Manufacturing method of enameled wire
By detecting and processing the defects between the flat wire drawing process and the coating forming process of the conductor during the enameled wire manufacturing process, the defects in the enameled wire manufacturing are solved, and a higher quality product output is achieved.
Patent Information
- Application Number
- CN202410459420.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-30
- Filing Date
- 2024-04-17
- Publication Date
- 2024-12-31
AI Technical Summary
In the manufacturing process of enameled wire, defects often occur, and the prior art is difficult to effectively suppress these defects.
During the stage between the flat wire drawing process and the film forming process, defect detection is performed on the conductor, and the degree of defect exceeds a preset reference. According to the detection results, the device in the flat rolling process or the flat wire drawing process is processed. , to reduce defects.
This method can effectively suppress the defects of the enameled wire, improve the manufacturing quality, and simplify the analysis and processing flow of defect causes.
Smart Images
Figure CN119216356A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a method for manufacturing an enameled wire. Background Art
[0002] Patent Document 1 discloses a method for producing an enameled wire. The method for producing an enameled wire includes a flat rolling step, a flat wire drawing step, and a coating film forming step.
[0003] Prior art literature
[0004] Patent Literature
[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-122974 Summary of the invention
[0006] Problems to be solved by the invention
[0007] When manufacturing an enameled wire, defects may occur in the enameled wire for various reasons. In one embodiment of the present disclosure, it is preferable to provide a method for manufacturing an enameled wire that can suppress defects in the enameled wire.
[0008] Means for solving problems
[0009] One embodiment of the present disclosure is a method for manufacturing an enameled wire, which includes a flat rolling process, a flat wire drawing process, and a coating forming process. In the method for manufacturing an enameled wire, a process for detecting defects of a conductor at a stage between the flat wire drawing process and the coating forming process is performed to determine whether the degree of the defect of the conductor exceeds a first reference. According to the method for manufacturing an enameled wire as one embodiment of the present disclosure, defects of the enameled wire can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is an explanatory diagram showing the structure of an enameled wire manufacturing apparatus.
[0011] Figure 2 This is a flowchart showing defect response processing in the method for manufacturing an enameled wire.
[0012] Figure 3 It is an explanatory diagram showing the reason why recessed portions are generated on the surface of a conductor.
[0013] Figure 4 This is an explanatory diagram showing another reason why recessed portions are generated on the surface of a conductor.
[0014] Figure 5 This is an explanatory diagram showing the reason why convex portions are generated on the surface of the enameled wire.
[0015] Figure 6 It is an explanatory diagram showing the reason why defects occur on the surface of the enameled wire.
[0016] Figure 7 It is an explanatory diagram showing the reason why defects occur on the surface of the enameled wire.
[0017] Fig. 8A It is a top view showing the constriction of the conductor. Figure 8B It is a top view showing a conductor having a portion with a small width.
[0018] Explanation of symbols
[0019] 1: conductor, 2: enameled wire, 10: manufacturing device, 12: flat rolling machine, 13: flat wire drawing machine, 14: cleaning device, 15: coating coating machine, 16: sintering furnace, 17: winding machine, 21: copper powder, 23: concave part, 24: necking, 25: coating, 27: convex part, 29: coating mold, 31: foreign matter, 100: winding tube. DETAILED DESCRIPTION
[0020] Illustrative embodiments of the present disclosure are described with reference to the accompanying drawings.
[0021] <First Embodiment>
[0022] 1. Basic processing in the manufacturing method of enameled wire
[0023] based on Figure 1 The basic process in the manufacturing method of the enameled wire is described below. Figure 1 The manufacturing apparatus 10 is shown.
[0024] The manufacturing device 10 includes a bobbin 100, a flat rolling mill 12, a flat wire drawing machine 13, a cleaning device 14, a coating coating machine 15, a sintering furnace 16, and a winding machine 17. A conductor 1 is wound around the bobbin 100. The conductor 1 is made of, for example, copper or a copper alloy. The cross section of the conductor 1 is, for example, circular.
[0025] The flat rolling mill 12 rolls the conductor 1 having a circular cross section into a flat shape. The flat rolling mill 12 rolls the conductor 1 up and down and left and right so that the thickness and width of the conductor 1 become predetermined dimensions, and processes the cross section of the conductor 1 into a flat shape. The flat rolling mill 12 includes, for example, a cassette roller die (CRD).
[0026] The flat wire drawing machine 13 draws the flat conductor 1. The flat wire drawing machine 13 processes the conductor 1 into a desired size. The desired size is, for example, a size related to the specification of the product. The flat wire drawing machine 13 includes, for example, a wire drawing die.
[0027] The cleaning device 14 cleans the conductor 1 drawn into a flat shape. The cleaning device 14 includes a cleaning liquid for cleaning the drawn conductor 1. As the cleaning liquid, water such as pure water can be used. As pure water, for example, RO water can be cited.
[0028] The coating coating machine 15 applies wire enamel coating to the cleaned conductor 1. For example, the coating coating machine 15 includes: a coating tank storing the wire enamel coating; a coating coating roller that draws the wire enamel coating from the coating tank and applies it to the outer peripheral surface of the conductor 1; and a coating die 29 that adjusts the thickness of the wire enamel coating to be uniform. The wire enamel coating is, for example, a coating containing a resin and a solvent.
[0029] The sintering furnace 16 evaporates the solvent in the wire enamel coating applied to the conductor 1 and hardens the resin in the wire enamel coating. After the solvent evaporates and the resin hardens, the enameled wire 2 is formed. In addition, the sintering furnace 16 may also include a drying furnace. The drying furnace only evaporates the solvent in the wire enamel coating. The drying furnace does not harden the resin in the wire enamel coating.
[0030] The basic steps in the method for producing the enameled wire are as follows.
[0031] (Flat rolling process)
[0032] The conductor 1 wound on the bobbin 100 is introduced into the flattening mill 12. The flattening mill 12 flattens the conductor 1 having a circular cross section. The flattening mill 12 may be performed not only once but also multiple times in stages using, for example, a multi-stage rolling mill.
[0033] (Flat wire drawing process)
[0034] Next, the flat wire drawing machine 13 performs flat wire drawing on the flat conductor 1. In this process, in order to allow the conductor 1 to pass smoothly through the wire drawing die, for example, a lubricating oil containing an emulsion can be used. In addition, the cross-sectional shrinkage rate in the flat wire drawing is, for example, about 20% to 25%. In the flat wire drawing process, for example, felt is used. As the felt, for example, a wiping cloth using ultrafine fibers composed of polyester, nylon, etc. can be cited. By sandwiching the flat conductor 1 from the top and bottom or the left and right with the felt, copper powder and foreign matter attached to the surface of the flat conductor 1 are removed. At this time, a member formed by winding and covering the felt around a plate-shaped member having a specified thickness can be used to sandwich the flat conductor 1 from the top and bottom or the left and right. As a result, it is easy to remove copper powder attached to the conductor 1 and foreign matter formed by solidification of the lubricating oil.
[0035] (Cleaning process)
[0036] Next, the cleaning device 14 cleans the flat conductor 1 after drawing. By cleaning, lubricating oil, water, etc. attached to the conductor 1 during the flat drawing process can be removed. In addition, by cleaning, copper powder attached to the surface of the conductor 1 drawn into a flat shape (for example, copper powder that has not been completely removed by the felt) can also be removed. That is, the cleaning process has the function of removing lubricating oil, copper powder, etc. attached to the surface of the flat conductor 1.
[0037] (Film forming process)
[0038] Next, the coating coating machine 15 coats the cleaned conductor 1. Specifically, the wire enameled coating is coated on the outer periphery of the conductor 1. Next, the sintering furnace 16 dries and hardens the coated wire enameled coating to form the enameled wire 2. The formed enameled wire 2 includes the conductor 1 having a flat cross section and the coating 25 covering the conductor 1. The coating forming step can be repeated until the coating 25 of the enameled wire 2 reaches a desired thickness.
[0039] The wire enamel coating material is not particularly limited as long as it can be used in the enameled wire 2. Examples of the solvent in the wire enamel coating material include N-methyl-2-pyrrolidone (NMP), cresol, N,N-dimethylacetamide (DMAc), and cyclohexanone. Examples of the resin in the wire enamel coating material include polyamide-imide, polyimide, and polyester-imide.
[0040] (Winding process)
[0041] Next, the winding machine 17 winds up the enameled wire 2 after the film forming process. The aforementioned processes may be performed on the same production line or on different production lines. For example, the production line may be divided between the cleaning process and the coating process, and the flat rolling process, the flat wire drawing process, and the cleaning process may be performed on the first production line, and the film forming process and the winding process may be performed on the second production line.
[0042] Examples of the conductor 1 before the flattening step include a round wire having a circular cross section and a wire having an elliptical cross section.
[0043] 2. Dealing with defects in the manufacturing method of enameled wire
[0044] In the manufacturing method of the enameled wire, in addition to the above-mentioned basic processing, the defect response processing described below is repeatedly performed at predetermined intervals. Figure 2 Describe the corresponding handling of defects.
[0045] exist Figure 2In step 1, a conductor image is obtained from a conductor 1 at a stage between the flat wire drawing step and the coating film forming step. That is, the conductor 1 to be obtained as the conductor image has been subjected to the flat wire drawing step but has not been subjected to the coating film forming step.
[0046] The conductor image is an image showing the surface of the conductor 1. To obtain the conductor image, for example, a line scanner (for example, an ultra-high-definition in-line profilometer manufactured by KEYENCE Corporation, etc.) can be used.
[0047] The conductor image is a three-dimensional image containing information about the depth of the conductor 1. The depth direction in the conductor image (the direction from the surface of the conductor 1 toward the inside of the conductor 1, for example, Figure 3 The resolution of the conductor image in the width direction is, for example, 0.1 μm. The resolution of the conductor image in the width direction is, for example, 2.5 μm. The resolution of the conductor image in the length direction L is, for example, 58.3 μm. In addition, the width direction refers to the width direction of the conductor 1 (a direction that is orthogonal to the length direction L of the conductor 1 in FIG8 and parallel to the paper surface of FIG8 ). The length direction L is the length direction of the conductor 1. The shooting range of the conductor image is a range that can capture the entire width direction of the conductor 1.
[0048] In step 2, an enameled wire image is obtained based on the manufactured enameled wire 2. The enameled wire image is an image showing the surface of the enameled wire 2. The enameled wire image is composed of, for example, a bright field image and a dark field image. The bright field image refers to an image obtained by irradiating the plane and corner surface of the enameled wire 2 with bright field shooting light and photographing the plane and corner surface of the enameled wire 2. The dark field image refers to an image obtained by irradiating the plane and corner surface of the enameled wire 2 with dark field shooting light along the length direction L of the enameled wire 2. When obtaining the bright field image and the dark field image, for example, the appearance inspection device described in Japanese Patent Gazette No. 2016-102727 can be used.
[0049] In step 3, the coating 25 of the manufactured enameled wire 2 is removed to expose the surface of the conductor 1. Next, an image showing the surface of the exposed conductor 1 (hereinafter referred to as a removal image) is obtained. In order to obtain the removal image, an optical microscope or a scanning electron microscope (SEM) is used. By obtaining the removal image, it is possible to analyze in detail whether the defects present on the surface of the conductor 1 are recesses 23, protrusions, etc. In addition, it is particularly preferred to perform step 3 on the enameled wire that satisfies the condition J2 described later. Thus, the cause of the defects on the surface of the enameled wire that satisfies the condition J2 can be analyzed. In addition, in step 6 described later, the analysis results of the cause can also be used to determine what kind of treatment to be performed to reduce the defects.
[0050] In step 4, a defect detection process is performed. The defect detection process includes the following first to third defect detection processes.
[0051] (First Defect Detection Process)
[0052] Based on the conductor image obtained in step 1, defects of the conductor 1 are detected. Examples of defects of the conductor 1 include concave portions 23 and convex portions existing on the surface of the conductor 1. Examples of defects of the conductor 1 include Fig. 8A The constriction 24 is a portion locally generated in the length direction L of the conductor 1 and narrower than other portions. Figure 8B As shown, it can be seen that the width W of the conductor 1 is smaller than the normal width W0.
[0053] The constriction 24 and the reduction in the width W of the conductor 1 are caused by the following reasons. In the flat wire drawing process, the friction between the wire drawing die and the conductor 1 increases in the wire drawing die, or when the conductor 1 is hooked on the wire drawing die in the wire drawing die, the tension applied to the conductor 1 temporarily increases. As a result, the width W of a portion of the conductor 1 in the longitudinal direction L is narrower than the normal width W0, and the constriction 24 or the constriction 24 is generated. Figure 8B As shown, the width W of the conductor 1 is smaller than the normal width W0.
[0054] The reason why the recessed portion 23 is formed on the surface of the conductor 1 is presumed to be as follows. Figure 3 P1 in FIG. 1 represents the conductor 1 after the first drawing. Figure 3 In the example shown, in the flat wire drawing process, two wire drawing processes are performed. The first wire drawing process is set as the first wire drawing. The second wire drawing process is set as the second wire drawing. At the stage P1, the copper powder 21 is not attached to the conductor 1. P2 is the conductor 1 conveyed by the pulley provided by the flat wire drawing machine 13 after the first wire drawing. The copper powder 21 accumulated on the pulley is transferred to the surface of the conductor 1.
[0055] P3 is a conductor 1 after the second drawing. In P3, the copper powder 21 is embedded in the conductor 1. P4 is a conductor 1 after the second drawing and before the cleaning step. The copper powder 21 falls off the conductor 1. In the conductor 1, a recess 23 is formed in the portion where the copper powder 21 exists.
[0056] Another reason why the recessed portion 23 is formed on the surface of the conductor 1 is presumed to be as follows. Figure 4 P11 in FIG. 1 is the conductor 1 at a stage after the flattening step. At the stage of P11 , the copper powder 21 is not attached to the conductor 1 .
[0057] P12 is a conductor 1 at a stage after the flattening step and before the first wire drawing. In P12, the copper powder 21 accumulated on the pulley conveying the conductor 1 is transferred to a position on the end side of the conductor 1.
[0058] P13 is the conductor 1 when the wire drawing is performed once. In P13 , the copper powder 21 is embedded in the conductor 1 .
[0059] P14 is a conductor 1 at a stage between the first and second wire drawing. In P14, copper powder 21 falls off the conductor 1. In P14, a recess 23 is formed in the conductor 1 at a portion where the copper powder 21 exists. The recess 23 is located at the end side of the conductor 1.
[0060] P15 is a conductor 1 after the second drawing. The recess 23 moves toward the center of the conductor 1 due to the increase in thickness for the second drawing.
[0061] In addition, in P12 to P15, the case where the concave portion 23 is generated when the copper powder 21 is attached is described, but the present invention is not limited to this. For example, in P12, when a crack caused by flattening occurs in the same portion as the portion where the copper powder 21 is attached, in P15, the crack moves to the same position as the concave portion 23. The crack becomes a defect on the surface of the conductor 1.
[0062] (Second Defect Detection Process)
[0063] Based on the enameled wire image obtained in step 2, defects on the surface of the enameled wire 2 are detected. Specifically, based on the bright field image and the dark field image, defects on the plane and corner surface of the enameled wire 2 are detected. As a method for detecting defects, for example, the defect detection method described in Japanese Patent Publication No. 2016-102727 can be used. Examples of defects on the surface of the enameled wire 2 include concave portions and convex portions existing on the surface of the enameled wire 2.
[0064] The reason why defects are generated on the surface of the enameled wire 2 is presumed to be as follows. Figure 5 P21 is a conductor 1 at a stage before the film forming step. A recess 23 exists on the surface of the conductor 1 .
[0065] Figure 5 P22 is an enameled wire 2 formed by performing a coating film forming step. The enameled wire 2 includes a conductor 1 and a coating film 25. The coating film 25 covers the surface of the conductor 1. During the coating film forming step, the enameled wire coating does not penetrate the recess 23, and air is sucked into the recess 23. The sucked air bubbles, and a convex portion 27 is generated on the surface of the enameled wire 2.
[0066] Other reasons for the occurrence of defects on the surface of the enameled wire 2 are presumed to be as follows. Figure 6 As shown, a coating die 29 is used in the coating forming step. If the conductor 1 is inclined relative to the coating die 29, a part of the conductor 1 contacts the coating die 29, and the conductor 1 is damaged. The damage to the conductor 1 causes defects on the surface of the enameled wire 2.
[0067] Other reasons for the occurrence of defects on the surface of the enameled wire 2 are presumed to be as follows. Figure 7 As shown in FIG. 1 , a coating die 29 is used in the coating film forming step. Foreign matter 31 may be attached to the inner surface of the coating die 29. The foreign matter 31 includes copper powder 21, cured product of the coating, etc. The foreign matter 31 damages the conductor 1 or the coating film 25. As a result, defects are generated on the surface of the enameled wire 2.
[0068] (Third Defect Detection Process)
[0069] Based on the removal image obtained in step 3, defects on the surface of the conductor 1 are detected. Specifically, using an optical microscope or a scanning electron microscope (SEM), defects on the surface of the conductor 1 after the coating 25 is removed from the enameled wire 2 are detected. Examples of defects on the conductor 1 include concave portions 23 and convex portions existing on the surface of the conductor 1.
[0070] In step 5, first, the extent of the defect detected in the first to third defect detection processes is calculated. For example, when the defect is a concave portion, the extent of the defect is the depth of the concave portion. For example, when the defect is a convex portion, the extent of the defect is the height of the convex portion. For example, when the defect is a constriction 24, the extent of the defect is the difference between the width W of the conductor 1 at the constriction 24 and the normal width W0. For example, when the defect is Figure 8B As shown, when the width W of the conductor 1 is small, the degree of defect means the difference between the width W of the conductor 1 and the normal width W0.
[0071] Next, it is determined whether the following conditions J1 to J3 are satisfied.
[0072] (Condition J1)
[0073] The degree of the defect detected in the first defect detection process exceeds a preset first reference.
[0074] (Condition J2)
[0075] The degree of the defect detected in the second defect detection process exceeds a preset second reference.
[0076] (Condition J3)
[0077] The degree of the defect detected in the third defect detection process exceeds a third predetermined reference.
[0078] For example, the defect detected in the first defect detection process is a concave portion 23, and the depth of the concave portion 23 is 8 μm. In addition, the first reference is 5 μm. In this case, condition J1 is satisfied. On the other hand, when the depth of the concave portion 23 detected in the first defect detection process is 3 μm, condition J1 is not satisfied. In addition, when no defect is detected in the first defect detection process, condition J1 is also not satisfied. It is also determined whether conditions J2 and J3 are satisfied.
[0079] When at least one of the conditions J1 to J3 is satisfied, the process proceeds to step 6. When none of the conditions J1 to J3 is satisfied, the process ends. The process of step 5 may be performed by a person or automatically by a computer.
[0080] In step 6, a process for reducing defects of the conductor 1 or the enameled wire 2 is performed. When the condition J1 is satisfied, a process for reducing defects of the conductor 1 is performed on the device used in the flat rolling process or the flat wire drawing process.
[0081] As a process for reducing defects of the conductor 1, for example, Figure 3 , Figure 4 The process for suppressing the generation of copper powder 21 is shown. Figure 3 , Figure 4 The treatment for the generation of the copper powder 21 shown above includes, for example, replacement of the felt or lubricating oil in the flat wire drawing machine 13 .
[0082] By replacing the felt or lubricating oil, it is possible to reduce the generation of Figure 3 , Figure 4 In addition, as a way to reduce the defects such as the concave portion 23 shown in FIG. Figure 3 , Figure 4 The processing of the defects such as the concave portion 23 shown in the figure can include cleaning the surface of the pulley provided in the manufacturing device 10. By cleaning the surface of the pulley, the copper powder 21 accumulated on the surface of the pulley can be removed, and the Figure 3 , Figure 4 The generation of defects such as the recessed portion 23 shown. For example, when the felt is replaced, it is easy to remove or reduce the copper powder 21 attached to the surface of the conductor 1. If the copper powder 21 attached to the surface of the conductor 1 is removed or reduced, the clogging of the wire drawing die by the copper powder 21 can be suppressed. If the clogging of the copper powder can be suppressed, the new generation of copper powder 21 in the wire drawing die can be suppressed. As a result, it is difficult for defects such as recessed portions 23 to be generated on the surface of the conductor 1. In addition, when the lubricating oil is replaced, the lubricity of the inside of the wire drawing die can be maintained, so the resistance (friction, etc.) generated between the wire drawing die and the conductor 1 can be reduced. As a result, the generation of new copper powder 21 in the wire drawing die can be suppressed. As a result, it is difficult for defects such as recessed portions 23 to be generated on the surface of the conductor 1.
[0083] As defects on the surface of the conductor 1, in addition to the recessed portion 23, for example Fig. 8A The necking 24 shown or Figure 8B The width W of the conductor 1 shown is reduced. These defects are detected in the first defect detection process. As a process for suppressing these defects, for example, the wire drawing die is adjusted so that the friction between the wire drawing die and the conductor 1 does not increase, or the conductor 1 does not get stuck on the wire drawing die in the wire drawing die.
[0084] When the condition J2 is satisfied, the device used in the flat rolling process, the flat wire drawing process, or the coating forming process is subjected to a process for reducing defects on the surface of the enameled wire 2. Examples of the process for reducing defects on the surface of the enameled wire 2 include: Figure 3 , Figure 4 The process for suppressing the generation of copper powder 21 is shown. Figure 3 , Figure 4 The treatment for the generation of the copper powder 21 shown in FIG. 1 may include, for example, replacing the felt or lubricating oil in the flat wire drawing machine 13. Figure 3 , Figure 4 The treatment for the generation of the copper powder 21 shown above includes, for example, a treatment for cleaning the surface of the pulley provided in the manufacturing apparatus 10 .
[0085] As a treatment for reducing defects on the surface of the enameled wire 2, for example, the conductor 1 may be prevented from being damaged by the corrosion of the conductor 1. Figure 6 The tilt of the coating mold 29 shown is processed and removed. Figure 7 The handling of the foreign matter 31 shown, etc.
[0086] When the condition J3 is satisfied, the device used in the flat rolling process or the flat wire drawing process is subjected to a process for reducing defects on the surface of the conductor 1. Examples of the process for reducing defects on the surface of the conductor 1 include: Figure 3 , Figure 4 The process for suppressing the generation of copper powder 21 is shown. Figure 3 , Figure 4 The treatment for the generation of the copper powder 21 shown in FIG. 1 may include, for example, replacing the felt or lubricating oil in the flat wire drawing machine 13. Figure 3 , Figure 4 The treatment for the generation of the copper powder 21 shown above includes, for example, a treatment for cleaning the surface of the pulley provided in the manufacturing apparatus 10 .
[0087] The type of defect reduction process may be fixed or may be selected from a plurality of processes according to the type and degree of the detected defect. The selection of the defect reduction process may be performed by a person or may be performed automatically by a computer.
[0088] 3. Effects of the manufacturing method of enameled wire
[0089] (1A) In the manufacturing method of the enameled wire of the present disclosure, a process of detecting defects of the conductor 1 at a stage between the flat wire drawing process and the coating forming process is performed to determine whether the degree of the defects of the conductor 1 exceeds the first standard. When the degree of the defects of the conductor 1 exceeds the first standard, a process of reducing the defects of the conductor 1 can be performed on the device used in the flat rolling process or the flat wire drawing process. In this way, the defects of the enameled wire 2 can be suppressed.
[0090] Furthermore, since the defects of the conductor 1 where the coating 25 is not formed are detected, the cause of the defects mainly lies in the flat rolling process or the flat wire drawing process. Therefore, compared with the case of detecting defects of the enameled wire 2, the cause of the defects can be easily identified.
[0091] (1B) In the manufacturing method of the enameled wire disclosed in the present invention, a process for detecting defects on the surface of the manufactured enameled wire 2 is performed. Then, it is determined whether the degree of defects on the surface of the enameled wire 2 exceeds the second benchmark. In a case where the degree of defects on the surface of the enameled wire 2 exceeds the second benchmark, a process for reducing defects on the surface of the enameled wire 2 is performed on the device used in the flat rolling process, the flat wire drawing process, or the coating forming process. In this way, the defects of the enameled wire 2 can be further reduced. In addition, by detecting both the defects on the surface of the conductor 1 and the defects on the surface of the manufactured enameled wire 2, it is possible to determine whether the defects on the surface of the enameled wire 2 are caused by the defects on the surface of the conductor 1. In this way, it is easy to determine whether to perform a process to reduce the defects of the conductor 1.
[0092] (1C) In the manufacturing method of the enameled wire disclosed in the present invention, the coating 25 of the manufactured enameled wire 2 is removed, and a process for detecting defects on the surface of the conductor 1 is performed. Then, it is determined whether the degree of the defects on the surface of the conductor 1 exceeds the third standard. When the degree of the defects on the surface of the conductor 1 exceeds the third standard, a process for reducing the defects on the surface of the conductor 1 is performed on the device used in the flat rolling process or the flat wire drawing process. In this way, the defects of the enameled wire 2 can be further suppressed.
[0093] <Other Implementation Methods>
[0094] As mentioned above, although embodiment of this disclosure was described, this disclosure is not limited to the said embodiment, Various deformation|transformation can be made and it can be implemented.
[0095] (1) In the first embodiment, the first to third defect detection processes are performed, but one or both of the second to third defect detection processes may not be performed. In the case where the second defect detection process is not performed, it is not necessary to determine whether the condition J2 is satisfied. In the case where the third defect detection process is not performed, it is not necessary to determine whether the condition J3 is satisfied.
[0096] (2) The results of the first to third defect detection processes may be integrated to determine the type of process to be performed in step 6. The type of process to be performed in step 6 may be determined by a person or automatically by a computer.
[0097] (3) The device for acquiring the conductor image may be a device other than a line scanner. The enameled wire image may be an image other than an image consisting of a bright field image and a dark field image. The device for acquiring the removal image may be a device other than an optical microscope or a scanning electron microscope.
[0098] (4) It is also possible to make multiple components share the functions of one component in each of the above embodiments, or to make one component play the functions of multiple components. In addition, it is also possible to omit a part of the structure of each of the above embodiments. In addition, it is also possible to add or replace at least a part of the structure of each of the above embodiments with respect to the structure of other embodiments.
[0099] (5) In addition to the above-mentioned enameled wire manufacturing method, the present disclosure can be implemented in various forms such as an enameled wire manufacturing apparatus.
[0100] [Technical ideas disclosed in this specification]
[0101] [Project 1]
[0102] A method for manufacturing an enameled wire includes a flat rolling process, a flat wire drawing process, and a coating forming process.
[0103] performing a process of detecting defects of the conductor at a stage between the flat wire drawing step and the coating forming step,
[0104] It is determined whether the degree of the defect of the conductor exceeds a first reference.
[0105] [Project 2]
[0106] The method for manufacturing an enameled wire according to item 1, wherein:
[0107] When the degree of defects of the conductor exceeds the first standard, a process for reducing defects of the conductor is performed on an apparatus used in the flat rolling step or the flat wire drawing step.
[0108] [Item 3]
[0109] The method for producing an enameled wire according to item 1 or 2, wherein:
[0110] A process for detecting defects on the surface of the manufactured enameled wire is performed,
[0111] determining whether the degree of the defect on the surface of the enameled wire exceeds a second standard,
[0112] When the degree of defects on the surface of the enameled wire exceeds the second reference, a process for reducing defects on the surface of the enameled wire is performed on an apparatus used in the flat rolling step, the flat wire drawing step, or the coating forming step.
[0113] [Item 4]
[0114] The method for producing an enameled wire according to any one of items 1 to 3, wherein:
[0115] removing the coating of the manufactured enameled wire and inspecting the surface of the conductor for defects;
[0116] determining whether the degree of the defect on the surface of the conductor exceeds a third standard,
[0117] When the degree of the defects on the surface of the conductor exceeds the third standard, a process for reducing the defects on the surface of the conductor is performed on the device used in the flat rolling step or the flat wire drawing step.
Claims
1. A method for manufacturing an enameled wire, comprising a flat rolling process, a flat wire drawing process and a coating forming process, characterized in that: performing a process of detecting defects of the conductor at a stage between the flat wire drawing step and the coating forming step, It is determined whether the degree of the defect of the conductor exceeds a first reference.
2. The method for manufacturing an enameled wire according to claim 1, characterized in that: When the degree of defects of the conductor exceeds the first standard, a process for reducing defects of the conductor is performed on an apparatus used in the flat rolling step or the flat wire drawing step.
3. The method for manufacturing an enameled wire according to claim 1 or 2, characterized in that: A process for detecting defects on the surface of the manufactured enameled wire is performed, determining whether the degree of the defect on the surface of the enameled wire exceeds a second standard, When the degree of defects on the surface of the enameled wire exceeds the second reference, a process for reducing defects on the surface of the enameled wire is performed on an apparatus used in the flat rolling step, the flat wire drawing step, or the coating forming step.
4. The method for manufacturing an enameled wire according to claim 1 or 2, characterized in that: removing the coating of the manufactured enameled wire and inspecting the surface of the conductor for defects; determining whether the degree of the defect on the surface of the conductor exceeds a third standard, When the degree of the defects on the surface of the conductor exceeds the third standard, a process for reducing the defects on the surface of the conductor is performed on the device used in the flat rolling step or the flat wire drawing step.