Self-centering edge ring

Abstract

An edge ring system for a substrate processing chamber includes an intermediate ring configured to be disposed about a substrate support. The edge ring system includes: an outer ring portion; an inner ring portion; n arcuate openings disposed between the outer ring portion and the inner ring portion, where N is an integer greater than 1; n bridges connecting the outer ring portion and the inner ring portion between the N arcuate openings; and an annular cavity disposed on a radially inner surface of the outer ring portion. A cap ring is disposed in the annular cavity. A top edge ring is disposed over the intermediate ring between the cap ring and the inner ring portion and over the N arcuate openings and the N bridges of the intermediate ring.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 342,826, filed May 17, 2022, and U.S. Provisional Application No. 63 / 458,542, filed April 11, 2023. The entire disclosure of each of the above applications is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a self-centering edge ring for a substrate processing system. Background Art

[0003] The background description provided here is for the purpose of generally presenting the background of the present disclosure. The work of the currently designated inventors within the scope described in this background section and aspects of the specification that were not determined to be prior art at the time of filing the application are neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0004] Substrate processing systems process substrates such as semiconductor wafers. Examples of substrate processing include deposition, ashing, etching, cleaning, and / or other processes. A process gas mixture may be supplied to a processing chamber to process the substrate. Plasma may be used to ignite a gas to enhance a chemical reaction.

[0005] The substrate is disposed on a substrate support during processing. An edge ring including an annular body is disposed around and adjacent to a radially outer edge of the substrate. The edge ring can be used to shape or focus plasma onto the substrate. Summary of the invention

[0006] An edge ring system for a substrate processing chamber includes: an intermediate ring including an outer ring portion and an inner ring portion; and an edge ring configured to be supported on the intermediate ring and between the outer ring portion and the inner ring portion. An outer diameter of a lower surface of the edge ring has a first chamfer, the first chamfer defining a chamfered surface facing downward and outward. An inner diameter of the outer ring portion has a second chamfer, the second chamfer defining a chamfered surface facing upward and inward. At least one of the first chamfer and the second chamfer is configured to align the edge ring within the outer ring portion and the inner ring portion of the intermediate ring.

[0007] In other features, the intermediate ring is further configured to align the edge ring with the moving ring so that the edge ring is centered relative to a substrate being processed in the substrate processing chamber. The inner ring portion of the intermediate ring is generally "L" shaped and has a protrusion extending radially outward toward the outer ring portion. The edge ring is configured to be at least partially supported on the protrusion of the inner ring portion. The edge ring includes a flange extending downward from the lower surface at the inner diameter of the edge ring, and wherein the flange is configured to be supported on the protrusion of the inner ring portion. The inner ring portion is configured to force the edge ring into a centered position relative to the intermediate ring. The interface between the edge ring and the inner ring portion defines a serpentine path.

[0008] In other features, the edge ring is fully supported within the inner diameter and outer diameter of the intermediate ring. The intermediate ring includes a plurality of bridges connecting the inner ring portion to the outer ring portion. The intermediate ring includes six of the bridges. The intermediate ring includes a plurality of gaps defined between the plurality of bridges. The edge ring system further includes a moving ring configured to be raised and lowered relative to the intermediate ring. The moving ring is configured to contact a lower surface of the edge ring via the plurality of gaps. The moving ring includes a raised portion extending upward through the plurality of gaps to contact a lower surface of the edge ring. The moving ring includes a stationary ring portion and a moving ring portion located radially inward of the stationary ring portion, and wherein the moving ring portion is configured to be raised and lowered.

[0009] In other features, the lower surface of the outer ring portion of the intermediate ring includes an annular groove. The edge ring system also includes a bottom ring, wherein the intermediate ring is supported on the bottom ring. The bottom ring includes an annular flange extending upward from the upper surface of the bottom ring into the annular groove.

[0010] An edge ring system for a substrate processing chamber includes: an intermediate ring including an outer ring portion and an inner ring portion; and an edge ring supported on the intermediate ring and between the outer ring portion and the inner ring portion. The edge ring is fully supported within the inner and outer diameters of the intermediate ring, and at least one of the outer ring portion and the inner ring portion is configured to force the edge ring to a centered position relative to the intermediate ring. A moving ring is disposed below the intermediate ring. The moving ring is configured to be raised and lowered to contact and selectively raise and lower the edge ring.

[0011] In other features, the intermediate ring includes: a plurality of bridges connecting the inner ring portion to the outer ring portion; and a plurality of gaps defined between the plurality of bridges. The moving ring is configured to pass through the plurality of gaps to contact a lower surface of the edge ring. The moving ring includes a raised portion extending upward through the plurality of gaps to contact a lower surface of the edge ring.

[0012] An edge ring system for a substrate processing chamber includes: an intermediate ring configured to be disposed around a substrate support and including: an outer ring portion; an inner ring portion; N arc-shaped openings disposed between the outer ring portion and the inner ring portion, wherein N is an integer greater than 1; N bridges connecting the outer ring portion and the inner ring portion between the N arc-shaped openings; and an annular cavity disposed on a radially inner surface of the outer ring portion. A cover ring is disposed in the annular cavity. A top edge ring is disposed above the intermediate ring and between the cover ring and the inner ring portion and above the N arc-shaped openings and the N bridges of the intermediate ring.

[0013] In other features, the moving ring includes N upper portions having an arcuate shape, the N upper portions being configured to align with and pass through the N arcuate openings. The top edge ring rests on the N upper portions. The N upper portions of the moving ring are configured to bias a bottom surface of the top edge ring through the N arcuate openings of the intermediate ring to lift the top edge ring relative to the cover ring.

[0014] In other features, the first lift pins are configured to selectively lift the moving ring and the top edge ring upward relative to the cover ring and the intermediate ring. The second lift pins are configured to selectively bias the intermediate ring, the top edge ring, and the cover ring relative to the moving ring.

[0015] In other features, the top edge ring has a "C" shaped cross section, the "C" shaped cross section defining an inner annular protrusion extending downwardly and an outer annular protrusion extending downwardly and a cavity disposed between the inner annular protrusion and the outer annular protrusion. The N bridges include protrusions extending upwardly toward the lower surface of the top edge ring. The cover ring has an inverted "L" shaped cross section.

[0016] In other features, the radial inner side of the cover ring includes a radial inner surface and an arcuate surface. The radial inner surface of the cover ring is positioned radially inward of the radial outer surface of the upper portion of the moving ring. The radial outer surface of the top edge ring is disposed radially outward below the radial inner surface of the cover ring. The upper radial outer edge of the top edge ring has an arcuate shape corresponding to the arcuate surface of the cover ring.

[0017] In other features, at least one of the N bridges of the intermediate ring includes one of a protrusion and a cavity, and the radially inner edge of the outer annular protrusion of the top edge ring includes the other of the cavity and the protrusion. The one of the protrusion and the cavity of the at least one of the N bridges of the intermediate ring is received in the other of the cavity and the protrusion on the radially inner edge of the outer annular protrusion of the top edge ring. A stationary ring is configured to be disposed around the substrate support below the intermediate ring.

[0018] In other features, the stationary ring includes a protrusion extending radially inward from a lower portion of a radial inner surface of the stationary ring, wherein the mobile ring is disposed above the protrusion of the stationary ring and radially inward of the stationary ring. In other features, the mobile ring includes a first plurality of protrusions extending radially outward from the mobile ring. The bottom surface of the first plurality of protrusions includes a groove, and the groove includes a reverse inclined surface extending in a radial direction.

[0019] In other features, the moving ring includes: a second plurality of protrusions extending radially outward from the moving ring; and holes extending in an axial direction through the second plurality of protrusions. The stationary ring includes a first plurality of cavities extending in a radially inward direction from a radially inner surface of the stationary ring and configured to provide clearance for the first plurality of protrusions of the moving ring. The stationary ring includes a second plurality of cavities extending in a radially inward direction from a radially inner surface of the stationary ring and configured to provide clearance for the second plurality of protrusions of the moving ring. The bottom edge ring includes: a first annular flange extending inwardly from the radially inner surface of the bottom edge ring; and an annular body disposed around the stationary ring.

[0020] In other features, the bottom edge ring further includes a second annular flange extending upwardly from an upper surface of the bottom edge ring. The intermediate ring includes an annular groove configured to accommodate the second annular flange of the bottom edge ring. A gap is defined between a bottom surface of the intermediate ring and an upper surface of the bottom edge ring. The bottom surface of the first annular flange rests on the stationary ring. The first annular flange includes: a first plurality of recesses extending in a radially inward direction to provide clearance for a first plurality of protrusions of the moving ring. The first annular flange includes: a second plurality of cavities extending in a radially inward direction from a radially inner surface of the stationary ring and configured to provide clearance for a second plurality of protrusions of the moving ring.

[0021] In other features, the intermediate ring comprises quartz. The cover ring comprises quartz. The top edge ring comprises silicon carbide. The moving ring comprises a silicon substrate having an electroplated aluminum outer layer. The stationary ring comprises a silicon substrate having one of an electroplated aluminum outer layer and a coating comprising perfluoroalkoxyalkane (PFA).

[0022] An intermediate ring for a substrate processing chamber comprises: an outer ring portion; an inner ring portion; N bridges connecting the outer ring portion to the inner ring portion, wherein N is an integer greater than 1; and N arc-shaped openings, which are respectively arranged between the N bridges and between the outer ring portion and the inner ring portion.

[0023] In other features, an annular cavity is disposed on an upper radially inner surface of the outer ring portion. At least one of the N bridges includes one of a protrusion and a cavity configured to position the intermediate ring relative to another edge ring. The one of the protrusion and the cavity is disposed on a radially outer surface of the at least one of the N bridges. The intermediate ring includes quartz. G alignment portions are disposed on a bottom surface of the outer ring portion, where G is an integer greater than 2. The G alignment portions include a planar surface extending in a radial direction disposed between oppositely inclined surfaces.

[0024] In other features, the G alignment portions are configured to self-center the intermediate ring on the lift pins. The opposing ends of the N arcuate openings are rounded. The circumferential side surfaces of the N bridges are rounded to define the rounded ends of the N arcuate openings. An annular groove is provided on the bottom surface of the outer ring portion.

[0025] In other features, G alignment portions are disposed on the bottom surface of the outer ring portion and include a planar surface extending in a radially outward direction disposed between the oppositely inclined surfaces, where G is an integer greater than 2. An annular groove is disposed on the bottom surface of the outer ring portion and is located radially outward of the G alignment portions. The intermediate ring includes quartz.

[0026] A top edge ring for a substrate processing system comprises: an annular body having a "C" shaped cross section. An inner annular protrusion extends downward from a radial inner surface of the annular body. An outer annular protrusion extends downward from a radial inner surface of the annular body. A cavity is provided between the inner annular protrusion and the outer annular protrusion.

[0027] In other features, the top edge ring comprises silicon carbide. A protrusion is disposed on one of: a radially inner surface of the outer annular protrusion; and a radially outer surface of the inner annular protrusion. The protrusion is configured to position the top edge ring relative to another edge ring.

[0028] In other features, the protrusion has a semicircular shape. A cavity is disposed on one of: a radially inner surface of the outer annular protrusion; and a radially outer surface of the inner annular protrusion. The cavity is configured to position the top edge ring relative to another edge ring. The cavity has a semicircular shape.

[0029] In other features, the top edge ring comprises silicon carbide.

[0030] A moving ring for a substrate processing system comprises: a ring body; N upper portions, which are arranged on the top edge of the ring body and have an arc shape; N gaps, which are arranged between the N upper portions; P first protrusions, which are arranged on the radial outer surface of the ring body, wherein P is an integer greater than 2; and P grooves, which are arranged on the bottom surfaces of the P first protrusions and are configured to make the moving ring self-centered when the P self-centering portions are biased by P lifting pins.

[0031] In other features, the P first protrusions have a "V" shape. The P grooves have a "V" shape including reverse inclined surfaces extending in a radial direction. R first protrusions are disposed on the outer surface, where R is an integer greater than 2. R holes pass through R of the N upper portions and the R first protrusions. The N upper portions are circular at their opposite circumferential ends. The moving ring includes a silicon substrate having an electroplated aluminum outer layer.

[0032] A stationary ring for an edge ring system of a substrate processing system comprises: an annular body; an annular flange extending radially inward from a lower end of the annular body; P first cavities disposed on a radial inner surface of the annular body, wherein P is an integer greater than 2; and P holes passing through the annular flange in the P first cavities.

[0033] In other features, the P first cavities have a rounded "V" shape. R second cavities are disposed on the radial inner surface of the annular body, where R is an integer greater than 2. The R second cavities have a rounded "V" shape. P=3 and the P first cavities are spaced apart at intervals of 120°.

[0034] In other features, R second cavities are disposed on the radial inner surface of the annular body, where R is an integer greater than 2, and wherein the R second cavities are disposed between the P first cavities. P=3, R=3, the P first cavities are spaced apart at intervals of 120°, and the R second cavities are spaced apart at intervals of 120° and are evenly spaced between the P first cavities. S cavities extend axially into the bottom surface of the annular body, where S is an integer greater than 2. S plugs are disposed in the S cavities. The stationary ring comprises a silicon substrate having one of an electroplated aluminum outer layer and a coating comprising perfluoroalkoxyalkane (PFA).

[0035] A bottom edge ring of an edge ring system for a substrate processing system comprises: an annular body; an annular flange extending radially inward from an upper end of the annular body; and P first recesses disposed on a radial inner edge of the annular flange, wherein P is an integer greater than 2.

[0036] In other features, the P first recesses are spaced 360° / P apart and have a rounded "V" shape. R second recesses are disposed on the radially inner edge of the annular flange, where R is an integer greater than 2. The R second recesses are spaced 360° / R apart and have a rounded "V" shape. P=3 and the P first recesses are spaced at intervals of 120°. The R second recesses are disposed on the radially inner surface of the annular body, where R is an integer greater than 2, wherein the R second recesses are disposed between the P first recesses. P=3, R=3, the P first recesses are spaced at intervals of 120°, and the R second recesses are spaced at intervals of 120° and are evenly spaced between the P first recesses.

[0037] In other features, S holes extend axially through the annular body, where S is an integer greater than 2. T holes extend axially into the annular body, where T is an integer greater than 2. T plugs are disposed in the T holes.

[0038] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0040] Figure 1 is a functional block diagram of an exemplary substrate processing system including a self-centering edge ring according to the present disclosure;

[0041] Figure 2A and Figure 2B is a cross-sectional view of an exemplary edge ring system according to the present disclosure, wherein the edge ring and the intermediate ring are in a raised position;

[0042] Figure 2C According to the content of this disclosure Figure 2A and Figure 2B a cross-sectional view of an edge ring system of the embodiment of the present invention, wherein the edge ring is in a raised position and the intermediate ring is in a lowered position;

[0043] Figure 2D yes Figure 2A , 2B and an isometric view of the middle ring of 2C;

[0044] Figure 2E yes Figure 2A , 2B , the plan view of the intermediate ring of 2C and 2D;

[0045] Figure 2F yes Figure 2A , 2B and the plan view of the mobile ring of 2C;

[0046] Figure 2G yes Figure 2A , 2B and an isometric view of the base of the marginal ring of 2C;

[0047] Figure 2H yes Figure 2G Another isometric view of the bottom of the edge ring;

[0048] Figure 3A is a first cross-sectional view of an exemplary edge ring system including a moving ring assembly according to the present disclosure;

[0049] Figure 3B is a first cross-sectional view of an exemplary edge ring system including a moving ring assembly according to the present disclosure;

[0050] Figure 4A is a side cross-sectional view of another example of an edge ring system according to the present disclosure showing the top ring and the mobile ring in a lowered position;

[0051] Figure 4B According to the content of this disclosure Figure 4A A side cross-sectional view of an edge ring system of FIG. 1 with the top ring and the mobile ring in a raised position;

[0052] Figure 5A According to the content of this disclosure Figure 4A a side cross-sectional view of an edge ring system of FIG. 1 showing the cover ring, the top ring, and the intermediate ring in a lowered position;

[0053] Figure 5B According to the content of this disclosure Figure 4A a side cross-sectional view of an edge ring system of FIG. 1 showing a cover ring, a top ring, and an intermediate ring in a raised position;

[0054] Fig. 6A According to the content of this disclosure Figure 4A a side cross-sectional view of an edge ring system of FIG. 1 showing the top ring and the mobile ring in a lowered position;

[0055] Figure 6B According to the content of this disclosure Figure 4A A side cross-sectional view of an edge ring system of FIG. 1 with the top ring and the mobile ring in a raised position;

[0056] Fig. 7A According to the content of this disclosure Figure 4A a side cross-sectional view of an edge ring system of FIG. 1 showing the top ring and the mobile ring in a lowered position;

[0057] Figure 7B According to the content of this disclosure Figure 4A A side cross-sectional view of an edge ring system of FIG. 1 with the top ring and the mobile ring in a raised position;

[0058] Fig. 8A and Figure 8B According to the present disclosure Figure 4A A plan view and a bottom view of an example of an intermediate ring;

[0059] Fig. 9A and Fig. 9C According to the content of this disclosure Fig. 8A An enlarged partial plan view of an example of an intermediate ring;

[0060] Fig. 9B and Fig.9D According to the content of this disclosure Figure 4A An enlarged partial bottom view of an example of a top ring of;

[0061] Fig.9E and Fig.9F is a side cross-sectional view showing an axial projection on a bridge of an intermediate ring according to the present disclosure;

[0062] Fig. 10A and Fig. 10B are top and bottom perspective views of examples of moving rings according to the present disclosure;

[0063] Figures 10C to 10F According to the content of this disclosure Fig. 10A Cross-sectional views of examples of the moving ring taken at various cross-sectional views shown in ;

[0064] Figure 10G is a top perspective view of an example of two of the N upper portions of a moving ring according to the present disclosure;

[0065] Fig. 10H is a bottom perspective view of an example of a moving ring at a convex portion according to the present disclosure;

[0066] Fig.11A and Fig. 11B are top and bottom perspective views of an example of a stationary ring according to the present disclosure;

[0067] Figures 11C to 11F According to the content of this disclosure Fig.11A and 11B Cross-sectional views of examples of stationary rings taken at various cross-sectional views shown in FIG.

[0068] Fig.11G is a top perspective view of an example of a first cavity of a stationary ring according to the present disclosure;

[0069] Fig.11H is a top perspective view of an example of a second cavity of a stationary ring according to the present disclosure;

[0070] Fig. 12A and Fig. 12B are top perspective and plan views of an example of a bottom edge ring according to the present disclosure; and

[0071] Figures 12C to 12F According to the content of this disclosure Fig. 12A and 11B Cross-sectional views of examples of a bottom edge ring taken at various cross-sectional views are shown.

[0072] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0073] During substrate processing, the substrate is placed on a pedestal such as an electrostatic chuck (ESC), process gases are supplied, and a plasma is ignited in a processing chamber. In some examples, an edge ring is placed around the radially outer edge of the substrate to shape the plasma. During operation, the exposed surfaces of the substrate and edge ring are etched by the plasma. As a result, the edge ring wears and the effect of the edge ring on the plasma changes, which may adversely affect uniformity. For example, due to wear, the exposed surface of the edge ring may have a different height relative to the substrate. Therefore, in some substrate processing systems, the worn edge ring is replaced periodically.

[0074] In some embodiments, the edge ring may correspond to a top edge ring in an edge ring system or assembly that also includes a bottom ring and / or an intermediate ring. For example, the edge ring may be supported on an intermediate ring or a bottom ring. In some embodiments, the edge ring is configured to be transferred into and out of a processing chamber through the same opening (e.g., a slot valve) as the substrate. This approach reduces chamber downtime by eliminating vacuum breaks and potential sources of contamination. In a system that includes an intermediate ring, the edge ring can be transferred with the intermediate ring (e.g., under vacuum, using a transfer robot) and / or placed on the intermediate ring within the processing chamber.

[0075] The edge ring can be centered relative to the intermediate ring to ensure centering relative to the substrate. For example, processing accuracy may depend on the concentric relationship between the edge ring and the substrate. In some embodiments, the edge ring and the intermediate ring are centered manually (e.g., using shims). In embodiments where a transfer robot is used to transfer the edge ring, accurate centering depends on the placement accuracy of the transfer robot and the manufacturing tolerances of various components and gaps. When the edge ring (e.g., the top edge ring) and the intermediate ring are transferred as a single unit, the edge ring may shift relative to the intermediate ring during transfer and / or placement (e.g., due to vibrations of the robot). Embodiments of the present disclosure reduce / minimize edge ring shift during robot transfer and optimize edge ring centering.

[0076] The self-centering edge ring system and method according to the present disclosure improves the alignment and centering of edge rings and intermediate rings under vacuum. In one embodiment, the outer diameter of the lower surface of the edge ring has a chamfer that contacts the intermediate ring. In other words, the lower surface of the edge ring is conical. In contrast, the upper surface on the intermediate ring can have a chamfer that contacts the chamfer of the edge ring (i.e., at least a portion of the upper surface of the intermediate ring can be conical). The chamfered surface maintains the concentricity of the edge ring relative to the intermediate ring during transport and placement. For example, the chamfer of the edge ring presses against the downward force of the intermediate ring to mechanically resist displacement caused by vibration and other lateral forces.

[0077] When the edge ring and the intermediate ring are lowered onto the substrate support, the edge ring can be supported above another ring (e.g., an inner ring or a bottom ring) and does not contact the intermediate ring. After placement, the edge ring and the intermediate ring can be raised and lowered independently. In some embodiments, the edge ring can be periodically re-centered by raising the intermediate ring (or lowering the edge ring) so that the intermediate ring contacts the edge ring. The complementary conical surfaces of the intermediate ring and the edge ring and the upward force of the raised intermediate ring force the edge ring into a centered, concentric position relative to the intermediate ring.

[0078] Aligning the edge ring with the intermediate ring in this manner centers the edge ring relative to the substrate support, and thus relative to a substrate disposed on the substrate support. For example, the edge ring and the intermediate ring are aligned using complementary conical surfaces, resulting in a substantially concentric relationship between the edge ring and the intermediate ring and between the edge ring and the substrate.

[0079] Reference now Figure 1, shows an example of a substrate processing system 100 that performs plasma processing and includes a replaceable edge ring system according to certain embodiments of the present disclosure. The substrate processing system 100 includes a coil drive circuit 104. In some examples, the coil drive circuit 104 includes an RF source 108, a pulse circuit 112, and a tuning circuit 114. The pulse circuit 112 controls the TCP envelope of the RF signal. And the duty cycle of the TCP envelope is changed during operation (e.g., between 1% and 99%). It will be appreciated that the pulse circuit 112 and the RF source 108 can be combined or separate.

[0080] The tuning circuit 114 may be directly connected to one or more induction coils 116. The tuning circuit 114 tunes the output of the RF source 108 to a desired frequency and / or a desired phase, matches the impedance of the induction coils 116, and / or distributes power between the induction coils 116. Although examples including multiple coils are shown, a single coil including a single conductor or multiple conductors may be used.

[0081] The dielectric window 120 is arranged along one side of the processing chamber 122. The processing chamber 122 also includes a substrate support (or pedestal) 124 to support a substrate 128. The substrate support 124 may include an electrostatic chuck (ESC), a mechanical chuck, or other types of chucks. Process gas is supplied to the processing chamber 122, and a plasma 132 is generated inside the processing chamber 122. An RF bias drive circuit 136 may be used to supply an RF bias to the substrate support 124 during operation to control ion energy. The RF bias drive circuit 136 may include an RF source and an impedance matching circuit (not shown).

[0082] In some embodiments, the plenum 140 is disposed adjacent to (e.g., above, as shown) the dielectric window 120. A gas delivery system 144 may be used to deliver gas from a gas source 146 to the plenum 140 via a valve 148. The gas may include a cooling gas (air) for cooling the induction coil 116 and the dielectric window 120.

[0083] A gas delivery system 156 may be used to supply a process gas mixture to the process chamber 122. The gas delivery system 156 may include a gas source 158 (e.g., a precursor, vapor, one or more other gases, an inert gas), a gas metering system 160 (e.g., valves and mass flow controllers), and a manifold 162. A gas injector (not shown) may be disposed at the center of the dielectric window 120 (or other location) and used to inject the gas mixture from the gas delivery system 156 into the process chamber 122.

[0084] The heater / cooler 164 may be used to heat / cool the substrate support 124 to a predetermined temperature. The exhaust system 166 includes a valve 168 and a pump 170 to control the pressure in the process chamber 122 and / or to remove reactants from the process chamber 122 by purging or evacuating.

[0085] A system controller 172 may be used to control the process. The system controller 172 monitors system parameters and controls the delivery of the gas mixture, the ignition, maintenance and extinguishing of the plasma, the removal of reactants, the supply of cooling gases, and the like.

[0086] The substrate support 124 can include an edge ring assembly or system that includes a top edge ring 174. As shown, the top edge ring 174 is disposed above the intermediate ring 176 and the bottom ring 178. As described in more detail below, the outer diameter of the lower surface of the top edge ring 174 can have a chamfer that contacts the intermediate ring 176 during transport. Correspondingly, the upper surface on the intermediate ring can have a chamfer that contacts the chamfer of the edge ring during transport. The chamfered surface maintains the concentricity of the top edge ring 174 relative to the intermediate ring 176 during transport and placement.

[0087] For example, the system controller 172 controls the robot 180 to transfer the substrate and / or edge ring to the processing chamber 122. The system controller 172 also controls one or more actuators 182 that move the lift pins ( Figure 1 The bottom ring 178 may be configured to selectively raise and lower the top edge ring 174 and / or the intermediate ring 176 to facilitate transferring the top edge ring 174 to and from the substrate support 124. When the top edge ring 174 and the intermediate ring 176 are lowered onto the substrate support 124, the top edge ring 174 may be supported on the bottom ring 178 and not contact the intermediate ring 176. In other words, lowering the top edge ring 174 and the intermediate ring 176 causes the bottom ring 178 to contact the top edge ring 174 and separate the top edge ring 174 from the intermediate ring 176. Although shown as a single ring, in some embodiments, the bottom ring 178 may include two or more concentric rings, such as an outer bottom ring (e.g., a stationary ring configured to support the intermediate ring 176) and an inner ring (e.g., a moving ring or a lifting ring configured to raise and lower the top edge ring 174).

[0088] The system controller 172 may also receive output from one or more sensors 184 for sensing the height of the edge ring. Non-limiting examples of sensors include optical sensors, physical sensors, piezoelectric sensors, ultrasonic sensors, and the like.

[0089] The edge ring system 200 including the edge ring 204 and the intermediate ring 208 is Figure 2A , Figure 2B and Figure 2C208 is shown in cross section and an isometric view of the intermediate ring 208 is shown in Figure 2D The plan view of the intermediate ring 208 is shown in Figure 2E The plan view of the moving ring 232 is shown in Figure 2F An isometric view of the bottom of the edge ring 204 is shown in Figure 2G and 2H In the display. Figure 2A and Figure 2B As shown, the edge ring 204 is supported on the intermediate ring 208 during transport (ie, during transport to the substrate support 124 and prior to placement on the bottom ring 212 ).

[0090] The outer diameter of the lower surface 216 of the edge ring 204 has a chamfer 218 (i.e., a chamfered surface facing downward and outward) that contacts and is supported on the intermediate ring 208 during transport. In other words, the lower surface 216 of the edge ring 204 is conical. The inner diameter of the outer ring portion 220 of the intermediate ring 208 may have a complementary chamfer 222 (i.e., a chamfered surface facing upward and inward) that contacts the chamfer 218 of the edge ring 204 (i.e., at least a portion of the upper surface of the intermediate ring 208 may be conical). In other words, the inner diameter of the outer ring portion 220 has a chamfered corner (or inclined surface) located between the top surface of the bridge 228 and the inner diameter surface of the outer ring portion 220. In some embodiments, the chamfer 222 may be larger than the corner, so that the inclined surface may extend from the top surface of the bridge 228 to the top surface of the outer ring portion 220. Chamfers 218 and 222 maintain the concentricity of edge ring 204 relative to intermediate ring 208 during transport and placement.

[0091] like Figure 2D and Figure 2E As shown, the intermediate ring 208 includes an outer ring portion 220 and an inner ring portion 224. The inner ring portion 224 is coupled to the outer ring portion 220 via two or more bridges 228. Figure 2A is a cross-sectional view taken at the location of one of the bridges 228. In contrast, Figure 2B 2 is a cross-sectional view taken at the location of one of the plurality of gaps 230 between the bridges 228. As shown, the edge ring 204 does not contact the bridges 228 during transport.

[0092] Although in Figure 2DOnly two bridges 228 are visible in the middle ring 208, but the middle ring 208 can include any number of bridges. In some embodiments, the middle ring 208 has six or more bridges 228. In some embodiments, each bridge has a width of about 8-12 mm. The width of the bridges 228 can vary with the number of bridges. As the number of bridges 228 increases, the width of the bridges 228 can decrease, and vice versa. In this way, the total area of ​​the gap 230 can be maintained at a desired value. For example, during processing, the edge ring 204 is lifted by and supported on the moving ring 232. In some embodiments, all bridges 228 have the same width (or substantially the same width). In some embodiments, a subset of bridges 228 has a different width than another subset of bridges 228. A subset of bridges may include one or more bridges.

[0093] exist Figure 2F A plan view of the moving ring 232 is shown. The raised portion 234 of the moving ring 232 extends through the gap 230 to contact the edge ring 204. For example, the upper surface of the moving ring 232 includes a plurality of raised portions 234 alternating with grooves or recesses 236. Figures 2A-2C is when the moving ring is in the lowered position ( Figure 2A and Figure 2B middle) and raised position ( Figure 2C ) is a cross-sectional view taken at the location of one of the raised portions 234, so that the groove 236 is not visible in 2A-2C.

[0094] Thus, edge ring 204 is capacitively coupled to moving ring 232. Since the size of gap 230 determines the contact surface area between edge ring 204 and moving ring 232, the width of bridge 228 and the corresponding size of gap 230 are selected to maximize the capacitive coupling between edge ring 204 and moving ring 232. In other words, as the total area of ​​bridge 228 increases, the total area of ​​raised portion 234 decreases, and the total contact surface area between the bottom surface of edge ring 204 and raised portion 234 decreases.

[0095] Conversely, as the total area of ​​the bridge 228 decreases, the total area of ​​the raised portion 234 increases, and the total contact surface area between the raised portion 234 and the bottom surface of the edge ring 204 increases. However, as the total area (and corresponding width) of the bridge 228 decreases, the mechanical stability, strength, etc. of the bridge 228 decreases. Therefore, the total area of ​​the bridge 228 and the corresponding width are selected to maximize the capacitive coupling between the edge ring 204 and the moving ring 232, while also maintaining the mechanical strength of the bridge 228 during the service life of the edge ring system 200.

[0096] In some embodiments, the contact area of ​​the moving ring 232 (i.e., the total area of ​​the raised portions 234) contacts about 72-76% of the bottom surface of the edge ring 204. In some embodiments, the contact area is about 74%-75% of the bottom surface of the edge ring 204. Conversely, the portion of the bottom surface of the edge ring 204 that does not contact the raised portions 234 overlaps the bridge 228. In some embodiments, approximately 24-28% of the edge ring 204 overlaps the bridge 228. In some embodiments, the surface area of ​​the edge ring 204 that overlaps the bridge is about 25-26%. In these embodiments, the range ratio of contact / overlap area allows for sufficient bridge surface area to achieve stable robotic transfer while maximizing the surface contact area of ​​the bottom surface of the edge ring 204 to achieve coupling strength.

[0097] In some embodiments, the robot transfer module is configured to contact a portion of the bridge 228 when transferring the edge ring assembly (including the edge ring 204 and the intermediate ring 208). In some embodiments, the intermediate ring is configured with fewer bridges (e.g., Figure 2E Less than 6 bridges are shown, but more than 2 bridges are shown), so that the contact surface percentage of the moving ring 232 with the bottom surface of the edge ring 204 will increase by more than 76%. However, regardless of the number of bridges, the bridges are designed to be mechanically stable and support the inner and outer parts of the intermediate ring at the end of the service life.

[0098] In one embodiment, one or more lugs or ridges 238 may extend radially outward from the outer periphery of the moving ring 232. The ridges 238 are aligned with corresponding lift pins ( Figures 2A-2F 204) is aligned with the lifting pins, which extend upward outside the outer periphery of the moving ring 232. In this way, the lifting pins raise and lower the moving ring 232, which in turn raises and lowers the edge ring 204.

[0099] like Figures 2A-2C As shown, the inner ring portion 224 has a generally "L" shaped cross-section. For example, the inner ring portion 224 has a protrusion 240 that extends radially outward toward the outer ring portion 220. In contrast, the inner diameter of the lower surface 216 of the edge ring 204 has a flange 242 that extends downward toward the protrusion 240. During transport, the flange 242 may contact the protrusion 240. In other words, the edge ring 204 may be at least partially supported on the inner ring portion 224 during transport. The edge ring 204 as shown is fully supported within the inner diameter and outer diameter of the intermediate ring 208. In an embodiment, the edge ring 204 is partially supported on the protrusion 240, the intermediate ring 208 (e.g., the chamfer 222), or on both the protrusion 240 and the intermediate ring 208. In one embodiment, the edge ring 204 is supported only on the protrusion 240.

[0100] In some embodiments, one or both of chamfers 218 and 222 may be omitted. For example, inner ring portion 224 and flange 242 may be configured to provide a centering function. In other words, as shown, the engagement between inner ring portion 224 and flange 242 prevents lateral movement of edge ring 204 relative to middle ring 208. Figure 2C In the raised position shown, the flange 242 extends downwardly below the plane defined by the upper end of the inner ring portion 224. In other words, the interface 244 between the edge ring 204 and the inner ring portion 224, the bridge 228, and the moving ring 232 define a serpentine path. Thus, a direct line of sight between the plasma volume above the edge ring system 200 and the lower surface of the flange 242, the protruding portion 240, the bridge 228, and the inner diameter of the moving ring 232 is interrupted. In addition to protecting portions of the intermediate ring 208 and the moving ring 232 from direct exposure to the processing environment, the flange 242 also improves capacitive coupling between the edge ring 204 and the moving ring 232.

[0101] In an embodiment, the thickness or height H1 of the edge ring 204 at the inner diameter (i.e., at a position corresponding to the flange 242) is 3.0 mm to 4.0 mm. In one embodiment, the height H1 is about 3.5 mm (e.g., within + / - 5%). The thickness or height H2 of the edge ring 204 at a position radially outside the flange 242 is 2.0 mm to 2.5 mm. In one embodiment, the height H2 is about 2.2 mm (e.g., within + / - 5%). In one embodiment, H2 is about 62% of H1 (e.g., within + / - 5%). The maximum thickness or height H3 of the intermediate ring is between 7.0 mm and 8.0 mm. In one embodiment, the height H3 is about 7.5 mm (e.g., within + / - 5%) and is greater than twice H1. In one embodiment, the height H3 is about 210% of H1 (e.g., within + / - 5%).

[0102] In some embodiments, the intermediate ring 208 and / or the bottom ring 212 include one or more centering features or alignment features. As shown, an annular groove 250 is defined in the lower surface of the intermediate ring 208, and an annular flange 252 extends upward from the upper surface of the bottom ring 212. The annular groove 250 is constructed to receive the annular flange 252 when the intermediate ring 208 is lowered onto the bottom ring 212. The annular groove 250 and the annular flange 252 form a serpentine path between the intermediate ring 208 and the bottom ring 212 and interrupt the direct line of sight. In this way, plasma and other process materials are prevented from penetrating between the intermediate ring 208 and the bottom ring 212.

[0103] In some embodiments, the outer diameter of the intermediate ring 208 includes a protrusion 254 extending radially outward from the intermediate ring 208. The protrusion 254 is configured to extend over one or more other structures of the processing chamber (e.g., an upper end of a chamber liner, not shown) to protect these structures from erosion caused by exposure to the plasma.

[0104] In one embodiment, the bottom ring 212 is configured to surround a moving ring 232, which in turn surrounds the ESC (e.g., substrate support 124). The moving ring 232 can be supported on the substrate support 124. In one embodiment, raised portions 234 on the upper surface of the moving ring 232 are aligned with the gaps 230 between the bridges 228 of the middle ring 208. Conversely, the grooves 236 between the raised portions 234 are aligned with the bridges 228. Thus, when the moving ring 232 is raised, the raised portions 234 pass through the gaps 230 to contact the edge ring 204. In this way, when centered, the edge ring 204 is supported within the inner and outer diameters of the middle ring 208, while still being movable (i.e., configured to be raised and lowered) by the moving ring 232 located below the middle ring 208.

[0105] Additionally, when edge ring 204 is in a raised position during processing (eg, Figure 2C 222), edge ring 204 can be periodically (e.g., between processes or handling steps) re-centered by lowering mobile ring portion 232-1 so that chamfer 218 contacts chamfer 222. In some embodiments, intermediate ring 208 can alternatively be raised so that chamfer 222 contacts chamfer 218. In either example, contact between chamfers 218 and 222 (and / or between protrusion 240 and flange 242) forces edge ring 204 into a centered, concentric position relative to intermediate ring 208.

[0106] Figure 3A and 3B A first and second cross-sectional view of an edge ring system 300 including an edge ring 304, an intermediate ring 308, a bottom ring 312, and a moving ring assembly 316 are shown. The moving ring assembly 316 includes a moving ring portion 316-1 and a stationary ring portion 316-2 (collectively referred to as the moving ring assembly 316). The stationary ring portion 316-2 is supported on the outer ring portion of the ESC 320. Figure 3A Lift pins 324 are shown extending through the ESC 320 to engage the moving ring portion 316 - 1 . Figure 3A 3 is a cross-sectional view of edge ring system 300 taken at a location of lift pins 324. For example, lift pins 324 engage ridges 326 extending radially outward from the outer periphery of moving ring portion 316-1. Thus, moving ring portion 316-1 is raised and lowered by raising and lowering lift pins 324.

[0107] For example, a controller (e.g., system controller 172) is configured to control the actuator to raise and lower the lift pins 324, thereby raising and lowering the moving ring portion 316-1, which in turn raises and lowers the edge ring 304. During processing, the moving ring portion 316-1 can be raised to raise the edge ring 304 to a desired height. In some embodiments, the position of the edge ring 304 can be adjusted during processing, between processing steps, etc. to fine-tune processing performance. Conversely, the moving ring portion 316-1 is lowered to lower the edge ring 304 to re-center the edge ring 304, as described above, or to place the edge ring 304 on the intermediate ring 308 for transport, etc.

[0108] Similarly, the lift pin 328, such as Figure 3B (eg, a cross-sectional view taken at the location of lift pins 328 ), extending through bottom ring 312 to engage intermediate ring 308 . Figure 3B 3 is a cross-sectional view of the edge ring system 300 taken at the location of the lift pins 328. The system controller 172 is configured to control the actuator to raise and lower the lift pins 328, thereby raising and lowering the intermediate ring 308. For example, the intermediate ring 308 can be raised together with the edge ring 304 to facilitate removal of the intermediate ring 308 and the edge ring 304 by a robot.

[0109] Reference now Figure 4A and Figure 4B The edge ring system 400 is arranged around a substrate support including a bottom plate 410 and a top plate 412. During processing, a substrate 414 is arranged on the top plate 412. The stationary ring 420 is arranged radially outside the bottom plate 410 and arranged on and above the radially outwardly extending lower protrusion 413 of the bottom plate 410. The stationary ring 420 includes an annular body and a radially inward protrusion 424.

[0110] The bottom edge ring 430 includes an annular body disposed radially outward of and extending below the stationary ring 420. The bottom edge ring 430 includes a radially inward annular flange 432 extending from an upper surface of the annular body of the bottom edge ring 430. The bottom edge ring 430 includes an annular flange 434 extending upward from an upper surface of the annular body of the bottom edge ring 430. In some examples, the stationary ring 420 is disposed about the bottom plate 410 before the bottom edge ring 430 is installed. The lower surface of the radially inward annular flange 432 rests on and contacts the upper surface of the stationary ring 420 when installed.

[0111] The intermediate ring 440 includes an annular body having an outer ring portion 442 and an inner ring portion 444. The bottom surface of the outer ring portion 442 includes an annular groove 446, which is configured to receive and abut against the annular flange 434. The annular groove 446 and the annular flange 434 define a tortuous path. The tortuous path reduces arcing by preventing a direct line of sight between the plasma and the conductive components of the bottom plate. The tortuous path can also reduce the ingress of particles generated when an arc occurs.

[0112] In some examples, an annular cavity 449 is located below the lower radially outer portion of the intermediate ring 440. The radially outer edge 441 of the intermediate ring 440 extends above the radially outer edge 433 of the bottom edge ring 430. The overlap provided by the radially outer edge 441 reduces erosion of the bottom edge ring 430, thereby reducing particle generation and wear of the bottom edge ring. The annular cavity 449 reduces the vertical height of the intermediate ring 440 to allow clearance for other equipment in the process chamber located radially outward of the intermediate ring 440 and the bottom edge ring 430.

[0113] The outer ring portion 442 defines an annular cavity 447 on its upper radial inner surface to receive the cover ring 470, as will be further described below. The outer ring portion 442 includes a radial protrusion 448, which extends radially inward and is connected to the inner ring portion 444 by a bridge, as will be further described below. In some examples, the inner ring portion 444 has an "L" shaped cross section.

[0114] The top edge ring 450 is arranged above the moving ring 460. In some examples, the top edge ring 450 includes an annular body and has a "C"-shaped cross section. The top edge ring 450 defines a cavity 456 on its bottom surface between an outer annular protrusion 452 and an inner annular protrusion 454 extending toward the moving ring 460 in an axial or downward direction. At this radial position, the moving ring 460 has a "T"-shaped cross section. The moving ring 460 includes one or more (N) upper portions 462 having an arc shape and a lower annular portion 464, where N is an integer greater than zero. The N upper portions 462 are located between the inner ring portion 444 of the intermediate ring 440 and the radial protrusion 448 of the intermediate ring 440 and are located below and / or inside the cavity 456 of the top edge ring 450.

[0115] The cover ring 470 is disposed above the radial protrusion 448 of the intermediate ring 440 and between the top edge ring 450 and the radial inner surface of the outer ring portion 442 of the intermediate ring (e.g., in the annular cavity 447 of the intermediate ring 440). In some examples, the cover ring 470 has an inverted "L" shaped cross-section. In some examples, the radial inner surface 472 of the cover ring 470 is positioned along the same vertical plane (when viewed from the top) as the radial outer edges of the N upper portions 462 of the moving ring or is positioned radially inward of the radial outer edges of the N upper portions 462 of the moving ring to prevent a direct line of sight to the plasma. The arcuate surface 476 is disposed below the radial inner surface 472 of the cover ring 470. In some examples, the arcuate surface 458 at the upper radial outer surface of the top edge ring 450 has a curvature similar to that of the arcuate surface 458 of the top edge ring 450 to allow the top edge ring 450 to move upward relative to the cover ring 470 below the radial inner surface 472. In some examples, arcuate surface 476 reduces / eliminates the possibility of arcing between arcuate surface 458 and cover ring 470 .

[0116] exist Figure 4A , the top edge ring 450 and the moving ring 460 are shown in a lowered position. Figure 4B , the top edge ring 450 and the moving ring 460 are shown in a raised position. The arcuate surface 458 of the top edge ring 450 is nested inside the arcuate surface 476 of the cover ring 470.

[0117] In some examples, the bottom surface of the stationary ring 420 rests on the lower protrusion 413 of the bottom plate 410. The bottom surface of the radially inward annular flange 432 of the bottom edge ring 430 rests on the upper surface of the stationary ring 420. A gap is defined between the bottom surface of the intermediate ring 440 and the upper surface of the bottom edge ring 430. The bottom surface of the top edge ring 450 rests on the N upper portions 462 of the moving ring 460. The top edge ring 450 is spaced apart from the intermediate ring 440. The bottom surface of the inner ring portion 444 rests on the top plate 412.

[0118] Reference now Figure 5A and 5B , the edge ring system 400 is shown in another radial cross-section. The bottom edge ring 430 includes a hole 510 extending vertically through the annular body of the bottom edge ring 430 and a lift pin 512 disposed in the hole 510. The bottom surface of the outer ring portion 442 of the intermediate ring 440 includes an alignment portion 518 aligned with the lift pin 512. In some embodiments, the alignment portion 518 is positioned in the bottom surface of the intermediate ring 440 and radially inward of the annular groove 446. In some examples, the alignment portion 518 includes a planar surface 521 extending in a radial direction between reverse inclined surfaces 519 to self-center the intermediate ring 440.

[0119] exist Figure 5B , an actuator (not shown) selectively biases lift pins 512 into alignment portions 518 to raise the intermediate ring 440, the top edge ring 450, and the cover ring 470, thereby allowing the intermediate ring 440, the top edge ring 450, and the cover ring 470 to be transported or replaced. The intermediate ring 440, the top edge ring 450, and the cover ring 470 can be moved to or from the processing chamber using a robot without opening the processing chamber. The robot arm can lift all three rings from the bottom surface of the intermediate ring 440 and transfer (move in or out) all three rings simultaneously. Figure 5B The stacked relationship shown prevents excessive lateral movement of the top edge ring 450 and the cover ring 470, which could cause the rings to fall during transport. This configuration reduces the time required to replace the ring assembly (e.g., compared to transporting the individual rings one by one) while allowing all three rings to be properly aligned when installed. In some examples, the intermediate ring 440, the top edge ring 450, and the cover ring 470 withstand more than 500 RF hours between replacements. In some examples, the intermediate ring 440, the top edge ring 450, and the cover ring 470 withstand more than 1000 RF hours between replacements.

[0120] refer to Fig. 6A and 6B , shows the edge ring system 400 in other radial cross-sections. Fig. 6A , one of the N bridges 480 of the intermediate ring 440 is shown. The intermediate ring 440 includes N bridges 480 extending between the outer ring portion 442 and the inner ring portion 444. The N bridges 480 include axial protrusions 482 extending upwardly in the axial direction from the N bridges 480. In some examples, the axial protrusions 482 are received in the cavity 456 of the top edge ring 450 and facilitate alignment between the top edge ring 450 and the intermediate ring 440. A gap 483 is defined between the top surface of the axial protrusion 482 and the bottom surface of the top edge ring 450. The gap 483 ensures that the top edge ring 450 rests on the N upper portions 462 of the moving ring 460. This ensures that there is electrical contact between the bottom surface of the top edge ring 450 and the top surface of the N upper portions 462 of the moving ring 460. In some examples, the moving ring 460 is made of quartz and is not electrically conductive. The axial protrusions 482 fill the open space in this area to reduce stray plasma.

[0121] exist Figure 6B In the embodiment, the moving ring 460 includes gaps between N upper portions 462 (hereinafter referred to as Fig. 10A and Fig. 10B460 and does not include any of the N upper portions 462. The moving ring 460 biases the top edge ring 450 vertically upward and downward. The lower annular portion 464 of the moving ring 460 moves toward the N bridges 480 and reduces the gap. In some embodiments, some or all of the N bridges 480 do not include the axial protrusion 482.

[0122] Reference now Fig. 7A and 7B , showing the edge ring system 400 in another radial cross-section. The moving ring 460 includes a protrusion 550 extending radially outward. A self-centering feature (e.g., a groove 560) is disposed on a lower surface of the protrusion 550. In some examples, the groove 560 extends in a radial direction to allow the moving ring 460 to self-align. The radially outward protrusion 413 of the base plate 410 defines a vertical hole 574, and the radially inward protrusion 424 of the stationary ring 420 defines a hole 576 to receive the lifting pin 572. In this radial cross-section, the stationary ring 420 defines a cavity to receive the protrusion 550 of the moving ring 460, as will be further described below. In Figure 7B , lift pins 572 are biased by an actuator (not shown) into grooves 560 to lift and / or center moving ring 460 and top edge ring 450 .

[0123] Reference now Fig. 8A and 8B , showing the intermediate ring 440 in more detail. Fig. 8A A top view of the middle ring 440 is shown without other rings. The outer ring portion 442 of the middle ring 440 is connected to the inner ring portion 444 by N bridges 480. In some examples, one or more of the N bridges 480 define a protrusion 616 (or Fig. 9C 617 in the N bridges 480), which extend radially outward (inward) from the radially outer side of one or more of the N bridges 480. In some examples, the protrusion 616 and / or the groove 617 are mating surfaces, such as semicircular or rounded triangular convex and concave surfaces.

[0124] In some examples, only one of the N bridges 480 includes a protrusion 616 or a groove 617. When assembled with the other rings, the top edge ring 450 and the cover ring 470 are disposed between the outer ring portion 442 and the inner ring portion 444 of the middle ring 440. Figure 8B A bottom view of the intermediate ring 440 is shown. Figure 8B In the embodiment, the bottom surface of the intermediate ring 440 includes one or more grooves 630 to receive one or more lifting pins (e.g. Figure 5B One or more grooves 630 are located radially inward of the annular groove 446. In some examples, the groove 630 is a "V" shaped groove having opposing inner surfaces aligned in a radial direction to self-center the intermediate ring 440.

[0125] Reference now 9A to 9D , the top edge ring 450 is angularly positioned or clocked relative to the middle ring 440 during processing. Fig. 9B In the embodiment, the bottom surface of the top edge ring 450 includes a groove 650 (or grooves) extending radially outward (inward) on the radial inner edge of the outer annular protrusion 452. Fig.9D The convex portion 651). exist Fig. 9A , the convex portion 616 (or Fig. 9C The top edge ring 450 is formed by a plurality of grooves 617 in the top edge ring 450 and a plurality of grooves 617 in the top edge ring 450. The grooves 617 in the top edge ring 450 are received in the grooves 650 (or protrusions 651) on the bottom surface of the top edge ring 450 to properly orient the top edge ring 450 relative to the rotational position of the intermediate ring 440. The top edge ring 450 is also angularly positioned relative to a ring identification mark 653, such as a QR code, a radio frequency identification (RFID) code, a bar code, etc. The operation of controlling the rotational position of the top edge ring 450 relative to the ring identification mark 653 ensures that the thickness measurement is consistently taken at the same position around the top edge ring 450 relative to the processing chamber to allow consistent measurement and / or diagnosis of process problems.

[0126] exist Fig. 9A In the embodiment, the intermediate ring 440 includes N arc-shaped openings 610 to accommodate the N upper portions 462 of the movable ring 460, as shown below Fig. 10A and 10B In some examples, N is equal to 6 and / or the N arc-shaped openings have rounded ends. When the N upper portions 462 of the moving ring 460 move up and down relative to the middle ring 440, the rounded ends 463 of the N arc-shaped openings 610 reduce the chance of interference.

[0127] exist Fig.9E , the top edge ring 450 and the intermediate ring 440 are shown in a radial cross-section away from the groove 650 on the top edge ring 450 and the protrusion 616 on the intermediate ring 440. Fig.9F A radial cross section is shown through the protrusion 616 on the intermediate ring 440 and the groove 650 on the top edge ring 450. The combined width of the axial protrusion 482 and the protrusion 616 creates a higher local radial width due to the protrusion 616. The top edge ring 450 creates a locally thinner radial width due to the groove 650.

[0128] As can be appreciated, the intermediate ring 440 can include a groove and the top edge ring 450 can include a protrusion. Although the groove 650 is disposed on the radially inner surface of the outer annular protrusion 452 of the top edge ring 450, the groove (or protrusion) can be disposed on the radially outer surface of the inner annular protrusion 454. Similarly, although the protrusion (or groove) is shown on the radially outer edge of the N bridges 480, the protrusion can be disposed on the radially inner edge of the N bridges 480.

[0129] Reference now Fig. 10A and 10B , showing the moving ring 460 in more detail. In some examples, the moving ring 460 includes spaced apart protrusions 550, where the number of protrusions 550 can be represented by "P", and P is an integer greater than 2. In some examples, such as Fig. 10A As shown, the protrusions 550 (eg, P=3) (and the grooves 560) are spaced apart at 360° / P (eg, 120°) to provide a rotational position when the moving ring 460 is biased by the lifting pins 572 (eg, Figure 7B The movable ring 460 is self-centered and / or evenly supports the weight of the movable ring 460 to adjust the height of the top edge ring 450 during operation. Similarly, the protrusions 670 (and holes 672) are spaced 360° / P (where P is the number of protrusions 670) to evenly support the movable ring 460 on the frame during coating.

[0130] In some examples, the protrusion 550 has a "V" shaped cross section extending from the radially outer side of the moving ring 460. The groove 560 is arranged on the bottom surface of the protrusion 550. In some examples, the groove 560 has a "V" shape having oppositely inclined surfaces aligned in the radial direction.

[0131] The grooves 560 on the protrusions 550 enable the moving ring 460 to self-center when it is moved vertically by the lift pins 572. The self-centering feature ensures that the moving ring 460 and the top edge ring 450 are centered relative to the bottom plate 410 and the substrate 414 when they are moved. In some examples, the lift pins 572 cycle up and down to self-center the moving ring 460. In some examples, the N upper portions 462 are arc-shaped with rounded ends. The rounded ends of the N upper portions 462 reduce the possibility of sticking relative to the intermediate ring 440 when the moving ring 460 is moved up and down. A gap 656 is located between adjacent ones of the N upper portions 462 of the moving ring 460.

[0132] In some examples, the radially outer surface of the moving ring 460 includes a protrusion 670 and a hole 672, which extends from the top surface of the moving ring 460 (for example, in some of the N upper portions 462) through the protrusion 670 to the bottom surface of the moving ring 460. In some examples, the hole 672 is used to mount the moving ring 460 on the frame during coating of the moving ring 460 during manufacturing and before use. In other words, during coating of the moving ring 460, the hole 672 receives a pin or another type of fastener to position and hold the moving ring 460 on the frame while minimizing the outer surface area of ​​the moving ring 460 that would be blocked during coating if the hole 672 did not exist. In some examples, after coating of the moving ring 460 is completed, the hole 672 is filled with a plug (such as Fig.10F In some embodiments, the moving ring 460 does not have the holes 672 and coating can be accomplished using conventional methods.

[0133] In some examples, the additional material used in protrusions 550 and 670 increases the structural strength of the ring relative to a moving ring 460 that does not include protrusions 550 and 670 to withstand lifting weight, thermal cycling, and / or breakage during installation or use.

[0134] Reference now Figures 10C to 10F , showing the Fig. 10A The following are cross-sectional views of examples of the moving ring 460 taken at various cross-sectional views. Fig. 10C In, along Fig. 10A The section line 10C-10C in FIG. 4 shows the moving ring 460. In this position, the moving ring 460 has a "T"-shaped cross-section, including one of the N upper portions 462 and an annular portion 464 extending from the one of the N upper portions 462.

[0135] exist Fig. 10D In, along Fig. 10A The section line 10D-10D in FIG. 4 shows the moving ring 460. At this section, the moving ring 460 has an "I"-shaped cross section including an annular portion 464.

[0136] exist Fig.10E In, along Fig. 10A The section line 10E-10E in FIG. 4 shows the moving ring 460. In this section, the moving ring 460 includes one of the N upper portions 462, an annular portion 464 extending from the one of the N upper portions 462, and a protrusion 550 extending radially outward from the annular portion 464. The bottom-facing portion 465 at the protrusion 550 defines a groove 560, which includes reversely inclined planes extending in the radial direction.

[0137] exist Fig.10F ,along Fig. 10AThe section line 10F-10F in FIG. 4 shows the moving ring 460. The moving ring 460 includes one of the N upper portions 462 and an annular portion 464 extending from the one of the N upper portions 462. The protrusion 670 extends radially outward from the annular portion 464. The hole 672 extends through the moving ring 460 and is used to position the moving ring 460 on the frame during coating. In some examples, the first fastener 675 and the second fastener 677 are arranged in the hole 672. The ends of the first fastener 675 and the second fastener 677 include mating threaded ends 679 and 681, respectively, connecting the first fastener 675 and the second fastener 677 in the hole 672. The upper radial outer portion of the head 683 of the first fastener 675 is shown as including an annular cavity 685 to receive an "O" ring 679 to prevent the ingress of arcs and / or particles.

[0138] Reference now Figure 10G , shows a top perspective view of an example of an adjacent pair of the N upper portions 462 of the moving ring 460. In some examples, the circumferentially facing ends 490 of the N upper portions 462 are rounded to reduce the likelihood of sticking when the moving ring 460 is raised and lowered and the N upper portions 462 pass through the N arc-shaped openings 610 in the intermediate ring 440. In some examples, the edges 492 of the N upper portions 462 and the edges 494 in the gaps 656 of the moving ring 460 are chamfered to reduce the likelihood of sticking.

[0139] Reference now Fig. 10H , a bottom perspective view of an example of a moving ring 460 is shown at the protrusion 550. In some examples, the groove 560 is "V" shaped and includes a reverse sloped surface 563 extending in a radial direction across the bottom surface 561 of the moving ring 460 to assist in self-centering the moving ring 460 as the moving ring 460 is raised and lowered. In some examples, the edge 565 is chamfered to reduce the possibility of sticking.

[0140] Reference now Fig.11A and Fig. 11B, the stationary ring 420 includes a first cavity 710 configured to provide clearance for the protrusion 550 of the moving ring 460. In some examples, the stationary ring 420 also includes a second cavity 720 configured to provide clearance for the protrusion 670 of the moving ring 460. In some examples, the first cavity 710 and the second cavity 720 are "V" shaped. In some examples, the second cavity 720 is spaced at intervals of 120° and is approximately centered between the two in the first cavity 710. The first cavity 710 and the second cavity 720 are spaced 120° apart to match the spacing of the protrusions 550 and 670 of the moving ring 460 and provide clearance for the protrusions 550 and 670, and the moving ring 460 moves in the axial direction when the top edge ring 450 is biased. In some examples, there are three first cavities 710 and three second cavities 720, and at least one of the three first cavities 710 is approximately 60° from one of the three second cavities 720. In an example, each of the three first cavities 710 is approximately 60° away from one of the three second cavities 720. Evenly distributing the first cavities 710 and / or the second cavities 720 around the circumference improves even weight distribution of the ring.

[0141] In some examples, the stationary ring 420 further includes one or more holes 680 extending into the annular body in an axial direction from a bottom surface of the stationary ring 420. The one or more holes 680 may be used to position the stationary ring 420 on a frame during coating of the stationary ring 420.

[0142] Reference now FIG. 11C to FIG. 11F , showing along Fig.11A and 11B The various cross-sectional views of the stationary ring 420 are shown. Fig. 11C In, along Fig.11A The section line 11C-11C in FIG. 4 shows the stationary ring 420. The stationary ring 420 includes an annular body 421 and a radially inward protrusion 424 extending from a side surface 721 of the annular body 421 at a lower edge of the annular body 421.

[0143] exist Fig.11D In, along Fig.11A The section line 11D-11D in FIG. 1 shows the stationary ring 420. The stationary ring 420 includes an annular body 421, which extends radially outward into the first cavity 710 in the side surface 721 of the stationary ring 420, so that the annular body 421 is connected to the first cavity 710 in the side surface 721 of the stationary ring 420. Fig. 11C In some examples, the first cavity 710 has a rounded "V" shape. Due to the first cavity 710, the radially inward protrusion 424 and the Fig. 11C The hole 576 is formed vertically through the radially inward protrusion 424 to allow the lifting pin 572 to pass through the stationary ring 420 ( Figure 7B ).

[0144] exist Fig.11E In, along Fig.11A The section line 11E-11E in FIG. 4 shows the stationary ring 420. The stationary ring 420 includes an annular body 421, which is larger than the stationary ring 420 due to the second cavity 720 extending radially outward into the side surface 721 of the stationary ring 420. Fig. 11C In some examples, the second cavity 720 has a rounded "V" shape. Due to the second cavity 720, the radially inward protrusion 424 further extends from the annular body 421 at this position (with the Fig. 11C compared to).

[0145] exist Fig.11F In the embodiment of the present invention, the stationary ring 420 includes a hole 680 extending into the bottom surface of the ring body 421 to allow the stationary ring 420 to be supported on the frame during coating of the stationary ring 420. After coating is completed, the hole 680 can be filled with a plug 425 or other filler (such as a threaded fastener). In some examples, the hole 680 is not required, so that Fig.11F There will be a solid annular body 420 without the hole 680.

[0146] Reference now Fig.11G , showing a top perspective view of the first cavity 710 of the stationary ring 420. The radial depth of the first cavity 710 provides clearance for the protrusion 550 of the moving ring 460. In some examples, one or more of the edges 713, 715, and 719 between the top surface 711 and the side surface 721, between the side surface 721 and the lower surface 717, and between the lower surface 717 and the bottom surface 723, respectively, are chamfered to reduce the possibility of sticking when installing and removing the stationary ring 420.

[0147] Reference now Fig.11H , showing a top perspective view of the second cavity 720 of the stationary ring 420. The radial depth of the second cavity 720 provides clearance for the protrusion 670 of the moving ring 460. In some examples, the radial depth of the first cavity 710 is greater than the radial depth of the second cavity 720. In some examples, the edge 725 is chamfered to reduce the possibility of sticking during installation and removal.

[0148] Reference now Fig. 12A and Fig. 12B, the bottom edge ring 430 includes recesses 750 and 752 in the annular flange 434, which are configured to provide clearance for the protrusions 550 and 670 of the moving ring 460. In some examples, the location of the recesses 750 and / or 752 is different from that depicted, depending on the clearance space required for the moving ring 460. In some examples, the recesses 750 and 752 are "V" shaped to match the shape of the protrusions 550 and 670. In some examples, the recesses 752 are spaced at 120° intervals and are approximately centered between the recesses 750 to match the spacing of the protrusions 550 and 670. In some examples, the bottom edge ring 430 also includes one or more holes 770 extending from the bottom surface of the bottom edge ring 430 into the annular body 431 in an axial direction. The one or more holes 770 can be used to position the bottom edge ring 430 on the frame during coating of the bottom edge ring 430. In some examples, the bottom edge ring 430 does not have the one or more holes 770.

[0149] Reference now Figures 12C to 12F , which displays along Fig. 12A and 12B 4. Cross-sectional views of examples of the bottom edge ring 430 taken at various cross-sectional views are shown. Fig. 12C In, along Fig. 12A The section line 12C-12C in FIG. 4 shows the bottom edge ring 430. The bottom edge ring 430 includes an annular body 431 and an inward annular flange 432. Due to the absence of recesses 750 and 752, the inward annular flange 432 is the widest (measured in the horizontal direction) at this location.

[0150] exist Fig.12D In, along Fig. 12A The section line 12D-12D in FIG. 4 shows the bottom edge ring 430. The bottom edge ring 430 includes an annular body 431 and an inward annular flange 432. Due to the recess 752, the inward annular flange 432 at this location has a medium width (similar to the width of FIG. 4 ). Fig. 12C and 12E compared to the inward annular flange 432 in FIG. 4 ).

[0151] exist Fig.12E In, along Fig. 12A The section line 12E-12E in FIG. 12A shows the bottom edge ring 430. The bottom edge ring 430 includes an annular body 431 and an inward annular flange 432. Due to the recess 750, the inward annular flange 432 has a narrower width at this position (compared to the width of FIG. 12A). Fig. 12C and 12D compared to).

[0152] exist Fig.12F In the display, along Fig. 12BThe bottom edge ring 430 of the section line 12F-12F in FIG. Hole 770 is used for the bracket and can be filled with plug 771 or other filler (such as a fastener) after coating. In some examples, hole 770 is not required, so that Fig.12F There will be a solid annular body 430 without the hole 770.

[0153] In some examples, the top edge ring 450 is made of silicon carbide or other plasma resistant materials. In some examples, the cover ring 470 and the intermediate ring 440 are made of quartz or other plasma resistant materials. In some examples, the moving ring 460 includes a silicon substrate with an aluminum electroplating layer. In some examples, the stationary ring 420 is made of a silicon substrate with a coating such as a perfluoroalkoxyalkane (PFA) coating or an aluminum electroplating layer.

[0154] In some examples, the top edge ring 450, the cover ring 470, and the intermediate ring 440 can be removed from the process chamber without opening the process chamber. In some examples, the top edge ring 450, the cover ring 470, and the intermediate ring 440 can withstand greater than 500 RF hours or 1000 RF hours before replacement is required. The remaining rings including the stationary ring 420, the mobile ring 460, and the bottom edge ring 430 are less exposed to the plasma and can last longer. In some examples, the stationary ring 420, the mobile ring 460, and the bottom edge ring 430 have a mean time between cleaning (MBTC) greater than or equal to 1 year.

[0155] The foregoing description is merely illustrative in nature and is by no means intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because when studying the drawings, the specification and the appended claims, other modifications will become apparent. It should be understood that, without changing the principles of the present disclosure, one or more steps in the method can be performed in different orders (or simultaneously). In addition, although each embodiment is described above as having certain features, any one or more of those features described relative to any embodiment of the present disclosure can be implemented in the features of any other embodiment and / or combined with the features of any other embodiment, even if the combination is not clearly described. In other words, the described embodiments are not mutually exclusive, and the replacement of one or more embodiments with each other remains within the scope of the present disclosure.

[0156] Various terms are used to describe the spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless the relationship between a first and a second element is explicitly described as "direct," when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intervening elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intervening elements (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C), using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C."

[0157] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operation before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or the type of system, the controller can be programmed to control any process disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out tools and other transfer tools and / or load locks connected or docked with a specific system.

[0158] Broadly speaking, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuit can include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing a specific process on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the manufacture of one or more (kinds of) layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0159] In some implementations, the controller may be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a wafer fab host system that may allow remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, check the history of past manufacturing operations, check trends or performance criteria for multiple manufacturing operations, change parameters of a current process, set processing steps to follow the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose, such as the processes and controls described herein. An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control the process on the chamber.

[0160] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0161] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. An edge ring system for a substrate processing chamber, comprising: an intermediate ring comprising an outer ring portion and an inner ring portion; and an edge ring configured to be supported on the intermediate ring and between the outer ring portion and the inner ring portion, wherein an outer diameter of a lower surface of the edge ring has a first chamfer defining a downwardly and outwardly facing chamfered surface, wherein the inner diameter of the outer ring portion has a second chamfer defining an upwardly and inwardly facing chamfered surface, and Wherein at least one of the first chamfer and the second chamfer is configured to align the edge ring within the outer ring portion and the inner ring portion of the intermediate ring.

2. The edge ring system of claim 1, wherein the intermediate ring is further configured to align the edge ring with the moving ring such that the edge ring is centered relative to a substrate being processed in the substrate processing chamber.

3. The edge ring system of claim 1 , wherein the inner ring portion of the intermediate ring is generally “L” shaped and has a protrusion extending radially outward toward the outer ring portion. 4 . The edge ring system of claim 3 , wherein the edge ring is configured to be at least partially supported on the protruding portion of the inner ring portion.

5. The edge ring system of claim 4, wherein the edge ring includes a flange extending downwardly from the lower surface at an inner diameter of the edge ring, and wherein the flange is configured to be supported on the protruding portion of the inner ring portion.

6. The edge ring system of claim 4, wherein the inner ring portion is configured to force the edge ring into a centered position relative to the middle ring.

7. The edge ring system of claim 4, wherein an interface between the edge ring and the inner ring portion defines a serpentine path.

8. The edge ring system of claim 1, wherein the edge ring is fully supported within the inner and outer diameters of the intermediate ring.

9. The edge ring system of claim 1 wherein the middle ring comprises a plurality of bridges connecting the inner ring portion to the outer ring portion.

10. The edge ring system of claim 9 wherein said middle ring comprises six of said bridges.

11. The edge ring system of claim 9, wherein the intermediate ring includes a plurality of gaps defined between the plurality of bridges.

12. The edge ring system of claim 11, further comprising a moving ring configured to be raised and lowered relative to the intermediate ring.

13. The edge ring system of claim 12, wherein the moving ring is configured to contact a lower surface of the edge ring via the plurality of gaps.

14. The edge ring system of claim 13, wherein the moving ring includes a raised portion extending upwardly through the plurality of gaps to contact a lower surface of the edge ring. 15 . The edge ring system of claim 14 , wherein the moving ring comprises a stationary ring portion and a moving ring portion located radially inward of the stationary ring portion, and wherein the moving ring portion is configured to be raised and lowered.

16. The edge ring system of claim 1 wherein a lower surface of the outer ring portion of the intermediate ring comprises an annular groove.

17. The edge ring system of claim 16, further comprising a bottom ring, wherein the intermediate ring is supported on the bottom ring.

18. The edge ring system of claim 17, wherein the base ring includes an annular flange extending upwardly from an upper surface of the base ring into the annular groove.

19. An edge ring system for a substrate processing chamber, comprising: an intermediate ring, comprising an outer ring portion and an inner ring portion; as well as an edge ring supported on the intermediate ring and between the outer ring portion and the inner ring portion, wherein the edge ring is fully supported within the inner and outer diameters of the intermediate ring, and wherein at least one of the outer ring portion and the inner ring portion is configured to force the edge ring into a centered position relative to the intermediate ring; as well as A moving ring is disposed below the intermediate ring, wherein the moving ring is configured to be raised and lowered to contact and selectively raise and lower the edge ring.

20. The edge ring system of claim 19, wherein the intermediate ring comprises: a plurality of bridges connecting the inner ring portion to the outer ring portion; and a plurality of gaps defined between the plurality of bridges, and wherein the moving ring is configured to pass through the plurality of gaps to contact a lower surface of the edge ring.

21. The edge ring system of claim 20, wherein the moving ring includes a raised portion extending upwardly through the plurality of gaps to contact a lower surface of the edge ring.

22. An edge ring for an edge ring system in a substrate processing chamber, comprising: upper surface; lower surface; inner diameter; outer diameter; a chamfer on the lower surface of the edge ring, the chamfer defining a downwardly and outwardly facing chamfer surface at the outer diameter; and A flange extends downwardly from the lower surface at the inner diameter of the edge ring.

23. An intermediate ring for an edge ring system in a substrate processing chamber, comprising: Outer ring part; Inner ring part; a plurality of bridges connecting the inner ring portion to the outer ring portion; a plurality of gaps defined between the plurality of bridges; as well as A chamfer defines an upwardly and inwardly facing chamfer surface at an inner diameter of the outer ring portion.

24. An edge ring system for a substrate processing chamber, comprising: An intermediate ring configured to be disposed around a substrate support and comprising: Outer ring part; Inner ring part; N arc-shaped openings are arranged between the outer ring portion and the inner ring portion, wherein N is an integer greater than 1; N bridges connecting the outer ring portion and the inner ring portion between the N arc-shaped openings; as well as an annular cavity disposed on the radially inner surface of the outer ring portion; as well as a cover ring disposed in the annular cavity; as well as A top edge ring is disposed above the intermediate ring and between the cover ring and the inner ring portion and above the N arc-shaped openings and the N bridges of the intermediate ring.

25. The edge ring system of claim 24, further comprising: a moving ring comprising N upper portions having an arc shape, the N upper portions being configured to be aligned with and pass through the N arc openings, wherein said top edge ring rests on said N upper portions, and The N upper portions of the moving ring are configured to bias the bottom surface of the top edge ring through the N arc-shaped openings of the intermediate ring to lift the top edge ring relative to the cover ring.

26. The edge ring system of claim 25, further comprising: first lift pins configured to selectively lift the moving ring and the top edge ring upward relative to the cover ring and the intermediate ring; and Second lift pins are configured to selectively bias the intermediate ring, the top edge ring, and the cover ring relative to the moving ring.

27. The edge ring system of claim 24, wherein the top edge ring has a "C" shaped cross-section defining an inner annular protrusion extending downwardly and an outer annular protrusion extending downwardly and a cavity disposed between the inner annular protrusion and the outer annular protrusion.

28. The edge ring system of claim 24, wherein the N bridges comprise protrusions extending upward toward a lower surface of the top edge ring.

29. The edge ring system of claim 25, wherein the cover ring has an inverted "L" shaped cross-section.

30. The edge ring system of claim 29, wherein the radially inner side of the cover ring comprises a radially inner surface and an arcuate surface.

31. The edge ring system of claim 30, wherein the radially inner surface of the cover ring is positioned radially inward of a radially outer surface of an upper portion of the moving ring.

32. The edge ring system of claim 30, wherein a radially outer surface of the top edge ring is disposed below and radially outward of the radially inner surface of the cover ring.

33. The edge ring system of claim 30, wherein an upper radially outer edge of the top edge ring has an arcuate shape corresponding to the arcuate surface of the cover ring.

34. The edge ring system of claim 27, wherein: at least one of the N bridges of the intermediate ring includes one of a protrusion and a cavity, and a radially inner edge of the outer annular protrusion of the top edge ring includes the other of the cavity and the protrusion, and The one of the protrusion and the cavity of the at least one of the N bridges of the intermediate ring is received in the other of the cavity and the protrusion on the radially inner edge of the outer annular projection of the top edge ring.

35. The edge ring system of claim 25, further comprising a stationary ring configured to be disposed about the substrate support below the intermediate ring.

36. The edge ring system of claim 35, wherein the stationary ring includes a protrusion extending radially inward from a lower portion of a radial inner surface of the stationary ring, wherein the moving ring is disposed above the protrusion of the stationary ring and radially inward of the stationary ring.

37. The edge ring system of claim 35, wherein the moving ring comprises a first plurality of protrusions extending radially outward from the moving ring.

38. The edge ring system of claim 37, wherein a bottom surface of the first plurality of protrusions comprises a groove comprising an oppositely inclined surface extending in a radial direction.

39. The edge ring system of claim 37, wherein the moving ring comprises: a second plurality of protrusions extending radially outward from the moving ring; and holes extending through the second plurality of protrusions in an axial direction.

40. The edge ring system of claim 35, wherein the stationary ring comprises a first plurality of cavities extending in a radially inward direction from a radially inner surface of the stationary ring and configured to provide clearances for a first plurality of protrusions of the moving ring.

41. The edge ring system of claim 40, wherein the stationary ring comprises a second plurality of cavities extending in a radially inward direction from a radially inner surface of the stationary ring and configured to provide clearances for a second plurality of protrusions of the moving ring.

42. The edge ring system of claim 35, further comprising a bottom edge ring, the bottom edge ring comprising: a first annular flange extending inwardly from a radially inner surface of the bottom edge ring; and an annular body arranged around the stationary ring.

43. The edge ring system of claim 42, wherein the bottom edge ring further comprises a second annular flange extending upwardly from an upper surface of the bottom edge ring.

44. The edge ring system of claim 43, wherein the intermediate ring includes an annular groove configured to receive the second annular flange of the bottom edge ring.

45. The edge ring system of claim 42, wherein a gap is defined between a bottom surface of the intermediate ring and an upper surface of the bottom edge ring.

46. ​​The edge ring system of claim 42 wherein a bottom surface of the first annular flange rests on the stationary ring.

47. The edge ring system of claim 42, wherein the first annular flange comprises: a first plurality of recesses extending in a radially inward direction to provide clearance for a first plurality of protrusions of the moving ring.

48. The edge ring system of claim 42, wherein the first annular flange comprises: a second plurality of cavities extending in a radially inward direction from the radially inner surface of the stationary ring and configured to provide clearance for a second plurality of protrusions of the moving ring.

49. The edge ring system of claim 24 wherein the intermediate ring comprises quartz.

50. The edge ring system of claim 24, wherein the cover ring comprises quartz.

51. The edge ring system of claim 24 wherein the top edge ring comprises silicon carbide.

52. The edge ring system of claim 25, wherein the moving ring comprises a silicon substrate having an outer layer of anodized aluminum.

53. The edge ring system of claim 35, wherein the stationary ring comprises one of an electroplated aluminum outer layer and a silicon substrate having a coating comprising perfluoroalkoxy alkane (PFA).

54. An intermediate ring for a substrate processing chamber, comprising: Outer ring part; Inner ring part; N bridges connecting the outer ring portion to the inner ring portion, where N is an integer greater than 1; and N arc-shaped openings are respectively arranged between the N bridges and between the outer ring portion and the inner ring portion.

55. The intermediate ring of claim 54, further comprising an annular cavity disposed on an upper radially inner surface of the outer ring portion.

56. The intermediate ring of claim 54, wherein at least one of the N bridges comprises one of a protrusion and a cavity configured to position the intermediate ring relative to another edge ring.

57. The intermediate ring of claim 56, wherein said one of said protrusion and said cavity is disposed on a radially outer surface of said at least one of said N bridges.

58. The intermediate ring of claim 54, wherein the intermediate ring comprises quartz.

59. The intermediate ring according to claim 54, further comprising G alignment portions disposed on the bottom surface of the outer ring portion, wherein G is an integer greater than 2.

60. The intermediate ring of claim 59, wherein the G alignment portions comprise planar surfaces extending in a radial direction disposed between opposing inclined surfaces.

61. The intermediate ring of claim 59, wherein the G alignment portions are configured to self-center the intermediate ring on the lift pins.

62. The intermediate ring of claim 54, wherein opposing ends of the N arc-shaped openings are rounded.

63. The intermediate ring of claim 54, wherein circumferential side surfaces of the N bridges are rounded to define rounded ends of the N arc-shaped openings.

64. The intermediate ring of claim 54, further comprising an annular groove disposed on a bottom surface of the outer ring portion.

65. The intermediate ring of claim 54, further comprising: G alignment portions disposed on the bottom surface of the outer ring portion and comprising a planar surface extending in a radially outward direction disposed between oppositely inclined surfaces, wherein G is an integer greater than 2; and An annular groove is provided on the bottom surface of the outer ring portion and is located radially outward of the G alignment portions.

66. The intermediate ring of claim 54, wherein the intermediate ring comprises quartz.

67. A top edge ring for a substrate processing system, comprising: an annular body having a "C" shaped cross section; an inner annular projection extending downwardly from a radial inner surface of the annular body; an outer annular projection extending downwardly from the radially inner surface of the annular body; and A cavity is disposed between the inner annular protrusion and the outer annular protrusion.

68. The top edge ring of claim 67, wherein the top edge ring comprises silicon carbide.

69. The top edge ring of claim 67, further comprising a protrusion disposed on one of: The radially inner surface of the outer annular projection; and The radial outer surface of the inner annular protrusion, Wherein the protrusion is configured to position the top edge ring relative to another edge ring.

70. The top edge ring of claim 69, wherein the protrusion has a semicircular shape.

71. The top edge ring of claim 67, further comprising a cavity disposed on one of: The radially inner surface of the outer annular projection; and The radial outer surface of the inner annular protrusion, Wherein the cavity is configured to position the top edge ring relative to another edge ring.

72. The top edge ring of claim 71 , wherein the cavity has a semicircular shape.

73. The top edge ring of claim 67, wherein the top edge ring comprises silicon carbide.

74. A moving ring for a substrate processing system, comprising: Ring body; N upper portions, which are disposed on the top edge of the annular body and have an arc shape; N gaps disposed between the N upper portions; P first protrusions, which are arranged on the radial outer surface of the annular body, where P is an integer greater than 2; as well as P grooves are provided on bottom surfaces of the P first protrusions and are configured to self-center the moving ring when the P self-centering portions are biased by the P lift pins.

75. A moving ring according to claim 74, wherein the P first protrusions have a "V" shape.

76. The moving ring of claim 74, wherein the P grooves have a "V" shape including reverse inclined surfaces extending in a radial direction.

77. The moving ring of claim 74, further comprising: R first protrusions are disposed on the outer surface, wherein R is an integer greater than 2; and R holes pass through R of the N upper portions and the R first protrusions.

78. A moving ring according to claim 74, wherein the N upper portions are circular at their opposite circumferential ends.

79. The moving ring of claim 74, wherein the moving ring comprises a silicon substrate having an outer layer of electroplated aluminum.

80. A stationary ring for an edge ring system of a substrate processing system, comprising: Ring body; an annular flange extending radially inwardly from a lower end of the annular body; P first cavities are disposed on the radial inner surface of the annular body, wherein P is an integer greater than 2; and P holes are formed through the annular flange in the P first cavities.

81. A stationary ring according to claim 80, wherein the P first cavities have a rounded "V" shape.

82. The stationary ring according to claim 80, further comprising R second cavities, which are arranged on the radial inner surface of the annular body, wherein R is an integer greater than 2.

83. A stationary ring according to claim 82, wherein the R second cavities have a rounded "V" shape.

84. The stationary ring of claim 80, wherein P=3 and the P first cavities are spaced apart at intervals of 120°.

85. The stationary ring according to claim 80, further comprising R second cavities disposed on the radial inner surface of the annular body, wherein R is an integer greater than 2, and wherein the R second cavities are disposed between the P first cavities.

86. The stationary ring of claim 85, wherein P=3, R=3, the P first cavities are spaced apart at intervals of 120°, and the R second cavities are spaced apart at intervals of 120° and are evenly spaced between the P first cavities.

87. The stationary ring of claim 80, further comprising S cavities extending axially into the bottom surface of the annular body, wherein S is an integer greater than 2.

88. The stationary ring of claim 87, further comprising S plugs disposed in the S cavities.

89. The stationary ring of claim 80, wherein the stationary ring comprises a silicon substrate having one of an electroplated aluminum outer layer and a coating comprising perfluoroalkoxyalkane (PFA).

90. A bottom edge ring for an edge ring system of a substrate processing system, comprising: Ring body; an annular flange extending radially inwardly from an upper end of the annular body; and P first recesses are provided on the radial inner edge of the annular flange, wherein P is an integer greater than 2.

91. The bottom edge ring of claim 90, wherein the P first recesses are spaced 360° / P apart and have a rounded "V" shape.

92. The bottom edge ring of claim 90, further comprising R second recesses disposed on the radially inner edge of the annular flange, wherein R is an integer greater than 2.

93. The bottom edge ring of claim 92, wherein the R second recesses are spaced 360° / R apart and have a rounded "V" shape.

94. The bottom edge ring of claim 90, wherein P=3 and the P first recesses are spaced apart at 120° intervals.

95. The bottom edge ring of claim 90, further comprising R second recesses disposed on the radial inner surface of the annular body, wherein R is an integer greater than 2, wherein the R second recesses are disposed between the P first recesses.

96. The bottom edge ring of claim 95, wherein P=3, R=3, the P first recesses are spaced at 120° intervals, and the R second recesses are spaced at 120° intervals and evenly spaced between the P first recesses.

97. The bottom edge ring of claim 90 further comprising S holes extending axially through the annular body, wherein S is an integer greater than 2.

98. The bottom edge ring of claim 90 further comprising T holes extending axially into the annular body, wherein T is an integer greater than 2.

99. The bottom edge ring of claim 98, further comprising T plugs disposed in the T holes.

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