Display device, tiled display device and picture adjusting method

Abstract

The invention provides a display device, a tiled display device and a picture adjusting method, and relates to the technical field of display, the display device comprises a display panel, a backlight module and a plurality of light emitting devices, and the display panel is located on the light emitting side of the backlight module; the plurality of light emitting devices are arranged on at least one side surface of the peripheral side of the display panel; the orthographic projection of the light-emitting device on the light-emitting face of the backlight module and the orthographic projection of the display panel on the light-emitting face of the backlight module are not overlapped. The display device can be used for preparing a'zero-splicing-seam 'splicing display device.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device, a spliced ​​display device and a picture adjustment method. Background Art

[0002] With the development of science and technology, the application of spliced ​​display devices is becoming more and more extensive. The spliced ​​display device is usually formed by splicing a plurality of independent display devices, and each independent display device includes a display panel and a backlight module.

[0003] However, there is a black border at the joint position of the spliced ​​display device, which reduces the display effect of the spliced ​​display device. Among them, the joint width is an important physical parameter of the spliced ​​display device. In order to reduce the joint width, the border of the spliced ​​display device is gradually reduced from 2mm to 0.88mm. Due to the limitations of existing processes, it is difficult to further reduce the joint width. Summary of the invention

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a display device, including:

[0006] A display panel, the display panel comprising a display area and a peripheral area surrounding the display area;

[0007] A backlight module, electrically connected to the display panel, wherein the display panel is located at a light-emitting side of the backlight module;

[0008] A plurality of light emitting devices are arranged on at least one side surface of the peripheral side of the display panel; the orthographic projection of the light emitting device on the light emitting surface of the backlight module and the orthographic projection of the display panel on the light emitting surface of the backlight module do not overlap each other.

[0009] In at least one embodiment of the present application, the display panel includes a first side surface, and the first side surface intersects with a light emitting surface of the display panel;

[0010] The display device includes multiple first conductive pad groups, the first conductive pad groups are arranged on the first side, and the light-emitting device is located on the side of the first conductive pad group away from the first side; one first conductive pad group includes at least two conductive pads, and one light-emitting device is electrically connected to each conductive pad in the same first conductive pad group.

[0011] In at least one embodiment of the present application, the display panel includes an array substrate and a color filter substrate that are arranged opposite to each other, and the first side surface includes a first area located on the array substrate and a second area located on the color filter substrate;

[0012] The light emitting device and the first conductive pad group are arranged in the first region, and / or the light emitting device and the first conductive pad group are arranged in the second region.

[0013] In at least one embodiment of the present application, the peripheral area includes a binding sub-area, the binding sub-area includes a second side surface, and the second side surface intersects with the light emitting surface of the display panel;

[0014] The display device includes a plurality of second conductive pad groups, each of which includes at least one conductive pad, and the second conductive pad group is arranged on the second side surface. The display panel includes an array substrate and a color film substrate that are arranged opposite to each other, and the second conductive pad group is electrically connected to a driving circuit on the array substrate.

[0015] In at least one embodiment of the present application, the second side surface includes a third area located on the array substrate and a fourth area located on the color filter substrate;

[0016] The second conductive pad group is disposed in the third region, and / or the second conductive pad group is disposed in the fourth region.

[0017] In at least one embodiment of the present application, the plurality of light-emitting devices include a first light-emitting device, a second light-emitting device, and a third light-emitting device, and the first light-emitting device, the second light-emitting device, and the third light-emitting device have different light-emitting colors;

[0018] Among them, one of the first light-emitting devices, one of the second light-emitting devices, and one of the third light-emitting devices are packaged into a light-emitting unit, and the light-emitting unit extends from a region of the first side located on the array substrate to a region of the first side located on the color film substrate.

[0019] In at least one embodiment of the present application, the planar size of each conductive pad in the second conductive pad group is larger than the planar size of each conductive pad in the first conductive pad group, and the conductive pads in the second conductive pad group extend from an area of ​​the second side located on the array substrate to an area of ​​the second side located on the color film substrate.

[0020] In at least one embodiment of the present application, the first side surface and the second side surface are the same side surface, and at least one second conductive pad group is disposed in a region between two adjacent light-emitting units;

[0021] The display device further includes a chip-on-chip film, which covers the second conductive pad group and extends to the side of the backlight module, and the orthographic projection of the chip-on-chip film on the first side does not overlap with the orthographic projection of the light-emitting unit on the first side;

[0022] The first conductive pad group is electrically connected to the chip-on-film, and the second conductive pad group is bound to the chip-on-film.

[0023] In at least one embodiment of the present application, the first conductive pad group includes a positive conductive pad and a negative conductive pad, the light-emitting unit includes a first pin, a second pin, a third pin and a fourth pin, the positive conductive pads of the first light-emitting device, the second light-emitting device and the third light-emitting device are all electrically connected to the first pin, the negative conductive pad of the first light-emitting device is electrically connected to the second pin, the negative conductive pad of the second light-emitting device is electrically connected to the third pin, and the negative conductive pad of the third light-emitting device is electrically connected to the fourth pin;

[0024] The chip-on-film covers at least a portion of the first pin, the second pin, the third pin and the fourth pin, and the chip-on-film is bound to the first pin, the second pin, the third pin and the fourth pin respectively.

[0025] In at least one embodiment of the present application, the first side surface and the second side surface are different sides, and the display device further includes a chip-on-chip film, which covers the second conductive pad group and extends to the side surface of the backlight module;

[0026] The portion of the array substrate located in the peripheral area further includes a plurality of binding leads, the first conductive pad group is electrically connected to the chip-on-film through the binding leads, and the second conductive pad group is bound to the chip-on-film.

[0027] In at least one embodiment of the present application, the display device further comprises at least one circuit board and at least one L-shaped protective plate, the circuit board is electrically connected to the chip-on-film, and the circuit board and the chip-on-film are arranged on the same side of the backlight module, and the circuit board is also electrically connected to the backlight module; the circuit board is configured to drive the display panel and the light-emitting device simultaneously;

[0028] A portion of the protection plate is disposed on a side of the circuit board away from the backlight module, and another portion of the protection plate is disposed on a side of the circuit board away from the chip-on-film.

[0029] In at least one embodiment of the present application, the display panel also includes at least one third side surface in addition to the first side surface, and the third side surface is located at a portion of the color film substrate and is provided with a reflective surface, and the angle between the reflective surface and the reference surface is an acute angle, and the reference surface is a plane perpendicular to the light emitting surface of the display panel.

[0030] In at least one embodiment of the present application, the angle range of the acute angle is greater than 0° and less than or equal to 30°.

[0031] In at least one embodiment of the present application, the display device further includes a reflective portion, and the reflective portion covers the reflective surface.

[0032] In at least one embodiment of the present application, the light emitting device has a light emitting angle ranging from 30° to 60°.

[0033] In at least one embodiment of the present application, the display device further includes a buffer layer and a plurality of packaging parts, the packaging part at least covers the light emitting surface of the light emitting device, the buffer layer covers the side surface of the display panel on which the light emitting device is arranged, the buffer layer includes a plurality of openings, and the light emitting device is arranged in the openings.

[0034] In a second aspect, an embodiment of the present application provides a spliced ​​display device, comprising at least a first display device and a second display device, wherein the first display device and the second display device are both display devices as described in any one of the first aspects;

[0035] The first display device includes a first splicing edge, the second display device includes a second splicing edge, the first splicing edge and the second splicing edge are spliced ​​together; a plurality of the light-emitting devices are arranged on the side of the area where the first splicing edge or the second splicing edge is located.

[0036] In at least one embodiment of the present application, a plurality of the light-emitting devices are arranged on a side surface of an area where one of the first splicing edge and the second splicing edge is located, and a reflective surface is arranged on a side surface of an area where the other one of the first splicing edge and the second splicing edge is located.

[0037] In at least one embodiment of the present application, the splicing display device also includes a dimming layer and a light-transmitting protective layer, the dimming layer has a curved light-emitting surface, and the dimming layer includes a light-transmitting material and diffusion particles; the dimming layer is located in the area between the first splicing edge and the second splicing edge, and covers the light-emitting device and the reflective surface; the light-transmitting protective layer covers the dimming layer.

[0038] In at least one embodiment of the present application, a region of the color film substrate of the first display device close to the first stitching edge and a region of the color film substrate of the second display device close to the second stitching edge are both provided with a shading layer, and the shading layer is configured to block the light of the light-emitting device.

[0039] In a third aspect, an embodiment of the present application provides a picture adjustment method, which is applied to the splicing display device as described in any one of the second aspects, and the method includes:

[0040] Respectively acquiring brightness data and chromaticity data of the display panel and the light-emitting device under preset conditions; the preset conditions include pure pictures of the same grayscale or the same color;

[0041] Comparing and calculating the difference in brightness data and chromaticity data between the display panel and the light emitting device under the same conditions;

[0042] The driving voltage of the display panel and the driving voltage of the light emitting device are adjusted according to the difference of the brightness data and the difference of the chromaticity data.

[0043] In at least one embodiment of the present application, the step of adjusting the driving voltage of the display panel and the driving voltage of the light emitting device according to the difference of the brightness data and the difference of the chromaticity data includes:

[0044] Forming a coded file according to the difference of the brightness data and the difference of the chrominance data;

[0045] Storing the encoding file in a timing controller of a circuit board;

[0046] The timing controller generates a first driving voltage and a second driving voltage according to the coding file; the first driving voltage is configured to drive the display panel, and the second driving voltage is configured to drive the light emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1-5B Structural schematic diagrams of six display devices provided in the embodiments of the present application;

[0049] Figure 6-Figure 8 A schematic diagram of the arrangement of three light-emitting devices on the first side provided in an embodiment of the present application;

[0050] Figure 9-11 A schematic diagram of the distribution position of the second conductive pad group on the second side surface provided in an embodiment of the present application;

[0051] Figure 12-13 Schematic diagrams of two arrangements of the light-emitting unit and the second conductive pad group provided in the embodiments of the present application when they are arranged on the same side of the display panel;

[0052] Figure 14-15Schematic diagram of two positional relationships between the chip-on-chip film, the light-emitting unit, and the second conductive pad provided in an embodiment of the present application;

[0053] Fig.16 A schematic diagram of an equivalent circuit of a light emitting unit provided in an embodiment of the present application;

[0054] Figure 17-Figure 18 A schematic diagram of the structures of two display devices provided in the embodiments of the present application;

[0055] Fig.19 , Fig. 20 , Fig.21A , Fig.22A Structural schematic diagrams of four splicing display devices provided in embodiments of the present application;

[0056] Fig. 21B for Fig.21A A diagram illustrating the light emitting angle of a light emitting device at a seam position in a spliced ​​display device shown;

[0057] Fig. 22B for Fig.22A A diagram illustrating the light emitting angle of a light emitting device at a seam position in a spliced ​​display device shown;

[0058] Fig.23 (1) Figure and Fig.23 Figure (2) is a schematic diagram of a preparation process of a second conductive pad set provided in an embodiment of the present application;

[0059] Fig.24 (1) Figure, Fig.24 (2) Figure and Fig.24 Figure (3) is a schematic diagram of another preparation process of the second conductive pad set provided in an embodiment of the present application;

[0060] Fig.25 A schematic diagram of a configuration method of a buffer layer in a display device provided in an embodiment of the present application;

[0061] Fig.26 A schematic diagram of a configuration method of a light-transmitting protective layer in a spliced ​​display device provided in an embodiment of the present application;

[0062] Fig. 27 A flowchart of a method for adjusting a picture of a spliced ​​display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0064] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings represent the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to actual scale.

[0065] In the embodiments of the present application, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with basically the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present application and shall not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0066] In the embodiments of the present application, the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0067] In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" are intended to indicate that a specific feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0068] In the embodiments of the present application, “plurality” means two or more, and “at least one” means one or more, unless otherwise clearly and specifically defined.

[0069] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present application include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances related to the measurement of specific quantities (e.g., the limitations of the measurement system), and are expressed as being within the acceptable deviation range for a specific value determined by a person of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value.

[0070] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, ie, meaning "including, but not limited to."

[0071] The "same layer" in the embodiments of the present application refers to the relationship between multiple film layers formed by the same material after the same step (e.g., a one-step patterning process). The "same layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same. The polygons in this specification are not strictly defined, and can be approximate triangles, parallelograms, trapezoids, pentagons or hexagons, etc., and there may be some small deformations caused by tolerances.

[0072] In the embodiments of the present application, the term “electrically connected” may refer to a direct electrical connection between two components, or may refer to an electrical connection between two components via one or more other components.

[0073] With the development of science and technology, the application of spliced ​​display devices is becoming more and more extensive. Spliced ​​display devices are usually composed of multiple independent display devices, each of which includes a display panel and a backlight module. However, there is a black border at the seam position of the spliced ​​display device, which reduces the display effect of the spliced ​​display device. Among them, the seam width is an important physical parameter of the spliced ​​display device. In order to reduce the seam width, the frame of the spliced ​​display device is gradually reduced from 2mm to 0.88mm. Due to the limitations of existing processes, it is not easy to further reduce the seam.

[0074] Based on this, an embodiment of the present application provides a display device, which includes a display panel, a backlight module and a plurality of light-emitting devices. The display panel is located on the light-emitting side of the backlight module and is electrically connected to the display panel; the plurality of light-emitting devices are arranged on at least one side of the peripheral side of the display panel; the orthographic projection of the light-emitting device on the light-emitting surface of the backlight module and the orthographic projection of the display panel on the light-emitting surface of the backlight module do not overlap each other. By arranging a plurality of light-emitting devices on at least one side of the display panel, when the display device is used as a spliced ​​display device, the side on which the plurality of light-emitting devices are arranged is spliced ​​with another display device. At this time, the plurality of light-emitting devices arranged at the splicing position can realize the display of the picture, which is conducive to the preparation of a "zero-seam" splicing display device.

[0075] The display device and the spliced ​​display device provided in the embodiments of the present application will be specifically introduced and described below in conjunction with the accompanying drawings.

[0076] The embodiment of the present application provides a display device, such as Fig.18 As shown, the display device includes:

[0077] The display panel 100 includes a display area and a peripheral area surrounding the display area;

[0078] The backlight module 200 is electrically connected to the display panel 100 , and the display panel 100 is located at the light emitting side of the backlight module 200 ;

[0079] A plurality of light emitting devices Q are arranged on at least one side surface of the peripheral side of the display panel 100 ; the orthographic projection of the light emitting device Q on the light emitting surface of the backlight module 200 and the orthographic projection of the display panel 100 on the light emitting surface of the backlight module 200 do not overlap each other.

[0080] In an exemplary embodiment, the above-mentioned display panel 100 can be a liquid crystal display panel (Liquid Crystal Display, LCD). Exemplarily, the liquid crystal display panel can include a twisted nematic (Twisted Nematic, TN) type, a vertical alignment (Vertical Alignment, VA) type, an in-plane switching (In Plane Switching, IPS) type and an advanced super dimensional field switch (ADS, Advanced Super Dimension Switch) type.

[0081] The liquid crystal display panel may include an array substrate 101 and a color filter substrate 102, with a liquid crystal layer LC (not drawn in the figure) located between the array substrate 101 and the color filter substrate 102; it also includes a first polarizer 103 and a second polarizer 104 located on both sides of the array substrate 101 and the color filter substrate 102 respectively.

[0082] The array substrate 101 and the color filter substrate 102 respectively include a substrate, and the specific material of the substrate is not limited here. Exemplarily, the substrate can be any one of silicon, glass, quartz, PET and the like.

[0083] The structures and components included in the array substrate 101 and the color filter substrate 102 of the display panel 100 are not limited here, and the specific structures and components can be determined according to the design of the product.

[0084] The above-mentioned active area (AA) refers to an area used for realizing display, and the peripheral area surrounding the active area AA is used for wiring and binding circuit boards.

[0085] The backlight module 200 is used to provide a light source with sufficient brightness and uniform brightness distribution to the display device. The specific structure of the backlight module 200 and the type of the light emitter (light source) in the backlight module 200 are not limited here.

[0086] For example, Fig.17 As shown, the light-emitting body 208 (light source) in the above-mentioned backlight module 200 can be a light-emitting diode (Light-Emitting Diode, abbreviated as LED in English), a sub-millimeter light-emitting diode (Mini Light Emitting Diode, abbreviated as Mini LED in English) or a micro light-emitting diode (Micro Light Emitting Diode, abbreviated as Micro LED in English).

[0087] For example, Fig.17 As shown, the light-emitting body 208 is arranged on the lamp board 205 , and a first reflective layer 207 is also arranged on the lamp board 205 . The first reflective layer 207 is provided with an opening, and the light-emitting body 208 is arranged in the opening of the first reflective layer 207 .

[0088] Exemplarily, the backlight module 200 may further include: Fig.17 The back plate 204 and the light board 205 shown in the figure are fixed on the back plate 204 through the first adhesive layer 206, and the middle frame 203 is arranged around the light source. One side of the middle frame 203 is fixed to the light board 205, and the other side of the middle frame 203 is fixed to the optical film layer 201 through the second adhesive layer 202, wherein the inner side of the middle frame 203 is covered with a second reflective layer 210 to reflect the light emitted by the light source 208 onto the optical film layer 201 as much as possible, and the middle frame 203 is provided with a corner block 209 to improve the supporting strength of the middle frame 203.

[0089] It should be noted that the optical film layer 201 may include multiple sub-layers. For example, a diffuser plate, a quantum dot film, a diffuser sheet, and a composite film, wherein the material of the diffuser plate may include any one of glass, polystyrene (PS), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), and acrylic (PMMA); quantum dot film (QD Enhancement Films, referred to as QDEF) is a technology for making a film sheet by mixing quantum dot phosphors and polymers evenly, for example, the material of the quantum dot film may include perovskite quantum dot material, and its thickness is generally about 100um; the material of the diffuser sheet may be the same as that of the diffuser plate; the composite film is used to improve the light efficiency and is also used as a protective film for the diffuser plate, quantum dot film, and diffuser sheet to protect them from scratches or damage.

[0090] In addition, a glue layer may be provided between the optical film layer 201 and the display panel 100 for fixing. Fig.17 The glue layer is not drawn in the figure, and the details can be referred to the introduction in the relevant technology.

[0091] The backlight module 200 may further include other structures and components. The specific structures and components included in the backlight module 200 may refer to the introduction in the related art, which will not be described in detail here.

[0092] Taking the plane shape of the display panel 100 as a rectangle as an example, the display panel 100 has four sides, and the plurality of light emitting devices Q are arranged on at least one side of the peripheral side of the display panel 100, including but not limited to the following cases:

[0093] First, a plurality of light emitting devices Q are disposed on one side surface among the peripheral sides of the display panel 100 .

[0094] Second, a plurality of light-emitting devices Q are arranged on two side surfaces of the peripheral side of the display panel 100. For example, a plurality of light-emitting devices Q are arranged on two adjacent side surfaces (i.e., two connected side surfaces) of the peripheral side of the display panel 100. For another example, a plurality of light-emitting devices Q are arranged on two opposite side surfaces (i.e., two side surfaces that are substantially parallel to each other) of the peripheral side of the display panel 100.

[0095] Third, a plurality of light emitting devices Q are arranged on three side surfaces of the peripheral side of the display panel 100 , that is, a plurality of light emitting devices Q are arranged on three connected side surfaces of the peripheral side of the display panel 100 .

[0096] Fourth, a plurality of light emitting devices Q are disposed on four side surfaces of the peripheral side of the display panel 100 , that is, a plurality of light emitting devices Q are disposed on each side surface of the peripheral side of the display panel 100 .

[0097] The type of the light-emitting device Q is not limited here. For example, the light-emitting device Q can be a sub-millimeter light-emitting diode (Mini Light Emitting Diode, abbreviated as Mini LED in English) or a micro light-emitting diode (Micro Light Emitting Diode, abbreviated as Micro LED in English).

[0098] In some embodiments, the plurality of light-emitting devices Q disposed on the side of the display panel 100 may all be light-emitting devices that emit a single color of light, for example, all light-emitting devices that emit white light; or, all light-emitting devices that emit blue light. In this case, the plurality of light-emitting devices Q may be used as light sources, and a color conversion layer may be provided to achieve display, wherein the color conversion layer may include a color filter layer and quantum dot layers of different colors. For a detailed description of the color conversion layer, reference may be made to the relevant art.

[0099] In some embodiments, the multiple light-emitting devices Q arranged on the side of the display panel 100 may include light-emitting devices that emit light of different colors, such as three light-emitting devices that emit red, green and blue light. In this case, the multiple light-emitting devices Q can be directly used for display.

[0100] The light emitting surface of the backlight module 200 mentioned above refers to the surface from which light in the backlight module 200 is emitted. The light emitting surface of the display panel 100 and the light emitting surface of the light emitting device Q mentioned below have similar meanings to those here and will not be described in detail below.

[0101] The light emitting surface includes a flat surface and a curved surface, which is specifically related to the structure of the main body emitting the light and is not limited here.

[0102] It should be noted that the above-mentioned “orthographic projection of the light-emitting device Q on the light-emitting surface of the backlight module 200” refers to the orthographic projection of the light-emitting device Q on the extended plane of the light-emitting surface of the backlight module 200. It can be understood that the light-emitting surface of the backlight module 200 is coplanar with the extended plane of its light-emitting surface.

[0103] In the display device provided in the embodiment of the present application, a plurality of light-emitting devices Q are arranged on at least one side of the display panel 100. When the display device is used as a spliced ​​display device, the side on which the plurality of light-emitting devices Q are arranged is spliced ​​with another display device. At this time, the plurality of light-emitting devices Q arranged at the splicing position can realize the display of the picture, which is facilitating the preparation of a "zero-seam" splicing display device.

[0104] In at least one embodiment of the present application, Figure 1-Figure 4 , Figure 5A and Figure 5BAs shown, the display panel includes a first side surface CM1, and the first side surface CM1 intersects with the light emitting surface of the display panel;

[0105] The display device includes multiple first conductive pad groups D1, the first conductive pad groups D1 are arranged on the first side CM1, and the light-emitting device Q is located on the side of the first conductive pad group D1 away from the first side CM1; one first conductive pad group D1 includes at least two conductive pads (for example, a positive conductive pad electrically connected to the positive electrode of the light-emitting device Q and a negative conductive pad electrically connected to the negative electrode of the light-emitting device Q), and one light-emitting device Q is electrically connected to each conductive pad in the same first conductive pad group D1.

[0106] Exemplarily, the conductive pads in the first conductive pad group D1 may be pads electrically connected to the light emitting device Q.

[0107] Exemplarily, the conductive pads in the first conductive pad group D1 may be pins of the light emitting device Q.

[0108] In an exemplary embodiment, when each light emitting device Q is independently packaged, the conductive pads in the first conductive pad group D1 are solder pads, which are located outside the packaging structure and electrically connected to the light emitting device Q.

[0109] In an exemplary embodiment, when a plurality of light-emitting devices Q of different colors are packaged together to form a light-emitting unit P, the conductive pads in the first conductive pad group D1 are pins of each light-emitting device Q in the light-emitting unit P, and each pin is located inside the packaging structure of the light-emitting unit P. For the specific situation of packaging a plurality of light-emitting devices Q of different colors together to form a light-emitting unit P, reference may be made to the description below.

[0110] It should be noted that, in the drawings provided in the embodiments of the present application, the structure of each conductive pad in the first conductive pad group D1 is not drawn out, but the conductive pads in the first conductive pad group D1 are simplified as a whole. In actual applications, the conductive pads in the same first conductive pad group D1 are independently arranged, and there is a gap between the conductive pads.

[0111] In at least one embodiment of the present application, Figure 1-Figure 4 , Figure 5A and Figure 5B As shown, the display panel 100 includes an array substrate 101 and a color film substrate 102 that are relatively arranged, and the first side surface CM1 includes a first area Area1 located on the array substrate 101 and a second area Area2 located on the color film substrate 102; the light-emitting device Q and the first conductive pad group D1 are arranged in the first area, and / or the light-emitting device Q and the first conductive pad group D1 are arranged in the second area.

[0112] The light emitting device Q and the first conductive pad group D1 are arranged in the first area Area1, and / or the light emitting device Q and the first conductive pad group D1 are arranged in the second area Area2, including the following situations:

[0113] First, if Figure 4 As shown, the light emitting device Q and the first conductive pad group D1 are disposed in the first area Area1 (the portion where the first side surface CM1 is located on the array substrate 101 ).

[0114] Second, if Figure 2 As shown, the light emitting device Q and the first conductive pad group D1 are arranged in the second area Area2 (the portion where the first side surface CM1 is located on the color filter substrate 102 ).

[0115] Third, if Figure 1 , Figure 5A , Figure 5B , Figure 6 , Figure 7 and Figure 8 As shown, part of the light-emitting device Q and the first conductive pad group D1 are arranged in the first area Area1 (the first side CM1 is located on the array substrate 101), and part of the light-emitting device Q and the first conductive pad group D1 are arranged in the second area Area2 (the first side CM1 is located on the color filter substrate 102).

[0116] Fourth, if Figure 3 As shown, part of the structure of the light-emitting device Q and part of the structure of the first conductive pad group D1 are arranged in the first area Area1 (the first side surface CM1 is located in the portion of the array substrate 101), and part of the structure of the light-emitting device Q and part of the structure of the first conductive pad group D1 are arranged in the second area Area2 (the first side surface CM1 is located in the portion of the color film substrate 102).

[0117] The arrangement of the plurality of light emitting devices Q on the first side surface CM1 is not limited here.

[0118] In an exemplary embodiment, when the display device is applied to a spliced ​​display device, in order to improve the display effect at the splicing position and improve the stability of the light-emitting device Q on the first side CM1, the light-emitting device Q can be distributed as evenly as possible on the first side CM1 of the display panel 100.

[0119] Exemplarily, the plurality of light emitting devices Q include a first light emitting device Q1, a second light emitting device Q2, and a third light emitting device Q3, each emitting light of different colors. Figure 6 , Figure 7 and Figure 8 Arrangements of a plurality of light emitting devices Q on the first side surface CM1 are provided respectively.

[0120] In at least one embodiment of the present application, Figure 5A and Figure 5B As shown, the peripheral area includes a binding sub-area, the binding sub-area includes a second side surface CM2, and the second side surface CM2 intersects with the light emitting surface of the display panel; the display device includes a plurality of second conductive pad groups D2, the second conductive pad group D2 includes at least one conductive pad, the second conductive pad group D2 is arranged on the second side surface CM2, and the second conductive pad group D2 is electrically connected to the driving circuit on the array substrate 101.

[0121] Exemplarily, there are gaps between the conductive pads included in the second conductive pad group D2, and there are also gaps between two adjacent second conductive pad groups D2 to avoid short circuits.

[0122] It should be noted that, in the embodiments of the present application, the second conductive pad group D2 includes one conductive pad as an example for description and drawing.

[0123] The specific material of the conductive pads included in the second conductive pad group D2 is not limited here. Exemplarily, the material of the conductive pads included in the second conductive pad group D2 includes metal, such as silver (Ag); specifically, it can be a glue or glue containing silver particles (Ag Ink).

[0124] The binding sub-area is used to set a flexible circuit board (FPC), and the flexible circuit board and the second conductive pad group D2 electrically connect the driving circuit and the circuit board in the array substrate 101 of the display panel 100, and the circuit board is used to provide a driving signal to the display device.

[0125] Specifically, the driving circuit in the array substrate 101 is electrically connected to the circuit board 2 through the second conductive pad group D2 and the flexible circuit board FPC in sequence; that is, the driving circuit is electrically connected to the second conductive pad group D2 through the wire L1, the second conductive pad group D2 is electrically connected to the flexible circuit board FPC, and the flexible circuit board FPC is electrically connected to the circuit board 2 (driving circuit board).

[0126] It should be noted that the first side surface CM1 of the display panel 100 mentioned above is also located in the peripheral area of ​​the display panel 100 (not shown in the figure), wherein it is not limited in the above text whether the first side surface CM1 is set in the binding sub-area.

[0127] In some embodiments, the first side surface CM1 can be set in an area of ​​the peripheral area except the binding sub-area. In this case, the first side surface CM1 can be set adjacent to (connected to) the second side surface CM2; or, the first side surface CM1 can be set opposite to the second side surface CM2 (the two are roughly parallel).

[0128] In some embodiments, the first side surface CM1 can be arranged in the binding sub-area, in which case the first side surface CM1 and the second side surface CM2 are the same side surface, that is, the first conductive pad group D1 and the second conductive pad group D2 are arranged on the same side surface of the display panel 100, and there is no overlap between the two; wherein the light emitting device Q is located on the side of the first conductive pad group D1 away from the side surface, and the light emitting device Q is electrically connected to the first conductive pad group D1. The distribution mode of the first conductive pad group D1 and the second conductive pad group D2 is not limited here, and can be specifically determined according to the arrangement mode of the light emitting device Q and the setting position of the second conductive pad group D2 and the wire L1 of the driving circuit on the array substrate 101.

[0129] In at least one embodiment of the present application, Fig. 9 , Fig.10 and Fig.11 As shown, the second side surface CM2 includes a third area Area3 located on the array substrate 101 and a fourth area Area4 located on the color filter substrate 102; the second conductive pad group D2 is arranged in the third area Area3, and / or the second conductive pad group D2 is arranged in the fourth area Area4.

[0130] The second conductive pad group D2 is disposed in the third area Area3, and / or the second conductive pad group D2 is disposed in the fourth area Area4, including but not limited to the following situations:

[0131] First, if Fig. 9 As shown, the second conductive pad group D2 is disposed in the third area Area3 (the second side surface CM2 is located in a partial area of ​​the array substrate 101);

[0132] Second, if Fig.10 As shown, the second conductive pad group D2 is disposed in the fourth area Area4 (the second side surface CM2 is located in a partial area of ​​the color filter substrate 102);

[0133] Third, if Fig.11 As shown, a portion of the second conductive pad set D2 is disposed in the third area Area3, and another portion of the second conductive pad set D2 is disposed in the fourth area Area4.

[0134] It should be noted that, in actual applications, when the second conductive pad group D2 and the first conductive pad group D1 are arranged on different sides of the display panel 100, the second conductive pad group D2 can be arranged in the third area Area 3 or the fourth area Area 4 according to the design space and the position of the wire L1 of the driving circuit on the array substrate 101.

[0135] When the first conductive pad group D1 and the second conductive pad group D2 are arranged on the same side of the display panel 100, the first area Area1 and the third area Area3 are the same area, and the second area Area2 and the fourth area Area4 are the same area. At this time, while considering the position of the second conductive pad group D2 and the wire L1 of the driving circuit on the array substrate 101, it is also necessary to avoid the design position of the first conductive pad group D1 and the light-emitting device Q; therefore, it can be determined based on the above two factors that the second conductive pad group D2 is arranged in the third area Area3 or the fourth area Area4.

[0136] Exemplarily, when the first conductive pad group D1 and the second conductive pad group D2 are disposed on the same side of the display panel 100 , the orthographic projection of the second conductive pad group D2 on the first side does not overlap with the orthographic projection of the light emitting device Q on the first side.

[0137] In at least one embodiment of the present application, the plurality of light emitting devices Q include a first light emitting device Q1, a second light emitting device Q2, and a third light emitting device Q3, and the first light emitting device Q1, the second light emitting device Q2, and the third light emitting device Q3 have different light emitting colors;

[0138] In an exemplary embodiment, one of the first light emitting device Q1 , the second light emitting device Q2 , and the third light emitting device Q3 is a red light emitting device, another is a green light emitting device, and another is a blue light emitting device.

[0139] For example, the first light emitting device Q1 may be a red light emitting device, the second light emitting device Q2 may be a green light emitting device, and the third light emitting device Q3 may be a blue light emitting device.

[0140] Among them, Figure 12-Figure 15 As shown, a first light emitting device Q1 , a second light emitting device Q2 and a third light emitting device Q3 are packaged into a light emitting unit P, and the light emitting unit P extends from the area where the first side surface CM1 is located on the array substrate 101 to the area where the first side surface CM1 is located on the color filter substrate 102 .

[0141] The packaging method of the light emitting unit P is not limited here.

[0142] In some embodiments, the light-emitting devices Q in the same light-emitting unit P may share a packaging film layer, that is, the packaging film layer covers the light-emitting devices Q in the same light-emitting unit P.

[0143] In some embodiments, when a first light-emitting device Q1, a second light-emitting device Q2, and a third light-emitting device Q3 are packaged into a light-emitting unit P, the first conductive pad group D1 electrically connected to the first light-emitting device Q1, the first conductive pad group D1 electrically connected to the second light-emitting device Q2, and the first conductive pad group D1 electrically connected to the third light-emitting device Q3 can all be packaged inside the same light-emitting unit P, and then the light-emitting unit P is set on the first side CM1.

[0144] Of course, the light emitting unit P may also have other packaging methods. For details, please refer to the introduction of the packaging methods and specific components of the light emitting unit P in the relevant technology, which will not be repeated here.

[0145] In the embodiment of the present application, by first packaging a first light-emitting device Q1, a second light-emitting device Q2 and a third light-emitting device Q3 into a light-emitting unit P, and then disposing the light-emitting unit P on the first side surface CM1, the difficulty of the manufacturing process of the display device can be greatly reduced and the manufacturing efficiency can be improved.

[0146] In at least one embodiment of the present application, the plane size of each conductive pad in the second conductive pad group D2 is larger than the plane size of each conductive pad in the first conductive pad group D1. Figure 11-Figure 15 As shown, the conductive pads in the second conductive pad group D2 extend from the area where the second side surface CM2 is located on the array substrate 101 to the area where the second side surface CM2 is located on the color filter substrate 101 .

[0147] The above-mentioned “plane size” refers to the side length, diagonal line, radius, diameter, length along any direction or area of ​​the orthographic projection figure of the conductive pads in the second conductive pad group D2 on the second side surface CM2.

[0148] Exemplarily, the area of ​​the plane figure of each conductive pad in the second conductive pad group D2 is greater than the area of ​​the plane figure of each conductive pad in the first conductive pad group D1. The "plane figure" is the above-mentioned orthographic projection figure.

[0149] In an embodiment of the present application, since the second conductive pad group D2 needs to be directly bound to the flexible circuit board in a subsequent process, by setting the planar size of each conductive pad in the second conductive pad group D2 to be larger than the planar size of each conductive pad in the first conductive pad group D1, the contact area between the second conductive pad group D2 and the flexible circuit board can be greatly increased, thereby improving the stability of binding and the stability of conduction, thereby improving the quality of the display device.

[0150] The flexible circuit board FPC can also be replaced by a chip on film (COF).

[0151] In at least one embodiment of the present application, Figure 5B , Figure 12-Figure 15 As shown, the first side surface CM1 and the second side surface CM2 are the same side surface, and at least one second conductive pad group D2 is disposed in the area between two adjacent light emitting units Q; Fig.14 and Fig.15 As shown, the display device also includes a chip-on-chip film 1, which covers the second conductive pad group D2 and extends to the side of the backlight module 200, and the orthographic projection of the chip-on-chip film 1 on the first side CM1 and the orthographic projection of the light-emitting unit P on the first side CM1 do not overlap each other; the first conductive pad group D1 and the chip-on-chip film 1 are electrically connected, and the second conductive pad group D2 and the chip-on-chip film 1 are bound together.

[0152] In at least one embodiment of the present application, the first conductive pad group D1 includes a positive conductive pad and a negative conductive pad, such as Fig.16 As shown, the light-emitting unit P includes but is not limited to a first pin Y1, a second pin Y2, a third pin Y3 and a fourth pin Y4, the positive conductive pads of the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q3 are all electrically connected to the first pin Y1, the negative conductive pad of the first light-emitting device Q1 is electrically connected to the second pin Y2, the negative conductive pad of the second light-emitting device Q2 is electrically connected to the third pin Y3, and the negative conductive pad of the third light-emitting device Q3 is electrically connected to the fourth pin Y4;

[0153] The positive conductive pad can be electrically connected to the positive electrode of the light-emitting device Q, and the negative conductive pad can be electrically connected to the negative electrode of the light-emitting device Q.

[0154] Exemplarily, the positive conductive pad and the negative conductive pad may both be pins of the light emitting device Q.

[0155] like Fig.14 and Fig.15 As shown, the chip-on-film 1 covers at least a portion of the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, and the chip-on-film 1 is respectively bound to the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4.

[0156] The arrangement positions of the first pin Y1 , the second pin Y2 , the third pin Y3 and the fourth pin Y4 of the light emitting unit P are not limited here.

[0157] Exemplarily, the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 can be respectively set on different sides of the light-emitting unit P. For example, one of the above four pins is set on the side on the left side of the light-emitting unit P, and the remaining three are set on the side on the lower side of the light-emitting unit P.

[0158] Exemplarily, the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 can be set on the same side of the light-emitting unit P. For example, the four pins are all set on the lower side of the light-emitting unit P, which facilitates binding between each pin and the chip-on-chip film 1 and avoids short circuit between each pin and the second conductive pad D2.

[0159] The materials of the first pin Y1 , the second pin Y2 , the third pin Y3 and the fourth pin Y4 of the light emitting unit P are not limited here. For example, the materials of the respective pins may include metal.

[0160] In other embodiments, it may be possible to set the negative conductive pads of the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q3 in a light-emitting unit P to be electrically connected to the first pin Y1, the positive conductive pad of the first light-emitting device Q1 to be electrically connected to the second pin Y2, the positive conductive pad of the second light-emitting device Q2 to be electrically connected to the third pin Y3, and the positive conductive pad of the third light-emitting device Q3 to be electrically connected to the fourth pin Y4.

[0161] In this specification, an example is given in which the positive conductive pads of the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q3 are all electrically connected to the first pin Y1, the negative conductive pad of the first light-emitting device Q1 is electrically connected to the second pin Y2, the negative conductive pad of the second light-emitting device Q2 is electrically connected to the third pin Y3, and the negative conductive pad of the third light-emitting device Q3 is electrically connected to the fourth pin Y4.

[0162] Wherein, “the chip-on-film 1 covers at least a portion of the first lead Y1, the second lead Y2, the third lead Y3 and the fourth lead Y4” includes but is not limited to the following situations:

[0163] First, if Fig.14 and Fig.15 As shown, the chip-on-chip film 1 covers a portion of the first pin Y1, a portion of the second pin Y2, a portion of the third pin Y3 and a portion of the fourth pin Y4, respectively, so that there is a gap between the chip-on-chip film 1 and the light-emitting unit P, avoiding a short circuit caused by a small distance between the chip-on-chip film 1 and other pins or conductive structures of the light-emitting unit P.

[0164] Second, if Fig.14 and Fig.15 As shown, when the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4 are arranged on the same side of the light-emitting unit P and no other pins or conductive structures are arranged on the side, the chip-on-film 1 can be arranged to completely cover the first pin Y1, the second pin Y2, the third pin Y3 and the fourth pin Y4, thereby increasing the contact area between the chip-on-film 1 and the above four pins, and improving the binding stability and conductive stability.

[0165] In at least one embodiment of the present application, Figure 5A As shown, the first side surface CM1 and the second side surface CM2 are different sides, and the display device also includes a chip-on-chip film 1, which covers the second conductive pad group D2 and extends to the side of the backlight module 200; the portion of the array substrate 102 located in the peripheral area also includes a plurality of binding leads, the first conductive pad group D1 is electrically connected to the chip-on-chip film 1 through the binding leads, and the second conductive pad group D2 is bound to the chip-on-chip film 1.

[0166] In an exemplary embodiment, a conductive adhesive, such as anisotropic conductive film (ACF), may be further disposed between the second conductive pad set D2 and the chip-on-film 1 to bind the second conductive pad set D2 and the chip-on-film 1 together through the conductive adhesive.

[0167] The anisotropic conductive film (ACF) can be conductive along a direction perpendicular to the second side surface CM2 , but is not conductive along a direction parallel to the second side surface CM2 .

[0168] It should be noted that the chip-on-chip film 1 is arranged on the side of the binding sub-area in the display panel 100. When the first side CM1 and the second side CM2 are different sides (that is, when there is a light-emitting device Q arranged on a side other than the binding sub-area), it is necessary to wind the binding leads located in the peripheral area to electrically connect the first conductive pad group D1 corresponding to the light-emitting device Q with the chip-on-chip film 1, so that the subsequent circuit board can transmit the driving signal to the light-emitting device Q through the chip-on-chip film 1, thereby realizing the simultaneous driving of the display panel 100 and the light-emitting device Q.

[0169] In at least one embodiment of the present application, Fig.18 As shown, the display device also includes at least one circuit board 2 and at least one L-shaped protective plate 3. The circuit board 2 and the chip-on-chip film 1 are arranged on the same side of the backlight module 200, and the circuit board 2 is electrically connected to the backlight module 200 and the chip-on-chip film 1, respectively; the circuit board 2 is configured to drive the display panel 100 and the light-emitting device Q at the same time; a part of the protective plate 3 is arranged on a side of the circuit board 2 away from the backlight module 200, and another part of the protective plate 3 is arranged on a side of the circuit board 2 away from the chip-on-chip film 1.

[0170] For example, Fig.18 As shown, a flexible film 31 is also attached to at least a portion of the side of the L-shaped protection plate 3 away from the backlight module 200 to improve the impact resistance of the protection plate 3 and prevent it from being damaged.

[0171] In some embodiments, the display device may include a circuit board 2; in other embodiments, the display device may include two circuit boards 2; wherein the number of circuit boards 2 included in the display device is less than or equal to the number of chip-on-chip films 1, and each circuit board 2 is electrically connected to at least part of the second conductive pad group D2 and at least part of the light-emitting device Q through at least one chip-on-chip film 1.

[0172] The circuit board 2 can also be electrically connected to the backlight module 200 .

[0173] The circuit board includes a timing controller (TCON). In some embodiments, the timing controller can provide video signals and audio signals to the display panel 100; in other embodiments, the timing controller can also provide a GOA signal to the display panel 100; in yet other embodiments, the timing controller can provide a control signal to the backlight module 200 to control the light emitting state and brightness of its light source.

[0174] In the embodiment of the present application, the timing controller also simultaneously controls the light-emitting state and brightness of all light-emitting devices Q. The light-emitting state refers to a bright state or a dark state.

[0175] Specifically, according to the requirements of the display image, the circuit board 2 transmits different driving signals to the second pin Y2, the third pin Y3 and the fourth pin Y4 of the light-emitting unit P, so that the first light-emitting device Q1, the second light-emitting device Q2 and the third light-emitting device Q2 display different colors, thereby realizing the display panel 100 and all the light-emitting devices Q2 being driven simultaneously and displaying the same complete picture.

[0176] In at least one embodiment of the present application, Fig.17 and Fig.22A As shown, the display panel 100 further includes at least one third side surface CM3 in addition to the first side surface CM1. The portion of the third side surface CM3 located on the color filter substrate 102 is provided with a reflective surface (not marked). The reflective surface and the reference surface ( Fig.17 The angle β between the third side surface CM3 and the reference surface (the dotted line position beside the third side surface CM3 represents a reference surface) is an acute angle, and the reference surface is a plane perpendicular to the light emitting surface of the display panel 100.

[0177] In at least one embodiment of the present application, Fig.17 and Fig.22A As shown, the angle range of the acute angle β is greater than 0° and less than or equal to 30°.

[0178] Exemplarily, the acute angle β may be 30°, 28°, 25°, 24°, 22°, 20°, 18°, 15°, 13°, 10°, 8°, 5°, or 3°.

[0179] In the embodiment of the present application, by setting the angle range of the acute angle β to be greater than 0° and less than or equal to 30°, when the display device is applied to Fig. 20 or Fig.22A In the case of the spliced ​​display device shown in , the side of one display device provided with a reflective surface and the side of another display device provided with a light emitting device Q are spliced ​​together, and the reflective surface is steeper, so that the reflective surface can direct more light along a similar Fig.22A The direction of the dotted arrow shown in the figure is reflected to the area near the left side of the joint, thereby improving the uniformity of light output at the joint position, improving the display effect of the spliced ​​display device, and achieving a display effect approaching "zero joint".

[0180] In at least one embodiment of the present application, Fig.17 and Fig.22A As shown, the display device further includes a reflective portion F, and the reflective portion F covers the reflective surface.

[0181] In an exemplary embodiment, the reflective portion F may include a reflective sheet or a third reflective layer;

[0182] Exemplarily, the material of the third reflective layer may include white oil, which may include resin (eg, epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and an organic solvent (eg, dipropylene glycol methyl ether), etc.

[0183] Exemplarily, the material of the third reflective layer may also include silicon-based white glue.

[0184] Exemplarily, the material of the third reflective layer may further include silver (Ag).

[0185] Exemplarily, the materials of the first reflective layer 207 , the second reflective layer 210 , and the third reflective layer may be the same.

[0186] In the display device provided in the embodiment of the present application, by providing a reflective portion F on the third side surface CM3, its reflective capability to the light emitting device Q can be further improved, so that more light can be reflected along the similar Fig.22A The direction of the dotted arrow shown in the figure is reflected to the area near the left side of the joint, thereby improving the uniformity of light output at the joint position, improving the display effect of the spliced ​​display device, and achieving a display effect approaching "zero joint".

[0187] In at least one embodiment of the present application, Fig.25 As shown, the display device also includes a buffer layer 8 and multiple packaging parts 5, the packaging part 5 at least covers the light emitting surface of the light emitting device Q, the buffer layer 8 covers the side of the display panel 100 where the light emitting device Q is arranged, and the buffer layer includes multiple openings K, and the light emitting device Q is arranged in the opening K.

[0188] Exemplarily, each packaging part 5 encapsulates a light emitting device Q. While the packaging part 5 performs the packaging function for the light emitting device Q, due to its special convex lens structure (Lens), the packaging part 5 can also improve the light efficiency of the light emitting device Q.

[0189] In some embodiments, the display device may further include an encapsulation layer disposed on a side of the light emitting device Q away from the first side surface CM1 to protect the light emitting device Q. Exemplarily, the encapsulation layer may be a whole layer covering the plurality of light emitting devices Q.

[0190] In the embodiment of the present application, the light emitting device Q is packaged by taking the packaging part as an example.

[0191] Exemplarily, the buffer layer 8 may include a buffer material, such as a flexible polymer material or foam, so as to avoid damage to the light emitting device Q during transportation, resulting in poor lighting.

[0192] Exemplarily, the material of the buffer layer 8 may include ethylene-vinyl acetate copolymer (EVA).

[0193] In some embodiments, when each light-emitting device Q is independently packaged, the opening K corresponds to the light-emitting device Q one by one; when three light-emitting devices Q of different colors are packaged into a light-emitting unit P, the opening K corresponds to the light-emitting unit P one by one.

[0194] In an exemplary embodiment, the distance between the edge of each opening K and the edge of the light emitting device Q located in the opening K is 1-2 μm.

[0195] In an exemplary embodiment, the distance between the edge of each opening K and the edge of the light emitting unit P located in the opening K is 1-2 μm.

[0196] In at least one embodiment of the present application, the light emitting angle γ of the light emitting device Q is in the range of 30° to 60°.

[0197] In an exemplary embodiment, the display device is applied to Fig.21A In the case of the spliced ​​display device shown in , that is, when the side of a display device without a light-emitting unit Q is spliced ​​together with the side of another display device with a light-emitting device Q, the combination Fig. 21BAs shown, the dotted line with an arrow is the emission direction of the light, the mark a is the maximum size of the packaging part 5 in the horizontal direction, and the mark b is the thickness of the color film substrate 102; wherein, in order to improve the uniformity of the light at the joint position, a part of the light emitted by the light-emitting device Q is set to be directly emitted (the light marked LC), and a part of it is irradiated on the side of the color film substrate 102 of the right display device to be reflected, so that the reflected light is scattered and then emitted (the light marked LB), so that the light emitted by the light-emitting device Q can be emitted as uniformly as possible at the joint position.

[0198] Based on this, combined Fig. 21B As shown, it is necessary to set tanγ≤b / a. At this time, part of the light emitted by the light emitting device Q is irradiated on the side of the color filter substrate 102 and reflected; wherein γ is the light emitting angle of the light emitting device Q.

[0199] It should be noted that the reference Fig. 21B and Fig. 22B As shown, the light emitting angle γ of the light emitting device Q refers to the angle between the light emitted laterally by the light emitting device Q and the light emitted forwardly;

[0200] In an exemplary embodiment, the display device is applied to Fig.22A In the case of the spliced ​​display device shown in , that is, when the side of one display device provided with a reflective surface and the side of another display device provided with a light emitting device Q are spliced ​​together, the combination Fig. 22B As shown, the dotted line with an arrow is the emission direction of the light, the mark a is the maximum size of the packaging part 5 in the horizontal direction, the mark b is the thickness of the color film substrate 102, and the mark c is the size of the positive projection of the reflective surface on the surface of the color film substrate 102 close to the array substrate 101; wherein, in order to improve the uniformity of light at the seam position, a part of the light emitted by the light-emitting device Q is set to be directly emitted (the light marked LC), and a part of it is irradiated on the side of the color film substrate 102 of the right display device to be reflected, so that the reflected light is scattered and then emitted (the light marked LB), so that the light emitted by the light-emitting device Q can be emitted as uniformly as possible at the seam position.

[0201] Based on this, combined Fig. 22B As shown, it is necessary to set tanγ≤b / (a+c), that is, part of the light emitted by the light emitting device Q is irradiated onto the reflective portion F provided on the color filter substrate 102 and is reflected;

[0202] On the basis of satisfying tanγ≤b / a or tanγ≤b / (a+c), a part of the light emitted by the light-emitting device Q is set to be directly emitted. Based on the fact that the maximum dimension a of the current packaging portion 5 along the horizontal direction is in the range of 0.2-0.4 mm and the thickness of the glass of the color film substrate is 0.5-0.8 mm, after comprehensive consideration, the light-emitting angle γ of the light-emitting device Q is set to be in the range of 30°-60°. In this way, a part of the light emitted by the light-emitting device Q can be directly emitted (the light marked with LC), and a part of it can be irradiated on the side of the color film substrate 102 of the right display device and reflected, so that the reflected light is scattered and then emitted (the light marked with LB), thereby improving the light uniformity at the joint position and improving the display effect of the spliced ​​display device prepared by the above-mentioned display device.

[0203] An embodiment of the present application provides a spliced ​​display device, comprising at least a first display device and a second display device, wherein the first display device and the second display device are both the display devices described above;

[0204] Among them, Fig.19 , Fig. 20 , Fig.21A and Fig.22A As shown, the first display device (for example, the display device on the left) includes a first splicing edge, and the second display device (for example, the display device on the right) includes a second splicing edge, and the first splicing edge and the second splicing edge are spliced ​​together; a plurality of light-emitting devices Q are arranged on the side of the area where the first splicing edge or the second splicing edge is located.

[0205] It should be noted that, when the spliced ​​display device includes three or more spliced ​​display devices, one of the two spliced ​​edges is provided with a light emitting device Q, while the other is not.

[0206] In at least one embodiment of the present application, Fig. 20 and Fig.22A As shown, a plurality of light emitting devices Q are arranged on the side surface of the region where one of the first splicing edge and the second splicing edge is located, and a reflecting surface F is arranged on the side surface of the region where the other one of the first splicing edge and the second splicing edge is located.

[0207] In at least one embodiment of the present application, Fig.19 , Fig. 20 , Fig.21A and Fig.22A As shown, the spliced ​​display device also includes a dimming layer 6 and Fig.26 The light-transmitting protective layer 9 shown in the figure has a dimming layer 6 with an arc-shaped light-emitting surface, and the dimming layer 6 includes a light-transmitting material 62 and diffusion particles 61; the dimming layer 6 is located in the area between the first splicing edge and the second splicing edge, and covers the light-emitting device Q and the reflective surface; the light-transmitting protective layer 9 covers the dimming layer 6.

[0208] In an exemplary embodiment, the diffusion particles 61 may include polymer microspheres or inorganic particles;

[0209] Exemplarily, the diffusion particles 61 may include at least one of polymethyl methacrylate microspheres and polybutyl methacrylate microspheres.

[0210] In the embodiments of the present application, Fig.21A As shown, by setting the dimming layer 6, part of the light emitted by the light emitting device Q can be directly emitted (the light marked with LC), and part of it can be irradiated on the side of the color film substrate 102 of the display device on the right and reflected, so that the reflected light is scattered and then emitted (the light marked with LB). In this way, the light emitted by the light emitting device Q can be emitted as evenly as possible at the seam position.

[0211] Exemplarily, the light-transmitting protective layer 9 may be a protective glue.

[0212] In actual applications, multiple display devices need to be spliced ​​together for use. When customers install and use them, they first splice the display devices, and then attach protective glue to the seams of the spliced ​​display devices. The protective glue here can be in the form of a film, and the upper and lower surfaces of the glue are covered with release paper. After tearing off the release paper, align one side of the edge of the display device and attach it to the other side. During the attachment process, use your fingers to smooth it out while attaching to increase the bonding strength between the protective glue and the display device.

[0213] In some embodiments, the dimming layer 6 may cover a portion of the light-emitting side polarizers (the second polarizer 104 ) of the first display device and the second display device.

[0214] In some other embodiments, the dimming layer 6 may be tangent to the light-emitting-side polarizers (the second polarizer 104 ) of the first display device and the second display device, respectively.

[0215] In addition, in order to enhance the protective effect of the light-transmitting protective layer 9 on the dimming layer 6, the light-transmitting protective layer 9 may cover a portion of the light-emitting side polarizers (the second polarizer 104) of the first display device and the second display device.

[0216] In at least one embodiment of the present application, Fig.21A and Fig.22A As shown, the area of ​​the color film substrate 102 of the first display device near the first splicing edge and the area of ​​the color film substrate 102 of the second display device near the second splicing edge are both provided with a shading layer 7, and the shading layer 7 is configured to block the light of the light-emitting device Q (the light marked LA) to avoid the light emitted by the light-emitting device Q from interfering with the display panel 100.

[0217] In an exemplary embodiment, the light shielding layer 7 may include one of metal and black resin material.

[0218] Exemplarily, the material of the light shielding layer 7 may be a black matrix material.

[0219] The embodiment of the present application further provides a method for preparing each conductive pad in the second conductive pad group D2, which specifically includes the following two cases:

[0220] The first type: Fig.23 As shown in FIG. (1), a plurality of conductive wires L1 electrically connected to conductive pads in the second conductive pad group D2 are leaked from the second side surface CM2 of the display panel 100 on the array substrate 101; a plurality of conductive pads in the second conductive pad group D2 are pre-formed by patterning; Fig.23 As shown in Figure (2), the conductive pads in the patterned plurality of second conductive pad groups D2 are transferred to the second side surface CM2 by transfer, so that the conductive pads in the second conductive pad group D2 are electrically connected to the corresponding wires L1. Exemplarily, the patterning process may include steps such as exposure and etching using a mask.

[0221] The second type: Fig.24 As shown in FIG. (2), the conductive material is transferred onto the second side surface CM2 as a whole, and then patterned (eg, laser processed) is used to obtain the following Fig.24 FIG. (3) shows a plurality of second conductive pad groups D2, wherein the conductive pads in the second conductive pad group D2 are electrically connected to the corresponding conductive wires L1.

[0222] Exemplarily, the material of the conductive pads in the second conductive pad group D2 may include glue containing silver particles (Ag Ink).

[0223] In addition, the above transfer process is not specifically limited here; illustratively, during the transfer of the conductive pad, a clamp is required to fix the display panel 100 to prevent the pressure generated during the printing on the side of the display panel 100 from damaging other components in the display panel 100.

[0224] For details, please refer to the transfer process in the related art, which will not be described here.

[0225] In some embodiments, when the light-emitting device Q is independently packaged (not packaged into an integral light-emitting unit P), the conductive pads in the first conductive pad group D1 may also be prepared in the above manner.

[0226] The embodiment of the present application provides a picture adjustment method, which is applied to the splicing display device as described in any one of the above texts, such as Fig. 27 As shown, the method includes:

[0227] S801, respectively acquiring brightness data and chromaticity data of the display panel 100 and the light-emitting device Q under preset conditions; the preset conditions include pure pictures of the same grayscale or the same color;

[0228] In an exemplary embodiment, the brightness data and the chromaticity data may be directly measured manually or automatically using an optical device.

[0229] The same gray scale means that the display panel 100 and the light emitting device Q are at the same gray scale;

[0230] The pure picture of the same color means that the display panel 100 and the light emitting device Q display a pure picture of the same color.

[0231] Exemplarily, the same grayscale may include L0 grayscale, L156 grayscale, and L255 grayscale.

[0232] Exemplarily, pure pictures of the same color may include a white picture, a black picture, a red picture, a green picture, and a blue picture.

[0233] S802, comparing and calculating the difference in brightness data and chromaticity data of the display panel 100 and the light emitting device Q under the same conditions;

[0234] S803 . Adjust the driving voltage of the display panel 100 and the driving voltage of the light emitting device Q according to the difference of the brightness data and the difference of the chromaticity data.

[0235] In this way, a display panel 100 and a light-emitting device Q having consistent brightness data and chromaticity data can be obtained, thereby improving the light uniformity at the seam position of the spliced ​​display device, improving the display effect of the spliced ​​display device, and achieving a "zero seam" spliced ​​display effect.

[0236] In at least one embodiment of the present application, step S803 of adjusting the driving voltage of the display panel 100 and the driving voltage of the light emitting device Q according to the difference of the brightness data and the difference of the chromaticity data includes:

[0237] S8031, forming a coding file (Code) according to the difference of the brightness data and the difference of the chrominance data;

[0238] S8032, storing the encoding file in the timing controller (TCON) of circuit board 2;

[0239] S8033. The timing controller (TCON) generates a first driving voltage and a second driving voltage according to the coding file; the first driving voltage is configured to drive the display panel 100, and the second driving voltage is configured to drive the light-emitting device Q.

[0240] In an embodiment of the present application, by adopting the above-mentioned picture adjustment method, the brightness and chromaticity of the pictures displayed by two adjacent display devices in the spliced ​​display device and multiple light-emitting devices Q located between the two adjacent display devices can be adjusted to be consistent, thereby improving the overall picture display quality of the spliced ​​display device and further achieving a "zero-seam" splicing display effect.

[0241] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display device, wherein: include: A display panel, the display panel comprising a display area and a peripheral area surrounding the display area; A backlight module, electrically connected to the display panel, and the display panel is located at the light-emitting side of the backlight module; A plurality of light emitting devices are arranged on at least one side surface of the peripheral side of the display panel; the orthographic projection of the light emitting device on the light emitting surface of the backlight module and the orthographic projection of the display panel on the light emitting surface of the backlight module do not overlap each other.

2. The display device according to claim 1, wherein: The display panel comprises a first side surface, and the first side surface intersects with a light emitting surface of the display panel; The display device includes multiple first conductive pad groups, the first conductive pad groups are arranged on the first side, and the light-emitting device is located on the side of the first conductive pad group away from the first side; one first conductive pad group includes at least two conductive pads, and one light-emitting device is electrically connected to each conductive pad in the same first conductive pad group.

3. The display device according to claim 2, wherein: The display panel comprises an array substrate and a color filter substrate which are arranged opposite to each other, and the first side surface comprises a first area located on the array substrate and a second area located on the color filter substrate; The light emitting device and the first conductive pad group are arranged in the first region, and / or the light emitting device and the first conductive pad group are arranged in the second region.

4. The display device according to claim 2, wherein: The peripheral area includes a binding sub-area, the binding sub-area includes a second side surface, and the second side surface intersects with the light emitting surface of the display panel; The display device includes a plurality of second conductive pad groups, each of which includes at least one conductive pad, and the second conductive pad group is arranged on the second side surface. The display panel includes an array substrate and a color film substrate arranged opposite to each other, and the second conductive pad group is electrically connected to a driving circuit on the array substrate.

5. The display device according to claim 4, wherein: The second side surface includes a third area located on the array substrate and a fourth area located on the color filter substrate; The second conductive pad group is disposed in the third region, and / or the second conductive pad group is disposed in the fourth region.

6. The display device according to claim 4, wherein: The plurality of light emitting devices include a first light emitting device, a second light emitting device and a third light emitting device, wherein the first light emitting device, the second light emitting device and the third light emitting device emit different colors of light; Among them, one of the first light-emitting devices, one of the second light-emitting devices, and one of the third light-emitting devices are packaged into a light-emitting unit, and the light-emitting unit extends from a region of the first side located on the array substrate to a region of the first side located on the color film substrate.

7. The display device according to claim 6, wherein: The planar size of each conductive pad in the second conductive pad group is larger than that of each conductive pad in the first conductive pad group, and the conductive pads in the second conductive pad group extend from an area of ​​the second side located on the array substrate to an area of ​​the second side located on the color film substrate.

8. The display device according to claim 7, wherein: The first side surface and the second side surface are the same side surface, and at least one second conductive pad group is disposed in the area between two adjacent light-emitting units; The display device further includes a chip-on-chip film, which covers the second conductive pad group and extends to the side of the backlight module, and the orthographic projection of the chip-on-chip film on the first side does not overlap with the orthographic projection of the light-emitting unit on the first side; The first conductive pad group is electrically connected to the chip-on-film, and the second conductive pad group is bound to the chip-on-film.

9. The display device according to claim 8, wherein: The first conductive pad group includes a positive conductive pad and a negative conductive pad, the light-emitting unit includes a first pin, a second pin, a third pin and a fourth pin, the positive conductive pads of the first light-emitting device, the second light-emitting device and the third light-emitting device are all electrically connected to the first pin, the negative conductive pad of the first light-emitting device is electrically connected to the second pin, the negative conductive pad of the second light-emitting device is electrically connected to the third pin, and the negative conductive pad of the third light-emitting device is electrically connected to the fourth pin; The chip-on-film covers at least a portion of the first pin, the second pin, the third pin and the fourth pin, and the chip-on-film is bound to the first pin, the second pin, the third pin and the fourth pin respectively.

10. The display device according to claim 7, wherein: The first side surface and the second side surface are different sides, and the display device further comprises a chip-on-chip film, which covers the second conductive pad group and extends to a side surface of the backlight module; The portion of the array substrate located in the peripheral area further includes a plurality of binding leads, the first conductive pad group is electrically connected to the chip-on-film through the binding leads, and the second conductive pad group is bound to the chip-on-film.

11. The display device according to claim 8 or 10, wherein: The display device further comprises at least one circuit board and at least one L-shaped protection plate, the circuit board is electrically connected to the chip-on-film, and the circuit board and the chip-on-film are arranged on the same side of the backlight module, and the circuit board is also electrically connected to the backlight module; the circuit board is configured to drive the display panel and the light-emitting device simultaneously; A portion of the protection plate is disposed on a side of the circuit board away from the backlight module, and another portion of the protection plate is disposed on a side of the circuit board away from the chip-on-film.

12. The display device according to any one of claims 2 to 10, wherein: The display panel also includes at least one third side surface in addition to the first side surface, and the third side surface is located on the color film substrate and is provided with a reflective surface. The angle between the reflective surface and the reference surface is an acute angle, and the reference surface is a plane perpendicular to the light emitting surface of the display panel.

13. The display device according to claim 12, wherein: The acute angle has an angle range greater than 0° and less than or equal to 30°.

14. The display device according to claim 12, wherein: The display device further includes a reflective portion, and the reflective portion covers the reflective surface.

15. The display device according to claim 1, wherein: The light emitting angle of the light emitting device is in the range of 30° to 60°.

16. The display device according to claim 1, wherein: The display device further includes a buffer layer and a plurality of encapsulation parts, wherein the encapsulation part at least covers the light emitting surface of the light emitting device, the buffer layer covers the side surface of the display panel where the light emitting device is arranged, and the buffer layer includes a plurality of openings, and the light emitting device is arranged in the openings.

17. A spliced ​​display device, wherein: At least comprising a first display device and a second display device, wherein the first display device and the second display device are both display devices described in any one of claims 1 to 16; The first display device includes a first splicing edge, the second display device includes a second splicing edge, the first splicing edge and the second splicing edge are spliced ​​together; a plurality of the light-emitting devices are arranged on the side of the area where the first splicing edge or the second splicing edge is located.

18. The spliced ​​display device according to claim 17, wherein: A plurality of the light emitting devices are arranged on the side surface of the region where one of the first splicing edge and the second splicing edge is located, and a reflecting surface is arranged on the side surface of the region where the other one of the first splicing edge and the second splicing edge is located.

19. The spliced ​​display device according to claim 17 or 18, wherein: The spliced ​​display device also includes a dimming layer and a light-transmitting protective layer. The dimming layer has an arc-shaped light-emitting surface, and the dimming layer includes a light-transmitting material and diffusion particles. The dimming layer is located in the area between the first splicing edge and the second splicing edge, and covers the light-emitting device and the reflecting surface. The light-transmitting protective layer covers the dimming layer.

20. The spliced ​​display device according to claim 19, wherein: A light shielding layer is provided on a region of the color filter substrate of the first display device close to the first splicing edge and a region of the color filter substrate of the second display device close to the second splicing edge. The light shielding layer is configured to block light from the light emitting device.

21. A method for adjusting a picture, wherein: Applied to the splicing display device according to any one of claims 17 to 20, the method comprising: Respectively acquiring brightness data and chromaticity data of the display panel and the light-emitting device under preset conditions; the preset conditions include pure pictures of the same grayscale or the same color; Comparing and calculating the difference in brightness data and the difference in chromaticity data between the display panel and the light-emitting device under the same conditions; The driving voltage of the display panel and the driving voltage of the light emitting device are adjusted according to the difference of the brightness data and the difference of the chromaticity data.

22. The image adjustment method according to claim 21, wherein: The step of adjusting the driving voltage of the display panel and the driving voltage of the light emitting device according to the difference of the brightness data and the difference of the chromaticity data comprises: Forming a coded file according to the difference of the brightness data and the difference of the chrominance data; Storing the encoding file in a timing controller of a circuit board; The timing controller generates a first driving voltage and a second driving voltage according to the coding file; the first driving voltage is configured to drive the display panel, and the second driving voltage is configured to drive the light emitting device.

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