.g., the Z-axis direction) of the electronic device 400, the thickness of the electronic device 400 may increase, or a large portion of the lens assembly 500 may protrude to the outside of the electronic device 400. In an embodiment of the present disclosure, the lens assembly 500 may include at least one refractive member 413 or 415 for reflecting or refracting the incident light IL in different directions. When implementing a telescopic function, (one or more) lenses 423a, 423b or 423c may be arranged to be movable forward or backward along the incident direction of light or along the propagation direction of reflected light or refracted light, thereby suppressing or reducing the increase in the thickness of the electronic device 400.

[0090] Reference Figure 6 and Figure 7, a folded camera (e.g., a lens assembly 500) may include a first refractive member 413, a second refractive member 415, an image sensor 411, and / or at least a lens system (e.g., a second lens 423a, 423b, or 423c) or a second lens group 423 including a dummy member 423d. A "folded camera" may be used to extend the adjustment range of a focal length. For example, a folded camera may have a reflective member such as a prism or a reflector, which is arranged so that the direction or arrangement of the lens can be freely designed regardless of the direction of incident external light. Such an improvement in the degree of freedom of design of the arrangement direction of the lens in the folded camera may realize a compact telephoto camera that may be combined with a wide-angle camera and installed in an electronic device. In an embodiment, at least one optical member may be configured to guide or focus the light RL1 reflected or refracted by the first refractive member 413 to the second refractive member 415, and prevent the light RL1 reflected or refracted by the first refractive member 413 from being directly incident on the image sensor.

[0091] According to an embodiment, the first refractive member 413 may include, for example, a prism, a reflector, or a reflective member including a reflector for reflecting light. For example, the first refractive member 413 may be formed of a prism including at least one reflector. In an embodiment, the first refractive member 413 may reflect or refract the light IL incident along the first direction D1 in a second direction D2 intersecting the first direction D1. The first direction D1 may refer to, for example, when the light IL passes from the outside to the camera when photographing a subject. Figure 5 The first direction D1 refers to a direction in which a transparent area 387 of the electronic device 400 or the lens assembly 500 is incident. In an embodiment, the first direction D1 may refer to a shooting direction, a subject direction, a facing direction, or a direction parallel to the lens assembly 500. In an embodiment, the first direction D1 may be parallel to a thickness direction or a Z-axis direction of the electronic device 400.

[0092] According to an embodiment, the second refractive member 415 may include, for example, a prism, a reflector, or a reflective member including a reflector for reflecting light. For example, the second refractive member 415 may be formed by a prism including at least one reflector. For example, at least one surface of the second refractive member 415 may be formed by a prism including a reflector. In an embodiment, the second refractive member 415 may reflect or refract the light RL1 reflected or refracted by the first refractive member 413 and incident along the second direction D2 in a third direction D3 intersecting the second direction D2. The third direction D3 may be substantially perpendicular to the second direction D2. For example, the third direction D3 may refer to a direction parallel to the Z-axis direction. However, the embodiments of the present disclosure are not limited thereto, and depending on the arrangement and specifications of the lens assembly 500 or the second refractive member 415 in the electronic device 400, the third direction D3 may be the second direction D2 or a direction inclined relative to the XY plane. In an embodiment, the third direction D3 may be substantially parallel to the first direction D1.

[0093] According to an embodiment, the image sensor 411 may be configured to detect light RL2 that is reflected or refracted by the second refractive member 415 and then incident along the third direction D3. For example, light IL incident from the outside may be detected by the image sensor 411 via the first refractive member 413 and the second refractive member 415, and the electronic device 400 or the lens assembly 500 may obtain a subject image based on a signal or information detected by the image sensor 411. In an embodiment, the image sensor 411 may be disposed substantially parallel to the XY plane. For example, when the lens assembly 500 has an image stabilization function that shifts the image sensor 411, the image sensor 411 may be horizontally moved from a plane perpendicular to the first direction D1 or the third direction D3.

[0094] According to an embodiment, when an image stabilization operation is performed, the image sensor 411 may be shifted in the length direction (e.g., Y-axis direction) or the width direction (e.g., X-axis direction) of the electronic device 400. For example, the image sensor 411 may be disposed on a plane perpendicular to the first direction D1 or the third direction D3, so that in an electronic device having a small thickness (e.g., a thickness of approximately 10 mm or less), the size of the image sensor 411 may be easily expanded, and / or a space for an image stabilization operation may be easily ensured. In an embodiment, when the lens assembly 500 is used as a telephoto camera, the quality of the captured image can be further improved due to the image stabilization function installed thereon. In an embodiment, when the image sensor 411 is magnified, the performance of the lens assembly 500 may be further improved.

[0095] According to an embodiment, the lens assembly 500 may further include a first lens group 421 including a lens system (e.g., at least one first lens 421a or 421b) for directing or focusing the light IL incident along the first direction D1 toward the first refractive member 413. In an embodiment, the first lens group 421 or the first lens (e.g., the first lens 421a) disposed on the object side of the lens assembly 500 may have a positive refractive power. For example, the first lens 421a may be configured to focus or align the light IL incident from the outside toward the first refractive member 413, thereby miniaturizing the optical system from the first lens 421a to the image sensor 411. According to an embodiment, the first lens group 421 may further include (one or more) additional first lenses 421b that focus or align the light incident from the outside.

[0096] According to an embodiment, the second lens group 423 may include a dummy member 423d and a light shielding member 425. For example, the dummy member 423d may be disposed inside, for example, the lens assembly 500 or the electronic device 400, and may have a cylindrical shape extending along the second direction D2, and may transmit the light RL1 traveling along the second direction D2. In an embodiment, the dummy member 423d may be one of lenses having positive or negative refractive power. In an embodiment, the dummy member 423d may be a component integrally formed with one of the second lenses 423a, 423b, and 423c or the second refractive member 415.

[0097] According to an embodiment, the light shielding member 425 may be formed or disposed on at least a portion of the outer peripheral surface of the dummy member 423d to absorb, scatter or reflect light. For example, the light shielding member 425 may be formed by etching or black paint processing and / or printing or depositing a reflective layer on at least a portion of the outer peripheral surface of the dummy member 423d. In an embodiment, the light reflected or refracted by the first refractive member 413 may be partially absorbed, scattered or reflected by the light shielding member 425. In an embodiment, the light shielding member 425 may substantially block the light reflected or refracted by the first refractive member 413 so that it does not pass through the second lens group 423 and / or the second refractive member 415 and is directly incident on the image sensor 411. For example, light sequentially passing through the first direction D1, the second direction D2 and / or the third direction D3 in the lens assembly 500 (for example, following the direction indicated by Figure 7 Light traveling along a path indicated by “IL”, “RL1”, or “RL2” in the figure) may be incident on the image sensor 411, and light traveling along other paths may be substantially blocked from being incident on the image sensor 411.

[0098] According to an embodiment, at least one of the second lenses 423a, 423b, and 423c may be moved forward and backward between the first refractive member 413 and the second refractive member 415 along an axis substantially the same as the second direction D2. Figure 1 The processor 120 or the lens assembly 500 may perform focal length adjustment or focusing by moving at least one second lens 423a, 423b, or 423c forward and backward based on an axis substantially the same as the second direction D2. A miniaturized electronic device such as a smart phone may have a thickness of about 10 mm, and in this case, there may be a limit to the range in which the lens can move forward and backward in the thickness direction thereof.

[0099] According to an embodiment, the second direction D2 may be substantially parallel to the length direction (eg, Figure 4 Y-axis direction), width direction (for example, Figure 4 The range in which the at least one second lens 423a, 423b, or 423c can move forward and backward can be large compared to a general wide-angle camera that moves forward and backward in the Z-axis direction for focusing. For example, since the telephoto performance in the lens assembly 500 is improved by moving the at least one second lens 423a, 423b, or 423c forward and backward along an axis substantially the same as the second direction D2, the degree of freedom in design can be improved in terms of ensuring a space that can move forward and backward for focusing or focal length adjustment.

[0100] According to an embodiment, the electronic device 400 and / or the lens assembly 500 may further include an infrared blocking filter 419. In an embodiment, the infrared blocking filter 419 may block infrared or near-infrared band light from being incident on the image sensor 411, and may be disposed at a specific portion of the optical path between the first lens 421a and the image sensor 411. In an embodiment, the infrared blocking filter 419 is disposed at a position close to the image sensor 411, for example, between the image sensor 411 and the second refractive member 415, thereby suppressing or preventing the infrared blocking filter 419 from being visually exposed to the outside. In an embodiment, the first refractive member 413, the second refractive member 415, and / or at least one optical member (for example, the second lens group 423) may include an infrared blocking coating, and in this case, the infrared blocking filter 419 may be omitted. In an embodiment, the infrared blocking coating may be disposed on at least one of the image sensor side surface and the object side surface of the dummy member 423d or the second refractive member 415. Thus, image sensor 411 may detect light that has substantially passed through infrared blocking filter 419 (or infrared blocking coating).

[0101] The refractive members 413 and 415 of the present disclosure may be selectively designed according to the structure of the lens assembly 500. For example, in an embodiment, the refractive members (eg, Figure 6 The second refractive member 415 may have a triangular prism shape. In an embodiment, the refractive member (eg, Figure 7 The second refractive member 415 of the embodiment may have a trapezoidal prism shape. The shapes of the refractive members 413 and 415 are not limited to the structures shown in the present disclosure. For example, if the refractive members 413 and 415 reflect, refract, or transmit light, the refractive members 413 and 415 may have other structures besides a triangular prism or a trapezoidal prism. In an embodiment, the refractive members 413 and 415 may be arranged in various types. For example, the refractive members (e.g., Figure 6 The second refractive member 415) may be configured with a prism. For example, the refractive member (eg, Figure 7 The second refractive member 415) may be configured with a reflector. For example, the refractive members 413 and 415 may include a substantially transparent material. For example, the refractive members 413 and 415 may be made of glass.

[0102] Figure 8 is a view showing a lens assembly 600 according to an embodiment of the present disclosure. Fig. 9 The present invention is a diagram showing an embodiment of the present invention. Figure 8 FIG. 6 is a view of a first optical component R1 of a lens assembly 600 . Fig.10 The present invention is a diagram showing an embodiment of the present invention. Figure 8 A view of an imaging surface img of the image sensor S in the lens assembly 600 and an exit surface F2 of the first optical member R1.

[0103] Reference Figures 8 to 10 , lens assembly 600 (eg, Figures 1 to 3 Camera modules 180, 205, 212 and 213 and / or Figure 6 The lens assembly 500 may include at least two lenses L1, L2, L3, L4 and L5, an image sensor S, and at least one optical member R1 (hereinafter referred to as "first optical member R1") disposed between the image sensor S and the at least two lenses (hereinafter referred to as "lenses (L1, L2, L3, L4 and L5)"). According to an embodiment, the lens assembly 600 may further include a second optical member R2 (for example, Figure 6 or Figure 7 The second optical member R2 and the first optical member R1 (eg, Figure 6 or Figure 7The lens assembly 600 is aligned with the second refractive member 415 of the second optical member R2, and the lenses L1, L2, L3, L4 and L5 are sandwiched between the second optical member R2 and the first optical member R1. The first optical member R1 can receive the light converged or guided by the lenses L1, L2, L3, L4 and L5, and reflect, refract or guide the light in the direction of the image sensor S. The second optical member R2 can receive external light, and then reflect or refract the light to guide the light in the direction of the alignment lenses L1, L2, L3, L4 and L5 (for example, the first optical axis O1 direction). For example, when the second optical member R2 is not included, the lens assembly 600 can receive external light incident in the ID1 direction, and when the second optical member R2 is included, the lens assembly 600 can receive external light from the ID2 direction different from the ID1 direction.

[0104] According to an embodiment, the lens assembly 600 may further include an infrared blocking layer IFL (or an infrared blocking coating). For example, the infrared blocking layer IFL may be disposed on one of the incident surface F1 and the exit surface F2 of the first optical member R1. In an embodiment, the infrared blocking layer IFL may be disposed on any surface of the first optical member R1, or on any surface of the lenses L1, L2, L3, L4, and L5. According to an embodiment, the lens assembly 600 may further include an infrared blocking filter independent of the first optical member R1 and / or the lenses L1, L2, L3, L4, and L5. In this case, the infrared blocking layer IFL may not be included.

[0105] According to an embodiment, at least two (eg, five) lenses L1, L2, L3, L4, and L5 may be sequentially arranged along the first optical axis O1. In an embodiment, the first optical axis O1 may be arranged substantially parallel to the electronic device (eg, Figures 1 to 6 The front surface of the electronic device 101, 200, 300, or 400 (eg, Figure 2 The first surface 210A) or the rear surface (eg, Figure 3 For example, even if the thickness of the electronic device 400 is reduced, the design freedom of the number and arrangement of the lenses L1, L2, L3, L4, and L5 can be high. According to an embodiment, the electronic device 400 (for example, Figure 1 The processor 120 of the electronic device 400 and / or the lens assembly 600 may move at least one of the lenses L1, L2, L3, L4, and L5 along the first optical axis O1. For example, a focus adjustment or focusing operation may be performed by moving at least one of the lenses L1, L2, L3, L4, and L5 along the first optical axis O1. In an embodiment, as the electronic device 400 (e.g., Figure 1The processor 120 of the embodiment and / or the lens assembly 600 moves at least one of the lenses L1, L2, L3, L4 and L5 in a direction substantially perpendicular to the first optical axis O1, thereby performing an image stabilization operation. “Moving in a direction substantially perpendicular to the first optical axis O1” may be understood to mean, for example, that (one or more) lenses L1, L2, L3, L4 or L5 move along at least two directions on a plane substantially perpendicular to the first optical axis O1. “At least two directions” may refer to, for example, directions perpendicular to each other.

[0106] According to an embodiment, the image sensor S may be configured to enable the lens assembly 600 and / or the electronic device 400 including the lens assembly 600 to acquire an image of the subject by receiving light guided and / or converged by the lenses L1, L2, L3, L4 and L5 and / or the first optical member R1. In an embodiment, the imaging surface img of the image sensor S may be disposed in a direction intersecting the first optical axis O1. For example, the imaging surface img of the image sensor S may be disposed to form an acute angle and / or an obtuse angle with the first optical axis O1. In an embodiment, when it is mentioned that “the imaging surface img may be disposed in a direction intersecting the first optical axis O1”, it may be understood that the imaging surface img is disposed relative to Figures 2 to 6 In an embodiment, since the image sensor S can be arranged in various directions relative to the alignment direction of the lenses L1, L2, L3, L4 and L5, the design freedom can be improved when manufacturing the lens assembly 600 and / or the electronic device 400 including the lens assembly 600.

[0107] According to an embodiment, the optical members R1 and R2 may reflect and / or refract light incident thereon to change the traveling direction of the light. For example, since at least one optical member (e.g., the first optical member R1) may be configured to be disposed between the lenses L1, L2, L3, L4, and L5 and the image sensor S, the degree of freedom in design may be increased in the arrangement of the lenses L1, L2, L3, L4, and L5 and the image sensor S. In an embodiment, when a plurality of optical members are disposed between the lenses L1, L2, L3, L4, and L5 and the image sensor S, the first optical member R1 may refer to an optical member disposed closest to the image sensor S.

[0108] According to an embodiment, the first optical member R1 may be disposed between lenses L1, L2, L3, L4, and L5 and the image sensor S, and may receive light incident along the first optical axis O1 direction through lenses L1, L2, L3, L4, and L5. In an embodiment, the first optical member R1 may reflect and / or refract light incident along the first optical axis O1 direction through lenses L1, L2, L3, L4, and L5 at least twice, thereby emitting light along the direction of a second optical axis O2 intersecting the first optical axis O1. The second optical axis O2 may be substantially understood as the optical axis of the image sensor S or the imaging surface img. In the illustrated embodiment, for ease of description, the second optical axis O2 is illustrated, and the (one or more) embodiments of the present disclosure are not limited thereto. It should be noted that the second optical axis O2 may be differently defined according to the embodiment and / or structure of the lens assembly 600 actually manufactured.

[0109] According to an embodiment, the first optical member R1 may include a prism. In an embodiment, the first optical member R1 may include a first surface (e.g., an incident surface F1) that is aligned to face at least two lenses (e.g., lenses L1, L2, L3, L4, or L5) on the first optical axis O1. The incident surface F1 may be, for example, perpendicular to the first optical axis O1. However, it should be noted that (one or more) embodiments of the present disclosure are not limited thereto. For example, according to the specifications of the first optical member R1, an additional optical member may be provided or the incident surface F1 may be provided tilted relative to the first optical axis O1.

[0110] According to an embodiment, the first optical member R1 may include a second surface (e.g., an exit surface F2) facing the image sensor S. For example, the exit surface F2 may be obliquely connected to the incident surface F1 to form a first angle Ang-p1 relative to the incident surface F1. In an embodiment, the exit surface F2 may provide a total reflection environment for the incident light (e.g., light incident on the incident surface F1 along the first optical axis O1 direction). For example, the exit surface F2 is arranged to be inclined at a predetermined angle relative to the first optical axis O1, thereby reflecting (or refracting) the incident light. When providing a total reflection environment, the inclination angle of the exit surface F2 relative to the first optical axis O1 will be described with reference to the formula to be described below. Therefore, the exit surface F2 may at least partially act as a reflector inside the first optical member R1.

[0111] According to an embodiment, the first optical member R1 may include a reflective surface F3 connecting the exit surface F2 and the entrance surface F1. For example, the reflective surface F3 may be connected to the exit surface F2 in a state of forming a second angle Ang-p2, and may be connected to the entrance surface F1 in a state of forming a third angle Ang-p3. In an embodiment, when the reflective surface F3 is disposed substantially parallel to the first optical axis O1, the inclination angle of the exit surface F2 relative to the first optical axis O1 may be defined as a second angle Ang-p2.

[0112] According to an embodiment, the light reflected by the exit surface F2 inside the first optical member R1 is reflected (or refracted) again by the reflection surface F3, and then can be emitted to the outside through the exit surface F2. For example, when the incident angle relative to the exit surface F2 is less than a predetermined angle, the exit surface F2 inside the first optical member R1 can provide a total reflection environment, and when the incident angle is greater than a predetermined angle, the exit surface F2 can transmit light. In this way, the light incident on the first optical member R1 can be reflected (or refracted) at least twice inside the first optical member R1 and guided to the image sensor S through the exit surface F2. In an embodiment, when the lens assembly 600 has a structure including an infrared blocking layer IFL, the infrared blocking layer IFL can be disposed on at least a portion of the surface of the first optical member R1 (e.g., the incident surface F1 and / or the exit surface F2). The position and size of the infrared blocking layer IFL can be selected differently in consideration of the path of the light passing through the first optical member R2. In an embodiment, the infrared blocking layer IFL can be disposed on at least one of the entrance surface F1 and the exit surface F2.

[0113] According to an embodiment, the electronic device 400 (eg, Figure 1 The processor 120 in the embodiment of the present invention and / or the lens assembly 600 can perform an image stabilization function or a subject tracking function by rotating or tilting at least one of the optical members R1 and R2 (e.g., the first optical member R1) relative to the first optical axis O1. For example, a "tilt operation" can be understood as an operation of rotating the first optical member R1 based on an arbitrary axis intersecting the first optical axis O1. The central axis of the tilt operation can be configured differently according to the structure of the lens assembly 600 and / or the electronic device 400 actually manufactured.

[0114] According to an embodiment, the second optical member R2 (eg, Figure 6 The first refractive member 413 of the embodiment may be disposed in front of the lenses L1, L2, L3, L4, and L5. For example, the direction in which light is incident on the electronic device 400 and / or the lens assembly 600 may be different from the direction of the first optical axis O1. As described above, when the above and / or the following are satisfied, Figure 8 The components of the lens assembly 600 described herein may be selectively combined with other components of the embodiments disclosed herein (e.g., Figure 6 The first lens group 421, the first refractive member 413, the dummy member 423d and / or the light shielding member 425) may be used to implement additional embodiments.

[0115] According to an embodiment, the lens assembly described above and / or below (e.g., Figure 8 , Fig.11 and / or Fig.13The lens assemblies 600, 700 and 800 in FIG. 1 may satisfy the condition of the following formula 1.

[0116] [Formula 1] Here, "img-X" represents the length of the longer side in the horizontal length / vertical length of the imaging surface img of the image sensor S; and "w" represents the length of the longer side in the horizontal length / vertical length of the exit surface F2 facing the image sensor among the surface of the optical member closest to the image sensor among the at least one optical member (hereinafter, "first optical member") . In the embodiment, the length indicated by "w" Fig. 9 The long side of the exit surface F2 in can be understood as Fig. 9 The long side of the region through which the light incident on the image sensor S passes in the exit surface F2. Fig.10 The region indicated by “F2E” in FIG. 1 may be a region through which light incident on the image sensor S passes. In an embodiment, the area or size of the region indicated as “F2E” may be smaller than the surface of the first optical member R1 (eg, Fig. 9 The exit surface F2).

[0117] According to an embodiment, the long side “img-X” of the imaging surface img may be set to be substantially parallel to the length direction of the electronic device (eg, Figure 4 Y-axis direction) or width direction (for example, Figure 4 or Figure 6 In an embodiment, the long side "w" of the exit surface F2 may be set to correspond to the long side "img-X" of the imaging surface img. For example, "w" as the long side of the exit surface F2 may be set to be substantially parallel to the length direction of the electronic device (e.g., Figure 4 Y-axis direction) or width direction (for example, Figure 4 or Figure 6 In an embodiment, the shorter side of the horizontal length / vertical length of the imaging surface img or the shorter side of the horizontal length / vertical length of the exit surface F2 may be set to be substantially parallel to the thickness direction of the electronic device (eg, Figure 4 or Figure 6Z-axis direction). For example, since the lens assembly is disposed inside a miniaturized electronic device, an increase in the thickness of the electronic device that may be caused by the size of the image sensor S or the first optical member R1 can be suppressed. According to an embodiment, the long sides of the imaging surface img and the exit surface F2 can be set to be substantially parallel to the XY plane of the electronic device, and the short sides of the imaging surface img and the exit surface F2 can be set to be inclined relative to the XY plane of the electronic device. For example, even if the short sides of the imaging surface img and the exit surface F2 are longer than the thickness of the electronic device, the image sensor S or the first optical member R1 can be easily arranged inside the electronic device. This can be achieved by improving the degree of freedom in designing the path through which the light is refracted and / or reflected using the first optical member R1.

[0118] According to an embodiment, the length or width of the electronic device may be quite large compared to the long sides of the imaging surface img and the exit surface F2. For example, since the long sides of the imaging surface img and the exit surface F2 can be manufactured to be approximately several millimeters, and the length or width of the electronic device can be approximately 50 mm or more, the size of the image sensor S or the first optical member R1 can be easily expanded. In an embodiment, when the long sides of the imaging surface img and the exit surface F2 are set to be parallel to the XY plane of the electronic device and the short sides of the imaging surface img and the exit surface F2 are set to be inclined relative to the XY plane of the electronic device, the restrictions that may be caused by the thickness of the electronic device can be alleviated, so that the length of the short sides of the imaging surface img and the exit surface F2 can be easily expanded.

[0119] According to an embodiment, when the value according to [Formula 1] becomes less than about 1.2, stray light in the acquired image may increase. Here, "stray light" can be understood as light incident along paths other than the specified path. For example, as the stray light increases, the quality of the acquired image may deteriorate. Such stray light may be generated by unexpected reflection or refraction inside the lens assembly 600. In an embodiment, when the value according to [Formula 1] is greater than about 2.5, the total lens length becomes small, making it difficult to implement a lens assembly 600 with good optical performance. For example, when the conditions according to [Formula 1] are met, the lens assembly 600 can have a total lens length of an appropriate size and good optical performance while suppressing stray light.

[0120] According to an embodiment, the lens assembly 600 may further include an anti-reflection coating disposed on at least one of the incident surface F1 or the exit surface F2 of the first optical member R1. For example, reflection or refraction occurring when light passes through the incident surface F1 or the exit surface F2 may be suppressed. In an embodiment, reflection or refraction on the incident surface F1 (or the exit surface F2) may cause stray light. For example, stray light may be suppressed by disposing an anti-reflection coating on at least one of the incident surface F1 or the exit surface F2. In an embodiment, when the infrared blocking layer (IFL) is disposed on one of the incident surface (F1) or the exit surface (F2), the anti-reflection coating may be disposed on the other of the incident surface (F1) or the exit surface (F2).

[0121] According to an embodiment, the lens assembly described above and / or below (e.g., Figure 8 , Fig.11 and / or Fig.13 The lens assemblies 600, 700 and 800) can satisfy the following condition of [Formula 2].

[0122] [Formula 2] Here, “Ang-min” means the smallest angle among angles formed by two adjacent surfaces of the first optical member R1, and may be Fig. 9 According to an embodiment, when the value of Formula 2 is less than an angle of about 15 degrees, the size of the first optical member R1 increases, which may make it difficult to implement the electronic device (eg, Figures 1 to 6 Electronic devices 101, 102, 104, 200, 300, and 400) or lens assembly 600. In an embodiment, when the value of [Formula 2] is greater than an angle of about 50 degrees, it may be difficult to create a total reflection environment for reflecting or refracting incident light at least twice inside the first optical member R1.

[0123] According to an embodiment, the incident surface F1 and the reflection surface F3 may be arranged to form a substantially right angle, and in this case, the reflection surface F3 may be substantially parallel to the first optical axis O1. In an embodiment, when the incident surface F1 and the reflection surface F3 are arranged to form a substantially right angle, the exit surface F2 may be arranged to satisfy the condition given by [Formula 2] relative to the reflection surface F3. In an embodiment, when the incident surface F1 and the reflection surface F3 are arranged to form a substantially right angle, the second angle Ang-p2 between the exit surface F2 and the reflection surface F3 may be about 25 degrees to about 35 degrees. In an embodiment, the first angle Ang-p1 between the incident surface F1 and the exit surface F2 may satisfy the condition given by [Formula 2].

[0124] According to an embodiment, the lens assembly described above and / or below (e.g., Figure 8 , Fig.11 and / or Fig.13 The lens assembly 600 , 700 , and 800 ) may satisfy the following condition of [Formula 3] for Vd-1 which is the Abbe number of the first optical member R1 .

[0125] [Formula 3] According to an embodiment, the first optical component R1 is disposed between the lenses L1, L2, L3, L4 and L5 and the image sensor S (e.g., the imaging surface img), which may affect the curvature or chromatic aberration. In an embodiment, when the Abbe number Vd-1 of the first optical component R1 is greater than about 95, it may be beneficial to correct the aberration in the lens assembly, but its strength is reduced, which may cause the optical component (e.g., the first optical component R1) to be easily deformed or damaged during the assembly process or during the manufacturing, transportation and / or storage process before assembly. In an embodiment, when the Abbe number Vd-1 of the first optical component R1 is less than about 25, the risk of damage to the electronic device is reduced, but it may be difficult to control the aberration. For example, when the condition of [Formula 3] for the Abbe number Vd-1 is met, the first optical component R1 can conveniently control the aberration of the lens assembly 600 without being easily damaged by the external environment.

[0126] According to an embodiment, the lens assembly described above and / or below (e.g., Figure 8 , Fig.11 and / or Fig.13 The lens assemblies 600, 700 and 800) may satisfy the following condition of [Equation 4] for the field of view (FOV).

[0127] [Formula 4] According to an embodiment, when the FOV is greater than about 35 degrees, the focal length of the lens assembly 600 is shortened, so that it may be difficult to arrange the first optical member R1 between the lenses L1, L2, L3, L4, and L5 and the image sensor S (e.g., the imaging surface img). In an embodiment, when the FOV is less than about 5 degrees, as the focal length of the lens assembly 600 increases, the lens assembly 600 is also enlarged. For example, when the FOV is less than about 5 degrees, it may be difficult to mount the lens assembly 600 on a miniaturized electronic device (e.g., Figures 1 to 6 In an embodiment, when the lens assembly 600 satisfies the condition of [Equation 4] for FOV, good telephoto performance may be provided.

[0128] The following [Table 1] illustrates the above-described or below-described Figure 8 , Fig.11 and / or Fig.13The values ​​of the above [Formulas 1-4] in the lens assemblies 600, 700, and 800 of (one or more) embodiments. According to the embodiment, by satisfying the conditions given by the above [Formulas 1]-[Formulas 4], the lens assemblies 600, 700, and 800 become more compact, thereby having good optical performance. In the embodiment, when the lens assemblies 600, 700, and 800 satisfy the conditions of the above [Formulas 1]-[Formulas 4], the lens assembly becomes smaller, so the design freedom can be improved in terms of the arrangement of (one or more) lenses and / or image sensors.

[0129] [Table 1]

[0130] In the following embodiment(s), the same reference numerals in the drawings are given to components that can be easily understood or omitted by the previous embodiment, and a detailed description thereof may also be omitted.

[0131] Fig.11 is a view showing a lens assembly 700 according to an embodiment of the present disclosure. Fig.12 The present invention is a diagram showing an embodiment of the present invention. Fig.11 A view of the imaging surface of the image sensor and the exit surface of the first optical component in the lens assembly.

[0132] Reference Fig.11 and Fig.12 , lens assembly 700 (eg, Figure 6 The lens assembly 500 may include at least two (e.g., four) lenses L1, L2, L3, or L4, an image sensor S, and / or a first optical member R1, wherein the first optical member R1 may be disposed between the lens L1, L2, L3, or L4 and the image sensor S. In an embodiment, the lens assembly 700 may satisfy the specifications or conditions given by [Formula 1]-[Formula 4] above. In an embodiment, the second optical axis O2 (e.g., the optical axis of the image sensor S) may be substantially parallel to the first optical axis O1.

[0133] According to an embodiment, the first optical member R1 may include an incident surface F1, an exit surface F2 and / or reflective surfaces F31, F32, F33 and F34. For example, light incident through the incident surface F1 may be reflected or refracted four times inside the first optical member R1. In an embodiment, some of the reflective surfaces F31, F32, F33 and F34 may be substantially arranged on the same plane as the incident surface F1 or the exit surface F2. For example, among the reflective surfaces F31, F32, F33 and F34, the first reflective surface F31 and the fourth reflective surface F34 may be arranged to be inclined relative to the incident surface F1 and / or the exit surface F2, the second reflective surface F32 may be arranged on the same plane as the incident surface F1, and the third reflective surface F33 may be arranged on the same plane as the exit surface F2. For example, the incident surface F1, the exit surface F2 and / or the reflection surfaces F31, F32, F33 and F34 are defined; however, these refer to areas or points where light is transmitted, reflected and / or refracted in the first optical component R1, and at least one of the reflection surfaces F31, F32, F33 and F34 can be arranged to form the same plane as the incident surface F1 or the exit surface F2.

[0134] According to an embodiment, light concentrated by lenses L1, L2, L3, and L4 may be incident (IL) to the incident surface (F1) along the first optical axis (O1) direction, and may be sequentially reflected or refracted by the first reflective surface F31, the second reflective surface F32, the third reflective surface F33, and / or the fourth reflective surface F34 inside the first optical member R1. In an embodiment, light reflected or refracted by the fourth reflective surface F34 may be emitted (EL) through the exit surface F2 and guided to the image sensor S. In an embodiment, the angle Ang-min satisfying the condition of [Formula 2] may be an angle between the incident surface F1 and the first reflective surface F31, and / or an angle between the exit surface F2 and the fourth reflective surface F34.

[0135] Fig.13 is a view showing a lens assembly 800 according to an embodiment of the present disclosure. Fig.14 The present invention is a diagram showing an embodiment of the present invention. Fig.13 A view of the imaging surface img of the image sensor S in the lens assembly 800 and the exit surface F2 of the first optical member R1.

[0136] Reference Fig.13 and Fig.14 , lens assembly 800 (eg, Figure 6The lens assembly 500 may include at least two (e.g., four) lenses L1, L2, L3, and L4, an image sensor S, and / or a first optical member R1, wherein the first optical member R1 may be disposed between the lenses L1, L2, L3, and L4 and the image sensor S. In an embodiment, the lens assembly 800 may satisfy the specifications or conditions given by [Formula 1]-[Formula 4] above. In an embodiment, the second optical axis O2 (e.g., the optical axis of the image sensor S) may be substantially parallel to the first optical axis O1.

[0137] According to an embodiment, the first optical member R1 may include an incident surface F1, an exit surface F2 and / or reflective surfaces F31 and F32. For example, light incident through the incident surface F1 may be reflected or refracted at least twice inside the first optical member R1. In an embodiment, the incident surface F1 and the exit surface F2 may be substantially arranged on the same plane of the first optical member R1, and may be understood as different regions. In an embodiment, the reflective surfaces F31 and F32 may be arranged to be inclined relative to the incident surface F1 and / or the exit surface F2, and may be substantially inclined in opposite directions relative to each other.

[0138] According to an embodiment, light concentrated by lenses L1, L2, L3, and L4 may be incident (IL) on the incident surface (F1) along the first optical axis (O1) direction, and may be sequentially reflected or refracted by the first reflective surface F31 and / or the second reflective surface F32 inside the first optical member R1. In an embodiment, light reflected or refracted by the second reflective surface F32 may be emitted (EL) through the exit surface F2 and guided to the image sensor S. In an embodiment, the angle Ang-min satisfying the condition of [Formula 2] may be an angle between the incident surface F1 and the first reflective surface F31, and / or an angle between the exit surface F2 and the second reflective surface F32.

[0139] According to the lens assembly of the embodiment of the present disclosure (for example, Figures 1 to 3 camera module 180, 205, 212 or 213, or Figure 6 , Figure 8 , Fig.11 and / or Fig.13 The lens assembly 500, 600, 700 or 800 in FIG. 5 may include a lens disposed between (one or more) lenses and an image sensor (eg, Figure 8 , Fig.11 and / or Fig.13 at least one optical member (eg, Figure 8 , Fig.11 and / or Fig.13 The first optical member R1 of the image sensor S can be freely designed to provide a light traveling path to the image sensor S. For example, the imaging surface of the image sensor S (eg, Figure 8The arrangement direction of the imaging surface img) can be relative to the lens (for example, Figure 8 The arrangement of the lenses L1, L2, L3, L4 and L5 can be variously designed. Therefore, it is easy to mount the lens assembly with high optical performance on a miniaturized and light-emitting electronic device such as a smart phone (for example, Figures 1 to 6 In the electronic device 101, 102, 104, 200, 300 or 400). In an embodiment, by providing an additional optical component (for example, Figure 6 The first refractive member 413 in the electronic device can be configured to have a length direction (eg, Figure 5 in the Y-axis direction) and / or in the width direction (e.g. Figure 5 For example, the number of lenses and the degree of freedom in the design of the arrangement can be increased in a miniaturized electronic device. In an embodiment, when the lenses are arranged along the length direction or the width direction of the electronic device, it is easy to ensure that the lenses are arranged in the optical axis direction (for example, Figure 8 The space for moving the lens forward and backward on the first optical axis O1 in the image sensor is provided. For example, by ensuring an environment in which a focal length adjustment operation and / or a focus adjustment operation can be achieved, the optical performance (e.g., telephoto performance) of the lens assembly can be easily improved. In an embodiment, the size of the exit surface (e.g., the area through which light incident on the image sensor passes) of the first optical member can be controlled relative to the imaging surface img, thereby suppressing the generation of stray light and achieving good optical performance in the lens assembly.

[0140] Effects that can be obtained by the present disclosure are not limited to the above-described effects, and other effects that are not described above can be clearly understood by a person of ordinary skill in the art to which the present disclosure pertains based on the following description.

[0141] As described above, according to an embodiment of the present disclosure, a lens assembly (eg, Figures 1 to 3 camera module 180, 205, 212 or 213, or Figure 6 , Figure 8 , Fig.11 and / or Fig.13 The lens assembly 500, 600, 700 or 800) may include: at least two lenses ( Figure 8 L1, L2, L3, L4 and L5), which are along the first optical axis (O1) (for example, Figure 8 The image sensor (eg, Figure 8 an image sensor S) configured to receive light guided or concentrated by at least two lenses; and at least one optical member (eg, Figure 8The first optical member R1 is disposed between the at least two lenses and the image sensor to receive light incident through the at least two lenses, refract or reflect the light at least twice, and then guide or emit the light toward the image sensor. In an embodiment, the lens assembly may satisfy the following [Conditional Formula 1] and [Conditional Formula 2].

[0142] [Conditional expression 1] 1.2= <w / img-X=<2.5。

[0143] [Conditional expression 2] 15=<Ang-min=<40.

[0144] Here, "img-X" represents the length of the longer side of the horizontal length / vertical length of the imaging surface (img) of the image sensor (see, for example, Fig.10 ); "w" represents an exit surface facing the image sensor among the surfaces of an optical member closest to the image sensor among the at least one optical member (hereinafter, "first optical member") (for example, Fig. 9 The exit surface F2 or Fig.10 "Ang-min" represents the minimum angle among the angles formed by two adjacent surfaces of the first optical member (for example, Fig. 9 The second angle indicated by "Ang-p2" in the figure).

[0145] According to an embodiment, the first optical member may satisfy the following [Conditional Expression 3] for the dispersion value Vd-1: [Conditional expression 3] 25= <Vd-1=<95。

[0146] According to an embodiment, the first optical member includes an incident surface (eg, Fig. 9 The incident surface F1 in the figure) and the exit surface (for example, Fig. 9 The exit surface F2 or Fig.10 An anti-reflective coating is formed on at least one of the regions indicated by “F2E” in the figure.

[0147] According to an embodiment, the first optical member may include an infrared blocking coating formed on at least one of an incident surface and an exit surface facing the at least two lenses.

[0148] According to an embodiment, the lens assembly may satisfy the following [Conditional Expression 4] for the field of view (FOV).

[0149] [Conditional expression 4] 5= <FOV=<35。

[0150] According to an embodiment, the lens assembly as described above may be configured to move at least one lens of the at least two lenses along the first optical axis direction, thereby performing a focusing function.

[0151] According to an embodiment, the lens assembly as described above may be configured to move at least one of the at least two lenses in a direction perpendicular to the first optical axis, thereby performing an image stabilization function.

[0152] According to an embodiment, the lens assembly as described above may be configured to move or rotate at least one optical member, thereby performing an image stabilization function or a subject tracking function.

[0153] According to an embodiment, the lens assembly as described above may further include a second optical member (eg, Figure 8 The second optical member R2 in the embodiment is aligned with at least one optical member along the first optical axis, wherein at least two lenses are sandwiched between the at least one optical member and the second optical member. In an embodiment, the second optical member can be configured to receive light from a direction different from the first optical axis (e.g., Figure 8 The device refracts or reflects the light in the direction of the first optical axis, thereby guiding the light to at least two lenses.

[0154] According to an embodiment, the first optical member may further include an incident surface facing the at least two lenses. In an embodiment, the first optical member may be configured to reflect or refract light incident on the incident surface at least twice between the incident surface and the exit surface.

[0155] According to an embodiment, the first optical member may further include a reflective surface (eg, Fig. 9 In an embodiment, the exit surface and the reflection surface can reflect or refract the light incident on the incident surface inside the first optical component. In an embodiment, the light reflected or refracted at least twice inside the first optical component is guided or emitted to the image sensor through the exit surface.

[0156] According to an embodiment, the lens assembly as described above is configured so that at least one of an angle formed between the incident surface and the reflective surface or an angle formed between the reflective surface and the exit surface may satisfy [Conditional Expression 2].

[0157] According to an embodiment, the first optical member may include a prism.

[0158] According to an embodiment of the present disclosure, an electronic device (eg, Figures 1 to 6 The electronic device 101, 102, 104, 200, 300 or 400 in the embodiment may include: a lens assembly (eg, Figures 1 to 3 camera module 180, 205, 212 or 213, or Figure 6 , Figure 8 , Fig.11 and / or Fig.13 lens assembly 500, 600, 700 or 800 in; memory (e.g., Figure 1 130 in the memory 130), which stores instructions for acquiring an image; and a processor (e.g., Figure 1 The processor 120 in the embodiment is configured to execute instructions to obtain an image by receiving external light using a lens assembly. In an embodiment, the lens assembly may include: at least two lenses (e.g., Figure 8 lenses L1, L2, L3, L4 and L5 in the image sensor, which are aligned along the first optical axis; an image sensor (e.g., Figure 8 ), which is configured to receive light guided or concentrated by at least two lenses; and at least one optical member (e.g., Figure 8 The first optical member R1 is disposed between the at least two lenses and the image sensor to receive light incident through the at least two lenses, refract or reflect the light at least twice, and then guide or emit the light toward the image sensor. In an embodiment, the lens assembly may satisfy the following [Conditional Formula 5] and [Conditional Formula 6].

[0159] [Conditional expression 5] 1.2= <w / img-X=<2.5。

[0160] [Conditional expression 6] 15=<Ang-min=<40.

[0161] Here, "img-x" represents the length of the longer side of the horizontal length / vertical length of the imaging surface (img) of the image sensor (see, for example, Fig.10 ); "w" represents an exit surface facing the image sensor among the surfaces of an optical component (hereinafter, "first optical component") closest to the image sensor among at least one optical component (eg, Fig. 9 The exit surface F2 or Fig.10 ; and “Ang-min” represents the minimum angle among the angles formed by two adjacent surfaces of the first optical member (for example, Fig. 9 The second angle indicated by "Ang-p2").

[0162] According to an embodiment, the processor may be configured to move at least one of the at least two lenses along the first optical axis direction, thereby performing a focusing function.

[0163] According to an embodiment, the processor may be configured to move at least one of the at least two lenses in a direction perpendicular to the first optical axis, thereby performing an image stabilization function.

[0164] According to an embodiment, the processor may be configured to move or rotate at least one optical member so as to perform an image stabilization function or a subject tracking function.

[0165] According to the embodiment, the first optical member may satisfy the following [Conditional Expression 7] for the dispersion value Vd-1.

[0166] [Conditional expression 7] 25= <Vd-1=<95。

[0167] According to an embodiment, the lens assembly may satisfy the following [Conditional Expression 8] for the field of view (FOV).

[0168] [Conditional expression 8] 5= <FOV=<35。

[0169] According to an embodiment, the first optical member may include an incident surface (eg, Fig. 9 An infrared blocking coating formed on at least one of the incident surface (F1) and the exit surface.

[0170] It is obvious to those skilled in the art that the lens assembly according to the present disclosure and the electronic device including the lens assembly as described above are not limited to the above embodiments and the embodiments shown in the accompanying drawings, and various changes, modifications or changes may be made thereto without departing from the scope of the present disclosure.

Claims

1. A lens assembly (500; 600; 700; 800), the lens assembly comprises: at least two lenses (L1, L2, L3, L4, L5), the at least two lenses being aligned along a direction of a first optical axis (O1); an image sensor (S) configured to receive the light directed or concentrated by the at least two lenses; and at least one optical member (R1), the at least one optical member being disposed between the at least two lenses and the image sensor, the at least one optical member being configured to receive light incident through the at least two lenses, and refract or reflect the light at least twice to guide or emit the light toward the image sensor, Wherein, the lens assembly is configured to satisfy the following [Conditional Formula 1] and [Conditional Formula 2]: [Conditional expression 1] 1.2= <w / img-X=<2.5, [Conditional expression 2] 15=<Ang-min=<40, Wherein, "img-X" represents the length of the longer side in the horizontal length / vertical length of the imaging surface (img) of the image sensor, "w" represents the length of the longer side in the horizontal length / vertical length of the exit surface (F2 or F2E) of the first optical component closest to the image sensor among the at least one optical component, the exit surface facing the image sensor, and "Ang-min" represents the minimum angle formed by two adjacent surfaces of the first optical component.

2. The lens assembly according to claim 1, wherein: The first optical member is configured to satisfy the following [Conditional Expression 3] for the dispersion value Vd-1: [Conditional expression 3] 25= <Vd-1=<95。 3. The lens assembly according to claim 1 or 2, wherein: The first optical member includes an anti-reflection coating formed on at least one of: an incident surface (F1) facing the at least two lenses, and the exit surface.

4. The lens assembly according to any one of claims 1 to 3, wherein: The first optical member includes an infrared blocking coating (IFL) formed on at least one of: an incident surface facing the at least two lenses, and the exit surface.

5. The lens assembly according to any one of claims 1 to 4, wherein: The lens assembly is configured to satisfy the following [Conditional Equation 4] for the field of view (FOV): [Conditional expression 4] 5= <FOV=<35。 6. The lens assembly according to any one of claims 1 to 5, wherein: The lens assembly is configured to move at least one of the at least two lenses along the first optical axis to perform a focusing function.

7. The lens assembly according to any one of claims 1 to 6, wherein: The lens assembly is configured to move at least one of the at least two lenses along a direction perpendicular to the first optical axis to perform an image stabilization function.

8. The lens assembly according to any one of claims 1 to 7, wherein: The lens assembly is configured to move or rotate the at least one optical member to perform at least one of an image stabilization function and a subject tracking function.

9. The lens assembly according to any one of claims 1 to 8, further comprising: a second optical member (R2), the second optical member being aligned with the at least one optical member along the first optical axis, the at least two lenses being sandwiched between the second optical member and the at least one optical member, The second optical member is configured to receive light incident from a direction (ID2) different from the direction of the first optical axis and refract or reflect the light in the direction of the first optical axis to guide the light toward the at least two lenses.

10. The lens assembly according to any one of claims 1 to 9, wherein: The first optical member further includes an incident surface facing the at least two lenses, and The first optical component is configured to reflect or refract light incident on the incident surface at least twice between the incident surface and the exit surface.

11. The lens assembly according to claim 10, wherein: The first optical component further includes a reflective surface (F3), wherein the reflective surface (F3) is arranged to be inclined relative to the emission surface. The emitting surface and the reflecting surface are configured to reflect or refract the light incident on the incident surface inside the first optical component, and The light reflected or refracted at least twice inside the first optical component is guided or emitted to the image sensor through the emission surface.

12. The lens assembly according to claim 11, wherein: At least one of an angle between the incident surface and the reflective surface or an angle between the reflective surface and the emitting surface satisfies [Conditional Expression 2].

13. The lens assembly according to any one of claims 1 to 12, wherein: The first optical member includes a prism.

14. An electronic device (101; 102; 104； 200； 300; 400), the electronic device comprises: A lens assembly (500; 600; 700; 800) according to any one of claims 1 to 13; a memory storing instructions for acquiring an image; and A processor (120) is configured to execute the instructions to acquire an image by receiving external light using the lens assembly.

Images